Heat dissipation device, controller, heat dissipation method, power assembly and vehicle

Abstract

The invention relates to a heat dissipation device, a controller, a heat dissipation method, a power assembly and a vehicle, the heat dissipation device comprises a shell and a movable spoiler, the shell is provided with a cooling cavity, and the movable spoiler can be inserted into or moved out of the cooling cavity. In the heat dissipation device, as the movable turbulent flow piece can be inserted into or moved out of the cooling cavity, the heat dissipation device has various different heat dissipation performance, the heat dissipation performance matched with the heat dissipation requirement of the piece to be subjected to heat dissipation is provided according to the heat dissipation requirement of the piece to be subjected to heat dissipation, and therefore the heat dissipation effect of the piece to be subjected to heat dissipation is improved.

Description

Technical Field

[0001] The present application relates to the technical field of heat dissipation equipment, and in particular to a heat dissipation device, a controller, a heat dissipation method, a powertrain, and a vehicle. Background Art

[0002] When a fluid (such as coolant) flows through a heat sink's cooling channel, a boundary layer forms near the inner wall, weakening the heat transfer capability. To improve the heat dissipation performance of a heat sink, spoilers are often installed to disrupt the stable structure of this boundary layer, creating eddies and turbulence within the cooling channel, thereby increasing heat transfer efficiency and enhancing heat dissipation.

[0003] In related technologies, the placement of spoilers is relatively fixed, making it difficult to flexibly adjust the heat dissipation effect of the heat dissipation device according to the specific needs of the heat dissipation component. For example, in certain working scenarios, the heat generated by the heat dissipation component is relatively high, so a stronger spoiler effect is required to enhance the heat transfer effect. However, fixed spoilers are difficult to meet the heat dissipation requirements of the heat dissipation component. Summary of the Invention

[0004] Embodiments of the present application provide a heat dissipation device, a controller, a heat dissipation method, a powertrain, and a vehicle, which can adaptively adjust the heat dissipation effect of the heat dissipation device to match the heat dissipation requirements of the components to be cooled, so as to at least partially solve the above-mentioned technical problems.

[0005] To achieve the above objectives, according to a first aspect of the present application, a heat dissipation device is provided, comprising a housing and a movable spoiler, wherein the housing has a cooling chamber, and the movable spoiler can be inserted into or removed from the cooling chamber.

[0006] Optionally, the housing includes an opposing side wall, and the movable spoiler is opposite to the opposing side wall; the movable spoiler has a first state and a second state, in the first state, the movable spoiler abuts the opposing side wall; in the second state, the movable spoiler is inserted into the cooling chamber and is spaced apart from the opposing side wall.

[0007] Optionally, the heat dissipation device further includes a fixed spoiler, and the fixed spoiler is fixed in the cooling chamber.

[0008] Optionally, the fixed spoiler includes a plurality of first spoiler rows arranged side by side along a first direction; the movable spoiler includes a plurality of second spoiler rows arranged side by side along the first direction, and the plurality of second spoiler rows are arranged alternately with the plurality of first spoiler rows.

[0009] Optionally, each of the first spoiler rows includes a plurality of first spoiler portions spaced apart along a second direction, where the second direction intersects the first direction; and each of the second spoiler rows includes a plurality of second spoiler portions spaced apart along the second direction.

[0010] Optionally, the shell is provided with a liquid inlet and a liquid outlet connected to the cooling chamber, and the liquid inlet and the liquid outlet define a flow channel for the liquid; the direction in which the movable spoiler is inserted into the cooling chamber is perpendicular to the flow direction of the liquid flowing through the movable spoiler.

[0011] Optionally, the liquid inlet and the liquid outlet are located on the same side of the shell; the heat dissipation device also includes an isolation member located in the cooling chamber, the isolation member divides the cooling chamber into a first chamber and a second chamber, the first chamber is connected to the liquid inlet, and the second chamber is connected to the liquid outlet; at least one opening is provided on the isolation member to connect the first chamber and the second chamber.

[0012] Optionally, along the length direction of the isolating member, a plurality of openings spaced apart from each other are provided on the isolating member; the heat dissipation device further comprises a movable closing member located at each of the openings, and the movable closing member can close or open the corresponding opening.

[0013] Optionally, the heat dissipation device is used to dissipate heat for power devices; the heat dissipation device also includes a power detector, which is used to detect the operating power of the power device, so that the movable spoiler is inserted into or removed from the cooling chamber according to the operating power.

[0014] Optionally, the heat dissipation device further includes a temperature detector, which is used to detect the temperature of the power device, so that the movable spoiler adjusts the length extending into the cooling chamber according to the temperature and the operating power.

[0015] According to a second aspect of the present application, a controller is provided, comprising the heat dissipation device described in any embodiment of the first aspect.

[0016] According to a third aspect of the present application, a powertrain is provided, comprising the controller according to the second aspect.

[0017] According to a fourth aspect of the present application, a vehicle is provided, comprising the powertrain according to the third aspect.

[0018] According to a fifth aspect of the present application, a heat dissipation method is provided, which is applied to the controller described in the second aspect. The heat dissipation method includes:

[0019] detecting the operating power of the power device;

[0020] When the operating power is less than a power threshold, controlling the movable spoiler to be located outside the cooling chamber; and

[0021] When the operating power is greater than or equal to the power threshold, the movable spoiler is controlled to be inserted into the cooling chamber.

[0022] Optionally, the heat dissipation method further includes:

[0023] detecting the temperature of the power device;

[0024] When the operating power is greater than or equal to the power threshold, controlling the movable spoiler to be inserted into the cooling chamber comprises:

[0025] When the operating power is greater than or equal to the power threshold and less than the power limit, and the temperature is less than the temperature limit, controlling the movable spoiler to be inserted into the cooling chamber so that the movable spoiler and the corresponding side wall of the housing are spaced apart from each other; and

[0026] When the operating power is greater than or equal to the power limit and the temperature is greater than or equal to the temperature limit, the movable spoiler is controlled to abut against the alignment side wall.

