Pressurizing device

Abstract

Provided is a pressurizing device capable of pressurizing only a portion requiring pressurization for a plurality of workpieces. The pressurizing device (1, 1Z) of the present invention is a pressurizing device that pressurizes a plurality of workpieces (W). The pressurizing device has a placement plate (14) capable of placing the workpieces, a plurality of individual pressurizing members (7) disposed above the placement plate and capable of individually pressurizing each workpiece from above, a support die (6) that supports the individual pressurizing members, an upper die (3) capable of pressurizing the individual pressurizing members downward, and a pressurizing pad (Pd, 18) disposed between the individual pressurizing members and the upper die. The individual pressurizing members are capable of moving in the vertical direction relative to the support die. The pressurizing pad is capable of deforming according to the amount of relative movement of each individual pressurizing member relative to the support die. When the workpieces are pressurized, the individual pressurizing members protrude from the support die toward the corresponding workpieces.

Description

Technical Field

[0001] This invention relates to a pressurization device. Background Technology

[0002] A pressure device is known for simultaneously pressurizing multiple workpieces (objects to be pressurized), such as a substrate (see, for example, Patent Document 1). This pressure device includes a pressure pad capable of applying equal pressure to each workpiece. The pressure pad is made of a special elastomer that is flexible enough to deform according to the shape of each workpiece. Therefore, this pressure device can simultaneously and equally pressurize multiple workpieces that have some height differences due to tolerances, etc.

[0003] Existing technical documents

[0004] Patent documents:

[0005] Patent Document 1: Japanese Patent Application Publication No. 2004-296746. Summary of the Invention

[0006] The problem the invention aims to solve

[0007] In the pressurizing device disclosed in Patent Document 1, the flexible body deforms to follow the shape of the workpiece. Therefore, in this pressurizing device, parts that do not require pressurization (e.g., parts other than the chip on the substrate) are also pressurized. Some workpieces have parts with low strength (e.g., eave-shaped parts). If this pressurizing device is used to pressurize such workpieces, defects such as cracking or breakage in the low-strength parts may occur. In other words, this pressurizing device presents a technical problem of pressurizing not only the parts that need pressurization but also the parts that do not need pressurization.

[0008] The purpose of this invention is to provide a pressurizing device that can apply pressure to only the parts of multiple workpieces that need to be pressurized at the same time.

[0009] Solution for solving the problem

[0010] One embodiment of the present invention is a pressurizing device for pressurizing multiple workpieces, wherein the pressurizing device comprises: a mounting plate for mounting the workpieces; a plurality of individual pressurizing components disposed above the mounting plate for individually pressurizing each of the workpieces from above; a support mold for supporting the individual pressurizing components; an upper mold for pressurizing the individual pressurizing components downward; a pressurizing pad disposed between the individual pressurizing components and the upper mold; and a support member for supporting the support mold, wherein the individual pressurizing components are movable relative to the support mold in a vertical direction, and the pressurizing pad is deformable according to the amount of relative movement of each of the individual pressurizing components relative to the support mold; when the workpieces are pressurized, the individual pressurizing components protrude from the support mold toward the corresponding workpieces; and the support member, when viewed from below, is disposed to the side of the upper mold and is movable relative to the upper mold in a vertical direction.

[0011] Invention Effects

[0012] According to the present invention, a pressurizing device is provided that can pressurize only the parts that need to be pressurized for multiple workpieces at the same time. Attached Figure Description

[0013] Figure 1 This is a schematic cross-sectional view of the pressurizing device, which describes an embodiment of the pressurizing device of the present invention.

[0014] Figure 2 This is a partially enlarged schematic cross-sectional view of the aforementioned device.

[0015] Figure 3 This is a schematic bottom view of the upper mold of the aforementioned device.

[0016] Figure 4 This is a schematic bottom view of the pressurization unit of the aforementioned device.

[0017] Figure 5 This is a schematic exploded perspective view of a portion of the structure of the aforementioned upper pressurization unit.

[0018] Figure 6 This is a schematic cross-sectional view showing one state of the aforementioned device during operation.

[0019] Figure 7 This is a schematic cross-sectional view showing another state of the aforementioned device during operation.

[0020] Figure 8 yes Figure 7 The above is a partially enlarged schematic cross-sectional view of the device in its current state.

[0021] Figure 9This is a schematic cross-sectional view showing another state of the aforementioned device during operation.

[0022] Figure 10 yes Figure 9 The above is a partially enlarged schematic cross-sectional view of the device in its current state.

[0023] Figure 11 This is a schematic cross-sectional view of the pressurizing device, which is used to describe a second embodiment of the pressurizing device of the present invention.

[0024] Figure 12 This is a partially enlarged schematic cross-sectional view of the device described above in the second embodiment.

[0025] Figure 13 This is a schematic exploded perspective view of a part of the structure of the upper pressurization unit included in the above-described device according to the second embodiment.

[0026] Figure 14 This is a schematic cross-sectional view showing one state of the above-described device in operation according to the second embodiment.

[0027] Figure 15 This is a schematic cross-sectional view showing another state of the above-described device in operation according to the second embodiment.

[0028] Figure 16 yes Figure 15 The above is a partially enlarged schematic cross-sectional view of the device in its current state.

[0029] Figure 17 This is a schematic cross-sectional view showing another state of the above-described device in operation according to the second embodiment.

[0030] Figure 18 yes Figure 17 The above is a partially enlarged schematic cross-sectional view of the device in its current state.

[0031] Figure 19 This is a schematic side view of the separate pressurizing component included in a modified version of the device.

[0032] Explanation of reference numerals in the attached figures

[0033] 1: Pressurization device

[0034] 3: Upper mold

[0035] 31: Individual upper mold

[0036] 50: Support component

[0037] 6: Support mold

[0038] 6a: Lower surface

[0039] 6c: Receiving hole (through hole)

[0040] 7: Separate pressurization component

[0041] 8: Individual pressure pad

[0042] 9: Force-applying unit (force-applying component)

[0043] 11: Module receiver component

[0044] 15: Heating Unit

[0045] Pd: Pressure Pad

[0046] 1Z: Pressurization device

[0047] 3Z: Upper mold

[0048] 6Z: Support mold

[0049] 11Z: Modular receiver component

[0050] 17: Frame component

[0051] 18: Pressure Pad

[0052] 7X: Separate pressurization component

[0053] 7Xa: Lower layer

[0054] 7Xb: Middle layer

[0055] 7Xc: Upper layer

[0056] 7Xf: Elastomer Detailed Implementation

[0057] The following describes embodiments of the pressurizing device (hereinafter referred to as "the device") of the present invention. In the following description, appropriate reference is made to the accompanying drawings. In the drawings, the same reference numerals are used to label the same parts and elements, and repeated descriptions are omitted. Furthermore, for ease of explanation, the dimensions of the elements may be enlarged, and are not limited to the proportions shown in the drawings.

[0058] In the following descriptions and accompanying figures, unless otherwise specified, when the three mutually orthogonal axes in space are the X-axis, Y-axis, and Z-axis, the X-axis and Y-axis are parallel to the horizontal direction, and the Z-axis is parallel to the vertical direction. That is, the XY plane is a horizontal plane, and the XZ plane and YZ plane are vertical planes. "X-axis direction" refers to the direction along the X-axis, "+X direction" is one direction along the X-axis, and "-X direction" is another direction along the X-axis. "Y-axis direction" refers to the direction along the Y-axis, "+Y direction" is one direction along the Y-axis, and "-Y direction" is another direction along the Y-axis. "Z-axis direction" refers to the direction along the Z-axis, which is the vertical direction. "+Z direction" is upward, and "-Z direction" is downward. "XY direction" refers to the direction along both the X-axis and Y-axis, and the "XY plane" is a virtual plane parallel to the XY direction. "XZ direction" refers to the direction along both the X-axis and Z-axis, and the "XZ plane" is a virtual plane parallel to the XZ direction. "YZ direction" refers to the direction along the Y-axis and Z-axis, and "YZ plane" is a virtual plane parallel to the YZ direction.

[0059] In the following description, the lower surface refers to the surface facing downwards and parallel to the XY direction. The upper surface refers to the surface facing upwards and parallel to the XY direction.

[0060] Pressurization device (first embodiment)

[0061] Structure of the pressurization device (first embodiment)

[0062] Figure 1 This is a schematic cross-sectional view of the device, illustrating an embodiment of the device.

[0063] Figure 2 This is a partially enlarged schematic cross-sectional view of device 1.

[0064] These figures illustrate the state in which the device 1, mounted on the XY plane, is cut along the XZ plane (described later). Figures 6-10 (Same as above). Figure 2 Show Figure 1 Part A of this device 1.

[0065] This device 1 applies pressure to workpiece W. This device 1 includes a base 2, an upper mold 3, a side unit 4, a support unit 5, a support mold 6, multiple (9 in this embodiment) individual pressure-applying components 7, multiple (9 in this embodiment) individual pressure pads 8, multiple (9 in this embodiment) force-applying units 9, multiple (9 in this embodiment) individual protective plates 10, a mold receiving component 11, a movement limiting component 12, a lifting device 13, a mounting plate 14, a heating unit 15, a control device 16, and a vacuum pump P. The base 2, upper mold 3, side unit 4, support unit 5, support mold 6, individual pressure-applying components 7, individual pressure pads 8, force-applying units 9, individual protective plates 10, mold receiving component 11, and movement limiting component 12 are arranged vertically above workpiece W, forming the upper pressure-applying unit UP. The mounting plate 14 and heating unit 15 are arranged vertically below workpiece W, forming the lower pressure-applying unit DP.

[0066] "Workpiece W" is the object pressurized by this device 1. Workpiece W includes, for example, an electronic component w1, a substrate w2, and a paste-like adhesive w6. In this embodiment, the electronic component w1 is, for example, a power semiconductor device. The electronic component w1 is disposed at the upper end of the workpiece W. The substrate w2 is, for example, a DCB substrate formed by bonding a ceramic plate w3 to two copper plates w4 and w5 using DCB (Direct Copper Bonding). The ceramic plate w3 is held between the two copper plates w4 and w5, and the outer edge of the ceramic plate w3 protrudes horizontally from the copper plates w4 and w5. The adhesive w6 is a high-temperature sintered bonding layer disposed between the electronic component w1 and the substrate w2. The electronic component w1 is thermally pressed onto the substrate w2 by this device 1. Since the thermal pressing method is a known technique, its detailed description is omitted.

