Preparation method of GaN-based photoelectron chip based on micro-nano array structure

Abstract

The invention discloses a preparation method of a GaN-based photoelectron chip based on a micro-nano array structure, comprising a support plate, the top of the support plate is provided with a first groove, the inner surface of the first groove is rotatably provided with a conveyor belt, the top of the support plate is movably provided with a top plate, the top of the top plate is provided with a fourth groove, and the fourth groove is provided with a second groove. A fifth electric telescopic rod is movably installed on the inner surface of the fourth groove, the output end of the fifth electric telescopic rod is rotationally connected with four clamping jaws, two side plates are fixedly installed at the top of the supporting plate, and the opposite faces of the two side plates are jointly and fixedly connected with an ultrasonic cleaner. The three connecting rods rotate to enable the three clamping jaws to get close to each other so as to clamp the substrate, then the substrate is moved to an inner cavity of the cleaning tank to be cleaned, finally, the substrate is dried in an inner cavity of the drying box, then the substrate falls to the top of the conveying belt, and the substrate is detected through the detector. And the substrates are classified and collected according to different detection results in cooperation with the baffle.

Description

Technical Field

[0001] The present invention relates to the technical field of preparing GaN-based optoelectronic chips with a micro-nano array structure, and in particular to a method for preparing GaN-based optoelectronic chips with a micro-nano array structure. Background Art

[0002] The technological evolution of intelligent traffic signal systems is closely related to the development of high-power gallium nitride-based LED chips. These chips have shown significant application potential in the field of traffic signals due to their high power output, excellent photoelectric conversion efficiency and directional light-emitting characteristics.

[0003] In the field of semiconductor manufacturing, although the dry etching process based on top-down micromachining technology is a traditional method for preparing micro-nano array structures, it is prone to two key problems during the processing: first, lattice damage on the side walls of the structure will form non-radiative recombination centers, which directly leads to a significant decrease in the photoelectric conversion efficiency of the device; second, the interface defects generated by the processing may form leakage current channels. To eliminate such defects, high-precision dielectric filling processes such as atomic layer deposition are required. In addition, the cleanliness of the substrate will also affect the quality of the products produced.

[0004] This post-processing not only significantly increases manufacturing costs and process complexity, but also poses the risk of causing secondary damage to the device structure.

[0005] Therefore, in order to solve the above problems, a method for preparing GaN-based optoelectronic chips based on micro-nano array structure is proposed. Summary of the Invention

[0006] In order to make up for the shortcomings of the existing technology and solve the problem that the dry etching process of top-down micromachining technology easily causes secondary damage to the device, the present invention proposes a method for preparing a GaN-based optoelectronic chip based on a micro-nano array structure.

[0007] A preparation device based on a preparation method of a micro-nano array structure GaN-based optoelectronic chip, comprising a support plate, a first groove being provided on the top of the support plate, a conveyor belt being rotatably mounted on the inner surface of the first groove, a top plate being movably mounted on the top of the support plate, a fourth groove being provided on the top of the top plate, a fifth electric telescopic rod being movably mounted on the inner surface of the fourth groove, four clamping claws being rotatably connected to the output end of the fifth electric telescopic rod, two side plates being fixedly mounted on the top of the support plate, an ultrasonic cleaner being fixedly connected to opposing surfaces of the two side plates, three cleaning tanks being provided on the top of the ultrasonic cleaner, a drying oven being fixedly mounted on the bottom of the top plate, a hot air pipe and a connecting plate being fixedly connected to the outer surface of the drying oven, and the connecting plate being fixedly connected to one side of the ultrasonic cleaner.

[0008] Preferably, two conveying rollers are rotatably installed on the inner surface of the first groove, and the conveyor belt is wound and installed on the outer surfaces of the two conveying rollers. One side of one of the conveying rollers is fixedly connected to a first motor, and the first motor is fixedly installed on one side of the support plate.

