A cooling system, node server, cooling method, device and medium

Abstract

The present application discloses a heat dissipation system, a node server, a heat dissipation method, a device and a medium, and relates to the field of server technology. The heat dissipation array is composed of mobile heat dissipation components connected by magnetic attraction, and is positioned on the surface of the device to be cooled. The thermal sensing device is connected to the controller, and the controller is connected to the wireless power transmitting array. The controller determines the heat dissipation path based on the heat dissipation performance parameters and the power distribution strategy of the heat dissipation device, and performs power distribution processing on the wireless power transmitting array. The heat dissipation array knows the heat dissipation path constructed by the mobile heat dissipation component required by the device to be cooled by the amount of electric energy, so as to dissipate the heat of the components to be cooled. In order to solve the technical problems of reduced heat dissipation efficiency and low space utilization caused by the fixed position of the heat dissipation module, limited hardware layout and loss of cable power supply, the flexible movement of the magnetic connection of the mobile heat dissipation component and the wireless receiving method are achieved, which saves space utilization while improving the heat dissipation efficiency.

Description

Technical Field

[0001] The present application relates to the field of server technology, and in particular to a heat dissipation system, a node server, a heat dissipation method, a device, and a medium. Background Art

[0002] Conventional server cooling systems utilize a fixed cable-powered cooling path for liquid cooling pumps and fans. Because the cooling modules corresponding to cable-powered cooling are fixed in position, cooling efficiency is limited by the rigid hardware layout, resulting in poor cooling performance. Furthermore, cable-powered cooling systems incur losses and mechanical wear, further reducing cooling efficiency. Furthermore, the cabling of cable-powered cooling components consumes space within the server cabinet, reducing space utilization.

[0003] Therefore, how to improve heat dissipation efficiency while saving space utilization is an urgent problem that needs to be solved by those skilled in the art. Summary of the Invention

[0004] The present application provides a heat dissipation system, a node server, a heat dissipation method, a device, and a medium to at least solve the problems in the related art of reduced heat dissipation efficiency and low space utilization caused by the fixed position of the heat dissipation module, limited hardware layout, and loss of cable power supply.

[0005] The present application also provides a heat dissipation system, comprising a heat dissipation array, a thermal sensing device, and a controller; the heat dissipation array is composed of mobile heat dissipation components connected by magnetic attraction and positioned on the surface of the device to be dissipated;

[0006] The thermal sensing device is connected to the controller and is used to sense the heat dissipation performance parameters of the device to be cooled;

[0007] The wireless power transmission array has an electric energy transmission range covering the device to be cooled and is connected to the controller; the controller is used to determine a corresponding heat dissipation path based on the heat dissipation performance parameters and the power allocation strategy of the device to be cooled, and perform power distribution processing on the wireless power transmission array based on the heat dissipation path;

[0008] The heat dissipation array is used to receive the electric energy sent by the wireless power transmission array and construct the heat dissipation path to dissipate the heat of the device to be dissipated.

[0009] The present application also provides a node server, wherein a heat dissipation device and the heat dissipation system described above are provided on a mainboard of the node server;

[0010] The device to be cooled is cooled by the cooling system.

[0011] The present application provides a server-based heat dissipation method, which is applied to a heat dissipation system. The heat dissipation system includes a heat dissipation array, a heat sensing device, and a controller. The heat dissipation array is composed of mobile heat dissipation components connected by magnetic attraction and positioned on the surface of the device to be cooled. The heat sensing device is connected to the controller. A wireless power transmission array covers the device to be cooled and is connected to the controller. The method includes:

[0012] Sense the heat dissipation performance parameters of the device to be cooled;

[0013] Determining a corresponding heat dissipation path according to the heat dissipation performance parameter and the power allocation strategy of the device to be cooled, and performing power distribution processing on the wireless power transmission array based on the heat dissipation path;

[0014] The heat dissipation array is controlled to receive the electric energy sent by the wireless power transmitting array, so as to construct the heat dissipation path and dissipate the heat of the device to be dissipated.

[0015] The present application also provides an electronic device, comprising: a memory for storing a computer program; and a processor for implementing the steps of any of the above-mentioned server-based heat dissipation methods when executing the computer program.

[0016] The present application also provides a computer-readable storage medium, in which a computer program is stored. When the computer program is executed by a processor, the steps of any of the above-mentioned server-based heat dissipation methods are implemented.

[0017] Through the present application, first, the heat dissipation array is composed of mobile heat dissipation components that are magnetically connected and positioned on the surface of the device to be cooled. The heat dissipation components corresponding to the heat dissipation array are mobile, and the position of the corresponding heat dissipation module is flexibly handled and is not fixed. The mobile heat dissipation components are magnetically connected, and there is no need for a cable power supply connection corresponding to the hardware layout, and there is no need to be restricted by the rigid structure of the hardware layout. This further avoids the loss of the cable power supply method and the reduction in heat dissipation efficiency caused by mechanical wear. While improving the heat dissipation efficiency, it also improves the flexible arrangement of the heat dissipation position of the mobile heat dissipation component. Second, the thermal sensing device is connected to the controller to sense the heat dissipation performance parameters of the heat dissipation device. The controller is connected to the wireless power transmission array, and the controller determines the heat dissipation path based on the heat dissipation performance parameters and the power allocation strategy of the heat dissipation device to distribute power to the wireless power transmission array. The heat dissipation array receives the electric energy sent by the wireless power transmission array. The amount of electric energy can be used to know the heat dissipation path constructed by the mobile heat dissipation component required for the device to be cooled, so as to dissipate heat to the components to be cooled. Compared with the conventional cable-powered heat dissipation component wiring method that takes up space, this application adopts a magnetic connection, and uses a wireless power generation array as the transmitter and a heat dissipation array as the receiver to form a wireless reception, avoiding the need for the heat dissipation components to occupy less cabinet space during wiring, and only the space occupied by the heat dissipation array is occupied, saving space utilization. Thirdly, the heat dissipation path determined by the heat dissipation performance coefficient of thermal perception in this application can be adjusted at any time, so that the heat dissipation array can be temporarily adjusted. Through the flexible movement of the mobile heat dissipation component and the magnetic connection, the current heat dissipation array can be quickly determined through the adjusted heat dissipation path to achieve real-time dynamic adjustment of the heat dissipation path.

[0018] Therefore, it is possible to solve the technical problems of reduced heat dissipation efficiency and low space utilization caused by the fixed position of conventional heat dissipation modules, limited hardware layout and cable power supply loss, and achieve the flexible movement of magnetic connection of mobile heat dissipation components and wireless reception, saving space utilization while improving heat dissipation efficiency. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] In order to more clearly illustrate the embodiments of the present application, the following is a brief introduction to the drawings required for use in the embodiments. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without any creative work.

