Substrate transfer arm and substrate transfer apparatus

Abstract

A substrate transfer arm and a substrate transfer device, the substrate transfer arm is suitable for bearing and moving a substrate, the substrate comprises a non-circuit area, and the substrate transfer arm comprises an arm body, a first support unit, a suction unit and a buoyancy unit. The arm body comprises a bearing part. The first supporting unit comprises a plurality of first supporting pieces, and the first supporting pieces are arranged at the two ends of the bearing part respectively and used for supporting a non-circuit area of the substrate. The suction unit comprises a plurality of suction pieces, and the suction pieces are arranged on the bearing parts and are adjacent to the first supporting pieces. The buoyancy unit comprises buoyancy pieces, and the buoyancy pieces are arranged on the bearing part and located between the suction pieces.

Description

Technical Field

[0001] The present invention relates to a transfer arm and a transfer device, and in particular to a substrate transfer arm and a substrate transfer device for transferring substrates. Background Art

[0002] Existing substrates tend to be thinner, with thicknesses ranging from approximately 0.2 to 0.4 mm. However, this thickness can easily cause the substrate to bend and deform. In addition, in order to increase the output of substrates, both sides of the substrate are etched and circuits are laid out to reduce the ineffective area of the substrate, thereby significantly reducing the contact area of the substrate. However, traditional substrate transport devices often transport substrates by clamping and adsorption, which not only cannot avoid large-area contact with the substrate circuit layout area, but also easily expose the substrate to the risk of deformation, cracking, and damage during movement.

[0003] Furthermore, in order to more efficiently utilize the internal space of the substrate container, the spacing between the substrates is reduced, which in turn increases the risk of the substrate transfer device hitting the substrates during operation, thereby further increasing the demand for a thinner transfer device. Summary of the Invention

[0004] One of the objectives of the present invention is to provide a substrate transfer arm that is thin, has a minimal contact area with the substrate, and can avoid product loss caused by substrate deformation.

[0005] The substrate transfer arm of the present invention is suitable for carrying and moving a substrate, wherein the substrate includes a non-circuit area, and the substrate transfer device includes an arm body, a first support unit, a suction unit, and a buoyancy unit. The arm body includes a bearing portion. The first support unit includes a plurality of first support members, which are respectively arranged at both ends of the bearing portion and are used to support the non-circuit area of the substrate. The suction unit includes a plurality of suction members, which are respectively arranged on the bearing portion and adjacent to the first support member. The buoyancy unit includes a buoyancy member, which is arranged on the bearing portion and located between the suction members.

[0006] The substrate transfer arm of the present invention has an arm body having a fixed portion, a connecting portion connected to the fixed portion and the supporting portion and having a connecting slope, the bottom of the supporting portion has a supporting slope, the slope of the supporting slope is smaller than that of the connecting slope, and the thickness of the arm body gradually decreases as the connecting slope and the supporting slope move away from the fixed portion.

[0007] The substrate transferring arm of the present invention further includes an air pipe joint located at one end of the arm body away from the carrying part, the arm body has an air flow channel, the air pipe joint has an air delivery part connected to an external air supply source, and an air delivery part connected to the air delivery part and the air flow channel, and the air flow channel is connected to the suction part and the buoyancy part.

[0008] In the substrate transfer arm of the present invention, each of the suction members is a cyclone suction cup or a Bernoulli suction cup.

[0009] In the substrate transfer arm of the present invention, the buoyancy member has a plurality of blowing holes respectively connected to the air flow channels.

[0010] In the substrate transfer arm of the present invention, the buoyancy member further comprises a top column and a bowl-shaped portion disposed on the top column.

[0011] The substrate transfer arm of the present invention further includes a second support unit, wherein the second support unit includes a second support member located between the first support members, and the second support member is used to contact the non-circuit area of the substrate.

[0012] In the substrate transfer arm of the present invention, the second supporting member has a second supporting portion and a supporting portion extending from the second supporting portion and used to support the substrate.

