Electronic component
By introducing a different material layer and a compressive stress introduction layer into the electronic components, the problems of electrostrictive cracks and stress increase are solved, and the stability and crack resistance under high temperature loads are achieved.
Patent Information
- Application Number
- CN202411981810.X
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Priority Date
- 2024-02-08
- Filing Date
- 2024-12-31
- Publication Date
- 2025-08-08
AI Technical Summary
When the conventional electronic components apply voltage, cracks occur in the corners of the internal electrode due to electrostriction, and stress increases, and deterioration problems occur under high temperature loads.
A layer of different material is introduced into the electronic component so that its linear expansion coefficient is greater than that of the element, and a cut-out is provided at the corners of the internal electrodes that do not overlap. Compression stress is introduced through the compression stress introduction layer to alleviate the stress stress on the internal electrodes and suppress electrostrictive cracks.
Effectively suppress the generation of electrostrictive cracks, relieve the stress of the corners of the internal electrodes, and maintain the stability of electronic components under high temperature loads to avoid high temperature deterioration.
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Figure CN120453060A_ABST
Abstract
Description
Technical Field
[0001] The present disclosure relates to electronic components. Background Art
[0002] There is known an electronic component including an element body having a pair of end faces facing each other, a pair of terminal electrodes arranged on the pair of end faces, and internal electrodes connected to the terminal electrodes (see, for example, Japanese Patent Application Laid-Open No. 2000-124064). Summary of the Invention
[0003] In electronic components like these, when voltage is applied, the area where the internal electrodes overlap causes volume changes due to electrostriction, sometimes leading to cracks in the side gaps. To suppress these electrostrictive cracks, one approach is to increase the volume of the internal electrodes. However, increasing the volume by thinning or multiplying the dielectric layers leads to degradation under high-temperature loads. Furthermore, addressing cracks caused by electrostriction can increase stress at the corners of the internal electrodes.
[0004] Therefore, an object of the present disclosure is to provide an electronic component that can suppress electrostrictive cracks and alleviate stress at corners of internal electrodes.
[0005] An electronic component comprises: a body having a pair of end faces opposite to each other in a first direction; a first terminal electrode arranged on the end face on one side of the first direction; a second terminal electrode arranged on the end face on the other side of the first direction; a first internal electrode arranged in the body and connected to the first terminal electrode; a second internal electrode arranged in the body and connected to the second terminal electrode; a heterogeneous material layer arranged in the body and composed of a material different from that of the body, the first internal electrode and the second internal electrode being opposite to each other in a second direction orthogonal to the first direction via the heterogeneous material layer, the heterogeneous material layer having a linear expansion coefficient greater than that of the body, the first internal electrode and the second internal electrode including a corner portion located in the body, and the heterogeneous material layer not overlapping with the corner portion when viewed from the second direction.
[0006] In this electronic component, a first internal electrode and a second internal electrode are opposed in the second direction via a dissimilar material layer composed of a different material from that of the element body. By overlaying the dissimilar material layer in addition to the internal electrodes, the volume of the component having a larger linear expansion coefficient than the element body is increased. This allows compressive stress to be introduced into the side gaps between the internal electrodes and the side surfaces of the element body. Consequently, even when electrostrictive vibrations occur when a voltage is applied, the occurrence of electrostrictive cracks can be suppressed by reducing the tensile stress in the central portion of the side gaps in the second direction. Furthermore, unlike thinner and multilayered dielectric layers, this can suppress degradation under high-temperature loads while also suppressing electrostrictive cracks. Here, the dissimilar material layer does not overlap with the corners of the internal electrodes when viewed from the second direction. Therefore, stress at the corners of the outermost internal electrode can be mitigated. As described above, electrostrictive cracks can be suppressed while also mitigating stress at the corners of the internal electrodes.
[0007] The element body may be made of a ceramic material, and the different material layer may be a metal layer. In this case, the linear expansion coefficient of the different material layer can be made higher than that of the element body.
[0008] In the region where the first and second internal electrodes overlap in the second direction, when the dimension in a third direction perpendicular to the first and second directions is represented by W, the dimension in the third direction of the region at the corner portion that does not overlap with the dissimilar material layer may be greater than or equal to W / 10 and less than or equal to W / 3. In this case, the width of the region at the corner portion that does not overlap with the dissimilar material layer can be sufficiently ensured, and by preventing this region from becoming excessively wide, sufficient compressive stress can be introduced into the side gap portion.
[0009] In the region where the first and second internal electrodes overlap in the second direction, when the dimension in the first direction is L, the dimension in the first direction of the region at the corner portion that does not overlap with the dissimilar material layer may be greater than L / 10 and less than L / 3. In this case, the width of the region at the corner portion that does not overlap with the dissimilar material layer can be sufficiently ensured, and by preventing this region from becoming too wide, sufficient compressive stress can be introduced into the side gap portion.
[0010] The dissimilar material layer may include a cutout portion at a position corresponding to the corner portion, and the cutout portion may be shaped to move away from the corner portion toward the inner circumference when viewed from the second direction. This can increase the distance between the corner portion of the internal electrode and the edge of the cutout portion of the dissimilar material layer, thereby alleviating stress at the corner portion of the internal electrode.
[0011] The different material layer may have a cutout portion at a position corresponding to the corner portion, and the cutout portion may have a curved portion that describes a curve when viewed from the second direction. In this case, concentration of the electric field in the cutout portion can be suppressed.
[0012] The curved portion may be curved away from the corner toward the inner circumference when viewed from the second direction. In this case, the distance between the corner of the internal electrode and the edge of the cutout of the dissimilar material layer can be increased, thereby alleviating stress at the corner of the internal electrode.
[0013] The corner portion may have a shape that protrudes toward the outer periphery. In this case, it is possible to suppress the concentration of the electric field at the corner portion.
[0014] The thickness of the different material layer may be greater than the thickness of the first internal electrode and the second internal electrode. In this case, the breakdown voltage can be increased by increasing the thickness of the different material layer.
[0015] The thickness of the different material layer may be 1.3 times or more the thickness of the first internal electrode and the second internal electrode. In this case, the breakdown voltage can be increased by sufficiently increasing the thickness of the different material layer.
[0016] The edge portion of the different material on the outer peripheral side may be thicker than the inner peripheral area. In this case, by thinning the inner peripheral area, it is possible to suppress bulging of the element body.
[0017] The thickness of the edge portion may be 1.3 times or more the thickness of the inner peripheral region. In this case, by sufficiently reducing the thickness of the inner peripheral region, bulging of the element body can be suppressed.
[0018] It is possible that, when a direction perpendicular to the first and second directions is defined as a third direction, the width of the dissimilar material layer in at least one of the first and third directions is smaller than that of the first and second internal electrodes, and the dissimilar material layer is positioned toward an end portion of the first and second internal electrodes in one direction when viewed in the second direction. In this case, since the internal electrodes do not overlap with the dissimilar material layer near their centers, bulging of the element body can be suppressed.
