Low-profile end-on-fire antenna

Abstract

The invention discloses a low-profile end-on-fire antenna, and belongs to the technical field of antennas. A printed board is composed of a U-shaped metal coating, a matrix array loading coating, a rectangular stepped groove, a printed board lower coating and the like. A stepped metal oscillator is located in a hollow area of the rectangular stepped groove in the middle of the printed board. A U-shaped metal coating and a matrix array loading coating are arranged on the upper surface of the printed board; the upper surface of the printed board is flush with the stepped metal oscillator, the L-shaped metal baffles are located at the same height, and the printed board, the stepped metal oscillator and the L-shaped metal baffles are electrically connected. Coaxial connectors are arranged at feeding points on the bottom plate and the stepped metal oscillators; the antenna adopts a low profile and metasurface loading antenna technology, so that the profile height of the antenna is only 0.09 lambda max, the problem that the aperture size of an end-fire antenna is relatively large is effectively solved, and the antenna is compact in structure, has the characteristics of good broadband end-fire characteristic, easiness in batch production, easiness in conformal with a carrier and the like, and can be applied to various high-speed motion carriers.

Description

Technical Field

[0001] The present invention relates to the field of antenna technology, and in particular to a low-profile end-fire antenna. Background Art

[0002] With the continuous expansion of wireless communication applications and the rapid development of military technology, antennas are increasingly being used in radar systems on specific carriers such as aircraft, missiles, and rockets. These systems require antennas to be small, lightweight, and conformal to the carrier, while also effectively preventing the carrier itself from affecting antenna performance. Because end-fire antennas do not have an aperture proportional to their directivity in the main beam direction, they are suitable for applications with low wind resistance.

[0003] End-fire antennas have good end-to-end radiation characteristics. Conventional broadband end-fire antenna structures mainly include log-periodic antennas, Yagi antennas, and tapered slot antennas (including exponentially varying cones, linearly varying cones, and constant cones).

[0004] A dielectric integrated waveguide (SIW) is a structure that uses arranged metalized through-holes as waveguides to propagate electromagnetic energy in a direction along a customized path. This structure is integrated with a dielectric substrate to achieve miniaturization and a low profile. To date, there has been an increasing amount of research on end-fire antennas based on SIWs. These end-fire antennas can be well integrated on metal platforms, achieving broadband radiation with their extremely low profile. Due to the low profile and good radiation characteristics of the H-plane horn, it can be loaded onto a flight platform without increasing its profile too much. Therefore, for antennas with conformal structures on airborne platforms, the H-plane horn or dielectric integrated waveguide (SIW) is a very good choice.

[0005] In addition, traditional radar array antennas mostly adopt the form of broadside arrays. The so-called broadside array means that the maximum radiation direction of the array is perpendicular to the plane where the array is located. The directivity coefficient of the broadside array antenna is simply proportional to the equivalent aperture size of the array. The higher the required directivity coefficient, the larger the equivalent aperture size of the array is required. However, the space in the actual application site is often limited, and antennas with good electrical performance may not be suitable for installation in any occasion. Unlike this traditional broadside radar array, the maximum radiation direction points to the axial direction of the array arrangement, rather than the normal direction. In the maximum radiation direction of the end-fire radar array antenna, the directivity coefficient is no longer simply proportional to the aperture size. Therefore, the end-fire array effectively solves the problem of the large aperture size of the broadside array. In addition, the planar end-fire array antenna has a low profile and can be well conformed to the carrier in design. It can be well applied to various high-speed moving carriers and has important theoretical research significance and engineering practical value. Summary of the Invention

[0006] In view of this, the present invention proposes a low-profile end-fire antenna that operates in the L-band and has good end-fire radiation characteristics within the frequency band of 1.34GHz to 1.66GHz. The antenna adopts low-profile and metasurface-loaded antenna technology, making the antenna's profile height only 0.09λ. max , effectively solved the problem of large aperture size of end-fire antenna. The antenna has a compact structure, good broadband end-fire characteristics, is easy to mass produce, and is easy to conform to the carrier. It can be used on various high-speed moving carriers.