[0009] Preferably, the first motor output shaft is fixedly connected to an incomplete gear, a limiting tube is fixedly installed on one side of the support plate, a gear is rotatably installed on one side of the support plate, a rack is slidably installed on the inner surface of the limiting tube, the incomplete gear and the gear are both engaged with the rack, a first spring is fixedly connected to one side of the rack, and the first spring is fixedly installed on one side of the support plate.

[0010] Preferably, two second grooves are provided on the top of the support plate, a bidirectional threaded rod is rotatably installed on the inner surface of the second groove, an L-shaped slider is slidably installed on the inner surface of the second groove, a clamping block is fixedly connected to one side of the L-shaped slider, and the bidirectional threaded rod is fixedly connected to one side of the gear.

[0011] Preferably, a first electric telescopic rod is fixedly installed on the top of the top plate, and the output end of the first electric telescopic rod is fixedly connected to a production box. A first sealing plate is fixedly installed on the bottom of the top plate. A third groove is provided on the top of the production box, and the first sealing plate is slidably installed on the inner surface of the third groove. A vacuum pump and a nitrogen pipe are fixedly connected to the outer surface of the production box. A second electric telescopic rod is fixedly installed on the outer surface of the production box, and the output end of the second electric telescopic rod is fixedly connected to a second sealing plate.

[0012] Preferably, a detector and a connecting block are fixedly connected to one side of the ultrasonic cleaner, four third electric telescopic rods are fixedly installed on the bottom of the connecting block, the output end of the third electric telescopic rod is fixedly connected to a second spring, one end of two adjacent second springs is commonly fixedly connected to a baffle, and the top of the baffle is fixedly connected to a vibrator.

[0013] Preferably, a fifth groove is provided on the top of the top plate, a threaded rod is rotatably installed on one side of the top plate, one end of the threaded rod is fixedly connected to the second motor, the second motor is fixedly installed on one side of the top plate, the outer surface of the threaded rod is threadedly connected to a sliding block, one side of the sliding block is fixedly connected to the fourth electric telescopic rod, the outer surface of the fourth electric telescopic rod is fixedly connected to a limiting slider, the limiting slider is slidably installed on the inner surface of the fifth groove, and the output end of the fourth electric telescopic rod is fixedly connected to the outer surface of the fifth electric telescopic rod.

[0014] Preferably, the output end of the fifth electric telescopic rod is fixedly connected to a rotating block, the inner surface of the rotating block is rotatably connected to a connecting column, one side of the rotating block is fixedly connected to a third motor, and the output shaft of the third motor is fixedly connected to one side of the connecting column.

[0015] Preferably, a sliding plate is slidably mounted on the outer surface of the connecting column, three connecting rods are rotatably mounted on the outer surface of the sliding plate, a fixed plate is fixedly connected to the bottom of the connecting column, the three clamps are rotatably mounted on the outer surface of the fixed plate, one end of the connecting rod is rotatably mounted on the top of the clamp, three sixth electric telescopic rods are fixedly mounted on the top of the fixed plate, and the output end of the sixth electric telescopic rod is fixedly connected to the bottom of the sliding plate.

[0016] A method for preparing a GaN-based optoelectronic chip based on a micro-nano array structure, the method using the device for preparing a GaN-based optoelectronic chip based on a micro-nano array structure, and the method comprising the following steps: S1: First, a substrate for manufacturing electronic chips is produced in the inner cavity of the production box; S2: The substrate is then placed on the conveyor belt and moves along the conveyor belt to the bottom of the clamp; S3: The three clamps then work together to pick up the substrate and place it in an ultrasonic cleaner for cleaning. After cleaning, the substrate is placed in a drying oven for drying. S4: Finally, the dried substrate is placed on the top of the conveyor belt. As the conveyor belt moves to the bottom of the detector, the detector detects the substrate. S5: Two baffles fall down respectively according to different detection results, diverting the substrate so that the substrate moves in different directions.