[0067] The base 2 supports the upper mold 3, the side unit 4, and the support unit 5. The base 2 is rectangular along the XY direction, and is a cuboid shape. The base 2 is supported by the lifting device 13 in a manner that allows it to move vertically via the lifting device 13. The base 2 has a lower surface 2a. The lower surface 2a is a surface parallel to the XY plane.

[0068] The upper die 3 applies pressure to the workpiece W from above via a separate pressure member 7. The upper die 3 is made of a metal with high rigidity (e.g., carbon steel). The upper die 3 is mounted on the lower surface 2a of the base 2. The upper die 3 has a base 30 and a plurality of (nine in this embodiment) individual upper dies 31.

[0069] Figure 3 This is a schematic bottom view of the upper mold 3.

[0070] In the following explanation, with Figure 3 Take appropriate reference together Figure 1 and Figure 2 .

[0071] The base 30 is rectangular in shape along the XY direction and is a flat cuboid in the vertical direction. The base 30 has a lower surface 30a. A portion of the lower surface 30a protrudes downward into a cuboid shape to form a separate upper mold 31. That is, the base 30 and the separate upper mold 31 are integrated.

[0072] The individual upper die 31 applies downward pressure to the corresponding individual pressure-applying component 7, thereby applying pressure to the corresponding workpiece W. The individual upper die 31 is rectangular along the XY direction, essentially a cuboid. Each individual upper die 31 has a lower surface 31a. When viewed from below, the individual upper dies 31 are arranged evenly (3 rows × 3 columns) along the XY direction. In the following description, each individual upper die 31 will be distinguished by adding the markings "1" to "9" at the end.

[0073] Individual upper dies 311, 312, and 313 are arranged sequentially along the X-axis direction from the +X direction side in the +Y direction half of the base 30. Individual upper dies 314, 315, and 316 are arranged sequentially along the X-axis direction from the +X direction side in the central part of the base 30 in the Y-axis direction. Individual upper dies 317, 318, and 319 are arranged sequentially along the X-axis direction from the +X direction side in the -Y direction half of the base 30.

[0074] It should be noted that in this invention, the upper mold 3 can also be integrally formed with the base 2.

[0075] Alternatively, in this invention, the upper mold 3 may not have a base 30. In this case, for example, the upper mold 31 alone may be mounted on the lower surface 2a of the base 2, or it may be integrally formed with the base 2.

[0076] Figure 4 This is a schematic bottom view of the upper pressurization unit UP.

[0077] This diagram omits the base 2 within the upper pressurization unit UP. In the following description, [the following text is incomplete and likely refers to a different topic]. Figure 4 Take appropriate reference together Figure 1 and Figure 2 For ease of explanation, the outer edge of the upper mold 3 is shown by a double-dotted line in this figure, and the outer edge of the support member 50, which will be described later, is shown by a bold double-dotted line.

[0078] When the workpiece W is pressurized, the side unit 4, together with the base 2 and the mounting plate 14, forms a space for accommodating the workpiece W (hereinafter referred to as "accommodation chamber R"). Figure 6 (The same applies below). The side unit 4 is disposed below the base 2. The side unit 4 includes a first side component 40, a second side component 41, a first sealing component 42, a second sealing component 43, a third sealing component 44, and a cylinder 45.

[0079] The first side component 40 and the second side component 41 are rectangular in shape along the XY direction, and are cylindrical. That is, when viewed from below, a rectangular internal space is formed in the center of the first side component 40 and the second side component 41. The first side component 40 is mounted on the lower surface 2a of the base 2. In the horizontal direction, the first side component 40 is arranged to surround the upper mold 3, the support unit 5, and the support mold 6. That is, when viewed from below, the upper mold 3, the support unit 5, and the support mold 6 are arranged in the internal space of the first side component 40. The second side component 41 is supported on the base 2 via a cylinder 45. In the horizontal direction, the second side component 41 is arranged to surround the first side component 40. That is, when viewed from below, the first side component 40 (upper mold 3, support unit 5, support mold 6) is arranged in the internal space of the second side component 41. The second side component 41 has a lower surface 41a, an upper surface 41b, and a vent 41c. The vent 41c is a through hole that opens on the inner and outer peripheral surfaces of the second side component 41.

[0080] The first sealing component 42, the second sealing component 43, and the third sealing component 44 are, for example, known O-rings. The first sealing component 42 is disposed between the base 2 and the first side component 40. The second sealing component 43 is disposed between the first side component 40 and the second side component 41. The third sealing component 44 is mounted on the lower surface 41a.

[0081] Cylinder 45 causes the second side component 41 to rise and fall. Cylinder 45 is mounted on the lower surface 2a of the base 2 and the upper surface 41b of the second side component 41, supporting the second side component 41 so that it can rise and fall. Cylinder 45 is, for example, a known cylinder.

[0082] Support unit 5 supports support mold 6. Support unit 5 is disposed below base 2. Support unit 5 includes support member 50 and multiple spring members 51.

[0083] Support member 50 supports support mold 6. Support member 50 is rectangular in shape along the XY direction, and is frame-shaped. That is, when viewed from below, a rectangular internal space is formed in the center of support member 50. Support member 50 is made of, for example, a metal with high rigidity (e.g., stainless steel). Support member 50 has a lower surface 50a and an upper surface 50b. When viewed from below, support member 50 is arranged on the side of upper mold 3 in a manner that surrounds upper mold 3.

[0084] Spring component 51 supports support component 50. Spring component 51 is mounted on the lower surface 2a of base 2 and the upper surface 50b of support component 50, supporting support component 50 so that it can move relative to upper mold 3 in the vertical direction. Spring component 51 is, for example, a known helical spring.

[0085] Figure 5 This is a schematic exploded perspective view of the structure of part of the upper pressure unit UP (upper mold 3, support mold 6, separate pressure component 7, separate pressure pad 8, force application unit 9, and separate protective plate 10).

[0086] In the following explanation, with Figure 5 Take appropriate reference together Figures 1-4 .

[0087] The support mold 6 supports the individual pressure-applying component 7, allowing it to move relative to the support mold 6 in the vertical direction for individual pressure application. The support mold 6 is made of a metal with high rigidity (e.g., carbon steel). The support mold 6 is rectangular along the XY direction, and is cuboid in shape. When viewed from below, the shape (size) of the outer edge of the support mold 6 is the same as the shape (size) of the outer edge of the support component 50. The support mold 6 is disposed below the upper mold 3 and the support unit 5. The support mold 6 has a lower surface 6a, an upper surface 6b, and a plurality of (nine in this embodiment) receiving holes 6c. The support mold 6 is mounted on the lower surface 50a of the support component 50 via the movement limiting member 12.

[0088] The receiving hole 6c is a through hole that penetrates the support mold 6 in the vertical direction. The shape of the receiving hole 6c is rectangular along the XY direction and is a two-section prism. The receiving hole 6c has an inner peripheral surface 6d and an inner flange portion 6e. The lower end of the inner peripheral surface 6d of the receiving hole 6c protrudes horizontally (inward direction of the receiving hole 6c) throughout the entire circumference, forming the inner flange portion 6e. That is, a two-section prism-shaped space is formed inside the receiving hole 6c. The shape of the inner flange portion 6e is rectangular along the XY direction and is frame-shaped. The inner flange portion 6e has an upper surface 6f. Each receiving hole 6c corresponds to each individual upper mold 31. For this correspondence, please refer to the following description. When viewed from below, the receiving hole 6c is positioned in the same position as the corresponding individual upper mold 31. In the following description, when distinguishing each receiving hole 6c, the marks "1" to "9" are added to the end of each hole.

[0089] As described later, the portion of the support mold 6 other than the receiving hole 6c bears pressure (pressing pressure) from the individual pressure pad 8 in the horizontal direction when the workpiece W is pressurized. Therefore, in the horizontal direction, the length (thickness) of this portion is designed to be a length that will not deform due to this pressure.

[0090] Individual pressure applying component 7 applies pressure to the corresponding workpiece W from above. Individual pressure applying component 7 is, for example, made of a metal with high rigidity (e.g., carbon steel). Figure 2As shown, the individual pressure-applying component 7 includes a lower surface 7a, an upper surface 7b, a main body portion 7c, and an outer flange portion 7d. The lower surface 7a is the lower surface of the main body portion 7c, and the upper surface 7b is the upper surface of both the main body portion 7c and the outer flange portion 7d. Each individual pressure-applying component 7 corresponds to each receiving hole 6c and each individual upper mold 31. This correspondence will be explained later. The individual pressure-applying component 7 is received in its corresponding receiving hole 6c. The individual pressure-applying component 7 can move (slide) in the vertical direction within its corresponding receiving hole 6c. That is, the individual pressure-applying component 7 can move relative to the support mold 6 in the vertical direction. In the following description, when distinguishing each individual pressure-applying component 7, the marks "1" to "9" will be added to the end of their respective designations.

[0091] The main body 7c is rectangular along the XY direction, and is a cuboid shape. In the XY direction, the length (width) of the main body 7c is shorter than the length (width) of the receiving hole 6c in the inner flange 6e. In the vertical direction, the length (height) of the main body 7c is shorter than the length of the receiving hole 6c (that is, the length of the support mold 6).

[0092] The upper end of the outer peripheral surface of the main body 7c protrudes outwards along its entire circumference, forming an outer flange 7d. That is, when viewed from the side, the shape of the individual pressure member 7 is "T". The outer flange 7d is rectangular along the XY direction. In the XY direction, the length (width) of the outer flange 7d is slightly shorter than the length (width) of the corresponding receiving hole 6c (to the extent that the individual pressure member 7 can slide within the receiving hole 6c). The outer flange 7d has a lower surface 7e. In the vertical direction, the lower surface 7e is positioned opposite the upper surface 6f of the corresponding inner flange 6e.

[0093] When the workpiece W is pressurized, the individual pressure pad 8 deforms according to the relative movement of the corresponding individual pressure component 7 relative to the support mold 6. For example... Figure 2 As shown, the individual pressure pad 8 includes a soft body 8a and two membranes 8b and 8c. Each individual pressure pad 8 corresponds to a receiving hole 6c and an individual pressure member 7. This correspondence will be explained later. The individual pressure pad 8 is received in the corresponding receiving hole 6c and is disposed above and adjacent to the corresponding individual pressure member 7. That is, the individual pressure pad 8 is disposed between the corresponding individual pressure member 7 and the corresponding individual upper mold 31 (upper mold 3). In other words, the individual pressure pad 8 functions as a pressure pad in this invention. In other words, the device 1 has a pressure pad Pd, which includes a plurality of individual pressure pads 8, disposed between the upper mold 3 and the individual pressure member 7. In the following description, when distinguishing each individual pressure pad 8, the marks "1" to "9" will be added to the end of their respective designations.