[0020] Figure 1 A schematic structural diagram of a heat dissipation system provided in an embodiment of the present application;

[0021] Figure 2 A schematic diagram of a server cabinet provided in an embodiment of the present application;

[0022] Figure 3 A schematic diagram of a wireless power transmission array provided in an embodiment of the present application;

[0023] Figure 4 A schematic structural diagram of the bottom of a mobile heat dissipation assembly provided in an embodiment of the present application;

[0024] Figure 5 A schematic diagram of the connection relationship between two mobile heat dissipation components provided in an embodiment of the present application;

[0025] Figure 6 A schematic diagram of fixing a device to be cooled and a mobile cooling assembly provided in an embodiment of the present application;

[0026] Figure 7 A schematic diagram of the structure of a node server provided in an embodiment of the present application;

[0027] Figure 8 A schematic diagram of a server cabinet provided in an embodiment of the present application;

[0028] Figure 9 A flow chart of a server-based heat dissipation method provided in an embodiment of the present application;

[0029] Figure 10 A flow chart of a heat dissipation array receiving wireless power provided in an embodiment of the present application;

[0030] Figure 11 A schematic diagram of adjusting a heat dissipation path provided in an embodiment of the present application;

[0031] Figure 12 A flowchart of the working principle of a controller provided in an embodiment of the present application;

[0032] Figure 13 A structural diagram of a server-based heat dissipation device provided in an embodiment of the present application. DETAILED DESCRIPTION

[0033] The following will be combined with the accompanying drawings in the embodiments of this application to clearly and completely describe the technical solutions in the embodiments of this application. Obviously, the embodiments described are only part of the embodiments of this application, not all of them. Based on the embodiments in this application, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of this application.

[0034] It should be noted that, in the description of this application, the terms "comprises," "includes," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or device comprising a series of elements includes not only those elements, but also other elements not explicitly listed, or elements inherent to such process, method, article, or device. The terms "first," "second," etc., in this application are used to distinguish similar objects, and are not used to describe a particular order or sequence.

[0035] In order to enable those skilled in the art to better understand the present application, the present application is further described in detail below with reference to the accompanying drawings and specific implementation methods.

[0036] Conventional server cooling systems are powered by cables through fixed liquid cooling pumps and fans, which results in a fixed position of the cooling module and the inability to dynamically adjust the cooling path according to changes in server load. The cooling efficiency is limited by the rigid structure of the hardware layout. The busbar or cable drag chain power supply method has contact resistance loss (5%-8%) and mechanical wear (such as high frequency of carbon brush replacement), resulting in an overall system efficiency of less than 70%, and maintenance costs accounting for more than 120% of the initial investment. When a local hot spot appears on the server, the fixed cooling path needs to wait for the coolant to circulate or the fan array to adjust its speed as a whole. The thermal response delay exceeds 500ms, which cannot meet the real-time cooling needs of high-density computing scenarios. The wiring of the cooling components takes up 15%-20% of the cabinet space, restricting the deployment of high-density servers. The cooling system provided in this application can solve the above technical problems.

[0037] Figure 1 A schematic diagram of a heat dissipation system according to an embodiment of the present invention is shown in FIG. Figure 1 As shown, it includes a heat dissipation array 1, a thermal sensing device 2 and a controller 3; the heat dissipation array 1 is composed of mobile heat dissipation components connected by magnetic attraction and positioned on the surface of the device to be dissipated 4;

[0038] The thermal sensing device 2 is connected to the controller 3 and is used to sense the heat dissipation performance parameters of the device to be cooled 4;

[0039] The wireless power transmission array 5 has an energy transmission range covering the device to be cooled 4 and is connected to the controller 3; the controller 3 is used to determine the corresponding heat dissipation path based on the heat dissipation performance parameters and the power allocation strategy of the device to be cooled 4, and to perform power distribution processing on the wireless power transmission array 5 based on the heat dissipation path;

[0040] The heat dissipation array 1 is used to receive the electric energy sent by the wireless power transmitting array 5 and to construct a heat dissipation path to dissipate the heat of the device to be cooled 4 .

[0041] Specifically, the heat dissipation array is composed of at least one mobile heat dissipation component. When multiple mobile heat dissipation components are configured, the multiple mobile heat dissipation components are connected magnetically. Compared to conventional heat dissipation devices, the heat dissipation array is disassembled and composed of individual mobile heat dissipation components. The mobile heat dissipation components can be reassembled based on the heat dissipation required by the device to be cooled. If the device to be cooled currently generates a lot of heat, more mobile heat dissipation components are urgently needed, and the heat dissipation array corresponding to the device to be cooled can be assembled in real time. If the device to be cooled currently generates less heat, several mobile heat dissipation components can be disassembled from the original heat dissipation array to reduce the number of mobile heat dissipation components in the heat dissipation array.

[0042] The heat dissipation array is positioned on the surface of the device to be cooled. It can be attached to the surface or a positioning structure can be set based on the surface of the device to be cooled to position the mobile heat dissipation components on the current heat dissipation array, such as positioning the magnetic protrusion structure.

[0043] The thermal sensing device here only corresponds to the collection device corresponding to each heat dissipation performance parameter, and can collect multiple parameters of the heat dissipation performance parameter. It should be noted that if multiple parameters are collected, the corresponding collection device is set based on the type of parameter. For example, temperature parameters require a temperature sensor or infrared thermal imager for collection. Distance parameters, such as distance parameters, can be collected through position sensors, etc., which are not limited here and can be set according to actual conditions. The thermal sensing device is connected to the controller to sense and collect the corresponding heat dissipation performance parameters.

[0044] It should be noted that the collected and perceived heat dissipation performance parameters can be pre-processed inside the controller, such as corresponding data noise reduction, anti-interference and other operations to reduce the interference of the heat dissipation performance parameters and improve the accuracy of the heat dissipation path determination process.

[0045] The wireless power transmitter array needs to be deployed in a location where its power transmission range covers the device to be cooled. There are no specific restrictions here. For example, in a server cabinet, a wireless power transmitter array can be deployed on the back panel of the server cabinet, such as a 43×10 matrix wireless power transmitter. The output power of each transmitter unit can be independently adjusted (range: 5-100W). The specific frequency band can be set according to actual conditions, such as a multi-band operating frequency range of 6.78MHz / 13.56MHz. The wireless power transmitter array acts as a wireless power transmitter, transmitting DC power to the receiving end of the cooling array. Figure 2 A schematic diagram of a server cabinet provided in an embodiment of the present application is shown in FIG. Figure 2 As shown, a wireless power transmission array is arranged on the back panel of the cabinet. Figure 3 This is a schematic diagram of a wireless power transmission array provided in an embodiment of the present application, as shown in FIG. Figure 3As shown, it is equipped with a 43×10 matrix wireless power transmitter.

