Time-sharing fusion imaging-based electronic component model acquisition method, medium and product

Abstract

The application provides an electronic component model acquisition method based on time-sharing fusion imaging, a medium and a product, and relates to the technical field of 3D imaging. The method comprises the following steps: irradiating a target electronic component with a plurality of light sources one by one, collecting images of the target electronic component under irradiation of different light sources, the light emitted by different light sources being different in color, and the angles of different light sources relative to the target electronic component being different; and generating a three-dimensional model of the target electronic component according to the images. According to the application, the images of the target electronic component can be acquired in a multi-color and multi-angle time-sharing fusion imaging mode, the matching degree of the three-dimensional model and the target electronic component is improved, the model has high precision, the color information of the electronic component can be accurately acquired, the device cost is low, the model acquisition efficiency is high, and the production demand can be effectively met.

Description

Technical Field

[0001] This application relates to the field of 3D imaging technology, and more specifically, to a method, medium, and product for acquiring electronic component models based on time-division fusion imaging. Background Technology

[0002] Surface Mount Technology (SMT), also known as surface mount technology, is a circuit assembly technology that mounts leadless or short-lead surface mount components (SMC / SMD, also known as chip components) onto the surface of a printed circuit board (PCB) or other substrates, and then solders them using methods such as reflow soldering or dip soldering.

[0003] Miniaturization and high-density placement of SMT components are current trends in electronic manufacturing, which places higher demands on SMT component inspection. In existing technologies, during electronic component production, a 3D model of the target electronic component is obtained by laser scanning. This model is then used to inspect whether parameters such as solder paste size and placement position meet requirements. While this method of obtaining a 3D model is highly accurate, it is time-consuming, difficult to obtain color information, and the equipment is expensive, making it difficult to meet production needs. Summary of the Invention

[0004] This application provides a method, medium, and product for acquiring electronic component models based on time-division fusion imaging. This addresses the problems of time-consuming acquisition, difficulty in effectively acquiring object colors, and high equipment costs associated with existing methods for acquiring 3D models of electronic components. To achieve this objective, this application provides the following solutions.

[0005] According to one aspect of the embodiments of this application, a method for obtaining electronic component models based on time-division fusion imaging is provided, including:

[0006] Multiple light sources are used to illuminate the target electronic component one by one, and images of the target electronic component under different light source illumination are acquired. The light emitted by the different light sources is of different colors, and the angles of the different light sources relative to the target electronic component are different.

[0007] A three-dimensional model of the target electronic component is generated based on the image.

[0008] In one possible implementation, the light source is positioned between the target electronic component and the camera, the camera being used to acquire images of the target electronic component;

[0009] Different light sources are at different heights relative to the target electronic component, and the light sources surround the optical axis of the camera.

[0010] In one possible implementation, each light source includes multiple partitions surrounding the optical axis, and the method of illuminating the target electronic component one by one with multiple light sources includes:

[0011] The target light source emitting light is determined according to the illumination sequence, which includes the emission sequence of the light source and the emission sequence of the partitions within the light source;

[0012] The target electronic component is illuminated by the partitions of the target light source one by one according to the light emission sequence of the partitions in the light source.

[0013] In one possible implementation, generating a three-dimensional image of the target electronic component based on the image includes:

[0014] The three-dimensional coordinate information of the surface of the target electronic component is obtained from the image, and the color features of the target electronic component are extracted using the image.

[0015] A three-dimensional model of the target electronic component is constructed based on the three-dimensional coordinate information and the color information.

[0016] In one possible implementation, obtaining the three-dimensional coordinate information of the surface of the target electronic component based on the image includes:

[0017] Obtain the illumination information corresponding to the image, wherein the illumination information includes at least one of light color, illumination direction, distance between the camera and the target electronic component, incident light intensity, reflectivity, and reflected light intensity;

[0018] Determine the height function of the target electronic component surface, and obtain the error function corresponding to the height function based on the illumination information;

[0019] The height function is iteratively optimized based on the error function to obtain the height value of the target electronic component surface. The error function is the sum of the errors of images corresponding to multiple light sources.

