A single wafer cleaning machine

Abstract

The application provides a single-chip wafer cleaning machine, and relates to the technical field of single-chip wafer cleaning machines.The single-chip wafer cleaning machine comprises a cleaning machine frame, an inner chamber and a spraying mechanism.The inner chamber is arranged inside the cleaning machine frame.The surface of the cleaning machine frame is provided with a central processing unit.The inner wall bottom end of the inner chamber is provided with an auxiliary assembly.The auxiliary assembly comprises a base.The bottom end of the base is fixedly connected with the inner wall bottom end of the inner chamber.A stepping motor is arranged inside the base.The output end of the stepping motor is fixedly connected with a rotating frame.A seepage hole is arranged in the side wall of the rotating frame.The cross-sectional dimension of the base is adapted to the cross-sectional dimension of the bottom end of the inner chamber.The application solves the problem that the surface of the wafer will be attached with more industrial dirt during the processing of the wafer, and the surface of the wafer needs to be cleaned at this time.However, the cleaning head arranged in the conventional cleaning device cannot be adjusted in angle, thereby causing the problem that it is inconvenient to clean the surface of the wafer in all aspects.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of single wafer cleaning machines, in particular to a single wafer cleaning machine. BACKGROUND

[0002] The single wafer cleaning machine is a device specially used for cleaning wafers in the semiconductor manufacturing process. It is mainly used to remove contaminants, particles, residues and other chemical contaminants on the surface of the wafer to ensure the cleanliness of the wafer surface, thereby improving the quality and reliability of subsequent processes such as photolithography, deposition, etc. It is relatively common in the process of processing production.

[0003] The prior art such as the invention disclosed in CN115116905B discloses a single wafer cleaning machine, which comprises a cleaning machine body, a cleaning pool, a water uniformizing arm, a cleaning liquid nozzle and an ultrapure water nozzle are arranged in the cleaning machine body, and a bearing mechanism is further arranged; the bearing mechanism comprises a rotary table, a vertical pipe element, a circular plate element, a horizontal partition plate and a compression air bag, a ventilation hole is formed in the top of the rotary table; the upper end of the compression air bag is provided with a ventilation pipe; a centering assembly is further arranged on the cleaning pool, the centering assembly comprises three thrusting mechanisms, each thrusting mechanism comprises a radial top rod and a translational vertical rod, three transmission blocks are fixedly connected to the outside of the circular plate element, and the lower end of each translational vertical rod is in surface contact with the corresponding transmission block. The present application changes the air pressure in the rotary table and the vertical pipe element, uses the external atmospheric pressure to generate pressure on the wafer, and then fixes the wafer on the rotary table; the present application positions the wafer through the centering assembly before fixing the wafer, which can greatly reduce the deviation of the wafer axis from the rotary table axis.

[0004] In the process of processing the wafer, it is found that the surface of the wafer will be attached with a large amount of industrial dirt at this time, and the cleaning head arranged in the usual cleaning device cannot be adjusted in angle, thereby causing the problem that it is inconvenient to clean the surface of the wafer in all aspects. SUMMARY

[0005] The present application aims to solve the shortcomings in the prior art that in the process of processing the wafer, the surface of the wafer will be attached with a large amount of industrial dirt at this time, and the cleaning head arranged in the usual cleaning device cannot be adjusted in angle, thereby causing the problem that it is inconvenient to clean the surface of the wafer in all aspects.

[0006] In order to achieve the above object, the application adopts the following technical scheme: A single-chip wafer cleaning machine, comprising a cleaning machine frame, an inner chamber and a spraying mechanism, the inner chamber is arranged in the inside of the cleaning machine frame, the surface of the cleaning machine frame is provided with a central processing unit, the inner wall bottom end of the inner chamber is installed with an auxiliary assembly, the auxiliary assembly comprises a base, the bottom end of the base is fixedly connected with the inner wall bottom end of the inner chamber, a stepping motor is installed in the inside of the base, the output end of the stepping motor is fixedly connected with a rotating frame, the side wall of the rotating frame is provided with a seepage hole, the cross-sectional dimension of the base is matched with the cross-sectional dimension of the bottom end of the inner chamber, a rotating frame is installed on one side surface of the base, a mounting plate is arranged on one side of the rotating frame, the spraying mechanism is arranged on the surface of the mounting plate corresponding to the position of the rotating frame, the spraying mechanism comprises a driving rod, a servo motor, a connecting pipe and a connecting pipe, the two ends of the driving rod are rotatably connected with the lower surface of the mounting plate, the servo motor is fixedly connected with the lower surface of the mounting plate, the output end of the servo motor is fixedly connected with one end of the driving rod, the arc surface of the driving rod is threadedly connected with a connecting shaft at both ends, the bottom end of the two connecting shafts is fixedly connected with the same spraying pipe, a plurality of spray heads are fixedly connected on the lower surface of the spraying pipe, the surface of the connecting pipe is fixedly connected with a fixed frame, one side of the fixed frame is fixedly connected with the surface of the mounting plate, the side wall of the inner chamber is fixedly connected with a water tank, a high-pressure pump is installed in the inside of the water tank, the output end of the high-pressure pump is fixedly communicated with the connecting pipe and the connecting pipe through the connecting pipe, the connecting pipe is a plastic hose, one side of the mounting plate is fixedly connected with a limiting plate, a limiting groove is formed in the surface of the limiting plate, the cross section of the limiting groove is arc-shaped, a limiting rod is fixedly connected on the surface of the spraying pipe, the cross section of one end of the limiting rod is "T" shaped, the arc surface of the limiting rod is movably connected with the inner wall of the limiting groove, the bottom end of the connecting pipe is rotatably connected with one side of the spraying pipe through the connecting pipe.

