Memory liquid cooling radiator and server radiating device

Abstract

The invention discloses a memory liquid cooling radiator and a server heat dissipation device, and relates to the technical field of memory heat dissipation, and the memory liquid cooling radiator comprises a heat exchange assembly, at least one heat conduction unit and a liquid supply assembly. A through cold mass flow channel is arranged in the heat exchange assembly. The heat conduction unit is arranged on the outer surface of the heat exchange assembly and comprises two heat conduction parts arranged in parallel, and a liquid bag is connected between the two heat conduction parts. The liquid supply assembly communicates with the liquid bag and is used for injecting or extracting the heat conduction medium into or out of the liquid bag, and the distance between the two heat conduction parts is adjusted through the volume change of the liquid bag. The distance between the two heat conduction parts is adjusted through cooperative arrangement of the liquid bag and the liquid supply assembly, the problem of poor contact or damage of memory particles caused by tolerance or improper installation of an existing cold plate type liquid cooling radiator is solved, the risk of memory damage in the installation stage is reduced, the contact area with the memory in the heat dissipation stage is increased, and the heat dissipation efficiency is improved. And the heat dissipation efficiency is improved.

Description

Technical Field

[0001] The present application relates to the field of memory heat dissipation technology, and in particular to a memory liquid cooling radiator and a server heat dissipation device. Background Art

[0002] Current memory liquid cooling technologies primarily include cold plate liquid cooling, immersion liquid cooling, and spray liquid cooling. Cold plate liquid cooling involves installing a metal cold plate on the surface of the memory module and circulating coolant through internal channels to indirectly dissipate heat. This approach offers the advantages of compatibility with existing architectures and low retrofit costs. However, in practice, the combined tolerances of the cold plate machining and the motherboard tolerances can lead to poor contact or interference, significantly impacting heat dissipation efficiency. Furthermore, rigid cold plates are prone to mechanical collision with memory chips during installation, causing irreversible hardware damage. While immersion liquid cooling can achieve ultra-high heat dissipation density, it faces technical barriers such as high coolant costs and complex sealing designs. While spray liquid cooling can precisely cover the heat source, it presents reliability issues such as uneven liquid distribution and the risk of leakage.

[0003] Due to the rigidity of the metal cold plate in traditional liquid cooling, it's difficult to adaptively compensate for assembly tolerances and avoid mechanical stress during installation. Existing technologies attempt to improve contact by adding thermal pads or spring structures, but neither addresses the dual requirements of installation protection and dynamic fit.

[0004] Therefore, there is an urgent need to develop a memory liquid cooling device that can not only eliminate the influence of assembly tolerances through flexible deformation, but also achieve dynamic switching between zero-contact protection during the installation process and close fit with the operating state, fundamentally solving the contradictions of traditional solutions in reliability, safety and heat dissipation efficiency. Summary of the Invention

[0005] The present application provides a memory liquid cooling radiator and a server cooling device to at least solve the problems of collision and damage of heating elements and low heat dissipation efficiency during installation of heating elements in the related art.

[0006] The present application provides a memory liquid cooling radiator, comprising a heat exchange assembly, at least one heat conduction unit, and a liquid supply assembly. The heat exchange assembly comprises a through-flow channel for cooling mass; at least one heat conduction unit is disposed on the outer surface of the heat exchange assembly, the heat conduction unit comprising two parallel heat conduction sections, with a liquid sac connected between the two sections; and a liquid supply assembly, connected to the liquid sac and configured to inject or withdraw the heat conduction medium into or from the liquid sac, adjusting the distance between the two heat conduction sections by varying the volume of the liquid sac.

[0007] The present application also provides a server cooling device comprising a chassis, a server motherboard, and the aforementioned memory liquid cooling radiator. The server motherboard is disposed within the chassis, and is equipped with a plurality of the aforementioned heating elements. The memory liquid cooling radiator is disposed within the chassis. When the liquid bladder is filled with the aforementioned heat-conducting medium, the heat-conducting unit is in thermal contact with adjacent heating elements.

[0008] The heat conduction unit of the memory liquid cooling radiator provided by the present application is arranged on the outer surface of the heat exchange component, and is composed of two parallel arranged heat conduction parts and a liquid capsule connecting the two; wherein the liquid supply component is connected to the liquid capsule, and the volume change of the liquid capsule is controlled by adjusting the injection amount of the heat conduction medium, thereby dynamically adjusting the distance between the two heat conduction parts. Through the flexible deformation characteristics of the liquid capsule, before installation, the distance between the heat conduction parts is reduced to avoid mechanical interference with the heating element, effectively preventing installation damage; when heat dissipation is required, the distance between the heat conduction parts is increased, and it can adaptively fit the surface of the heating element (memory, etc.), which not only avoids the risk of damage to the heating element due to installation pressure or tolerance of traditional rigid radiators, but also ensures the close fit of the heat dissipation contact surface, significantly improving the heat dissipation efficiency. This adjustable liquid cooling heat dissipation structure is particularly suitable for application scenarios in high-density servers that have high requirements for memory heat dissipation reliability and heat dissipation performance. BRIEF DESCRIPTION OF THE DRAWINGS

[0009] In order to more clearly illustrate the embodiments of the present application, the following is a brief introduction to the drawings required for use in the embodiments. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without any creative work.