[0007] In order to achieve the above object, the technical solution adopted by the present invention includes:

[0008] A low-profile end-fire antenna includes a stepped metal element 1, a printed circuit board 2, an L-shaped metal baffle 3, a base plate 4, a dielectric screw 5, and a metal screw 6. The upper surface of the printed circuit board 2 is provided with a U-shaped metal coating 7, a matrix array loading coating 8, and a rectangular stepped groove 9. The U-shaped metal coating 7 and the matrix array loading coating 8 are arranged side by side, with the opening of the U-shaped metal coating facing the matrix array loading coating 8. The rectangular stepped groove 9 is located in the opening of the U-shaped metal coating.

[0009] The stepped metal vibrator 1 is embedded in the rectangular stepped groove 9 of the printed circuit board 2. The upper surface of the stepped metal vibrator 1 is flush with the upper surface of the printed circuit board 2 and connected to the U-shaped metal coating 7.

[0010] The printed circuit board lower plating layer 10 is located on the lower surface of the printed circuit board 2 and contacts the bottom plate 4 .

[0011] The L-shaped metal baffle 3 is L-shaped, one side of the L-shaped metal baffle 3 abuts against the printed circuit board 2, and the other side is fixedly connected to the bottom plate 4 by metal screws 6;

[0012] The dielectric screw 5 passes through the stepped metal vibrator 1 and the printed circuit board 2 and is connected to the bottom plate 4 .

[0013] Furthermore, the upper surface of the stepped metal vibrator 1 and the U-shaped metal coating 7 are connected by welding or bonding with copper foil to achieve electrical connection between the two.

[0014] Furthermore, the stepped metal vibrator 1 is completely fitted into the rectangular stepped groove 9 of the printed circuit board 2 .

[0015] Furthermore, the U-shaped metal coating 7 presents a U-shaped surface structure, the surface is flush with the upper surface of the stepped metal vibrator 1, the opening part of the U-shaped metal coating 7 is used to pass through the stepped metal vibrator 1, and the side of the U-shaped metal coating 7 is connected to the side of the L-shaped metal baffle 3.

[0016] Furthermore, the matrix array loading coating 8 is composed of multiple groups of rectangularly arranged coatings, which are flush with the surface of the U-shaped metal coating 7 and do not contact the U-shaped metal coating 7 .

[0017] Furthermore, a plurality of avoidance holes are provided on the lower plating layer 10 of the printed circuit board.

[0018] Furthermore, one side of the U-shaped metal coating 7 is electrically connected to the L-shaped metal baffle 3 .

[0019] Compared with the prior art, the antenna of the present invention adopts low profile and super surface loading antenna technology, making the antenna profile height only 0.09λ max , effectively solved the problem of large aperture size of end-fire antenna. The antenna has a compact structure, good broadband end-fire characteristics, is easy to mass produce, and is easy to conform to the carrier. It can be used on various high-speed moving carriers. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] Figure 1 A structural diagram of a low-profile end-fire antenna provided in an embodiment of the present invention;

[0021] Figure 2 A cross-sectional view of a low-profile end-fire antenna provided in an embodiment of the present invention;

[0022] Figure 3 A structural diagram of a stepped metal vibrator provided in an embodiment of the present invention;

[0023] Figure 4 A diagram of the upper structure of a printed circuit board provided in an embodiment of the present invention;

[0024] Figure 5 A structural cross-sectional view of a printed circuit board provided in an embodiment of the present invention;

[0025] Figure 6 A diagram showing the lower structure of a printed circuit board provided in an embodiment of the present invention;

[0026] Figure 7 A structural diagram of an L-shaped metal baffle provided in an embodiment of the present invention;

[0027] Figure 8 This is a diagram of the structural dimensions and parameters of the base plate provided in an embodiment of the present invention.

[0028] Figure 9 This is a graph showing the voltage standing wave ratio of the antenna provided in an embodiment of the present invention.

[0029] Figure 10 This is the gain pattern of the antenna at 1.34 GHz provided by the embodiment of the present invention.

[0030] Figure 11This is the gain pattern of the antenna at 1.4 GHz provided by the embodiment of the present invention.

[0031] Figure 12 This is the gain pattern of the antenna at 1.45 GHz provided by an embodiment of the present invention.

[0032] Figure 13 This is the gain pattern of the antenna at 1.5 GHz provided by the embodiment of the present invention.

[0033] Figure 14 This is the gain pattern of the antenna at 1.55 GHz provided by an embodiment of the present invention.