[0020] In one possible implementation, the expression for the error function is:

[0021]

[0022] In the formula, Let c be the error function, k be the number of the light color, k be the number of the illumination direction, and m be the total number of light colors. This represents the total number of light directions. Let be the intensity of reflected light under the c-th light color and the k-th illumination direction. Let c be the reflectance of the target electronic component for the c-th color of light. Let c be the incident light intensity corresponding to the c-th color. height function The partial derivative on the x-axis, Let x be the component of the illumination direction vector on the x-axis. height function Partial derivative on the y-axis Let be the y-component of the illumination direction vector. Let be the component of the illumination direction vector on the z-axis, with the camera optical axis direction being the positive z-axis direction.

[0023] In one possible implementation, extracting the color features of the target electronic component using the image includes:

[0024] The first reflected light intensity information of the target electronic component at different positions is determined based on the three-dimensional coordinate information and the reflected light intensity, wherein the first reflected light intensity information includes the reflected light intensity of the position for different colors of light;

[0025] A texture image of the target electronic component is generated based on the first reflected light intensity information and the three-dimensional coordinate information.

[0026] According to one aspect of the embodiments of this application, the embodiments of this application provide a computer-readable storage medium having a computer program stored thereon, which, when executed, implements the steps of the method described above.

[0027] According to one aspect of the embodiments of this application, the embodiments of this application provide a computer program product, including a computer program that, when executed by a processor, implements the steps of the method described above.

[0028] The beneficial effects of the technical solutions provided in this application are:

[0029] The electronic component model acquisition method based on time-division fusion imaging provided in this application uses multiple light sources to illuminate the target electronic component one by one, and collects images of the target electronic component under different light source illumination. The light emitted by different light sources is of different colors, and the angles of different light sources relative to the target electronic component are different. A three-dimensional model of the target electronic component is generated based on the images. The embodiments of this application can acquire images of the target electronic component through multi-color and multi-angle time-division fusion imaging, improve the matching degree between the three-dimensional model and the target electronic component, achieve high model accuracy, accurately acquire the color information of the electronic component, have low equipment cost, and high model acquisition efficiency, effectively meeting production needs. Attached Figure Description

[0030] To more clearly illustrate the technical solutions in the embodiments of this application, the accompanying drawings used in the description of the embodiments of this application will be briefly introduced below.

[0031] Figure 1 A flowchart illustrating the electronic component model acquisition method based on time-division fusion imaging provided in this application embodiment;

[0032] Figure 2 A schematic diagram illustrating the setup of the camera, light source, and target electronic components provided in an embodiment of this application;

[0033] Figure 3 This is a schematic diagram of the partitioning of the light source provided in the embodiments of this application;

[0034] Figure 4 A schematic diagram illustrating the acquisition of a three-dimensional model provided in an embodiment of this application;

[0035] Figures 5a to 5d These are chip images acquired under different zones of blue light illumination, as provided in the embodiments of this application.

[0036] Figures 6a to 6d Chip images acquired under different zones of green light source illumination, as provided in embodiments of this application;

[0037] Figures 7a to 7d Chip images acquired under different zones of red light source illumination, as provided in the embodiments of this application;

[0038] Figures 8a to 8c The embodiments provided in this application are based on Figures 6a-7d The texture image obtained from the chip image;

[0039] Figure 9 The embodiments provided in this application are based on Figures 5a-8b The three-dimensional shape obtained from the image. Detailed Implementation

[0040] The embodiments of this application are described below with reference to the accompanying drawings. It should be understood that the embodiments described below with reference to the accompanying drawings are exemplary descriptions for explaining the technical solutions of the embodiments of this application, and do not constitute a limitation on the technical solutions of the embodiments of this application.

