Manufacturing method of aluminum foil COB lamp strip

Abstract

The invention provides a manufacturing method of an aluminum foil COB (Chip On Board) lamp strip, which comprises the following steps: detecting whether a material meets a feeding standard or not during feeding, pretreating an aluminum foil into an aluminum foil circuit board comprising an anode aluminum foil, a cathode aluminum foil and an aluminum foil bearing sheet, and plating metal on the aluminum foil circuit board to form a conductive bonding pad; the aluminum foil circuit board is placed in a eutectic machine to be preheated and heated, the LED light-emitting chip module and the protective resistor are connected into a conductive bonding pad, and eutectic fusion is carried out; and cutting off the positive electrode aluminum foil, the negative electrode aluminum foil and the aluminum foil bearing sheet, packaging with fluorescent glue, heating and curing, cutting into a plurality of aluminum foil COB lamp strips, electrifying and testing, coiling the qualified aluminum foil COB lamp strips, sealing and packaging, and pasting labels. The aluminum foil COB lamp strip has the beneficial effects that the aluminum foil is used as a carrier of the LED light-emitting chip module, and the aluminum foil COB lamp strip is simple in structure, uniform in light-emitting brightness, low in production cost, high in production efficiency and good in heat dissipation.

Description

Technical Field

[0001] The present invention relates to the technical field of LED light strips, and in particular to a method for manufacturing an aluminum foil COB light strip. Background Art

[0002] Light strips are LED lights soldered onto copper wire or flexible circuit boards using a special process, then connected to a power source to produce light. They are named for their strip-like shape when illuminated. They are widely used in buildings, bridges, roads, gardens, courtyards, floors, ceilings, furniture, cars, ponds, underwater, advertisements, signs, and other fields for decoration or illumination, adding endless joy and festive atmosphere to various festivals such as Christmas, Halloween, Valentine's Day, Easter, and National Day. With their tenacious vitality, they have entered the five major advantageous markets of advertising, decoration, construction, commercial use, and gifts, and are exported to many countries and regions. They are widely used in building corridors, bridges, guardrails, hotels, gardens, dance halls, and advertising decorations.

[0003] Among them, the light strip welded on the strip flexible circuit board is also called FPC light strip. FPC light strip refers specifically to the light strip assembled with flexible circuit board FPC as the carrier. Because of the softness and ultra-thinness of FPC, its application range is wider. The LEDs assembled on FPC light strips include SMD LEDs, direct-plug LEDs and flip-chip LEDs. Flip-chip LEDs are also called COB. The sizes of SMD LEDs are 0603, 0805, 1206, 1210, 5050, 5060 and other specifications, and the colors include red, yellow, blue, green, white, yellow-green, purple, RGB and other colors; direct-plug LEDs are ∮3, ∮5, ∮6, etc., with round heads and flat heads (commonly known as straw hat lights), and the colors are also red, yellow, blue, green, white, etc. FPC light strips are mainly used in advertising decoration, car decoration, home decoration and other places. They can also be used in reflective vests and for some special purposes. The common specifications of FPC light strips are 20cm long with 8 LEDs, 30cm long with 18 LEDs, 30cm long with 24 LEDs, 50cm long with 15 LEDs, 50cm long with 24 LEDs, 50cm long with 30 LEDs, and there are also specifications of 60cm and 80cm lengths. Different users have different specifications. Because FPC material is soft, it can be bent, folded, and rolled up at will. It can be moved and stretched in three-dimensional space without breaking. Therefore, FPC light strips can be cut or extended at will without affecting the light emission. They are suitable for use in irregular places and small spaces. Because they can be bent and rolled up at will, they are suitable for arbitrary combination of various patterns in advertising decoration.

[0004] COB light strips utilize LED modules as the light source and flexible printed circuit boards (FPCs) as the carrier assembly. LED light strips utilize LEDs as the light source, with lenses or reflectors used to arrange the LEDs into a specific pattern. COB light strips, on the other hand, utilize surface-mount LED modules and lenses or reflectors to create a specific pattern. COB light strips offer advantages over LED light strips in that they can be produced in a variety of patterns. Furthermore, because the LED modules in COB light strips are DC devices, they do not generate high-frequency electromagnetic fields that could interfere with other electronic devices. COB light strips offer the advantages of brighter light intensity, greater environmental friendliness, and higher power consumption. Another advantage of COB light strips is their spot size, which facilitates secondary optical design. However, COB light strips also have a major drawback: heat dissipation. Because the high-power chip packages are concentrated in a small area, all the heat is concentrated in a small area, making it difficult to dissipate, significantly reducing the lifespan of the lamp.

