Spring probe contact assembly

Abstract

A compliant probe contact assembly for a test system for testing an integrated circuit device is provided. The contact assembly includes an upper plunger including a first shoulder separating an upper shaft from a lower shaft, and a retainer adjacent an end of the lower shaft. The contact assembly also includes a first receiver and a second receiver configured to engage with the upper plunger, each of the first receiver and the second receiver including a second shoulder having a shoulder stop. The contact assembly also includes a biasing member. When the contact assembly is assembled, the biasing member is captured between the bottom of the first shoulder and the shoulder stop of the first receiver and the shoulder stop of the second receiver. An upper plunger separates a side portion of an upper portion of the first receiver from a side portion of an upper portion of the second receiver. A side portion of the lower portion of the first receiver and a side portion of the lower portion of the second receiver are in contact with each other.

Description

Technical Field

[0001] The present disclosure relates generally to the field of testing microcircuits (eg, chips such as semiconductor devices, integrated circuits, etc.) More particularly, the present disclosure relates to a spring-loaded probe contact assembly that provides an electrical connection to a device under test (DUT). Background Art

[0002] The manufacturing process for microcircuits cannot guarantee that every microcircuit is fully functional. The size of individual microcircuits is microscopic, and the manufacturing steps are highly complex, so minor glitches or errors in the manufacturing process often result in defective devices. Installing a defective microcircuit on a circuit board is relatively expensive. Installation typically involves soldering the microcircuit to the circuit board. Once installed on the circuit board, removing the microcircuit presents a problem, as the second act of melting the solder can damage the board. Therefore, if the microcircuit is defective, the circuit board itself may also be destroyed, meaning the entire value added to the board is lost. For all these reasons, microcircuits are typically tested before being installed on a circuit board. Each microcircuit must be tested in a manner that identifies all defective devices, but also prevents incorrectly identifying a good device as defective. If these errors occur frequently, any one of these errors can add significant costs to the overall circuit board manufacturing process.

[0003] Microcircuit testing equipment itself is quite complex. First, the tester must make precise, low-resistance, temporary, and non-destructive electrical contact with each of the closely spaced microcircuit contacts. Due to the small size of the microcircuit contacts and the spacing between them, even a small error in contact formation can result in an incorrect connection. Another problem with microcircuit testing equipment arises during automated testing. The tester can test a hundred devices per minute, or even more. This sheer volume of testing leads to wear on the tester contacts that make electrical connections to the microcircuit terminals during testing.

[0004] There are other considerations as well. Inexpensive tester contacts that perform well are advantageous. Since test equipment is expensive, it is also desirable to minimize the time required to replace them. If the test equipment is offline for an extended period of time for normal maintenance, the cost of testing a single microcircuit increases. Currently used test equipment has an array of test contacts with a pattern that simulates the array of microcircuit terminals. The array of test contacts is supported in a structure that precisely keeps the contacts aligned relative to each other. The test contacts are mounted on a load board (i.e., a printed circuit board (PCB)) having conductive pads that are electrically connected to the test contacts. The load board pads are connected to circuit paths that transmit signals and power between the test equipment electronics and the test contacts. Summary of the Invention

[0005] Test contactors are typically designed and constructed using spring-loaded contacts because the design of the socket is simple, while the electrical contacts for ball grid array (BGA) packages and / or other array-type integrated circuit packages remain strong and reliable. The spring-loaded contacts form a temporary electrical connection between the DUT and the load board. Each contact (or contact assembly) connects a specific terminal on the DUT (e.g., signal and power (S&P) terminals) to a specific pad on the load board. It should be understood that the DUT can have a BGA package or any other suitable package (or packages). For example, the DUT can be a pad device, a peripheral device, etc.

[0006] The embodiments disclosed herein provide solutions to each of the above problems. The embodiments disclosed herein provide a compliant spring-loaded probe contact assembly comprising an upper plunger (DUT plunger) and a pair of receivers (also referred to as lower plungers, PCB plungers, or load board plungers), the pair of receivers being clamped by a biasing member such as a compliant compression spring. The probe contact assembly disclosed herein can significantly improve existing designs to enhance the electrical and mechanical performance of spring-loaded probes. The probe contact assembly disclosed herein can use a variety of manufacturing techniques to manufacture the plunger components of the spring-loaded probe contact assembly, and the probe contact assembly can be limited to using a single technology. The probe contact assembly disclosed herein is capable of using a homogeneous alloy DUT side tip and two identical PCB side plunger components, the PCB side plunger assembly being manufactured by a flat forming process (e.g., etching, stamping, water jet cutting, or e-forming). Using two PCB side plunger assemblies that contact PCB pads can be beneficial due to electrical redundancy.