[0041] Those skilled in the art will understand that, unless specifically stated otherwise, the singular forms “a,” “an,” “the,” and “the” used herein may also include the plural forms. It should be further understood that the terms “comprising” and “including” as used in embodiments of this application mean that the corresponding feature can be implemented as the presented feature, information, data, step, operation, element, and / or component, but do not exclude implementation as other features, information, data, step, operation, element, component, and / or combinations thereof supported by the art. It should be understood that when we say that an element is “connected” or “coupled” to another element, the one element can be directly connected or coupled to the other element, or it can mean that the one element and the other element establish a connection relationship through an intermediate element. Furthermore, “connected” or “coupled” as used herein can include wireless connection or wireless coupling. The term “and / or” as used herein indicates at least one of the items defined by the term; for example, “A and / or B” indicates implementation as “A,” or implementation as “A,” or implementation as “A and B.”

[0042] To make the objectives, technical solutions, and advantages of this application clearer, the embodiments of this application will be described in further detail below with reference to the accompanying drawings.

[0043] The technical solutions of this application and their effects are described below through several exemplary embodiments. It should be noted that the following embodiments can be referenced, borrowed from, or combined with each other. Identical terms, similar features, and similar implementation steps in different embodiments will not be repeated.

[0044] The electronic component model acquisition method, medium, and product based on time-division fusion imaging provided in this application aim to solve at least one technical problem existing in the prior art.

[0045] Optionally, the device that performs the electronic component model acquisition method based on time-division fusion imaging of this application can be a mobile phone, tablet computer, server, SMT placement device, or other terminal capable of acquiring target electronic component models and generating 3D models.

[0046] Optionally, such as Figures 1-9 As shown, the electronic component model acquisition method based on time-division fusion imaging in this application includes:

[0047] S101: Use multiple light sources to illuminate the target electronic component one by one, and collect images of the target electronic component under different light source illumination.

[0048] Optionally, the target electronic component can be a chip, SMT component, textile, or other object that requires the generation of a 3D model. The type of target electronic component can be determined according to the actual environment. After obtaining the 3D model, various operations such as measurement, processing, and handling of the target electronic component can be performed on the 3D model according to actual needs.

[0049] Optionally, different light sources emit different colors of light, and the angles of the different light sources relative to the target electronic component are different. Each light source can emit pure light of a specific color; for example, three light sources can be set to emit red, green, and blue light respectively. More light sources can also be set, as long as the light emitted by each light source is of a different color.

[0050] In one embodiment, such as Figure 2 As shown, multiple light sources are provided, and solder paste is provided on the side of the target electronic component. The light sources can be positioned between the target electronic component and the camera. The camera is used to capture images of the target electronic component with solder paste. Different light sources have different heights relative to the target electronic component, and the light sources surround the optical axis of the camera.

[0051] Alternatively, the light source can be positioned at the same height as the camera lens, or it can be positioned above the camera. The relative positions of the camera and the light source can be determined based on image acquisition requirements, desired acquisition results, and the image acquisition environment.

[0052] Optionally, the number of cameras can be single or multiple. When there are multiple cameras, a 3D model can be constructed using images from each camera, and the 3D models corresponding to all cameras can be integrated to obtain the final 3D model of the target electronic component.

[0053] Alternatively, different light sources can be partially or entirely located at the same height relative to the target electronic component, as long as the illumination angle of each light source is different in order to capture images of the target electronic component at various locations as much as possible.

[0054] Optionally, the light source can be an RGB light source or a light source emitting other specific wavelengths of light. The color of the light source can be determined according to the type of the target electronic component and the image acquisition requirements. The light emitted by the light source illuminates the surface of the target electronic component, providing a basis for obtaining the color information of the target electronic component and enhancing the surface features of the target electronic component.

[0055] Alternatively, the size of the light source can be determined based on the size of the target electronic components and the image resolution requirements.

[0056] In one embodiment, the minimum diameter of the light source can be twice the smallest detectable feature size of the target electronic component. For example, if the diameter of the solder joint to be detected on the target electronic component is 0.1 mm, the minimum diameter of the light source is greater than or equal to 0.2 mm.