[0094] When the workpiece W is pressurized, the flexible body 8a equally transmits the pressure from the corresponding individual upper mold 31 to the corresponding individual pressurizing component 7. The flexible body 8a is, for example, made of a known elastomeric material with high fluidity and low resilience (e.g., GELTEC Corporation, high-damping thermally conductive gel sheet "αGEL (registered trademark)"). The flexible body 8a possesses the flexibility to deform according to the contours of an object when pressed against it. The flexible body 8a is, for example, filled between two films 8b and 8c disposed above and below the flexible body 8a.

[0095] Membranes 8b and 8c prevent the corresponding individual pressure-applying component 7 and individual protective plate 10 from adhering to the flexible body 8a. Furthermore, membranes 8b and 8c function as sealing materials, preventing the flexible body 8a from entering the gaps between the corresponding receiving hole 6c and the individual pressure-applying component 7 (outer flange 7d), and between the corresponding receiving hole 6c and the individual protective plate 10. Membranes 8b and 8c are rectangular in shape along the XY direction and are membrane-like. In the XY direction, the length (width) of membranes 8b and 8c is the same as or slightly longer than the length of the corresponding receiving hole 6c.

[0096] It should be noted that, in this invention, when the size of the gap between the corresponding receiving hole 6c and the individual pressure member 7 (outer flange 7d), and the size of the gap between the corresponding receiving hole 6c and the individual protective plate 10, are sizes that prevent the flexible body 8a from entering, the length (width) of the membranes 8b and 8c in the XY direction can also be shorter than the length (width) of the receiving hole 6c. In this case, a sealing material (e.g., an O-ring) can also be provided between the receiving hole 6c and the outer flange 7d. Furthermore, when the flexible body 8a is made of a material that does not enter the gap, the individual pressure pad 8 may not have membranes 8b and 8c.

[0097] The force-applying unit 9 applies upward force to the individual pressure-applying component 7. The force-applying unit 9 is composed of one or more force-applying components (e.g., coil springs) in this embodiment. Each force-applying unit 9 corresponds to the receiving hole 6c and each individual pressure-applying component 7. This correspondence will be explained later. The force-applying unit 9 is received in the corresponding receiving hole 6c and disposed between the upper surface 6f of the corresponding inner flange 6e and the lower surface 7e of the outer flange 7d of the individual pressure-applying component 7. In the following description, when distinguishing each force-applying unit 9, the designations "1" to "9" will be added to the end of their respective designations.

[0098] It should be noted that, in this invention, the number of force-applying components constituting the force-applying unit 9 is not limited to "4". That is, for example, the force-applying unit 9 may also be composed of a single helical spring, which is configured with the main body 7c as the core material. Furthermore, the force-applying component is not limited to a helical spring. That is, for example, the force-applying component may also be a leaf spring.

[0099] Individual protective plates 10 protect individual pressure pads 8 from the influence of individual upper molds 31. Individual protective plates 10 are made of, for example, a metal with high rigidity (e.g., carbon steel). The shape of the individual protective plates 10 is rectangular along the XY direction and is plate-shaped. In the XY direction, the length (width) of the individual protective plate 10 is slightly shorter than the length (width) of the corresponding receiving hole 6c. Each individual protective plate 10 corresponds to each individual upper mold 31, each receiving hole 6c, and each individual pressure pad 8. For details of this correspondence, please refer to the following description. The individual protective plates 10 are positioned below the corresponding individual upper mold 31, received in the corresponding receiving hole 6c, and placed on top of the corresponding individual pressure pad 8. In the following description, when distinguishing each individual protective plate 10, the marks "1" to "9" are added to the end of its designation.

[0100] When the workpiece W is pressurized, the mold receiving member 11 bears the downward pressure from the supporting mold 6. Furthermore, when the workpiece W is pressurized, the mold receiving member 11 determines the position (height) of the supporting mold 6 relative to the mounting plate 14 in the vertical direction. The mold receiving member 11 is made, for example, of a known rigid heat-insulating material (e.g., a heat-insulating material having a compressive strength of tens to hundreds of MPa or more). The shape of the mold receiving member 11 is rectangular along the XY direction, and is frame-shaped. The mold receiving member 11 is mounted on the outer edge of the lower surface 6a of the supporting mold 6. As a result, the mold receiving member 11 faces the mounting surface 14a of the mounting plate 14, which will be described later. Figure 2 As shown, in the vertical direction, the length (thickness) L11 of the mold receiving component 11 is longer than the length (thickness) Lw of the workpiece W. The mold receiving component 11 has a lower surface 11a.

[0101] The movement limiting member 12 restricts the upward movement of the individual pressure member 7, the individual pressure pad 8, and the individual protective plate 10 by means of the force application unit 9. The movement limiting member 12 is rectangular in shape along the XY direction and is plate-shaped. The movement limiting member 12 is disposed above the support mold 6 and mounted on the upper surface 6b of the support mold 6. The movement limiting member 12 has a lower surface 12a and a plurality of (nine in this embodiment) through holes 12b.

[0102] The through-hole 12b is a through-hole that penetrates the movement limiting member 12 in the vertical direction. The through-hole 12b is rectangular in shape along the XY direction. Each through-hole 12b corresponds to each individual upper mold 31, each receiving hole 6c, and each individual protective plate 10. This correspondence is described later. When viewed from below, the through-hole 12b is positioned at the same location as the corresponding individual upper mold 31 and receiving hole 6c. When viewed from above, the portion surrounding the through-hole 12b in the movement limiting member 12 covers the outer edge of the corresponding receiving hole 6c in a rectangular frame shape. As a result, this portion restricts the upward movement of the corresponding individual pressure member 7, individual pressure pad 8, and individual protective plate 10. In the XY direction, the length (width) of the through-hole 12b is longer than the length (width) of the corresponding individual upper mold 31, and shorter than the length (width) of the corresponding receiving hole 6c and individual protective plate 10. In the following description, when distinguishing each through hole 12b, mark "1" to "9" at the end of each hole.

[0103] It should be noted that, in this invention, the movement restriction member 12 may also be composed of multiple (e.g., the same number as the receiving hole 6c) frame-shaped members.

[0104] The lifting device 13 raises and lowers the base 2. The lifting device 13 is, for example, a known hydraulic cylinder.

[0105] The mounting plate 14 is a component for mounting the workpiece W. The mounting plate 14 is made of, for example, graphite or a metal with high thermal conductivity (e.g., a copper alloy). When viewed from below, the mounting plate 14 is rectangular along the XY direction and is plate-shaped. The mounting plate 14 is placed on top of the heating unit 15. The mounting plate 14 has an upper surface, namely the mounting surface 14a.

[0106] Heating unit 15 heats workpiece W. Heating unit 15 is made of a metal with high rigidity (e.g., carbon steel). The shape of heating unit 15 is rectangular along the XY axis when viewed from above, and is cuboid in shape. Heating unit 15 includes multiple heaters and refrigerant channels (not shown) disposed inside heating unit 15.

[0107] The control device 16 controls the overall operation of this device 1.

[0108] Vacuum pump P adjusts the atmosphere within the containment chamber R (described later) to a reduced-pressure atmosphere (vacuum atmosphere). Vacuum pump P is a known vacuum pump. Vacuum pump P is connected to exhaust port 41c via piping.

[0109] Here, the components with the same reference numerals added for distinction among the individual upper molds 31, receiving holes 6c, individual pressure-applying components 7, individual pressure-applying pads 8, force-applying units 9, individual protective plates 10, and insertion holes 12b correspond to each other. That is, for example, the individual upper molds 311, receiving holes 6c1, individual pressure-applying components 71, individual pressure-applying pads 81, force-applying units 91, individual protective plates 101, and insertion holes 12b1 correspond to each other. The individual pressure-applying components 71, individual pressure-applying pads 81, force-applying units 91, and individual protective plates 101 are received in the receiving hole 6c1. The individual pressure-applying component 71 can move (slide) in the vertical direction within the receiving hole 6c1. The individual pressure-applying pad 81 is positioned above the individual pressure-applying component 71 and adjacent to it. The force-applying unit 91 applies upward force to the individual pressure-applying component 71, individual pressure-applying pad 81, and individual protective plate 101. The individual protective plate 101 is positioned below the individual upper mold 311 and rests on the individual pressure pad 81. When viewed from above, the portion surrounding the through hole 12b1 in the movement limiting member 12 covers the outer edge of the receiving hole 6c1 in a rectangular frame shape. As a result, this portion restricts the upward movement of the individual pressure member 71, the individual pressure pad 81, and the individual protective plate 101.

[0110] The device 1 configured in this way can apply pressure to different types of workpieces W by replacing the upper mold 3 (separate upper mold 31), support mold 6, separate pressure component 7, separate pressure pad 8, force application unit 9, separate protective plate 10, and movement restriction component 12.

[0111] Operation of the pressurization device (first embodiment)

[0112] Next, the operation of this device 1 will be explained as follows. In the following explanation, this device 1 applies pressure to nine workpieces W simultaneously. In the following explanation, appropriate references will be made. Figure 1 , Figure 2 , Figure 5 .

[0113] like Figure 1 As shown, when workpiece W is not pressurized, the upper pressurizing unit UP is positioned above the lower pressurizing unit DP, separate from the lower pressurizing unit DP. In this state, as... Figure 2As shown, in the receiving hole 6c, the force-applying unit 9 applies upward force to the corresponding individual pressure-applying component 7, individual pressure-applying pad 8, and individual protective plate 10. As a result, the individual pressure-applying component 7 is received in the corresponding receiving hole 6c and does not protrude downward from the support mold 6. In addition, the individual protective plate 10 abuts against the movement restriction member 12, and the individual pressure-applying component 7, individual pressure-applying pad 8, and individual protective plate 10 do not protrude upward from the receiving hole 6c. The individual upper mold 31 is opposite to the corresponding individual protective plate 10 and is located higher than the corresponding receiving hole 6c and insertion hole 12b. The support mold 6 and the individual pressure-applying component 7 are disposed above the mounting plate 14.

[0114] First, the workpiece W is placed on the mounting surface 14a of the mounting plate 14. At this time, each workpiece W is located below the corresponding individual pressure member 7.

