Chip taking device and die bonder

Abstract

The invention relates to the technical field of chip mounting equipment, and discloses a chip material taking device and a die bonder, the chip material taking device comprises a mounting rack, a first corrugated pipe, a second corrugated pipe, a floating rack, a displacement sensor and a material taking assembly, the first corrugated pipe and the second corrugated pipe are arranged at an interval along the horizontal direction, one end of the first corrugated pipe and one end of the second corrugated pipe in the vertical direction are fixedly connected to the mounting frame, the other end of the first corrugated pipe and the other end of the second corrugated pipe are fixedly connected with the floating frame, the floating frame is slidably connected to the mounting frame, the displacement sensor is connected to the mounting frame and used for monitoring the sliding distance of the floating frame in the vertical direction, and the material taking assembly is connected to the floating frame. Based on the first corrugated pipe and the second corrugated pipe, the chip taking device can provide taking force with a wide range, and is suitable for taking work of various types of chips.

Description

Technical Field

[0001] The present invention belongs to the field of chip mounting equipment, and more specifically, relates to a chip picking device and a die bonding machine. Background Art

[0002] Chips are highly sophisticated and fragile electronic components. Therefore, during the retrieving process of chip placement, an appropriate retrieving force needs to be applied to ensure that the chip is not damaged during the retrieving process and to maintain its stable and reliable performance. With the continuous development of semiconductor technology, the types and specifications of chips have shown a trend of diversification. Different types of chips require different retrieving forces due to differences in size, material and internal structure. The existing chip retrieving device has a relatively narrow force control range, making it difficult to apply to the retrieving work of various types of chips. Summary of the Invention

[0003] The main purpose of the present invention is to provide a chip picking device with a relatively wide force control range, which can be applied to the picking work of various types of chips.

[0004] According to a first aspect of the present invention, a chip picking device is provided, comprising a mounting frame, a first bellows, a second bellows, a floating frame, a displacement sensor and a picking assembly, wherein the first bellows and the second bellows are spaced apart in the horizontal direction, and the length directions of the first bellows and the second bellows extend in the vertical direction, one end of the first bellows and the second bellows in the vertical direction are fixedly connected to the mounting frame, and the other end are fixedly connected to the floating frame, the floating frame is connected to the mounting frame, and the floating frame can slide in the vertical direction, the displacement sensor is fixedly connected to the mounting frame, and the displacement sensor is used to monitor the sliding distance of the floating frame in the vertical direction, and the picking assembly is fixedly connected to the floating frame.

[0005] In a specific embodiment of the present invention, the floating frame includes a frame body and a connecting plate, the frame body is connected to the mounting frame, the connecting plate is horizontally fixedly connected to the top end of the frame body, and the top side surface of the connecting plate is fixedly connected to the first corrugated pipe and the second corrugated pipe;

[0006] The chip picking device further includes a first limiting member, the first limiting member being fixedly connected to the mounting frame and located below the connecting plate, and the first limiting member having a limiting surface that is horizontally arranged and faces the connecting plate;

[0007] When the first bellows, the second bellows, the floating frame and the material taking assembly are in a naturally drooping state, the bottom side surface of the connecting plate contacts the limiting surface of the first limiting member.

[0008] In a specific embodiment of the present invention, the frame has a avoidance hole, the avoidance hole is located below the connecting plate, and the first limiting member passes through the avoidance hole.

[0009] In a specific embodiment of the present invention, the chip picking device also includes a second limiting member, which is fixedly connected to the mounting frame and is spaced apart above the connecting plate. The second limiting member is used to contact the connecting plate to limit the displacement of the connecting plate.

[0010] In a specific embodiment of the present invention, the first bellows and the second bellows have the same structure, size and mechanical properties.

[0011] In a specific embodiment of the present invention, the chip retrieval device further includes a first mounting seat and a second mounting seat, wherein the first mounting seat and the second mounting seat are both connected to the mounting frame, and the positions of the first mounting seat and the second mounting seat in the vertical direction are both adjustable;

[0012] The first bellows is fixedly connected to the first mounting seat so as to be connected to the mounting frame, and the second bellows is fixedly connected to the second mounting seat so as to be connected to the mounting frame.

