Ball supplementing module and ball supplementing machine thereof

Abstract

The invention relates to the technical field of semiconductor manufacturing and packaging, in particular to a ball supplementing module and a ball supplementing machine thereof, and the ball supplementing machine comprises a rack, a wafer carrying platform, a ball supplementing module, a dispensing module and a ball removing module. The ball supplementing module achieves accurate ball supplementing through a ball supplementing needle unit and a ball box unit, the ball box unit is provided with a unique suction opening structure, and it is ensured that solder balls are stably sucked and released. The glue dispensing module adopts a glue dispensing needle unit to be matched with a glue supply unit, so that high-precision glue dispensing operation is realized; and the ball removing module is combined with the ball removing needle unit and the automatic detection unit, so that bad solder balls can be effectively removed, and the position offset can be detected. In addition, a wafer calibration fine tuning system and a flattening system are arranged, so that accurate positioning and flatness in the wafer processing process are ensured. According to the invention, the technical effect of improving the wafer ball supplementing efficiency and precision is achieved, and meanwhile, the defective product rate is reduced.

Description

Technical Field

[0001] The present application relates to the technical field of semiconductor manufacturing and packaging, and in particular to a ball replenishing module and a ball replenishing machine thereof. Background Art

[0002] A wafer reballing machine is a key piece of equipment used in semiconductor wafer manufacturing and packaging. It's primarily used to inspect wafer ball placement and perform reballing operations to ensure uniform solder ball distribution and compliance with process requirements. In wafer-level packaging, reballing machines repair solder balls on the wafer surface, ensuring their integrity and positional accuracy to meet subsequent packaging and testing requirements. These machines can detect issues such as excess balls, damaged balls, missing balls, and misaligned balls on the wafer surface, and then perform ball removal, glue dispensing, and reballing.

[0003] The ball boxes of common wafer reballing machines typically utilize a static mechanical structure and a single airflow control mode, which cannot meet the non-destructive microball handling requirements of precision electronic packaging. Furthermore, debris and oxidized dust easily accumulate within the sealed ball boxes, requiring regular disassembly and cleaning, increasing maintenance downtime. Furthermore, because the balls directly contact the bottom of the box, they can easily undergo secondary displacement when the ball needle is pressed down to remove the balls. Summary of the Invention

[0004] In order to improve the feeding quality of the ball box, the present application provides a ball replenishing module and a ball replenishing machine thereof.

[0005] On the one hand, the present application provides a ball replenishment module, which adopts the following technical solution: A ball replenishing module comprises a ball replenishing needle unit and a ball box unit, wherein the ball box unit comprises an upper ball box and a lower ball box connected to each other, an air outlet gap is provided between the upper ball box and the lower ball box; a suction port is provided on the upper ball box, and the suction port gradually shrinks towards the lower ball box; a ball accommodating cavity is provided in the lower ball box, an air pressure port is provided at the bottom of the lower ball box, and both the air pressure port and the suction port are connected to the ball accommodating cavity.

[0006] By adopting this technical solution, the ball-replenishing module's ball-replenishing unit utilizes an upper and lower ball-replenishing unit structure. This utilizes an air gap and a tapered suction port, combined with a compressed air port, to supply air to the ball-replenishing chamber, creating a stable suspension state within the chamber. This avoids surface scratches caused by direct contact between the ball and the needle in traditional mechanical structures, while also addressing the arch bridge effect caused by ball accumulation, significantly improving both ball replenishment speed and positioning accuracy. Furthermore, the continuous air supply to the chamber also prevents debris or oxidized dust from remaining inside the ball-replenishing unit, eliminating the need for regular disassembly and cleaning, reducing maintenance downtime.

[0007] Optionally, a leak-proof filter is provided in the air pressure port.

[0008] By adopting the above technical solution, the leak-proof filter can effectively prevent the microballs in the ball box unit from leaking from the compressed air port under the action of airflow, while preventing external impurities from entering the ball box unit, ensuring the stability and reliability of the ball replenishment process.

[0009] On the other hand, the present application provides a ball replenishment module, including the above-mentioned ball replenishment module, and further comprising: A frame, wherein a crystal loading platform is movably provided on the frame, and the ball replenishing needle unit is slidably provided on the frame; a ball box platform is provided on the frame, a negative pressure airway is formed between the lower ball box and the ball box platform, and a vacuum joint and a compressed air joint are connected on the side wall of the ball box platform, the vacuum joint is connected to the negative pressure airway, and the compressed air joint is connected to the compressed air port; A glue dispensing module, comprising a glue dispensing support provided on the frame, a glue dispensing needle unit provided on the glue dispensing support, and a glue supply unit, wherein the glue dispensing needle unit is slidably provided on the glue dispensing support; The ball removal module includes a ball removal needle unit, a defect scanner and an automatic detection unit arranged on the frame. The ball removal needle unit is slidably arranged on the frame, the defect scanner is used to detect ball defects, and the automatic detection unit is used to detect the position offset of the ball removal needle unit before and after movement.