[0019] An electronic component comprises: a body having a pair of end faces opposing each other in a first direction; a first terminal electrode arranged on the end face on one side of the first direction; a second terminal electrode arranged on the end face on the other side of the first direction; a first internal electrode arranged in the body and connected to the first terminal electrode; a second internal electrode arranged in the body and connected to the second terminal electrode; a compressive stress introduction layer arranged in the body and introducing compressive stress into the body, the first internal electrode and the second internal electrode opposing each other in a second direction perpendicular to the first direction via the compressive stress introduction layer, the compressive stress introduction layer introducing compressive stress into a side gap portion between the first internal electrode and the second internal electrode and a side face of the body in a third direction perpendicular to the first and second directions, the first internal electrode and the second internal electrode including a corner portion located in the body, and the compressive stress introduction layer does not overlap with the corner portion when viewed from the second direction.
[0020] In this electronic component, a first internal electrode and a second internal electrode are opposed in the second direction via a compressive stress-introducing layer that introduces compressive stress into the element body. The stress-introducing layer can introduce compressive stress in the third direction into the side gaps between the first and second internal electrodes and the side surfaces of the element body. Thus, even when electrostrictive vibrations occur when a voltage is applied, the occurrence of electrostrictive cracks can be suppressed by reducing the tensile stress in the central portion of the side gaps in the second direction. Furthermore, unlike thin-layer and multi-layer dielectric layers, electrostrictive cracks can be suppressed while suppressing degradation under high-temperature loads. Here, the compressive stress-introducing layer does not overlap with the corners of the internal electrodes when viewed from the second direction. Therefore, stress at the corners of the outermost internal electrode can be mitigated. As described above, electrostrictive cracks can be suppressed, and stress at the corners of the internal electrodes can be mitigated.
[0021] According to the present disclosure, it is possible to provide an electronic component that can suppress electrostrictive cracks and alleviate stress at corners of internal electrodes. BRIEF DESCRIPTION OF THE DRAWINGS
[0022] Figure 1 This is a perspective view showing an electronic component according to one embodiment of the present disclosure.
[0023] Figure 2 It is along Figure 1 The cross-sectional view along the II-II line is shown.
[0024] Figure 3 It is along Figure 1 A cross-sectional view taken along line III-III is shown.
[0025] Figure 4 This is a cross-sectional view of the first inner electrode as viewed from the second direction.
[0026] Figure 5 This is a cross-sectional view of the intermediate layer viewed from the second direction.
[0027] Figure 6 It is a conceptual diagram showing the specific structure of the cutout portion.
[0028] Figure 7 It is a conceptual diagram showing the specific structure of the cutout portion.
[0029] Figure 8 It is a conceptual diagram showing the specific structure of the cutout portion.
[0030] Figure 9 It is a conceptual diagram showing the specific structure of the cutout portion.
[0031] Figure 10 It is a conceptual diagram showing the specific structure of the cutout portion.
[0032] Figure 11 It is a conceptual diagram showing the specific structure of the cutout portion.
[0033] Figure 12 2 is a cross-sectional view showing an electronic component according to a modified example.
[0034] Figure 13 2 is a cross-sectional view showing an electronic component according to a modified example.
[0035] Figure 14 2 is a cross-sectional view showing an electronic component according to a modified example.
[0036] Figure 15 2 is a cross-sectional view showing an electronic component according to a modified example.
[0037] Figure 16 It is a graph showing the experimental results.
[0038] Figure 17 is a table showing the experimental results.
[0039] Figure 18 It is a graph showing the experimental results.
[0040] Figure 19 It is a graph showing the experimental results. DETAILED DESCRIPTION
[0041] Hereinafter, embodiments of the present disclosure will be described in detail with reference to the accompanying drawings. In the following description, the same elements or elements having the same functions will be denoted by the same reference numerals, and repeated descriptions will be omitted.
[0042] Reference Figures 1 to 5 The structure of the electronic component according to this embodiment will be described. Figure 1 It is a perspective view showing the electronic component according to this embodiment. Figure 2 and Figure 3 A diagram illustrating the cross-sectional structure of the multilayer capacitor according to this embodiment. Figure 4 This is a cross-sectional view of the first inner electrode 11 as viewed from the second direction D2. Figure 5 This is a cross-sectional view of the intermediate layer 20 as viewed from the second direction D2. In this embodiment, a multilayer capacitor C1 is described as an example of an electronic component.
[0043] like Figure 1 As shown, the multilayer capacitor C1 includes a rectangular parallelepiped element body 2, and a first terminal electrode 5 and a second terminal electrode 7 arranged on the outer surface of the element body 2. The first terminal electrode 5 is separated from the second terminal electrode 7. The rectangular parallelepiped shape includes a rectangular parallelepiped shape with chamfered corners and edges, and a rectangular parallelepiped shape with rounded corners and edges.
[0044] The element body 2 has, as its outer surfaces, a pair of opposing end faces 2a and 2b, a pair of opposing principal faces 2c and 2d, and a pair of opposing side faces 2e and 2f. In this embodiment, the direction in which the pair of end faces 2a and 2b oppose each other (a first direction D1) corresponds to the length direction of the element body 2, the direction in which the pair of principal faces 2c and 2d oppose each other (a second direction D2) corresponds to the height direction of the element body 2, and the direction in which the pair of side faces 2e and 2f oppose each other (a third direction D3) corresponds to the width direction of the element body 2.
[0045] The length of the element body 2 in the first direction D1 is greater than the length of the element body 2 in the second direction D2 and the length of the element body 2 in the third direction D3. The length of the element body 2 in the second direction D2 and the length of the element body 2 in the third direction D3 are equal. That is, in this embodiment, the pair of end faces 2a and 2b are square, and the pair of main faces 2c and 2d and the pair of side faces 2e and 2f are rectangular. The length of the element body 2 in the first direction D1 may be equal to the length of the element body 2 in the second direction D2 and the length of the element body 2 in the third direction D3. The length of the element body 2 in the second direction D2 and the length of the element body 2 in the third direction D3 may also be different.
[0046] Equal includes not only being identical but also including slight differences within a predetermined range or manufacturing errors. For example, if multiple values are within ±5% of their average, the values are considered equal.
[0047] The pair of main surfaces 2c and 2d extend in the first direction D1 to connect the pair of end surfaces 2a and 2b. The pair of main surfaces 2c and 2d also extend in the third direction D3. The pair of side surfaces 2e and 2f extend in the first direction D1 to connect the pair of end surfaces 2a and 2b. The pair of side surfaces 2e and 2f also extend in the second direction D2.
[0048] The element body 2 is constructed by stacking a plurality of dielectric layers 51 in a direction (second direction D2) with a pair of principal surfaces 2c and 2d facing each other. In the element body 2, the stacking direction of the plurality of dielectric layers 51 (hereinafter referred to as the "stacking direction") coincides with the second direction D2. Each dielectric layer 51 is formed, for example, from a sintered body of a ceramic green sheet containing a dielectric material (e.g., a dielectric ceramic such as a BaTiO3-based, Ba(Ti, Zr)O3-based, or (Ba, Ca)TiO3-based material). In the actual element body 2, the dielectric layers 51 are integrated to such an extent that the boundaries between the dielectric layers 51 are indistinguishable. The third direction D3 may also be the aforementioned stacking direction.
[0049] like Figure 2 、 Figure 3 、 Figure 4 As shown, multilayer capacitor C1 includes a plurality of first internal electrodes 11 and a plurality of second internal electrodes 13. Internal electrodes 11, 13 are made of a conductive material commonly used as an internal conductor in multilayer electronic components (e.g., Ni, Cu, Ag, Pt, etc.). Internal electrodes 11, 13 are formed as a sintered body of a conductive paste containing the aforementioned conductive material. Internal electrodes 11, 13 function as internal conductors within element body 2.