[0057] Optionally, to avoid light spot overlap, the distance between adjacent light sources can be greater than 1.5 times the diameter of the light source, and the size difference between the light sources can be less than or equal to 20%.

[0058] Optionally, the light source can be ring-shaped, and each color of the light source includes multiple partitions. The partitions surround the optical axis, and the target electronic component is illuminated one by one by the multiple light sources. This includes: determining the target light source that is currently emitting light according to the illumination sequence, which includes the emission sequence of the light source and the emission sequence of the partitions in the light source; and controlling the partitions of the target light source to illuminate the target electronic component one by one according to the emission sequence of the partitions in the light source.

[0059] Optionally, the number of partitions in the light source can be 4, 6, 8, 10, or other numbers. Different light sources can have the same or different number of partitions. The light emitted from different partitions of the same light source can be of the same or different colors.

[0060] In one embodiment, such as Figure 3 As shown, the light source is a ring structure with eight sections, designated as section 0 to section 7. The optical axis of the camera used to capture images is located at the center of this ring structure. After determining the target light source, the sections of the target light source can be controlled to emit light sequentially in a clockwise direction, and the camera captures one or more images of the target electronic component when each section is illuminated.

[0061] In one embodiment, when the number of partitions is 4 and the light source is a blue light source, a green light source, and a red light source, the acquired chip image can be as follows: Figures 5a-7d As shown, chip images are acquired during illumination of each light source's partition. Figures 5a-5d The images of the chip were captured under sequential illumination of the first to fourth zones of a blue light source. Figures 6a-6d The images of the chip were captured under sequential illumination of the first to fourth zones of the green light source. Figures 7a-7d The images of the chip were captured under sequential illumination of the first to fourth zones of the red light source.

[0062] Optionally, the emission of light sources can be controlled by a time-division control module. This module, connected to the light source, prevents different light sources from illuminating simultaneously and coordinates their timing. Through precise time control, the module ensures that light sources emitting different colors illuminate the object at different times. Specifically, the light source can emit light 1ms before the camera captures the image and continue emitting light until the camera's exposure ends, while the camera captures the image at the corresponding moment of light emission, achieving multi-color, multi-angle time-division imaging.

[0063] In one embodiment, the time-division control module may include a microcontroller for controlling the switching sequence of each zone of the light source, and the emission timing error of the light source may be set to less than 1 microsecond. The light source may include red, green, and blue light sources. During image acquisition, the red light source may be turned on first, and the camera exposure may be triggered 5ms after it is turned on. After each zone of the red light source finishes emitting light, the red light source is turned off, and then the green light source is switched on. The operation of turning on each light source and acquiring images is repeated in a loop until image acquisition is completed.

[0064] Optionally, the time-sharing control module can use hardware trigger signals (such as GPIO) to trigger the light source or camera to work synchronously to ensure the consistency of data acquisition.

[0065] In one embodiment, during image acquisition, the target electronic component is placed on a platform, and the parameters of the camera and light source are adjusted. These parameters include light intensity, camera exposure time, focal length, etc., and their values ​​can be determined based on image acquisition requirements, 3D model accuracy requirements, and other conditions. After parameter adjustment, the time-division control module sequentially triggers different light sources to emit light. When each light source emits light, the camera captures an image of the object. For example, first, the red light source is turned on, and the camera captures a set of images of the electronic component model under red light illumination; then, the camera switches to the green light source and captures images again; and so on, completing the capture of images of all color light sources, thereby obtaining images of the target electronic component under different lighting conditions. Specifically, the light source can be a ring-shaped RGB light source, which can include 12 zones. The diameter of the ring-shaped RGB light source is 50mm, and the spacing between adjacent light sources can be 80mm. The camera can be equipped with a 20-megapixel CMOS sensor, a frame rate of 30fps, and a telecentric lens. The camera's exposure time can be 10ms for each zone when each light source is turned on. When there are 3 light sources, each light source including 4 zones, the total imaging cycle of the camera is 120ms.