[0046] The wireless power transmitter array is connected to a controller, which processes the array's power distribution and sends control signals. The array then transmits the power based on these signals. Normally, the array transmits the same amount of power. However, given the varying heat dissipation requirements of different devices, the number of mobile heat dissipation components in the corresponding heat dissipation arrays varies. Setting the number of mobile heat dissipation components requires real-time determination of the heat dissipation path.

[0047] It should be noted that the heat dissipation path provided in this embodiment is only a path in the planning stage and has not yet been implemented. First, the number of mobile heat dissipation components corresponding to the heat dissipation device is determined based on the determined heat dissipation path, and then the power distribution of the wireless power transmission array is used to enable the mobile heat dissipation components to move and form a determined heat dissipation array. That is, after the heat dissipation path is constructed, the heat is dissipated from the device to be dissipated.

[0048] Regarding the transmission principle between the heat dissipation array and the wireless power transmission array, the corresponding transmitting coil of the wireless power transmission array's transmitting end is activated. A high-frequency inverter circuit converts DC power into AC current, driving the transmitting coil to generate an alternating magnetic field, thus transmitting energy in a targeted manner. The transmitting end and the receiving end of the heat dissipation array use the same resonant frequency (6.78MHz or 13.56MHz), and capacitor matching is used to improve energy transmission efficiency. The receiving end of the heat dissipation array uses the electromagnetic induction principle of the coil, namely resonant coupling, to capture the magnetic field energy and convert it into AC power. This AC power is then converted to DC power through a full-bridge rectifier circuit. A low-dropout linear regulator (LDO) or direct current to direct current converter (DC-DC) module is used to stabilize the output voltage (e.g., 12V / 5A).

[0049] It should be noted that this embodiment utilizes a dynamic electromagnetic coupling heat dissipation system, enabling adaptive topological reconfiguration of heat dissipation components through a multi-band wireless power transmission network. This architecture addresses the issue of unsteady heat flow distribution in high-density heterogeneous computing clusters, transcending the physical constraints of traditional heat dissipation systems and establishing a dynamic deployment mechanism for heat dissipation modules with spatial freedom. The system utilizes a resonant topology of a series-compensated resonant converter (LCC-S) as the energy transmission medium, achieving an electromagnetic coupling efficiency of 85.3% ± 1.7% in the 6.78MHz / 13.56MHz dual-bands. A dynamic impedance matching algorithm eliminates fluctuations in energy transmission efficiency caused by heat dissipation component displacement (the fluctuation range is controlled within ± 2.1%).

[0050] The dynamic impedance matching algorithm is as follows:

[0051] 1. Conjugate matching condition: load impedance Need to match the source impedance Conjugate matching for maximum power transfer, Right now , ,in , ;

[0052] 2. Minimize the reflection coefficient: In the transmission line scenario, adjust ZL to make the reflection coefficient approach zero.

[0053] , , is the characteristic impedance of the transmission line.

[0054] 3. Dynamic parameter adjustment: real-time correction of reactance components , through the adjustable capacitor or inductor satisfy:

[0055] ;

[0056] Iterative solution is required The optimal value of .

[0057] 4. Closed-loop error control: Generates parameter corrections based on feedback mechanisms such as the Proportional-Integral-Derivative Controller (PID):

[0058] , , to achieve dynamic tracking of impedance.

[0059] Conjugate matching is the algorithm goal, the reflection coefficient reflects the matching degree, and dynamic adjustment and closed-loop control are the execution means. In practical applications, it is necessary to combine the circuit topology (such as transformer turns ratio) ) Comprehensive optimization.

[0060] Furthermore, the electromagnetic coupling principle is based on LCC-S magnetic resonance technology, and the dynamic wireless power transfer system (DWPT) can achieve an energy transmission efficiency of more than 80%, and support stable power supply for mobile devices during high-speed (2.5 m / s) operation, providing a technical foundation for the dynamic deployment of heat dissipation components.

[0061] The mutual inductance coupling equation is as follows:

[0062] The mutual inductance M between two coils is defined by the following formula: ;

[0063] Where k is the coupling coefficient (0≤k≤10), which represents the coupling strength of the magnetic field between the coils; are the self-inductances of the transmitting and receiving coils respectively.

[0064] Resonant frequency conditions:

[0065] The system needs to meet the resonance condition to achieve efficient energy transmission, the resonant frequency The expression is: ;

[0066] and are the coil inductance and compensation capacitance values ​​respectively.

[0067] Transmission efficiency model:

[0068] Maximum transmission efficiency The relationship with coil parameters is: ;

[0069] are the quality factors of the transmitting and receiving coils respectively ( , is the equivalent resistance).

[0070] Coupling coefficient k: When k>0.4, the system efficiency can reach over 85%, but eddy current losses need to be reduced through coil optimization design (such as using Litz wire).

[0071] Quality factor Q: Industrial-grade WPT systems require Q>200 and require the use of low-loss capacitors and high-permeability ferrite cores.

[0072] Frequency selection: The typical operating frequency is 6.78 MHz or 85 kHz (Qi standard), and a balance must be struck between transmission efficiency and electromagnetic interference level.

[0073] Improved environmental adaptability: Wireless power supply track can withstand high temperatures It also has an IP54 protection level and can adapt to the complex environment of the data center (such as high humidity and dust), avoiding the failure risks of traditional physical contact power supply.

[0074] Through the embodiments of the present application, first, the heat dissipation array is composed of mobile heat dissipation components that are magnetically connected and positioned on the surface of the device to be cooled. The heat dissipation components corresponding to the heat dissipation array are mobile, and the position of the corresponding heat dissipation module is flexibly handled and is not fixed. The mobile heat dissipation components are magnetically connected, and there is no need for a cable power supply connection corresponding to the hardware layout, and there is no need to be restricted by the rigid structure of the hardware layout. This further avoids the loss of the cable power supply method and the reduction in heat dissipation efficiency caused by mechanical wear. While improving the heat dissipation efficiency, it also improves the flexible arrangement of the heat dissipation position of the mobile heat dissipation components. Second, the thermal sensing device is connected to the controller to sense the heat dissipation performance parameters of the heat dissipation device. The controller is connected to the wireless power transmission array, and the controller determines the heat dissipation path based on the heat dissipation performance parameters and the power allocation strategy of the heat dissipation device to distribute power to the wireless power transmission array. The heat dissipation array receives the electric energy sent by the wireless power transmission array. The amount of electric energy can be used to know the heat dissipation path constructed by the mobile heat dissipation component required for the device to be cooled, so as to dissipate heat to the components to be cooled. Compared with the conventional cable-powered heat dissipation component wiring method that takes up space, this application adopts a magnetic connection, and uses a wireless power generation array as the transmitter and a heat dissipation array as the receiver to form a wireless reception, avoiding the need for the heat dissipation components to occupy less cabinet space during wiring, and only the space occupied by the heat dissipation array is occupied, saving space utilization. Thirdly, the heat dissipation path determined by the heat dissipation performance coefficient of thermal perception in this application can be adjusted at any time, so that the heat dissipation array can be temporarily adjusted. Through the flexible movement of the mobile heat dissipation component and the magnetic connection, the current heat dissipation array can be quickly determined through the adjusted heat dissipation path to achieve real-time dynamic adjustment of the heat dissipation path.