[0013] In the substrate transfer arm of the present invention, the top end of the supporting portion has a chamfer.

[0014] The substrate transfer arm of the present invention further comprises a plurality of buoyancy members, and the buoyancy members are arranged at intervals between the first support members.

[0015] In the substrate transfer arm of the present invention, each of the first supporting members includes a first supporting portion for contacting the substrate and a guide portion extending from the first supporting portion.

[0016] In the substrate transfer arm of the present invention, the introduction portion has an introduction surface.

[0017] In the substrate transfer arm of the present invention, the height of the first supporting portion is 3 mm.

[0018] In the substrate transfer arm of the present invention, the height of the supporting portion is 2.5 mm.

[0019] The substrate transfer arm of the present invention has two chamfered surfaces on both sides of the length direction of the arm body.

[0020] In the substrate transfer arm of the present invention, the suction unit and the buoyancy unit suspend the substrate at a height greater than or equal to 0.3 mm and less than the height of the introduction portion.

[0021] In the substrate transfer arm of the present invention, the ratio of the width of the airflow channel to the width of the arm body is 5-50%.

[0022] Another object of the present invention is to provide a substrate transfer device that is thin, has a minimal contact area with the substrate, and can avoid product loss caused by substrate deformation.

[0023] The substrate transfer device of the present invention comprises a base and a plurality of substrate transfer arms as described above, wherein the substrate transfer arms are arranged on the base.

[0024] The beneficial effect of the present invention is that the substrate transfer device can flexibly move the substrate via the substrate transfer arms, and each substrate transfer arm utilizes the suction force generated by the suction members provided on the support portion and the buoyancy generated by the buoyancy members to enable the substrate transfer device to grasp the substrate in a non-contact manner. Thus, during the movement of the substrate provided on the substrate transfer device, the substrate transfer device can minimize the risk of damage to the substrate, thereby achieving the effect of safely transferring the substrate. BRIEF DESCRIPTION OF THE DRAWINGS

[0025] Figure 1 is a three-dimensional diagram of an embodiment of a substrate transfer device of the present invention when carrying a substrate;

[0026] Figure 2 is a perspective view of one of the substrate transfer arms of the embodiment;

[0027] Figure 3 is a side view of one of the substrate transfer arms of the embodiment;

[0028] Figure 4 is a front view of one of the substrate transfer arms of the embodiment;

[0029] Figure 5 In one embodiment, the substrate transfer arm is composed of Figure 4 The sectional view obtained by the cutting line V-V in;

[0030] Figure 6 is a perspective view of one of the first support members of the embodiment;

[0031] Figure 7 is a perspective view of a second support member of the embodiment;

[0032] Figure 8 is a partial exploded perspective view of the embodiment;

[0033] Figure 9 It is a partial exploded perspective view of the embodiment. DETAILED DESCRIPTION

[0034] The present invention will be described in detail below with reference to the accompanying drawings and embodiments.

[0035] See Figure 1 and Figure 2 An embodiment of a substrate transfer device 100 of the present invention is suitable for carrying and moving a substrate 31 including a non-circuit area 311 and a circuit area 312. The substrate transfer device 100 includes a base 1 and two substrate transfer arms 2.

[0036] The substrate transfer arms 2 are spaced apart from each other on the base 1 and are respectively used to carry the substrates 31. Each substrate transfer arm 2 includes an arm body 21, an air pipe joint 22, two first support units 23, a second support unit 24, a suction unit 25, and a buoyancy unit 26. In this embodiment, the number of substrate transfer arms 2 is two and they move in conjunction with each other, but the number of substrate transfer arms 2 can also be at least two. Moreover, if a smaller substrate 31 needs to be transferred, the substrate transfer device 100 can also have only a single substrate transfer arm 2 without the base 1, and the purpose of the invention can still be achieved. For ease of explanation, the following description will be based on one of the substrate transfer arms 2.