[0050] The first internal electrodes 11 and the second internal electrodes 13 are arranged at different positions (layers) in the second direction D2. That is, the first internal electrodes 11 and the second internal electrodes 13 are alternately arranged within the element body 2 so as to face each other with a gap therebetween in the second direction D2 (via the intermediate layer 20 described later). The first internal electrodes 11 and the second internal electrodes 13 have different polarities.
[0051] Also like Figure 4 As shown, each first inner electrode 11 includes a main electrode portion 11A and a connecting portion 11B. The main electrode portion 11A forms an electrostatic capacitor by being opposed to the main electrode portion 13A of the second inner electrode 13 described later. The connecting portion 11B connects the main electrode portion 11A to the first terminal electrode 5. The connecting portion 11B extends from one side (a short side) of the main electrode portion 11A and is exposed at the end face 2a. The first inner electrode 11 is exposed at the end face 2a and is not exposed at the end face 2b, the pair of main faces 2c and 2d, and the pair of side faces 2e and 2f. The main electrode portion 11A and the connecting portion 11B are formed integrally.
[0052] like Figure 4As shown, the main electrode portion 11A has a rectangular shape with its longitudinal direction in the first direction D1 and its transverse direction in the third direction D3. That is, in each first inner electrode 11, the length of the main electrode portion 11A in the first direction D1 is greater than its length in the third direction D3. The connecting portion 11B extends from the end portion of the main electrode portion 11A on the end face 2a side to the end face 2a. The length of the connecting portion 11B in the first direction D1 is less than the length of the main electrode portion 11A in the first direction D1. The length of the connecting portion 11B in the third direction D3 is equal to the length of the main electrode portion 11A in the third direction D3. The connecting portion 11B is connected to the first terminal electrode 5 at the end portion exposed at the end face 2a. The length of the connecting portion 11B in the third direction D3 may also be less than the length of the main electrode portion 11A in the third direction D3.
[0053] Also like Figure 4 As shown, each second inner electrode 13 includes a main electrode portion 13A and a connecting portion 13B. The main electrode portion 13A is a portion that forms an electrostatic capacitor by being opposed to the main electrode portion 11A of the first inner electrode 11 described later. The connecting portion 13B is a portion that connects the main electrode portion 13A to the second terminal electrode 7. The main electrode portion 13A is opposed to the main electrode portion 11A via a portion (dielectric layer) of the element body 2 in the second direction D2. The connecting portion 13B extends from one side (a short side) of the main electrode portion 13A and is exposed at the end face 2b. The second inner electrode 13 is exposed at the end face 2b and is not exposed at the end face 2a, a pair of main faces 2c, 2d, and a pair of side faces 2e, 2f. The main electrode portion 13A and the connecting portion 13B are formed integrally.
[0054] like Figure 4 As shown, the main electrode portion 13A has a rectangular shape with its longitudinal direction in the first direction D1 and its transverse direction in the third direction D3. That is, in each second inner electrode 13, the length of the main electrode portion 13A in the first direction D1 is greater than its length in the third direction D3. The connecting portion 13B extends from the end portion of the main electrode portion 13A on the end face 2b side to the end face 2b. The length of the connecting portion 13B in the first direction D1 is less than the length of the main electrode portion 13A in the first direction D1. The length of the connecting portion 13B in the third direction D3 is equal to the length of the main electrode portion 13A in the third direction D3. The connecting portion 13B is connected to the second terminal electrode 7 at the end portion exposed at the end face 2b. The length of the connecting portion 13B in the third direction D3 may also be less than the length of the main electrode portion 13A in the third direction D3.
[0055] The first inner electrode 11 has an end 11a extending in the third direction D3 on the second terminal electrode 7 side, an end 11b extending in the first direction D1 on the side face 2e, and an end 11c extending in the first direction D1 on the side face 2f. The second inner electrode 13 has an end 13a extending in the third direction D3 on the first terminal electrode 5 side, an end 13b extending in the first direction D1 on the side face 2e, and an end 13c extending in the first direction D1 on the side face 2f. When viewed in the second direction D2, end 11b overlaps with end 13b, and end 11c overlaps with end 13c. When viewed in the second direction D2, end 11a overlaps with the boundary between the main electrode portion 13A and the connecting portion 13B of the second inner electrode 13. When viewed in the second direction D2, end 13a overlaps with the boundary between the main electrode portion 11A and the connecting portion 11B of the first inner electrode 11. A region E1 where the first inner electrode 11 and the second inner electrode 13 overlap in the second direction D2 is defined by the end portion 11a, the end portion 13a, the end portions 11b and 13b, and the end portions 11c and 13c.
[0056] The first internal electrode 11 and the second internal electrode 13 include corner portions CN located within the element body 2. The first internal electrode 11 has a corner portion CN at the intersection of the end portion 11a and the end portion 11b, and a corner portion CN at the intersection of the end portion 11a and the end portion 11c. Furthermore, if the corner portion CN has a rounded corner or a chamfered portion, the rounded corner or chamfered portion corresponds to the corner portion CN. Each corner portion CN is embedded at a position separated from the inner circumference of each surface of the element body 2.
[0057] When viewed from the first direction D1, the first terminal electrode 5 is located at the end of the element body 2 on the side of the end surface 2a. The first terminal electrode 5 includes an electrode portion 5a located on the end surface 2a, an electrode portion 5b located on the pair of principal surfaces 2c and 2d, and an electrode portion 5c located on the pair of side surfaces 2e and 2f. In other words, the first terminal electrode 5 is formed on the five surfaces 2a, 2c, 2d, 2e, and 2f.
[0058] Adjacent electrode portions 5a, 5b, and 5c are connected and electrically connected to each other at the ridges of element body 2. Electrode portion 5a and electrode portion 5b are connected at the ridges between end face 2a and each of principal faces 2c and 2d. Electrode portion 5a and electrode portion 5c are connected at the ridges between end face 2a and each of side faces 2e and 2f.
[0059] The electrode portion 5a is arranged to completely cover the portion of the connecting portion 11B exposed at the end surface 2a. The connecting portion 11B is directly connected to the first terminal electrode 5. In other words, the connecting portion 11B connects the main electrode portion 11A and the electrode portion 5c. Thus, each first inner electrode 11 is electrically connected to the first terminal electrode 5.
[0060] When viewed from the first direction D1, the second terminal electrode 7 is located at the end portion of the element body 2 on the side of the end surface 2b. The second terminal electrode 7 includes an electrode portion 7a located on the end surface 2b, an electrode portion 7b located on the pair of principal surfaces 2c and 2d, and an electrode portion 7c located on the pair of side surfaces 2e and 2f. In other words, the second terminal electrode 7 is formed on the five surfaces 2b, 2c, 2d, 2e, and 2f.
[0061] Adjacent electrode portions 7a, 7b, and 7c are electrically connected to each other at the ridges of element body 2. Electrode portion 7a and electrode portion 7b are connected at the ridges between end face 2b and each of principal faces 2c and 2d. Electrode portion 7a and electrode portion 7c are connected at the ridges between end face 2b and each of side faces 2e and 2f.
[0062] Electrode portion 7a is arranged to completely cover the portion of each connecting portion 13B exposed at end face 2b, and connecting portion 13B is directly connected to second terminal electrode 7. In other words, connecting portion 13B connects main electrode portion 13A and electrode portion 7c. Thus, each second inner electrode 13 is electrically connected to second terminal electrode 7.