[0007] The effect of the above components is that in the process of processing and producing wafers, the surface of the wafer will be attached with stains, at which time the surface of the wafer needs to be cleaned, at which time the wafer is placed in the inner chamber of the cleaning machine frame and cleaned by the spraying mechanism, in this process, the spraying mechanism can deflect the angle of the spraying pipe and the spray head, and can also move the spraying pipe horizontally, which is helpful for the full-range cleaning operation of the wafer.

[0008] Preferably, the inner wall of the upper end of the connecting pipe is fixedly connected with a baffle, the upper surface of the baffle is abutted with a filter cartridge, the filter cartridge is an activated carbon cartridge, a plurality of filter holes are formed in the surface of the filter cartridge.

[0009] The effect achieved by the above component is that when the cleaning water in the water tank is delivered into the spray pipe and then the flushing process is performed by the spray head arranged on the lower surface of the spray pipe, the filter cylinder of activated carbon material arranged in the connecting pipe can be used for auxiliary filtration, which is helpful for energy saving and environmental protection.

[0010] Preferably, an angle scale table is arranged on the surface of the limiting plate corresponding to the position of the limiting groove, and the size of the angle scale table is adapted to the cross-sectional size of the limiting plate.

[0011] The effect achieved by the above component is that the angle of deflection of the entire spray pipe can be effectively observed through the arrangement of the angle scale table on the surface of the limiting plate.

[0012] Preferably, the spray pipe is a stainless steel pipe, and the length size of the spray pipe is adapted to the cross-sectional size of the rotating frame.

[0013] The effect achieved by the above component is that the spray pipe made of stainless steel is widely used in some humid environments or places with high requirements due to its excellent corrosion resistance and oxidation resistance.

[0014] Preferably, an auxiliary material mechanism is arranged on one side of the connecting pipe, the auxiliary material mechanism comprises a butt joint pipe, the bottom end of the butt joint pipe is fixedly communicated with the connecting pipe, the upper end of the butt joint pipe is fixedly communicated with a bearing pipe, the upper end of the bearing pipe is fixedly communicated with a delivery pipe, one side of the water tank is fixedly connected with an auxiliary cylinder, the bottom end of the auxiliary cylinder is fixedly communicated with the delivery pipe, the inner walls of the bottom end of the bearing pipe are provided with inner sliding grooves on both sides, the surface of the bearing pipe is provided with outer sliding grooves corresponding to the positions of the inner sliding grooves, the inner walls of the inner sliding grooves are slidably connected with inner magnetic blocks, the inner walls of the outer sliding grooves are slidably connected with outer magnetic blocks, the outer magnetic blocks are attracted to the inner magnetic blocks, the surfaces of the electric push rods are fixedly connected with the outer magnetic blocks, and the inner magnetic blocks are fixedly connected with the same opening and closing column at the end close to each other.

[0015] The effect achieved by the above component is that during the cleaning process of the wafer surface, the auxiliary material mechanism arranged on one side of the spray mechanism can be used for operation to effectively increase the cleaning effect, which is helpful for delivering additional cleaning additive into the connecting pipe to mix with the clean water, so as to further clean the wafer surface.

[0016] Preferably, a drainage block is fixedly connected to the inner wall of the bottom end of the opening and closing column, and the cross section of the drainage block is in the shape of a sharp cone.

[0017] The effect achieved by the above-mentioned component is that the flow guide block with a sharp conical cross-section can quickly guide the cleaning additive liquid delivered in the auxiliary material cylinder.

[0018] Preferably, the bottom end of the opening and closing column is fixedly connected with a sealing ring, and the inner wall of the closing plate is provided with a sealing groove, and the inner wall surface of the sealing groove is in abutment with the surface of the sealing ring.

[0019] The effect achieved by the above-mentioned component is that the abutment limiting between the sealing groove and the sealing ring can further increase the sealing property, so that better opening and closing operations can be performed between the bearing pipe and the butt joint pipe.

[0020] Preferably, the inner wall bottom end of the butt joint pipe is fixedly connected with an auxiliary frame, the upper end of the auxiliary frame is rotatably connected with a rotating frame, the cross-section of the rotating frame is in a sharp conical shape, the surface of the rotating frame is uniformly fixedly connected with a plurality of connecting plates, and the cross-section of the connecting plate is in an inclined shape.