[0017] The present invention is beneficial in that: 1. The present invention uses a vacuum pump to put the inner cavity of the production box into a vacuum state, and then inputs substrate raw materials into the inner cavity of the production box through a nitrogen pipe to produce substrates. After the substrate production is completed, the second electric telescopic rod moves the second sealing plate to drop the substrate to the top of the conveyor belt. The first motor output shaft drives the conveyor roller to rotate, so that the conveyor roller and the conveyor belt rotate to move the substrate.

[0018] 2. In the present invention, when the output shaft of the first motor rotates, the incomplete gear will also rotate. The incomplete gear further drives the rack to slide along the limiting tube. At the same time, the rack also rotates with the gear. When the incomplete gear is not engaged with the rack, the first spring can make the rack return to its initial position. When the gear rotates, the bidirectional threaded rod can rotate. The bidirectional threaded rod further drives the two clamps to approach each other. With the action of the first spring, the two clamps move closer and farther in a reciprocating cycle. This can adjust the substrate to the middle position of the conveyor belt when the substrate passes between the two clamps.

[0019] 3. The present invention rotates the threaded rod through the second motor output shaft, and the horizontal position of the clamping claw can be adjusted by extending and shortening the output end of the fourth electric telescopic rod. The vertical position of the clamping claw can be adjusted by extending and shortening the fifth electric telescopic rod, so that the three clamping claws are located around the substrate. Then, the output end of the sixth electric telescopic rod is retracted to cause the sliding plate to slide upward along the connecting column, so that the three connecting rods are rotated to make the three clamping claws approach each other and thus clamp the substrate. Then, the substrate is moved to the inner cavity of the cleaning tank, cleaned, and finally dried in the inner cavity of the drying box. Then, the substrate is dropped to the top of the conveyor belt, detected by the detector, and classified and collected according to different detection results in cooperation with the baffle. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the following briefly introduces the drawings required for use in the embodiments or the description of the prior art. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative work.

[0021] Figure 1 This is a schematic diagram of the overall structure of an embodiment of the present invention; Figure 2 A schematic diagram of a rack connection structure according to an embodiment of the present invention; Figure 3 This is a schematic diagram of a gear connection structure according to an embodiment of the present invention; Figure 4 This is a schematic diagram of the connection structure of a production box according to an embodiment of the present invention; Figure 5 This is a schematic diagram of the installation structure of an ultrasonic cleaner according to an embodiment of the present invention; Figure 6 This is a schematic diagram of a threaded rod driving structure according to an embodiment of the present invention; Figure 7 This is a schematic diagram of the clamping jaw installation structure according to an embodiment of the present invention; Figure 8 The flowchart of one embodiment of the present invention is shown in FIG.

[0022] In the figure: 1. Support plate; 11. First groove; 12. Second groove; 2. Conveyor roller; 21. Conveyor belt; 22. First motor; 23. Incomplete gear; 24. Rack; 25. Limiting tube; 26. Gear; 27. First spring; 261. Bidirectional threaded rod; 262. L-shaped slider; 263. Clamping block; 3. Top plate; 301. Fourth groove; 302. Fifth groove; 31. First electric telescopic rod; 32. Production box; 321. Third groove; 322. First sealing plate; 323. Vacuum pump; 324. Nitrogen pipe; 35. Second electric telescopic rod; 36. Second sealing plate; 4. Side panel; 41. Ultrasonic cleaner; 411. Cleaning tank; 42. Connecting plate; 43. Drying box; 44. Hot air duct; 5. Detector; 51. Connecting block; 52. Third electric telescopic rod; 53. Second spring; 54. Baffle; 55. Vibrator; 6. Threaded rod; 61. Second motor; 62. Sliding block; 63. Fourth electric telescopic rod; 64. Limiting slider; 65. Fifth electric telescopic rod; 66. Rotating block; 661. Third motor; 662. Connecting column; 663. Sliding plate; 664. Fixed plate; 665. Clamping claw; 666. Connecting rod; 667. Sixth electric telescopic rod. DETAILED DESCRIPTION

[0023] The following will clearly and completely describe the technical solutions in the embodiments of the present invention in conjunction with the accompanying drawings. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making any creative efforts shall fall within the scope of protection of the present invention.