[0010] By adopting the above technical solution, the negative pressure airway formed between the lower ball box and the ball box platform ensures the stable installation of the ball box unit on the ball box platform, preventing the ball box unit from shifting due to vibration or other external factors during the ball replenishment process. The vacuum connector is connected to the negative pressure airway, allowing the negative pressure airway to be evacuated through the vacuum connector. The compressed air connector is connected to the compressed air port, allowing air to be blown into the ball-holding cavity through the compressed air connector, forming a positive pressure airflow within the cavity, causing the ball to be suspended within the cavity.

[0011] The dispensing module achieves dispensing through the coordination of the dispensing needle unit and the glue supply unit, providing a stable glue supply for subsequent ball replenishment. The ball removal module integrates an automatic detection unit and a defect scanner, capable of removing defective balls from the wafer. It also accurately detects the position offset of the ball removal needle unit to ensure the stability and reliability of the ball removal process. In summary, by optimizing the design of each functional module, this ball replenishment machine effectively solves the technical difficulties faced by traditional equipment in non-destructive processing, high-speed operation, and high-precision requirements, significantly improving the overall performance of wafer ball replenishment.

[0012] Optionally, the glue supply unit includes a glue box and a glue supply plate, a glue outlet is provided at the bottom of the glue box, and the glue supply plate is slidably provided under the glue box; a fine-tuning unit is provided on the glue dispensing support, and the fine-tuning unit is used to adjust the gap between the glue box and the glue supply plate.

[0013] By adopting this technical solution, when glue is needed, the glue supply plate slides under the glue box, and the glue liquid in the glue box is evenly spread from the glue outlet onto the glue supply plate, providing glue for the dispensing needle unit to dip into. By adjusting the gap between the glue box and the glue supply plate with a fine-tuning unit, different thicknesses of evenly distributed glue can be obtained, and the glue thickness can be adjusted according to the glue amount required for different types of balls.

[0014] Optionally, the dispensing module also includes a glue needle balancing unit, which includes a pressure sensor, an elastic balancing member and a force-applying member. The elastic balancing member is connected to the side of the dispensing needle unit, and the force-applying member is connected to the dispensing support for abutting the dispensing needle unit. The pressure sensor is located between the force-applying member and the dispensing needle unit.

[0015] By employing this technical solution, the elastic balance member effectively offsets the needle's own weight and external pressure, stabilizing the pressure in the dispensing unit and preventing damage to the target wafer point due to excessive pressure. A pressure sensor monitors the contact force between the needle and the wafer in real time and feeds this data back to the control system, enabling closed-loop regulation and ensuring controllable needle force, further improving operational precision. The force-applying member provides stable support above the needle unit, preventing the needle from swinging up and down during high-speed operation and ensuring the accuracy of its motion trajectory.

[0016] Optionally, the automatic detection unit includes a visual detector and a contact sensor, the visual detector is used to detect the vertical offset of the ball removal needle unit, and the contact sensor is located at the same height as the upper end surface of the crystal carrier platform.

[0017] By employing this technical solution, a contact sensor sets the lower limit for the vertical movement of the ball removal needle unit, while a visual detector accurately measures its vertical displacement, providing high-resolution vertical offset data. Based on this detected offset data, the position of the ball removal needle unit can be adjusted to a preset position, improving operational accuracy and efficiency.

[0018] Optionally, the frame is also provided with a wafer calibration and fine-tuning system, including a visual positioning unit and a rotational motion mechanism. The visual positioning unit is fixedly arranged on the frame, and the rotational motion mechanism includes a two-dimensional moving module, a rotational drive module and a rotating platform arranged on the two-dimensional moving module. The crystal carrier platform is rotatably arranged on the rotating platform, and the rotational drive module is used to drive the crystal carrier platform to rotate.

[0019] By employing this technical solution, the visual positioning unit identifies the markings on the wafer, determines the deviation between the wafer's actual position and the expected position, and then calculates the required rotation angle to ensure precise calibration of the wafer's position. The two-dimensional motion module in the rotary motion mechanism precisely controls the position of the rotating stage, and in conjunction with the rotary drive module, adjusts the horizontal position of the wafer carrier, effectively resolving positional offsets caused by wafer placement deviations or processing errors.