[0021] The effect achieved by the above-mentioned component is that the rotating frame arranged in the butt joint pipe can rotate by the inclined connecting plates arranged on the surface and the delivered cleaning liquid, so that the mixing between the cleaning additive liquid and the clean water can be facilitated, and better cleaning operations can be performed.

[0022] Preferably, the inner wall of the rotating frame is provided with a clamping mechanism, the clamping mechanism comprises a positioning frame and a placement plate, the surface of the positioning frame is fixedly connected with the surface of the rotating frame, the upper end inner wall of the positioning frame is fixedly connected with a support plate, the surface of the placement plate is uniformly provided with a plurality of extrusion holes, the lower surface of the placement plate is fixedly connected with a guide rail at positions corresponding to the extrusion holes, the inner wall cross-section of the guide rail is in a concave shape, the inner wall of the guide rail is slidably connected with a guide block, the cross-section size of the guide block is adapted to the inner wall cross-section size of the guide rail, the upper end of the guide block is connected with a connecting column, the circular arc surface of the connecting column is threadedly connected with an extrusion roller, the extrusion roller is a sponge roller, the lower surface of the guide block is fixedly connected with a rack, the upper surface of the rack is slidably penetrated with the lower surface of the guide rail, one side of the guide rail is fixedly connected with a fixed plate, the cross-section of the fixed plate is in an "L" shape, the lower surface of the fixed plate is fixedly connected with the surface of the support plate, the inner wall of the positioning frame is fixedly connected with an inlaid plate, the surface of the inlaid plate is fixedly connected with a driving motor, the output end of the driving motor is fixedly connected with an adjusting rod, the upper end of the adjusting rod is rotatably connected with the lower surface of the placement plate, the bottom end circular arc surface of the adjusting rod is fixedly connected with a support frame, the upper surface of the support frame is fixedly connected with a tooth ring, the lower surface of the placement plate is rotatably connected with a gear at positions corresponding to the rack and the tooth ring, the gear tooth surface is engaged with the rack and the tooth ring tooth surface, the upper surface of the placement plate is fixedly connected with a support pad at positions corresponding to the adjusting rod, and the support pad is a rubber pad.

[0023] The effect achieved by the above-mentioned components is that, in the process of cleaning the wafer, in order to avoid the wafer from being offset, the clamping mechanism arranged on the inner wall of the rotating frame is used for auxiliary clamping and limiting, the placing plate arranged in the clamping mechanism is used for placing the wafer, then the position of the extrusion roller sliding on the surface of the placing plate is controlled, and the wafer can be quickly clamped and fixed on the periphery.

[0024] Preferably, the lower surface of the placing plate is fixedly connected with a pneumatic cylinder, the output end of the pneumatic cylinder is fixedly connected with an extrusion block, the side surface of the extrusion block close to the gear ring is in a bevel gear shape, and the surface of the extrusion block is connected with the tooth surface of the gear ring.

[0025] The effect achieved by the above-mentioned components is that, in the process of cleaning the wafer, in order to avoid the wafer from being offset, the clamping mechanism arranged on the inner wall of the rotating frame is used for auxiliary clamping and limiting, the placing plate arranged in the clamping mechanism is used for placing the wafer, then the position of the extrusion roller sliding on the surface of the placing plate is controlled, and the wafer can be quickly clamped and fixed on the periphery.

[0026] Compared with the prior art, the application has the advantages and positive effects that,

[0027] 1、In the application, the spraying pipe and the nozzle corresponding to the rotating frame on the lower surface of the mounting plate can be deflected and horizontally moved in position, the limiting rod fixed on the surface of the spraying pipe can be actively controlled along the limiting groove on the surface of the limiting plate, and therefore the surface of the wafer can be quickly and conveniently cleaned.

[0028] 2、In the application, the inner wall between the bearing pipe on one side of the adapter pipe and the butt joint pipe can be opened and closed by the auxiliary material mechanism, so that the auxiliary cleaning additive in the auxiliary material cylinder is transported, the cleaning additive is mixed with clean water, in the process, the adsorption movement between the outer magnetic block and the inner magnetic block is driven by the electric push rod, the inner magnetic block drives the opening and closing column to ascend and descend, the opening and closing column is inserted into and separated from the closing plate in the inner wall of the upper end of the butt joint pipe, and therefore the transport and control of the cleaning additive are facilitated.

[0029] 3、In the application, the wafer can be extruded and clamped on the surface of the placing plate by the clamping mechanism, the extrusion roller in the guide rail on the surface of the placing plate is moved by the gear ring, the gear and the rack, the extrusion roller extrudes and clamps the wafer, and therefore the wafer cannot be offset and shaken in the cleaning process. BRIEF DESCRIPTION OF DRAWINGS

[0030] Figure 1 A three-dimensional structure schematic diagram of a single-chip wafer cleaning machine is provided for the application.