[0024] See also Figures 1 to 7 As shown, a preparation device based on a preparation method of a micro-nano array structure GaN-based optoelectronic chip includes a support plate 1, a first groove 11 is provided on the top of the support plate 1, a conveyor belt 21 is rotatably installed on the inner surface of the first groove 11, a top plate 3 is movably installed on the top of the support plate 1, a fourth groove 301 is provided on the top of the top plate 3, a fifth electric telescopic rod 65 is movably installed on the inner surface of the fourth groove 301, and four clamping claws 665 are rotatably connected to the output end of the fifth electric telescopic rod 65, two side plates 4 are fixedly installed on the top of the support plate 1, and an ultrasonic cleaner 41 is fixedly connected to the opposite surfaces of the two side plates 4, and three cleaning tanks 411 are provided on the top of the ultrasonic cleaner 41, a drying box 43 is fixedly installed on the bottom of the top plate 3, and a hot air pipe 44 and a connecting plate 42 are fixedly connected to the outer surface of the drying box 43, and the connecting plate 42 is fixedly connected to one side of the ultrasonic cleaner 41.

[0025] In the existing electronic chip production process, the dry etching process using top-down micromachining technology is prone to cause secondary damage to the electronic chip.

[0026] When the present invention is in use, after the substrate is produced, it falls onto the conveyor belt 21. The substrate moves along the conveyor belt 21 to the bottom of the three clamps 665 and is clamped by the three clamps 665. The fifth electric telescopic rod 65 moves with the clamps 665 holding the substrate to the top of the ultrasonic cleaner 41 and is cleaned in the inner cavities of the three cleaning tanks 411 respectively. The inner cavities of the three cleaning tanks 411 are filled with acetone, isopropyl alcohol, and deionized water in sequence. The order of the cleaning agents ensures a gradient transition from strong polarity to weak polarity solvents to avoid solvent residue. After the substrate is cleaned in sequence, it is moved to the inner cavity of the drying box 43 for drying. Finally, the dried substrate is placed on the top of the conveyor belt 21. The substrate moves along the conveyor belt 21 and is collected by the staff.

[0027] Further, such as Figure 2 and Figure 3 As shown, two conveying rollers 2 are rotatably installed on the inner surface of the first groove 11, and the conveyor belt 21 is wound and installed on the outer surface of the two conveying rollers 2. A first motor 22 is fixedly connected to one side of one of the conveying rollers 2, and the first motor 22 is fixedly installed on one side of the support plate 1; The output shaft of the first motor 22 is fixedly connected to an incomplete gear 23, a limiting tube 25 is fixedly installed on one side of the support plate 1, a gear 26 is rotatably installed on one side of the support plate 1, a rack 24 is slidably installed on the inner surface of the limiting tube 25, the incomplete gear 23 and the gear 26 are both engaged with the rack 24, and a first spring 27 is fixedly connected to one side of the rack 24, and the first spring 27 is fixedly installed on one side of the support plate 1; Two second grooves 12 are provided on the top of the support plate 1, and a bidirectional threaded rod 261 is rotatably installed on the inner surface of the second groove 12, and an L-shaped slider 262 is slidably installed on the inner surface of the second groove 12. A clamping block 263 is fixedly connected to one side of the L-shaped slider 262, and the bidirectional threaded rod 261 is fixedly connected to one side of the gear 26.

[0028] When the present invention is in use, the output shaft of the first motor 22 first drives the conveyor roller 2 to rotate, and when the conveyor roller 2 rotates, the conveyor belt 21 is rotated to realize the conveyance of the substrate. The output shaft of the first motor 22 simultaneously drives the incomplete gear 23 to rotate. The incomplete gear 23 can drive the rack 24 to slide along the limiting tube 25. When the rack 24 slides, it will drive the gear 26 to rotate, and in the gap where the incomplete gear 23 is not engaged with the rack 24, the first spring 27 will push the rack 24 to slide. When the gear 26 rotates, it will synchronously drive the bidirectional threaded rod 261 to rotate. The bidirectional threaded rod 261 can drive the L-shaped slider 262 to slide along the inner cavity of the second groove 12. The two L-shaped sliders 262 respectively drive the two clamping blocks 263 to slide back and forth toward each other, which can squeeze the substrate on the conveyor belt 21 to the middle.