[0020] Optionally, the rack is further provided with a wafer flattening system, which includes a flattening mechanism and a closed-loop control module; The crystal carrier platform is provided with a plurality of adsorption holes, and the adsorption holes are connected to a negative pressure source; The flattening mechanism includes a lift base and a flattening ring connected to one end of the lift base, the flattening ring includes a ring body and a flattening head fixed on the flattening ring, and a plurality of flattening heads are arranged at intervals around the axis of the flattening ring; The closed-loop control module includes a thickness measuring unit and a distance measuring sensor. The thickness measuring unit is arranged on the frame and is used to measure the thickness of the wafer; the distance measuring sensor is arranged on the flattening ring and is used to monitor the distance between the flattening head and the wafer.

[0021] By employing this technical solution, the suction holes are connected to a negative pressure source to ensure wafer stability during flattening, thus accommodating wafers of varying sizes and degrees of warpage. A thickness measurement unit precisely measures wafer thickness, while a distance sensor monitors the distance between the flattening head and the wafer in real time, forming a closed-loop feedback control system to ensure precision during the flattening process and avoid damage to the wafer. The multiple flattening heads on the flattening ring are spaced around the axis, applying uniform force across the wafer surface, effectively addressing wafer warpage and providing a smooth work surface for subsequent reballing.

[0022] Optionally, a plurality of flattening rings are coaxially arranged at the end of the elevator seat, and each flattening ring has a different radius.

[0023] By adopting this technical solution and setting up multiple flattening rings of varying radii, the system can flexibly accommodate the flattening needs of wafers of varying sizes, improving the compatibility of the equipment. Furthermore, the synergistic effect of the flattening rings of varying radii ensures uniform force is applied to the wafer during the flattening process, preventing damage to the wafer caused by excessive localized pressure.

[0024] Optionally, a plurality of lifting pins are slidably connected to the wafer carrier platform, and after the lifting pins are lowered, the upper end surfaces of the lifting pins are coplanar with the upper end surface of the wafer carrier platform.

[0025] By adopting this technical solution, the multiple lift pins can flexibly accommodate wafers of varying sizes and degrees of warpage, providing uniform support during wafer transfer and flattening, and creating a clear workspace for loading. When the lift pins descend to a level with the upper surface of the wafer carrier, wafer surface flatness is ensured, providing a stable platform for subsequent reballing, and improving reballing accuracy and yield.

[0026] In summary, this application has at least one of the following beneficial effects: 1. This application utilizes a ball box unit design that combines air suspension with vacuum, creating a positive pressure gradient field within the ball chamber through the compressed air port. This allows the ball to maintain a non-contact suspension state within the chamber, effectively preventing surface scratches and the arch bridge effect, and significantly improving ball replenishment speed. 2. This application uses an adjustable glue supply unit in conjunction with a glue needle balancing unit to achieve precise control of glue thickness and the glue dispensing needle unit ensures pressure stability, avoiding damage to the target point on the wafer and significantly improving the glue dipping effect and ball filling quality; 3. The visual positioning unit and the rotary motion mechanism of the wafer calibration and fine-tuning system in this application cooperate with each other to achieve precise correction of the wafer position, effectively reducing the problem of ball filling failure caused by wafer offset. BRIEF DESCRIPTION OF THE DRAWINGS

[0027] Figure 1 This is a schematic diagram of the overall structure of the ball replenishing machine according to an embodiment of the present application; Figure 2 It is a schematic diagram of the partial structure of the upper part of the machine in the embodiment of the present application; Figure 3 This is a schematic structural diagram of the rotating platform in an embodiment of the present application; Figure 4 This is a schematic structural diagram of a ball removal module in an embodiment of the present application; Figure 5 This is a schematic structural diagram of the dispensing module in an embodiment of the present application; Figure 6 This is a structural diagram of the ball replenishment module in an embodiment of the present application; Figure 7 Schematic diagram of the partial structure of the ball box unit in the embodiment of the present application; Explanation of reference numerals: 1. rack; 11. crystal carrier platform; 111. adsorption hole; 112. lifting pin; 12. ball box platform; 121. negative pressure airway; 122. vacuum joint; 123. compressed air joint; 13. XZ CNC workbench; 131. X-axis slide module; 132. Z-axis slide module; 14. machine platform; 2. visual positioning unit; 3. rotary motion mechanism; 31. two-dimensional moving module; 32. rotary drive module; 321. motor screw drive assembly; 322. tension spring; 323. transmission slider; 33. rotary carrier; 4. ball replenishing module; 41. ball replenishing needle unit; 42. ball box unit; 421. upper ball box; 4211. suction port; 422. lower ball box; 4221. ball holding cavity; 4222. compressed air port; 423. leak-proof filter; 43 , ball replenishing support; 44, vacuum interface; 45, pressure-air interface; 5, dispensing module; 51, dispensing support; 52, dispensing needle unit; 53, glue supply unit; 531, glue box; 532, glue supply plate; 54, fine-tuning unit; 55, glue needle balancing unit; 551, pressure sensor; 552, elastic balancing part; 553, force-applying part; 6, ball removal module; 61, ball removal needle unit; 62, defect scanner; 63, automatic detection unit; 631, visual detector; 632, contact sensor; 64, waste ball collection box; 65, ball removal support; 7, wafer flattening system; 71, flattening mechanism; 711, elevator seat; 712, flattening ring; 713, flattening head; 72, closed-loop control module; 721, thickness measurement unit; 722, distance measurement sensor; 8, negative pressure source. DETAILED DESCRIPTION

[0028] The following is combined with Figure 1-7 This application is described in further detail.