[0031] Figure 2 An internal structure schematic diagram of a three-dimensional structure of a single-chip wafer cleaning machine is provided for the application.

[0032] Figure 3 A single wafer cleaning machine Figure 2 of cross-sectional structure schematic diagram;

[0033] Figure 4 A single wafer cleaning machine of spray mechanism structure schematic diagram is proposed to the application;

[0034] Figure 5 A single wafer cleaning machine of spray mechanism local structure schematic diagram is proposed to the application;

[0035] Figure 6 A single wafer cleaning machine Figure 5 of A enlarged structure schematic diagram;

[0036] Figure 7 A single wafer cleaning machine Figure 4 of B enlarged structure schematic diagram;

[0037] Figure 8 A single wafer cleaning machine of auxiliary material mechanism structure schematic diagram is proposed to the application;

[0038] Figure 9 A single wafer cleaning machine of opening and closing column local structure schematic diagram is proposed to the application;

[0039] Figure 10 A single wafer cleaning machine of clamping mechanism structure schematic diagram is proposed to the application;

[0040] Figure 11 A single wafer cleaning machine of clamping mechanism local structure schematic diagram is proposed to the application.

[0041] Legend: 1, washing machine frame; 2, inner chamber; 3, central processing unit; 4, rotating frame; 5, rotating frame; 6, mounting plate; 7, spraying mechanism; 701, spraying pipe; 702, spray head; 703, servo motor; 704, drive rod; 705, limiting rod; 706, limiting plate; 707, limiting groove; 708, angle scale; 709, water tank; 710, high-pressure pump; 711, connecting pipe; 712, adapter pipe; 713, fixed frame; 714, filter cartridge; 715, baffle; 716, filter hole; 717, connecting shaft; 8, auxiliary material mechanism; 801, auxiliary material cylinder; 802, conveying pipe; 803, bearing pipe; 804, outer sliding groove; 805, inner sliding groove; 806, opening and closing column; 807, inner magnetic block; 808, electric push rod; 809, outer magnetic block; 810, through hole; 811, butt joint pipe; 812, drainage block; 813, sealing ring; 814, closing plate; 815, sealing groove; 816, connecting plate; 817, auxiliary frame; 818, rotating frame; 9, clamping mechanism; 901, positioning frame; 902, support plate; 903, inlaid plate; 904, drive motor; 905, support frame; 906, gear ring; 907, guide rail; 908, gear; 909, rack; 910, fixed plate; 911, air cylinder; 912, extrusion block; 913, extrusion hole; 914, connecting column; 915, extrusion roller; 916, guide block; 917, adjusting rod; 918, placing plate; 919, support pad; 10, auxiliary assembly; 101, base; 102, seepage hole; 103, stepper motor. DETAILED DESCRIPTION

[0042] In order to enable the above-mentioned objects, features and advantages of the present application to be more clearly understood and to be put into practical application, the following will describe the present application in further detail with reference to the accompanying drawings and embodiments. It should be explained that the embodiments of the present application and the features in the embodiments can be combined with each other without conflict.

[0043] In the following description, many specific details are set forth in order to provide a thorough understanding of the present application. However, the present application can be practiced in different ways from those described, and so the present application is not limited to the specific embodiments disclosed in the following description.

[0044] As Figures 1-3As shown, the present application provides a single wafer cleaning machine, which comprises a cleaning machine frame 1, an inner chamber 2 and a spraying mechanism 7, the inner chamber 2 is arranged inside the cleaning machine frame 1, the surface of the cleaning machine frame 1 is provided with a central processing unit 3, the inner wall bottom end of the inner chamber 2 is installed with an auxiliary assembly 10, the auxiliary assembly 10 comprises a base 101, the bottom end of the base 101 is fixedly connected with the inner wall bottom end of the inner chamber 2, the inside of the base 101 is installed with a stepping motor 103, the output end of the stepping motor 103 is fixedly connected with a rotating frame 4, the side wall of the rotating frame 4 is provided with a seepage hole 102, the cross-sectional dimension of the base 101 is matched with the bottom end cross-sectional dimension of the inner chamber 2, one side surface of the base 101 is installed with a rotating frame 5, one side of the rotating frame 5 is provided with a mounting plate 6, the spraying mechanism 7 is arranged on the surface of the mounting plate 6 corresponding to the position of the rotating frame 4, one side arc surface of the connecting pipe 712 is provided with a auxiliary material mechanism 8, the inner wall of the rotating frame 4 is provided with a clamping mechanism 9.

[0045] The specific settings and effects of the spraying mechanism 7, the auxiliary material mechanism 8 and the clamping mechanism 9 will be described below.