[0075] Therefore, it is possible to solve the technical problems of reduced heat dissipation efficiency and low space utilization caused by the fixed position of conventional heat dissipation modules, limited hardware layout and cable power supply loss, and achieve the flexible movement of magnetic connection of mobile heat dissipation components and wireless reception, saving space utilization while improving heat dissipation efficiency.

[0076] In some embodiments, the bottom of the mobile heat dissipation assembly is provided with magnetic positioning components arranged in an array at a first preset interval, and the four ports at the bottom are provided with auxiliary guide components with the same diameter and radius as the magnetic positioning components; the side edges of the bottom are provided with magnetic positioning components arranged in an array at a first preset interval, corresponding to half of the magnetic positioning components;

[0077] A superconducting coil is provided on the top of the mobile heat dissipation component, arranged in a ring shape and evenly distributed on the top, and the superconducting coils are spaced a first preset distance apart;

[0078] A magnetic connector is provided on the side between the bottom and the top of the mobile heat dissipation component, which is magnetically connected to another mobile heat dissipation component.

[0079] Specifically, Figure 4 This is a structural diagram of the bottom of a mobile heat dissipation component provided in an embodiment of the present application, such as Figure 4 As shown, the bottom of the mobile heat dissipation assembly is provided with magnetic positioning components 6 arranged in an array at a first predetermined interval. These components are circular structures with circular holes recessed to a predetermined depth. These magnetic positioning components 6 utilize magnetic force to achieve precise physical positioning. The sides of the bottom are provided with magnetic positioning components 6 arranged in an array at a first predetermined interval, occupying half of the space.

[0080] The magnetic attraction positioning component 6 is mainly the interaction between the magnet and the magnetic sensor, with physical automatic calibration and fixation. Here, magnetic attraction can be used to embed a magnet in the device and use the attraction of the magnet to adsorb the object to the specified position. It is also possible to use a magnetic sensor to sense the magnetic field generated by the magnet and determine the relative position relationship with the magnet based on the geometric change characteristics of the magnetic field strength. The position and direction of the magnet can also be adjusted so that the magnetic lines of force are aligned with a specific window or position, thereby achieving precise positioning. There is no limitation here, and it can be set according to actual conditions.

[0081] The four bottom ports are equipped with auxiliary guide components 7 with the same diameter and radius as the magnetic positioning component 6. The radius corresponding to the fan-shaped area of ​​the auxiliary guide components 7 is the same as the radius of the magnetic positioning component 6, but the depth of the recess of the auxiliary guide components 7 is greater than that of the magnetic positioning component 6. The auxiliary guide components 7 are additional mechanical or electronic devices that assist magnetic positioning during the positioning process, improving the accuracy and reliability of positioning. They can use specific mechanical structures to guide objects to a predetermined position; electronic guidance can also be used, using electronic signals or sensors to assist positioning; or a combination of magnetic force and mechanical structure can achieve more efficient positioning.

[0082] Figure 5 A schematic diagram of the connection relationship between two mobile heat dissipation components provided in an embodiment of the present application is shown as follows: Figure 5 As shown, a superconducting coil is provided on the top of the mobile heat dissipation component in a ring layout, which is connected in series on a wire and evenly distributed on the top. The superconducting coil can be provided with one or more superconducting coils. Figure 5 There are three sets of superconducting coils, with adjacent superconducting coils separated by a first preset distance. The three sets of superconducting coils realize three-dimensional suspension (accuracy ±0.2mm) and the Lorentz force compensation mechanism eliminates eddy current interference.

[0083] The side structure between the bottom and the top of the mobile heat dissipation component is provided with a magnetic connector 8, which is connected to other mobile heat dissipation components through magnetic force, making the connection and disconnection operations more convenient and quick.

[0084] The embodiment provides a mobile heat dissipation assembly provided by the magnetic positioning component and auxiliary guide component, which can achieve precise positioning and stable fixation. The design of the magnetic interface allows the mobile heat dissipation assembly to be easily connected and disconnected with other mobile heat dissipation assemblies, improving the flexibility and simplicity of operation.

[0085] In some embodiments, a top surface of the device to be cooled is provided with corresponding magnetic protrusion structures arranged in an array at a first preset interval to position a magnetic positioning component of a mobile cooling assembly.

[0086] Specifically, Figure 6 A schematic diagram of fixing a heat dissipation device and a mobile heat dissipation component provided in an embodiment of the present application is shown as follows: Figure 6 As shown, the top surface of the heat dissipation device 4 is provided with magnetic protrusion structures 9 arranged in a matrix at a first preset interval, which are positioned by means of positioning bosses and precisely positioned by means of adsorption.

[0087] The magnetic positioning component of the mobile heat dissipation assembly provided in this embodiment is positioned with the magnetic protrusion structure to prevent it from falling off, thereby achieving extremely high positioning accuracy, saving manpower in assembly work, and realizing automatic positioning.

[0088] In some embodiments, a liquid cooling unit and / or a fan unit is provided inside the mobile heat dissipation component to receive magnetic field information corresponding to electrical energy through a superconducting coil, convert the magnetic field information into alternating current, and output voltage to the liquid cooling unit and / or the fan unit to drive the operation to dissipate heat from the heat dissipation device.

[0089] Specifically, a liquid cooling unit and / or a fan unit is provided inside the mobile heat dissipation assembly for subsequent heat dissipation. Regardless of the type of heat dissipation unit, a superconducting coil is required to receive magnetic field information, convert it into alternating current, and output voltage to the heat dissipation unit. If it is a liquid cooling unit, an output voltage is required to speed up the circulation of the circulating coolant in the liquid cooling unit to absorb and dissipate heat. If it is a fan unit, the fan motor is driven based on the voltage, causing the fan blades to rotate and generate wind flow.

[0090] Superconducting coils in a changing magnetic field generate an induced electromotive force, which in turn generates alternating current (AC). This AC can be converted to DC using a rectifier circuit. This AC is then converted to DC using a rectifier (such as a bridge rectifier). Filtering components such as capacitors remove the AC component from the DC, making it smoother.

[0091] The liquid cooling unit absorbs and dissipates heat by circulating coolant. The coolant flows within the heat dissipation module, absorbing heat generated by components such as the superconducting coils. The heat is then dissipated to the surrounding environment through the radiator. The axial flow fan generates airflow through its rotation, removing heat from the heat dissipation module. Its operating principle is based on electromagnetic induction, using a DC motor to rotate the fan blades, generating airflow.

