Metallized film capacitor with embedded heat dissipation layer structure
Through the metallized film capacitor with an embedded heat dissipation layer structure, the metallized film winding layer and the heat dissipation layer are alternately stacked, combined with the heat dissipation tail and the heat dissipation pipe, the problem of heat dissipation under high frequency and high power is solved, and the heat dissipation effect is achieved is achieved. It is suitable for high frequency and high power density scenarios.
Patent Information
- Application Number
- CN202510530888.8
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2025-04-25
- Publication Date
- 2025-08-08
AI Technical Summary
The existing metallized film capacitors are difficult to dissipate heat in high-frequency and high-power density scenarios, especially when the heat dissipation channel is blocked under the flattened and winding structure, resulting in an increase in temperature and it is difficult to effectively dissipate heat. The existing external heat dissipation solution is large in size, high in cost and hysteresis response.
The metallized film capacitor adopts an embedded heat dissipation layer structure. By alternately stacking the metallized film winding layer and the heat dissipation layer, the heat conduction layer is in direct contact with the metallized electrode layer, forming a vertical multi-layer short-path heat conduction, combining the heat dissipation tail, the heat dissipation rib plate and the heat dissipation pipe filled with phase change materials to achieve efficient heat dissipation.
Without increasing the volume, efficient heat dissipation effect is achieved, with good temperature stability, which is in line with the trend of miniaturization and high power of electronic equipment, and does not require external power to assist heat dissipation.
Smart Images
Figure CN120453059A_ABST
Abstract
Description
Technical Field
[0001] The present invention relates to the field of capacitor technology, and more specifically to a metallized film capacitor with an embedded heat dissipation layer structure, which is suitable for heat dissipation optimization in high-frequency and high-power density scenarios. Background Art
[0002] Metallized film capacitors, with their high specific capacitance, low loss, good self-healing properties, and stable electrical performance, are widely used in power electronics conversion, renewable energy generation, high-frequency communications, industrial control, and other fields. As electronic equipment develops toward high power density, high frequency, and miniaturization, the heat generated by metallized film capacitors during operation due to dielectric loss, equivalent series resistance loss, and other factors has increased significantly. Especially under high-frequency operating conditions or pulse power scenarios, the internal temperature of the capacitor core can quickly rise to over 80°C. Furthermore, the gaps in the core disappear after being flattened, and adjacent metallized films fit tightly together, further increasing the difficulty of heat dissipation. Existing technologies, such as external heat sinks or forced air cooling solutions, suffer from increased size, high cost, and delayed response. Summary of the Invention
[0003] In order to solve the problems in the prior art, the present invention provides a metallized film capacitor with an embedded heat dissipation layer structure. The specific technical solution is as follows:
[0004] Metallized film capacitor with embedded heat dissipation layer structure, including:
[0005] shell;
[0006] and a core body mounted in the housing, the core body comprising alternately stacked metallized film winding layers and heat dissipation layers;
[0007] The heat dissipation layer includes a heat conductive layer and a heat dissipation tail, wherein the heat conductive layer is sandwiched between adjacent metallized film winding layers, and the heat dissipation tail extends to the outside of the core tail;
[0008] The tail portion of the shell is provided with a heat dissipation structure matched with the heat dissipation tail portion.
[0009] As a further technical solution of the present invention, the end surface of the metallized film winding layer facing the heat dissipation layer has a metallized electrode layer, which is formed by magnetron sputtering or vacuum evaporation process, and the thermal conductive layer is in direct contact with the metallized electrode layer.
[0010] As a further technical solution of the present invention, the heat-conducting layer and the heat-dissipating tail of the heat-dissipating layer are made of an integrally formed heat-conducting insulating material, and the heat-conducting insulating material is a graphene composite material or aluminum nitride ceramic.
[0011] As a further technical solution of the present invention, the heat dissipation structure of the tail of the shell includes several heat dissipation ribs protruding inward, and a heat dissipation channel is formed between the several heat dissipation ribs. The heat dissipation tail is inserted into the heat dissipation channel and fully fits with the heat dissipation ribs.
[0012] As a further technical solution of the present invention, a plurality of heat dissipation pipes are further provided at the rear of the housing, one end of each heat dissipation pipe is inserted into the heat dissipation rib, and the other end extends to the outside of the housing;
[0013] The heat radiating pipe is filled with a heat absorbing medium.