[0005] The existing COB light strip manufacturing method is to etch a circuit on a flexible organic material to make it a carrier, then patch the LED module onto the carrier and perform spot tin soldering, and then encapsulate it with translucent glue. Due to process reasons, the etched circuit has a relatively narrow line width, so the current limitation is large, the voltage drop is particularly obvious, and the brightness of the lamp beads at the beginning and end of the light strip varies greatly; and because the heat dissipation performance of the flexible organic material and the translucent glue is relatively poor, the COB light strip is also more likely to burn out the already narrow circuit during use; moreover, the etching process is complicated to produce, resulting in relatively low production efficiency, high pollution of etching waste liquid caused by etching production, and high processing costs, which are difficult to meet people's needs. Summary of the Invention

[0006] In order to solve the problems in the prior art, the present invention provides a method for manufacturing an aluminum foil COB light strip. By producing an aluminum foil COB light strip, aluminum foil is used as a carrier and conductive circuit for the LED module light-emitting chip. The structure is simple, no etching is required, and only laser cutting or stamping is required. The production cost is low, the production efficiency is high, the heat dissipation is good, and the brightness of the LED module light-emitting chip is uniform. The problem of the COB light strip in the prior art that the voltage drop is obvious, resulting in uneven brightness of the LED module light-emitting chip, poor heat dissipation, narrow circuit that is easy to burn out, and low etching production efficiency is solved.

[0007] The present invention provides a method for manufacturing an aluminum foil COB light strip, comprising the following steps:

[0008] Step 1: Material loading inspection and aluminum foil pretreatment: During loading, the aluminum foil, LED light-emitting chip module, and protective resistor are inspected to see if they meet the loading standards. The aluminum foil is pretreated into an aluminum foil circuit board comprising positive aluminum foil, negative aluminum foil, and an aluminum foil carrier sheet. An insulating layer is applied to the back of the aluminum foil circuit board. Metal is plated on the positive aluminum foil, negative aluminum foil, and aluminum foil carrier sheet to form conductive pads. An insulating layer is applied to the front of the aluminum foil circuit board.

[0009] Step 2: Mount the LED chip module and protective resistor. Place the aluminum foil circuit board in the eutectic machine and heat it to the required eutectic temperature in the preheating zone and heating zone. Then, connect the LED chip module and protective resistor to the metal-plated conductive pads on the aluminum foil circuit board in the mounting zone. Eutectic fusion is carried out in the eutectic machine, and then the machine is sent out after passing through the cooling zone.

[0010] Step 3: Product packaging, testing and packaging. Cut the positive and negative aluminum foils of the cooled aluminum foil circuit board and the aluminum foil carrier sheet, then encapsulate them with fluorescent glue and heat-cure them. Cover the back of the aluminum foil circuit board with double-sided tape, and then cut them into multiple aluminum foil COB light strips and power them on for testing. Mark the defective products and return them for repair. The aluminum foil COB light strips that pass the test are rolled into rolls, sealed and packaged, and labeled.

[0011] The present invention is further improved, in said step 1, further comprising the following steps:

[0012] Step 101: During loading, check whether the surfaces of the aluminum foil, LED light-emitting chip module, and protective resistor are clean and intact;

[0013] Step 102: When the surfaces of the aluminum foil, LED light-emitting chip module, and protective resistor are found to be clean and intact, the dimensions of the aluminum foil, LED light-emitting chip module, and protective resistor are checked to see if they meet the loading standards.

[0014] Step 103: When the dimensions of the aluminum foil, LED light-emitting chip module, and protective resistor are found to meet the loading standards, the aluminum foil is cut or punched into an aluminum foil circuit board comprising a positive electrode aluminum foil, a negative electrode aluminum foil, and an aluminum foil carrier sheet. An insulating layer is applied to the back of the aluminum foil circuit board and the board is baked.

[0015] Step 104: Metallizing the positive electrode aluminum foil, the negative electrode aluminum foil, and the aluminum foil carrier to form conductive pads;

[0016] Step 105: Cover the front side of the aluminum foil circuit board with an insulating layer.