[0029] Reference Figure 1 and Figure 2The present application provides a ball replenishing machine, comprising a frame 1, on which a wafer flattening system 7, a ball removal module 6, a glue dispensing module 5, and a ball replenishing module 4 are sequentially arranged. The frame 1 is also provided with a wafer calibration and fine-tuning system, which includes a visual positioning unit 2 and a rotary motion mechanism 3. The visual positioning unit 2 is fixedly connected to the frame 1. In this embodiment, the visual positioning unit 2 is specifically configured as a positioning camera. The rotary motion mechanism 3 includes a two-dimensional moving module 31, a rotary drive module 32, and a rotary platform 33 arranged on the two-dimensional moving module 31. The frame 1 includes a machine platform 14, and the two-dimensional moving module 31 is fixed to the machine platform 14. In this embodiment, the two-dimensional moving module 31 is specifically an XY CNC worktable. The two-dimensional moving module 31 includes a rotary platform 33 located at the top. The rotary drive module 32 is fixed to one side of the rotary platform 33. The rotary platform 33 is rotatably connected to the crystal carrier 11 via a cross roller bearing. The crystal carrier 11 is specifically configured as a circular plate. The two-dimensional moving module 31 can drive the wafer carrier 11 to slide on the machine 14, fine-tune the horizontal position of the wafer carrier 11, and transfer the wafer carrier 11 to a designated processing location. The rotation driving module 32 is used to drive the wafer carrier 11 to rotate around its own axis.

[0030] Reference Figure 3 Specifically, the rotation drive module 32 includes a motor-screw drive assembly 321 and a tension spring 322. A drive slider 323 is connected to the screw within the motor-screw drive assembly 321 via a cam bearing follower. One end of the drive slider 323 is connected to the bottom of the wafer carrier 11. One end of the tension spring 322 is connected to the drive slider 323, and the other end is fixed to the motor-screw drive assembly 321. Activating the motor-screw drive assembly 321 drives the wafer carrier 11 to rotate counterclockwise or clockwise.

[0031] The wafer calibration and fine-tuning system uses a visual positioning unit 2 to capture image data of wafer markings. Combined with a rotary motion mechanism 3, it achieves precise rotational adjustment of the wafer, thereby resolving marking position deviations caused by wafer placement deviations or processing errors. This system not only simplifies the wafer positioning process but also improves calibration accuracy, meeting the requirements of high-precision processing.

[0032] Reference Figure 1 and Figure 3, a plurality of adsorption hole groups are coaxially provided on the upper end surface of the crystal carrier platform 11, and the adsorption hole group includes a plurality of adsorption holes 111 arranged in a ring-shaped interval; the adsorption hole group is connected to a negative pressure source 8. After the negative pressure source 8 is started, a negative pressure can be formed on the upper end surface of the crystal carrier platform 11 to adsorb the wafer, thereby achieving stable installation of the wafer on the crystal carrier platform 11. The negative pressure source 8 can be a vacuum pump, a centrifugal fan, etc. The crystal carrier platform 11 is also slidably connected to a lifting pin 112, and three lifting pins 112 are arranged at intervals around the axis of the crystal carrier platform 11. A lifting source (not shown in the figure) is fixed to the bottom of the crystal carrier platform 11, and the telescopic end of the lifting source is fixedly connected to each lifting pin 112 to drive the lifting pin 112 to move up and down. After the wafer is transferred to the wafer carrier platform 11, the lifting source drives the lifting pin 112 to descend, so that the upper end surface of the lifting pin 112 descends to be coplanar with the upper end surface of the wafer carrier platform 11, or lower than the upper end surface of the wafer carrier platform 11, so that the adsorption hole group can stably adsorb the wafer.

[0033] Reference Figure 1 and Figure 2 The wafer flattening system 7 includes a flattening mechanism 71 and a closed-loop control module 72. In order to facilitate loading, a loading unit can be added to transfer the wafer to the wafer carrier platform 11. The loading unit can be a robot, a vacuum adsorption loader, etc. The flattening mechanism 71 includes a lift base 711 and a flattening ring 712 fixedly connected to the lifting end of the lift base 711. There are multiple flattening rings 712 coaxially fixed on the lifting end of the lift base 711, and the radius of each flattening ring 712 is different. Each flattening ring 712 is located at the same vertical height. The flattening ring 712 includes a ring body and a flattening head 713 fixed to the flattening ring 712 by bolts. Several flattening heads 713 are arranged at intervals around the axis of the flattening ring 712. In this embodiment, the lift base 711 can use a turbine screw lift. There are two flattening rings 712, one is set to 8 inches and the other is set to 6 inches. Twelve flattening heads 713 are fixed at equal intervals on each flattening ring 712 .