[0010] Figure 1 A schematic diagram of the structure of a memory liquid cooling radiator provided in an embodiment of the present application;

[0011] Figure 2 A structural diagram of a heat conduction unit of a memory liquid cooling radiator provided in an embodiment of the present application;

[0012] Figure 3 A cross-sectional view of a heat transfer unit of a memory liquid cooling radiator provided in an embodiment of the present application with the heat transfer medium extracted;

[0013] Figure 4 A cross-sectional view of a heat transfer medium being injected into a heat transfer unit of a memory liquid cooling radiator provided in an embodiment of the present application;

[0014] Figure 5 for Figure 4 A partial enlarged view of the end of the heat transfer unit shown;

[0015] Figure 6A schematic structural diagram of a heat transfer unit of a memory liquid cooling radiator provided in an embodiment of the present application, in which multiple liquid capsules are provided;

[0016] Figure 7 A schematic diagram of the structure of a server heat dissipation device provided in an embodiment of the present application.

[0017] The above drawings include the following reference numerals:

[0018] 1. Heat exchange components;

[0019] 11. Cold flow channel;

[0020] 12. Heat exchange tube;

[0021] 13. First connecting portion;

[0022] 14. Second connecting portion;

[0023] 15. Fixing parts;

[0024] 2. Heat transfer unit;

[0025] 21. Heat transfer part;

[0026] 22. cyst;

[0027] 23. Package;

[0028] 3. Liquid supply components;

[0029] 31. Liquid storage tank;

[0030] 32. Bidirectional pump;

[0031] 4. Pressure components;

[0032] 41. Hydraulic valve;

[0033] 42. Pressure sensor;

[0034] 5. Water inlet pipe;

[0035] 51. Water inlet valve;

[0036] 6. Water outlet pipe;

[0037] 61. Water outlet valve;

[0038] 7. Chassis;

[0039] 71. Pipeline fixings;

[0040] 8. Server motherboard;

[0041] 9. Heating element;

[0042] 91. Memory unit;

[0043] 92. Processing unit. DETAILED DESCRIPTION

[0044] The following will be combined with the accompanying drawings in the embodiments of this application to clearly and completely describe the technical solutions in the embodiments of this application. Obviously, the embodiments described are only part of the embodiments of this application, not all of them. Based on the embodiments in this application, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of this application.

[0045] It should be noted that the terms "center," "longitudinal," "transverse," "length," "width," "thickness," "upper," "lower," "front," "back," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," "counterclockwise," "axial," "radial," "circumferential," and the like, indicating positions or relationships, are based on the positions or relationships shown in the accompanying drawings and are intended solely for ease of description and simplification of the present application. They are not intended to indicate or imply that the devices or components referred to must have, be constructed, or operate in a specific orientation, and therefore should not be construed as limiting the present application. The terms "mounted," "connected," and "connected" should be interpreted broadly, and may include, for example, fixed, removable, or integral connections; mechanical or electrical connections; direct or indirect connections through an intermediary; and internal communication between two components. The terms "parallel," "perpendicular," and "equal" encompass the described conditions and conditions similar to the described conditions, provided that the range of the similar conditions is within an acceptable range of deviation, as determined by a person of ordinary skill in the art taking into account the measurement in question and the errors associated with the measurement of the particular quantity (i.e., the limitations of the measurement system). For example, "parallel" includes both absolute parallelism and approximate parallelism, where the acceptable deviation range for approximate parallelism may be, for example, within 5°; "perpendicular" includes both absolute perpendicularity and approximate perpendicularity, where the acceptable deviation range for approximate perpendicularity may also be, for example, within 5°. "Equal" includes both absolute equality and approximate equality, where the acceptable deviation range for approximate equality may be, for example, that the difference between the two is less than or equal to 5% of either. Those skilled in the art will understand the specific meanings of the above terms in this application based on the specific circumstances.

[0046] Current memory liquid cooling technology faces the following key technical bottlenecks: cold plate liquid cooling, while offering low retrofit costs, suffers from high contact thermal resistance and limited heat dissipation efficiency; immersion liquid cooling, while offering excellent heat dissipation performance, faces technical hurdles such as high coolant costs and complex system sealing; and spray liquid cooling, while enabling precise heat dissipation, suffers from inherent drawbacks such as uneven liquid distribution and a high risk of leakage. These technical solutions struggle to balance key performance indicators such as heat dissipation efficiency, system reliability, and retrofit costs. In particular, they fail to simultaneously meet the multiple requirements of high-density memory modules for ease of installation, optimized contact thermal resistance, and stable operation, hindering the development of high-performance computing equipment towards higher thermal densities.

[0047] In order to enable those skilled in the art to better understand the present application, the present application is further described in detail below with reference to the accompanying drawings and specific implementation methods.