[0046] As Figure 4 , Figure 5 and Figure 6As shown, the spraying mechanism 7 comprises a driving rod 704, a servo motor 703, a connecting pipe 712 and a connecting pipe 711, both ends of the driving rod 704 are rotatably connected with the lower surface of the mounting plate 6, the servo motor 703 is fixedly connected with the lower surface of the mounting plate 6, the output end of the servo motor 703 is fixedly connected with one end of the driving rod 704, the arc surface of the driving rod 704 is threadedly connected with two connecting shafts 717, the bottom ends of the two connecting shafts 717 are fixedly connected with the same spraying pipe 701, the lower surface of the spraying pipe 701 is fixedly connected with a plurality of spray heads 702, the surface of the connecting pipe 712 is fixedly connected with a fixed frame 713, one side of the fixed frame 713 is fixedly connected with the surface of the mounting plate 6, the side wall of the inner chamber 2 is fixedly connected with a water tank 709, the inside of the water tank 709 is mounted with a high-pressure pump 710, the output end of the high-pressure pump 710 is fixedly communicated with the connecting pipe 712 through the connecting pipe 711, the connecting pipe 711 is a plastic hose, one side of the mounting plate 6 is fixedly connected with a limiting plate 706, the surface of the limiting plate 706 is provided with a limiting groove 707, the cross section of the limiting groove 707 is arc-shaped, the surface of the spraying pipe 701 is fixedly connected with a limiting rod 705, one end of the limiting rod 705 is in "T" shape, the arc surface of the limiting rod 705 is movably connected with the inner wall of the limiting groove 707, the bottom end of the connecting pipe 712 is rotatably connected with one side of the spraying pipe 701 through the connecting pipe 711, the upper end of the inner wall of the connecting pipe 712 is fixedly connected with a baffle 715, the upper surface of the baffle 715 is abutted with a filter cylinder 714, the filter cylinder 714 is an activated carbon cylinder, the surface of the filter cylinder 714 is provided with a plurality of filter holes 716, the surface of the limiting plate 706 is provided with an angle scale table 708 at the position corresponding to the limiting groove 707, the size of the angle scale table 708 is adapted to the cross section size of the limiting plate 706, the spraying pipe 701 is a stainless steel pipe, the length size of the spraying pipe 701 is adapted to the cross section size of the rotating frame 4.

[0047] As Figure 7 , Figure 8 and Figure 9As shown, the auxiliary material mechanism 8 comprises a docking pipe 811, the bottom end of the docking pipe 811 is fixedly communicated with the connecting pipe 712, the upper end of the docking pipe 811 is fixedly communicated with a bearing pipe 803, the upper end of the bearing pipe 803 is fixedly communicated with a conveying pipe 802, one side of the water tank 709 is fixedly connected with an auxiliary material cylinder 801, the bottom end of the auxiliary material cylinder 801 is fixedly communicated with the conveying pipe 802, the inner wall of the bottom end of the bearing pipe 803 is provided with an inner sliding groove 805 on both sides, the surface of the bearing pipe 803 is provided with an outer sliding groove 804 at the position corresponding to the inner sliding groove 805, the inner wall of the inner sliding groove 805 is slidably connected with an inner magnetic block 807, the inner wall of the outer sliding groove 804 is slidably connected with an outer magnetic block 809, the outer magnetic block 809 is adsorbed with the inner magnetic block 807, the surfaces of both sides of the bearing pipe 803 are fixedly connected with an electric push rod 808, the output end of the electric push rod 808 is fixedly connected with the surface of the outer magnetic block 809, one end of the two inner magnetic blocks 807 close to each other is fixedly connected with the same opening and closing column 806, the bottom end of the opening and closing column 806 is provided with a through hole 810 on both sides, the upper end of the docking pipe 811 is fixedly connected with a closing plate 814 at the position corresponding to the bottom end of the opening and closing column 806, the inner wall of the closing plate 814 is inserted with the surface of the bottom end of the opening and closing column 806, the inner wall cross section size of the closing plate 814 is matched with the cross section size of the opening and closing column 806, the inner wall bottom end of the opening and closing column 806 is fixedly connected with a drainage block 812, the cross section of the drainage block 812 is in the shape of a sharp cone, the bottom end arc surface of the opening and closing column 806 is fixedly connected with a sealing ring 813, the inner wall of the closing plate 814 is provided with a sealing groove 815, the inner wall surface of the sealing groove 815 is in abutment with the surface of the sealing ring 813, the inner wall bottom end of the connecting pipe 712 is fixedly connected with an auxiliary frame 817, the upper end of the auxiliary frame 817 is rotatably connected with a rotating frame 818, the cross section of the rotating frame 818 is in the shape of a sharp cone, the surface of the rotating frame 818 is uniformly fixedly connected with a plurality of connecting plates 816, the cross section of the connecting plate 816 is in the shape of an inclination.

