Heat dissipation structure of heating element

Abstract

The present disclosure provides a heat dissipation structure for a heating element, wherein the heat dissipation structure uses a heat sink and includes: a plate; a heating element including a housing configured to have one surface attached to the plate, and a heating unit located inside the housing and radiating heat; an evaporation chamber positioned in close contact with the heating element and configured to receive and diffuse heat emitted from the heating element; a heat conducting pad configured to transfer heat received from the evaporation chamber to the heat sink; and a heat sink attached to the thermally conductive pad and configured to dissipate heat received from the thermally conductive pad.

Description

Technical Field

[0001] The present disclosure relates to a heat dissipation structure of a heating element. Background Art

[0002] The contents described in this section merely provide background information for the present disclosure and do not constitute prior art.

[0003] Electronic devices such as mobile phones, LED modules, laptop computers, and personal computers (PCs) are widely used. Each electronic device may include multiple electrical and electronic components, such as circuit boards, transceiver modules, and batteries.

[0004] Electrical and electronic components also include heating elements that generate heat. Examples include high-power and high-output amplifiers, high-speed and high-performance central processing units (CPUs), digital signal processors (DSPs), and field-programmable gate arrays (FPGAs).

[0005] The heat generated by the heating element may cause thermal degradation of the corresponding components or peripheral components, thereby reducing the performance of the electronic device or causing the electronic device to malfunction or damage. Therefore, a heat dissipation structure is required inside the electronic device to effectively dissipate the heat generated by the heating element.

[0006] In order to dissipate the heat generated by the heating element, a heat dissipation structure such as a radiator, a heat pipe, an evaporation chamber, etc. can be designed outside the heating element.

[0007] With the trend toward higher integration and higher output in electronic devices, the heat dissipation performance of heat sinks and other heat dissipation structures is becoming increasingly important. However, there are limits to improving the thermal conductivity of heat dissipation materials. Therefore, it is necessary to improve the heat dissipation performance of heat dissipation structures by modifying their design. Summary of the Invention

[0008] In the heat dissipation structure for the heating element according to the embodiment, a thermal compound may be located between the heating element and the evaporation chamber, and one surface of the heating element may be open.

[0009] Objects to be achieved by the present disclosure are not limited to the above-mentioned objects, and other objects not mentioned will be clearly understood by those skilled in the art from the following description.

[0010] According to an embodiment of the present disclosure, a heat dissipation structure for a heating element using a radiator includes: a board; a heating element including a housing and a heating unit, the housing being configured to have one surface attached to the board, the heating unit being located inside the housing and dissipating heat; an evaporation chamber positioned in close contact with the heating element and configured to receive and diffuse heat dissipated from the heating element; a thermal pad configured to transfer heat received from the evaporation chamber to the radiator; and a radiator attached to the thermal pad and configured to dissipate heat received from the thermal pad.

[0011] According to one embodiment, the heat dissipation structure of the heating element has the effect of improving the heat dissipation performance by placing thermal paste between the heating element and the evaporation chamber and opening one surface of the heating element. BRIEF DESCRIPTION OF THE DRAWINGS

[0012] Figure 1 It is a cross-sectional view of a conventional heat dissipation structure for a heating element.

[0013] Figure 2 is a diagram illustrating a coupling state of a heat dissipation structure for a heating element according to an embodiment of the present disclosure.

[0014] Figure 3 is an exploded view of a heat dissipation structure for a heating element according to an embodiment of the present disclosure.

[0015] Figure 4 is a cross-sectional view of a heat dissipation structure for a heating element according to an embodiment of the present disclosure.

[0016] Figure 5 4 is a comparison table of thermal resistances of a conventional heat dissipation structure for a heating element and a heat dissipation structure for a heating element according to the present disclosure. DETAILED DESCRIPTION

[0017] Hereinafter, some exemplary embodiments of the present disclosure will be described in detail with reference to the accompanying drawings. In the following description, although these elements are shown in different drawings, the same reference numerals preferably represent the same elements. In addition, in the following description of various exemplary embodiments of the present disclosure, for the sake of clarity and brevity, detailed descriptions of known functions and configurations included therein will be omitted.

[0018] In addition, various terms such as first, second, A, B, (a), (b), etc. are only used to distinguish one component from another, and do not imply or indicate the nature, order, or sequence of the components. Throughout this specification, when a component "includes" or "comprising" a component, unless otherwise specifically stated, the component is intended to further include rather than exclude other components. Terms such as "unit" and "module" refer to one or more units for processing at least one function or operation, which can be implemented by hardware, software, or a combination thereof.