[0115] It should be noted that, in this invention, the workpiece W can also be transported together with the mounting plate 14 to the top of the heating unit 15 while it is placed on the mounting plate 14.

[0116] Next, the lifting device 13 lowers the upper pressurizing unit UP. Specifically, the lifting device 13 lowers the upper pressurizing unit UP until the second side component 41 and the third sealing component 44 are tightly fitted with the mounting plate 14. At this time, a receiving chamber R for accommodating the workpiece W is formed between the upper pressurizing unit UP and the mounting plate 14. The receiving chamber R is a space surrounded by the base 2, the side unit 4, and the mounting plate 14.

[0117] Figure 6 This is a schematic cross-sectional view showing one state of the device 1 during operation.

[0118] The diagram shows a state in which a containment chamber R is formed.

[0119] Next, the vacuum pump P reduces the pressure of the atmosphere in the containment chamber R.

[0120] Next, the lifting device 13 lowers the upper pressure unit UP until the mold receiving component 11 comes into contact with the mounting plate 14. At this time, the second side component 41 moves upward relative to the first side component 40 as the base 2 descends.

[0121] Figure 7 This is a schematic cross-sectional view showing another state of the device 1 in operation.

[0122] Figure 8 yes Figure 7 This is a partially enlarged schematic cross-sectional view of the device 1 in its current state.

[0123] These figures show the state in which the mold receiving component 11 abuts against the mounting plate 14. Figure 8 Show Figure 7Part B of this device 1.

[0124] When the mold receiving member 11 abuts against the mounting plate 14, the mold receiving member 11 is pressed downward by the spring member 51 via the support member 50 and the support mold 6. That is, the mold receiving member 11 is clamped between the support mold 6 (lower surface 6a) and the mounting plate 14 (mounting surface 14a). At this time, the mold receiving member 11 bears the pressure applied downward from the support mold 6 (mainly due to the pressure of the weight of the support member 50 and the support mold 6, as well as the pressing force from the spring member 51). In addition, friction is generated between the mold receiving member 11 and the mounting plate 14 due to this pressure, which prevents the support mold 6 from moving horizontally relative to the mounting plate 14. As a result, no horizontal sliding of the support mold 6 relative to the mounting plate 14 occurs. Moreover, in the vertical direction, the position of the lower surface 6a relative to the mounting surface 14a is maintained at a position at the length L11 of the mold receiving member 11. That is, by abutting against the mounting plate 14 via the mold receiving member 11, the position of the support mold 6 relative to the mounting plate 14 (workpiece W) is fixed (determined). In this state, the support mold 6 (lower surface 6a) and the individual pressing member 7 (lower surface 7a) do not contact the workpiece W. Therefore, malfunctions such as workpiece W movement or accidental pressure on the workpiece W due to their contact with the workpiece W will not occur. In this way, by pressing the mold receiving member 11 against the mounting plate 14, the mold receiving member 11 determines the position of the support mold 6 relative to the mounting plate 14 (workpiece W).

[0125] Next, the heating unit 15 heats the workpiece W to a specified temperature (e.g., 300°C).

[0126] It should be noted that, in this invention, the heating unit 15 can start heating the workpiece W at a time before the upper pressure unit UP descends.

[0127] Next, the lifting device 13 lowers the upper pressure unit UP until each individual pressure component 7 abuts against the corresponding workpiece W. At this time, the individual upper mold 31 is inserted into the corresponding insertion hole 12b and abuts against the corresponding individual protective plate 10. In addition, the support component 50 and the support mold 6 move upward relative to the upper mold 3 by the spring component 51 retracting as the base 2 descends. Next, the individual upper mold 31 presses the corresponding individual protective plate 10 downward. At this time, the individual upper mold 31, the individual pressure component 7, the individual pressure pad 8, and the individual protective plate 10 resist the force of the force application unit 9 and descend (slide) within the receiving hole 6c. That is, the individual upper mold 31, the individual pressure component 7, the individual pressure pad 8, and the individual protective plate 10 move downward relative to the support mold 6. As a result, the individual pressure component 7 protrudes from the receiving hole 6c toward the corresponding workpiece W and abuts against the upper end (electronic component w1) of the corresponding workpiece W. The individual pressure-applying component 7 only contacts the part of the workpiece W that requires pressure (electronic component w1). Here, in the vertical direction, the length Lw of each workpiece W and the position of the lower surface 7a of the individual pressure-applying component 7 may vary slightly due to the tolerances of the workpiece W and each component. Therefore, the relative movement of each individual pressure-applying component 7 relative to the support mold 6 may vary slightly (the relative movement varies).

[0128] Next, the lifting device 13 lowers the upper pressurizing unit UP until each individual pressurizing component 7 applies a specified pressure (e.g., several tens of MPa, hereinafter referred to as "specified pressure") to the corresponding workpiece W (the workpiece W is pressurized).

[0129] Figure 9 This is a schematic cross-sectional view showing another state of the device 1 in operation.

[0130] Figure 10 yes Figure 9 This is a partially enlarged schematic cross-sectional view of the device 1 in its current state.

[0131] Figure 9 This shows the state in which workpiece W is under pressure. Figure 10 Show Figure 9 Part C of this device 1.

[0132] In this state, the individual pressure pad 8 (soft body 8a) deforms according to the relative movement of the corresponding individual pressure member 7. As a result, the prescribed pressure from the corresponding individual upper mold 31 is equally transmitted to the corresponding individual pressure member 7. That is, the individual upper mold 31 presses downward on the corresponding individual pressure member 7. As mentioned above, the soft body 8a is held between two films 8b and 8c. Therefore, the soft body 8a will not enter the gap between the receiving hole 6c and the individual pressure member 7 (outer flange 7d), or the gap between the receiving hole 6c and the individual protective plate 10. In addition, since the soft body 8a absorbs the difference in the relative movement of the corresponding individual pressure member 7, the prescribed pressure from the individual upper mold 31 is equally transmitted to all workpieces W. As mentioned above, since the soft body 8a is made of gel sheet, differences of hundreds of micrometers can also be absorbed. At this time, through the deformation of the individual pressure pad 8, the prescribed pressure from the individual upper mold 31 is also transmitted in the horizontal direction (that is, the inner circumferential surface 6d of the receiving hole 6c) via the individual pressure pad 8. Therefore, as mentioned above, the support mold 6 is designed not to deform due to the specified pressure transmitted to the inner circumferential surface 6d.

[0133] As mentioned earlier, the individual pressure-applying component 7 only contacts the electronic component w1 of the corresponding workpiece W, applying downward pressure only to the electronic component w1. Therefore, the outer edge of the ceramic plate w3 protruding from the copper plates w4 and w5 is not pressured, preventing cracking, defects, or other malfunctions at that edge. In this way, by using the individual pressure-applying component 7, which moves relative to the support mold 6, this device 1 can apply pressure only to the respective pressure-required portions (electronic components w1) of multiple workpieces W simultaneously.

[0134] When workpiece W is pressurized, the helical springs constituting force application unit 9 are not fully compressed. Therefore, the prescribed pressure transmitted to the individual pressurizing component 7 is transmitted to workpiece W, but not to the inner flange portion 6e (support mold 6). Furthermore, as mentioned above, when workpiece W is pressurized, the support component 50 and support mold 6 move upward relative to the upper mold 3. Therefore, the prescribed pressure from the upper mold 3 is concentrated and transmitted to the individual pressurizing component 7, but not to the support mold 6. Therefore, in this device 1, compared to "existing pressurizing devices that use pressurizing pads arranged to cover the entire surface of the upper mold to pressurize multiple workpieces (hereinafter referred to as "existing devices")", the pressure required to pressurize workpiece W from the lifting device 13 is reduced (for example, by about 1 / 4). As a result, the lifting device 13 is miniaturized compared to existing devices. In addition, compared to when the upper surface 6b of the support mold 6 is pressurized, the pressure resistance required for the support mold 6 is reduced. Therefore, the length of the support mold 6 in the vertical direction can be shortened, and the weight of the support mold 6 can be reduced.

[0135] Next, the lifting device 13 maintains the state of applying a specified pressure to the workpiece W for a specified time. Here, the support mold 6 does not abut against the mounting plate 14, and the mold receiving component 11 is made of heat-insulating material. Therefore, heat from the heating unit 15 is indirectly transferred to the separate pressurizing component 7 via the workpiece W, rather than being directly transferred from the mounting plate 14 to the support mold 6.

[0136] Next, the lifting device 13 raises the upper pressure unit UP. At this time, the individual upper mold 31 rises within the corresponding receiving hole 6c and moves upward through the corresponding insertion hole 12b. As a result, the individual pressure member 7, the individual pressure pad 8, and the individual protective plate 10 rise within the receiving hole 6c under the force of the force application unit 9, and the individual pressure member 7 is received within the receiving hole 6c. Therefore, the individual pressure member 7 does not protrude downward from the support mold 6. In addition, the flexible body 8a of the individual pressure pad 8 returns to its pre-pressurization state, and the individual protective plate 10 abuts against the movement restriction member 12. As mentioned above, the individual protective plate 10 is disposed between the membrane 8b and the individual upper mold 31. Therefore, when the individual upper mold 31 moves upward from the receiving hole 6c, the membrane 8b (individual pressure pad 8) does not adhere to the individual upper mold 31 and is not lifted from the receiving hole 6c together with the individual upper mold 31.

[0137] When the lifting device 13 raises the upper pressurization unit UP, the control device 16 purifies the containment chamber R with gas (e.g., nitrogen) to make the atmosphere in the containment chamber R atmospheric. Additionally, the heating unit 15 stops heating the workpiece W.

[0138] Summary (First Implementation)

[0139] According to the embodiment described above, the device 1 includes an upper mold 3, a support mold 6, multiple individual pressure-applying components 7, a pressure pad Pd having multiple individual pressure pads 8, and a mounting plate 14. The support mold 6 supports each individual pressure-applying component 7. The individual pressure-applying component 7 is disposed above the mounting plate 14 and can apply pressure to the corresponding workpiece W individually from above. The pressure pad Pd (individual pressure pad 8) is disposed between the upper mold 3 and the corresponding individual pressure-applying component 7. The individual pressure-applying component 7 can move relative to the support mold 6 in the vertical direction. The pressure pad Pd can deform according to the amount of relative movement of the corresponding individual pressure-applying component 7 relative to the support mold 6. When the workpiece W is pressured, the individual pressure-applying component 7 protrudes downward from the support mold 6 toward the corresponding workpiece W. According to this structure, when the workpiece W is pressured, only the individual pressure-applying component 7 abuts against the workpiece W, and the pressure from the upper mold 3 is applied only to the upper end (electronic component w1) of the workpiece W via the individual pressure-applying component 7. Therefore, the outer edge of the ceramic plate w3 protruding from the copper plates w4 and w5 is not pressurized, and no defects such as cracking or damage will occur at the outer edge. In this way, the device 1 uses a separate pressurizing component 7 that moves relative to the support mold 6, and can pressurize only the respective parts (electronic components w1) of multiple workpieces W that need to be pressed at the same time.