[0007] The internal geometry of the probe contact assembly can be designed such that the geometry (e.g., the internal geometry of the spring) can capture and hold the component (e.g., within the internal volume of the spring) while forming a secure sliding interconnection between the upper plunger and the receiver pair. The probe contact assembly disclosed herein does not rely on deforming, crimping, snapping one (or more) latches, or press-fitting the spring. With the probe contact assembly disclosed herein, the geometry of the component alone can capture the probe contact assembly when the probe contact assembly is assembled, and the probe contact assembly may not physically detach from itself during normal use.

[0008] The probe contact assembly disclosed herein can reduce the overall length of the assembly, which can reduce probe inductance and improve radio frequency (RF) performance. In contrast, existing latch and press-fit technologies may require extended length regions to achieve positive latching, or features that are large enough to allow for curling or deformation to reliably hold the assembly together.

[0009] The probe contact assembly disclosed herein can be used in most commonly precision-machined standard socket housings, can be extremely miniaturized, and due to its inherent low inductance, may be necessary for testing 5G and other high-frequency semiconductor devices. The external spring geometry and internal component design of the probe contact assembly can allow for a large percentage of compliance in the probe contact assembly due to additional mechanical tolerances in the test system, which is important for testing BGA packages or when testing multiple DUTs at once.

[0010] The probe contact assembly disclosed herein can have components trapped within the spring volume, which ensures that the sliding interfaces (e.g., between the sides of the receiver and the inner shaft of the upper plunger) are always in contact with each other. The cooperation of these components can ensure reliable electrical contact of the plunger, and the receiver can contact the inner wire surface of the spring, which may be desirable as a redundant contact element in the system and can minimize the possibility of RF resonance that may be induced at undesirable frequencies.

[0011] A compliant probe contact assembly for a test system for testing integrated circuit devices is also disclosed. The contact assembly includes an upper plunger and a retainer, the upper plunger including a first shoulder separating an upper shaft from a lower shaft, the retainer being proximate to an end of the lower shaft. The contact assembly also includes a first receiver and a second receiver, the first receiver and the second receiver being configured to engage with the upper plunger, each of the first receiver and the second receiver including a second shoulder having a shoulder stop. The contact assembly also includes a biasing member. When the contact assembly is assembled, the biasing member is captured between the bottom of the first shoulder and the shoulder stop of the first receiver and the shoulder stop of the second receiver. The upper plunger separates the side of the upper portion of the first receiver from the side of the upper portion of the second receiver. The side of the lower portion of the first receiver and the side of the lower portion of the second receiver contact each other.

[0012] A test system for testing integrated circuit devices is also disclosed. The test system includes a device under test (DUT), a load board, and a compliant probe contact assembly. The contact assembly includes an upper plunger and a retainer. The upper plunger includes a first shoulder that separates an upper shaft from a lower shaft, and the retainer is proximate to the end of the lower shaft. The contact assembly also includes a first receiver and a second receiver, each of which is configured to engage with the upper plunger. Each of the first and second receivers includes a second shoulder with a shoulder stop. The contact assembly also includes a biasing member. When the contact assembly is assembled, the biasing member is captured between the bottom of the first shoulder and the shoulder stop of the first and second receivers. The upper plunger separates the side of the upper portion of the first receiver from the side of the upper portion of the second receiver. The side of the lower portion of the first receiver and the side of the lower portion of the second receiver contact each other. The upper plunger includes a DUT interface configured to engage with the DUT. The ends of the first and second receivers are configured to engage with the load board.

[0013] A compliant probe contact assembly for a test system for testing integrated circuit devices is also disclosed. The contact assembly includes a plunger including a retainer near the end of a lower shaft; and a first receiver plate and a second receiver plate having a top and a bottom, each receiver plate having a longitudinal aperture sized to receive only a portion of the retainer, the aperture being insufficiently wide to allow the retainer to pass therethrough. The contact assembly also includes a biasing member. The first receiver plate and the second receiver plate are aligned relative to each other so that the first receiver plate and the second receiver plate gradually move closer to each other at the bottom relative to the top. When the contact assembly is assembled, the biasing member surrounds at least a portion of the plunger and receives the first receiver plate and the second receiver plate, thereby maintaining physical and electrical contact between the first receiver plate and the second receiver plate and the retainer as the plunger moves along the apertures of the first receiver plate and the apertures of the second receiver plate. BRIEF DESCRIPTION OF THE DRAWINGS

[0014] Reference is made to the accompanying drawings which form a part of this disclosure and which illustrate embodiments in which the systems and methods described in this specification may be practiced.