[0048] Figure 1 A schematic diagram of the structure of a memory liquid cooling radiator provided in an embodiment of the present application; Figure 2 A structural diagram of a heat conduction unit of a memory liquid cooling radiator provided in an embodiment of the present application; Figure 3 A cross-sectional view of a heat transfer unit of a memory liquid cooling radiator provided in an embodiment of the present application with the heat transfer medium extracted; Figure 4 A cross-sectional view of a heat transfer medium injected into a heat transfer unit of a memory liquid cooling radiator provided in an embodiment of the present application.

[0049] The embodiment of the present application provides a memory liquid cooling radiator, such as Figures 1 to 4 As shown, it includes a heat exchange component 1, at least one heat conduction unit 2, and a liquid supply component 3. The heat exchange component 1 is provided with a through-flowing cold mass flow channel 11; at least one heat conduction unit 2 is provided on the outer surface of the heat exchange component 1, and the heat conduction unit 2 includes two parallel heat conduction parts 21, with a liquid sac 22 connected between the two heat conduction parts 21; and the liquid supply component 3 is connected to the liquid sac 22 and is used to inject or withdraw heat conduction medium into the liquid sac 22, and adjust the distance between the two heat conduction parts 21 by changing the volume of the liquid sac 22.

[0050] According to the above-mentioned setting method, the injection amount of the heat-conducting medium in the liquid capsule 22 is controlled by the liquid supply component 3, so that the distance between the two heat-conducting parts 21 can be dynamically adjusted. On the one hand, during installation, the flexible deformation of the liquid capsule 22 is used to adjust the distance between the liquid capsule 22 and the heating element 9, thereby avoiding the risk of damage to the heating element 9 caused by installation pressure or tolerance of the traditional rigid radiator; on the other hand, it ensures that the heat-conducting part 21 and the memory particles maintain the best contact state under working conditions, thereby effectively improving the heat dissipation efficiency.

[0051] Specifically, this arrangement is particularly suitable for high-density server environments, significantly improving the heat dissipation performance of the heating element 9 while ensuring installation reliability. It also works with the cold mass flow channel 11 within the heat exchange assembly 1 to dissipate heat, effectively solving the problems of difficult installation and poor contact caused by traditional liquid cooling radiators, resulting in low heat dissipation efficiency. It is particularly suitable for the heat dissipation needs of memory modules in high-density servers.

[0052] In an illustrative embodiment, Figure 1 and Figure 2 As shown, it includes at least two heat-conducting units 2 , which are arranged in parallel and spaced apart in the heat exchange assembly 1 , and a gap for accommodating the heating element 9 is formed between two adjacent heat-conducting units 2 .

[0053] According to the above-mentioned setting method, during the installation process, the spacing of the heat-conducting parts 21 can be controlled by adjusting the injection amount of the heat-conducting medium in the liquid capsule 22 to adjust the gap size between two adjacent heat-conducting units 2, thereby ensuring the rapid and damage-free installation of the heating element 9; when heat dissipation is required, the liquid capsule 22 is injected with heat-conducting medium to expand, and the heat-conducting unit 2 can form all-round close contact with the heating element 9 after expansion, and the contact pressure is evenly distributed on the surface of the heating element 9, thereby reducing the interface thermal resistance.

[0054] Furthermore, the distribution spacing of the heat-conducting unit 2 is set according to the thickness of the heating element 9, which can adapt to combinations of heating elements 9 of different sizes, effectively reducing the peak temperature of the heating element 9 during the test, and at the same time effectively reducing the overall volume of the heat dissipation system, which is conducive to application in compact heat dissipation scenarios of high-density electronic equipment.

[0055] In an illustrative embodiment, the memory liquid cooling radiator of the present application is not only suitable for the heat dissipation of the memory unit 91, but can also be expanded to be applied to the heat dissipation scenarios of other heating components 9 in the server, including but not limited to the processor unit 92, graphics card chip, power module and other electronic components that require efficient heat dissipation.

[0056] By adjusting the volume of the heat-conducting medium in the liquid capsule 22, the heat-conducting portion 21 can be adaptively fitted to the surface of heating elements 9 of different sizes and shapes, thereby solving the problem of poor contact caused by component height tolerance in traditional radiators and reducing the risk of damage to precision electronic components caused by installation stress through flexible contact.

[0057] In an illustrative embodiment, Figures 2 to 4 As shown, the heat conducting portion 21 is constructed as a rectangular thin sheet, one end of which is fixedly connected to the heat exchange component 1 .

[0058] According to an embodiment of the present application, one end of the heat conducting portion 21 is fixedly connected to the outer surface of the heat exchange assembly 1 by welding, bonding or integral molding.

[0059] According to the above configuration, the rectangular sheet can produce uniform deformation when the liquid capsule 22 is filled with the heat-conducting medium and expands, ensuring a large-area stable contact with the memory unit 91 or other heating elements 9 .

[0060] Furthermore, the thin-sheet structure has high structural strength and heat conduction efficiency, and the fixed connection end can ensure that heat is quickly conducted to the cold mass flow channel 11 of the heat exchange component 1 .