[0019] In order to avoid confusion in understanding the present disclosure, "upward" or "upper surface" refers to the direction in which the heat sink 15 is disposed. In addition, "downward" or "lower surface" refers to the direction in which the board 11 is disposed.

[0020] Figure 1 It is a cross-sectional view of a conventional heat dissipation structure for a heating element.

[0021] Reference Figure 1 The conventional heat dissipation structure 1 for a heating element may include at least one or all of a plate 11 , a heating element 12 , a thermal pad 13 , an evaporation chamber 14 , a heat sink 15 or a thermal paste 16 .

[0022] The heating element 12 may be attached to the upper surface of the plate 11. A thermal pad 13 and an evaporation chamber 14 may be sequentially attached to the upper surface of the heating element 12. The thermal pad 13 is in the form of a double-sided tape containing an adhesive material, so that the heating element 12 and the evaporation chamber 14 can be attached to the opposite lower and upper surfaces of the thermal pad 13, respectively. A heat sink 15 may be attached to the upper surface of the evaporation chamber 14.

[0023] A thermal paste 16 as a fluid for transferring heat may be applied between the evaporation chamber 14 and the heat sink 15. That is, the thermal paste 16 may be applied at an interface between an upper surface of the evaporation chamber 14 and a lower surface of the heat sink 15.

[0024] The following briefly describes the heat dissipation mechanism of a conventional heat dissipation structure 1 for a heating element. Heat generated by heating element 12 can be transferred to thermal pad 13. Thermal pad 13 can transfer the heat received from heating element 12 to evaporation chamber 14. Evaporation chamber 14 can then diffuse the heat received from thermal pad 13 to heat sink 15.

[0025] The evaporation chamber 14 may transfer heat received through internal steam from the thermal pad 13 disposed below the lower surface of the evaporation chamber 14 to the heat sink 15 disposed on the upper surface of the evaporation chamber 14. To effectively diffuse the heat, the cross-sectional area of the upper surface of the evaporation chamber 14 may be larger than the cross-sectional area of the lower surface of the evaporation chamber 14.

[0026] The heat diffused by the evaporation chamber 14 can be transferred to the heat sink 15 through the thermal paste 16. The heat sink 15 may include a plurality of heat dissipation pins formed at predetermined intervals on its upper surface. The heat sink 15 may use the plurality of heat dissipation pins to dissipate heat. Therefore, the heat generated by the heating element 12 can be dissipated.

[0027] Figure 2 is a diagram illustrating a coupling state of a heat dissipation structure for a heating element according to an embodiment of the present disclosure.

[0028] Figure 3 is an exploded view of a heat dissipation structure for a heating element according to an embodiment of the present disclosure.

[0029] Figure 4 is a cross-sectional view of a heat dissipation structure for a heating element according to an embodiment of the present disclosure.

[0030] Reference Figures 2 to 4 The heat dissipation structure 2 for a heating element according to the present disclosure may include at least one or all of a plate 21 , a heating element 22 , a thermal pad 23 , an evaporation chamber 24 , a heat sink 25 , a thermal paste 26 or a connecting member 27 .

[0031] Compared to the conventional heat dissipation structure 1 for a heating element, the heat dissipation structure 2 for a heating element according to the present disclosure differs in the design positions of the thermal pad 23, evaporation chamber 24, and thermal paste 26. Furthermore, one surface of the heating element 22 can be exposed. Due to the modified design positions and the exposed surface of the heating element 22, the heat dissipation performance of the heat dissipation structure 2 for a heating element can be improved. Compared to the conventional heat dissipation structure 1 for a heating element, descriptions of common or identical components have been omitted.

[0032] The heating element 22 may include a housing 221 and a heating unit 222. The housing 221 may have a lidless shape with an open upper surface. The lower surface of the housing 221 may be attached to the board 21. The heating unit 222 may be located at the center of the interior of the housing 221. In this case, the heating unit 222 may be a device having a heat dissipation area smaller than the cross-sectional area of the housing 221, such as a field programmable gate array (FPGA). By adopting the lidless housing 221, the thermal resistance of the cover is eliminated, thereby improving the heat dissipation performance of the heat dissipation structure 2 of the heating element.

[0033] The evaporation chamber 24 may be positioned to be in close contact with the heating element 22. Specifically, a protrusion unit 241 may be formed on a lower surface of the evaporation chamber 24, and at least a portion of the protrusion unit 241 may be positioned to be inserted into the housing 221.

[0034] Thermal paste 26 may be applied between the evaporation chamber 24 and the heating element 22. Specifically, thermal paste 26 may be applied to the interface between the lower surface of the protrusion unit 241 and the upper surface of the heating unit 222. Thermal paste 26 is a thermal interface material (TIM) with minimal thickness that minimizes thermal resistance. Because thermal paste 26 is applied to the upper surface of the heating unit 222, which has a smaller cross-sectional area, the application area of the thermal paste 26 of the present disclosure can be smaller than that of conventional thermal paste 16.