[0140] Furthermore, according to the embodiment described above, the device 1 includes a support member 50 that supports the support mold 6. When viewed from below, the support member 50 is positioned to the side of the upper mold 3 and can move relative to the upper mold 3 in the vertical direction. With this structure, when the workpiece W is pressurized, the pressure from the upper mold 3 is concentrated on a separate pressurizing member 7 and is not transmitted to the support mold 6. Therefore, the lifting device 13 of the device 1 is miniaturized compared to existing devices. Additionally, the pressure resistance required for the support mold 6 is reduced compared to when the upper surface 6b of the support mold 6 is pressurized. Therefore, the length of the support mold 6 in the vertical direction can be shortened, and the weight of the support mold 6 can be reduced.

[0141] Furthermore, according to the embodiment described above, the upper mold 3 has a plurality of individual upper molds 31 corresponding to the individual pressure-applying components 7. The pressure pad Pd has a plurality of individual pressure pads 8 corresponding to the individual pressure-applying components 7. The support mold 6 has a plurality of receiving holes 6c extending through the support mold 6 in the vertical direction and accommodating the corresponding individual pressure-applying components 7 and individual pressure pads 8. The individual upper molds 31 are capable of relative movement in the vertical direction relative to the support mold 6 within the corresponding receiving holes 6c. The individual pressure pads 8 are capable of deformation according to the amount of relative movement of the corresponding individual pressure-applying components 7 relative to the support mold 6. According to this structure, the predetermined pressure from the corresponding individual upper molds 31 is equally transmitted to the corresponding individual pressure-applying components 7. In addition, the flexible body 8a absorbs the difference in the amount of relative movement of the individual pressure-applying components 7, and the predetermined pressure from the individual upper molds 31 is equally transmitted to all workpieces W.

[0142] Furthermore, according to the embodiment described above, the device 1 includes multiple force-applying units 9, each consisting of multiple force-applying components. Each force-applying unit 9 is disposed between the inner flange 6e of the support mold 6 and the outer flange 7d of the corresponding individual pressure-applying component 7, applying upward force to the corresponding individual pressure-applying component 7. When the workpiece W is not pressurized, each individual upper mold 31 is located above the corresponding receiving hole 6c, and each individual pressure-applying component 7 is applied upward by the force of the force-applying unit 9, without protruding downward from the support mold 6. According to this structure, when the upper pressure-applying unit UP descends, before the support mold 6 is positioned or before the predetermined pressure from the individual upper mold 31 is applied to the individual pressure-applying component 7, the individual pressure-applying component 7 (lower surface 7a) does not protrude from the support mold 6 and does not contact the workpiece W. Therefore, malfunctions such as workpiece W movement due to the lower surface 7a contacting the workpiece W will not occur. As a result, the device 1 can stably pressurize multiple workpieces W simultaneously.

[0143] Furthermore, according to the embodiment described above, the device 1 includes a mold receiving member 11. The mold receiving member 11 is mounted on the lower surface 6a of the supporting mold 6, and is disposed between the lower surface 6a and the mounting surface 14a in the vertical direction, facing the mounting surface 14a. In the vertical direction, the length L11 of the mold receiving member 11 is longer than the length Lw1 of each workpiece W. With this structure, when the workpiece W is pressurized, the supporting mold 6 (lower surface 6a) does not contact the workpiece W. Therefore, malfunctions such as workpiece W movement or accidental pressurization of the workpiece W due to contact between the lower surface 6a and the workpiece W are prevented. Additionally, in the vertical direction, the position of the supporting mold 6 relative to the mounting plate 14 is maintained at a position approximately equal to the length of the mold receiving member 11. Moreover, by abutting against the mounting surface 14a, the position of the supporting mold 6 relative to the mounting plate 14 (workpiece W) is fixed (determined).

[0144] It should be noted that, in this invention, the material of the flexible body 8a is not limited to gel sheets. That is, for example, when the height difference between workpieces W is a tiny difference on the order of tens of micrometers, the material of the flexible body 8a can also be a material with lower shape conformity than gel sheets (e.g., silicone rubber).

[0145] In addition, in this invention, the device 1 may not have a separate protection plate 10.

[0146] Furthermore, in this invention, the module receiving component 11 can also be mounted on the mounting plate 14.

[0147] Furthermore, in this invention, the device 1 may also be without the movement limiting member 12. In this case, for example, the length of the receiving hole 6c in the vertical direction or the force of the force application unit 9 can be adjusted in such a way that the entire protective plate 10 does not protrude upward from the receiving hole 6c.

[0148] Furthermore, in this invention, the mold receiving component 11 may also be integrally formed with the supporting mold 6 and / or the mounting plate 14.

[0149] Furthermore, in this invention, when the workpiece W is not pressurized, the individual pressurizing component 7 can also protrude downwards from the support mold 6. In this case, it is preferable that when the mold receiving component 11 abuts against the mounting plate 14, the amount of protrusion can be controlled to a degree to which the individual pressurizing component 7 does not contact the workpiece W.

[0150] Pressurization device (second embodiment)

[0151] Next, focusing on the differences between another embodiment of this device (hereinafter referred to as "Second Embodiment") and the embodiment described above (hereinafter referred to as "First Embodiment"), the following description will be provided. In the Second Embodiment, the structure of the upper pressurization unit differs from that in the First Embodiment. In the following description of the Second Embodiment, for ease of explanation, components that are the same as those in the First Embodiment and components that have the same functions are labeled with the same reference numerals as those in the First Embodiment, and detailed descriptions are omitted.

[0152] Structure of the pressurization device (second embodiment)

[0153] Figure 11 This is a schematic cross-sectional view of the device, showing the second embodiment of the device.

[0154] Figure 12 This is a partially enlarged schematic cross-sectional view of device 1Z.

[0155] These figures illustrate the state of the device 1Z, which is mounted on the XY plane, being cut along the XZ plane (described later). Figures 14-18 (The same applies). Figure 12 Show Figure 11 The D section of this device 1Z.

[0156] This device 1Z applies pressure to the workpiece W. The device 1Z includes a base 2, an upper mold 3Z, a side unit 4, a support unit 5, a support mold 6Z, multiple (nine in this embodiment) individual pressure-applying components 7, multiple (nine in this embodiment) force-applying units 9, a mold receiving component 11Z, a lifting device 13, a mounting plate 14, a heating unit 15, a control device 16, a frame component 17, a pressure pad 18, and a vacuum pump P. The base 2, upper mold 3Z, side unit 4, support unit 5, support mold 6Z, individual pressure-applying components 7, force-applying units 9, frame component 17, and pressure pad 18 are arranged vertically above the workpiece W, forming the upper pressure-applying unit UPZ. The mold receiving component 11Z, mounting plate 14, and heating unit 15 are arranged vertically below the workpiece W, forming the lower pressure-applying unit DPZ.

[0157] The upper die 3Z applies pressure to the workpiece W from above via a separate pressure member 7. The upper die 3Z is made of a metal with high rigidity (e.g., carbon steel). The upper die 3Z is rectangular along the XY axis and flattened cuboid in the vertical direction. The upper die 3Z has a lower surface 3a. The upper die 3Z is mounted on the lower surface 2a of the base 2.

[0158] Support unit 5 supports frame component 17. Support unit 5 is disposed below base 2. When viewed from below, support component 50 is disposed on the side of upper mold 3Z in a manner that surrounds upper mold 3Z.

[0159] Figure 13 This is a schematic exploded perspective view of a part of the upper pressure unit UPZ (upper mold 3Z, support mold 6Z, separate pressure component 7, frame component 17, and pressure pad 18). In the following description, [the following text is incomplete and likely refers to a different part of the unit]. Figure 13 Take appropriate reference together Figure 11 and Figure 12 .

[0160] The support mold 6Z supports the individual pressure-applying component 7, allowing it to move relative to the support mold 6Z in the vertical direction. The support mold 6Z is made of a metal with high rigidity (e.g., carbon steel). The support mold 6Z is rectangular along the XY direction, and is cuboid in shape. When viewed from below, the shape (size) of the outer edge of the support mold 6Z is the same as the shape (size) of the outer edge of the support component 50 and the outer edge of the frame component 17. The support mold 6Z is disposed below the upper mold 3Z, the support unit 5, the frame component 17, and the pressure pad 18. The support mold 6Z is supported by the frame component 17. The support mold 6Z has a lower surface 6a, an upper surface 6b, a plurality of (nine in this embodiment) receiving holes 6c, and a recess 6g. The receiving holes 6c receive the corresponding individual pressure-applying component 7 and the force-applying unit 9.

[0161] The upper surface 6b of the support mold 6Z, except for its outer edge, is recessed downwards into a rectangular plate shape, forming a recess 6g. In the XY direction, the length (width) of the recess 6g is the same as or slightly shorter than the length (width) of the upper mold 3Z. The support mold 6Z is mounted on the lower surface 17a of the frame member 17, which will be described later.

[0162] As described later, the support mold 6Z bears a specified pressure downward from the pressure pad 18 when the workpiece W is pressurized. Therefore, the length (thickness) of the support mold 6Z in the vertical direction is designed to be a length that will not deform under the specified pressure.

[0163] When the workpiece W is pressurized, the mold receiving member 11Z bears the downward pressure (specified pressure) from the supporting mold 6Z. Additionally, when the workpiece W is pressurized, the mold receiving member 11Z determines the position (height) of the supporting mold 6Z relative to the mounting plate 14 in the vertical direction. The mold receiving member 11Z is made, for example, of a known rigid heat-insulating material (e.g., a heat-insulating material having a compressive strength of several tens of MPa to over 100 MPa). The shape of the mold receiving member 11Z is rectangular along the XY direction, and is grid-like. The mold receiving member 11Z is mounted on the mounting surface 14a of the mounting plate 14 at a position opposite to the lower surface 6a of the supporting mold 6Z (not opposite to the receiving hole 6c). Figure 12 As shown, in the vertical direction, the length L11Z of the mold receiving component 11Z is longer than the length Lw of the workpiece W. The mold receiving component 11Z has a lower surface 11a and an upper surface 11b.