[0034] Reference Figure 1The closed-loop control module 72 includes a thickness measuring unit 721 and a distance measuring sensor 722. The thickness measuring unit 721 is located on the side of the flattening mechanism 71 near the ball removal module 6. The thickness measuring unit 721 is fixedly connected to the frame 1 through a bracket and is used to measure the thickness of the wafer. The thickness measuring unit 721 can be a laser thickness gauge, an ultrasonic thickness gauge, an optical interferometer, etc. In this embodiment, a laser thickness gauge is specifically selected. The distance measuring sensor 722 is fixed to the side of the flattening ring 712 near the elevator base 711 and is used to monitor the distance between the flattening head 713 and the wafer. After the wafer is moved to the thickness measuring unit 721 under the drive of the two-dimensional moving module 31, the thickness measuring unit 721 measures the wafer thickness; the two-dimensional moving module 31 continues to transfer the wafer to the bottom of the flattening mechanism 71. The elevator base 711 can control the height of the flattening head 713 according to the wafer thickness measured by the thickness measuring unit 721, so that the flattening head 713 presses against the wafer, which can effectively solve the problem of wafer warping. The rangefinder 722 monitors the descent height of the flattening head 713 to determine when it reaches the limit position during descent. The wafer flattening system 7, through the multi-size adaptive flattening mechanism 71 and combined with high-precision closed-loop control, achieves uniform flattening of wafers of varying sizes and warpage. This facilitates the acquisition of sphere information on the wafer during subsequent processing, improving processing accuracy and yield.

[0035] In other embodiments, a buffer spring may be connected between the flattening head 713 and the flattening ring 712 to enable the flattening head 713 to slowly flatten the periphery of the wafer.

[0036] Reference Figure 2 Three XZ CNC worktables 13 are fixed to the machine frame 1 at intervals. These include an X-axis slide module 131 and a Z-axis slide module 132, which are perpendicular to each other. The X-axis slide module 131 is bolted to the machine platform 14, while the Z-axis slide module 132 is bolted to the X-axis slide module 131. The Z-axis slide module 132 is located at the end of the X-axis slide module 131 near the wafer carrier 11. The ball removal module 6, the glue dispensing module 5, and the ball replenishment module 4 are each mounted on a corresponding set of XZ CNC worktables 13, thereby achieving a sliding connection on the machine frame 1.

[0037] Reference Figure 1 and Figure 4, ball removal module 6, the ball removal module 6 includes a ball removal support 65, a ball removal needle unit 61, a defect scanner 62, a waste ball collection box 64 and an automatic detection unit 63. The ball removal support 65 is fixedly connected to the slide corresponding to the Z-axis slide module 132, and the defect scanner 62 is fixed on the ball removal support 65. The defect scanner 62 is specifically configured as a scanning camera. The waste ball collection box 64 is fixedly connected to the slide corresponding to the X-axis slide module 131, and a collection port is provided on the waste ball collection box 64. The ball removal needle unit 61 is also fixed on the ball removal support 65, and the ball removal needle unit 61 is located above the waste ball collection box 64. The automatic detection unit 63 includes a visual detector 631 and a contact sensor 632. The contact sensor 632 is fixed to the frame 1 through a bracket; the contact sensor 632 is located below the ball removal needle unit 61, and the contact sensor 632 is at the same height as the upper end surface of the crystal carrier platform 11. The visual detector 631 is specifically configured as a detection camera, and the lens of the detection camera is equipped with a scale. When detecting the displacement offset of the ball removal needle unit 61, the visual detector 631 reads the initial position of the ball removal needle unit 61, records the offset, and enters the data into the system. The ball removal needle unit 61 is then moved toward the contact sensor 632, and the Z-axis slide module 132 drives the ball removal needle unit 61 toward the contact sensor 632, so that the top of the ball removal needle unit 61 contacts the contact sensor 632. Since the contact sensor 632 and the upper end surface of the wafer carrier 11 are located at the same height, this serves as a reference. Based on the data read by the contact sensor 632, the distance between the top of the ball removal needle unit 61 and the wafer plane is calculated. If adjustment is required, the Z-axis slide module 132 is fine-tuned until the preset accuracy is achieved. After the adjustment is completed, the position of the ball removal needle unit 61 is verified. If the verification passes, the ball removal needle unit 61 can be put into use; if not, the adjustment is repeated until the requirements are met.