[0066] S102: Generate a three-dimensional model of the target electronic component based on the image.

[0067] Optionally, generating a three-dimensional image of the target electronic component from the image includes: obtaining three-dimensional coordinate information of the surface of the target electronic component from the image; extracting color features of the target electronic component from the image; and constructing a three-dimensional model of the target electronic component based on the three-dimensional coordinate information and color information. The three-dimensional coordinate information can be obtained through the parallax between images under different illumination angles, and the color information can be determined from images obtained under different light sources. A three-dimensional model of the target electronic component is then obtained based on this color information and three-dimensional coordinate information.

[0068] Optionally, after acquiring the image, it can be preprocessed, including noise reduction, correction and other processing methods to reduce noise in the image.

[0069] Optionally, obtaining three-dimensional coordinate information of the target electronic component surface based on the image includes: obtaining illumination information corresponding to the image, wherein the illumination information includes at least one of light color, illumination direction, distance between the camera and the target electronic component, incident light intensity, reflectivity, and reflected light intensity; determining the height function of the target electronic component surface, and obtaining an error function corresponding to the height function based on the illumination information; iteratively optimizing the height function based on the error function to obtain the height value of the target electronic component surface, wherein the error function is the sum of errors of images corresponding to multiple light sources.

[0070] Optionally, the expression for the error function is:

[0071]

[0072] In the formula, Let c be the error function, k be the number of the light color, k be the number of the illumination direction, and m be the total number of light colors. This represents the total number of light directions. Let be the intensity of reflected light under the c-th light color and the k-th illumination direction. Let c be the reflectance of the target electronic component for the c-th color of light. Let c be the incident light intensity corresponding to the c-th color. height function The partial derivative on the x-axis, Let x be the component of the illumination direction vector on the x-axis. height function Partial derivative on the y-axis Let be the y-component of the illumination direction vector. Let be the component of the illumination direction vector on the z-axis, with the camera optical axis direction being the positive z-axis direction.

[0073] Optionally, the origin of the coordinate system formed by the x-axis, y-axis, and z-axis can be the optical center of the camera. This coordinate system can be a Cartesian coordinate system, with the target electronic component located on the plane z=d. d is the distance between the camera and the plane containing the object being measured.

[0074] Optionally, when acquiring information about the illumination direction, the angle between the camera optical axis and the illumination direction of each partition of the light source, as well as the camera azimuth angle, are obtained, and the components of the illumination direction vector are obtained based on the angle and the camera azimuth angle.

[0075] In one embodiment, the angle (tilt angle) between the camera's optical axis and the direction of illumination is: c is the color code of the light emitted by the light source, k is the direction code of the illumination, and the camera azimuth angle is... Convert the included angle and the camera azimuth angle into radians:

[0076] , Correspondingly, the illumination direction vector The components are as follows:

[0077]

[0078]

[0079]

[0080] In one embodiment, the surface of the target electronic component can be a Lambertian surface, and for each color of light, the reflected light intensity is... satisfy .in It is the reflectance of the object's surface to that color of light. It is the intensity of the incident light corresponding to that color. is the normal vector of the object's surface, c is the color code (e.g., c=1 for red, c=2 for green, c=3 for blue), m is the total number of colors, and k is the angle code of the light source.

[0081] Optionally, the height function is a height function of the target electronic component's surface, which can be expressed as: The normal vector of the target electronic component surface can be expressed as: On a gentle slope (e.g., less than 10 degrees), the surface of the target electronic component is nearly horizontal, and the vertical vector is close to 1. , .