[0027] Optionally, when the operating power is greater than or equal to the power threshold and less than the power limit, and the temperature is less than the temperature limit, controlling the movable spoiler to be inserted into the cooling chamber so that the movable spoiler and the corresponding side wall of the housing are spaced apart from each other includes:

[0028] When the operating power is greater than or equal to the power threshold and less than the power limit, and the temperature is less than the temperature threshold, controlling the movable spoiler to be inserted into the cooling chamber so that a first spacing is formed between the movable spoiler and the aligned sidewall, and a ratio of the first spacing to a length of the movable spoiler extending into the cooling chamber is greater than or equal to 1 and less than or equal to 3, wherein the temperature threshold is less than the temperature limit; and

[0029] When the operating power is greater than or equal to the power threshold and less than the power limit, and the temperature is greater than or equal to the temperature threshold and less than the temperature limit, the movable spoiler is controlled to be inserted into the cooling chamber so that a second distance is formed between the movable spoiler and the aligned side wall, and a ratio of the second distance to a length of the movable spoiler extending into the cooling chamber is greater than 0 and less than or equal to 1.

[0030] Optionally, the heat dissipation method further includes:

[0031] detecting the temperature of the power device;

[0032] When the operating power is less than a power threshold, controlling the movable spoiler to be located outside the cooling chamber includes:

[0033] When the temperature is lower than a temperature threshold and the operating power is lower than a power threshold, the movable spoiler is controlled to be located outside the cooling chamber.

[0034] In the heat dissipation device of the embodiment of the present application, since the movable spoiler can be inserted into or removed from the cooling chamber, the heat dissipation device has a variety of different heat dissipation performances, thereby providing heat dissipation performance that matches the heat dissipation requirements of the heat dissipation component to be cooled, thereby improving the heat dissipation effect on the heat dissipation component to be cooled. For example, when the heat dissipation requirement of the heat dissipation component to be cooled is relatively low, the movable spoiler can be removed from the cooling chamber, thereby providing the heat dissipation device with relatively low heat dissipation performance to match the heat dissipation requirement of the heat dissipation component to be cooled. When the heat dissipation requirement of the heat dissipation component to be cooled is relatively high, the movable spoiler can be inserted into the cooling chamber, thereby providing the heat dissipation device with relatively high heat dissipation performance to match the heat dissipation requirement of the heat dissipation component to be cooled.

[0035] Other features and advantages of the present application will be described in detail in the subsequent detailed description. BRIEF DESCRIPTION OF THE DRAWINGS

[0036] To more clearly illustrate the technical solutions in the embodiments of the present application, the following briefly introduces the drawings required for describing the embodiments. Obviously, the drawings described below are only some embodiments of the present application. Those skilled in the art can also derive other drawings based on these drawings without inventive effort.

[0037] In order to more completely understand the present application and its beneficial effects, the following description will be given in conjunction with the accompanying drawings, wherein the same drawing numbers represent the same parts in the following description.

[0038] Figure 1 is a top view of a heat dissipation device provided by some embodiments of the present disclosure;

[0039] Figure 2 yes Figure 1 Cross-sectional view along A-A';

[0040] Figure 3 yes Figure 1 Schematic diagram of the structure of the heat dissipation device without a cover plate;

[0041] Figure 4 yes Figure 1 Exploded structure diagram;

[0042] Figure 5is a schematic diagram of a flow channel in a heat dissipation device according to some embodiments of the present disclosure;

[0043] Figure 6 is a schematic structural diagram of a vehicle provided by some embodiments of the present disclosure;

[0044] Figure 7 This is a flow chart of a heat dissipation method provided by some embodiments of the present disclosure.

[0045] Description of reference numerals:

[0046] 10. Housing; 101. Cooling chamber; 101A. First chamber; 101B. Second chamber; 11. Housing; 11A. Liquid inlet; 11B. Liquid outlet; 111. First flow channel; 112. Second flow channel; 111A. First region; 111B. Second region; 111C. Third region; 111D. Fourth region; 12. Cover; 121. Alignment sidewall; 13. Mounting frame;

[0047] 20. Movable spoiler; 21. Second spoiler row; 211. Second spoiler portion;

[0048] 30. Fixed spoiler; 31. First spoiler row; 311. First spoiler portion;

[0049] 40. Isolation member; 401. Opening;

[0050] 50. Movable closures;

[0051] 100, heat dissipation device; 200, power device; 300, controller; 400, motor; 500, powertrain; 600, battery; 1000, vehicle;

[0052] X, first direction; Y, second direction; Z, third direction. DETAILED DESCRIPTION

[0053] The following will be combined with the drawings in the embodiments of the present application to clearly and completely describe the technical solutions in the embodiments of the present application. Obviously, the embodiments described are only part of the embodiments of the present application, not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without creative work are within the scope of protection of the present application.

[0054] Some embodiments of the present disclosure provide a heat dissipation device, such as Figures 1 to 3 As shown, the heat dissipation device 100 includes a housing 10 and a movable spoiler 20 .

[0055] The housing 10 has a cooling chamber 101, and the movable spoiler 20 can be inserted into or removed from the cooling chamber 101. When inserted into the cooling chamber 101, the movable spoiler 20 can change the flow direction and velocity distribution of the fluid, thereby generating eddies and turbulence within the cooling chamber 101, increasing the degree of mixing within the fluid, transferring heat more evenly throughout the fluid, and avoiding local overheating. At the same time, it also allows the fluid to more fully contact the inner wall surface of the cooling chamber 101, thereby improving heat exchange efficiency.