[0029] Further, such as Figure 4 As shown, a first electric telescopic rod 31 is fixedly installed on the top of the top plate 3, and the output end of the first electric telescopic rod 31 is fixedly connected to a production box 32. A first sealing plate 322 is fixedly installed on the bottom of the top plate 3. A third groove 321 is provided on the top of the production box 32. The first sealing plate 322 is slidably installed on the inner surface of the third groove 321. A vacuum pump 323 and a nitrogen pipe 324 are fixedly connected to the outer surface of the production box 32. A second electric telescopic rod 35 is fixedly installed on the outer surface of the production box 32, and the output end of the second electric telescopic rod 35 is fixedly connected to a second sealing plate 36.

[0030] When the present invention is in use, first, when producing a substrate, the production box 32 is first lifted by the first electric telescopic rod 31 so that the first sealing plate 322 can seal the third groove 321 and the first sealing plate 322, and then the inner cavity of the production box 32 is placed in a vacuum state by the vacuum pump 323, and then the raw materials are transported to the inner cavity of the production box 32 through the nitrogen pipe 324 to produce the substrate. After the production is completed, the first electric telescopic rod 31 drives the production box 32 to descend again. At this time, the output end of the second electric telescopic rod 35 slides with the second sealing plate 36, and the second sealing plate 36 moves away from the bottom of the production box 32, which can make the substrate on the second sealing plate 36 fall onto the conveyor belt 21.

[0031] Further, such as Figure 5 As shown, a detector 5 and a connecting block 51 are fixedly connected to one side of the ultrasonic cleaner 41, four third electric telescopic rods 52 are fixedly installed at the bottom of the connecting block 51, the output end of the third electric telescopic rod 52 is fixedly connected to a second spring 53, and one end of two adjacent second springs 53 is commonly fixedly connected to a baffle 54, and the top of the baffle 54 is fixedly connected to a vibrator 55.

[0032] When the present invention is in use, the substrate moves to the bottom of the detector 5 along with the conveyor belt 21, and the detector 5 detects the substrate. According to different detection results, the detector 5 can drive different third electric telescopic rods 52 to extend. Different extensions of the third electric telescopic rods 52 can cause different baffles 54 to contact the top surface of the conveyor belt 21. The baffles 54 block the substrate and the movement path of the substrate can be adjusted. When in use, the vibrator 55 can make the baffle 54 vibrate continuously, and the second spring 53 can further increase the amplitude of the baffle 54. The vibration of the baffle 54 can prevent the substrate from stopping on one side of the baffle 54.

[0033] Further, such as Figure 6 and Figure 7 As shown, a fifth groove 302 is provided on the top of the top plate 3, a threaded rod 6 is rotatably mounted on one side of the top plate 3, one end of the threaded rod 6 is fixedly connected to a second motor 61, and the second motor 61 is fixedly mounted on one side of the top plate 3, the outer surface of the threaded rod 6 is threadedly connected to a sliding block 62, one side of the sliding block 62 is fixedly connected to a fourth electric telescopic rod 63, the outer surface of the fourth electric telescopic rod 63 is fixedly connected to a limiting slider 64, the limiting slider 64 is slidably mounted on the inner surface of the fifth groove 302, and the output end of the fourth electric telescopic rod 63 is fixedly connected to the outer surface of the fifth electric telescopic rod 65; The output end of the fifth electric telescopic rod 65 is fixedly connected to a rotating block 66, the inner surface of which is rotatably connected to a connecting column 662. One side of the rotating block 66 is fixedly connected to a third motor 661, and the output shaft of the third motor 661 is fixedly connected to one side of the connecting column 662. A sliding plate 663 is slidably mounted on the outer surface of the connecting column 662, and three connecting rods 666 are rotatably mounted on the outer surface of the sliding plate 663. The bottom of the connecting column 662 is fixedly connected to a fixed plate 664, and the three clamping claws 665 are rotatably mounted on the outer surface of the fixed plate 664. One end of the connecting rod 666 is rotatably mounted on the top of the clamping claw 665. Three sixth electric telescopic rods 667 are fixedly mounted on the top of the fixed plate 664, and the output end of the sixth electric telescopic rod 667 is fixedly connected to the bottom of the sliding plate 663.