[0092] The heat dissipation unit provided in this embodiment, when used as a liquid cooling unit, can quickly transfer heat from the heat source to the radiator. When used as a fan unit, the fan speed and air volume can be adjusted as needed to meet different heat dissipation requirements. If both are present, high heat generation can be effectively handled, ensuring stable operation of the device within the normal temperature range.

[0093] In some embodiments, the thermal sensing unit includes a Hall sensor, which is installed in the mobile heat dissipation component and is used to detect a first suspension gap between the mobile heat dissipation components and a second suspension gap between the mobile heat dissipation component and the processor surface;

[0094] The controller is configured to control the wireless power transmitting array to adjust the magnetic field strength if the first suspension gap and / or the second suspension gap is greater than or equal to a preset gap.

[0095] Specifically, the method by which the Hall sensor collects the suspension gap mainly relies on the Hall effect. In the presence of a magnetic field, when the direction of the current is perpendicular to the direction of the magnetic field, a voltage is generated in the conductor. This effect is used by the Hall probe to measure the magnetic field flux density perpendicular to the thin layer, where the Hall voltage is linearly related to the magnetic field value. The sensitivity of the Hall probe depends on the density, mobility and type of charge carriers in the conductive layer, so semiconductors are usually used to manufacture efficient Hall probes. The Hall sensor uses the Hall effect to measure the XYZ three-axis position of the suspension disk, and the deviation is output to the coil current loop, thereby achieving accurate measurement of the suspension gap.

[0096] In this embodiment, a first suspension gap between the mobile heat dissipation components and a second suspension gap between the mobile heat dissipation components and the processor surface are collected.

[0097] When the controller sets one or two corresponding suspension gaps to be greater than or equal to the preset gap, it indicates that the current suspension ability is weak and the magnetic field strength needs to be dynamically adjusted to maintain stable suspension.

[0098] The Hall sensor provided in this embodiment collects the suspension gap, and can achieve non-contact measurement of the suspension gap, which helps to reduce mechanical wear, improve the reliability and accuracy of the measurement, and ensure the stability of the suspension.

[0099] Furthermore, the present application also provides a node server, Figure 7 A schematic diagram of the structure of a node server provided in an embodiment of the present application is shown as follows: Figure 7 As shown, the mainboard of the node server 10 is provided with a heat dissipation device 4 and the above-mentioned heat dissipation system;

[0100] The heat dissipation device 4 is cooled by the heat dissipation system.

[0101] Specifically, Figure 7 Components to be cooled include hard drives, central processing units (CPUs), and peripheral component interconnect express (PCIE) expansion cards. The cooling system's mobile cooling components are currently located near the CPU and need to be secured to the magnetic protrusions on the CPU surface. The cooling system's wireless energy emits a magnetic field. Figure 7 For a node server, there are multiple node servers in the server cabinet that are extracted in a drawer manner. Figure 8 A schematic diagram of a server cabinet provided in an embodiment of the present application is shown in FIG. Figure 8 As shown, it includes at least one node server 10, whose wireless energy transmission array is located at Figure 8 The back of the backplane of the node server is perpendicular to the node server.

[0102] For an introduction to a node server provided in this application, please refer to the above method embodiment, and the present invention will not be repeated here. It has the same beneficial effects as the above-mentioned heat dissipation system.

[0103] Furthermore, the present application also provides a heat dissipation method based on a server. Figure 9 A flow chart of a server-based heat dissipation method provided in an embodiment of the present application is applied to a heat dissipation system, which includes a heat dissipation array, a thermal sensing device, and a controller; the heat dissipation array is composed of mobile heat dissipation components connected by magnetic attraction and positioned on the surface of the device to be cooled; the thermal sensing device is connected to the controller; the wireless power transmission array covers the device to be cooled and is connected to the controller; Figure 9 As shown, the method includes:

[0104] S11: sensing heat dissipation performance parameters of the device to be cooled;

[0105] S12: determining a corresponding heat dissipation path according to the heat dissipation performance parameters and the power allocation strategy of the device to be cooled, and performing power distribution processing on the wireless power transmission array based on the heat dissipation path;

[0106] S13: Control the heat dissipation array to receive the electric energy sent by the wireless power transmitting array to build a heat dissipation path to dissipate heat from the heat dissipation device.

[0107] Specifically, the heat dissipation performance parameters are sensed, which can be one parameter or multiple parameters. The type of heat dissipation performance parameter corresponding here is linked to the parameter type of the power allocation strategy. The power allocation strategy is based on the heat dissipation performance parameters of the device to be cooled to refer to and allocate according to the corresponding allocation weight parameters to determine the matching between the mobile heat dissipation component and the device to be cooled, and determine the heat dissipation path of the mobile heat dissipation component corresponding to the device to be cooled based on the power allocation strategy. The allocation here can be based on the weight parameters set for different types of heat dissipation performance parameters and the device priority between each device to be cooled.

[0108] Power distribution is performed on the wireless power transmitter array based on the heat dissipation path. It should be noted that the current heat dissipation path is a preset movement path corresponding to the mobile heat dissipation component that has not yet been laid out. Power distribution is performed on the wireless power transmitter array based on the preset movement path. A higher energy level is set for the mobile heat dissipation component corresponding to the preset movement path to facilitate magnetic assembly of the mobile heat dissipation component. Furthermore, a higher energy level is also set for the components to be cooled within the mapped coverage area of ​​the wireless power transmitter array.

[0109] At this time, the mobile heat dissipation components of the heat dissipation array receive the distributed and processed electric energy, build a heat dissipation path, and form a heat dissipation array that truly corresponds to the device to be cooled for heat dissipation.

[0110] For an introduction to a server-based heat dissipation method provided in this application, please refer to the above method embodiment, which will not be described in detail herein. It has the same beneficial effects as the above heat dissipation system.

[0111] Figure 10 A flow chart of a heat dissipation array receiving wireless energy provided in an embodiment of the present application is as follows: Figure 10 Shown, including:

[0112] S21: Magnetic field generation and directional emission;

[0113] S22: Magnetic field reception and electrical energy capture;

[0114] S23: Magnetic suspension stability control;

[0115] S24: Power management and cooling execution.

[0116] Specifically, in step S21, the transmitting coil is activated, and a high-frequency inverter circuit converts direct current into alternating current, driving the transmitting coil to generate an alternating magnetic field. Resonant coupling is optimized, with the transmitting and receiving coils using the same resonant frequency, and energy transfer efficiency is improved through capacitor matching.

[0117] In step S22, the receiving coil is placed in the heat dissipation array, and the magnetic field energy is converted into alternating current through the principle of electromagnetic induction. A full-bridge rectifier circuit is used to convert the alternating current into direct current and stabilize the output voltage.

[0118] In step S23, the Hall sensor monitors the distance between the heat dissipation array and the transmitting end and the distance between the mobile heat dissipation components in the heat dissipation array in real time, and feeds back to the controller to dynamically adjust the transmitting coil current through the PID algorithm to maintain stable suspension (0.5~3mm).