[0048] As Figure 10 and Figure 11As shown, the clamping mechanism 9 comprises a positioning frame 901, a placement plate 918, the surface of the positioning frame 901 is fixedly connected with the surface of the rotating frame 4, the upper end inner wall of the positioning frame 901 is fixedly connected with a support plate 902, the surface of the placement plate 918 is uniformly provided with a plurality of extrusion holes 913, the lower surface of the placement plate 918 is fixedly connected with guide rails 907 at positions corresponding to the extrusion holes 913, the inner wall section of the guide rail 907 is in the shape of a Chinese character "K", the inner wall of the guide rail 907 is slidingly connected with guide blocks 916, the section size of the guide block 916 is adapted to the section size of the inner wall of the guide rail 907, the upper end of the guide block 916 is connected with a connecting column 914, the arc surface of the connecting column 914 is threadedly connected with an extrusion roller 915, the extrusion roller 915 is a sponge roller, the lower surface of the guide block 916 is fixedly connected with a rack 909, the upper surface of the rack 909 slidingly penetrates the lower surface of the guide rail 907, one side of the guide rail 907 is fixedly connected with a fixed plate 910, the section of the fixed plate 910 is in the shape of "L", the lower surface of the fixed plate 910 is fixedly connected with the surface of the support plate 902, the inner wall of the positioning frame 901 is fixedly connected with an inlaid plate 903, the surface of the inlaid plate 903 is fixedly connected with a driving motor 904, the output end of the driving motor 904 is fixedly connected with an adjusting rod 917, the upper end of the adjusting rod 917 is rotatably connected with the lower surface of the placement plate 918, the bottom end arc surface of the adjusting rod 917 is fixedly connected with a support frame 905, the upper surface of the support frame 905 is fixedly connected with a gear ring 906, the lower surface of the placement plate 918 is rotatably connected with a gear wheel 908 at positions corresponding to the rack 909 and the gear ring 906, the gear surface of the gear wheel 908 is engaged with the gear surfaces of the rack 909 and the gear ring 906, the upper surface of the placement plate 918 is fixedly connected with a support pad 919 at a position corresponding to the adjusting rod 917, the support pad 919 is a rubber pad, the lower surface of the placement plate 918 is fixedly connected with an air cylinder 911, the output end of the air cylinder 911 is fixedly connected with an extrusion block 912, one side of the extrusion block 912 close to the gear ring 906 is in the shape of a bevel gear, the surface of the extrusion block 912 is clamped with the gear surface of the gear ring 906.

[0049] The whole working principle is that in the process of processing the wafer, the surface of the wafer needs to be cleaned, at this time the wafer is placed in the inner chamber 2 arranged in the cleaning machine frame 1, the wafer is placed in the rotating frame 4, the position is fixed by the clamping mechanism 9 arranged in the rotating frame 4, the single wafer is placed on the surface of the placing plate 918, then the driving motor 904 in the positioning frame 901 is started, the driving motor 904 drives the adjusting rod 917 to rotate, the support frame 905 on the surface of the adjusting rod 917 drives the gear ring 906 to rotate, so that the gear ring 906 drives the gear 908 arranged on the lower surface of the placing plate 918 to rotate, at the same time drives the rack 909 to slide along the guide rail 907, at this time the extrusion roller 915 sliding along the extrusion slot on the surface of the placing plate 918 will extrude and fix the wafer, then the air cylinder 911 on the lower surface of the placing plate 918 is started, the air cylinder 911 drives the extrusion block 912 to clamp and fix the tooth surface of the gear ring 906, at this time the position of the whole placing plate 918 cannot be deviated, at this time the whole placing plate 918, the positioning frame 901 and the wafer are rotated by the rotating frame 4, and the full range of spraying operation can be realized.

[0050] In the process of spraying and cleaning the wafer, the whole spraying mechanism 7 is moved to the upper side of the rotating frame 4 and the wafer by the rotating frame 5 and the mounting plate 6, then the high-pressure pump 710 in the water tank 709 is started, the high-pressure pump 710 sends the cleaning water to the spraying pipe 701 through the connecting pipe 711 and the connecting pipe 712, and then the wafer is sprayed and cleaned by the nozzle 702 on the lower surface of the spraying pipe 701, in this process, the servo motor 703 on the lower surface of the mounting plate 6 is started, the servo motor 703 drives the driving rod 704 to rotate, at this time the driving rod 704 arc surface will drive the spraying pipe 701 fixed by the connecting shaft 717 to rotate, at the same time the limiting rod 705 fixed on the surface of the spraying pipe 701 will slide along the limiting slot 707 arranged on the surface of the limiting plate 706, when the limiting rod 705 moves to both ends of the limiting slot 707, the limiting rod 705 cannot continue to rotate, only the horizontal movement of the spraying pipe 701 can be driven, so that the spraying pipe 701 can be deflected in angle and moved horizontally in position during use, so that the spraying pipe 701 and the nozzle 702 can effectively clean the surface of the wafer, when the cleaning water is sent by the connecting pipe 712, the filter cylinder 714 made of activated carbon on the upper end of the connecting pipe 712 can be used for filtering and cleaning, which is helpful to energy saving and environmental protection.