[0034] Figure 15 This is the gain pattern of the antenna at 1.6 GHz provided by the embodiment of the present invention.

[0035] Figure 16 This is the gain pattern of the antenna at 1.66 GHz provided by the embodiment of the present invention.

[0036] Explanation of reference numerals: 1- stepped metal vibrator 2- printed circuit board 3- L-shaped metal baffle 4- bottom plate 5- dielectric screw 6- metal screw 7- U-shaped metal coating 8- matrix array loading coating 9- rectangular stepped groove 10- printed circuit board lower layer coating DETAILED DESCRIPTION

[0037] The accompanying drawings are for illustrative purposes only and are not to be construed as limiting this patent;

[0038] It is understandable to those skilled in the art that some well-known structures and their descriptions may be omitted in the drawings;

[0039] In order to illustrate the structure and features of the present invention in detail, the technical solution of the present invention is further described below with reference to the accompanying drawings and embodiments.

[0040] A low-profile end-fire antenna, comprising a stepped metal vibrator 1, a printed circuit board 2, an L-shaped metal baffle 3, a bottom plate 4, a dielectric screw 5, and a metal screw 6; wherein the printed circuit board 2 contains a U-shaped metal coating 7, a matrix array loading coating 8, a rectangular stepped groove 9, and a printed circuit board lower layer coating 10. Figure 1 、 Figure 2 、 Figure 4 and Figure 5 .

[0041] Furthermore, the step-shaped metal vibrator 1 is stepped and embedded from top to bottom in the rectangular step groove 9 of the printed circuit board 2. The outer dimensions of the rectangular step groove 9 are consistent with those of the step-shaped metal vibrator 1. The opening of the U-shaped metal coating 7 is consistent with the upper surface dimensions of the step-shaped metal vibrator 1. The upper surface of the step-shaped metal vibrator 1 is flush with the surface of the printed circuit board 2. The upper surface of the step-shaped metal vibrator 1 and the U-shaped metal coating 7 are welded or bonded with copper foil to ensure a close electrical connection between the two. Figures 2 to 4 .

[0042] Furthermore, the printed circuit board 2 is a double-sided printed circuit board, which includes a U-shaped metal coating 7, a matrix array loading coating 8, a rectangular stepped groove 9, and a printed circuit board lower coating 10. The U-shaped metal coating 7 and the matrix array loading coating 8 are located on the upper surface of the printed circuit board 2, and a rectangular stepped groove 9 is dug inside the printed circuit board 2. The printed circuit board lower coating 10 is located on the lower surface of the printed circuit board 2. Figures 4 to 6 .

[0043] Furthermore, the L-shaped metal baffle 3 is L-shaped, one side of the L-shaped metal baffle 3 is in contact with the printed circuit board 2, and the other side is fixedly connected to the bottom layer 4 by metal screws. Figure 2 、 Figure 7 .

[0044] Furthermore, the dielectric screw 5 is a non-metallic screw, one end of which is connected to the stepped metal vibrator 1 and the other end is connected to the bottom plate 4 , and mainly serves to fix the stepped metal vibrator 1 .

[0045] Furthermore, the metal screw 6 is a metal screw, mainly used to fix the printed circuit board 2 and the L-shaped metal baffle 3. Figure 2 .

[0046] Furthermore, the U-shaped metal coating 7 presents a U-shaped surface structure, the surface is flush with the upper surface of the stepped metal vibrator 1, the opening portion of the U-shaped metal coating 7 is used to pass through the stepped metal vibrator 1, and the side of the U-shaped metal coating 7 is connected to the side of the L-shaped metal baffle 3. Figure 2 and 4 .

[0047] Furthermore, the matrix array loading coating 8 is composed of multiple groups of rectangularly arranged coatings, which are flush with the surface of the U-shaped metal coating 7 but do not contact the U-shaped metal coating 7. Figure 4 .

[0048] Furthermore, the rectangular stepped groove 9 is used to place the stepped metal vibrator 1 inside the printed circuit board 2. The outer dimensions of the rectangular stepped groove 9 are consistent with the dimensions of the ladder-shaped metal vibrator 1. Figure 3 and Figure 5 .

[0049] Furthermore, the printed circuit board lower plating layer 10 is located on the lower surface of the printed circuit board 2 and contacts the bottom plate 4. The printed circuit board lower plating layer 10 has many avoidance holes with different apertures.