[0082] In one embodiment, when using gradient descent for iterative optimization, the height function is discretized into a pixel-level matrix, where each pixel corresponds to a point on the surface of the target electronic component. The height value of each pixel can be iteratively optimized using gradient descent, thereby reducing the error function. Convergence. Based on the iteration results, determine the coordinate information (e.g., height value) of each point on the surface of the target electronic component. In discrete image pixels ( On the above, the partial derivatives of the error function are obtained using the finite difference method: , , Represents pixel ( The corresponding coordinate information (height value). Represents pixel ( The corresponding coordinate information (height value). Represents pixel ( The corresponding coordinate information (height value) is in When the difference between the x and y coordinates of the i-th pixel and the (i+1)-th pixel is 1, the error function is related to... The partial derivatives are Learning rate The initial value can be set to 0.01. If the error exceeds the convergence threshold after each iteration, then... Halved, maximum number of iterations The convergence threshold will be set based on the image resolution (e.g., K=500 for a resolution of 1000*1000 pixels). The initial value can be set to 0.00001. Initialize the height matrix of the object's surface (i.e., the pixel-level matrix obtained by discretization). The size of this matrix is ​​the same as the image size, and all elements in the matrix are set to 0. , The number of iterations can be K, for each pixel ( ), calculate according to the following formula:

[0083]

[0084] In the formula, This represents the k-th iteration. The height value is updated using the gradient descent formula, which is: , This represents the height value of pixel (i, j) after the k-th iteration. Using... Calculate the sum of the height changes for all pixels. If If the maximum number of iterations is reached, the iteration stops; otherwise, it continues to the next iteration. After convergence, the height value matrix... Each element in This refers to the height value of the corresponding pixel. These height values ​​are then combined with the pixel's coordinates. It can construct the three-dimensional coordinate information of the surface of the target electronic component. This allows us to obtain the three-dimensional shape information of the target electronic component.

[0085] Alternatively, to improve the convergence speed and stability during the gradient descent optimization process, the Adam optimizer can be used to dynamically adjust α to accelerate convergence and a momentum term (β=0.9) can be added to reduce oscillations.

[0086] Optionally, the color features of the target electronic component are extracted using an image, including: determining first reflected light intensity information at different positions of the target electronic component based on three-dimensional coordinate information and reflected light intensity, wherein the first reflected light intensity information includes the reflected light intensity of the position for different colors of light; and generating a texture image of the target electronic component based on the first reflected light intensity information and three-dimensional coordinate information.

[0087] In one embodiment, since the reflectivity of light varies at different locations on the surface of the target electronic component, after obtaining the three-dimensional coordinate information of the target electronic component's surface, the reflectivity of the object's surface for each color of light can be inferred using the Lambertian reflection model. The incident light intensity of each color The intensity of reflected light can be pre-determined using a photometer through a calibration experiment. It can also be obtained through measurement. (From...) We can obtain: , This represents the reflectance of point (x, y) under the c-th color of light. If the reflectance of the same color of light shining on the same point at different angles is different, these reflectances can be weighted and averaged to obtain the reflectance under that color of light, thus improving the accuracy of reflectance calculation.

[0088] After obtaining the reflectance at different locations, the coordinates (x, y) of each point and the corresponding reflectance are then compared. Combining these steps, the reflectance-to-RGB formula is used to obtain the RGB color value of each point, i.e., the color value of the texture image at point (x, y), thus constructing the texture image of the object. The reflectance-to-RGB formula is as follows:

[0089] , ,

[0090] In the formula, This represents the reflectance of point (x, y) for the color red. This indicates the maximum reflectivity of the target electronic component to red. Let (x, y) represent the reflectance of the point (x, y) with respect to green. This indicates the maximum reflectivity of the target electronic component to green. This represents the reflectance of point (x, y) for the color blue. This represents the maximum reflectivity of the target electronic component to blue. A three-dimensional model of the target electronic component is established based on the three-dimensional coordinates of each point on its surface and the corresponding color.