[0014] As a further technical solution of the present invention, the heat absorption medium is liquid metal or phase change material, the liquid metal includes gallium-based alloy, and the phase change material includes paraffin or fatty acid ester.
[0015] As a further technical solution of the present invention, the heat dissipation pipe is made of copper or aluminum, and a spiral guide groove is provided in the heat dissipation pipe.
[0016] Compared with the prior art, the present invention has the following beneficial effects:
[0017] In this application, a core structure in which metallized film winding layers and heat dissipation layers are alternately stacked is adopted. Through direct contact between the heat conductive layer and the metallized electrode layer, the lateral heat conduction path of the traditional capacitor is innovated into a vertical multi-layer short-path heat conduction, which effectively solves the problem of blocked heat dissipation channels under the flattened winding structure; and through the integrated design of the stacked heat dissipation layer and the core, efficient heat dissipation is achieved without increasing the volume, which is in line with the trend of miniaturization and high power of electronic equipment.
[0018] The heat dissipation layer has the dual functions of a thermal conductive layer and a heat dissipation tail, forming an "inside-out" heat dissipation channel to achieve step-by-step conduction and rapid release of heat. At the same time, heat dissipation ribs and heat pipes filled with phase change material / liquid metal are set at the heat dissipation tail to cooperate in forming passive heat dissipation without the need for external power. BRIEF DESCRIPTION OF THE DRAWINGS
[0019] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the following briefly introduces the drawings required for use in the embodiments or the description of the prior art. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative work.
[0020] Figure 1 Shows the overall structure of a metallized film capacitor with an embedded heat dissipation layer structure;
[0021] Figure 2 A structural diagram showing the overall structural diagram of the core;
[0022] Figure 3 shows a schematic diagram of the internal structure of the core;
[0023] Figure 4 A schematic structural diagram of the housing is shown.
[0024] Description of the drawings: 100, outer shell; 110, heat dissipation ribs; 120, heat dissipation channel; 130, heat dissipation pipe; 200, core; 210, metallized film winding layer; 220, heat dissipation layer; 221, heat conductive layer; 222, heat dissipation tail; 230, pin. DETAILED DESCRIPTION
[0025] The following will clearly and completely describe the technical solutions in the embodiments of the present invention in conjunction with the accompanying drawings. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of the present invention.
[0026] Figure 1 Shows the overall structure of a metallized film capacitor with an embedded heat dissipation layer structure; Figure 1 In the embodiment, the metallized film capacitor with an embedded heat dissipation layer structure includes a housing 100 and a core 200 installed in the housing 100 .
[0027] Figure 2 A structural diagram showing the overall structural diagram of the core 200; Figure 2 In the figure, the core 200 has two pins 230 at the head, and the two metallized film winding layers 210 both penetrate the shell 100 and extend to the outside; in actual use, the two metallized film winding layers 210 connected to the core 200 are used as positive and negative electrodes respectively, and are used to form a complete circuit with external electrical appliances. Specifically, the positive electrodes are connected to the positive electrodes, and the negative electrodes are connected to the negative electrodes. At this time, the current can flow from the positive electrode through the electrical appliances and then return to the negative electrode to form power supply.
[0028] Figure 3 shows a schematic diagram of the internal structure of the core 200; Figure 3In the embodiment, the core 200 includes alternately stacked metallized film winding layers 210 and heat dissipation layers 220; the conventional winding structure of the single-layer metallized film winding layer 210 is changed, and the core 200 is set to a double-layer winding structure, but it should be noted that the manufacturing steps are not changed, that is, it is still formed by winding and flattening; the heat dissipation layer 220 includes a heat conductive layer 221 and a heat dissipation tail 222, the heat conductive layer 221 is wound in the core 200 and is used to absorb the heat generated by the metallized film winding layer 210, and the heat dissipation tail 222 extends and is exposed at the tail of the heat dissipation layer 220 and is used to dissipate the heat conductive layer 221 that is, the heat dissipation layer 220 is only partially wound in the core 200 to cooperate with the metallized film winding layer 210, and the other part is exposed at the tail of the core 200, which is more conducive to the dissipation of the absorbed heat, that is, the heat is absorbed by the thermal conductive layer 221 of the heat dissipation layer 220 and then conducted to the heat dissipation tail 222, and then the heat dissipation tail 222 is used to dissipate the heat to the outside, so that the temperature of the core 200 is maintained in a stable range during operation, and the core 200 is still tight and gapless during operation, and the structural stability of the core 200 can still be guaranteed.