[0017] The present invention is further improved, in said step 3, further comprising the following steps:

[0018] Step 301: Silica gel with a heat resistance of >260°C and phosphor powder are mixed in a proportion and uniformly prepared into fluorescent glue;

[0019] Step 302: Separate the positive electrode aluminum foil and the aluminum foil carrier sheet, and separate the negative electrode aluminum foil and the aluminum foil carrier sheet of the cooled aluminum foil circuit board by laser cutting, high-speed die stamping, or roller die cutting;

[0020] Step 303: Place the prepared fluorescent glue and the cut aluminum foil circuit board on a glue dispenser for glue dispensing, and then bake in an oven to completely solidify the glue to form a sealing glue layer;

[0021] Step 304: Cover the back of the baked product with double-sided tape and use laser to cut it into multiple aluminum foil COB light strips. Then place it on a power supply test stand for lighting test. Defective products will be marked and returned for repair.

[0022] Step 305: The aluminum foil COB light strip that has passed the test is rolled up using a reeling machine, and the rolled aluminum foil COB light strip is sealed and packed in a sealed bag and labeled.

[0023] The present invention is further improved. In steps 101 and 102, when it is detected that the surfaces of the aluminum foil, LED light-emitting chip module and protective resistor are unclean or defective, or the size specifications of the aluminum foil, LED light-emitting chip module and protective resistor do not meet the feeding standards, the aluminum foil, LED light-emitting chip module and protective resistor with unclean or defective surfaces or those that do not meet the feeding standards are removed.

[0024] The present invention is further improved. In step 1, the aluminum foil is pre-treated to prepare an aluminum foil circuit board comprising a positive electrode aluminum foil, a negative electrode aluminum foil and an aluminum foil carrier sheet by laser cutting, high-speed die stamping or roller die cutting. The aluminum foil carrier sheets are cut and separated from each other, while the positive electrode aluminum foil and the aluminum foil carrier sheet, and the negative electrode aluminum foil and the aluminum foil carrier sheet are not cut. The insulating layer on both sides of the aluminum foil circuit board is a PET film or a PI film, and the PET film is tightly adhered to the aluminum foil circuit board.

[0025] The present invention is further improved. In step 104, the metal used to form the conductive pad is copper, silver, nickel, or tin, and the metal plating method is electroplating. Each of the aluminum foil carrier sheets is provided with at least two metal-plated conductive pads, the positive aluminum foil is provided with at least one metal-plated conductive pad, and the negative aluminum foil is provided with at least one metal-plated conductive pad; the insulating layer on both sides of the aluminum foil circuit board is a PET film or a PI film, and the PET film or the PI film is tightly adhered to the aluminum foil circuit board.

[0026] The present invention is further improved. In step 301, the fluorescent glue can be modulated into any color, allowing the LED light-emitting chip module to emit light of different colors, and nano-scale titanium dioxide powder can be added to the fluorescent glue according to different application requirements.

[0027] The present invention is further improved. In step 2, the eutectic machine is provided with a preheating zone, a heating zone, a patch zone and a cooling zone in sequence. The conveyor belt in the eutectic machine can drive the aluminum foil circuit board through the preheating zone, the heating zone, the patch zone and the cooling zone in sequence. The required eutectic temperature is 280°C.

[0028] The present invention is further improved. In steps 1 and 2, when an insulating layer is coated on the front side of the aluminum foil circuit board and solder paste is printed in step 1, solder paste soldering equipment is used in step 2 to replace the eutectic machine for heating, and the LED light-emitting chip module and the protective resistor are heated and connected to the metal-plated conductive pad on the aluminum foil circuit board.

[0029] The present invention is further improved. In steps 1, 2 and 3, the width of the aluminum foil is 110 cm, the width of the aluminum foil circuit board and the aluminum foil COB light strip is 2 cm, and the eutectic machine can produce up to 55 aluminum foil COB light strips at a time.

[0030] The beneficial effects of the present invention are as follows: the present invention provides a manufacturing method of an aluminum foil COB light strip, which produces an aluminum foil COB light strip and uses aluminum foil as a carrier and conductive circuit for the LED module light-emitting chip, has a simple structure, and all LED module light-emitting chips directly use aluminum foil as a circuit carrier, so that the conductive circuit is wide, the influence of voltage drop is minimized, and the brightness of the LED module light-emitting chip is uniform; there is no need to etch the circuit, and the positive aluminum foil, negative aluminum foil and aluminum foil carrier sheet are directly formed by laser cutting, high-speed mold stamping or roller die cutting of aluminum foil to form a circuit, so the production cost is low; the LED module is mounted on the aluminum foil without spot tin welding, and is directly eutectic fused in a eutectic machine and then laser cut, so the production efficiency is high; the heat dissipation performance of the aluminum foil circuit board is much better than that of flexible organic materials, which solves the problems in the prior art of COB light strips caused by obvious voltage drop, resulting in uneven brightness of the LED module light-emitting chip, poor heat dissipation, narrow circuits that are easy to burn out, and low etching production efficiency. BRIEF DESCRIPTION OF THE DRAWINGS