[0038] The ball removal needle unit 61 includes a vacuum nozzle, which is also connected to the negative pressure source 8. When the ball removal module 6 is in operation, the defect scanner 62 scans the wafer for defective or excess spheres. Then, under the action of the Z-axis slide module 132, the ball removal needle unit 61 descends until the vacuum nozzle contacts and absorbs the defective spheres. Under the action of the corresponding X-axis slide module 131, the waste ball collection box 64 slides directly below the ball removal needle unit 61, deflates the vacuum nozzle, and deposits the defective or excess spheres into the waste ball collection box 64.

[0039] Reference Figure 5The glue dispensing module 5 includes a glue dispensing support 51, a glue dispensing needle unit 52 and a glue supply unit 53 arranged on the frame 1. The glue dispensing support 51 is fixed on the slide corresponding to the Z-axis slide module 132, and the glue dispensing needle unit 52 is slidably connected to the glue dispensing support 51 through a vertical slide rail. A glue needle balancing unit 55 is also provided on the glue dispensing support 51. The glue needle balancing unit 55 includes a pressure sensor 551, an elastic balancing member 552 and a force-applying member 553. The elastic balancing member 552 is connected between the glue dispensing needle unit 52 and the glue dispensing support 51, and multiple force-applying members 553 are provided on the side of the glue dispensing needle unit 52. The force-applying member 553 is located above the glue dispensing needle unit 52 and is fixedly connected to the glue dispensing support 51. The force-applying member 553 is specifically a pressure cylinder, the piston rod of the force-applying member 553 faces the glue dispensing needle unit 52, and the pressure sensor 551 is connected between the piston rod of the force-applying member 553 and the glue dispensing needle unit 52. The force-applying member 553 can be extended and retracted to press against the dispensing needle unit 52. This is used to support the dispensing needle unit 52 during high-speed operation, dissipating its kinetic energy and preventing it from swinging up and down. The components within the needle balancing unit 55 work together to ensure controllable force from the dispensing needle unit 52 and provide real-time feedback on the pressure of the dispensing needle unit 52 contacting the wafer surface, preventing damage to the target point on the wafer during the dispensing operation. The elastic balancing member 552 can be implemented as a spring or airbag, while the force-applying member 553 can also be implemented as a robotic arm.

[0040] Reference Figure 5 The glue supply unit 53 includes a glue box 531 and a glue supply plate 532 that are spaced apart in the vertical direction; the glue box 531 is slidably connected to the guide rail in the corresponding Z-axis slide module 132 through a vertical slide rail, and the glue box 531 is located directly below the glue dispensing needle unit 52. A glue outlet is provided at the bottom of the glue box 531, and the upper end surface of the glue supply plate 532 is concave to form a ball-filling glue accumulation area, and the ball-filling glue in the glue box 531 can fall into the ball-filling glue accumulation area. One end of the glue supply plate 532 is fixedly connected to the slide in the corresponding X-axis slide module 131, realizing the sliding connection of the glue supply plate 532 below the glue box 531. When the glue supply plate 532 slides under the drive of the corresponding X-axis slide module 131, the ball-filling glue in the glue box 531 can be evenly spread on the ball-filling glue accumulation area of the glue supply plate 532.

[0041] The glue dispensing support 51 is also equipped with a fine-tuning unit 54. Specifically, this unit 54 is configured as a fine-tuning knob-type Z-axis manual slide module, and the slide within the fine-tuning knob-type Z-axis manual slide module is fixedly connected to the glue box 531. The gap between the glue box 531 and the glue supply plate 532 can be adjusted using a high-precision fine-tuning knob-type Z-axis manual slide to achieve evenly distributed glue of varying thicknesses, enabling switching between different types of shot filling, thereby improving the glue dipping effect and shot filling quality.

[0042] Reference Figure 1 and Figure 6The ball replenishment module 4 includes a ball replenishment support 43, a ball replenishment needle unit 41, and a ball box unit 42. The ball replenishment support 43 is fixedly connected to the slide of the corresponding Z-axis slide module 132; the ball replenishment needle unit 41 is fixedly connected to one end of the ball replenishment support 43. The ball replenishment needle unit 41 includes a ball replenishment nozzle, and the ball replenishment nozzle is connected to the negative pressure source 8, which controls the suction and release actions of the ball replenishment nozzle. The ball box unit 42 is located below the ball replenishment needle unit 41. The slide of the X-axis slide module 131 corresponding to the ball replenishment module 4 is fixedly connected to the ball box platform 12. The ball box unit 42 is detachably connected to the ball box platform 12, realizing the sliding connection of the ball box unit 42 below the ball replenishment needle unit 41.