[0061] Secondly, the above-mentioned configuration allows the thickness and material of the sheet to be adjusted according to actual needs, optimizing thermal conductivity while ensuring structural strength. This modular design facilitates mass production and allows the length and width of the heat-conducting portion 21 to be flexibly adjusted according to the size specifications of different heating components, significantly improving the radiator's applicability and installation adaptability.

[0062] According to an embodiment of the present application, the thickness of the rectangular thin-sheet heat conducting portion 21 is preferably 0.5 to 2 mm.

[0063] Figure 5 for Figure 4 A partial enlarged view of the end of the heat transfer unit is shown.

[0064] In an illustrative embodiment, Figure 5 As shown, the heat conducting unit 2 further includes a packaging member 23 , which covers the outer surfaces of the two heat conducting parts 21 , and the edge of the packaging member 23 forms an airtight sealing connection with the heat exchange component 1 .

[0065] According to the above-mentioned setting method, the heat conducting unit 2 is encapsulated by the packaging member 23, and the airtight sealing connection formed effectively prevents the internal and external contact of the heat conducting unit 2, and forms secondary protection for the internal liquid capsule 22, effectively preventing the leakage of the heat conducting medium and ensuring the long-term stability of the hydraulic adjustment function; at the same time, the covering design of the packaging member 23 provides additional structural support for the heat conducting part 21, so that it maintains its shape integrity during repeated expansion / contraction; the sealed connection also blocks the external environment core and / or the heating element 8 from contaminating or damaging the heat conducting part 21, thereby improving the reliability and service life of the heat dissipation system.

[0066] In detail, the packaging component 23 is made of PET (polyethylene terephthalate) film. The surface of the PET film is plasma treated to form a micron-level rough structure, which improves the bonding strength with the heat conducting part 21. The film material itself has excellent temperature resistance and dimensional stability. The edge sealing is achieved with the heat exchange component 1 by curing glue to form a reliable sealing structure.

[0067] In an alternative embodiment, the packaging member 23 is sealed and connected to the adjacent end surfaces of the two heat-conducting parts 21 facing the heat-conducting surfaces of the heating element 8 to form a sealed space between the two heat-conducting parts 21 .

[0068] In detail, the package 23 adopts a U-shaped covering structure, and the edges on both sides are sealed and connected to the circumferential end faces of the two heat-conducting parts. The end face sealing design avoids the package 23 from blocking the working surface of the heat-conducting part 21, ensuring that the heat dissipation surface is completely exposed. The U-shaped structure provides a buffer space for the expansion and deformation of the heat-conducting part 21.

[0069] The edges of both sides of the package 23 are precisely sealed and connected to the circumferential end surfaces of the two heat conducting parts 21 by hot pressing or gluing process.

[0070] In an illustrative embodiment, the heat conducting portion 21 is made of a soft heat conducting material, including graphene. Graphene has good heat dissipation performance and good tensile strength.

[0071] In an illustrative embodiment, the heat-conducting part 21 uses flexible organic silicone as a matrix to provide good elastic deformation ability, and graphene material is added therein. Its high intrinsic thermal conductivity and ultra-large specific surface area significantly improve the thermal conductivity efficiency of the heat-conducting part 21, so that heat is quickly transferred from the heating element 9 to the cold mass flow channel 11 in the exchange assembly 1, and the heat is dissipated through the flowing cold mass.

[0072] In an illustrative embodiment, the heat-conducting surface of the heat-conducting portion 21 facing the heating element 8 may also be provided with a rigid heat-conducting layer to ensure good contact while providing sufficient structural strength.

[0073] In detail, the rigid heat-conducting layer is made of copper or aluminum alloy material, which can improve the overall heat-conducting efficiency of the heat-conducting portion 21 while providing strength.

[0074] According to the embodiment of the present application, the heat conducting portion 21 adopts a composite laminated structure design, the base layer adopts a flexible organic silicone composite graphene material, and the base layer thickness is preferably 0.8-1.2mm, which not only maintains excellent elastic deformation ability, but also achieves efficient axial thermal conductivity through the directional arrangement of graphene; the middle layer is a porous copper mesh reinforcement layer, which is combined with the base layer through a vacuum hot pressing process to form a three-dimensional heat conduction network while improving the tensile strength; the working surface is a rigid heat conducting layer of composite copper material, and the surface is treated with micro-arc oxidation to ensure close contact with the heating element 8 and avoid the risk of circuit short circuit. Through the above-mentioned setting method, the contact pressure between the heat conducting surface and the memory particles is evenly distributed, and the heat dissipation efficiency is greatly improved compared with the traditional pure metal heat conducting sheet. In addition, the boron nitride nanosheets incorporated into the graphene layer can further reduce the interfacial thermal resistance, so that the overall structure maintains stable performance in a wide temperature range.

[0075] Figure 6 A schematic structural diagram of a memory liquid cooling radiator provided in an embodiment of the present application, wherein a heat conduction unit is provided with multiple liquid capsules.

[0076] In an illustrative embodiment, Figure 6 As shown, the heat conducting unit 2 is provided with a plurality of liquid capsules 22, which are arranged side by side along the length direction of the two heat conducting parts 21. Each liquid capsule 22 is independently provided, is connected to the liquid supply assembly 2, and has different expansion states of liquid filling amount.