[0031] Figure 1 This is a flow chart of a method for manufacturing an aluminum foil COB light strip according to the present invention;

[0032] Figure 2 This is a flow chart of a method for manufacturing an aluminum foil COB light strip according to the present invention;

[0033] Figure 3 The present invention is a flowchart of a method for manufacturing an aluminum foil COB light strip. DETAILED DESCRIPTION

[0034] The present invention is further described in detail below with reference to the accompanying drawings and embodiments.

[0035] See Figure 1-3 The present invention provides a method for manufacturing an aluminum foil COB light strip, comprising the following steps:

[0036] Step 1: Material feeding detection and aluminum foil pretreatment. When feeding, detect whether the aluminum foil, LED light-emitting chip module and protective resistor meet the feeding standards, and pre-process the aluminum foil into an aluminum foil circuit board containing positive aluminum foil, negative aluminum foil and aluminum foil carrier. Cover the back of the aluminum foil circuit board with an insulating layer, and metalize the positive aluminum foil, negative aluminum foil and aluminum foil carrier to form conductive pads, and cover the front of the aluminum foil circuit board with an insulating layer. Among them, the insulating layer on both sides of the aluminum foil circuit board is PET film or PI film. The PET film or PI film fits tightly with the aluminum foil circuit board, which can make the aluminum foil COB light strip not easy to bend. When brushing white oil, it is necessary to reserve the position of the aluminum foil circuit board to be metalized to form a conductive pad. The main purpose of brushing white oil is to strengthen the connection between the positive aluminum foil, negative aluminum foil and aluminum foil carrier so that it will not be completely disconnected due to pretreatment. This effect can be achieved regardless of brushing white oil or laminating, and the order of brushing white oil or laminating can also be adjusted. In this embodiment, aluminum foil is used as a carrier for LED light-emitting chips, which has a simple structure. All LED light-emitting chips directly use aluminum foil as a circuit carrier, the conductive line is wide, the influence of voltage drop is minimized, and the brightness of the LED light-emitting chips is uniform; there is no need to etch the circuit, and the positive aluminum foil, negative aluminum foil and aluminum foil carrier sheet are directly formed by laser cutting aluminum foil to form a circuit, so the production cost is low; there is no need to perform spot tin welding on the LED patch to the aluminum foil, and it is directly eutectic fused in a eutectic machine and then laser cut, so the production efficiency is high; the heat dissipation performance of the aluminum foil circuit board is much better than that of flexible organic materials, and the price of aluminum foil is much cheaper than that of the organic material of the strip flexible circuit board, so compared with the FPC light strip, the production cost is greatly reduced; the surface of the aluminum foil will rapidly oxidize naturally to form an insulating aluminum oxide protective film, which can not only prevent corrosion and increase the service life of the aluminum foil COB light strip, but also improve the safety of the aluminum foil COB light strip. PET film, also known as PET plastic, is the abbreviation of Polyethylene terephthalate in English, abbreviated as PET or PETP. Its Chinese meaning is: polyethylene terephthalate plastics, mainly including polyethylene terephthalate PET and polybutylene terephthalate PBT. Polyethylene terephthalate, also commonly known as polyester resin, is a condensation product of terephthalic acid and ethylene glycol. Together with PBT, it is collectively referred to as thermoplastic polyester, or saturated polyester; PI film, also known as polyimide (Polyimide), abbreviated as PI, is a polymer with an imide group (─C(O)─N─C(O)─) in the main chain. As a special engineering material, polyimide has been widely used in aviation, aerospace, microelectronics, nanotechnology, liquid crystal, separation membranes, lasers and other fields. Recently, countries have listed the research, development and utilization of polyimide as one of the most promising engineering plastics in the 21st century. In this embodiment, PET film is cheap and can be cut by laser. PI film is slightly more expensive and can be cut by laser or reflow soldering. White oil is simple to produce, but the strength of white oil is slightly lower. It can be matched according to specific production needs.