[0051] In the process of cleaning the surface of the wafer by the cleaning water in the water tank 709, in order to further deep cleaning, the auxiliary material mechanism 8 arranged on one side of the adapter pipe 712 can be used to store the cleaning additive in the auxiliary material cylinder 801, and when the auxiliary use is needed, only the electric push rod 808 is started to drive the outer magnetic block 809 to slide along the outer sliding groove 804, at this time the outer magnetic block 809 in the bearing pipe 803 is adsorbed with the inner magnetic block 807, so that the inner magnetic block 807 drives the opening and closing column 806 to insert and separate with the closing plate 814 fixed on the inner wall of the adapter pipe 811, so that the whole connecting pipe 711 is communicated with the bearing pipe 803, at this time the cleaning additive will be delivered to the adapter pipe 712, the cleaning additive is delivered by the through hole 810 opened on the surface of the opening and closing column 806, and is shunted by the drainage block 812, so that the cleaning water and the cleaning additive are mixed, then the rotating frame 818 and the connecting plate 816 in the adapter pipe 712 are rotated and mixed, so that the mixing efficiency can be further improved.

[0052] The above is only the preferred embodiment of the present application, and is not intended to limit the other forms of the present application. Any skilled person in the art can use the disclosed technical content to make changes or modifications to equivalent embodiments applied to other fields, but any simple modification, equivalent change and modification made on the basis of the technical essence of the present application to the above embodiments without departing from the technical solution content of the present application still belongs to the protection scope of the technical solution of the present application.

Claims

1. A single wafer cleaning machine comprising a cleaning machine frame (1), an inner chamber (2) and a spraying mechanism (7), characterized in that: The inner chamber (2) is arranged in the inside of the cleaning machine frame (1), the surface side of the cleaning machine frame (1) is provided with a central processing unit (3), the inner wall bottom end of the inner chamber (2) is installed with an auxiliary assembly (10), the auxiliary assembly (10) comprises a base (101), the bottom end of the base (101) is fixedly connected with the inner wall bottom end of the inner chamber (2), a stepping motor (103) is installed in the inside of the base (101), the output end of the stepping motor (103) is fixedly connected with a rotating frame (4), the side wall of the rotating frame (4) is provided with a seepage hole (102), the section size of the base (101) is matched with the bottom end section size of the inner chamber (2), the side surface of the base (101) is installed with a rotating frame (5), the side of the rotating frame (5) is provided with a mounting plate (6), the spraying mechanism (7) is arranged on the surface of the mounting plate (6) corresponding to the position of the rotating frame (4), the spraying mechanism (7) comprises a driving rod (704), a servo motor (703), a connecting pipe (711) and a connecting pipe (711), the both ends of the driving rod (704) are rotatably connected with the lower surface of the mounting plate (6), the servo motor (703) is fixedly connected with the lower surface of the mounting plate (6), the output end of the servo motor (703) is fixedly connected with one end of the driving rod (704), the arc surface of the driving rod (704) is threadedly connected with a connecting shaft (717) at both ends, the bottom ends of the two connecting shafts (717) are fixedly connected with the same spraying pipe (701), the lower surface of the spraying pipe (701) is fixedly connected with a plurality of spray heads (702), the surface of the connecting pipe (712) is fixedly connected with a fixed frame (713), one side of the fixed frame (713) is fixedly connected with the surface of the mounting plate (6), the side wall of the inner chamber (2) is fixedly connected with a water tank (709), the inside of the water tank (709) is installed with a high-pressure pump (710), the output end of the high-pressure pump (710) is fixedly communicated with the connecting pipe (711) and the connecting pipe (712) by means of the connecting pipe (711), the connecting pipe (711) is a plastic hose, one side of the mounting plate (6) is fixedly connected with a limiting plate (706), the surface of the limiting plate (706) is provided with a limiting groove (707), the section of the limiting groove (707) is arc-shaped, the surface of the spraying pipe (701) is fixedly connected with a limiting rod (705), one end section of the limiting rod (705) is "T"-shaped, the arc surface of the limiting rod (705) is movably connected with the inner wall of the limiting groove (707), the bottom end of the connecting pipe (712) is rotatably connected with one side of the spraying pipe (701) by means of the connecting pipe (711), the inner wall of the rotating frame (4) is provided with a clamping mechanism (9), the clamping mechanism (9) comprises a positioning frame (901) and a placing plate (918), the surface of the positioning frame (901) is fixedly connected with the surface of the rotating frame (4), the upper end inner wall of the positioning frame (901) is fixedly connected with a supporting plate (902),The surface of the placement plate (918) is uniformly provided with a plurality of extrusion holes (913), the lower surface of the placement plate (918) is fixedly connected with a guide rail (907) at the position corresponding to the extrusion hole (913), the inner wall section of the guide rail (907) is concave-shaped, the inner wall of the guide rail (907) is slidably connected with a guide block (916), the section size of the guide block (916) is matched with the inner wall section size of the guide rail (907), the upper end of the guide block (916) is connected with a connecting column (914), the arc surface of the connecting column (914) is threadedly connected with an extrusion roller (915), the extrusion roller (915) is a sponge roller, the lower surface of the guide block (916) is fixedly connected with a rack (909), the upper surface of the rack (909) slidably penetrates the lower surface of the guide rail (907), one side of the guide rail (907) is fixedly connected with a fixed plate (910), the section of the fixed plate (910) is "L"-shaped, the lower surface of the fixed plate (910) is fixedly connected with the surface of the support plate (902), the inner wall of the positioning frame (901) is fixedly connected with a mosaic plate (903), the surface of the mosaic plate (903) is fixedly connected with a driving motor (904), the output end of the driving motor (904) is fixedly connected with an adjusting rod (917), the upper end of the adjusting rod (917) is rotatably connected with the lower surface of the placement plate (918), the bottom end arc surface of the adjusting rod (917) is fixedly connected with a support frame (905), the upper surface of the support frame (905) is fixedly connected with a gear ring (906), the lower surface of the placement plate (918) is rotatably connected with a gear (908) at the position corresponding to the rack (909) and the gear ring (906), the gear surface of the gear (908) is engaged with the gear surface of the rack (909) and the gear ring (906), the upper surface of the placement plate (918) is fixedly connected with a support pad (919) at the position corresponding to the adjusting rod (917), and the support pad (919) is a rubber pad.