[0119] In step S24, the electrical energy is used to drive the magnetic levitation coil and the heat dissipation array, with the former allocated 20% to 30% and the latter 70% to 80%. The former prioritizes powering the levitation coil, while the latter utilizes the semiconductor cooling element. This is combined with heat conduction optimization technology to achieve efficient heat dissipation, while the reverse magnetic field offsets electromagnetic interference, ensuring the simultaneous and stable operation of wireless power supply and heat dissipation.

[0120] Figure 11 A schematic diagram of adjusting a heat dissipation path provided in an embodiment of the present application is shown in FIG. Figure 11 As shown, wireless power transmission is used to transmit and receive power from the wireless power transmission array and the heat dissipation array. The heat dissipation array dissipates heat from the server's components by laying out heat dissipation paths. Simultaneously, a thermal sensing device detects heat dissipation performance parameters during wireless power transmission. The controller uses dynamic power allocation strategies and heat dissipation performance parameters to determine the appropriate heat dissipation path to dissipate heat from the components.

[0121] Wireless power transmission array, space energy field construction: multi-coil matrix layout (such as 8×8 array), support 3D space magnetic field superposition (frequency Gallium Nitride (GaN) power devices are used to achieve >90% transmission efficiency (10cm distance). Topology adaptive triggering: When the server rack structure is adjusted, the corresponding area coil is automatically activated / deactivated through impedance detection.

[0122] Heat dissipation array, suspension drive unit: three sets of symmetrical superconducting coils (Yttrium Barium Copper Oxide (YBCO) material) to achieve three-dimensional suspension (precision )Lorentz force compensation mechanism eliminates eddy current interference. Heat dissipation execution unit: semiconductor refrigeration chip maximum temperature difference (Input power 50W).

[0123] Thermal sensing equipment and heat source location: Infrared thermal imagers (resolution 640×480) scan the server surface temperature distribution. Magnetic field coupling status monitoring: Hall effect sensors provide real-time feedback on the magnetic flux matching between the receiving end and the transmitting coil.

[0124] Controller: Power distribution (heat load, distance coefficient, priority) is as follows: heat load weight accounts for 60%, distance attenuation coefficient accounts for 30%, and device priority accounts for 10%. Distribution ratio = 0.6 Normalized (heat load) + 0.3 (1 / distance factor) + 0.1 Priority, transmit array node power Path Planning Engine: Artificial Intelligence (AI) algorithms optimize the heat dissipation module's movement path (avoiding cable / slot obstacles), and the magnetic levitation track switching delay is less than 10ms.

[0125] Figure 12 A flowchart of the working principle of a controller provided in an embodiment of the present application is shown as follows: Figure 12 As shown, the initialization scan, thermal field response, and energy heat dissipation coordination are performed first, and then the heat dissipation path is dynamically adjusted.

[0126] Initialization scan: The transmitting array sends a low-power detection signal to identify the server physical topology through reflected impedance. Establish a three-dimensional coordinate system to map the locations of all heat sources (accuracy ).

[0127] Thermal field response: When a CPU core temperature exceeds 85°C, the sensor network triggers a level 3 alarm. The control center calculates the coordinates (x, y, z) of the optimal heat dissipation point and the required heat dissipation power.

[0128] Energy-Cooling Synergy: The transmitting array activates the coils in the target area, transmitting a specified power (e.g., 120W) to the magnetically levitated cooling module. The cooling module then moves along a planned path above the heat source, activating semiconductor cooling to dissipate heat.

[0129] Dynamic adjustment: If the heat source migrates (for example, a virtual machine switches physical cores), the sensor recalibrates its position. The control center corrects power allocation and updates the movement trajectory of the cooling module.

[0130] It should be noted that in this application, when the heat dissipation array is performing heat dissipation work on the heat dissipation device, the above-mentioned heat dissipation method can be used to dynamically adjust the various mobile heat dissipation components of the heat dissipation array to determine a new heat dissipation path, and the heat dissipation device can be dissipated again.

[0131] In some embodiments, the heat dissipation performance parameters include at least a temperature parameter, a distance parameter between the device to be dissipated and the mobile heat dissipation assembly, and a magnetic flux matching degree between the heat dissipation array and the wireless power transmission array; determining the corresponding heat dissipation path based on the heat dissipation performance parameters and the power allocation strategy of the device to be dissipated includes:

[0132] Pre-acquire a first mapping relationship between a preset temperature parameter and a preset heat load parameter;

[0133] Determine current heat load parameters of the plurality of components to be cooled according to the first mapping relationship and the temperature parameter;

[0134] Obtaining preset mobile heat dissipation components for respective scheduling of multiple devices to be cooled;

[0135] Determining a first target mobile heat dissipation component in an idle state among the preset mobile heat dissipation components;

[0136] Determining distance parameters between a plurality of components to be cooled and their corresponding first target movable cooling components;

[0137] Obtaining device priorities of multiple devices to be cooled, and determining corresponding priority weight parameters according to the respective device priorities;

[0138] Determine a first weight parameter of a current heat load parameter and a second weight parameter of a distance parameter;

[0139] Determine a scheduling path between the current device to be cooled and the first target mobile cooling component according to the current heat load parameter, the first weight parameter, the distance parameter, the second weight parameter, the device priority, the priority weight parameter, and the magnetic flux matching degree corresponding to the first target mobile cooling component;

[0140] The scheduling paths between the current device to be cooled and the plurality of first target mobile cooling components are sorted to determine the cooling path of the current device to be cooled.

[0141] Specifically, heat dissipation performance parameters include at least temperature parameters, distance parameters between the device to be dissipated and the mobile heat dissipation assembly, and flux matching between the heat dissipation array and the wireless power transmission array. The temperature parameter corresponds to the temperature parameter of the device to be dissipated. The distance parameter refers to the distance parameters between the device to be dissipated and each mobile heat dissipation assembly. The flux matching between the heat dissipation array and the wireless power transmission array refers to the degree of matching of the flux linkage (magnetic flux linkage) between the transmitting coil and the receiving coil. Flux matching is crucial to the efficiency and stability of wireless charging systems. Flux linkage refers to the magnetic flux passing through a coil and is the product of the magnetic field strength and the number of coil turns. In a wireless charging system, the magnetic field generated by the transmitting coil is transmitted to the receiving coil in the form of flux linkage. Flux matching refers to the perfect alignment of the flux linkages between the transmitting coil and the receiving coil in terms of quantity and phase, thereby achieving efficient energy transfer.

[0142] The first mapping relationship is between a preset temperature parameter and a preset heat load parameter. Heat load generally refers to the amount of heat generated by a system or component per unit time, while a temperature parameter represents the temperature of the system or component under a specific heat load. The temperature parameter can be, without limitation, ambient temperature, component surface temperature, or component internal temperature.