[0037] Step 2: Mount the LED light-emitting chip module and protective resistor, place the aluminum foil circuit board in the eutectic machine, and heat it to the required eutectic temperature through the preheating zone and heating zone. Then, in the patch zone, connect the LED light-emitting chip module and protective resistor to the metal-plated conductive pads on the aluminum foil circuit board. Eutectic fusion occurs in the eutectic machine, and then the board is sent out of the eutectic machine after passing through the cooling zone. The eutectic machine is equipped with a preheating zone, a heating zone, a patch zone, and a cooling zone in sequence. The conveyor belt in the eutectic machine can drive the aluminum foil circuit board through the preheating zone, the heating zone, the patch zone, and the cooling zone. The required eutectic temperature is 280°C. When an insulating layer is applied to the front of the aluminum foil circuit board and solder paste is printed in step 1, the solder paste soldering equipment is used in step 2 to replace the eutectic machine for heating, and the LED light-emitting chip module and protective resistor are heated and connected to the metal-plated conductive pads on the aluminum foil circuit board.

[0038] Step 3: Product packaging, testing and packaging. Cut the positive and negative aluminum foils of the cooled aluminum foil circuit board and the aluminum foil carrier sheet, then encapsulate them with fluorescent glue and heat-cure them. Cover the back of the aluminum foil circuit board with double-sided tape, cut them into multiple aluminum foil COB light strips and test them with power. Mark the defective products and return them for repair. The aluminum foil COB light strips that pass the test are rolled into rolls, sealed and packaged, and labeled. The width of the aluminum foil is 110 cm, and the width of the aluminum foil circuit board and the aluminum foil COB light strip is 2 cm. The eutectic machine can produce up to 55 aluminum foil COB light strips at a time. In this embodiment, the circuit of the aluminum foil COB light strip does not need to be etched. The positive aluminum foil, negative aluminum foil, and aluminum foil carrier sheet are directly formed by laser cutting the aluminum foil or high-speed stamping of the mold or roller die cutting of the aluminum foil, which has low production cost and high production efficiency.

[0039] Eutectic refers to a mixture of two or more dense crystals formed when a liquid alloy of a certain composition cools, solidifies, and crystallizes at the eutectic reaction temperature. Simple binary alloys can be represented by the general formula La + β. Alloy structures that deviate from the eutectic composition are called hypoeutectics or hypereutectics. Eutectics are generated by mutual nucleation, with a dendritic proeutectic structure first precipitating from the liquid. The liquid between the dendrites then solidifies into a eutectic structure, which grows alternately through branching and bridging to form a lamellar structure. Due to short-range separation, diffusion, and growth, typical eutectic structures are lamellar or rod-like; the morphology of added structures is strip-like, dot-like, or spiral-like. Atypical eutectics are formed when two independent nucleation interfaces form, which is related to the growth mode. The presence of a primary phase is prone to divorced eutectics, where one phase in the eutectic grows in isolation around the primary phase. Eutectic alloys have low melting points and are easy to flow and cast. They have poor pressure working and welding properties but good cutting properties.

[0040] Eutectic bonding involves the fusion of eutectic materials at relatively low temperatures. The eutectic alloy transitions directly from solid to liquid without undergoing a plastic phase, resulting in an equilibrium reaction in which one liquid simultaneously generates two solid states. The melting point is called the eutectic temperature. The key to eutectic soldering technology lies in the selection of eutectic materials and the control of soldering temperature. For the new generation of InGaN high-brightness LEDs, using eutectic bonding, the bottom of the die can be coated with pure tin (Sn) or a gold-tin (Au-Sn) alloy as the contact surface, and the die can be soldered to a gold- or silver-plated substrate. When the substrate is heated to the appropriate eutectic temperature, the gold or silver element penetrates the Au-Sn alloy layer. This change in alloy composition raises the melting point, causing the eutectic layer to solidify and securely solder the LED to the heat sink or substrate. When considering a eutectic die bonder, in addition to high positioning accuracy, flexible and stable temperature control and the presence of a nitrogen or mixed gas system are also crucial for preventing oxidation during the eutectic bonding process. Of course, as with silver paste die bonding, achieving high-precision die bonding requires rigorous mechanical design and high-precision motor motion. This ensures optimal control of the soldering head movement and soldering force while maintaining high production capacity and yield. In this embodiment, the LED chip's power pins are made of tin or a tin alloy, allowing for eutectic bonding with the copper and silver in the conductive pads.