[0013] In a specific embodiment of the present invention, the chip picking device further includes a first guide rail and a second guide rail, wherein the first guide rail and the second guide rail are fixedly connected to the mounting frame, and the first guide rail and the second guide rail are spaced apart along the horizontal direction, and the length direction of the first guide rail and the second guide rail extends along the vertical direction;

[0014] Two ends of the floating frame along the horizontal direction are respectively connected to the first guide rail and the second guide rail.

[0015] In a specific embodiment of the present invention, the chip picking device further includes a sensing member fixedly connected to the floating frame, and the sensing member is configured to cooperate with the displacement sensor so that the displacement sensor monitors the sliding distance of the floating frame.

[0016] In a specific embodiment of the present invention, the material picking assembly includes a direct drive motor, a first magnetic seat, a second magnetic seat and a suction nozzle, the direct drive motor is fixedly connected to the floating frame, the first magnetic seat is fixedly connected to the power output end of the direct drive motor, the second magnetic seat is detachably connected to the first magnetic seat, the suction nozzle is fixedly connected to the second magnetic seat, and the suction nozzle, the second magnetic seat, the first magnetic seat and the direct drive motor are arranged along the vertical direction.

[0017] The present invention also provides a die bonding machine, comprising the chip picking device as described above.

[0018] One of the above technical solutions of the present invention has at least one of the following advantages or beneficial effects:

[0019] The chip picking device of the present invention is provided with a first bellows and a second bellows. In actual application, the first bellows and the second bellows balance the gravity of the floating frame and the picking assembly. Therefore, the chip picking device can eliminate the picking force deviation caused by gravity when picking up materials, and the picking force is accurately controlled. When the chip picking device is faced with the picking work of chips that require a relatively small picking force, a first preset amount of gas is input into the first bellows or the second bellows to adjust the stiffness of the first bellows or the second bellows. Thereafter, when the picking assembly moves downward to attach to the chip and applies a slight overpressure to the chip, the floating frame will slide upward, and the first bellows or the second bellows will be compressed. At this time, the sliding distance of the floating frame is monitored by the displacement sensor. The dynamic distance is the deformation length of the first bellows or the second bellows. Based on the deformation length and Hooke's law, the elastic force of the first bellows or the second bellows can be obtained, and the elastic force is the picking force of the picking assembly; and when the chip picking device faces the picking work of the chip that requires a relatively large picking force, a second preset amount of gas is input into the first bellows and the second bellows. At this time, the stiffness of the first bellows and the second bellows is relatively large, and the elastic force generated by the first bellows and the second bellows is greater under the same sliding distance of the floating frame. Therefore, the chip picking device can provide a greater picking force, that is, based on the first bellows and the second bellows, the chip picking device can provide a relatively wide range of picking force, which is suitable for picking work of various types of chips. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] The present invention will be further described below with reference to the accompanying drawings and embodiments;

[0021] Figure 1 This is a three-dimensional diagram of a chip retrieving device according to an embodiment of the present invention;

[0022] Figure 2 This is a front view of a chip retrieving device according to an embodiment of the present invention;

[0023] Figure 3 It is a cross-sectional view of a chip retrieving device according to an embodiment of the present invention.

[0024] In the figure, 1. mounting frame; 2. first bellows; 3. second bellows; 4. floating frame; 41. frame body; 4101. avoidance hole; 42. connecting plate; 5. displacement sensor; 6. material picking assembly; 61. direct drive motor; 62. first magnetic seat; 63. second magnetic seat; 64. suction nozzle; 7. first limit member; 8. second limit member; 9. first mounting seat; 10. second mounting seat; 11. first guide rail; 12. second guide rail; 13. sensing member. DETAILED DESCRIPTION

[0025] The embodiments of the present invention are described in detail below. Examples of the embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals represent the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain the present invention, and are not to be construed as limiting the present invention.

[0026] Reference Figures 1 to 3 As shown, a chip picking device includes a mounting frame 1, a first bellows 2, a second bellows 3, a floating frame 4, a displacement sensor 5 and a picking assembly 6. The first bellows 2 and the second bellows 3 are arranged at intervals in the horizontal direction, and the length directions of the first bellows 2 and the second bellows 3 extend in the vertical direction. One end of the first bellows 2 and the second bellows 3 in the vertical direction is fixedly connected to the mounting frame 1, and the other end is fixedly connected to the floating frame 4. The floating frame 4 is connected to the mounting frame 1 and can slide in the vertical direction. The displacement sensor 5 is fixedly connected to the mounting frame 1. The displacement sensor 5 is used to monitor the sliding distance of the floating frame 4 in the vertical direction. The picking assembly 6 is fixedly connected to the floating frame 4; when the picking assembly 6 grabs the chip, the first bellows 2 and / or the second bellows 3 are filled with a preset amount of gas, and the picking force of the picking assembly 6 is controlled based on the sliding distance monitored by the displacement sensor 5.