[0029] It should be noted that the heat-conducting insulating material used in the heat dissipation layer 220 is a graphene composite material or aluminum nitride ceramic.
[0030] Continue to see Figure 3 , a metallized electrode layer is evaporated on the end surface of the metallized film winding layer 210 facing the heat dissipation layer 220, and the heat dissipation layer 220 has insulating thermal conductivity; after winding, the two end surfaces of each group of heat-conducting layers 221 are closely attached to the metallized film winding layer 210, and the two metallized film winding layers 210 adjacent to the heat dissipation layer 220 are both evaporated with a metallized electrode layer on their end surfaces facing it, that is, the metallized electrode layer and the heat dissipation layer 220 surface are attached and in close contact. When power is turned on and heat is generated, the metallized electrode layer can directly conduct heat to the heat dissipation layer 220, so that the heat conduction path is shortened, so that the heat can be dissipated to the outside as soon as it is generated, avoiding internal heat accumulation, which is beneficial to stabilizing the internal temperature of the core 200 within a certain range. At the same time, the insulating properties of the heat dissipation layer 220 can block the electrical path between the two adjacent metallized film winding layers 210 to avoid short circuit.
[0031] That is, along the thickness direction, the interlayer distribution of the core 200 is a first group of metallized film winding layers 210, a metallized electrode layer on the surface of the first group of metallized film winding layers 210, a heat dissipation layer 220, a metallized electrode layer on the surface of the second group of metallized film winding layers 210, and a second group of metallized film winding layers 210. Both end surfaces of the heat dissipation layer 220 are directly in contact with the metallized electrode layer, greatly shortening the heat conduction path.
[0032] Figure 4 shows a schematic structural diagram of the housing 100; Figure 4 In the figure, the tail of the shell 100 has a plurality of heat dissipation ribs 110 protruding inward, and the plurality of heat dissipation ribs 110 are distributed radially to form a heat dissipation channel 120. In the installed state, the heat dissipation tail 222 of the core 200 is inserted into the heat dissipation channel 120 and fully fits the heat dissipation ribs 110; when the core 200 is installed into the shell 100, the heat dissipation tail 222 protruding from the tail of the core 200 can be inserted into the heat dissipation channel 120, so that the surface of the heat dissipation tail 222 is fully fit with the heat dissipation ribs 110, and the heat dissipation ribs 110 are used to dissipate heat to the outside through the tail of the shell 100, thereby preventing the heat dissipation tail 222 of the heat dissipation layer 220 from being too high in temperature.
[0033] Continue to see Figure 4 , a plurality of heat dissipation pipes 130 are vertically arranged at the tail of the shell 100, and the plurality of heat dissipation pipes 130 are distributed along the trajectory of the heat dissipation ribs 110. One end of the heat dissipation pipe 130 is inserted into the heat dissipation ribs 110, and the other end of the heat dissipation pipe 130 is extended and exposed at the tail of the shell 100. Heat-absorbing medium is injected into the heat dissipation pipe 130; one end of the heat dissipation pipe 130 inserted into the heat dissipation ribs 110 serves as the hot end, and the other end of the heat dissipation pipe 130 exposed at the tail of the shell 100 serves as the cold end. During operation, as the temperature of the heat dissipation ribs 110 rises, the heat-absorbing medium in the hot end of the heat dissipation pipe 130 dissipates the heat in the heat dissipation ribs 110 and reduces the temperature of the heat dissipation ribs 110. At this time, the temperature of the heat-absorbing medium at the hot end of the heat dissipation pipe 130 rises, that is, there is a temperature difference between the hot end and the cold end. At this time, driven by the temperature difference, the heat-absorbing medium can flow by itself in the heat dissipation pipe 130. The heat-absorbing medium at the cold end has a high density and sinks, while the heat-absorbing medium at the hot end has a low density and floats, so that the heat-absorbing medium circulates between the cold end and the hot end. After entering the cold end, the heat-absorbing medium at the hot end can quickly dissipate heat and cool down. This reciprocating process can continuously absorb heat from the heat dissipation ribs 110, which is beneficial to the temperature stability of the core 200 during long-term continuous operation. The heat dissipation pipe 130 is made of copper or aluminum, and a spiral guide groove is provided in the heat dissipation pipe 130. The spiral groove destroys the laminar flow state of the heat-absorbing medium, changes the flow path from a straight line to a spiral trajectory, forms local turbulence, and the centrifugal force generated by the spiral groove forces the medium to move toward the outer wall, forming a double vortex structure, thereby extending the contact time.