[0037] For reference Figures 3 to 5The arm body 21 is rectangular and has a fixing portion 211 fixed to the base 1, a connecting portion 212, a supporting portion 213, two chamfered surfaces 214 and an air flow channel 215. The connecting portion 212 is connected to the fixing portion 211 and has a connecting bevel 216 located on the back of the arm body 21, but in other embodiments, the connecting bevel 216 can also be located on the front of the arm body 21. The connecting bevel 216 extends obliquely from bottom to top, and when the substrate transfer arm 2 is in a substrate container (not shown), the connecting bevel 216 can prevent the substrate transfer arm 2 from easily touching other parts of the substrate container, so that the substrate transfer arm 2 can stably transfer the substrate 31. The supporting portion 213 is connected to the connecting portion 212 and has a supporting bevel 217 located at the bottom of the arm body 21, and the supporting bevel 217 extends obliquely from bottom to top. The slope of the supporting slope 217 is smaller than that of the connecting slope 216, and the thickness of the arm body 21 gradually decreases as the connecting slope 216 and the supporting slope 217 move away from the fixed portion 211. The interior of the arm body 21 has an air flow channel 215 extending in the longitudinal direction, and the air flow channel 215 sequentially connects the fixed portion 211, the connecting portion 212 and the supporting portion 213. The ratio of the width of the air flow channel 215 to the width of the arm body 21 is 5 to 50%, preferably 10 to 30%, and most preferably 10 to 20%. Thus, when the width of the air flow channel 215 is wider, the substrate transfer arm 2 can provide stronger suction and buoyancy, and when the width of the air flow channel 215 is narrower, the structural strength of the substrate transfer arm 2 can be increased and it is not easy to bend, and the width ratio can be adjusted according to the needs of the user. Two chamfered surfaces 214 extending obliquely from top to bottom are respectively formed on both sides of the arm body 21 in the longitudinal direction to prevent the substrate transfer arm 2 from hitting the transferred substrate 31 during operation.

[0038] See Figure 2 、 Figure 3 and Figure 5 The air pipe connector 22 is disposed on the fixed portion 211 and includes an air delivery portion 221 and an air supply portion 222. The air delivery portion 221 is connected to an external air supply source (not shown), while the air supply portion 222 passes through the fixed portion 211 and is connected to the air delivery portion 221 and the air flow channel 215, respectively, so that the external air supply source connected to the air delivery portion 221 can introduce air into the air flow channel 215 through the air delivery portion 221.

[0039] See Figure 1 and Figure 2 、 Figure 6 and Figure 8The first support unit 23 includes a plurality of first support members 230, which are respectively arranged at both ends of the carrying portion 213 and opposite to each other, and each first support member 230 has a first support portion 231 and an introduction portion 232. The height of the first support portion 231 is 3 mm, and is used to contact and support the non-circuit area 311 of the substrate 31. The height of the introduction portion 232 is 4.5 mm, and extends upward from the first support portion 231, so that the first support member 230 is slightly L-shaped. The introduction portion 232 has an introduction surface 233 extending obliquely from top to bottom, and the introduction surface 233 is used to guide and limit the substrate 31 to be placed on the first support portion 231. The first support member 230 can support the rigidity of the substrate 31, reduce the sagging amount of the substrate 31 when placed on the substrate transfer device 100, and enable the substrate 31 to be stably limited to the substrate transfer device 100.

[0040] See Figure 1 、 Figure 2 and Figure 7 The second support unit 24 includes a second support member 240, which is island-shaped and located between the first support members 230, and has a second support portion 241 and a supporting portion 242. The supporting portion 242 is used to contact and support the non-circuit area 311 of the substrate 31 and has a height of 2.5 mm. It is located at the center of the second support portion 241 and extends from the second support portion 241. The top of the supporting portion 242 has a chamfer 243, and the curved surface design of the chamfer 243 can reduce the contact area with the substrate 31, so that the substrate 31 can be smoothly moved or placed on the substrate transfer device 100. The second support member 240 can support the rigidity of the substrate 31 and reduce the sagging amount of the substrate 31 when placed on the substrate transfer device 100. It should be noted that the second support member 240 can also be formed integrally with the arm body 21, as long as the second support member 240 can reduce the contact area with the substrate 31 and support the substrate 31 through the supporting portion 242 and the chamfer 243.