[0043] Reference Figure 7 The ball housing unit 42 comprises an upper ball housing 421 and a lower ball housing 422, which are connected to each other. In this embodiment, the upper and lower ball housings 421 and 422 are fixedly connected by bolts. An air outlet gap exists between the upper and lower ball housings 421 and 422, and the width of the air outlet gap is smaller than the diameter of the ball. The upper ball housing 421 has a suction port 4211, which tapers toward the lower ball housing 422, facilitating the needle unit 41 to absorb the ball. In this embodiment, the suction port 4211 is specifically configured as a conical cavity. The lower ball housing 422 defines a ball-receiving cavity 4221. A pressure-release port 4222 is defined at the bottom of the lower ball housing 422. Both the pressure-release port 4222 and the suction port 4211 communicate with the ball-receiving cavity 4221. A leak-proof filter 423 is embedded within the pressure-release port 4222. The mesh size of the leak-proof filter 423 is smaller than the diameter of the ball to prevent the ball from falling out of the cavity 4221. The leak-proof filter 423 can be made of nylon, stainless steel or ceramic to meet different environmental requirements.

[0044] In other embodiments, the air outlet gap may be replaced by other forms of micro-gap channels, such as serpentine micro-channels or porous plate structures, to further optimize the airflow distribution.

[0045] Reference Figure 7An annular groove is formed on the end surface of the ball box platform 12, forming an annular negative pressure airway 121 between the annular groove and the lower end surface of the lower ball box 422. A vacuum interface 44 and a compressed air interface 45 are threadedly connected on the side wall of the ball box platform 12, and two gas flow paths are machined into the ball box platform 12. The vacuum interface 44 is connected to the negative pressure airway 121 through the gas flow path. By pumping air through the vacuum interface 44, the negative pressure airway 121 forms a negative pressure adsorption surface, firmly fixing the ball box unit 42 on the ball box platform 12 and achieving a detachable connection of the ball box unit 42 on the ball box platform 12. The compressed air interface 45 is connected to the compressed air port 4222 through the gas flow path within the ball box platform 12. Air is blown into the compressed air port 4222 through the compressed air interface 45. The airflow passes through the leak-proof filter 423 to form a positive pressure thrust surface, generating a positive pressure gradient field within the cavity, causing the ball in the ball cavity 4221 to be suspended. The existence of the air outlet gap increases the airflow auxiliary dispersion, keeping the ball in the dynamic airflow path, thereby effectively avoiding the arch bridge effect and increasing the speed of the ball.

[0046] When the ball replenishment module 4 is in operation, the X-axis slide module 131 drives the ball box unit 42 to move to the bottom of the ball replenishment needle unit 41, and the Z-axis slide module 132 drives the ball replenishment needle unit 41 to descend, so that the ball replenishment nozzle enters the suction port 4211, and the ball replenishment nozzle sucks up a ball, and the Z-axis slide module 132 drives the ball replenishment needle unit 41 to rise. The X-axis slide module 131 continues to drive the ball box unit 42 to move away from the ball replenishment needle unit 41, and the rotary motion mechanism 3 transfers the wafer to the bottom of the ball replenishment module 4, and drives the position on the wafer to be replenished after glue dispensing to move to the bottom of the ball replenishment nozzle. The Z-axis slide module 132 drives the ball replenishment needle unit 41 to move toward the wafer, and the ball replenishment nozzle deflates to release the ball.

[0047] The implementation principle of a ball replenishing machine in the embodiment of the present application is as follows: the various modules of the ball replenishing machine work together to achieve non-destructive, high-speed, and high-precision processing during the wafer ball replenishment process. Specifically, the ball box unit 42 uses air suspension and vacuum synergy technology to ensure the safety of the balls during the suction and transfer process; the dispensing module 5 uses an adjustable glue box 531 device and a glue needle balancing unit 55 to ensure the uniformity and stability of the colloid; and the ball removal module 6 combines visual monitoring and contact displacement sensing technology to achieve precise control of the position of the ball removal needle unit 61. This not only significantly improves the operating efficiency and reliability of the ball replenishing machine, but also reduces maintenance costs and downtime, providing a more optimal solution for the semiconductor manufacturing industry.

[0048] The above are all preferred embodiments of the present application, and are not intended to limit the scope of protection of the present application. Therefore, any equivalent changes made based on the structure, shape, and principle of the present application should be included in the scope of protection of the present application.

Claims

1. A ball replenishment module, characterized in that: The invention comprises a ball replenishing needle unit (41) and a ball box unit (42), wherein the ball box unit (42) comprises an upper ball box (421) and a lower ball box (422) connected to each other, and an air outlet gap is provided between the upper ball box (421) and the lower ball box (422); a suction port (4211) is provided on the upper ball box (421), and the suction port (4211) gradually shrinks in a direction close to the lower ball box (422); a ball accommodating cavity (4221) is provided in the lower ball box (422), and an air pressure port (4222) is provided at the bottom of the lower ball box (422), and both the air pressure port (4222) and the suction port (4211) are communicated with the ball accommodating cavity (4221).