[0034] When the present invention is in use, when it is necessary to clamp a substrate, the threaded rod 6 is first rotated by the output shaft of the second motor 61. When the threaded rod 6 rotates, the limiting slider 64 slides in the inner cavity of the fifth groove 302 to drive the fourth electric telescopic rod 63 to slide. After the clamping claw 665 is moved to the top of the substrate, the output end of the fifth electric telescopic rod 65 drives the connecting column 662 to move downward. After the three clamping claws 665 are at the periphery of the substrate, the output ends of the three sixth electric telescopic rods 667 are synchronously extended to drive the sliding plate 663 to move upward. The sliding plate 663 drives the three connecting rods 666 to rotate. The three connecting rods 666 respectively drive the three clamping claws 665 to clamp the substrate. Then, the fifth electric telescopic rod 65, the fourth electric telescopic rod 63 and the threaded rod 6 cooperate to move and clean the substrate. After cleaning is completed, the output shaft of the third motor 661 drives the connecting column 662 to rotate, and the connecting column 662 can move the clamped substrate to the inner cavity of the drying box 43 in one step. At this time, hot air is transported to the inner cavity of the drying box 43 through the hot air pipe 44, which can quickly dry the substrate.

[0035] A method for preparing a GaN-based optoelectronic chip based on a micro-nano array structure, the method using the device for preparing a GaN-based optoelectronic chip based on a micro-nano array structure, and the method comprising the following steps: S1: First, a substrate for manufacturing electronic chips is produced in the inner cavity of the production box 32; S2: The substrate is then placed on the conveyor belt 21 and moves along the conveyor belt 21 to the bottom of the clamp 665; S3: Then the three clamps 665 cooperate to pick up the substrate and place it in the ultrasonic cleaner 41 for cleaning. After cleaning, the substrate is placed in the inner cavity of the drying box 43 for drying. S4: Finally, the dried substrate is placed on the top of the conveyor belt 21. As the conveyor belt 21 moves to the bottom of the detector 5, the detector 5 detects the substrate; S5: The two baffles 54 fall down respectively according to different detection results, diverting the substrate so that the substrate moves in different directions.

[0036] Working principle: First, the inner cavity of the production box 32 is in a vacuum state through the vacuum pump 323, and then the substrate raw materials are input into the inner cavity of the production box 32 through the nitrogen pipe 324 to produce the substrate. After the substrate production is completed, the second electric telescopic rod 35 moves with the second sealing plate 36 to drop the substrate to the top of the conveyor belt 21. The output shaft of the first motor 22 drives the conveyor roller 2 to rotate, so that the conveyor roller 2 drives the conveyor belt 21 to rotate and thus move the substrate. When the output shaft of the first motor 22 rotates, it also drives the incomplete gear 23 to rotate. The incomplete gear 2 The rack 24 is further driven to slide along the limiting tube 25, while the rack 24 also rotates the gear 26. When the incomplete gear 23 is not engaged with the rack 24, the first spring 27 can return the rack 24 to its initial position. The rotation of the gear 26 can rotate the bidirectional threaded rod 261, which further drives the two clamping blocks 263 toward each other. With the action of the first spring 27, the two clamping blocks 263 move back and forth in a reciprocating cycle. This can adjust the substrate to the middle position of the conveyor belt 21 when the substrate passes between the two clamping blocks 263.