[0091] In one embodiment, such as Figure 4 Different light sources have different angles relative to the target electronic component. Images acquired under different light sources and different illumination zones can be represented as (high angle L0…low angle Ln). Time-division fusion processing is performed on these images to obtain the 3D shape and texture images formed by the coordinates of each position of the target electronic component. Fusing these 3D shape and texture images yields the 3D model of the target electronic component. Specifically, when the target electronic component is an FPGA chip, the chip images acquired under different light sources can be as follows: Figures 5a-8c As shown, based on these images, the colors corresponding to different coordinates on the FPGA chip are obtained, thus yielding... Figures 8a-8c The texture image shown, wherein, Figure 8a Images can be based on Figures 5a-5d The image was obtained. Figure 8b Images can be based on Figures 6a-6d The image was obtained. Figure 8c The image can be based on Figure a to Figure 7d The image is obtained, and then used... Figures 5a-8c The image in the image is used to generate the three-dimensional shape of the FPGA chip.

[0092] The electronic component model acquisition method based on time-division fusion imaging provided in this application has the following advantages:

[0093] Improve measurement accuracy: By using multi-color, multi-angle time-division fusion imaging, the measurement blind zone is reduced, and the measurement accuracy of objects with complex shapes is improved.

[0094] Achieve high-precision fusion of color and shape information: accurately acquire the three-dimensional shape and true color information of objects to meet the needs of comprehensive digitization of objects.

[0095] Improved efficiency: The use of time-sharing fusion imaging technology reduces measurement time and data processing complexity, enabling rapid and efficient acquisition of 3D models.

[0096] Based on the same inventive concept, embodiments of this application provide a computer-readable storage medium storing a computer program that, when executed by an electronic device / processor, implements the steps of any method provided in this application or the steps of various optional implementations of the method provided in this application.

[0097] Based on the same inventive concept, embodiments of this application provide a computer program product, which includes a computer program that, when executed by an electronic device / processor, implements the steps of any method provided in this application or the steps of various optional implementations of the method provided in this application.

[0098] Those skilled in the art will understand that the steps, measures, and solutions in the various operations, methods, and processes discussed in this application can be alternated, modified, combined, or deleted. Furthermore, other steps, measures, and solutions in the various operations, methods, and processes discussed in this application can also be alternated, modified, rearranged, decomposed, combined, or deleted. Furthermore, steps, measures, and solutions in related technologies that are similar to those disclosed in this application can also be alternated, modified, rearranged, decomposed, combined, or deleted.

[0099] In the description of this application, the terms "center," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," and "outer," etc., indicate directions or positional relationships based on the exemplary directions or positional relationships shown in the accompanying drawings. They are used to facilitate the description or simplification of the embodiments of this application and are not intended to indicate or imply that the device or component referred to must have a specific orientation or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this application.

[0100] The terms "first," "second," "third," "fourth," "1," "2," etc. (if present) in the specification, claims, and accompanying drawings of this application are used to distinguish similar objects and are not necessarily used to describe a specific order or sequence. It should be understood that such data can be interchanged where appropriate so that the embodiments of this application described herein can be implemented in a sequence other than that shown in the illustrations or text descriptions.

[0101] It should be understood that although arrows indicate various operation steps in the flowcharts of this application's embodiments, the order in which these steps are implemented is not limited to the order indicated by the arrows. Unless explicitly stated herein, in some implementation scenarios of this application's embodiments, the implementation steps in each flowchart can be executed in other orders as required. Furthermore, some or all steps in each flowchart, based on the actual implementation scenario, may include multiple sub-steps or multiple stages. Some or all of these sub-steps or stages can be executed at the same time, and each sub-step or stage can also be executed at different times. In scenarios where execution times differ, the execution order of these sub-steps or stages can be flexibly configured according to requirements, and this application's embodiments do not limit this.

[0102] The above description is only an optional implementation method for some implementation scenarios of this application. It should be noted that for those skilled in the art, other similar implementation methods based on the technical concept of this application without departing from the technical concept of this application also fall within the protection scope of the embodiments of this application.