[0143] The current heat load parameters of multiple devices to be cooled are determined based on the first mapping relationship and the temperature parameters, and the corresponding current heat load parameters are directly found through the mapping relationship. The first target mobile cooling component in an idle state is determined in the preset mobile cooling component. This is because there may be multiple mobile cooling components around the device to be cooled, and not all mobile cooling components are dedicated to cooling one device to be cooled. The surrounding mobile cooling components may be providing cooling services for another device to be cooled. Therefore, it is necessary to determine the first target mobile cooling component in an idle state corresponding to the current device to be cooled. The distance parameter between the current device to be cooled and the corresponding first target mobile cooling component is determined by a thermal sensing device.

[0144] The device priority here is based on which device to be cooled is prioritized among all devices to be cooled, and the corresponding priority weight parameter has been determined. The scheduling path between the current device to be cooled and the first target mobile cooling component is determined by the current heat load parameter, the first weight parameter, the distance parameter, the second weight parameter, the device priority, the priority weight parameter, and the magnetic flux matching degree corresponding to the first target mobile cooling component. The formula is as follows:

[0145] Heat load parameter × first weight parameter + distance parameter × second weight parameter + device priority × priority weight parameter + flux matching degree = scheduling path;

[0146] It should be noted that the scheduling path here is based on the scheduling path between the current device to be cooled and each first target mobile cooling component. All scheduling paths are sorted from largest to smallest based on the path radiated from the current device to be cooled to each first target mobile cooling component to obtain the cooling path to all first target mobile cooling components, which are then used to cool the current device to be cooled.

[0147] The heat dissipation path determination process provided in this embodiment improves the accuracy of heat dissipation path determination and enables the flexibility of adjusting the corresponding heat dissipation path according to the heat dissipation performance parameters monitored in real time through the proportional allocation between different heat dissipation performance parameters and the corresponding power allocation strategies.

[0148] In some embodiments, the temperature parameters include at least an ambient temperature parameter and a device surface temperature parameter; determining the current heat load parameters of the plurality of devices to be cooled based on the first mapping relationship and the temperature parameters includes:

[0149] Obtaining ambient temperature parameters and device surface temperature parameters corresponding to each of a plurality of devices to be cooled;

[0150] Determine the final temperature parameters corresponding to the multiple heat dissipation devices according to the ambient temperature parameters and the device surface temperature parameters;

[0151] The current heat load parameter is determined according to the first mapping relationship and the final temperature parameter.

[0152] Specifically, the temperature parameters correspond to parameters collected at different locations, such as the ambient temperature parameters and the device surface temperature parameters. To facilitate subsequent data calculations and ensure fairness in temperature parameter collection, it is necessary to determine the final temperature parameters based on the ambient temperature parameters and the device surface temperature parameters. The determination process here can be averaging or standard deviation processing, etc., which is not limited here, as long as it can be normalized into a single temperature parameter. The current heat load parameter is determined based on the first mapping relationship and the final temperature parameter.

[0153] The temperature parameter settings provided in this embodiment are temperature parameters measured at different locations under different heat load conditions. In this embodiment, the temperature parameters that have a greater impact on the heat dissipation efficiency are uniformly processed to obtain a temperature parameter, which facilitates subsequent data calculations and processing of mapping relationships under heat loads, while also improving heat dissipation efficiency.

[0154] In some embodiments, performing power distribution processing on a wireless power transmission array based on a heat dissipation path includes:

[0155] Mapping the heat dissipation path to a first transmission path corresponding to the wireless power transmission array;

[0156] Determine a second transmission path corresponding to the wireless power transmission array transmitting to the device to be cooled;

[0157] The power of the wireless power transmission array is distributed according to the first transmission path and the second transmission path. The preset power is transmitted; wherein the transmission power of the non-transmission path is less than the transmission power of the first transmission path and the second transmission path.

[0158] Specifically, considering that the heat dissipation path and the device to be dissipated are mapped to two emission ranges under the wireless power transmission array, namely, a first emission path and a second emission path, the power of the wireless power transmission array is distributed according to the first emission path and the second emission path, and the preset power is transmitted. This is to take into account the different power transmission sizes corresponding to different emission paths and non-emission paths.

[0159] This embodiment provides a method for distributing power to a wireless power transmission array based on a heat dissipation path, so as to ensure that the heat dissipation path constructed subsequently complies with the current emission law and realize the mobility function of the mobile heat dissipation component.

[0160] Through the description of the above implementation methods, those skilled in the art can clearly understand that the method according to the above embodiment can be implemented by means of software plus the necessary general hardware platform, and of course it can also be implemented by hardware, but in many cases the former is a better implementation method.

[0161] The embodiment of the present application also provides a heat dissipation device based on a server, Figure 13 A structural diagram of a server-based heat dissipation device provided in an embodiment of the present application is shown in FIG. Figure 13 Shown, including:

[0162] A sensing module 11 is used to sense the heat dissipation performance parameters of the device to be cooled;

[0163] A determination module 12 is configured to determine a corresponding heat dissipation path according to the heat dissipation performance parameters and the power allocation strategy of the device to be cooled, and perform power distribution processing on the wireless power transmission array based on the heat dissipation path;

[0164] The control module 13 is used to control the heat dissipation array to receive the electric energy sent by the wireless power transmitting array, so as to build a heat dissipation path to dissipate the heat of the device to be cooled.

[0165] For the description of the features in the embodiment corresponding to the server-based heat dissipation device, reference can be made to the relevant description of the embodiment corresponding to the server-based heat dissipation method, which will not be repeated here.

[0166] An embodiment of the present application further provides an electronic device, including a memory and a processor, wherein the memory stores a computer program, and the processor is configured to run the computer program to execute the steps in any of the above-mentioned server-based heat dissipation method embodiments.

[0167] An embodiment of the present application further provides a computer-readable storage medium storing a computer program, wherein the computer program is configured to execute the steps of any of the above-mentioned server-based heat dissipation method embodiments when running.

[0168] In an exemplary embodiment, the computer-readable storage medium may include, but is not limited to, various media that can store computer programs, such as a USB flash drive, a read-only memory (ROM), a random access memory (RAM), a mobile hard disk, a magnetic disk, or an optical disk.

[0169] An embodiment of the present application further provides a computer program product, which includes a computer program. When the computer program is executed by a processor, the computer program implements the steps of any of the above-mentioned server-based heat dissipation method embodiments.

[0170] An embodiment of the present application further provides another computer program product, including a non-volatile computer-readable storage medium, wherein the non-volatile computer-readable storage medium stores a computer program, and when the computer program is executed by a processor, the steps of any of the above-mentioned server-based heat dissipation method embodiments are implemented.