[0035] In order to effectively diffuse heat, the upper surface of the evaporation chamber 24 may have a larger cross-sectional area than the lower surface of the evaporation chamber 24. Therefore, the heat transferred from the heating unit 222 having a smaller cross-sectional area may be widely diffused.

[0036] The thermal pad 23 may be attached to the upper surface of the evaporation chamber 24. Since the thermal pad 23 is attached to the upper surface of the evaporation chamber 24 and the upper surface of the evaporation chamber 24 has a larger cross-sectional area than the lower surface of the evaporation chamber 24, the cross-sectional area of the thermal pad 23 of the present disclosure may be larger than that of the conventional thermal pad 13.

[0037] The heat sink 25 can be attached to the upper surface of the thermal pad 23. The thermal pad 23 is in the form of a double-sided tape containing an adhesive material, so that the evaporation chamber 24 and the heat sink 25 can be attached to the opposite lower and upper surfaces of the thermal pad 23, respectively. Although the thermal paste 26 has a higher heat transfer efficiency than the thermal pad 23, the thermal pad 23 can be located between the evaporation chamber 24 and the heat sink 25 to absorb the accumulated tolerance of the heat dissipation structure 2 of the heating element in the height direction (z-axis).

[0038] The heat sink 25 may include a plurality of heat dissipation pins 252 formed at predetermined intervals on an upper surface thereof. The plurality of heat dissipation pins 252 may protrude from the upper surface of the heat sink 25 in the z-axis direction and may be formed at predetermined intervals in the y-axis direction.

[0039] The connecting member 27 may include a screw 271 and a washer 272. The washer 272 may be located between the evaporation chamber 24 and the plate 21. The washer 272 may prevent the heating element 22 from being subjected to excessive pressure from the evaporation chamber 24, the thermal pad 23, and the heat sink 25. If necessary, the washer 272 may be replaced with a washer 272 having an appropriate height.

[0040] The lower end of the gasket 272 may be coupled to the plate 21 by welding. The upper end of the gasket 272 may have a screw hole through which the screw 271 may be inserted. The screw 271 may pass through the evaporation chamber 24 from top to bottom and may be coupled to the gasket 272.

[0041] A plurality of grooves 251 may be formed on the lower surface of the heat sink 25. The screws 271 may be respectively received in the plurality of grooves 251 of the heat sink 25. Since the screws are respectively received in the plurality of grooves, the heat sink 25, the thermal pad 23, and the evaporation chamber 24 may be tightly bonded.

[0042] Reference Figure 1 and Figure 4Compared to conventional thermal paste 16, the thermal paste 26 of the present disclosure can be applied to a smaller area. On the other hand, the cross-sectional area of the thermal pad 13 of the present disclosure can be larger than that of conventional thermal pads 13. In other words, as the design positions of the thermal pad 23, evaporation chamber 24, and thermal paste 26 are changed, the application area of the thermal paste 26 and the cross-sectional area of the thermal pad 23 can be different from those of the prior art.

[0043] When the application area of thermal paste 26 and the cross-sectional area of thermal pad 23 change, the thermal resistance of thermal paste 26 and thermal pad 23 changes. This change in the thermal resistance of thermal paste 26 and thermal pad 23 improves the heat dissipation performance of heat dissipation structure 2 for a heating element. The following details the changes in the heat dissipation performance of heat dissipation structure 2 for a heating element caused by changes in the application area of thermal paste 26 and the cross-sectional area of thermal pad 23.

[0044] Figure 5 is a comparison table of thermal resistances between a conventional heat dissipation structure for a heating element and a heat dissipation structure for a heating element according to the present disclosure.

[0045] Thermal resistance refers to the property of a material that hinders the transfer of heat. The higher the thermal resistance, the lower the heat flow through the material. In other words, the lower the thermal resistance of the heating element's heat dissipation structure 2, the better the heat dissipation performance. Thermal resistance can be calculated using Equation 1.

[0046] R=L / (k×A) (1)

[0047] In Equation 1, “R” represents thermal resistance, “L” represents the thickness of the heat transfer material, “A” represents the cross-sectional area of the heat transfer material, and “k” represents the thermal conductivity of the heat transfer material.

[0048] Reference Figure 1 and Figure 5 , the evaporation chamber 14 of the conventional heat dissipation structure 1 for a heating element is identical to the evaporation chamber 24 of the heat dissipation structure 2 for a heating element according to the present disclosure, and therefore, they are not considered when calculating the thermal resistance.