[0027] In actual application, the first bellows 2 and the second bellows 3 balance the gravity of the floating frame 4 and the picking assembly 6. As a result, the chip picking device can eliminate the picking force deviation caused by gravity when picking up the material, and the picking force is accurately controlled. When the chip picking device is faced with the picking work of a chip that requires a relatively small picking force, a first preset amount of gas is input into the first bellows 2 or the second bellows 3 to adjust the stiffness of the first bellows 2 or the second bellows 3. Thereafter, the picking assembly 6 moves downward to attach to the chip and applies a slight overpressure to the chip. In the process, the floating frame 4 will slide upward, and the first bellows 2 or the second bellows 3 will be compressed. At this time, the sliding distance of the floating frame 4 is monitored by the displacement sensor 5. The sliding distance is the deformation length of the first bellows 2 or the second bellows 3. The deformation length and Hooke's law can obtain the elastic force of the first bellows 2 or the second bellows 3, which is the picking force of the picking assembly 6. When the picking force is at a preset value, the chip picking device stops moving downward; and when the chip picking device faces the picking work of the chip that requires a relatively large picking force, a second preset amount of gas is input into the first bellows 2 and the second bellows 3. At this time, the stiffness of the first bellows 2 and the second bellows 3 is relatively large, and the elastic force generated by the floating frame 4 is greater at the same sliding distance. Therefore, the chip picking device can provide a greater picking force, that is, based on the first bellows 2 and the second bellows 3, the chip picking device can provide a relatively wide range of picking force, which is suitable for picking work of various types of chips.

[0028] The horizontal direction in this embodiment is Figure 2 The left and right directions under the perspective of the chip picking device are shown, and the vertical direction is Figure 2 The up and down directions from the perspective of the chip picking device are shown.

[0029] It should be noted that after the first bellows 2 and / or the second bellows 3 are filled with gas, their stiffness can be obtained through calibration. For example, the calibration method is described by taking the filling of a preset amount of gas into the first bellows 2 as an example. The calibration method is as follows: first, a first preset amount of gas is filled into the first bellows 2, then the chip picking device is driven downward, and the picking assembly 6 is attached to the pressure surface of the force sensor so that the two are just in contact. Then, the picking assembly 6 is pressed down for a small stroke. At this time, the floating frame 4 will undergo a small upward displacement in the vertical direction. At this time, the displacement sensor 5 will receive the displacement change signal and, combined with the force value signal of the force sensor, establish a linear change relationship of "displacement-force", thereby calibrating the stiffness of the first bellows 2. In actual application, this linear change relationship of "displacement-force" is also the main control basis for the force control of the chip picking device. Similarly, the stiffness of the second bellows 3, the stiffness of the first bellows 2 and the stiffness of the second bellows 3 are also calibrated in the above manner. This application will not elaborate on this in detail.

[0030] Furthermore, the chip picking device of the present invention can also be used in the process of chip mounting and transportation. When the chip is mounted, its mounting force is also controlled by the above-mentioned linear variation relationship of "displacement-force".

[0031] In this embodiment, the floating frame 4 includes a frame body 41 and a connecting plate 42, the frame body 41 is connected to the mounting frame 1, the connecting plate 42 is horizontally fixedly connected to the top of the frame body 41, and the top side surface of the connecting plate 42 is fixedly connected to the first bellows 2 and the second bellows 3; the chip picking device also includes a first limiter 7, the first limiter 7 is fixedly connected to the mounting frame 1, and the first limiter 7 is located below the connecting plate 42, and the first limiter 7 has a horizontally set limiter surface facing the connecting plate 42; when the first bellows 2, the second bellows 3, the floating frame 4 and the picking assembly 6 are in a naturally drooping state When the first bellows 2 or the second bellows 3 is used to control the material picking force, after the first bellows 2 or the second bellows 3 is filled with gas, the connecting plate 42 will be pressed against the first limiter 7. At this time, the force applied by the first bellows 2 or the second bellows 3 will smoothly transition to the force applied jointly by the first bellows 2 and the second bellows 3, which can make the force act evenly on the floating frame 4, so that the material picking component 6 can provide uniform material picking force to avoid physical damage to the chip.