[0063] like Figure 2 and Figure 3 As shown, the multilayer capacitor C1 includes a plurality of intermediate layers 20 disposed within the element body 2. The intermediate layers 20 are disposed at different positions (layers) in the second direction D2 between the first internal electrode 11 and the second internal electrode 13. That is, the intermediate layers 20 are disposed within the element body 2 so as to oppose the first internal electrode 11 and the second internal electrode 13 with a gap therebetween in the second direction D2. The intermediate layers 20 are disposed inwardly in the first direction D1, separated from the first terminal electrode 5 and the second terminal electrode 7, and are not electrically connected. Furthermore, in this embodiment, the intermediate layers 20 are disposed throughout the entire region between the first internal electrode 11 and the second internal electrode 13. However, the intermediate layers 20 may be omitted from some regions.
[0064] The intermediate layer 20 functions as a dissimilar material layer 21 composed of a material different from that of the element body 2. The intermediate layer 20 serving as the dissimilar material layer 21 can be a metal layer. Examples of metal layer materials include Ni, Cu, Ag, Pt, Au, and alloys thereof. The intermediate layer 20 can be made of the same material as the internal electrodes 11 and 13, or a different material. The intermediate layer 20 is formed as a sintered body of a conductive paste containing the aforementioned metal materials.
[0065] The intermediate layer 20 as the different material layer 21 has a linear expansion coefficient greater than that of the element body 2. Specifically, the linear expansion coefficient of the intermediate layer 20 as the different material layer 21 may be greater than that of the element body 2 by 0.5×10 - 6 K-1 More than 2.0×10 -6 K -1 The upper limit of the linear expansion coefficient of the intermediate layer 20 as the different material layer 21 is not particularly limited, but can be set to 30.0×10 -6 K -1 The thickness of the intermediate layer 20 as the dissimilar material layer 21 is greater than the thickness of the internal electrodes 11 and 13. For example, the thickness of the intermediate layer 20 as the dissimilar material layer 21 may be 1.1 times or more, and more preferably 1.3 times or more, greater than the thickness of the internal electrodes 11 and 13. The upper limit of the thickness of the intermediate layer 20 as the dissimilar material layer 21 is not particularly limited and may be 5.0 times or less of the thickness of the internal electrodes 11 and 13. In addition, the thickness of the internal electrodes 11 and 13 may be set to 0.5 to 1.5 μm.
[0066] like Figure 5 As shown, the intermediate layer 20 overlaps at least a portion of the main electrode portion 11A of the first inner electrode 11 as viewed from the second direction. The intermediate layer 20 overlaps at least a portion of the main electrode portion 13A of the second inner electrode 13 as viewed from the second direction.
[0067] The intermediate layer 20 has an end portion 20a extending in the third direction D3 on the second terminal electrode 7 side, an end portion 20d extending in the third direction D3 on the first terminal electrode 5 side, an end portion 20b extending in the first direction D1 on the side surface 2e side, and an end portion 20c extending in the first direction D1 on the side surface 2f side. As viewed in the second direction D2, the end portion 20b overlaps with the end portions 11b and 13b, and the end portion 20c overlaps with the end portions 11c and 13c. As viewed in the second direction D2, the end portion 20a overlaps with the end portion 11a and the boundary between the main electrode portion 13A and the connecting portion 13B of the second inner electrode 13. As viewed in the second direction D2, the end portion 20d overlaps with the end portion 13a and the boundary between the main electrode portion 11A and the connecting portion 11B of the first inner electrode 11. Therefore, as viewed in the second direction, the intermediate layer 20 overlaps at least a portion of the region E1 (the region generating capacitance) where the first and second inner electrodes 11 and 13 overlap in the second direction D2.
[0068] When viewed in the second direction D2, the intermediate layer 20 does not overlap with the corner portions CN of the internal electrodes 11 and 13. That is, when viewed in the second direction D2, the conductor pattern constituting the intermediate layer 20 is absent in the portion of the intermediate layer 20 corresponding to the corner portions CN. Consequently, the corner portions CN and the areas near the corner portions CN of the internal electrodes 11 and 13 do not face the intermediate layer 20 in the second direction D2. When viewed in the second direction D2, the end portions of the portion of the intermediate layer 20 corresponding to the corner portions CN are spaced apart from the inner circumference of the corner portions CN in the first direction and in the inner circumference of the third direction.
[0069] In this embodiment, the intermediate layer 20 has cutouts 25 at positions corresponding to the four corners CN. The cutouts 25 are portions having a shape in which the four corners (and the vicinity of the corners) of the intermediate layer 20 are cut out so that the intermediate layer 20 does not overlap with the corners CN of the internal electrodes 11 and 13. Figure 5 The starting point P1 is set at a position separated from the inner circumference of the corner portion CN in the third direction D3. Figure 5 The cutout portion 25 has an edge 26 extending linearly or concavely toward the inner circumference between the starting points P1 and P2.
[0070] Intermediate layer 20 has cutouts 25 at locations corresponding to the corner between ends 20a and 20b, the corner between ends 20a and 20c, the corner between ends 20d and 20b, and the corner between ends 20d and 20c. The term "cutout 25" refers to a shape and does not limit the method of formation. A pattern formed by patterning a conductor into a desired shape also corresponds to cutout 25. Specific examples of cutout 25 will be described later.
[0071] With the above structure, the intermediate layer 20 functions as a compressive stress introducing layer 22 for introducing compressive stress into the element body 2. The compressive stress introducing layer 22 introduces compressive stress into the side gaps SG between the internal electrodes 11, 13 and the side faces 2e, 2f of the element body 2 in the third direction D3. Figure 3 As shown, the compressive stress introducing layer 22 introduces a compressive stress F1 in the second direction D2 into the side gap portion SG.
[0072] Next, refer to Figures 6 to 8 A specific example of the cutout portion 25 will be described. Figures 6 to 8 2 is a schematic diagram showing the structure near the corner CN when viewed from the second direction D2. Figures 6 to 8 The description of the structure when viewed from the second direction D2 is described. Figures 6 to 8 In FIG. 1 , the portions where the internal electrodes 11 and 13 are present are patterned, the portions where the internal electrodes 11 and 13 overlap are deep patterned, and the portions where the intermediate layer 20 overlaps are shaded. Figures 9 to 11 Same. Figure 6 (a) and (b) show the structure in which the intermediate layer 20 is not overlapped. Figure 6As shown in (a) and (b), the structure near the corner CN between the end 11a and the ends 11b and 13b is shown here. In addition, the corner CN is formed by the R angle between the end 11a and the ends 11b and 13b. The corner CN has a shape that protrudes toward the outer peripheral side. Figure 6 (b) shows a configuration in which a constricted portion 13e is provided on the connecting portion 13B of the second inner electrode 13. The constricted portion 13e is a portion that makes the width of the connecting portion 13B in the third direction D3 narrower than that of the main electrode portion 13A. The constricted portion 13e is located on the inner circumference of the end portion 13b in the third direction.