[0041] See Figure 2 , in step 1, further comprising the following steps,

[0042] Step 101: During loading, the surfaces of the aluminum foil, LED light-emitting chip module, and protective resistor are inspected to see if they are clean and intact. When it is detected that the surfaces of the aluminum foil, LED light-emitting chip module, and protective resistor are not clean or have defects, or the dimensions of the aluminum foil, LED light-emitting chip module, and protective resistor do not meet loading standards, the aluminum foil, LED light-emitting chip module, and protective resistor with unclean or defective surfaces or those that do not meet loading standards are removed.

[0043] Step 102: When the surfaces of the aluminum foil, LED light-emitting chip module and protective resistor are detected to be clean and intact, the dimensions of the aluminum foil, LED light-emitting chip module and protective resistor are detected to see whether they meet the feeding standards. When it is detected that the dimensions of the aluminum foil, LED light-emitting chip module and protective resistor do not meet the feeding standards, the aluminum foil, LED light-emitting chip module and protective resistor whose dimensions do not meet the feeding standards are removed.

[0044] Step 103: When the dimensions of the aluminum foil, LED light-emitting chip module, and protective resistor are found to meet the loading standards, the aluminum foil is cut or punched into an aluminum foil circuit board comprising a positive aluminum foil, a negative aluminum foil, and an aluminum foil carrier sheet. An insulating layer is applied to the back of the aluminum foil circuit board and the board is baked. The aluminum foil is pre-processed into the aluminum foil circuit board comprising the positive aluminum foil, the negative aluminum foil, and the aluminum foil carrier sheet by laser cutting, high-speed die stamping, or roller die cutting. The aluminum foil carrier sheets are cut and separated from each other, while the positive aluminum foil and the aluminum foil carrier sheet, and the negative aluminum foil and the aluminum foil carrier sheet, are not cut. In this embodiment, since the dimensions of the aluminum foil circuit board are as fine as microns, laser cutting or high-speed die stamping achieves the best accuracy. Roller die cutting achieves slightly lower accuracy. Etching can also be used, but this is environmentally friendly and has a high cost.

[0045] Step 104: Metal is plated on the positive aluminum foil, the negative aluminum foil and the aluminum foil carrier sheet to form conductive pads, wherein the metal used to form the conductive pads is copper, silver, nickel or tin, and the metal plating method is electroplating. Each aluminum foil carrier sheet is provided with at least two metal-plated conductive pads, the positive aluminum foil is provided with at least one metal-plated conductive pad, and the negative aluminum foil is provided with at least one metal-plated conductive pad. In this embodiment, electroplating can be performed on the entire front surface of the aluminum foil circuit board, or a film can be coated on the front surface of the aluminum foil circuit board, and holes are opened in the film corresponding to the positions of the conductive pads, and electroplating is performed on the conductive pads. The advantage is that the cost is lower than the cost of electroplating the entire surface, but the adhesion of the electroplated metal is not as good as that of electroplating the entire surface.

[0046] Step 105: Cover the front side of the aluminum foil circuit board with an insulating layer.

[0047] See Figure 3 In step 3, the following steps are also included:

[0048] Step 301: Silica gel with a heat resistance of >260°C is mixed with phosphor powder in a uniform ratio to form a fluorescent glue. The fluorescent glue can be adjusted to any color, enabling the LED chip module to emit different colors. Nano-sized titanium dioxide powder can be added to the fluorescent glue to meet different application requirements. The transparent glue contains nano-sized white titanium dioxide particles, which increase the refractive index of the sealant layer and the brightness of the aluminum foil COB light strip. Silica gel (also known as silica gel) is a highly active adsorption material, an amorphous substance with the chemical formula mSiO2·nH2O. It does not react with any substances except strong alkalis and hydrofluoric acid, is insoluble in water and all solvents, is non-toxic and odorless, and has stable chemical properties. Different types of silica gel have different microporous structures due to their different manufacturing methods. The chemical composition and physical structure of silica gel give it many advantages that are difficult to replace with other similar materials, including high adsorption performance, good thermal stability, stable chemical properties, and high mechanical strength. In this embodiment, the light-transmitting adhesive is prepared by using silicone containing phosphor, which can improve the service life and safety of the aluminum foil COB light strip, and at the same time make the brightness of the LED light-emitting chip more uniform.

[0049] Step 302: The cooled aluminum foil circuit board is separated between the positive electrode aluminum foil and the aluminum foil carrier sheet, and between the negative electrode aluminum foil and the aluminum foil carrier sheet by laser cutting, high-speed die stamping, or roller die cutting.