[0050] See also Figure 1 , Figure 1 This is a structural diagram of a low-profile end-fire antenna of the present invention, which includes a stepped metal vibrator 1, a printed circuit board 2, an L-shaped metal baffle 3, a bottom plate 4, a dielectric screw 5, and a metal screw 6.

[0051] In this embodiment, the installation position of the stepped metal vibrator 1 and the printed circuit board 2 is: the stepped metal vibrator 1 is embedded in the printed circuit board 2, and the two are flush with each other, and the two are tightly nested together, with a cross-sectional height of 20 mm, which is about 0.09λ. max , see Figure 2 .

[0052] In this embodiment, the step-type metal vibrator 1, see FIG. Figure 2 and 3 It consists of three metal sections of varying thicknesses, forming a stepped shape with a length of 54.5mm, a width of 15mm, a minimum thickness of 6mm, and a maximum thickness of 11.8mm. The stepped metal vibrator 1 has two holes for inserting dielectric screws 5 and a feed hole, one of which is located near the thickest end of the stepped metal vibrator 1. The stepped metal vibrator 1 is located at the center of the printed circuit board 2, near one side of the L-shaped metal baffle 3. The top surface of the stepped metal vibrator 1 is flush with the printed circuit board 2 and does not contact the L-shaped metal baffle 3. The stepped metal vibrator 1 is connected to the printed circuit board 2 and the base plate 4 via dielectric screws 5.

[0053] In this embodiment, the printed circuit board 2, see Figures 4 to 6 The printed circuit board (PCB) is nearly square and made of Arlon AD410™ sheet material with a dielectric constant of 4.1, a thickness of 20 mm, and dimensions of 134 mm by 130 mm. It has a central hollow area with a rectangular stepped groove 9. PCB 2 is double-sided, with a U-shaped metal coating 7 and a matrix array loading coating on its upper surface, and a lower PCB coating 10 on its lower surface. PCB 2 is fixed to the base plate 4 via metal screws 6.

[0054] In this embodiment, the U-shaped metal coating 7, see Figure 4 , presenting a U-shaped surface structure (black coating part), the surface is flush with the upper surface of the step-type metal vibrator 1, the opening part of the U-shaped metal coating 7 (white uncoated part) is used to pass through the step-type metal vibrator 1, and the U-shaped metal coating 7 is welded and contacted with the upper surface of the step-type metal vibrator 1 for electrical connection; the side of the U-shaped metal coating 7 is in contact with the side of the L-shaped metal baffle 3 for electrical connection.

[0055] In this embodiment, the matrix array is loaded with a plating layer 8, see Figure 4 It is composed of 2×5 groups of rectangularly arranged coating arrays. The size of a single rectangular coating is 20mm*7.5mm, and the distance between each rectangular coating is about 5mm. The matrix array loading coating 8 is flush with the surface of the U-shaped metal coating 7, but is not connected to the U-shaped metal coating 7 and the stepped metal vibrator 1.

[0056] In this embodiment, the printed circuit board lower layer 10, see Figure 6 , located on the lower surface of the printed circuit board 2, in contact with the bottom plate 4, the size of the lower plating layer 10 of the printed circuit board is 134mm*130mm, and there are many avoidance holes with different apertures on it.

[0057] In this embodiment, the L-shaped metal baffle 3, see Figure 7 The L-shaped metal baffle 3 is an aluminum plate in an L shape with a length of 130 mm, a width of 20 mm and a thickness of 2 mm. One side of the L-shaped metal baffle 3 contacts the printed circuit board 2. The length of the L-shaped metal baffle 3 is the same as the length of the contact end of the printed circuit board 2, and the width is the same as the thickness of the printed circuit board 2. Figure 1 The other side is fixedly connected to the base plate 4 by metal screws 6.

[0058] In this embodiment, the bottom plate 4 is an aluminum plate. Figure 8 , thickness is 3mm, size is 220mm*180mm, the upper surface of the bottom plate 4 contacts the lower layer of the printed circuit board 10. The base 4 is designed with interfaces for installation with other components, and there are many through holes of different diameters on it. The structural size parameters of the bottom plate 4 are shown in Figure 8 shown.