[0056] In this embodiment, because the movable spoiler 20 can be inserted into or removed from the cooling chamber 101, the heat sink 100 has a variety of different heat dissipation properties, providing heat dissipation properties that match the heat dissipation requirements of the heat dissipation component to be cooled, thereby improving the heat dissipation effect on the heat dissipation component to be cooled. For example, when the heat dissipation requirement of the heat dissipation component to be cooled is relatively low, the movable spoiler 20 can be removed from the cooling chamber 101, thereby providing the heat sink with lower heat dissipation properties to match the heat dissipation requirement of the heat dissipation component to be cooled. When the heat dissipation requirement of the heat dissipation component to be cooled is relatively high, the movable spoiler 20 can be inserted into the cooling chamber 101, thereby providing the heat sink with higher heat dissipation properties to match the heat dissipation requirement of the heat dissipation component to be cooled.

[0057] It is worth noting that in related art, due to the relatively fixed placement of the spoiler, the fluid is prone to flow separation and wake vortices, causing flow losses, resulting in greater resistance to the fluid in the cooling chamber 101, increased pump power requirements (e.g., water pump), and increased energy consumption of the heat sink 100. In this embodiment, however, because the movable spoiler 20 can be selectively inserted into or removed from the cooling chamber 101, problems such as flow separation and wake vortices can be effectively alleviated, thereby reducing the resistance to the fluid and, in turn, lowering the energy consumption of the heat sink 100.

[0058] In some examples, the housing 10 includes a shell 11 and a cover 12, wherein the cover 12 is fixed to the shell 11 to define a cooling chamber 101. For example, the cover 12 can be fixed to the shell 11 by bolts, and a sealing ring can be provided between the cover 12 and the shell 11 to prevent leakage of fluid in the cooling chamber 101.

[0059] The cooling chamber 101 is used to contain a fluid to exchange heat through the fluid to achieve heat dissipation of the heat dissipation element. The fluid can be a liquid or a gas. This embodiment of the present disclosure does not limit this.

[0060] In some embodiments, as Figures 2 to 4As shown, the housing 10 includes a counter-positioning sidewall 121, and the movable spoiler 20 is directly opposite the counter-positioning sidewall 121. One side of the housing 10 is used to mount the movable spoiler 20. After the movable spoiler 20 is mounted, the movable spoiler 20 is directly opposite the counter-positioning sidewall 121 on the other side of the housing 10. The area where the orthographic projection of the movable spoiler 20 on the other side of the housing 10 is located is the area where the counter-positioning sidewall 121 is located.

[0061] The movable spoiler 20 has a first state and a second state. In the first state, the movable spoiler 20 abuts against the opposing side wall 121 . In the second state, the movable spoiler 20 is inserted into the cooling chamber 101 and spaced apart from the opposing side wall 121 .

[0062] That is, when the movable spoiler 20 is inserted into the cooling chamber 101, the movable spoiler 20 has two states, one of which is in contact with the opposing side wall 121, and the other is not in contact with the opposing side wall 121. When the movable spoiler 20 is in contact with the opposing side wall 121, the movable spoiler 20 is in the first state, at which time the movable spoiler 20 has the best disruptive effect on the surrounding fluid, and the heat dissipation performance of the heat dissipation device 100 is the strongest. When the movable spoiler 20 is not in contact with the opposing side wall 121, the movable spoiler 20 is in the second state, at which time the movable spoiler 20 has a relatively poor disruptive effect on the surrounding fluid, and the heat dissipation performance of the heat dissipation device 100 is higher than when the movable spoiler 20 is removed from the cooling chamber 101, but lower than when the movable spoiler 20 is in contact with the opposing side wall 121.

[0063] In some examples, such as Figure 4 As shown, the movable spoiler 20 includes a drive motor and a movable spoiler body. The drive motor can drive the movable spoiler body to move linearly. This allows the movable spoiler body to be inserted into or removed from the cooling chamber 101. As an example, the housing 10 can have a mounting hole, through which the movable spoiler body can be inserted into the cooling chamber 101. The housing 10 is also provided with a seal at the mounting hole to prevent fluid leakage through the gap between the movable spoiler body and the housing 10 when the movable spoiler body is moving or stationary in the mounting hole.

[0064] In some examples, a mounting frame 13 for fixing the driving motor is provided on the housing 11 , so as to ensure the operational stability of the movable spoiler 20 . The mounting frame 13 can be fixedly connected to the housing 11 .

[0065] In some embodiments, as Figure 3 and Figure 4 As shown, the heat dissipation device 100 further includes a fixed spoiler 30 , which is fixed in the cooling chamber 101 .

[0066] By providing a fixed spoiler 30, the basic heat dissipation performance of the heat dissipation device 100 can be improved. That is, when the movable spoiler 20 is moved out of the cooling chamber 101, the fixed spoiler 30 can form a spoiler effect on the surrounding fluid, thereby ensuring that the heat dissipation device 100 has a higher basic heat dissipation performance.

[0067] In some embodiments, please refer to Figure 3 and Figure 4 The fixed spoiler 30 includes a plurality of first spoiler rows 31 arranged side by side along the first direction X, and the movable spoiler 20 (such as the movable spoiler body) includes a plurality of second spoiler rows 21 (such as the movable spoiler body) arranged side by side along the first direction X. Figure 3 In the figure (shown in the dotted box), a plurality of second spoiler rows 21 and a plurality of first spoiler rows 31 are arranged alternately.

[0068] In this case, since the fixed spoiler 30 includes a plurality of first spoiler bars 31 and the movable spoiler 20 includes a plurality of second spoiler bars 21, and the arrangement direction of the plurality of first spoiler bars 31 is the same as the arrangement direction of the plurality of second spoiler bars 21, the fluid in a larger area can be disturbed, thereby ensuring that the heat dissipation device 100 has better heat dissipation performance. In addition, since the plurality of first spoiler bars 31 and the plurality of second spoiler bars 21 are arranged alternately, a better spoiler effect can be achieved by the plurality of first spoiler bars 31 when the plurality of second spoiler bars 21 are moved out of the cooling chamber 101, thereby ensuring that the heat dissipation device 100 has better basic heat dissipation performance.