[0032] In addition, since the first limit member 7 has a horizontal limit surface, the setting of the first limit member 7 can provide a reference for the gravity balance adjustment of the first bellows 2, the second bellows 3, the floating frame 4 and the material picking assembly 6. Specifically, after the first bellows 2, the second bellows 3 are assembled on the mounting frame 1, when the first bellows 2, the second bellows 3, the floating frame 4 and the material picking assembly 6 are in a naturally drooping state, by adjusting the position of the first bellows 2 and / or the second bellows 3 in the vertical direction, the bottom side surface of the connecting plate 42 is in contact with the limit surface of the first limit member 7, avoiding the connecting plate 42 from being slightly tilted due to the influence of the installation position of the first bellows 2 and / or the second bellows 3. At this time, the first bellows 2, the second bellows 3 balance the gravity of the floating frame 4 and the material picking assembly 6, that is, based on the setting of the first limit member 7, the gravity balance adjustment work of the first bellows 2, the second bellows 3, the floating frame 4 and the material picking assembly 6 can be made more convenient.

[0033] It should be noted that the first bellows 2, the second bellows 3, the floating rack 4 and the material picking assembly 6 are in a naturally drooping state, which means that the chip picking device is in a stationary state, and the first bellows 2, the second bellows 3, the floating rack 4 and the material picking assembly 6 are in a drooping or hanging state simply due to the action of gravity on themselves.

[0034] Furthermore, the frame 41 has an avoidance hole 4101, which is located below the connecting plate 42. The first limiting member 7 is provided with the avoidance hole 4101. The advantage of this structure is that the first limiting member 7 does not need to be connected to a position outside the floating frame 4 in the mounting frame 1, and the chip picking device has a compact structure.

[0035] In this embodiment, the chip picking device also includes a second limiter 8, which is fixedly connected to the mounting frame 1 and is spaced apart above the connecting plate 42. The second limiter 8 is used to contact the connecting plate 42 to limit the displacement of the connecting plate 42. Thus, during the movement of the floating frame 4 during the picking operation, the actual displacement of the floating frame 4 when sliding upward can be prevented from exceeding the expected or set target displacement. The chip picking device has the characteristics of safe and reliable structure.

[0036] In this embodiment, the structure, size and mechanical properties of the first bellows 2 and the second bellows 3 are the same. Specifically, the bellows itself has relatively stable elastic characteristics. Within a certain deformation range, its elastic force and deformation amount are basically linearly related. This makes it possible to more accurately control the size of the material picking force during the material picking process. When the material picking force is controlled by the first bellows 2 and the second bellows 3, since the structure, size and mechanical properties of the first bellows 2 and the second bellows 3 are the same, it is possible to reduce differentiation, thereby reducing errors and making the material picking force more accurately controlled.

[0037] In this embodiment, the chip picking device also includes a first mounting seat 9 and a second mounting seat 10. The first mounting seat 9 and the second mounting seat 10 are both connected to the mounting frame 1, and the positions of the first mounting seat 9 and the second mounting seat 10 in the vertical direction can be adjusted; the first bellows 2 is fixedly connected to the first mounting seat 9 to be connected to the mounting frame 1, and the second bellows 3 is fixedly connected to the second mounting seat 10 to be connected to the mounting frame 1. Specifically, the position of the first bellows 2 in the vertical direction can be adjusted through the first mounting seat 9, and the position of the second bellows 3 in the vertical direction can be adjusted through the second mounting seat 10. Based on this, the first bellows 2 and the second bellows 3 can be made flush in the horizontal direction, which can further reduce differentiation and thus reduce errors.

[0038] As a specific implementation of this embodiment, the first mounting seat 9 and the second mounting seat 10 are both provided with waist-shaped holes extending in the vertical direction, and the mounting frame 1 is provided with a through hole opposite to the waist-shaped holes. The first mounting seat 9 and the second mounting seat 10 are both fixed to the mounting frame 1 by bolts passing through the waist-shaped holes and connecting the through holes with nuts. By loosening the bolts and nuts, the first mounting seat 9 and the second mounting seat 10 can be adjusted in the vertical direction.