[0041] See Figure 2 、 Figure 5 and Figure 8The suction unit 25 includes a plurality of suction members 250, which are respectively arranged on the supporting portion 213 and are respectively cyclonic suction cups or Bernoulli suction cups, that is, each of the suction members 250 can be one of a cyclonic suction cup or a Bernoulli suction cup, that is, one or several of the suction members 250 are cyclonic suction cups and the remaining one or several are Bernoulli suction cups, or all of the suction members 250 are cyclonic suction cups, or all of them are Bernoulli suction cups. The suction members 250 are adjacent to the two first support members 230 and are connected to the air flow channel 215. Each of the suction members 250 has a side wall 251 and a plurality of air supply holes 252 formed on the side wall 251 and arranged at intervals, and in this embodiment, each of the suction members 250 is a cyclonic suction cup. The gas from the external air supply source is introduced into each of the suction members 250 through the air flow channel 215, and is discharged through the air supply holes 252 respectively to form a gas flow along the side wall 251 to generate a cyclone, thereby driving the air flow to generate suction through the cyclone effect or Bernoulli's principle, so that the substrate transfer device 100 can grab the substrate 31 in a non-contact manner.

[0042] See Figure 2 、 Figure 5 and Figure 9 The buoyancy unit 26 includes a plurality of buoyancy members 260. The buoyancy members 260 are disposed on the supporting portion 213 and connected to the airflow channel 215. The buoyancy members 260 are spaced and equidistantly arranged between one of the suction members 250 and the second support member 240. The buoyancy members 260 may be, for example, floating discs. Each buoyancy member 260 has a plurality of air blowing holes 261 spaced apart and connected to the airflow channel 215, a top column 262, and a bowl-shaped portion 263 disposed on the top column 262. The gas from the external gas supply source is introduced into each of the buoyancy members 260 through the air flow channel 215, and the gas is discharged through the air blowing holes 261 respectively, so that the generated air flow hits the top column 262, disperses and changes the flow direction so that the air flow flows downward, and is reflected upward by the bowl-shaped portion 263, thereby generating a uniform and large-area buoyancy on the substrate 31, so that the substrate 31 placed on the substrate transfer device 100 can be suspended at a height greater than or equal to 0.3 mm and less than or equal to the height of the introduction portion 232 (4.5 mm in this embodiment), so that the substrate transfer arm 2 will not directly contact the circuit area 312 of the substrate 31 to avoid damaging the circuit layout of the substrate 31, and will not cause the substrate 31 to be suspended too high and cause a collision, thereby ensuring the safety of the substrate 31 during transfer and reliably maintaining the substrate 31 and the substrate transfer arm 2 at a safe height.

[0043] In a variant implementation, if the middle area of the substrate 31 does not have the non-line area 311, the substrate transfer arm 2 does not include the second support unit 24, so that the buoyancy members 260 are spaced apart and arranged equidistantly between the first support member 230 and the suction member 250. In another variant implementation, the buoyancy unit 26 may not have the buoyancy member 260, but directly form a plurality of through holes on the surface of the arm body 21, so that the airflow passes through the airflow channel 215 and is directed upward from the through holes to generate buoyancy. In this embodiment, the number of the buoyancy members 260 is 4, but the number is not limited to this, as long as it can provide sufficient support force and power to support and grasp the substrate 31.

[0044] In summary, the substrate transfer device 100 can flexibly move the substrate 31 via the substrate transfer arms 2. Each substrate transfer arm 2 utilizes the suction force generated by the suction members 250 disposed on the support portion 213 and the buoyancy generated by the buoyancy members 260 to enable the substrate transfer device 100 to grasp the substrate 31 in a non-contact manner. Consequently, during the movement of the substrate 31 disposed within the substrate transfer device 100, the substrate transfer device 100 can minimize the risk of damage to the substrate 31, thereby achieving the goal of safely transferring the substrate 31. Therefore, the objective of the present invention is effectively achieved.