[0069] As an example, Figure 3 As shown, multiple spoiler bars are arranged in N rows along the first direction X, wherein the spoiler bars in odd-numbered rows are first spoiler bars 31, and the spoiler bars in even-numbered rows are second spoiler bars 21. When the second spoiler bars 21 are removed from or inserted into the cooling chamber 101, the arrangement density of the spoiler bars changes. In this way, the heat dissipation performance of the heat sink 100 can be adjusted by changing the arrangement density of the spoiler bars to adapt to the heat dissipation requirements of the heat dissipation element. It is worth noting that the arrangement density of the spoiler bars refers to the number of spoiler bars per unit area.

[0070] In some embodiments, please refer to Figure 3 and Figure 4 Each first spoiler row 31 includes a plurality of first spoiler portions 311 spaced apart along a second direction Y, and each second spoiler row 21 includes a plurality of second spoiler portions 211 spaced apart along a second direction Y. The second direction Y intersects the first direction X. For example, the second direction Y is perpendicular to the first direction X.

[0071] By arranging that each first spoiler row 31 includes multiple first spoiler portions 311, each second spoiler row 21 includes multiple second spoiler portions 211, and the arrangement direction of the multiple first spoiler portions 311 and the multiple second spoiler portions 211 are the same, the fluid within a certain area can be disturbed, thereby ensuring that the heat dissipation device 100 has good heat dissipation performance.

[0072] As an example, the first spoilers 311 in each first spoiler row 31 are arranged at equal intervals, and the second spoilers 211 in each second spoiler row 21 are arranged at equal intervals. This facilitates the production of the fixed spoiler 30 and the movable spoiler 20.

[0073] For example, the number of first spoilers 311 in each first spoiler row 31 may be the same as the number of second spoilers 211 in each second spoiler row 21. In this case, all spoilers (including the first spoilers 311 and the second spoilers 211) in the plurality of spoiler rows are arranged in an array.

[0074] In some examples, the first spoiler 311 and the second spoiler 211 can have the same structure. For example, the spoilers (including the first spoiler 311 and the second spoiler 211) can have a raindrop-shaped structure, a needle-shaped structure, a streamlined structure, or a columnar structure. The spoilers can change the flow direction and speed of the fluid, thereby increasing the convective heat transfer coefficient and reducing the heat transfer resistance, thereby improving the heat transfer efficiency of the fluid.

[0075] In the case of a raindrop-shaped spoiler, the spoiler includes multiple subcomponents sequentially arranged along its length, each subcomponent having a raindrop-shaped cross-section, and the larger ends of the multiple subcomponents are located on the side of the spoiler closest to the opposing sidewall 121. This arrangement, on the one hand, enhances the spoiler's turbulent effect through the raindrop-shaped structure, thereby enhancing the heat dissipation performance of the heat dissipation device 100; on the other hand, it ensures the structural stability of the end of the second spoiler 211 closest to the opposing sidewall 121 when it abuts the opposing sidewall 121, preventing the tip of the second spoiler 211 from piercing the opposing sidewall 121 or otherwise being damaged.

[0076] When the spoiler has a columnar structure, the size of the spoiler at each position along the length direction thereof is equal.

[0077] To facilitate the description of the present disclosure, some of the following embodiments are illustrated using liquid as the fluid.

[0078] In some embodiments, please refer to Figure 3 and Figure 4The housing 10 is provided with a liquid inlet 11A and a liquid outlet 11B communicating with the cooling chamber 101. The liquid inlet 11A and the liquid outlet 11B define a liquid flow channel. The direction in which the movable spoiler 20 is inserted into the cooling chamber 101 (eg Figure 3 The third direction Z) shown in FIG is perpendicular to the flow direction of the liquid flowing through the movable spoiler 20 .

[0079] By inserting the movable spoiler 20 into the cooling chamber 101 perpendicular to the flow direction of the liquid through the movable spoiler 20 , it can be ensured that the movable spoiler 20 has a good disruptive effect on the liquid, thereby improving the heat dissipation performance of the heat dissipation device 100.

[0080] In some examples, the length direction of the fixed spoiler 30 is perpendicular to the flow direction of the liquid through the movable spoiler 20 , so that the fixed spoiler 30 can ensure that it has a good spoiling effect on the liquid, thereby improving the basic heat dissipation performance of the heat dissipation device 100 .

[0081] In some embodiments, please refer to Figure 3 and Figure 4 , the liquid inlet 11A and the liquid outlet 11B are located on the same side of the housing 10 .

[0082] The heat dissipation device 100 further includes an isolation member 40 located in the cooling chamber 101 . The isolation member 40 divides the cooling chamber 101 into a first chamber 101A and a second chamber 101B. The first chamber 101A is connected to the liquid inlet 11A, and the second chamber 101B is connected to the liquid outlet 11B.

[0083] At least one opening 401 is defined in the isolation member 40, connecting the first chamber 101A and the second chamber 101B. In this manner, the cooled liquid first enters the first chamber 101A through the liquid inlet 11A, then enters the second chamber 101B through the opening 401, and finally exits through the liquid outlet 11B. The cooled liquid exchanges heat in at least one of the first chamber 101A and the second chamber 101B, ultimately being discharged as heated liquid from the liquid outlet 11B, thereby achieving heat dissipation from the heat sink 100.

[0084] In this embodiment, since the liquid inlet 11A and the liquid outlet 11B are located on the same side of the housing 10, the flow channel of the liquid can be extended, so that multiple heat dissipating components can be arranged in various settings of the flow channel according to the heat dissipation requirements of the multiple heat dissipating components, so that the multiple heat dissipating components can achieve good heat dissipation effects.