[0073] Figure 6 The cutout portion 25 shown in (c) has an edge 26 between the starting point P1 and the starting point P2, and the edge 26 is bent at a right angle so as to be concave toward the inner circumference. The edge 26 extends and bends from the starting point P1 in the first direction D1, and extends to the starting point P2 in the third direction D3. The cutout portion 25 has a shape that moves away from the corner portion CN toward the inner circumference. In addition, an R angle is provided at the curved portion of the edge 26. Therefore, the cutout portion 25 has a curved portion 27 that describes a curve when viewed from the second direction D2. In addition, an R angle is also provided at the starting points P1 and P2, forming a curved portion. When viewed from the second direction D2, the curved portion 27 is curved so as to move away from the corner portion CN toward the inner circumference. Figure 6 (d) is relative to Figure 6 The structure of (b) with the tightening portion 13e adopts the same Figure 6 (c) The structure of the cutout portion 25 having the same purpose.
[0074] Figure 7 The notch portion 25 shown in (a) has an edge portion 26 extending linearly and obliquely between a starting point P1 and a starting point P2. No rounded corners are provided at the starting points P1 and P2. Figure 7 (b) is relative to Figure 6 The structure of (b) with the tightening portion 13e adopts the same Figure 7 (a) The structure of the cutout portion 25 has the same meaning as (a). Figure 7 The cutout portion 25 shown in (c) is relative to Figure 7 The notch portion 25 shown in (a) is formed into a curved portion by providing R angles at the starting points P1 and P2. Figure 7 (d) is relative to Figure 6 The structure of (b) with the tightening portion 13e adopts the same Figure 7 (c) The structure of the cutout portion 25 having the same purpose.
[0075] Figure 8The cutout portion 25 shown in (a) has an edge 26 between the starting point P1 and the starting point P2, and the edge 26 extends in a manner concave toward the inner circumference. The edge 26 extends and bends obliquely from the starting point P1 toward the first direction D1, and extends obliquely toward the third direction D3 to the starting point P2. The cutout portion 25 has a shape that moves away from the corner portion CN toward the inner circumference. In addition, an R angle is provided at the curved portion of the edge 26. Therefore, the cutout portion 25 has a curved portion 27 that describes a curve when viewed from the second direction D2. In addition, an R angle is also provided at the starting points P1 and P2, forming a curved portion. When viewed from the second direction D2, the curved portion 27 is curved in a manner that moves away from the corner portion CN toward the inner circumference. Figure 8 (b) relative to Figure 6 The structure of (b) with the tightening portion 13e adopts the same Figure 8 (a) The structure of the cutout portion 25 has the same meaning as (a).
[0076] Figure 8 The cutout portion 25 shown in (c) has an edge 26 between starting points P1 and P2. This edge 26 is bent at a right angle, concave inwardly. The edge 26 extends and curves from starting point P1 in the first direction D1, then extends in the third direction D3 to starting point P2. The cutout portion 25 is shaped away from the corner CN and away from the inner circumference. Furthermore, no rounded corners are provided at the curved portion of the edge 26. Furthermore, no rounded corners are provided at starting points P1 or P2. Figure 8 (d) is relative to Figure 6 The structure of (b) with the tightening portion 13e adopts the same Figure 8 (c) The structure of the cutout portion 25 having the same purpose.
[0077] Reference Figure 9 The size of the cutout portion 25 will be described. Figure 9 (a) is a schematic diagram showing a structure in which the cutout portion 25 is minimized in size. Figure 9 (b) is a schematic diagram showing the structure when the cutout portion 25 is set to the maximum size. Figure 7 The shape of the cutout portion 25 corresponds to (a), but the same size relationship also applies to other shapes. In the region E1 where the first internal electrode 11 and the second internal electrode 13 overlap in the second direction D2, the dimension in the third direction D3 is W. In the overlapping region E1, the dimension in the first direction D1 is L. Figure 9 As shown in (a), the minimum size of the cutout portion 25 in the third direction D3 is W / 10, and the minimum size in the first direction D1 is L / 10. Figure 9 As shown in (b), the maximum size of the cutout portion 25 in the third direction D3 is W / 3, and the maximum size in the first direction D1 is L / 3.
[0078] As described above, the dimension of the region E2 at the corner CN that does not overlap with the intermediate layer 20 in the third direction D3 is greater than or equal to W / 10 and less than or equal to W / 3. That is, the dimension of the cutout 25 in the third direction D3 is greater than or equal to W / 10 and less than or equal to W / 3. Furthermore, the dimension of the region E2 at the corner CN that does not overlap with the intermediate layer 20 in the first direction D1 is greater than or equal to L / 10 and less than or equal to L / 3. That is, the dimension of the cutout 25 in the first direction D1 is greater than or equal to L / 10 and less than or equal to L / 3.
[0079] Next, the operation and effects of the multilayer capacitor C1 (electronic component) according to this embodiment will be described.
[0080] In the multilayer capacitor C1, the first internal electrode 11 and the second internal electrode 13 are opposed to each other in the second direction D2 via a dissimilar material layer 21 made of a material different from that of the element body 2. By stacking the dissimilar material layer 21 in addition to the internal electrodes 11 and 13, the volume of a component having a larger linear expansion coefficient than that of the element body 2 is increased, thereby introducing a compressive stress F1 (see FIG. 1 ) into the side gap SG between the internal electrodes 11 and 13 and the side faces 2e and 2f of the element body 2. Figure 3 Thus, even if electrostrictive vibration occurs when voltage is applied, the tensile stress F2 of the central portion in the second direction D2 of the side gap portion SG is reduced (see Figure 3 ), it is also possible to suppress the generation of electrostrictive cracks. In addition, the dielectric layer 51 (see Figure 2 、 3 ) is different from the multi-layer thin layer, which can suppress degradation under high-temperature loads while also suppressing electrostrictive cracking. Here, when viewed from the second direction D2, the dissimilar material layer does not overlap with the corners CN of the internal electrodes 11 and 13. Therefore, the stress at the corners CN of the outermost internal electrodes 11 and 13 can be alleviated. Furthermore, when the electric field strength increases, the electrostriction increases, making it difficult to achieve the effect of increasing compressive stress. However, in this embodiment, the use of the dissimilar material layer 21 can suppress the increase in electric field strength. This suppresses electrostrictive cracking and alleviates stress at the corners CN of the internal electrodes 11 and 13.
[0081] The element body 2 may be made of a ceramic material, and the different material layer 21 may be a metal layer. In this case, the linear expansion coefficient of the different material layer 21 can be made higher than that of the element body 2 .
[0082] In the region E1 where the first inner electrode 11 and the second inner electrode 13 overlap in the second direction D2, when the dimension in the third direction D3 perpendicular to the first and second directions D1 and D2 is represented by W, the dimension in the third direction of the region at the corner portion CN that does not overlap with the dissimilar material layer 21 may be greater than W / 10 and less than W / 3. In this case, the width of the region at the corner portion CN that does not overlap with the dissimilar material layer 21 can be sufficiently ensured, and by preventing this region from becoming too wide, sufficient compressive stress can be introduced into the side gap.
[0083] In the region E1 where the first inner electrode 11 and the second inner electrode 13 overlap in the second direction D2, when the dimension in the first direction D1 is defined as L, the dimension in the first direction D1 of the region E2 at the corner CN that does not overlap with the dissimilar material layer 21 may be greater than L / 10 and less than L / 3. In this case, the width of the region E2 at the corner CN that does not overlap with the dissimilar material layer 21 can be sufficiently ensured, and by preventing the region E2 from becoming too wide, sufficient compressive stress can be introduced into the side gap SG.