[0049] Since the thermal pad 13 and the thermal paste 16 are connected in series, the thermal resistance of the conventional heat dissipation structure 1 for a heating element can be calculated as the sum of the thermal resistance R1 of the thermal pad 13 and the thermal resistance R2 of the thermal paste 16 .

[0050] When the thickness, cross-sectional area, and thermal conductivity of thermal pad 13 are substituted into Equation 1, the thermal resistance R1 of thermal pad 13 is 0.199 K / W. Similarly, when the thickness, cross-sectional area (applied area), and thermal conductivity of thermal paste 16 are substituted into Equation 1, the thermal resistance R2 of thermal paste 16 is 0.002 K / W. In other words, the thermal resistance R of the conventional heat dissipation structure 1 for a heating element is 0.201 K / W.

[0051] Since the thermal pad 23 and the thermal paste 26 are connected in series in the heat dissipation structure 2 for a heating element according to the present disclosure, the thermal resistance R′ may be calculated as the sum of the respective thermal resistances.

[0052] When the thickness, cross-sectional area, and thermal conductivity of thermal pad 23 are substituted into Equation 1, the thermal resistance R1' of thermal pad 23 is 0.011 K / W. Similarly, when the thickness, cross-sectional area (applied area), and thermal conductivity of thermal paste 26 are substituted into Equation 1, the thermal resistance R2' of thermal paste 26 is 0.042 K / W. In other words, the thermal resistance R' of the heat dissipation structure 2 for a heating element according to the present disclosure is 0.053 K / W.

[0053] The thermal resistance R' of the heat dissipation structure 2 for heating elements according to the present disclosure is 26% of the thermal resistance R of the conventional heat dissipation structure 1 for heating elements. That is to say, the heat dissipation structure 2 for heating elements according to the present disclosure has the effect of improving the heat dissipation performance compared with the conventional heat dissipation structure 1 for heating elements. For example, when the heating element generates 30W of heat, the temperature of the conventional heat dissipation structure 1 for heating elements will rise by about 6 degrees due to the thermal resistance R (ΔT=Q×R, where ΔT represents temperature change and Q represents heat). On the other hand, in the heat dissipation structure 2 for heating elements according to the present disclosure, the temperature rises by about 1.6 degrees due to the thermal resistance R'. Therefore, compared with the conventional heat dissipation structure 1 for heating elements, the temperature of the heat dissipation structure 2 for heating elements according to the present disclosure can be improved by about 4.5 degrees.

[0054] The above description is merely an example of the technical concept of the present embodiment, and those skilled in the art may make various modifications and variations without departing from the concept and scope of the present embodiment. Therefore, the present embodiment is not intended to limit the technical concept of the present embodiment, but is used for explanation, and the scope of the technical concept of the present embodiment is limited by these embodiments. The scope of protection of the present embodiment should be interpreted according to the appended claims, and all technical concepts within the scope equivalent thereto should be interpreted as included within the scope of rights of the present embodiment.

Claims

1. A heat dissipation structure for a heating element, wherein: The heat dissipation structure adopts a radiator and includes: plate; the heating element including a housing configured to have one surface attached to the plate and a heating unit located inside the housing and radiating heat; an evaporation chamber positioned in close contact with the heating element and configured to receive and diffuse heat emitted from the heating element; a thermal pad configured to transfer heat received from the evaporation chamber to the heat sink; and The heat sink is attached to the thermal pad and is configured to dissipate heat received from the thermal pad. 2 . The heat dissipation structure according to claim 1 , further comprising a thermally conductive paste applied between the heating element and the evaporation chamber to transfer heat from the heating element to the evaporation chamber.

3. The heat dissipation structure according to claim 2, wherein: The housing is configured such that the other surface of the housing parallel to the one surface is open.

4. The heat dissipation structure according to claim 3, wherein: The thermal paste is coated on an upper surface of the heating unit.

5. The heat dissipation structure according to claim 3, wherein: The evaporation chamber includes a protrusion unit, at least a portion of which is inserted into the housing.

6. The heat dissipation structure according to claim 1, wherein: The thermal pad is configured to bond the evaporation chamber and the heat sink. 7 . The heat dissipation structure according to claim 1 , further comprising at least one connecting member configured to connect the evaporation chamber and the plate.

8. The heat dissipation structure according to claim 7, wherein: The connecting member comprises: a screw configured to pass through the evaporation chamber; and A gasket is positioned between the evaporation chamber and the plate and is configured to be coupled to the screw.

9. The heat dissipation structure according to claim 8, wherein: The gasket is coupled to the plate by welding.

10. The heat dissipation structure according to claim 8, wherein: The heat sink includes a recess configured to receive at least a portion of the screw.

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