[0077] According to the above-mentioned configuration, the distributed liquid capsule configuration can achieve precise control of contact pressure based on the heat dissipation requirements of different areas of the heating element 9 by independently adjusting the amount of thermally conductive medium filled in each liquid capsule 22, ensuring closer thermal contact in areas with high heat flux density. Secondly, the coordinated operation of multiple liquid capsules 22 can adaptively compensate for surface irregularities of the heating element 9, effectively eliminating the localized contact problems that can occur with traditional rigid heat sinks. This allows for more precise contact pressure control of heating elements 8 with different thicknesses, making it particularly suitable for cooling scenarios with heating modules subject to installation tolerances or uneven surfaces.

[0078] In addition, the above-mentioned setting method also enhances the reliability of the heat dissipation system. When a single liquid capsule 22 fails, the remaining liquid capsules 22 can still maintain basic heat dissipation function, so that the heat conducting portion 21 can still respond to the expansion of other liquid capsules 22 and abut against the surface of the heating element 9, which significantly improves the fault tolerance of the heat dissipation system.

[0079] In an illustrative embodiment, the heat conducting portion 21 may be configured in a modular segmented manner, including a plurality of independent small pieces, each of which is connected side by side to form the heat conducting portion 21 through a flexible connection structure and is respectively connected to the heat exchange component 1 .

[0080] According to the above-mentioned arrangement, it is advantageous to independently deform different areas or positions of different thicknesses of the heating element 9 so as to facilitate fitting and heat dissipation.

[0081] Furthermore, each small piece is linked to the corresponding liquid capsule 22 unit, wherein an independent small piece is set on both sides of each independent liquid capsule 22, forming multiple independent pressure adjustment units. According to the surface morphology of the heating element 9, it can automatically adhere to the raised areas of the element surface to automatically reduce the contact pressure to avoid stress concentration, and strengthen the adhesion in the recessed areas to ensure thermal contact.

[0082] According to the above arrangement, by independently controlling the pressure of each liquid capsule 22 , the corresponding small piece can reduce the pressure at the convex part to prevent squeezing and increase the pressure at the concave part to ensure contact according to the thickness difference of the local position of the heating element 9 .

[0083] Specifically, it performs adaptive adjustment based on heat dissipation requirements, such as high pressure in the core area to enhance heat dissipation and low pressure in the edge area to reduce stress, to form a gradient pressure distribution. At the same time, it has good fault tolerance, and the failure of a single unit does not affect the overall operation, which significantly improves the adaptability, reliability and economy of the heat dissipation system. It is particularly suitable for heat dissipation scenarios of high-performance electronic equipment with installation tolerances, uneven surfaces or differentiated heat dissipation requirements.

[0084] This setup, through the introduction of a distributed pressure feedback mechanism, enables the cooling system to achieve surface adaptability, effectively addressing component assembly tolerances and deformation caused by long-term use. Redundant independent control units ensure continued system operation even when some components malfunction, significantly enhancing the engineering suitability of the cooling solution. This makes it particularly suitable for high-performance computing equipment, which demands stringent cooling uniformity and reliability.

[0085] In an illustrative embodiment, Figure 1 and Figure 2 As shown, the liquid supply assembly 3 includes a liquid storage tank 31 and a bidirectional pump 32. The liquid storage tank 31 is connected to the liquid capsule 22 and is filled with a heat-conducting medium; and the bidirectional pump 32 is connected to the pipeline between the liquid capsule 22 and the liquid storage tank 31.

[0086] With this setup, the precise regulation of bidirectional pump 32 dynamically adjusts the volume of thermally conductive medium within bladder 22 based on cooling requirements. This allows for rapid pressure increase during high loads to enhance heat dissipation, while also reducing pressure during standby mode to reduce system energy consumption. The buffering design of reservoir 31 not only ensures a stable medium supply but also absorbs pressure fluctuations caused by changes in the volume of bladder 22, giving the entire cooling system adaptive regulation capabilities. This closed-loop liquid supply solution achieves an intelligent balance between cooling performance and energy consumption.

[0087] In an illustrative embodiment, the heat-conducting medium used by the liquid supply component 3 can be selected specifically based on different working conditions.

[0088] In detail, for applications within a conventional operating temperature range, an ethylene glycol aqueous solution may be used as the base medium, which has moderate specific heat capacity and viscosity characteristics.

[0089] Furthermore, in scenarios where higher thermal conductivity performance is sought, composite thermal fluids with added nano-alumina or carbon nanotubes can be used. Such nanofluids can significantly improve the thermal conductivity efficiency of the medium. In addition, for harsh environments that require wide temperature range operation, ionic liquids with low freezing points can be used as the medium to ensure that the system can still operate stably under extreme temperatures.

[0090] All media undergo a special surface treatment to enhance fluidity and prevent sedimentation. The media circuit utilizes a closed-loop design, and a filter can be installed within the reservoir 31, ensuring long-term stable heat transfer performance without sedimentation or clogging. This modular media selection approach allows the cooling system to flexibly adapt to the specific needs of diverse applications, from consumer electronics to industrial equipment.