[0084] The dissimilar material layer 21 may include a cutout portion 25 at a position corresponding to the corner portion CN, with the cutout portion 25 being shaped so as to be spaced inward from the corner portion CN as viewed in the second direction D2. This increases the distance between the corner portion CN of the internal electrodes 11 and 13 and the edge 26 of the cutout portion 25 of the dissimilar material layer 21, thereby alleviating stress at the corner portion CN of the internal electrodes 11 and 13.
[0085] The different material layer 21 may have a cutout portion 25 at a position corresponding to the corner portion CN, and the cutout portion 25 may have a curved portion 27 that describes a curve when viewed from the second direction D2. In this case, electric field concentration at the cutout portion 25 can be suppressed.
[0086] The curved portion 27 may be curved so as to be away from the corner portion CN toward the inner circumference when viewed from the second direction D2. In this case, the distance between the corner portion CN of the internal electrodes 11 and 13 and the edge 26 of the notch 25 of the dissimilar material layer 21 can be increased, thereby alleviating stress in the corner portion CN of the internal electrodes 11 and 13.
[0087] The corner portion CN may have a shape protruding toward the outer peripheral side. In this case, it is possible to suppress the concentration of the electric field at the corner portion CN.
[0088] The thickness of the different material layer 21 may be such that "the thickness of the different material layer 21 is greater than or equal to the thickness of the first internal electrode 11 and the second internal electrode 13" (for example, see the following description). Figure 14 、 15), preferably, “the thickness of the different material>the thickness of the internal electrode”. In this case, by increasing the thickness of the different material layer 21, the breakdown voltage can be increased.
[0089] The thickness of the different material layer 21 may be at least 1.3 times the thickness of the first internal electrode 11 and the second internal electrode 13. In this case, by sufficiently increasing the thickness of the different material layer 21, the breakdown voltage can be increased.
[0090] In the multilayer capacitor C1, the first internal electrode 11 and the second internal electrode 13 are opposed to each other in the second direction D2 via a compressive stress introducing layer 22 for introducing compressive stress into the element body 2. The compressive stress introducing layer 22 can introduce compressive stress F1 in the third direction D3 into the side gaps SG between the first and second internal electrodes 11, 13 and the side faces 2e, 2f of the element body 2 (see FIG. Figure 3 Thus, even if electrostrictive vibration occurs when voltage is applied, the tensile stress F2 of the central portion in the second direction D2 of the side gap portion SG is reduced (see Figure 3 ), it is possible to suppress the generation of electrostrictive cracks. In addition, the dielectric layer 51 (refer to Figure 2 、 3 Unlike the thin-layer multilayer structure (see Figure 2), this structure can suppress degradation under high-temperature loads while also preventing electrostrictive cracking. Here, when viewed from the second direction D2, the compressive stress-introducing layer 22 does not overlap with the corners CN of the internal electrodes 11 and 13. Therefore, stress at the corners CN of the outermost internal electrodes 11 and 13 can be alleviated. This suppresses electrostrictive cracking and also reduces stress at the corners CN of the internal electrodes 11 and 13.
[0091] The present disclosure is not limited to the above-described embodiments.
[0092] Reference Figure 10 and Figure 11 Modifications of the shape of the intermediate layer 20 will be described. Figure 10 and Figure 11 This is a schematic diagram of a modified example of the intermediate layer 20 viewed from the second direction D2. Figure 10 As shown in (a), the intermediate layer 20 can be divided in the first direction D1 by a slit 28. The slit 28 extends inward in the third direction, including the center of the internal electrodes 11 and 13 in the first direction D1. The intermediate layer 20 is divided into the intermediate layer 20A and the intermediate layer 20B with the slit 28 interposed therebetween.
[0093] The width of the intermediate layers 20A and 20B in the first direction D1 is smaller than that of the internal electrodes 11 and 13. Furthermore, as viewed in the second direction D2, the intermediate layer 20A is disposed on one end side of the internal electrodes 11 and 13 in the first direction D1. As viewed in the second direction D2, the intermediate layer 20B is disposed on the other end side of the internal electrodes 11 and 13 in the first direction D1.
[0094] like Figure 10 As shown in (b), the intermediate layer 20 can be divided in the third direction D3 by a slit 29. The slit 29 extends inward in the first direction D1, including the center of the internal electrodes 11 and 13 in the third direction D3. The intermediate layer 20 is divided into the intermediate layer 20C and the intermediate layer 20D with the slit 29 interposed therebetween.
[0095] The width of the intermediate layers 20C and 20D in the third direction D3 is smaller than that of the internal electrodes 11 and 13. Furthermore, when viewed in the second direction D2, the intermediate layer 20C is disposed on one end side of the internal electrodes 11 and 13 in the third direction D3. When viewed in the second direction D2, the intermediate layer 20D is disposed on the other end side of the internal electrodes 11 and 13 in the third direction D3.
[0096] like Figure 11 As shown in (a), the intermediate layer 20 may also have an annular shape due to the through portion 30. The intermediate layer 20 is arranged so as to overlap along the four end portions of the internal electrodes 11 and 13. The intermediate layer 20 has a smaller width in the first direction D1 than the internal electrodes 11 and 13, and is arranged on both end portions of the internal electrodes 11 and 13 in the first direction D1 as viewed from the second direction D2. The intermediate layer 20 also has a smaller width in the third direction D3 than the internal electrodes 11 and 13, and is arranged on both end portions of the internal electrodes 11 and 13 in the third direction D3 as viewed from the second direction D2.
[0097] like Figure 11 As shown in (b) and (c) of FIG. 1 , a structure in which a ring-shaped intermediate layer 20 is formed by combining a pair of L-shaped intermediate layers 20E and 20F may be adopted. Figure 11 The intermediate layer 20E shown in (b) has a portion that is smaller in width in the first direction D1 than the internal electrodes 11, 13 and is positioned on one end side of the internal electrodes 11, 13 in the first direction D1 as viewed in the second direction D2. The intermediate layer 20E has a portion that is smaller in width in the third direction D3 than the internal electrodes 11, 13 and is positioned on one end side of the internal electrodes 11, 13 in the third direction D3 as viewed in the second direction D2. Furthermore, cutouts 25 are provided at the corners of the L-shape. The longitudinal ends 20Ea, 20Eb of the L-shape of the intermediate layer 20E are positioned so as not to overlap with the corners CN of the internal electrodes 11, 13.
[0098] Figure 11The intermediate layer 20F shown in (c) has a portion that is smaller in width in the first direction D1 than the internal electrodes 11, 13 and is positioned on the other end side of the internal electrodes 11, 13 in the first direction D1 as viewed in the second direction D2. The intermediate layer 20F has a portion that is smaller in width in the third direction D3 than the internal electrodes 11, 13 and is positioned on the other end side of the internal electrodes 11, 13 in the third direction D3 as viewed in the second direction D2. Furthermore, cutouts 25 are provided at the corners of the L-shape. The longitudinal ends 20Fa, 20Fb of the L-shape of the intermediate layer 20F are positioned so as not to overlap with the corners CN of the internal electrodes 11, 13.