[0037] When the substrate moves to the bottom of the clamp 665, the threaded rod 6 is rotated by the output shaft of the second motor 61, and the horizontal position of the clamp 665 can be adjusted by extending and shortening the output end of the fourth electric telescopic rod 63. The vertical position of the clamp 665 can be adjusted by extending and shortening the fifth electric telescopic rod 65, so that the three clamps 665 are around the substrate. Then, the output end of the sixth electric telescopic rod 667 is retracted, and the sliding plate 663 is slid upward along the connecting column 662, so that the three connecting rods 666 are rotated to make the three clamps 665 approach each other and clamp the substrate. Then, the substrate is moved to the inner cavity of the cleaning tank 411, the substrate is cleaned, and finally the substrate is dried in the inner cavity of the drying box 43. Then, the substrate falls to the top of the conveyor belt 21, the substrate is detected by the detector 5, and the baffle 54 is used to classify and collect the substrate according to different detection results.

[0038] Since the structure in which the detector 5 can perform detection and drive the third electric telescopic rod 52 at the same time belongs to the prior art, it is not described in the present invention document.

[0039] Throughout this specification, references to terms such as "one embodiment," "example," or "specific example" indicate that the specific features, structures, materials, or characteristics described in conjunction with that embodiment or example are included in at least one embodiment or example of the present invention. In this specification, schematic representations of these terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.

[0040] The basic principles, main features, and advantages of the present invention are shown and described above. Those skilled in the art should understand that the present invention is not limited to the above embodiments. The above embodiments and descriptions are merely illustrative of the principles of the present invention. Various changes and modifications may be made to the present invention without departing from the spirit and scope of the present invention, and such changes and modifications fall within the scope of the invention as claimed.

Claims

1. A preparation device based on a preparation method of a micro-nano array structure GaN-based optoelectronic chip, comprising a support plate (1), characterized in that: The support plate (1) is provided with a first groove (11) on the top, a conveyor belt (21) is rotatably mounted on the inner surface of the first groove (11), a top plate (3) is movably mounted on the top of the support plate (1), a fourth groove (301) is provided on the top of the top plate (3), a fifth electric telescopic rod (65) is movably mounted on the inner surface of the fourth groove (301), and four clamping claws (665) are rotatably connected to the output end of the fifth electric telescopic rod (65), two side plates (4) are fixedly mounted on the top of the support plate (1), and an ultrasonic cleaner (41) is fixedly connected to the opposite surfaces of the two side plates (4), and three cleaning tanks (411) are provided on the top of the ultrasonic cleaner (41), a drying box (43) is fixedly mounted on the bottom of the top plate (3), and a hot air pipe (44) and a connecting plate (42) are fixedly connected to the outer surface of the drying box (43), and the connecting plate (42) is fixedly connected to one side of the ultrasonic cleaner (41).

2. The manufacturing device according to claim 1, wherein: Two conveying rollers (2) are rotatably mounted on the inner surface of the first groove (11), and the conveyor belt (21) is wound around the outer surfaces of the two conveying rollers (2). A first motor (22) is fixedly connected to one side of one of the conveying rollers (2), and the first motor (22) is fixedly mounted on one side of the support plate (1).

3. The manufacturing device according to claim 2, wherein: The output shaft of the first motor (22) is fixedly connected to an incomplete gear (23); a limiting tube (25) is fixedly mounted on one side of the support plate (1); a gear (26) is rotatably mounted on one side of the support plate (1); a rack (24) is slidably mounted on the inner surface of the limiting tube (25); the incomplete gear (23) and the gear (26) are both meshed with the rack (24); a first spring (27) is fixedly connected to one side of the rack (24); and the first spring (27) is fixedly mounted on one side of the support plate (1).

4. The manufacturing device according to claim 3, wherein: Two second grooves (12) are formed on the top of the support plate (1), a bidirectional threaded rod (261) is rotatably mounted on the inner surface of the second groove (12), an L-shaped slider (262) is slidably mounted on the inner surface of the second groove (12), a clamping block (263) is fixedly connected to one side of the L-shaped slider (262), and the bidirectional threaded rod (261) is fixedly connected to one side of the gear (26).