[0091] In an illustrative embodiment, Figure 1 and Figure 2 As shown, at least one pressure assembly 4 is further included, which is arranged in a pipeline connecting the liquid bag 22 and the bidirectional pump 32 . The pressure assembly 4 includes a hydraulic valve 41 and a pressure sensor 42 .

[0092] Specifically, according to the embodiment of the present application ( Figure 2 As shown, the pressure assembly 4 is disposed downstream of the bidirectional pump 32 and communicates with the liquid capsules 22 of the multiple heat transfer units 2. The flow and pressure of the heat transfer medium are precisely controlled by a hydraulic valve 41, while the pressure sensor 42 monitors the pressure changes of the liquid capsules 22 in real time.

[0093] According to the above-mentioned setting, the pressure states of multiple liquid capsules 22 can be synchronously adjusted through a single hydraulic valve 41, which significantly simplifies the complexity of the control system; the real-time feedback of the pressure sensor 42 can ensure that each liquid capsule 22 is maintained in the optimal working pressure range.

[0094] In an alternative embodiment, a plurality of pressure components 4 are provided and independently connected to the branch pipes between the liquid sac 22 and the bidirectional pump 32 of each heat transfer unit 2 .

[0095] Specifically, the outlet of the liquid storage tank 31 is connected to a bidirectional pump 32 via a main pipeline. Branch pipelines connect the bidirectional pump 32 to the liquid bladder 22 of each heat transfer unit 2. Multiple pressure assemblies 4 are located on each branch pipeline. Hydraulic valves 41 on each branch pipeline precisely control the flow and pressure of the heat transfer medium in the corresponding liquid bladder 22. Pressure sensors 42 on each branch pipeline independently monitor pressure changes in each liquid bladder 22.

[0096] According to the above-mentioned setting method, the pressure of the liquid capsule 22 of each thermal conductive component 2 can be independently and accurately adjusted through multiple pressure components 4, which significantly improves the flexibility of pressure control; the independent feedback of each pressure sensor 42 ensures that each liquid capsule 22 can be accurately maintained in its own optimal working pressure range.

[0097] In an illustrative embodiment, Figure 6 As shown, when the heat conducting unit 2 is provided with a plurality of liquid capsules 22 , each liquid capsule 22 is configured with a pressure component 4 .

[0098] According to the above-mentioned setting method, the flow rate and pressure of the heat-conducting medium in the corresponding liquid capsule 22 in each heat-conducting unit 2 can be accurately controlled by the hydraulic valve 41 and the pressure sensor 42 on each branch, so that corresponding adjustments can be made according to the heat dissipation requirements of different areas of the heating element 9 or positions with different thicknesses.

[0099] In an illustrative embodiment, Figure 1 As shown, the heat exchange assembly 1 includes a plurality of parallel arranged heat exchange tubes 12, a first connecting portion 13 and two second connecting portions 14, wherein at least one heat conduction unit 2 is installed in the length direction of each heat exchange tube 12; the first connecting portion 13 is connected to the first ends of the plurality of heat exchange tubes 12; the two second connecting portions 14 are respectively connected to the second end of at least one heat exchange tube 12, and the two second connecting portions 14 are respectively connected to the external cold mass supply module through the water inlet pipe 5 and the water outlet pipe 6; wherein the inner cavities of the plurality of heat exchange tubes 12, the first connecting portion 13 and the two second connecting portions 14 are connected to form a cold mass flow channel 11.

[0100] According to the above arrangement, after the refrigerant enters the inner cavity of the second connection portion 14 from the water inlet pipe 5, it is evenly distributed to a group of multiple heat exchange tubes 12 through the diversion structure. After completing the initial heat exchange, the refrigerant is recollected through the inner cavity of the first connection portion 13 and again distributed to another group of multiple heat exchange tubes 12 through the diversion structure. After undergoing the second heat exchange, the refrigerant is finally discharged into the water outlet pipe 6 through the other second connection portion 14. This two-stage circulation design achieves a two-stage heat exchange process for the refrigerant. The refrigerant enters and exits the radiator on the same side after undergoing two heat exchanges within the annular flow channel, resulting in a compact heat dissipation system.

[0101] According to the embodiment of the present application, the plurality of heat exchange tubes 12 are arranged in a modular manner, and their spatial arrangement corresponds to the physical distribution of the heating element 9. Figure 1 As shown, in the areas of multiple memory units 91 symmetrically arranged on both sides of the processing unit 92, independent heat exchange modules are respectively configured for directional heat dissipation. Each heat exchange module is composed of a number of parallel arranged heat exchange tubes 12. These heat exchange tubes 12 are interconnected through a common first connection part 13 and are connected to the second connection part 14 at the opposite end, thereby forming a complete closed-loop cooling flow channel. This modular configuration method realizes the spatial matching of the heat dissipation unit and the heating element, ensures the efficient use of heat dissipation resources, and can flexibly adjust the number and distribution of the heat exchange tubes 12 according to actual heat dissipation needs: when the heat generation of the heating element 9 is large, the density of the heat exchange tubes 12 can be increased; when the heating element 9 needs to focus on heat dissipation, the coverage area of the corresponding heat exchange tubes 12 can be expanded.