[0171] Professionals may further appreciate that the units and algorithm steps of each example described in conjunction with the embodiments disclosed herein can be implemented in electronic hardware, computer software, or a combination of the two. In order to clearly illustrate the interchangeability of hardware and software, the above description has generally described the components and steps of each example according to their functions. Whether these functions are performed in hardware or software depends on the specific application and design constraints of the technical solution. Professionals and technicians may use different methods to implement the described functions for each specific application, but such implementation should not be considered beyond the scope of this application.

[0172] The above is a detailed introduction to a heat dissipation system, node server, heat dissipation method, device and medium provided by the present application. Specific examples are used herein to illustrate the principles and implementation methods of the present application. The description of the above embodiments is only used to help understand the method and core idea of ​​the present application. It should be pointed out that for ordinary technicians in this technical field, without departing from the principles of the present application, several improvements and modifications can be made to the present application, and these improvements and modifications also fall within the scope of protection of the present application.

Claims

1. A heat dissipation system, characterized in that: The system comprises a heat dissipation array, a thermal sensing device and a controller; the heat dissipation array is composed of mobile heat dissipation components connected by magnetic attraction and positioned on the surface of the device to be cooled; the mobile heat dissipation components are reorganized based on the heat dissipation intensity required by the device to be cooled; The thermal sensing device is connected to the controller and is used to sense the heat dissipation performance parameters of the device to be cooled; The electric energy transmission range of the wireless power transmission array covers the device to be cooled and is connected to the controller; The controller is configured to determine a corresponding heat dissipation path based on the heat dissipation performance parameters and the power allocation strategy of the device to be cooled, and to perform power distribution processing on the wireless power transmission array based on the heat dissipation path; wherein, after determining the number of mobile heat dissipation components corresponding to the heat dissipation device based on the heat dissipation path, power is distributed through the wireless power transmission array; the heat dissipation path is determined by proportional allocation between different heat dissipation performance parameters and corresponding power allocation strategies; The heat dissipation array is used to receive the electric energy sent by the wireless power transmission array and construct the heat dissipation path to dissipate the heat of the device to be dissipated.

2. The heat dissipation system according to claim 1, characterized in that: The bottom of the mobile heat dissipation component is provided with magnetic positioning components arranged in an array at a first preset interval, and the four ports at the bottom are provided with auxiliary guide components with the same diameter and radius as the magnetic positioning components; the side of the bottom is provided with magnetic positioning components arranged in an array at a first preset interval and occupying half of the corresponding portion; A superconducting coil is provided on the top of the mobile heat dissipation component, arranged in a ring shape and evenly distributed on the top, and the superconducting coils are spaced a first preset distance apart; A magnetic connector is provided on the side between the bottom and the top of the mobile heat dissipation component for magnetically connecting to another mobile heat dissipation component.

3. The heat dissipation system according to claim 2, characterized in that: The top surface of the device to be cooled is provided with corresponding magnetic protrusion structures arranged in an array at a first preset interval to position the magnetic positioning component of the mobile cooling assembly.

4. The heat dissipation system according to claim 3, characterized in that: A liquid cooling unit and / or a fan unit is provided inside the mobile heat dissipation component to receive magnetic field information corresponding to the electrical energy through the superconducting coil, convert the magnetic field information into alternating current, and output voltage to the liquid cooling unit and / or the fan unit to drive the operation to dissipate heat from the device to be dissipated.

5. A node server, characterized in that: The node server mainboard is provided with a heat dissipation device and a heat dissipation system according to any one of claims 1 to 4; The device to be cooled is cooled by the cooling system.

6. A heat dissipation method based on a server, characterized in that: Applied to a heat dissipation system, the heat dissipation system includes a heat dissipation array, a thermal sensing device, and a controller; the heat dissipation array is composed of mobile heat dissipation components connected by magnetic attraction and positioned on the surface of the device to be cooled; the mobile heat dissipation components are reorganized based on the heat dissipation intensity required by the device to be cooled; The thermal sensing device is connected to the controller; The wireless power transmitting array covers the device to be cooled and is connected to the controller; the method includes: Sense the heat dissipation performance parameters of the device to be cooled; Determining a corresponding heat dissipation path based on the heat dissipation performance parameters and the power allocation strategy of the device to be cooled, and performing power distribution processing on the wireless power transmission array based on the heat dissipation path; wherein, after determining the number of mobile heat dissipation components corresponding to the heat dissipation device based on the heat dissipation path, power is distributed through the wireless power transmission array; the heat dissipation path is determined by proportional allocation between different heat dissipation performance parameters and corresponding power allocation strategies; The heat dissipation array is controlled to receive the electric energy sent by the wireless power transmitting array, so as to construct the heat dissipation path and dissipate the heat of the device to be dissipated.

7. The server-based heat dissipation method according to claim 6, characterized in that: The heat dissipation performance parameters include at least a temperature parameter, a distance parameter between the device to be cooled and the mobile heat dissipation assembly, and a magnetic flux matching degree between the heat dissipation array and the wireless power transmission array; Determining a corresponding heat dissipation path according to the heat dissipation performance parameter and the power allocation strategy of the device to be cooled includes: Pre-acquire a first mapping relationship between a preset temperature parameter and a preset heat load parameter; Determine current heat load parameters of multiple components to be cooled according to the first mapping relationship and the temperature parameter; Obtaining preset mobile heat dissipation components for respective scheduling of multiple devices to be cooled; Determining a first target mobile heat dissipation component in an idle state among the preset mobile heat dissipation components; Determining distance parameters between a plurality of components to be cooled and their respective corresponding first target movable cooling components; Obtaining device priorities of multiple devices to be cooled, and determining corresponding priority weight parameters according to the respective device priorities; Determining a first weight parameter of the current heat load parameter and a second weight parameter of the distance parameter; Determine a scheduling path between the current device to be cooled and the first target mobile cooling component according to the current heat load parameter, the first weight parameter, the distance parameter, the second weight parameter, the device priority, the priority weight parameter, and the magnetic flux matching degree corresponding to the first target mobile cooling component; The scheduling paths between the current device to be cooled and a plurality of first target mobile cooling components are sorted to determine a cooling path of the current device to be cooled.

8. The server-based heat dissipation method according to claim 6, characterized in that: Performing power distribution processing on the wireless power transmitting array based on the heat dissipation path includes: mapping the heat dissipation path to a first transmission path corresponding to the wireless power transmitting array; Determine a second transmission path corresponding to the wireless power transmission array transmitting to the device to be cooled; The power of the wireless power transmission array is distributed according to the first transmission path and the second transmission path. The preset power is transmitted; wherein the transmission power of the non-transmission path is less than the transmission power of the first transmission path and the second transmission path.

9. An electronic device, characterized in that: include: Memory for storing computer programs; A processor, configured to implement the steps of the server-based heat dissipation method according to any one of claims 6 to 8 when executing the computer program.

10. A computer-readable storage medium, characterized in that The computer-readable storage medium stores a computer program, wherein when the computer program is executed by a processor, the steps of the server-based heat dissipation method according to any one of claims 6 to 8 are implemented.

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