[0039] It should be noted that the first mounting seat 9 is also connected to a first air inlet connector connected to the first bellows 2, and the second mounting seat 10 is also connected to a second air inlet connector connected to the second bellows 3; in actual application, the first air inlet connector and the second air inlet connector are both connected to the air source system through an air pipe, and the first bellows 2 and / or the second bellows 3 are inflated or not inflated through the air source system. The air source system is further explained. The air source system includes an air source processing component (air compressor, air pump), an air source pressure regulating component (pressure reducing valve), a high-precision electrical proportional valve, an air storage tank, a directional control valve, a flow meter and a pressure switch, etc. Air source processing components (air compressor, air pump) and air source pressure regulating components (pressure reducing valve) are the basic components for positive pressure input of the air circuit; high-precision electrical proportional valves are used to achieve high-precision air pressure control and ensure air pressure accuracy; air storage tanks are used to provide stable flow; directional control valves are used to control the inflation / non-inflation of the bellows; flow meters and pressure switches are used to monitor the air flow stability and air pressure of the input bellows, and an alarm will be prompted when it deviates from the normal value. Ultimately, a wide range of thrust for the bellows can be achieved based on the control of the air circuit composition.

[0040] In this embodiment, the chip picking device also includes a first guide rail 11 and a second guide rail 12. The first guide rail 11 and the second guide rail 12 are fixedly connected to the mounting frame 1, and the first guide rail 11 and the second guide rail 12 are arranged at intervals in the horizontal direction, and the length direction of the first guide rail 11 and the second guide rail 12 extends in the vertical direction; the frame body 41 of the floating frame 4 is connected to the first guide rail 11 and the second guide rail 12 at both ends in the horizontal direction, respectively. The setting of the first guide rail 11 and the second guide rail 12 provides the floating frame 4 with a precise movement direction to ensure that it moves in the vertical direction. The chip picking device has the characteristics of structural reliability.

[0041] In this embodiment, the chip picking device also includes a sensing part 13, which is fixedly connected to the floating frame 4. The sensing part 13 is used to cooperate with the displacement sensor 5 so that the displacement sensor 5 monitors the sliding distance of the floating frame 4. The structure is simple, which facilitates the displacement sensor 5 to monitor the sliding distance of the floating frame 4.

[0042] In this embodiment, the material picking component 6 includes a direct drive motor 61, a first magnetic seat 62, a second magnetic seat 63 and a suction nozzle 64. The direct drive motor 61 is fixedly connected to the floating frame 4, the first magnetic seat 62 is fixedly connected to the power output end of the direct drive motor 61, the second magnetic seat 63 is detachably connected to the first magnetic seat 62, the suction nozzle 64 is fixedly connected to the second magnetic seat 63, and the suction nozzle 64, the second magnetic seat 63, the first magnetic seat 62 and the direct drive motor 61 are arranged in a vertical direction. Specifically, based on the setting of the first magnetic seat 62 and the second magnetic seat 63, the suction nozzle 64 is detachably connected to the direct drive motor 61. In actual applications, the chip picking device can quickly replace the suction nozzle 64 according to actual needs, and the chip picking device is more applicable to different types of chips.

[0043] Furthermore, the direct drive motor 61 has a negative pressure channel arranged along its central axis. The negative pressure channel passes through the output shaft of the direct drive motor 61. The upper end of the negative pressure channel is connected to the trachea joint, and the lower end is connected to the suction nozzle 64. The suction nozzle 64 is connected to the negative pressure system through the negative pressure channel and the trachea joint. Thus, the replaced suction nozzle 64 can be directly connected to the negative pressure channel. The suction nozzle 64 is easy to replace, and it can be ensured that the replaced suction nozzle 64 can perform chip grabbing work normally.

[0044] Based on the above-mentioned chip picking device, the present invention also proposes a crystal bonding machine, wherein the crystal bonding machine includes the chip picking device as described above. Since the crystal bonding machine includes the above-mentioned chip picking device, the crystal bonding machine also has the advantages of the above-mentioned chip picking device, and this application will not go into details about this.

[0045] While embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions, and variations may be made to the embodiments without departing from the principles and spirit of the invention, and that the scope of the invention is defined by the claims and their equivalents.