5. The manufacturing device according to claim 4, wherein: A first electric telescopic rod (31) is fixedly mounted on the top of the top plate (3), an output end of the first electric telescopic rod (31) is fixedly connected to a production box (32), a first sealing plate (322) is fixedly mounted on the bottom of the top plate (3), a third groove (321) is provided on the top of the production box (32), the first sealing plate (322) is slidably mounted on the inner surface of the third groove (321), a vacuum pump (323) and a nitrogen pipe (324) are fixedly connected to the outer surface of the production box (32), a second electric telescopic rod (35) is fixedly mounted on the outer surface of the production box (32), and an output end of the second electric telescopic rod (35) is fixedly connected to a second sealing plate (36).

6. The manufacturing device according to claim 5, characterized in that: One side of the ultrasonic cleaner (41) is fixedly connected to a detector (5) and a connecting block (51); four third electric telescopic rods (52) are fixedly installed at the bottom of the connecting block (51); the output end of the third electric telescopic rod (52) is fixedly connected to a second spring (53); one end of two adjacent second springs (53) is fixedly connected to a baffle (54); and the top of the baffle (54) is fixedly connected to a vibrator (55).

7. The manufacturing device according to claim 6, wherein: A fifth groove (302) is provided on the top of the top plate (3), a threaded rod (6) is rotatably mounted on one side of the top plate (3), one end of the threaded rod (6) is fixedly connected to a second motor (61), the second motor (61) is fixedly mounted on one side of the top plate (3), an outer surface of the threaded rod (6) is threadedly connected to a sliding block (62), one side of the sliding block (62) is fixedly connected to a fourth electric telescopic rod (63), an outer surface of the fourth electric telescopic rod (63) is fixedly connected to a limiting slider (64), the limiting slider (64) is slidably mounted on the inner surface of the fifth groove (302), and an output end of the fourth electric telescopic rod (63) is fixedly connected to the outer surface of the fifth electric telescopic rod (65).

8. The manufacturing device according to claim 7, wherein: The output end of the fifth electric telescopic rod (65) is fixedly connected to a rotating block (66), the inner surface of the rotating block (66) is rotatably connected to a connecting column (662), one side of the rotating block (66) is fixedly connected to a third motor (661), and the output shaft of the third motor (661) is fixedly connected to one side of the connecting column (662).

9. The manufacturing device according to claim 8, characterized in that: A sliding plate (663) is slidably mounted on the outer surface of the connecting column (662), three connecting rods (666) are rotatably mounted on the outer surface of the sliding plate (663), a fixed plate (664) is fixedly connected to the bottom of the connecting column (662), the three clamping claws (665) are rotatably mounted on the outer surface of the fixed plate (664), one end of the connecting rod (666) is rotatably mounted on the top of the clamping claw (665), three sixth electric telescopic rods (667) are fixedly mounted on the top of the fixed plate (664), and the output end of the sixth electric telescopic rod (667) is fixedly connected to the bottom of the sliding plate (663).

10. A method for preparing a GaN-based optoelectronic chip with a micro-nano array structure, characterized by: The preparation method adopts the preparation device of the micro-nano array structure GaN-based optoelectronic chip according to claims 1-9, and the preparation method comprises the following steps: S1: First, a substrate for manufacturing electronic chips is produced in the inner cavity of the production box (32); S2: The substrate is then placed on the conveyor belt (21) and moves along the conveyor belt (21) to the bottom of the clamp (665); S3: Then the three clamps (665) cooperate to pick up the substrate and place it in the ultrasonic cleaner (41) for cleaning. After cleaning, the substrate is placed in the inner cavity of the drying box (43) for drying; S4: Finally, the dried substrate is placed on the top of the conveyor belt (21), and as the conveyor belt (21) moves to the bottom of the detector (5), the detector (5) detects the substrate; S5: Two baffles (54) fall down respectively according to different detection results, diverting the substrate so that the substrate moves in different directions.

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