2. The single wafer cleaning machine of claim 1, wherein: The upper end inner wall of the adapter pipe (712) is fixedly connected with a baffle (715), the upper surface of the baffle (715) abuts against a filter cylinder (714), the filter cylinder (714) is an activated carbon cylinder, and a plurality of filter holes (716) are formed in the surface of the filter cylinder (714).

3. The single wafer cleaning machine of claim 1, wherein: An angle scale table (708) is arranged on the surface of the limiting plate (706) at a position corresponding to the limiting groove (707), and the size of the angle scale table (708) is adapted to the cross-sectional size of the limiting plate (706).

4. The single wafer cleaning machine of claim 1 wherein: The spraying pipe (701) is a stainless steel pipe, and the length size of the spraying pipe (701) is adapted to the cross-sectional size of the rotating frame (4).

5. A single-wafer cleaning machine according to claim 1, characterized in that: One side of the adapter pipe (712) is provided with an auxiliary material mechanism (8), the auxiliary material mechanism (8) comprises a butt joint pipe (811), the bottom end of the butt joint pipe (811) is fixedly communicated with the adapter pipe (712), the upper end of the butt joint pipe (811) is fixedly communicated with a bearing pipe (803), the upper end of the bearing pipe (803) is fixedly communicated with a conveying pipe (802), one side of the water tank (709) is fixedly connected with an auxiliary material cylinder (801), the bottom end of the auxiliary material cylinder (801) is fixedly communicated with the conveying pipe (802), the bottom end inner wall of the bearing pipe (803) is provided with inner sliding grooves (805) on both sides, the surface of the bearing pipe (803) is provided with outer sliding grooves (804) at positions corresponding to the inner sliding grooves (805), the inner wall of the inner sliding grooves (805) is slidably connected with inner magnetic blocks (807), the inner wall of the outer sliding grooves (804) is slidably connected with outer magnetic blocks (809), the outer magnetic blocks (809) are attracted to the inner magnetic blocks (807), the surfaces of the outer magnetic blocks (809) are fixedly connected with the output ends of electric push rods (808), and the same opening and closing column (806) is fixedly connected to one end of the two inner magnetic blocks (807) that are close to each other.

6. A single wafer cleaning machine as claimed in claim 5, wherein: The inner wall of the opening and closing column (806) is fixedly connected with a drainage block (812), and the cross section of the drainage block (812) is in the shape of a sharp cone.

7. A single wafer cleaning machine as claimed in claim 5, wherein: The bottom end of the opening and closing column (806) is fixedly connected with a sealing ring (813), and the inner wall of the closing plate (814) is provided with a sealing groove (815), and the inner wall surface of the sealing groove (815) abuts against the surface of the sealing ring (813). The bottom end of the opening and closing column (806) is fixedly connected with a sealing ring (813), and the inner wall of the closing plate (814) is provided with a sealing groove (815), and the inner wall surface of the sealing groove (815) abuts against the surface of the sealing ring (813).

8. A single wafer cleaning machine as claimed in claim 5, wherein: The inner wall bottom end of the adapter pipe (712) is fixedly connected with an auxiliary frame (817), the upper end of the auxiliary frame (817) is rotatably connected with a rotating frame (818), the cross section of the rotating frame (818) is in the shape of a sharp cone, and the surface of the rotating frame (818) is uniformly fixedly connected with a plurality of connecting plates (816), and the cross section of the connecting plate (816) is in the shape of an inclination.

9. The single wafer cleaning machine of claim 1, wherein: The lower surface of the placing plate (918) is fixedly connected with a gas cylinder (911), the output end of the gas cylinder (911) is fixedly connected with a pressing block (912), the side close to the gear ring (906) of the pressing block (912) is in the shape of a bevel gear, and the surface of the pressing block (912) is clamped with the tooth surface of the gear ring (906).

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