2. A ball replenishment module according to claim 1, characterized in that: A leak-proof filter (423) is provided in the air pressure port (4222).

3. A ball replenishing machine, characterized in that: The device comprises the ball replenishment module according to claim 1 or 2, further comprising: A frame (1), wherein a crystal carrier platform (11) is movably provided on the frame (1), and the ball replenishing needle unit (41) is slidably provided on the frame (1); a ball box platform (12) is provided on the frame (1), a negative pressure airway (121) is formed between the lower ball box (422) and the ball box platform (12), a vacuum joint (122) and a compressed air joint (123) are connected on the side wall of the ball box platform (12), the vacuum joint (122) is connected to the negative pressure airway (121), and the compressed air joint (123) is connected to the compressed air port (4222); A glue dispensing module (5) comprising a glue dispensing support (51) arranged on the frame (1), a glue dispensing needle unit (52) arranged on the glue dispensing support (51), and a glue supply unit (53), wherein the glue dispensing needle unit (52) is slidably arranged on the glue dispensing support (51); The ball removal module (6) comprises a ball removal needle unit (61), a defect scanner (62) and an automatic detection unit (63) arranged on the frame (1), wherein the ball removal needle unit (61) is slidably arranged on the frame (1), the defect scanner (62) is used to detect ball defects, and the automatic detection unit (63) is used to detect the position offset of the ball removal needle unit (61) before and after movement.

4. A ball replenishing machine according to claim 3, characterized in that: The glue supply unit (53) comprises a glue box (531) and a glue supply plate (532), wherein a glue outlet is provided at the bottom of the glue box (531), and the glue supply plate (532) is slidably provided below the glue box (531); a fine-tuning unit (54) is provided on the glue dispensing support (51), and the fine-tuning unit (54) is used to adjust the gap between the glue box (531) and the glue supply plate (532).

5. A ball replenishing machine according to claim 3, characterized in that: The dispensing module (5) further includes a glue needle balancing unit (55), the glue needle balancing unit (55) including a pressure sensor (551), an elastic balancing member (552) and a force-applying member (553), the elastic balancing member (552) being connected to the side of the dispensing needle unit (52), the force-applying member (553) being connected to the dispensing support (51) for abutting against the dispensing needle unit (52), and the pressure sensor (551) being located between the force-applying member (553) and the dispensing needle unit (52).

6. A ball replenishing machine according to claim 3, characterized in that: The automatic detection unit (63) includes a visual detector (631) and a contact sensor (632), wherein the visual detector (631) is used to detect the vertical offset of the ball removal needle unit (61), and the contact sensor (632) is located at the same height as the upper end surface of the crystal carrier platform (11).

7. The ball replenishing machine according to claim 3, characterized in that: The frame (1) is also provided with a wafer calibration fine-tuning system, including a visual positioning unit (2) and a rotary motion mechanism (3), wherein the visual positioning unit (2) is fixed on the frame (1), and the rotary motion mechanism (3) includes a two-dimensional moving module (31), a rotary drive module (32) and a rotary platform (33) arranged on the two-dimensional moving module (31), the crystal carrier platform (11) is rotatably arranged on the rotary platform (33), and the rotary drive module (32) is used to drive the crystal carrier platform (11) to rotate.

8. The ball replenishing machine according to claim 3, characterized in that: The frame (1) is further provided with a wafer flattening system (7), and the wafer flattening system (7) comprises a flattening mechanism (71) and a closed-loop control module (72); A plurality of adsorption holes (111) are provided on the crystal-carrying platform (11), and the adsorption holes (111) are connected to a negative pressure source (8); The flattening mechanism (71) comprises an elevator seat (711) and a flattening ring (712) connected to one end of the elevator seat (711), the flattening ring (712) comprises a ring body and a flattening head (713) fixed on the flattening ring (712), and a plurality of the flattening heads (713) are arranged at intervals around the axis of the flattening ring (712); The closed-loop control module (72) comprises a thickness measuring unit (721) and a distance measuring sensor (722); the thickness measuring unit (721) is arranged on the frame (1) and is used to measure the thickness of the wafer; the distance measuring sensor (722) is arranged on the flattening ring (712) and is used to monitor the distance between the flattening head (713) and the wafer.

9. The ball replenishing machine according to claim 8, characterized in that: A plurality of flattening rings (712) are coaxially arranged at the end of the elevator seat (711), and each flattening ring (712) has a different radius.

10. The ball replenishing machine according to claim 8, characterized in that: A plurality of lifting pins (112) are slidably connected to the crystal carrier platform (11), and after the lifting pins (112) are lowered, the upper end surfaces of the lifting pins (112) are coplanar with the upper end surface of the crystal carrier platform (11).

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