[0085] As an example, among multiple heat dissipation components to be cooled, the heat dissipation components to be cooled that have a higher heat dissipation demand (for example, components to be cooled that generate severe heat) can be arranged in the flow channel near the liquid inlet 11A, while the heat dissipation components to be cooled that have a lower heat dissipation demand (for example, components to be cooled that generate less heat) can be arranged in the flow channel near the liquid outlet 11B. Since the closer the position is to the liquid inlet 11A, the closer the temperature of the liquid is to the temperature when it is input into the flow channel. The above arrangement can make the temperature difference between the liquid and the heat dissipation components to be cooled that are arranged near the liquid inlet 11A relatively large, thereby achieving a good heat dissipation effect for the heat dissipation components to be cooled that have a higher heat dissipation demand; in addition, since the heat dissipation demand of the heat dissipation components to be cooled that are arranged near the liquid outlet 11B is relatively small, only a small temperature difference is required to achieve the heat dissipation of the liquid to the heat dissipation components to be cooled. Therefore, in this embodiment, both the heat dissipation components to be cooled that have a higher heat dissipation demand and the heat dissipation components to be cooled that have a lower heat dissipation demand can achieve a good heat dissipation effect.

[0086] In some embodiments, as Figure 3 As shown, along the length direction of the isolation member 40, the isolation member 40 is provided with a plurality of openings 401 spaced apart from each other. For example, along the second direction Y, the plurality of openings 401 are spaced apart from each other.

[0087] The heat dissipation device 100 further includes a movable sealing member 50 located at each opening 401, which can close or open the corresponding opening 401. When any opening 401 is opened by the movable sealing member 50, the first chamber 101A and the second chamber 101B are in communication.

[0088] In some examples, such as Figure 4 As shown, each movable sealing member 50 includes a drive motor and a sealing plate connected to the output of the drive motor. The drive motor can drive the sealing plate to move toward or away from the cover plate 12. When the sealing plate abuts the cover plate 12, it closes the corresponding opening 401; when the sealing plate is spaced apart from the cover plate 12, the sealing plate opens the corresponding opening 401.

[0089] As an example, Figure 5 As shown, among the plurality of openings 401, when the opening 401 closest to the liquid inlet 11A is opened and the other openings 401 are closed, a Figure 4 The first flow channel 111 shown in the figure, the flow direction of the liquid in the first flow channel 111 is shown by the arrow in the figure. At this time, the flow channel of the liquid is the shortest, so that the heat dissipation components located in the first area 111A and the second area 111B can be cooled. Figure 4 The area shown by the dotted box.

[0090] Among the plurality of openings 401, when the opening 401 farthest from the liquid inlet 11A is opened and the other openings 401 are closed, a Figure 4 The second flow channel 112 is shown in the figure, and the flow direction of the liquid in the second flow channel 112 is shown by the arrow in the figure. At this time, the flow channel of the liquid is the longest, so that the heat can be dissipated to multiple heat dissipation components located in the first area 111A, the second area 111B, the third area 111C and the fourth area 111D. Among them, the first area 111A to the fourth area 111D are Figure 4 The area shown by the dotted box.

[0091] Therefore, for the heat dissipation device 100 provided in the embodiment of the present disclosure, it can perform zoning control on the heat dissipation components in different areas as needed. By controlling the opening of different openings 401, the length of the flow channel of the liquid can be changed, thereby accurately controlling the flow area of the liquid and the resistance to the liquid, and reducing the power consumption of the pump body. In addition, the heat dissipation device 100 provided in this embodiment also adjusts the state of the movable spoiler 20 inserted into or removed from the cooling chamber 101, so that the resistance to the liquid can be further finely adjusted, thereby adaptively adjusting the heat dissipation performance of the heat dissipation device 100 according to the heat dissipation conditions of the heat dissipation component to be dissipated, thereby reducing the energy consumption of the heat dissipation device 100 while ensuring a good heat dissipation effect on the heat dissipation component.

[0092] It is worth mentioning that Figure 3 Only one drive motor is shown driving all first spoilers 311 in the active spoiler body. In actual applications, all first spoilers 311 can be divided into multiple sets, each set spaced apart from the others. Multiple drive motors can then be provided to drive each set separately. This allows only the first spoilers 311 in a subset of sets to be inserted into or removed from the cooling chamber 101 as needed. This helps reduce the operating energy consumption of the active spoiler 20, thereby reducing the energy consumption of the heat dissipation device 100.

[0093] In some embodiments, as Figure 6 As shown, the heat dissipation device 100 is used to dissipate heat from a power device 200. Specifically, the heat dissipation component is the power device 200. The power device 200 includes at least one of a high-voltage controller and a low-voltage controller. The high-voltage controller can be used for vehicle power control, while the low-voltage controller can be used for intelligent driving control of the vehicle.

[0094] For example, the power device 200 includes at least one high-voltage controller; or, the power device 200 includes at least one low-voltage controller; or, the power device 200 includes at least one high-voltage controller and at least one low-voltage controller.

[0095] The heat dissipation device 100 further includes a power detector for detecting the operating power of the power device so that the movable spoiler 20 is inserted into or removed from the cooling chamber 101 according to the operating power.

[0096] In this case, the movable spoiler 20 can be adjusted according to the actual working conditions of the power device, so that the movable spoiler 20 is in different working states (such as the first state or the second state).

[0097] In some embodiments, please refer to Figure 6 The heat dissipation device 100 further includes a temperature detector for detecting the temperature of the power device 200 . The movable spoiler 20 can adjust the length of its own extension into the cooling chamber 101 according to the temperature and the operating power.

[0098] It is worth noting that the different lengths of the movable spoiler 20 extending into the cooling chamber 101 indicate different operating states of the movable spoiler 20. Furthermore, the greater the length of the movable spoiler 20 extending into the cooling chamber 101, the better the spoiler 20's effect on the surrounding liquid, and the stronger the heat dissipation performance of the heat dissipation device 100.