[0034] It should be noted that the heat absorbing medium is liquid metal or phase change material, the liquid metal includes gallium-based alloy, and the phase change material includes paraffin or fatty acid ester.
[0035] In summary, when the core 200 is working, the metallized film winding layer 210 generates heat and conducts the heat to the heat-conducting layer 221 of the heat dissipation layer 220 through the metallized electrode layer. Due to the high thermal conductivity of the heat dissipation layer 220, it can conduct the heat of the heat-conducting layer 221 to the heat dissipation tail 222, and then conduct it to the heat dissipation rib 110 that is fully fitted with it through the heat dissipation tail 222. At this time, part of the heat in the heat dissipation rib 110 is dissipated through heat exchange between the tail of the shell 100 and the outside, and the other part of the heat is absorbed by the heat-absorbing medium in the hot end of the heat dissipation pipe 130. After absorbing heat, the heat-absorbing medium at the hot end increases in temperature and decreases in density, and floats to the cold end of the heat dissipation pipe 130 for dissipation. At the same time, the low-temperature heat-absorbing medium at the cold end of the heat dissipation pipe 130 is squeezed toward the hot end to continue absorbing heat, and the heat in the heat dissipation rib 110 is conducted back and forth in this way.
[0036] It will be apparent to those skilled in the art that the present invention is not limited to the details of the exemplary embodiments described above and that the invention can be embodied in other specific forms without departing from the spirit or essential characteristics of the invention. Therefore, the embodiments should be considered in all respects as illustrative and non-restrictive, and the scope of the invention is defined by the appended claims, not the foregoing description, and all variations within the meaning and range of equivalents of the claims are intended to be included therein. Any reference sign in a claim should not be construed as limiting the claim to which it relates.
Claims
1. A metallized film capacitor with an embedded heat dissipation layer structure, characterized in that: include: Housing (100); and a core (200) installed in the housing (100), wherein the core (200) comprises alternately stacked metallized film winding layers (210) and heat dissipation layers (220); The heat dissipation layer (220) comprises a heat-conducting layer (221) and a heat-dissipating tail (222), wherein the heat-conducting layer (221) is sandwiched between adjacent metalized film winding layers (210), and the heat-dissipating tail (222) extends to the outside of the tail of the core (200); The tail portion of the housing (100) is provided with a heat dissipation structure that cooperates with the heat dissipation tail portion (222).
2. The metallized film capacitor with an embedded heat dissipation layer structure according to claim 1, characterized in that: The end surface of the metallized film winding layer (210) facing the heat dissipation layer (220) has a metallized electrode layer, the metallized electrode layer is formed by magnetron sputtering or vacuum evaporation process, and the heat conductive layer (221) is in direct contact with the metallized electrode layer.
3. The metallized film capacitor with an embedded heat dissipation layer structure according to claim 1, characterized in that: The heat conducting layer (221) and the heat dissipating tail (222) of the heat dissipating layer (220) are made of an integrally formed heat conducting insulating material, and the heat conducting insulating material is a graphene composite material or aluminum nitride ceramic.
4. The metallized film capacitor with an embedded heat dissipation layer structure according to claim 2, characterized in that: The heat dissipation structure at the tail of the housing (100) includes a plurality of heat dissipation ribs (110) protruding inwardly, a heat dissipation channel (120) is formed between the plurality of heat dissipation ribs (110), and the heat dissipation tail (222) is inserted into the heat dissipation channel (120) and fully fits with the heat dissipation ribs (110).
5. The metallized film capacitor with an embedded heat dissipation layer structure according to claim 4, characterized in that: A plurality of heat dissipation pipes (130) are further provided at the rear of the housing (100), one end of the heat dissipation pipe (130) being inserted into the heat dissipation rib (110) and the other end extending to the outside of the housing; The heat dissipation pipe (130) is filled with a heat absorbing medium.
6. The metallized film capacitor with an embedded heat dissipation layer structure according to claim 5, characterized in that: The heat absorption medium is liquid metal or phase change material, the liquid metal includes gallium-based alloy, and the phase change material includes paraffin or fatty acid ester.
7. The metallized film capacitor with an embedded heat dissipation layer structure according to claim 6, characterized in that: The heat dissipation pipe (130) is made of copper or aluminum, and a spiral guide groove is provided in the heat dissipation pipe (130).