[0045] However, the above is only an embodiment of the present invention and should not be used to limit the scope of the present invention. All simple equivalent changes and modifications made according to the claims and description of the present invention are still within the scope of the present invention.

Claims

1. A substrate transfer arm, adapted to carry and move a substrate, wherein the substrate includes a non-circuit area, characterized in that: The substrate transfer arm comprises: The arm body includes a load-bearing portion; a first supporting unit comprising a plurality of first supporting members, wherein the first supporting members are respectively provided at both ends of the carrying portion and are used to support the non-circuit area of the substrate; a suction unit comprising a plurality of suction members, each of which is disposed on the bearing portion and adjacent to the first support member; and The buoyancy unit includes a buoyancy member, which is arranged on the bearing portion and located between the suction members.

2. The substrate transfer arm according to claim 1, wherein: The arm body has a fixing portion, a connecting portion connected to the fixing portion and the supporting portion and having a connecting slope, the bottom of the supporting portion has a supporting slope, the slope of the supporting slope is smaller than the connecting slope, and the thickness of the arm body gradually decreases along the connecting slope and the supporting slope in a direction away from the fixing portion.

3. The substrate transfer arm according to claim 1, wherein: The substrate transfer arm also includes an air pipe joint located at one end of the arm body away from the supporting part, the arm body has an air flow channel, the air pipe joint has an air delivery part connected to an external air supply source, and an air delivery part connected to the air delivery part and the air flow channel, and the air flow channel is connected to the suction part and the buoyancy part.

4. The substrate transfer arm according to claim 1, wherein: Each of the suction members is a cyclone suction cup or a Bernoulli suction cup.

5. The substrate transfer arm according to claim 3, wherein: The buoyancy member has a plurality of blowing holes respectively connected to the air flow channels.

6. The substrate transfer arm according to claim 1, wherein: The buoyancy member further comprises a top column and a bowl-shaped portion arranged on the top column.

7. The substrate transfer arm according to claim 1, wherein: The substrate transfer arm further includes a second support unit, wherein the second support unit includes a second support member located between the first support members, and the second support member is used to contact the non-circuit area of the substrate.

8. The substrate transfer arm according to claim 7, wherein: The second supporting member has a second supporting portion and a supporting portion extending from the second supporting portion and used for supporting the substrate.

9. The substrate transfer arm according to claim 8, wherein: The top end of the supporting portion has a chamfer.

10. The substrate transfer arm according to claim 1, wherein: The substrate transfer arm further includes a plurality of buoyancy members, and the buoyancy members are arranged at intervals between the first support members.

11. The substrate transfer arm according to claim 1, wherein: Each of the first supporting members has a first supporting portion for contacting the substrate and an introduction portion extending from the first supporting portion.

12. The substrate transfer arm according to claim 11, wherein: The introduction portion has an introduction surface.

13. The substrate transfer arm according to claim 11, wherein: The height of the first supporting portion is 3 mm.

14. The substrate transfer arm according to claim 8, wherein: The height of the supporting portion is 2.5 mm.

15. The substrate transfer arm according to claim 1, wherein: The arm body has two chamfered surfaces on both sides of the length direction.

16. The substrate transfer arm according to claim 11, wherein: The suction unit and the buoyancy unit suspend the substrate at a height greater than or equal to 0.3 mm and less than a height of the introduction portion.

17. The substrate transfer arm according to claim 3, wherein: The ratio of the width of the air flow channel to the width of the arm body is 5-50%.

18. A substrate transfer device, characterized in that: The substrate moving device comprises: base; and A plurality of substrate transfer hands according to any one of claims 1 to 17 BCPI-240079 Page 3 / 3 An arm is provided on the base.

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