[0059] In this embodiment, the dielectric screw 5 is a nylon screw, one end of which is connected to the stepped metal vibrator 1 and the other end is connected to the bottom plate 4, mainly serving to fix the stepped metal vibrator 1.

[0060] In this embodiment, Figure 9 The antenna voltage standing wave ratio curve provided by the embodiment of the present invention is as follows: Figure 9 As can be seen, within the 1.34 GHz to 1.66 GHz frequency band, the antenna's voltage standing wave ratio (VSWR) is less than 2.0, providing good impedance characteristics within the antenna's operating frequency band. The VSWR can be optimized by adjusting the size and position of the stepped metal oscillator 1 , as well as the size of the matrix array loading layer 8 .

[0061] In this embodiment, Figures 10 to 16The antenna provided in the embodiment of the present invention has a gain pattern at 1.34GHz, 1.4GHz, 1.45GHz, 1.5GHz, 1.55GHz, 1.6GHz, and 1.66GHz, respectively. Figures 10 to 16 It can be seen that the antenna has good end-fire radiation characteristics in the frequency band of 1.34GHz to 1.66GHz, and the gain pattern is The cut surface appears to be warped, which is due to the influence of the base plate. The directivity pattern can be optimized and improved by loading the coating layer 8 with the matrix array.

[0062] Some of the techniques not described in detail in the present invention belong to those skilled in the art.

[0063] The above are only preferred embodiments of the present invention, which are intended to further illustrate the present invention rather than to limit it. Any simple replacement based on the contents disclosed in the above text and drawings is within the scope of protection of this patent.

Claims

1. A low-profile end-fire antenna, characterized in that: The invention comprises a stepped metal vibrator (1), a printed circuit board (2), an L-shaped metal baffle (3), a bottom plate (4), a dielectric screw (5), and a metal screw (6); wherein the upper surface of the printed circuit board (2) is provided with a U-shaped metal coating (7), a matrix array loading coating (8), and a rectangular stepped groove (9); the U-shaped metal coating (7) and the matrix array loading coating (8) are arranged in parallel, and the opening of the U-shaped metal coating faces the matrix array loading coating (8); and the rectangular stepped groove (9) is located in the opening of the U-shaped metal coating; The stepped metal vibrator (1) is embedded in a rectangular stepped groove (9) of a printed circuit board (2); the upper surface of the stepped metal vibrator (1) is flush with the upper surface of the printed circuit board (2) and is connected to the U-shaped metal coating (7); The printed circuit board lower plating layer (10) is located on the lower surface of the printed circuit board (2) and is in contact with the bottom plate (4); The L-shaped metal baffle (3) is L-shaped, one side of the L-shaped metal baffle (3) is in contact with the printed circuit board (2), and the other side is fixedly connected to the bottom plate (4) via metal screws (6); The dielectric screw (5) passes through the stepped metal vibrator (1) and the printed circuit board (2) and is connected to the bottom plate (4).

2. The low-profile end-fire antenna according to claim 1, characterized in that: The upper surface of the step-shaped metal vibrator (1) and the U-shaped metal plating layer (7) are connected by welding or by gluing with copper foil to achieve electrical connection between the two.

3. The low-profile end-fire antenna according to claim 1, characterized in that: The stepped metal vibrator (1) is completely adapted in the rectangular stepped groove (9) of the printed circuit board (2).

4. The low-profile end-fire antenna according to claim 1, characterized in that: The U-shaped metal coating (7) presents a U-shaped surface structure, the surface of which is flush with the upper surface of the stepped metal vibrator (1); the opening portion of the U-shaped metal coating (7) is used to pass through the stepped metal vibrator (1); and the side of the U-shaped metal coating (7) is connected to the side of the L-shaped metal baffle (3).

5. The low-profile end-fire antenna according to claim 1, wherein: The matrix array loading coating (8) is composed of a plurality of groups of rectangularly arranged coatings, is flush with the surface of the U-shaped metal coating (7), and does not contact the U-shaped metal coating (7).

6. The low-profile end-fire antenna according to claim 1, characterized in that: A plurality of avoidance holes are provided on the lower plating layer (10) of the printed circuit board.

7. The low-profile end-fire antenna according to claim 1, characterized in that: One side of the U-shaped metal coating (7) is electrically connected to the L-shaped metal baffle (3).

Images