[0099] In this embodiment, by detecting the temperature and operating power of the power device and adjusting the length of the movable spoiler 20 extending into the cooling chamber 101 according to the temperature and operating power, the heat dissipation performance of the heat dissipation device 100 can simultaneously match the current operating power and current temperature of the power device, thereby finely matching the heat dissipation requirements of the power device, thereby achieving good heat dissipation effect while reducing the energy consumption of the heat dissipation device 100.

[0100] The temperature detector can be integrated into the power device or provided separately.

[0101] As an example, the heat dissipation device 100 may also include a processing module, which is electrically connected to the temperature detector and the power detector, so that the temperature detected by the temperature detector and the operating power detected by the power detector can be obtained, and then the active spoiler 20 is controlled to be inserted into the cooling chamber 101 to a certain depth according to the temperature and the operating power.

[0102] In some examples, the power device 200 includes multiple control mechanisms (high voltage controllers and / or low voltage controllers), multiple temperature detectors are provided and correspond one-to-one with the multiple control mechanisms, and multiple power devices are provided and correspond one-to-one with the multiple control mechanisms.

[0103] Some embodiments of the present disclosure further provide a controller, such as Figure 6 As shown, the controller 300 includes a power device 200 and the heat dissipation device 100 described in any of the above embodiments.

[0104] As an example, the power device 200 is disposed on the cover plate 12. The cover plate 12 can realize heat exchange between the power device 200 and the liquid, thereby achieving heat dissipation of the power device 200.

[0105] Some embodiments of the present disclosure also provide a powertrain, please continue to refer to Figure 6 , the powertrain 500 includes the controller 300 described in the above embodiment.

[0106] As an example, the powertrain 500 further includes a motor 400 , and the controller 300 is electrically connected to the motor 400 .

[0107] Some embodiments of the present disclosure also provide a vehicle, please continue to refer to Figure 6 , the vehicle 1000 includes the powertrain 500 described in the above embodiment.

[0108] As an example, the vehicle 1000 further includes a battery 600 , and the powertrain 500 is electrically connected to the battery 600 .

[0109] Since the controller 300, powertrain 500 and vehicle 1000 provided in the embodiment of the present disclosure each include a heat dissipation device 100, the controller 300, powertrain 500 and vehicle 1000 have the technical effects of the above-mentioned heat dissipation device 100, which will not be repeated here.

[0110] Some embodiments of the present disclosure also provide a heat dissipation method, which is applied to the controller 300. Figure 7 As shown, the heat dissipation method includes the following steps.

[0111] S10: Detecting the operating power of the power device 200 .

[0112] S20 : when the operating power is less than the power threshold, controlling the movable spoiler 20 to be located outside the cooling chamber 101 .

[0113] S30 : when the operating power is greater than or equal to the power threshold, controlling the movable spoiler 20 to be inserted into the cooling chamber 101 .

[0114] This configuration allows the operating state of the movable spoiler 20 to be adjusted according to the operating power of the power device 200, thereby meeting the different heat dissipation requirements of the power device 200. For example, when it is detected that the power device 200 is operating at a lower power, the movable spoiler 20 can be located outside the cooling chamber 101, thereby meeting the lower heat dissipation requirements of the power device 200. When the power device 200 is operating at a higher power, the movable spoiler 20 can be inserted into the cooling chamber 101, thereby meeting the higher heat dissipation requirements of the power device 200.

[0115] It is worth noting that the power threshold can be flexibly determined according to the type of power device 200. For example, the power device 200 includes a high-voltage controller, and the power threshold can be 500W. That is, when the working power of the high-voltage controller is less than 500W, the movable spoiler 20 is controlled to be located outside the cooling chamber 101; when the working power of the high-voltage controller is greater than or equal to 500W, the movable spoiler 20 is controlled to be inserted into the cooling chamber 101. For another example, the power device 200 includes a low-voltage controller, and the power threshold can be 30W. That is, when the working power of the low-voltage controller is less than 30W, the movable spoiler 20 is controlled to be located outside the cooling chamber 101; when the working power of the low-voltage controller is greater than or equal to 30W, the movable spoiler 20 is controlled to be inserted into the cooling chamber 101. In this way, the working state of the power device 200 can be better matched and adapted to its heat dissipation requirements.

[0116] When the operating power of the power device 200 is less than the power threshold, the power device 200 is in a low-load state, and the temperature of the power device 200 rises slowly. In this situation, the movable spoiler 20 in the heat sink 100 only needs to be controlled outside the cooling chamber 101, and the basic heat dissipation performance of the heat sink 100 can ensure the heat dissipation requirements of the power device 200.

[0117] In some embodiments, the heat dissipation method further includes: detecting the temperature of the power device.

[0118] In this case, step S30 includes steps S31 and S32.

[0119] S31: When the operating power is greater than or equal to the power threshold and less than the power limit, and the temperature is less than the temperature limit, control the movable spoiler 20 to be inserted into the cooling chamber 101 so that the movable spoiler 20 and the corresponding side wall 121 of the housing 10 are spaced apart from each other.

[0120] S32 : when the operating power is greater than or equal to the power limit and the temperature is greater than or equal to the temperature limit, controlling the movable spoiler 20 to abut against the aligned side wall 121 .

[0121] When the active spoiler 20 is controlled to abut the aligned sidewall 121, the active spoiler 20 has the best disruptive effect on the surrounding liquid, resulting in the best heat dissipation effect for the power device 200. When the active spoiler 20 is not in contact with the aligned sidewall 121, the active spoiler 20 has a moderate disruptive effect on the surrounding liquid, resulting in a moderate heat dissipation effect for the power device 200. Therefore, by detecting the temperature and operating power of the power device, this embodiment can adaptively adjust the heat dissipation performance of the heat dissipation device 100 according to its specific operating state and temperature conditions, thereby providing matched heat dissipation for the power device 200.