[0099] The combination of the aforementioned end portions 20Ea and 20Fb allows the intermediate layer 20 to be configured so that it does not overlap with the corner portion CN when viewed from the second direction D2. The combination of the aforementioned end portions 20Eb and 20Fa allows the intermediate layer 20 to be configured so that it does not overlap with the corner portion CN when viewed from the second direction D2. Thus, the method for preventing the intermediate layer 20 from overlapping with the corner portion CN when viewed from the second direction D2 is not limited to the cutout portion 25; alternatively, the position of the end portions of the narrow intermediate layer 20 may be adjusted. Furthermore, a single-sided shape may be employed instead of the L-shaped shape extending along both sides of the internal electrodes 11 and 13, as in the case of intermediate layers 20e and 20f. In this case, only four sets of intermediate layers are required.
[0100] It is possible that, when a direction perpendicular to the first and second directions is defined as a third direction, the width of the dissimilar material layer in at least one of the first and third directions is smaller than that of the first and second internal electrodes, and the dissimilar material layer is positioned toward an end portion of the first and second internal electrodes in one direction when viewed in the second direction. In this case, since the internal electrodes do not overlap with the dissimilar material layer near their centers, bulging of the element body can be suppressed.
[0101] like Figure 12 and Figure 13 As shown, the outer peripheral edge 31 of the intermediate layer 20 may be thicker than the inner peripheral region 32. In this case, by thinning the inner peripheral region 32, the bulging of the element body 2 can be suppressed. In addition, the shape and size of the thinned inner peripheral region 32 may be different from the inner peripheral region 32. Figure 11 The thickness of the edge portion 31 can be at least 1.1 times the thickness of the inner peripheral region 32, and more preferably at least 1.3 times. In this case, by sufficiently thinning the inner peripheral region, bulging of the element body can be suppressed. The upper limit of the thickness of the edge portion 31 is not particularly limited and can be set to no more than 5.0 times the thickness of the inner peripheral region 32.
[0102] The relationship between the thickness of the intermediate layer 20 (different material layer 21) and the internal electrodes 11 and 13 is not particularly limited. Figure 2 、 3 As shown, the intermediate layer 20 is thicker than the internal electrodes 11 and 13. Figure 14 As shown, the thickness of the intermediate layer 20 is equal to that of the internal electrodes 11 and 13. Figure 12 、 13 As shown, the thinner region 32 of the intermediate layer 20 is thicker than the internal electrodes 11, 13. Figure 15 As shown, the thinner region 32 of the intermediate layer 20 is equal to the thickness of the internal electrodes 11 , 13 .
[0103] Reference Figures 16 to 19 The experiment for confirming the effect of the electronic component of this embodiment is described below. Figures 2 to 5 As Comparative Example 1, a multilayer capacitor was prepared in which the intermediate layer 20 was omitted from the embodiment. As Comparative Example 2, a multilayer capacitor was prepared in which the cutout 25 was omitted from the embodiment and the intermediate layer 20 overlapped the corner CN of the internal electrodes 11 and 13.
[0104] First, the effect of suppressing cracks caused by electrostriction was confirmed. Voltage was applied to Example and Comparative Examples 1 and 2, and the stress in the stacking direction of the side gap SG was measured. Figure 2 、 Figure 3 and Figure 4 The stress at the measuring point MP1 is shown. Figure 16 As shown in Figure 16 As shown, Comparative Example 2 and the Example, which include the intermediate layer 20, can introduce greater compressive stress than Comparative Example 1 from the initial stage of voltage application. In Comparative Example 1, the stress acting on the side gap portion SG at 150 V is tensile stress. In contrast, in Comparative Example 2 and the Example, the stress acting on the side gap portion SG can be compressive stress up to 300 V. This confirms that the use of the intermediate layer 20 can introduce compressive stress into the side gap portion SG.
[0105] Next, the voltage at which electrostrictive cracks are generated was measured by applying voltage to the examples and comparative examples 1 and 2. The measurement results were recorded in Figure 17 As shown in the table. Figure 17 As shown in the table, the electrostrictive crack initiation voltages of Comparative Example 2 and the Example, which have the intermediate layer 20, are higher than those of Comparative Example 1, which does not have the intermediate layer 20. Furthermore, a T test was performed, confirming that the differences between Comparative Example 2 and the Example and Comparative Example 1 are statistically significant. Thus, it was confirmed that the use of the intermediate layer 20 can suppress electrostrictive cracking.
[0106] Next, the effect of suppressing the stress at the corner CN by providing the cutout 25 was confirmed. The stress at the corner CN was measured for the embodiment and comparative examples 1 and 2. Figure 2 、 Figure 3 and Figure 4 The stress at the measuring point MP2 is shown. Figure 18 As shown in Figure 18 As shown in FIG. 2 , the maximum principal stress at the corner CN increases in Comparative Example 2, which does not include the cutout 25. In contrast, in the embodiment having the cutout 25, the maximum principal stress at the corner CN can be suppressed to the same level as in Comparative Example 1, which does not include the intermediate layer 20. This confirms that the stress at the corner CN can be suppressed by providing the cutout 25 and preventing the intermediate layer 20 from overlapping the corner CN.
[0107] Next, thermal shock at 280°C was applied to Example and Comparative Examples 1 and 2, and the number of cracks was counted. 20 samples were prepared, and the number of NG products was counted. The measurement results were recorded in Figure 19 As shown in FIG. Comparative Example 2 shows a high NG rate. In contrast, in Example 2, the NG rate can be reduced. Thus, it can be confirmed that by providing the cutout portion 25 and preventing the intermediate layer 20 from overlapping the corner portion CN, the generation of cracks in the corner portion CN can be suppressed.
[0108] [Method 1]
[0109] An electronic component comprising:
[0110] a body having a pair of end surfaces facing each other in a first direction;
[0111] a first terminal electrode disposed on the end surface on one side of the first direction;
[0112] a second terminal electrode disposed on the end surface on the other side of the first direction;
[0113] a first internal electrode disposed in the element body and connected to the first terminal electrode;
[0114] a second internal electrode disposed in the element body and connected to the second terminal electrode;
[0115] a different material layer, which is disposed in the element body and is made of a material different from that of the element body,
[0116] The first internal electrode and the second internal electrode are opposed to each other via the different material layer in a second direction orthogonal to the first direction.
[0117] The different material layer has a linear expansion coefficient greater than the linear expansion coefficient of the element body,
[0118] The first internal electrode and the second internal electrode include corner portions located within the element body.
[0119] When viewed from the second direction, the different material layer does not overlap with the corner portion.
[0120] [Method 2]
[0121] The electronic component according to embodiment 1, wherein
[0122] The element body is made of ceramic material.
[0123] The heterogeneous material layer is a metal layer.
[0124] [Method 3]
[0125] The electronic component according to aspect 1 or 2, wherein
[0126] In the region where the first inner electrode and the second inner electrode overlap in the second direction, when the dimension in a third direction perpendicular to the first direction and the second direction is defined as W,
[0127] A dimension of a region of the corner portion that does not overlap with the different material layer in the third direction is greater than or equal to W / 10 and less than or equal to W / 3.
[0128] [Method 4]
[0129] The electronic component according to any one of aspects 1 to 3, wherein
[0130] In a region where the first inner electrode and the second inner electrode overlap in the second direction, when the dimension in the first direction is defined as L,
[0131] A dimension in the first direction of a region of the corner portion that does not overlap with the different material layer is greater than or equal to L / 10 and less than or equal to L / 3.