[0164] The frame member 17 holds the pressure pad 18. The frame member 17 is made of a metal with high rigidity (e.g., stainless steel). The frame member 17 is rectangular in shape along the XY direction, and when viewed from below, it has the same shape as the support member 50. That is, when viewed from below, a rectangular internal space is formed in the center of the frame member 17. The frame member 17 has a lower surface 17a and an upper surface 17b. The frame member 17 is disposed below the support member 50 and mounted on the lower surface 50a of the support member 50. When viewed from below, the frame member 17 is disposed to the side of the upper mold 3Z in a manner that surrounds the upper mold 3Z. The frame member 17 is integral with the support member 50 and can move relative to the upper mold 3Z in the vertical direction. In the vertical direction, the frame member 17 is located below the lower surface 3a of the upper mold 3Z.

[0165] When the workpiece W is pressurized, the pressure pad 18 deforms according to the relative movement of the individual pressure member 7 relative to the support mold 6Z. Viewed from above, the pressure pad 18 is positioned above the support mold 6Z such that it covers the entire surface of the recess 6g of the support mold 6Z; viewed from below, it is positioned such that it covers the entire surface of the upper mold 3Z. That is, the pressure pad 18 is positioned between the upper mold 3Z and the individual pressure member 7. The pressure pad 18 includes a flexible body 18a, two membranes 18b and 18c, and a heat insulation body 18d.

[0166] When the workpiece W is pressurized, the flexible body 18a equally transmits the pressure from the upper mold 3Z to the individual pressurizing member 7. The flexible body 18a is, for example, made of the same material as the flexible body 8a in the first embodiment. The flexible body 18a is, for example, filled between two membranes 18b and 18c disposed above and below the flexible body 18a. The flexible body 18a is held around the entire circumference by the frame member 17 through the outer edges of the membranes 18b and 18c, thereby surrounding the flexible body 18a in the horizontal direction (filling the internal space of the frame member 17).

[0167] When the workpiece W is pressurized, the heat insulation 18d evenly distributes the pressure from the upper mold 3Z to the individual pressurizing member 7 and suppresses the transfer of heat from the heating unit 15 to the flexible body 18a. The heat insulation 18d is made, for example, of a known fibrous material with high flexibility and low thermal conductivity. Like the flexible body 18a, the heat insulation 18d has the flexibility to deform according to the relative movement of the individual pressurizing member 7 relative to the supporting mold 6Z. The heat insulation 18d is disposed adjacent to the membrane 18c below the flexible body 18a and is housed in the recess 6g of the supporting mold 6Z.

[0168] This device 1Z, configured in this way, can apply pressure to different types of workpieces W by replacing the support mold 6Z, the separate pressure-applying component 7, and the force-applying unit 9.

[0169] Operation of the pressurization device (second embodiment)

[0170] The operation of this device 1Z will be described below. In the following description, device 1Z applies pressure to nine workpieces W simultaneously. Please refer to the following description as appropriate. Figure 11 and Figure 12 .

[0171] like Figure 11 As shown, when the workpiece W is not pressurized, the upper pressurizing unit UPZ is positioned above the lower pressurizing unit DPZ and separate from it. In this state, the force-applying unit 9 applies upward force to the corresponding individual pressurizing component 7 within the receiving hole 6c. As a result, the individual pressurizing component 7 is received within the corresponding receiving hole 6c and does not protrude downward from the support mold 6Z. Furthermore, the individual pressurizing component 7 abuts against the heat insulation body 18d and does not protrude upward from the receiving hole 6c. The heat insulation body 18d is held between the support mold 6Z and the flexible body 18a, and the upper mold 3Z is positioned above the pressure pad 18 and separate from it.

[0172] The decompression operation of placing the workpiece W onto the mounting plate 14 and transferring it to the receiving chamber R in the operation of this device 1Z is the same as the operation of this device 1 in the first embodiment.

[0173] Figure 14 This is a schematic cross-sectional view showing one state of the device 1Z during operation.

[0174] The diagram shows a state in which a containment chamber R is formed.

[0175] Next, the lifting device 13 lowers the upper pressure unit UPZ until the support mold 6Z abuts against the mold receiving component 11Z. At this time, the second side component 41 moves upward relative to the first side component 40 as the base 2 descends.

[0176] Figure 15 This is a schematic cross-sectional view showing another state of the device 1Z in operation.

[0177] Figure 16 yes Figure 15 This is a partially enlarged schematic cross-sectional view of the device 1Z in its current state.

[0178] These figures show the state in which the support mold 6Z abuts against the mold receiving component 11Z. Figure 16 Show Figure 15 Part E of this device 1Z.

[0179] When the support mold 6Z abuts against the mold receiving member 11Z, the mold receiving member 11Z is pressed downward by the spring member 51 via the support member 50, the frame member 17, and the support mold 6Z. That is, the mold receiving member 11Z is clamped between the support mold 6Z and the mounting plate 14. At this time, the mold receiving member 11Z bears the pressure applied downward from the support mold 6Z (mainly due to the pressure from the weight of the support member 50, the support mold 6Z, the frame member 17, the pressure pad 18, and the pressing force from the spring member 51). In this state, similar to the device 1 of the first embodiment, the position of the support mold 6 relative to the mounting plate 14 (workpiece W) is fixed (determined). In addition, the support mold 6Z (lower surface 6a) and the individual pressure member 7 (lower surface 7a) do not contact the workpiece W. Therefore, malfunctions such as workpiece W movement or accidental pressure on the workpiece W due to their contact with the workpiece W will not occur. Thus, the support mold 6Z is pressed against the mold receiving member 11Z, thereby the mold receiving member 11Z determines the position of the support mold 6Z relative to the mounting plate 14 (workpiece W).

[0180] Next, the heating unit 15 heats the workpiece W to a specified temperature (e.g., 300°C).

[0181] It should be noted that, in this invention, the heating unit 15 can start heating the workpiece W at a time before the upper pressure unit UPZ descends.

[0182] Next, the lifting device 13 lowers the upper pressure unit UPZ until each individual pressure component 7 comes into contact with the corresponding workpiece W. At this time, the upper mold 3Z applies downward pressure to the pressure pad 18 while entering the internal space of the frame component 17. Additionally, the support component 50 and the frame component 17 move upward relative to the upper mold 3Z as the upper mold 3Z descends. As a result, the flexible body 18a deforms and enters the recess 6g of the support mold 6Z, pressing the heat insulation body 18d downward. The heat insulation body 18d deforms following the shape of the support mold 6Z and enters the receiving hole 6c, pressing the individual pressure components 7 downward. At this time, the individual pressure components 7 resist the force of the force application unit 9 and descend (slide) within the receiving hole 6c. That is, the individual pressure components 7 move downward relative to the support mold 6Z. As a result, the individual pressure-applying component 7 protrudes from the receiving hole 6c toward the lower part of the support mold 6Z toward the corresponding workpiece W, and abuts against the upper end (electronic component w1) of the corresponding workpiece W. The individual pressure-applying component 7 abuts only against the part of the workpiece W that needs to be pressured (electronic component w1).

[0183] Next, the lifting device 13 lowers the upper pressurizing unit UPZ until each individual pressurizing component 7 applies a specified pressure to the corresponding workpiece W (the workpiece W is pressurized).

[0184] Figure 17 This is a schematic cross-sectional view showing another state of the device 1Z in operation.

[0185] Figure 18 yes Figure 17 This is a partially enlarged schematic cross-sectional view of the device 1Z in its current state.

[0186] These figures show the state of workpiece W under pressure. Figure 18 Show Figure 17 The F part of this device 1Z.

[0187] In this state, the pressure pad 18 (soft body 18a and heat insulation body 18d) deforms according to the amount of heat insulation body 18d entering the receiving hole 6c (i.e., the relative movement of the individual pressure members 7). As a result, the prescribed pressure from the upper mold 3Z is equally transmitted to the individual pressure members 7. That is, the upper mold 3Z applies downward pressure to the individual pressure members 7. In addition, since the soft body 18a absorbs the difference in the relative movement of the individual pressure members 7, the prescribed pressure from the upper mold 3Z is equally transmitted to all workpieces W.

[0188] As previously described, the pressure pad 18 is positioned above the support mold 6Z, and the heat insulation body 18d is housed within the recess 6g. Therefore, the support mold 6Z is pressurized by the upper mold 3Z at a predetermined pressure via the flexible body 18a and the heat insulation body 18d. In the second embodiment, the mold receiving member 11Z is arranged in a grid pattern between the lower surface 6a of the support mold 6Z and the mounting surface 14a of the mounting plate 14, supporting the support mold 6Z being pressurized at a predetermined pressure. Therefore, the support mold 6Z will not deform even when a predetermined pressure is applied. Furthermore, the lifting device 13 requires a larger output (pressure) than the lifting device 13 in the first embodiment. Therefore, the lifting device 13 in the second embodiment is larger than the lifting device 13 in the first embodiment.

[0189] The individual pressure-applying component 7 only contacts the electronic component w1 of the corresponding workpiece W, and applies downward pressure only to the electronic component w1. Therefore, this device 1Z uses the individual pressure-applying component 7, which moves relative to the support mold 6Z, to apply pressure only to the respective parts (electronic components w1) of multiple workpieces W that require pressure at the same time.

[0190] Next, the lifting device 13 maintains the state of applying a specified pressure to the workpiece W for a specified time. Here, the support mold 6Z does not abut against the mounting plate 14, and the mold receiving member 11Z is made of heat-insulating material. Therefore, heat from the heating unit 15 is indirectly transferred to the separate pressurizing member 7 via the workpiece W, rather than being directly transferred from the mounting plate 14 to the support mold 6Z. In addition, a heat insulation body 18d with high heat insulation properties is disposed between the support mold 6Z and the flexible body 18a. Therefore, even if heat from the heating unit 15 is transferred to the support mold 6Z, the transfer of that heat to the flexible body 18a can be suppressed.

[0191] Next, the lifting device 13 raises the upper pressure unit UPZ. At this time, the upper mold 3Z moves away from the pressure pad 18 and upwards. As a result, the individual pressure member 7, with the help of the force application unit 9, rises upwards while pushing against the heat insulation body 18d, and is received in the receiving hole 6c. In addition, the flexible body 18a returns to its state before pressure application. As mentioned above, the heat insulation body 18d is received in the recess 6g. Therefore, the individual pressure member 7 is pressed down by the heat insulation body 18d and does not protrude upwards from the receiving hole 6c.