[0122] When the operating power of the power device 200 is greater than or equal to the power limit, the power device 200 is in a high-load state, and the temperature of the power device 200 is likely to exceed the temperature limit. When it is detected that the operating power of the power device 200 is greater than or equal to the power limit and the temperature is greater than or equal to the temperature limit, the movable spoiler 20 is controlled to abut the aligned side wall 121, thereby optimizing the heat dissipation performance of the heat sink 100, thereby ensuring good heat dissipation effect of the heat sink 100 on the power device 200, quickly reducing the temperature of the power device 200, and preventing the power device 200 from burning due to excessive temperature.

[0123] The power limit can be flexibly determined according to the type of the power device 200. For example, when the power device 200 includes a high-voltage controller, the power limit can be 1500 W. For another example, when the power device 200 includes a low-voltage controller, the power limit can be 80 W.

[0124] It is worth noting that when the vehicle is starting or traveling on a steep slope, the operating power of the power device 200 is often in a high-load state, and this state typically lasts for 15 seconds to 3 minutes. Therefore, during this stage, the movable spoiler 20 is controlled to abut the aligned side wall 121, thereby optimizing the heat dissipation performance of the heat dissipation device 100 and achieving rapid and effective cooling of the power device 200.

[0125] In some embodiments, step S31 includes steps S311 and S312.

[0126] S311: When the operating power is greater than or equal to the power threshold and less than the power limit, and the temperature is less than the temperature threshold, control the movable spoiler 20 to be inserted into the cooling chamber 101 so that the movable spoiler 20 and the corresponding side wall 121 have a first spacing, and the ratio of the first spacing to the length of the movable spoiler 20 extending into the cooling chamber 101 is greater than or equal to 1 and less than or equal to 3.

[0127] The temperature threshold is less than the temperature limit. As an example, the temperature limit may be twice the temperature threshold. The specific value of the temperature threshold may be set based on the heat dissipation requirements of the power device 200. For example, the temperature threshold may be 40°C or 45°C.

[0128] S312: When the operating power is greater than or equal to the power threshold and less than the power limit, and the temperature is greater than or equal to the temperature threshold and less than the temperature limit, control the movable spoiler 20 to be inserted into the cooling chamber 101 so that the movable spoiler 20 and the corresponding side wall 121 have a second distance, and the ratio of the second distance to the length of the movable spoiler 20 extending into the cooling chamber 101 is greater than 0 and less than or equal to 1.

[0129] When the operating power of the power device 200 is greater than or equal to the power threshold and less than the power limit, the power device 200 is in a medium load state, and the temperature of the power device 200 rises rapidly. At this time, by detecting the temperature of the power device 200, and when the temperature is less than the temperature threshold, the movable spoiler 20 is inserted into the cooling chamber 101 and moved a smaller stroke, so that the heat dissipation performance of the heat dissipation device 100 is improved to a certain extent, thereby effectively alleviating the rapid increase in the temperature of the power device 200. In addition, when it is detected that the temperature of the power device 200 is greater than or equal to the temperature threshold and less than the temperature limit, the movable spoiler 20 is controlled to move a larger stroke (i.e., the movable spoiler 20 extends into the cooling chamber 101 for a relatively larger length), thereby making the heat dissipation performance of the heat dissipation device 100 relatively more improved, thereby effectively reducing the temperature of the power device 200. Therefore, the embodiment of the present application can match the working state of the power device 200 and adjust the length of the movable spoiler 20 extending into the cooling chamber 101 according to the temperature of the power device 200, thereby effectively improving the heat dissipation effect of the power device 200.

[0130] In some examples, in step S311, based on the temperature being less than the temperature threshold, the interval between the base temperature and the temperature threshold can be divided into multiple intervals, each of which matches a first spacing; and the closer a segment is to the temperature threshold, the smaller the first spacing matched by the segment. The base temperature is less than the temperature threshold. As an example, the base temperature can be the temperature of the power device 200 when it is not operating. This arrangement allows the length of the movable spoiler 20 extending into the cooling chamber 101 to gradually increase as the temperature of the power device 200 increases, thereby continuously adjusting the heat dissipation performance of the power device 200 and thereby improving the heat dissipation effect of the power device 200.

[0131] In step S312, based on the fact that the temperature is greater than or equal to the temperature threshold and less than the temperature limit, the interval between the temperature threshold and the temperature limit can be divided into multiple intervals, each of which is matched with a second spacing; and the closer the interval is to the temperature limit, the smaller the second spacing matched by the interval. This arrangement can ensure that as the temperature of the power device 200 increases, the length of the movable spoiler 20 extending into the cooling chamber 101 gradually increases, thereby continuously adjusting the heat dissipation performance of the power device 200 and thereby improving the heat dissipation effect of the power device 200.

[0132] In some embodiments, when the heat dissipation method includes detecting the temperature of the power device 200 , step S20 includes: when the temperature is less than a temperature threshold and the operating power is less than a power threshold, controlling the movable spoiler 20 to be located outside the cooling chamber 101 .

[0133] With this configuration, the heat dissipation performance of the power device 200 can be specifically adjusted according to the working state and temperature of the power device 200 .

[0134] In the description of this application, the terms "first" and "second" are used for descriptive purposes only and should not be understood to indicate or imply relative importance or implicitly specify the number of technical features indicated. Therefore, a feature defined as "first" or "second" may explicitly or implicitly include one or more features. In the description of this application, "plurality" means two or more, unless otherwise specifically defined.

[0135] In the above embodiments, the description of each embodiment has its own focus. For parts that are not described in detail in a certain embodiment, reference can be made to the relevant descriptions of other embodiments.

[0136] The embodiments, implementation methods and related technical features of the present application can be combined and replaced with each other without conflict.