Claims

1. A method for acquiring electronic component models based on time-division fusion imaging, characterized in that, include: Multiple light sources are used to illuminate the target electronic component one by one, and images of the target electronic component under different light source illumination are acquired. The light emitted by the different light sources is of different colors, and the angles of the different light sources relative to the target electronic component are different. A three-dimensional model of the target electronic component is generated based on the image. The three-dimensional model includes three-dimensional coordinate information of the surface of the target electronic component. The acquisition of the three-dimensional coordinate information includes: Obtain the illumination information corresponding to the image, wherein the illumination information includes at least one of light color, illumination direction, distance between the camera and the target electronic component, incident light intensity, reflectivity, and reflected light intensity; Determine the height function of the target electronic component surface, and obtain the error function corresponding to the height function based on the illumination information. The error function is the sum of the errors of images corresponding to multiple light sources. The height function is discretized into a pixel-level matrix, and the height value of each pixel in the pixel-level matrix is ​​iteratively optimized using gradient descent. The height value of each point on the surface of the target electronic component is determined based on the iteration results. Wherein, the error function is about The partial derivatives are: In the formula, Let be the error function. These are elements of a pixel-level matrix, where c is the color number, k is the direction number of the illumination, and m is the total number of colors. This represents the total number of light directions. Let be the intensity of reflected light under the c-th light color and the k-th illumination direction. Let c be the reflectance of the target electronic component for the c-th color of light. Let c be the incident light intensity corresponding to the c-th color. height function The partial derivative on the x-axis, Let x be the component of the illumination direction vector on the x-axis. height function Partial derivative on the y-axis Let be the y-component of the illumination direction vector. represents the component of the illumination direction vector on the z-axis, with the camera optical axis direction being the positive z-axis direction; The gradient descent formula is: , This indicates the k-th iteration. For the k-th iteration, the error function with respect to The partial derivatives, This represents the height value of pixel (i, j) after the k-th iteration. For learning rate, This represents the height value of pixel (i, j) after the (k+1)th iteration; use Calculate the sum of the height changes for all pixels; like If the maximum number of iterations is reached, stop iterating and process each element in the pixel-level matrix. The value is determined as the height value of the corresponding pixel. The maximum number of iterations is determined based on the image resolution, serving as the convergence threshold.

2. The method for obtaining electronic component models based on time-division fusion imaging according to claim 1, characterized in that, The light source is positioned between the target electronic component and the camera, and the camera is used to capture images of the target electronic component. Different light sources are at different heights relative to the target electronic component, and the light sources surround the optical axis of the camera.

3. The method for obtaining electronic component models based on time-division fusion imaging according to claim 2, characterized in that, Each light source includes multiple partitions surrounding the optical axis, and the method of illuminating the target electronic component one by one using multiple light sources includes: The target light source emitting light is determined according to the illumination sequence, which includes the emission sequence of the light source and the emission sequence of the partitions within the light source; The target electronic component is illuminated by the partitions of the target light source one by one according to the light emission sequence of the partitions in the light source.

4. The method for obtaining electronic component models based on time-division fusion imaging according to claim 2, characterized in that, The step of generating a three-dimensional image of the target electronic component based on the image includes: The three-dimensional coordinate information of the surface of the target electronic component is obtained from the image, and the color features of the target electronic component are extracted using the image. A three-dimensional model of the target electronic component is constructed based on the three-dimensional coordinate information and the color information.

5. The method for obtaining electronic component models based on time-division fusion imaging according to claim 1, characterized in that, The expression for the error function is: 。 6. The method for obtaining electronic component models based on time-division fusion imaging according to claim 1, characterized in that, The step of extracting the color features of the target electronic component using the image includes: The first reflected light intensity information of the target electronic component at different positions is determined based on the three-dimensional coordinate information and the reflected light intensity, wherein the first reflected light intensity information includes the reflected light intensity of the position for different colors of light; A texture image of the target electronic component is generated based on the first reflected light intensity information and the three-dimensional coordinate information.

7. A computer-readable storage medium having a computer program stored thereon, characterized in that, When the computer program is executed, it implements the steps of the method as described in any one of claims 1-6.

8. A computer program product, comprising a computer program, characterized in that, When the computer program is executed by a processor, it implements the steps of the method according to any one of claims 1-6.

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