[0192] Summary (Second Implementation)

[0193] According to the embodiment described above, the device 1Z includes an upper mold 3Z, a support mold 6Z, multiple individual pressure-applying components 7, a mounting plate 14, and a pressure pad 18. The support mold 6Z supports each individual pressure-applying component 7. The individual pressure-applying component 7 is disposed above the mounting plate 14 and can apply pressure to the corresponding workpiece W individually from above. The pressure pad 18 is disposed between the upper mold 3Z and the individual pressure-applying components 7. The individual pressure-applying components 7 can move relative to the support mold 6Z in the vertical direction. The pressure pad 18 can deform according to the amount of relative movement of the corresponding individual pressure-applying component 7 relative to the support mold 6Z. When the workpiece W is pressured, the individual pressure-applying component 7 protrudes downward from the support mold 6Z toward the corresponding workpiece W. According to this structure, when the workpiece W is pressured, only the individual pressure-applying component 7 abuts against the workpiece W, and the pressure from the upper mold 3Z is applied only to the upper end (electronic component w1) of the workpiece W via the individual pressure-applying component 7. Therefore, the outer edge of the ceramic plate w3 protruding from the copper plates w4 and w5 is not pressurized, and no defects such as cracking or damage will occur at the outer edge. In this way, the device 1Z uses a separate pressurizing component 7 that moves relative to the support mold 6Z, which can pressurize only the respective parts (electronic components w1) of multiple workpieces W that need to be pressed at the same time.

[0194] Furthermore, according to the embodiment described above, the device 1Z includes a frame member 17 for holding the pressure pad 18. The pressure pad 18 is disposed below the upper mold 3Z such that it covers the entire surface of the upper mold 3Z when viewed from below. In the horizontal direction, the frame member 17 is disposed such that it covers the entire circumference of the pressure pad 18. The support mold 6Z is disposed below the frame member 17 and the pressure pad 18, and is supported by the frame member 17. The frame member 17 is capable of relative movement with respect to the upper mold 3Z in the vertical direction. According to this structure, the upper mold 3Z applies downward pressure to the pressure pad 18 with the entire surface of its lower surface 3a. The pressure pad 18 deforms according to the relative movement of the individual pressure members 7 disposed below the pressure pad 18. Therefore, the predetermined pressure from the upper mold 3Z is equally transmitted to the individual pressure members 7. In addition, the soft body 18a and the heat insulation body 18d absorb the difference in the relative movement of the individual pressure members 7, and the pressure from the upper mold 3Z is equally transmitted to all workpieces W.

[0195] Furthermore, according to the embodiment described above, the support mold 6Z has a plurality of receiving holes 6c extending through the support mold 6Z in the vertical direction. The receiving holes 6c receive corresponding individual pressure-applying components 7. According to this structure, the pressure pad 18 deforms following the shape of the receiving holes 6c. Therefore, the specified pressure from the upper mold 3Z is transmitted equally and reliably to the individual pressure-applying components 7.

[0196] Furthermore, according to the embodiment described above, the device 1Z includes multiple force-applying units 9, each composed of multiple force-applying components. Each force-applying unit 9 is disposed between the inner flange 6e of the support mold 6Z and the outer flange 7d of the corresponding individual pressure-applying component 7, applying upward force to the corresponding individual pressure-applying component 7. When the workpiece W is not pressurized, each individual pressure-applying component 7 is subjected to upward force by the force of the force-applying unit 9 and does not protrude downward from the support mold 6Z. According to this structure, similar to the device 1 of the first embodiment, malfunctions such as workpiece W movement due to contact between the individual pressure-applying component 7 and the workpiece W will not occur. As a result, the device 1Z can stably pressurize multiple workpieces W simultaneously.

[0197] Furthermore, according to the embodiment described above, the device 1Z includes a mold receiving member 11Z. The mold receiving member 11Z is mounted on the mounting surface 14a of the mounting plate 14, and is disposed between the lower surface 6a and the mounting surface 14a in the vertical direction, facing the lower surface 6a. In the vertical direction, the length L11Z of the mold receiving member 11Z is longer than the length Lw of each workpiece W. With this structure, similar to the device 1 of the first embodiment, malfunctions such as workpiece W movement due to the lower surface 6a contacting the workpiece W, or accidental pressure on the workpiece W, are avoided. Additionally, in the vertical direction, the position of the supporting mold 6Z relative to the mounting plate 14 is maintained at a position approximately equal to the length L11Z of the mold receiving member 11Z. Moreover, by abutting against the lower surface 6a, the position of the supporting mold 6Z relative to the mounting plate 14 (workpiece W) is fixed (determined). Furthermore, the supporting mold 6Z will not deform even when a specified pressure is applied.

[0198] It should be noted that in the second embodiment, the pressure pad 18 may also lack the heat insulation body 18d. In this case, the support mold 6Z may also lack the recess 6g.

[0199] Alternatively, in the second embodiment, the heat insulation body 18d may also be held by the frame member 17. In this case, the support mold 6Z may not have the recess 6g.

[0200] Furthermore, in the second embodiment, the structure of the mold receiving component 11Z is not limited to the structure described in the second embodiment, as long as the supporting mold 6Z does not deform. That is, for example, the mold receiving component 11Z may also be composed of multiple separable components. In addition, for example, the mold receiving component 11Z may also be composed of multiple components along the X direction or Y direction. Moreover, the mold receiving component 11Z may also be mounted on the lower surface 6a of the supporting mold 6Z.

[0201] Furthermore, in this invention, the mold receiving component 11Z can also be integrally formed with the supporting mold 6Z and / or the mounting plate 14.

[0202] Variations

[0203] Next, focusing on the differences from the first and second embodiments, modifications of the apparatus 1 and 1Z will be described below. In the following description of the modifications, for ease of explanation, unless specifically stated otherwise, components identical to those in the first and second embodiments, as well as components having the same functions, will be labeled with the same reference numerals as those in the first and second embodiments, and their descriptions will be omitted. In the following modifications, the structure of the individual pressure-applying component differs from that in the first and second embodiments. In the following description, appropriate references will be made to… Figure 1 , Figure 2 , Figure 11 .

[0204] Figure 19 This is a schematic cross-sectional view of the separate pressurizing component of the device in a modified example.

[0205] The individual pressurizing component 7X comprises a lower layer 7Xa, a middle layer 7Xb, an upper layer 7Xc, multiple (e.g., four) bolts 7Xd and 7Xe (two not shown, the same below), and an elastomer 7Xf. The lower layer 7Xa and upper layer 7Xc are, for example, made of a metal with high rigidity (e.g., carbon steel). The middle layer 7Xb is, for example, made of a known rigid thermal insulation material (e.g., a thermal insulation material with a compressive strength of tens to hundreds of MPa or more). That is, the thermal conductivity of the material constituting the middle layer 7Xb is lower than that of the materials constituting each of the lower layer 7Xa and upper layer 7Xc. The middle layer 7Xb is mounted on the lower layer 7Xa, and the upper layer 7Xc is mounted on the middle layer 7Xb. The lower layer 7Xa is fastened to the upper layer 7Xc by bolts 7Xd and 7Xe. As a result, the middle layer 7Xb is sandwiched between the lower layer 7Xa and the upper layer 7Xc. In the XY direction, the upper layer 7Xc protrudes further outward than the lower layer 7Xa and the middle layer 7Xb throughout its circumference, functioning as an outer flange 7d. The elastomer 7Xf is, for example, made of the same material as the heat insulation body 18d in the second embodiment. The elastomer 7Xf is, for example, fixed to the lower surface 7Xg of the lower layer 7Xa by an adhesive.

[0206] In this structure, when the workpiece W is pressurized, the elastomer 7Xf deforms following the shape of the workpiece W (electronic component w1), applying pressure evenly to the electronic component w1. As a result, the adhesive w6 is processed into a well-rounded corner shape at the boundary between the electronic component w1 and the copper plate w4. Furthermore, in this structure, heat from the heating unit 15, transmitted via the workpiece W to the individual pressurizing component 7X, is blocked by the intermediate layer 7Xb. This, in turn, suppresses the transfer of heat to the flexible bodies 8a and 18a.

[0207] It should be noted that, in the modified example, the standalone pressurizing component 7X may not have an elastomer 7Xf.

[0208] Other implementation methods

[0209] It should be noted that, in this invention, the shapes of the upper molds 3 and 3Z do not necessarily have to be rectangular along the XY direction. That is, for example, the shapes of the upper molds 3 and 3Z can also be cylindrical. In this case, the shapes of the support molds 6 and 6Z are cylindrical. The shapes of the support member 50 and the frame member 17 are annular. The shape of the pressure pad 18 is circular when viewed from below, and it is plate-shaped.

[0210] Alternatively, in this invention, the side unit 4 may not include the first side member 40. In this case, the second sealing member 43 may also be disposed between the first side member 40 and the support member 50.

[0211] Furthermore, in this invention, the number of individual pressure-applying components 7 is not limited to nine; any number is acceptable. In this case, the number and configuration of the individual upper mold 31, receiving hole 6c, individual pressure pad 8, force-applying unit 9, and individual protective plate 10 are appropriately set according to the number and configuration of the individual pressure-applying components 7.

[0212] Furthermore, in this invention, the shape of the individual pressure-applying component 7 is not limited to being rectangular along the XY direction when viewed from below. That is, for example, the shape of the individual pressure-applying component 7 can also be circular when viewed from below.

[0213] Furthermore, in this invention, the structure of the individual pressurizing component 7 is not limited to the structures of each embodiment. That is, for example, the individual pressurizing component 7 may also be composed of multiple separable components, just like the individual pressurizing component 7X.

[0214] Furthermore, in this invention, the shapes of the inner flange 6e and the outer flange 7d are not limited to a rectangular frame, as long as they are arranged opposite each other in the vertical direction. That is, for example, the inner flange 6e and the outer flange 7d may also be arranged only in the X direction or the Y direction.

[0215] Embodiments of the present invention

[0216] Next, regarding the embodiments of the present invention as understood from the above-described embodiments, the terms and reference numerals used in each embodiment will be described below.