[0050] Step 303: Place the prepared fluorescent glue and the cut aluminum foil circuit board on a glue dispenser for glue dispensing, and then bake in an oven to solidify the glue completely to form a sealing glue layer; the cross section of the sealing glue layer is circular or elliptical.

[0051] Step 304: Cover the back of the baked product with double-sided tape and use laser to cut it into multiple aluminum foil COB light strips. Then place it on a power supply test stand for lighting test. Mark defective products and return them for repair.

[0052] Step 305: The aluminum foil COB light strip that has passed the test is rolled up using a reeling machine, and the rolled aluminum foil COB light strip is sealed and packed in a sealed bag and labeled.

[0053] As can be seen from the above, the beneficial effects of the present invention are: the present invention provides a manufacturing method of an aluminum foil COB light strip, which produces an aluminum foil COB light strip and uses aluminum foil as a carrier and conductive circuit for the LED module light-emitting chip, with a simple structure. All LED module light-emitting chips directly use aluminum foil as a circuit carrier, and the conductive circuit is wide, the influence of voltage drop is minimized, and the brightness of the LED module light-emitting chip is uniform; there is no need to etch the circuit, and the positive aluminum foil, negative aluminum foil and aluminum foil carrier sheet are directly formed by laser cutting or high-speed mold stamping or roller die cutting of aluminum foil to form a circuit, and the production cost is low; the LED module does not need to be patched to the aluminum foil for spot tin welding, and it can be directly eutectic fused in a eutectic machine and then laser cut, and the production efficiency is high; the heat dissipation performance of the aluminum foil circuit board is much better than that of flexible organic materials, which solves the problems in the prior art that the voltage drop of the COB light strip is obvious, resulting in uneven brightness of the LED module light-emitting chip, poor heat dissipation, narrow circuits that are easy to burn out, and low etching production efficiency.

[0054] The specific implementation manner described above is a preferred implementation manner of the present invention, and is not intended to limit the specific implementation scope of the present invention. The scope of the present invention includes but is not limited to this specific implementation manner. All equivalent changes made in accordance with the present invention are within the protection scope of the present invention.

Claims

1. A method for manufacturing an aluminum foil COB light strip, characterized in that: The following steps are included: Step 1: Material loading inspection and aluminum foil pretreatment: During loading, the aluminum foil, LED light-emitting chip module, and protective resistor are inspected to see if they meet the loading standards. The aluminum foil is pretreated into an aluminum foil circuit board comprising positive aluminum foil, negative aluminum foil, and an aluminum foil carrier sheet. An insulating layer is applied to the back of the aluminum foil circuit board. Metal is plated on the positive aluminum foil, negative aluminum foil, and aluminum foil carrier sheet to form conductive pads. An insulating layer is applied to the front of the aluminum foil circuit board. Step 2: Mount the LED chip module and protective resistor. Place the aluminum foil circuit board in the eutectic machine and heat it to the required eutectic temperature in the preheating zone and heating zone. Then, connect the LED chip module and protective resistor to the metal-plated conductive pads on the aluminum foil circuit board in the mounting zone. Eutectic fusion is carried out in the eutectic machine, and then the machine is sent out after passing through the cooling zone. Step 3: Product packaging, testing and packaging. Cut the positive and negative aluminum foils of the cooled aluminum foil circuit board and the aluminum foil carrier sheet, then encapsulate them with fluorescent glue and heat-cure them. Cover the back of the aluminum foil circuit board with double-sided tape, and then cut them into multiple aluminum foil COB light strips and power them on for testing. Mark the defective products and return them for repair. The aluminum foil COB light strips that pass the test are rolled into rolls, sealed and packaged, and labeled.

2. The method for manufacturing an aluminum foil COB light strip according to claim 1, wherein: In step 1, the following steps are also included: Step 101: During loading, check whether the surfaces of the aluminum foil, LED light-emitting chip module, and protective resistor are clean and intact; Step 102: When the surfaces of the aluminum foil, LED light-emitting chip module, and protective resistor are found to be clean and intact, the dimensions of the aluminum foil, LED light-emitting chip module, and protective resistor are checked to see if they meet the loading standards. Step 103: When the dimensions of the aluminum foil, LED light-emitting chip module, and protective resistor are found to meet the loading standards, the aluminum foil is cut or punched into an aluminum foil circuit board comprising a positive electrode aluminum foil, a negative electrode aluminum foil, and an aluminum foil carrier sheet. An insulating layer is applied to the back of the aluminum foil circuit board and the board is baked. Step 104: Metallizing the positive electrode aluminum foil, the negative electrode aluminum foil, and the aluminum foil carrier to form conductive pads; Step 105: Cover the front side of the aluminum foil circuit board with an insulating layer.