[0102] In an illustrative embodiment, the first connection part 13 and the second connection part 14 adopt an integrated box-type flow channel design, and its structural features include: a long rectangular box body is provided with a continuous through inner cavity along the length direction, and connection interfaces are opened on the side of the box body at equal intervals, which form a sealed connection with the interior of the heat exchange tube 12 through a docking structure.

[0103] The above-described arrangement ensures that the continuous inner cavity design maintains flow stability during the cooling medium diversion and converging processes. Furthermore, the standardized interface arrangement facilitates modular assembly with varying numbers of heat exchange tubes 12. Furthermore, the integrated housing enhances the structural strength and sealing reliability of the flow channel system. This design is particularly suitable for high-power electronic equipment cooling scenarios requiring high-precision flow channel control.

[0104] The heat dissipation device in the embodiment of the present application constructs an efficient heat transfer path: the heat generated by the heating element 9 is first conducted through the heat-conducting portion 21 of the heat-conducting unit 2 in direct contact, and then the heat is transferred to the cold mass flow channel 11 of the heat exchange component 1 by the heat-conducting medium in the liquid capsule 22, and finally the heat is taken out of the system by the circulating cooling medium. This heat transfer path forms a complete heat flow channel of "heat-conducting element → heat-conducting interface → heat-conducting medium → cooling medium", realizing efficient heat transfer from the heating element to the external environment. This multi-stage heat transfer architecture gives full play to the respective advantages of contact conduction and liquid convection, ensuring that heat can be quickly and evenly extracted from the heat source.

[0105] Furthermore, while multiple heat exchange tubes 12 arranged side by side form a dense heat exchange flow channel, the space between them naturally constitutes the installation position of the memory unit 91, thereby improving the space utilization of the heat dissipation system and the memory module; the structure in which the heat conduction unit 2 is directly connected to the heat exchange tube 12 establishes the shortest heat conduction path from the memory unit 91 to the cold mass, significantly improving the heat exchange efficiency; in particular, the spacing between adjacent heat exchange tubes 12 can be precisely adapted to memory modules of different specifications, while maintaining the pressure-bearing capacity, providing a modular and customized heat dissipation solution for high-density servers.

[0106] Figure 7 A schematic diagram of the structure of a server heat dissipation device provided in an embodiment of the present application.

[0107] The embodiment of the present application also provides a server heat dissipation device, such as Figure 7 As shown, the system includes a chassis 7, a server motherboard 8, and the aforementioned memory liquid cooling radiator. The server motherboard 8 is disposed within the chassis 7 and is equipped with multiple heating elements 9. The memory liquid cooling radiator is disposed within the chassis 7. When the liquid bladder 22 is filled with the thermally conductive medium, the thermally conductive unit 2 is in thermal contact with the adjacent heating elements 9.

[0108] The above-described setup utilizes a modular liquid cooling structure, where a liquid bladder 22 filled with a thermally conductive medium forms adaptive contact with the heating element 9, ensuring optimal contact between the heat transfer unit 2 and the heating element 9 at all times. This not only addresses the issue of poor contact between traditional radiators and high-density memory modules, but its unique pressure regulation mechanism also automatically compensates for component assembly tolerances and allows for timely adjustment of cooling intensity as server loads fluctuate. The entire system provides a comprehensive solution for high-density servers, combining efficient cooling with energy conservation and environmental protection.

[0109] In an illustrative embodiment, Figure 6 As shown, the heat exchange assembly 1 is fixed to the server motherboard 8 or the chassis 7 through multiple fixings 15 ; the water inlet pipe 5 and the water outlet pipe 6 are fixed to the chassis 7 through pipe fixings 71 .

[0110] In detail, the fixing member 15 includes a fastening screw, which fixes the heat exchange component 1 through a mounting base set on the server motherboard 8 or the chassis 7; wherein, it also includes a buffer component, which is set between the mounting base and the heat exchange component 1 and / or between the fixing member 15 and the heat exchange component 1. In detail, the fixing member 15 is located at both ends of the first connecting part 13 and the second connecting part 14 to provide stable fixation.

[0111] Furthermore, the pipe fixing member 71 includes a clamp, primarily composed of a stainless steel clamp body, an adjustment bolt, and a shock-absorbing base. Lined with a high-temperature-resistant silicone cushioning layer, it ensures flexible contact with the pipe. During installation, a graded locking mechanism achieves uniform pressure distribution, ensuring securement strength while preventing pipe deformation. The unique shock-absorbing design effectively isolates equipment vibration transmission while allowing for moderate pipe displacement due to thermal expansion and contraction. This pipe fixing solution ensures system reliability while balancing ease of installation and maintenance.