[0132] [Method 5]
[0133] The electronic component according to any one of aspects 1 to 4, wherein
[0134] The different material layer has a cutout portion at a position corresponding to the corner portion,
[0135] The cutout portion has a shape that is away from the corner portion toward the inner peripheral side when viewed from the second direction.
[0136] [Method 6]
[0137] The electronic component according to any one of aspects 1 to 5, wherein
[0138] The different material layer has a cutout portion at a position corresponding to the corner portion,
[0139] The cutout portion has a curved portion that describes a curve when viewed from the second direction.
[0140] [Method 7]
[0141] The electronic component according to embodiment 6, wherein
[0142] The curved portion is curved so as to be away from the corner portion toward the inner peripheral side when viewed from the second direction.
[0143] [Method 8]
[0144] The electronic component according to any one of aspects 1 to 7, wherein
[0145] The corner portion has a shape that protrudes toward the outer peripheral side.
[0146] [Method 9]
[0147] The electronic component according to any one of aspects 1 to 8, wherein
[0148] The thickness of the different material layer is greater than the thickness of the first internal electrode and the second internal electrode.
[0149] [Method 10]
[0150] The electronic component according to embodiment 9, wherein
[0151] The thickness of the different material layer is 1.3 times or more the thickness of the first internal electrode and the second internal electrode.
[0152] [Method 11]
[0153] The electronic component according to any one of aspects 1 to 10, wherein
[0154] The edge portion on the outer peripheral side of the dissimilar material is thicker than the region on the inner peripheral side.
[0155] [Method 12]
[0156] The electronic component according to embodiment 11, wherein
[0157] The thickness of the edge portion is 1.3 times or more the thickness of the inner peripheral region.
[0158] [Method 13]
[0159] The electronic component according to any one of aspects 1 to 12, wherein
[0160] When a direction perpendicular to the first direction and the second direction is set as a third direction,
[0161] In the heterogeneous material layer,
[0162] The width in at least one of the first direction and the third direction is smaller than that of the first internal electrode and the second internal electrode.
[0163] The first inner electrode and the second inner electrode are arranged on the end side in the one direction when viewed from the second direction.
[0164] [Method 14]
[0165] An electronic component comprising:
[0166] a body having a pair of end surfaces facing each other in a first direction;
[0167] a first terminal electrode disposed on the end surface on one side of the first direction;
[0168] a second terminal electrode disposed on the end surface on the other side of the first direction;
[0169] a first internal electrode disposed in the element body and connected to the first terminal electrode;
[0170] a second internal electrode disposed in the element body and connected to the second terminal electrode;
[0171] a compressive stress introducing layer, which is arranged in the element body and introduces compressive stress into the element body;
[0172] The first internal electrode and the second internal electrode are opposed to each other via the compressive stress introducing layer in a second direction perpendicular to the first direction.
[0173] The compressive stress introducing layer introduces the compressive stress into the side gaps between the first and second internal electrodes and the side surfaces of the element body in a third direction perpendicular to the first and second directions.
[0174] The first internal electrode and the second internal electrode include corner portions located within the element body.
[0175] The compressive stress-introducing layer does not overlap with the corner portion when viewed from the second direction.
[0176] Description of Reference Numerals
[0177] 2…element body, 5…first terminal electrode, 7…second terminal electrode, 11…first internal electrode, 13…second internal electrode, 21…different material layer, 22…compressive stress introduction layer, 25…notch portion, 26…edge portion, 27…curved portion, C1…multilayer capacitor (electronic component).
Claims
1. An electronic component comprising: a body having a pair of end surfaces facing each other in a first direction; a first terminal electrode disposed on the end surface on one side of the first direction; a second terminal electrode disposed on the end surface on the other side of the first direction; a first internal electrode disposed in the element body and connected to the first terminal electrode; a second internal electrode disposed in the element body and connected to the second terminal electrode; a different material layer, which is disposed in the element body and is made of a material different from that of the element body, The first internal electrode and the second internal electrode are opposed to each other via the different material layer in a second direction orthogonal to the first direction. The different material layer has a linear expansion coefficient greater than the linear expansion coefficient of the element body, The first internal electrode and the second internal electrode include corner portions located within the element body. When viewed from the second direction, the different material layer does not overlap with the corner portion.
2. The electronic component according to claim 1, wherein The element body is made of ceramic material. The heterogeneous material layer is a metal layer.
3. The electronic component according to claim 1, wherein In a region where the first inner electrode and the second inner electrode overlap in the second direction, assuming that a dimension in a third direction perpendicular to the first and second directions is W, A dimension in the third direction of a region of the corner portion that does not overlap with the different material layer is greater than or equal to W / 10 and less than or equal to W / 3. The electronic component according to claim 1 , wherein In a region where the first inner electrode and the second inner electrode overlap in the second direction, assuming that the dimension in the first direction is L, A dimension in the first direction of a region of the corner portion that does not overlap with the different material layer is greater than or equal to L / 10 and less than or equal to L / 3.
5. The electronic component according to claim 1, wherein The different material layer has a cutout portion at a position corresponding to the corner portion, The cutout portion has a shape that is away from the corner portion toward the inner peripheral side when viewed from the second direction. The electronic component according to claim 1 , wherein The different material layer has a cutout portion at a position corresponding to the corner portion, The cutout portion has a curved portion that describes a curve when viewed from the second direction.
7. The electronic component according to claim 6, wherein The curved portion is curved so as to be away from the corner portion toward the inner peripheral side when viewed from the second direction.
8. The electronic component according to claim 1, wherein The corner portion has a shape that protrudes toward the outer peripheral side.
9. The electronic component according to claim 1, wherein The thickness of the different material layer is greater than the thickness of the first internal electrode and the second internal electrode.
10. The electronic component according to claim 9, wherein The thickness of the different material layer is 1.3 times or more the thickness of the first internal electrode and the second internal electrode. The electronic component according to claim 1 , wherein The edge portion on the outer peripheral side of the dissimilar material is thicker than the region on the inner peripheral side.
12. The electronic component according to claim 11, wherein The thickness of the edge portion is 1.3 times or more the thickness of the inner peripheral region.
13. The electronic component according to claim 1, wherein When a direction perpendicular to the first direction and the second direction is defined as a third direction, The width of the different material layer in at least one of the first direction and the third direction is smaller than that of the first internal electrode and the second internal electrode. The different material layer is arranged on the end side in the one direction of the first internal electrode and the second internal electrode when viewed from the second direction.
14. An electronic component comprising: a body having a pair of end surfaces facing each other in a first direction; a first terminal electrode disposed on the end surface on one side of the first direction; a second terminal electrode disposed on the end surface on the other side of the first direction; a first internal electrode disposed in the element body and connected to the first terminal electrode; a second internal electrode disposed in the element body and connected to the second terminal electrode; a compressive stress introducing layer, which is arranged in the element body and introduces compressive stress into the element body; The first internal electrode and the second internal electrode are opposed to each other via the compressive stress introducing layer in a second direction perpendicular to the first direction. The compressive stress introducing layer introduces the compressive stress into the side gaps between the first and second internal electrodes and the side surfaces of the element body in a third direction perpendicular to the first and second directions. The first internal electrode and the second internal electrode include corner portions located within the element body. The compressive stress-introducing layer does not overlap with the corner portion when viewed from the second direction.
Citation Information
Patent Citations
Laminated chip component
JP2000124064A