[0137] The above are merely preferred embodiments of the present application and do not constitute any form of limitation to the present application. However, any simple modifications, equivalent changes, and modifications made to the above embodiments based on the technical essence of the present application without departing from the content of the technical solution of the present application are still within the scope of the technical solution of the present application.

Claims

1. A heat dissipation device, characterized in that: include: a housing having a cooling chamber; and A movable spoiler is configured to be inserted into or removed from the cooling chamber.

2. The heat dissipation device according to claim 1, characterized in that: The housing includes a counter-position side wall, and the movable spoiler is opposite to the counter-position side wall; The movable spoiler has a first state and a second state. In the first state, the movable spoiler abuts against the aligned side wall. In the second state, the movable spoiler is inserted into the cooling chamber and spaced apart from the aligned side wall.

3. The heat dissipation device according to claim 1, wherein: The heat dissipation device further includes a fixed spoiler, which is fixed in the cooling chamber.

4. The heat dissipation device according to claim 3, characterized in that: The fixed spoiler comprises a plurality of first spoiler rows arranged side by side along a first direction; The movable spoiler includes a plurality of second spoiler rows arranged side by side along the first direction, and the plurality of second spoiler rows and the plurality of first spoiler rows are arranged alternately.

5. The heat dissipation device according to claim 4, characterized in that: Each of the first spoiler rows includes a plurality of first spoiler portions spaced apart along a second direction, the second direction intersecting the first direction; Each of the second spoiler rows includes a plurality of second spoiler portions spaced apart along the second direction.

6. The heat dissipation device according to any one of claims 1 to 5, characterized in that: The shell is provided with a liquid inlet and a liquid outlet communicating with the cooling chamber, wherein the liquid inlet and the liquid outlet define a liquid flow channel; The direction in which the movable spoiler is inserted into the cooling chamber is perpendicular to the flow direction of the liquid passing through the movable spoiler.

7. The heat dissipation device according to claim 6, characterized in that: The liquid inlet and the liquid outlet are located on the same side of the housing; The heat dissipation device further includes an isolating member located in the cooling chamber, the isolating member dividing the cooling chamber into a first chamber and a second chamber, the first chamber being in communication with the liquid inlet, and the second chamber being in communication with the liquid outlet; The isolating member is provided with at least one opening to allow the first chamber and the second chamber to communicate with each other.

8. The heat dissipation device according to claim 7, characterized in that: Along the length direction of the isolating member, the isolating member is provided with a plurality of openings spaced apart from each other; The heat dissipation device further comprises a movable sealing member located at each of the openings, and the movable sealing member can close or open the corresponding opening.

9. The heat dissipation device according to any one of claims 1 to 5, characterized in that: The heat dissipation device is used to dissipate heat from the power device; The heat dissipation device further includes a power detector configured to detect an operating power of the power device, so that the movable spoiler is inserted into or removed from the cooling chamber according to the operating power.

10. The heat dissipation device according to claim 9, characterized in that: The heat dissipation device further includes a temperature detector for detecting the temperature of the power device, so that the movable spoiler adjusts the length extending into the cooling chamber according to the temperature and the operating power.

11. A controller, characterized in that: The heat dissipation device comprises a power device and the heat dissipation device according to any one of claims 1 to 10.

12. A heat dissipation method, characterized in that: Applied to the controller according to claim 11, the heat dissipation method comprises: detecting the operating power of the power device; When the operating power is less than a power threshold, controlling the movable spoiler to be located outside the cooling chamber; and When the operating power is greater than or equal to the power threshold, the movable spoiler is controlled to be inserted into the cooling chamber.

13. The heat dissipation method according to claim 12, wherein: The heat dissipation method further includes: detecting the temperature of the power device; When the operating power is greater than or equal to the power threshold, controlling the movable spoiler to be inserted into the cooling chamber comprises: When the operating power is greater than or equal to the power threshold and less than the power limit, and the temperature is less than the temperature limit, controlling the movable spoiler to be inserted into the cooling chamber so that the movable spoiler and the corresponding side wall of the housing are spaced apart from each other; and When the operating power is greater than or equal to the power limit and the temperature is greater than or equal to the temperature limit, the movable spoiler is controlled to abut against the alignment side wall.

14. The heat dissipation method according to claim 13, wherein: The method of controlling the movable spoiler to be inserted into the cooling chamber so that the movable spoiler and the corresponding side wall of the housing are spaced apart from each other when the operating power is greater than or equal to the power threshold and less than the power limit, and the temperature is less than the temperature limit, comprises: When the operating power is greater than or equal to the power threshold and less than the power limit, and the temperature is less than a temperature threshold, controlling the movable spoiler to be inserted into the cooling chamber so that a first spacing is formed between the movable spoiler and the aligned sidewall, and a ratio of the first spacing to a length of the movable spoiler extending into the cooling chamber is greater than or equal to 1 and less than or equal to 3, wherein the temperature threshold is less than the temperature limit; and When the operating power is greater than or equal to the power threshold and less than the power limit, and the temperature is greater than or equal to the temperature threshold and less than the temperature limit, the movable spoiler is controlled to be inserted into the cooling chamber so that a second distance is formed between the movable spoiler and the aligned side wall, and a ratio of the second distance to a length of the movable spoiler extending into the cooling chamber is greater than 0 and less than or equal to 1.

15. The heat dissipation method according to any one of claims 12 to 14, characterized in that: The heat dissipation method further includes: detecting the temperature of the power device; When the operating power is less than a power threshold, controlling the movable spoiler to be located outside the cooling chamber includes: When the temperature is lower than a temperature threshold and the operating power is lower than a power threshold, the movable spoiler is controlled to be located outside the cooling chamber.

16. A powertrain, characterized in that: Comprising the controller of claim 11.

17. A vehicle, characterized in that: Comprising the powertrain as claimed in claim 16.

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