Claims

1. A chip picking device, characterized in that: The invention comprises a mounting frame (1), a first bellows (2), a second bellows (3), a floating frame (4), a displacement sensor (5) and a material taking assembly (6), wherein the first bellows (2) and the second bellows (3) are arranged at intervals in the horizontal direction, the length direction of the first bellows (2) and the second bellows (3) extends in the vertical direction, one end of the first bellows (2) and the second bellows (3) in the vertical direction is fixedly connected to the mounting frame (1), and the other end is fixedly connected to the floating frame (4), the floating frame (4) is connected to the mounting frame (1), and the floating frame (4) can slide in the vertical direction, the displacement sensor (5) is fixedly connected to the mounting frame (1), the displacement sensor (5) is used to monitor the sliding distance of the floating frame (4) in the vertical direction, and the material taking assembly (6) is fixedly connected to the floating frame (4).

2. The chip retrieving device according to claim 1, characterized in that: The floating frame (4) includes a frame body (41) and a connecting plate (42), wherein the frame body (41) is connected to the mounting frame (1), the connecting plate (42) is horizontally fixedly connected to the top end of the frame body (41), and the top side surface of the connecting plate (42) is fixedly connected to the first corrugated pipe (2) and the second corrugated pipe (3); The chip picking device further comprises a first limiting member (7), the first limiting member (7) being fixedly connected to the mounting frame (1), and the first limiting member (7) being located below the connecting plate (42), and the first limiting member (7) having a limiting surface that is horizontally arranged and faces the connecting plate (42); When the first corrugated pipe (2), the second corrugated pipe (3), the floating frame (4) and the material taking assembly (6) are in a naturally drooping state, the bottom side surface of the connecting plate (42) contacts the limiting surface of the first limiting member (7).

3. The chip retrieving device according to claim 2, characterized in that: The frame (41) has a avoidance hole (4101), the avoidance hole (4101) is located below the connecting plate (42), and the first limiting member (7) passes through the avoidance hole (4101).

4. The chip retrieving device according to claim 2, characterized in that: The chip picking device further includes a second limiting member (8), which is fixedly connected to the mounting frame (1) and is spaced apart above the connecting plate (42). The second limiting member (8) is used to contact the connecting plate (42) to limit the displacement of the connecting plate (42).

5. The chip retrieving device according to any one of claims 1 to 4, characterized in that: The first bellows (2) and the second bellows (3) have the same structure, size and mechanical properties.

6. The chip retrieving device according to claim 5, characterized in that: The chip picking device further comprises a first mounting seat (9) and a second mounting seat (10), wherein the first mounting seat (9) and the second mounting seat (10) are both connected to the mounting frame (1), and the positions of the first mounting seat (9) and the second mounting seat (10) in the vertical direction are both adjustable; The first bellows (2) is fixedly connected to the first mounting seat (9) to be connected to the mounting frame (1), and the second bellows (3) is fixedly connected to the second mounting seat (10) to be connected to the mounting frame (1).

7. The chip retrieving device according to claim 5, characterized in that: The chip picking device further comprises a first guide rail (11) and a second guide rail (12), wherein the first guide rail (11) and the second guide rail (12) are fixedly connected to the mounting frame (1), and the first guide rail (11) and the second guide rail (12) are spaced apart along the horizontal direction, and the length directions of the first guide rail (11) and the second guide rail (12) extend along the vertical direction; The two ends of the floating frame (4) along the horizontal direction are respectively connected to the first guide rail (11) and the second guide rail (12).

8. The chip retrieving device according to claim 1, characterized in that: The chip picking device further comprises a sensing element (13), wherein the sensing element (13) is fixedly connected to the floating frame (4), and the sensing element (13) is used to cooperate with the displacement sensor (5) so that the displacement sensor (5) monitors the sliding distance of the floating frame (4).

9. The chip retrieving device according to claim 1, characterized in that: The material picking assembly (6) includes a direct drive motor (61), a first magnetic seat (62), a second magnetic seat (63) and a suction nozzle (64), wherein the direct drive motor (61) is fixedly connected to the floating frame (4), the first magnetic seat (62) is fixedly connected to the power output end of the direct drive motor (61), the second magnetic seat (63) is detachably connected to the first magnetic seat (62), the suction nozzle (64) is fixedly connected to the second magnetic seat (63), and the suction nozzle (64), the second magnetic seat (63), the first magnetic seat (62) and the direct drive motor (61) are arranged along the vertical direction.

10. A die bonding machine, characterized in that: It comprises a chip picking device as described in any one of claims 1-9.

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