3. The method for manufacturing an aluminum foil COB light strip according to claim 2, wherein: In step 3, the following steps are also included: Step 301: Silica gel with a heat resistance of >260°C and phosphor powder are mixed in a proportion and uniformly prepared into fluorescent glue; Step 302: Separate the positive electrode aluminum foil and the aluminum foil carrier sheet, and separate the negative electrode aluminum foil and the aluminum foil carrier sheet of the cooled aluminum foil circuit board by laser cutting, high-speed die stamping, or roller die cutting; Step 303: Place the prepared fluorescent glue and the cut aluminum foil circuit board on a glue dispenser for glue dispensing, and then bake in an oven to completely solidify the glue to form a sealing glue layer; Step 304: Cover the back of the baked product with double-sided tape and use laser to cut it into multiple aluminum foil COB light strips. Then place it on a power supply test stand for lighting test. Defective products will be marked and returned for repair. Step 305: The aluminum foil COB light strip that has passed the test is rolled up using a reeling machine, and the rolled aluminum foil COB light strip is sealed and packed in a sealed bag and labeled.

4. The method for manufacturing an aluminum foil COB light strip according to claim 3, wherein: In steps 101 and 102, when it is detected that the surfaces of the aluminum foil, LED light-emitting chip module and protective resistor are unclean or defective, or the size specifications of the aluminum foil, LED light-emitting chip module and protective resistor do not meet the feeding standards, the aluminum foil, LED light-emitting chip module and protective resistor with unclean or defective surfaces or that do not meet the feeding standards are removed.

5. The method for manufacturing an aluminum foil COB light strip according to claim 4, wherein: In step 1, the aluminum foil is pre-treated to prepare an aluminum foil circuit board comprising a positive electrode aluminum foil, a negative electrode aluminum foil, and an aluminum foil carrier sheet by laser cutting, high-speed die stamping, or roller die cutting. The aluminum foil carrier sheets are cut and separated from each other, while the positive electrode aluminum foil and the aluminum foil carrier sheet, and the negative electrode aluminum foil and the aluminum foil carrier sheet are not cut. The insulating layer on both sides of the aluminum foil circuit board is a PET film or a PI film, and the PET film or the PI film is tightly adhered to the aluminum foil circuit board.

6. The method for manufacturing an aluminum foil COB light strip according to claim 5, wherein: In step 104, the metal used to form the conductive pad is copper, silver, nickel or tin, and the metal plating method is electroplating. Each of the aluminum foil carrier sheets is provided with at least two metal-plated conductive pads, the positive aluminum foil is provided with at least one metal-plated conductive pad, and the negative aluminum foil is provided with at least one metal-plated conductive pad.

7. The method for manufacturing an aluminum foil COB light strip according to claim 6, wherein: In step 301, the fluorescent glue can be modulated into any color, allowing the LED light-emitting chip module to emit light of different colors, and nano-scale titanium dioxide powder can be added to the fluorescent glue according to different application requirements.

8. The method for manufacturing an aluminum foil COB light strip according to claim 7, wherein: In step 2, the eutectic machine is provided with a preheating zone, a heating zone, a patch zone and a cooling zone in sequence. The conveyor belt in the eutectic machine can drive the aluminum foil circuit board through the preheating zone, the heating zone, the patch zone and the cooling zone in sequence. The required eutectic temperature is 280°C.

9. The method for manufacturing an aluminum foil COB light strip according to claim 8, wherein: In steps 1 and 2, when an insulating layer is coated on the front of the aluminum foil circuit board and solder paste is printed in step 1, the solder paste soldering equipment is used in step 2 to replace the eutectic machine for heating, and the LED light-emitting chip module and the protective resistor are heated and connected to the metal-plated conductive pad on the aluminum foil circuit board.

10. The method for manufacturing an aluminum foil COB light strip according to claim 9, wherein: In steps 1, 2 and 3, the width of the aluminum foil is 110 cm, the width of the aluminum foil circuit board and the aluminum foil COB light strip is 2 cm, and the eutectic machine can produce a maximum of 55 aluminum foil COB light strips at a time.

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