[0112] In an illustrative embodiment, Figure 6 As shown, the water inlet pipe 5 extends to the outside of the chassis 7 and is provided with a water inlet valve 51. The water outlet pipe 6 also extends to the outside of the chassis 7 and is provided with a water outlet valve 61. Through the setting of the water inlet valve 51 and the water outlet valve 61, the flow rate of the refrigerant in the refrigerant flow channel 11 can be regulated in real time to adapt to different heat dissipation requirements.

[0113] This application achieves intelligent installation and heat dissipation optimization by integrating a flexible heat sink (i.e., heat transfer unit 2) with gas channels into a traditional cold plate liquid cooling system. The core of this device lies in the fact that heat transfer unit 2 is made of a flexible, highly thermally conductive composite material and internally features an adjustable pressure liquid channel (liquid capsule 22). During installation, the volume of heat transfer unit 2 is reduced by reducing the amount of thermal conductive medium charged, avoiding physical contact with memory unit 91 and effectively preventing damage from collisions during installation. After installation, the amount of thermal conductive medium charged is increased, causing heat transfer unit 2 to expand, forming a tight fit with memory unit 91 and significantly improving heat dissipation efficiency. This innovative air pressure regulation mechanism not only solves the installation difficulties of traditional radiators, but also ensures optimal thermal conductivity during operation, providing a safe and reliable heat dissipation solution for high-density server memory.

[0114] The above is a detailed introduction to the server protection equipment and server provided by this application. This article uses specific examples to illustrate the principles and implementation methods of this application. The description of the above embodiments is only used to help understand the method and core ideas of this application. It should be pointed out that for ordinary technicians in this technical field, without departing from the principles of this application, several improvements and modifications can be made to this application, and these improvements and modifications also fall within the scope of protection of the claims of this application.

Claims

1. A memory liquid cooling radiator, characterized in that: include: The heat exchange component 1 is provided with a through cold mass flow channel 11; At least one heat conducting unit 2 is provided on the outer surface of the heat exchange component 1, wherein the heat conducting unit 2 includes two heat conducting parts 21 provided in parallel, and a liquid capsule 22 is connected between the two heat conducting parts 21; and The liquid supply component 3 is in communication with the liquid capsule 22 and is used to inject or extract the heat-conducting medium into or out of the liquid capsule 22 , and adjust the distance between the two heat-conducting parts 21 by the volume change of the liquid capsule 22 .

2. The memory liquid cooling radiator according to claim 1, characterized in that: The heat conducting portion 21 is configured as a rectangular sheet, one end of which is fixedly connected to the heat exchange component 1 .

3. The memory liquid cooling radiator according to claim 2, characterized in that: The heat conducting unit 2 further includes a packaging member 23 , which is coated on the outer surfaces of the two heat conducting parts 21 . The edge of the packaging member 23 forms an airtight sealing connection with the heat exchange component 1 .

4. The memory liquid cooling radiator according to claim 1, characterized in that: The heat conducting portion 21 is made of a soft heat conducting material, including graphene.

5. The memory liquid cooling radiator according to claim 4, characterized in that: The heat conducting unit 2 is provided with a plurality of liquid capsules 22 , which are arranged side by side along the length direction of the two heat conducting parts 21 .

6. The memory liquid cooling radiator according to any one of claims 1 to 5, characterized in that: The liquid supply component 3 includes: a liquid storage tank 31 , which is in communication with the liquid capsule 22 and is filled with the heat-conducting medium; and The bidirectional pump 32 is connected to the pipeline between the liquid bag 22 and the liquid storage tank 31 .

7. The memory liquid cooling radiator according to claim 6, characterized in that: The system further includes at least one pressure assembly 4 , which is disposed in a pipeline connecting the liquid bag 22 and the bidirectional pump 32 . The pressure assembly 4 includes a hydraulic valve 41 and a pressure sensor 42 .

8. The memory liquid cooling radiator according to claim 1, characterized in that: The heat exchange component 1 includes: A plurality of heat exchange tubes 12 arranged in parallel, each heat exchange tube 12 having at least one heat transfer unit 2 installed along its length; A first connecting portion 13 connected to the first ends of the plurality of heat exchange tubes 12; and Two second connecting parts 14 are respectively connected to the second end of at least one of the heat exchange tubes 12, and the two second connecting parts 14 are respectively connected to the external cold mass supply module through the water inlet pipe 5 and the water outlet pipe 6; The inner cavities of the plurality of heat exchange tubes 12 , the first connecting portion 13 and the two second connecting portions 14 are connected to form the cold mass flow channel 11 .

9. A server heat dissipation device, characterized in that: include: Chassis 7; A server motherboard 8 is disposed in the chassis 7 , and the server motherboard 8 is equipped with a plurality of heating elements 9 ; as well as The memory liquid cooling radiator according to any one of claims 1 to 8, arranged in the chassis 7; When the liquid capsule 22 is filled with the heat-conducting medium, the heat-conducting unit 2 is in heat-conducting contact with the adjacent heating element 9 .

10. The server heat dissipation device according to claim 9, characterized in that: The heat exchange assembly 1 is fixed to the server motherboard 8 or the chassis 7 via a plurality of fixing members 15; and The water inlet pipe 5 and the water outlet pipe 6 are fixed to the chassis 7 via pipe fixing members 71 .

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