[0217] A first embodiment of the present invention is a pressurizing device (e.g., pressurizing device 1, 1Z) that pressurizes a plurality of workpieces (e.g., workpiece W), wherein the pressurizing device comprises: a mounting plate (e.g., mounting plate 14) capable of mounting the workpieces; a plurality of individual pressurizing components (e.g., individual pressurizing components 7, 7X) disposed above the mounting plate, capable of individually pressurizing each of the workpieces from above; a support mold (e.g., support mold 6, 6Z) supporting the individual pressurizing components; an upper mold (e.g., upper mold 3, 3Z) capable of pressurizing the individual pressurizing components downward; and a pressurizing pad (e.g., pressurizing pad Pd, 18) disposed between the individual pressurizing components and the upper mold, wherein the individual pressurizing components are capable of relative movement in the vertical direction relative to the support mold, and the pressurizing pad is capable of deforming according to the relative movement of each of the individual pressurizing components relative to the support mold, wherein when the workpiece is pressurized, the individual pressurizing component protrudes from the support mold toward the corresponding workpiece.

[0218] Based on this structure, the device can apply pressure to only the respective parts of multiple workpieces that require pressure at the same time.

[0219] The second embodiment of the present invention is based on the pressurizing device (e.g., pressurizing device 1) described in the first embodiment, wherein the pressurizing device includes a support member (e.g., support member 50) that supports the support mold. The support member is disposed to the side of the upper mold (e.g., upper mold 3) when viewed from below and is capable of relative movement in the vertical direction relative to the upper mold.

[0220] This structure allows for a reduction in the length (thickness) of the support mold in the vertical direction, thus reducing its weight.

[0221] In the third embodiment of the present invention, based on the pressurizing device described in the second embodiment, the support mold has a plurality of through holes (e.g., receiving holes 6c) penetrating the support mold in the vertical direction, the upper mold has a plurality of individual upper molds (e.g., individual upper mold 31) corresponding to each individual pressurizing component, and the pressurizing pad (e.g., pressurizing pad Pd) has a plurality of individual pressurizing pads (e.g., individual pressurizing pad 8) corresponding to each individual pressurizing component. The through holes receive the corresponding individual pressurizing component and the corresponding individual pressurizing pad. The individual upper mold can move relative to the support mold in the vertical direction within the through holes that receive the corresponding individual pressurizing component. The individual pressurizing pad can deform according to the amount of relative movement of the corresponding individual pressurizing component relative to the support mold.

[0222] According to this structure, the specified pressure from the individual upper die is equally transmitted to all workpieces.

[0223] The fourth embodiment of the present invention is based on the pressurizing device described in the third embodiment. The pressurizing device has a plurality of force-applying components (e.g., force-applying unit 9). The plurality of force-applying components are disposed between the support mold and the corresponding individual pressurizing component, and apply upward force to the corresponding individual pressurizing component. When the workpiece is not pressurized, the individual upper mold is located above the corresponding through hole, and the individual pressurizing component is applied upward force by the corresponding force-applying component and does not protrude from the support mold.

[0224] Based on this structure, the device can stably apply pressure to multiple workpieces simultaneously.

[0225] The fifth embodiment of the present invention is based on the pressurizing device (e.g., pressurizing device 1Z) described in the first embodiment, the pressurizing device having a frame member (e.g., frame member 17) holding the pressurizing pad (e.g., pressurizing pad 18), which, when viewed from below, covers the entire surface of the upper mold (e.g., upper mold 3Z), and in the horizontal direction, the frame member surrounds the entire circumference of the pressurizing pad, the support mold being disposed below the pressurizing pad and the frame member and supported by the frame member, the frame member being movable relative to the upper mold in the vertical direction.

[0226] According to this structure, the pressure from the upper die is evenly transmitted to all workpieces.

[0227] The sixth embodiment of the present invention, based on the pressurizing device described in the fifth embodiment, provides that the support mold (for example, support mold 6Z) has a plurality of through holes penetrating the support mold in the vertical direction, and the through holes accommodate the corresponding individual pressurizing components.

[0228] According to this structure, the specified pressure from the upper mold is transmitted equally and reliably to the individual pressurizing components.

[0229] The seventh embodiment of the present invention is based on the pressurizing device described in the sixth embodiment. The pressurizing device has a plurality of force-applying components, which are disposed between the support mold and the corresponding individual pressurizing components. The force-applying components apply upward force to the corresponding individual pressurizing components. When the workpiece is not pressurized, each individual pressurizing component is force-applying upward by the force-applying components and does not protrude from the support mold.

[0230] Based on this structure, the device can stably apply pressure to multiple workpieces simultaneously.

[0231] In the eighth embodiment of the present invention, based on the pressurizing device described in the second or fifth embodiment, the supporting mold has a downward-facing lower surface (e.g., lower surface 6a), the mounting plate has a mounting surface for mounting each of the workpieces (e.g., mounting surface 14a), and the pressurizing device has a mold receiving member (e.g., mold receiving member 11, 11Z). The mold receiving member is disposed vertically between the lower surface and the mounting surface, facing the lower surface or the mounting surface, and in the vertical direction, the length of the mold receiving member is longer than the length of each of the workpieces.

[0232] According to this structure, there will be no malfunctions such as workpiece movement or accidental pressure on the workpiece caused by the lower surface contacting the workpiece.

[0233] The ninth embodiment of the present invention, based on the pressurizing device described in the first embodiment, includes a heating unit (e.g., heating unit 15) capable of heating the workpiece. Each of the individual pressurizing components includes: an upper layer (e.g., upper layer 7Xc); a lower layer (e.g., lower layer 7Xa) disposed at a position lower than the upper layer; and a middle layer (e.g., middle layer 7Xb) disposed between the upper layer and the lower layer. The thermal conductivity of the material constituting the middle layer is lower than that of the materials constituting the upper layer and the lower layer, respectively.

[0234] According to this structure, the transfer of heat from the heating unit to the soft body is suppressed.

[0235] The tenth embodiment of the present invention is based on the pressurizing device described in the first or ninth embodiment, wherein each of the individual pressurizing components has an elastomer (e.g., an elastomer 7Xf) that abuts against the workpiece and deforms in accordance with the shape of the workpiece when the workpiece is pressurized.

[0236] According to this structure, at the boundary between the electronic components and the copper plate, the adhesive is processed into a well-rounded corner shape.

Claims

1. A pressurizing device for pressurizing multiple workpieces, wherein, The pressurizing device has: A mounting plate capable of holding the workpiece; Multiple individual pressurizing components are arranged above the mounting plate, enabling individual pressurization of each workpiece from above; A support mold that supports the individual pressure-applying component; The upper mold is capable of applying downward pressure to the individual pressurizing components; A pressure pad, disposed between the individual pressure component and the upper mold; and Support component, which supports the support mold. The individual pressurizing component is capable of relative movement in the vertical direction relative to the support mold. The pressure pad can deform according to the relative movement of each of the individual pressure components relative to the support mold. When the workpiece is pressurized, the individual pressurizing component protrudes from the support mold toward the corresponding workpiece. The support member is positioned to the side of the upper mold when viewed from below, and is capable of relative movement in the vertical direction relative to the upper mold.

2. The pressurizing device according to claim 1, wherein, The support mold has multiple through holes extending through the support mold in the vertical direction. The upper mold has multiple individual upper molds corresponding to each of the individual pressurizing components. The pressure pad has multiple individual pressure pads corresponding to each of the individual pressure components. The through-hole accommodates the corresponding individual pressure component and the corresponding individual pressure pad. The individual upper mold is capable of moving relative to the support mold in the vertical direction within the through hole that accommodates the corresponding individual pressure component. The individual pressure pad can deform according to the relative movement of the corresponding individual pressure component relative to the support mold.

3. The pressurizing device according to claim 2, wherein, The pressurizing device has multiple force-applying components, which are disposed between the support mold and the corresponding individual pressurizing component, and apply upward force to the corresponding individual pressurizing component. When the workpiece is not pressurized The individual upper mold is located above the corresponding through hole. The individual pressurizing component is exerted upward force by the corresponding force-applying component and does not protrude from the support mold.

4. A pressurizing device for pressurizing multiple workpieces, wherein, The pressurizing device has: A mounting plate capable of holding the workpiece; Multiple individual pressurizing components are arranged above the mounting plate, enabling individual pressurization of each workpiece from above; A support mold that supports the individual pressure-applying component; The upper mold is capable of applying downward pressure to the individual pressurizing components; A pressure pad, disposed between the individual pressure component and the upper mold; and The frame component holds the pressure pad. The individual pressurizing component is capable of relative movement in the vertical direction relative to the support mold. The pressure pad can deform according to the relative movement of each of the individual pressure components relative to the support mold. When the workpiece is pressurized, the individual pressurizing component protrudes from the support mold toward the corresponding workpiece. When viewed from below, the pressure pad covers the entire surface of the upper mold. In the horizontal direction, the frame component surrounds the entire circumference of the pressure pad. The support mold is positioned below the pressure pad and the frame component, and is supported by the frame component. The frame component is capable of relative movement in the vertical direction relative to the upper mold.

5. The pressurizing device according to claim 4, wherein, The support mold has multiple through holes extending through the support mold in the vertical direction. The through-hole accommodates the corresponding individual pressure component.

6. The pressurizing device according to claim 5, wherein, The pressurizing device has multiple force-applying components, which are disposed between the support mold and the corresponding individual pressurizing component, and apply upward force to the corresponding individual pressurizing component. When the workpiece is not pressurized, each of the individual pressurizing components is forced upward by the force-applying component and does not protrude from the support mold.

7. The pressurizing device according to claim 1 or 4, wherein, The support mold has a downward-facing lower surface. The mounting plate has a mounting surface for mounting each of the workpieces. The pressurizing device has a mold receiving component, which is disposed vertically between the lower surface and the mounting surface, facing the lower surface or the mounting surface. In the vertical direction, the length of the mold receiving component is longer than the length of each of the workpieces.

8. The pressurizing device according to claim 1 or 4, wherein, The pressurizing device includes a heating unit capable of heating the workpiece. Each of the aforementioned individual pressurizing components includes: Upper part; The lower layer is positioned further below the upper layer; and The middle layer is disposed between the upper layer and the lower layer. The thermal conductivity of the material constituting the middle layer is lower than that of the materials constituting the upper layer and the lower layer, respectively.

9. The pressurizing device according to claim 1 or 4, wherein, Each of the individual pressurizing components has an elastomer that abuts against the workpiece when the workpiece is pressurized and deforms in accordance with the shape of the workpiece.

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