[0015] Figure 1A is a perspective view of a portion of a test system for receiving a DUT for testing according to an embodiment.

[0016] Figure 1B is a bottom perspective view of a DUT according to an embodiment.

[0017] Figure 1C is a side view of a portion of a test system for receiving a DUT according to an embodiment.

[0018] Figure 1D According to an embodiment Figure 1C Side view of the test system where the DUT is electrically engaged.

[0019] Figure 2A is a side view of an upper plunger of a probe contact assembly for a test system according to one embodiment.

[0020] Figure 2B According to an embodiment Figure 2A Perspective view of the upper plunger.

[0021] Figure 3A is a front view of a receiver of a probe contact assembly for a test system according to one embodiment.

[0022] Figure 3B According to an embodiment Figure 3A A perspective view of the receiver.

[0023] Figure 4A is a side view of a spring for a probe contact assembly of a test system according to one embodiment.

[0024] Figure 4B According to an embodiment Figure 4A Perspective view of a spring.

[0025] Figure 5A is a front view of a probe contact assembly for a test system according to one embodiment.

[0026] Figure 5B According to an embodiment Figure 5A Side view of the probe contact assembly.

[0027] Figure 5C According to an embodiment Figure 5A A perspective view of the probe contact assembly.

[0028] Figure 5D According to an embodiment Figure 5A A top view of the probe contact assembly.

[0029] Figure 5E According to an embodiment Figure 5A Bottom view of the probe contact assembly.

[0030] Figure 6A is a front view of a probe contact assembly (in a compressed state) for a test system according to another embodiment.

[0031] Figure 6B According to another embodiment Figure 6A Side view of the probe contact assembly.

[0032] Figure 6CAccording to another embodiment Figure 6A A perspective view of the probe contact assembly.

[0033] Figure 6D According to another embodiment Figure 6A A top view of the probe contact assembly.

[0034] Figure 6E According to another embodiment Figure 6A Bottom view of the probe contact assembly.

[0035] Figure 7A FIG. 1 is a top view of a probe contact assembly for a test system according to an embodiment.

[0036] Figure 7B According to an embodiment Figure 7A Front view of the probe contact assembly.

[0037] Figure 7C According to an embodiment Figure 7A Cross-sectional view of the probe contact assembly along line AA.

[0038] Figure 7D According to an embodiment Figure 7A Cross-sectional view of the probe contact assembly along line BB.

[0039] Figure 8A is a top view of a probe contact assembly (in a compressed state) for a test system according to another embodiment.

[0040] Figure 8B According to another embodiment Figure 8A Front view of the probe contact assembly.

[0041] Figure 8C According to another embodiment Figure 8A Cross-sectional view of the probe contact assembly along line CC.

[0042] Figure 8D According to another embodiment Figure 8A Cross-sectional view of the probe contact assembly along line DD.

[0043] Figure 9A is a front view of a probe contact assembly for a test system according to one embodiment.

[0044] Figure 9B According to an embodiment Figure 9A Cross-sectional view of the probe contact assembly along line EE.

[0045] Figure 10A is a cross-sectional perspective view of a plurality of probe contact assemblies housed in a receptacle housing according to one embodiment.

[0046] Figure 10B According to an embodiment Figure 10A FIG. 1 is an enlarged view of a portion F1 of FIG. 2 , showing a probe contact assembly housed in a contact cavity of a socket housing.

[0047] Figure 11A is a cross-sectional perspective view of a plurality of probe contact assemblies (in a compressed state) housed in a receptacle housing according to another embodiment.

[0048] Figure 11B According to another embodiment Figure 11A FIG. 1 is an enlarged view of portion F2 of FIG. 2 , showing the probe contact assembly housed in the contact cavity of the socket housing.

[0049] Figure 12A is a front view of a receiver (in a flat state during manufacture) of a probe contact assembly for a test system according to another embodiment.

[0050] Figure 12B According to another embodiment Figure 12A A perspective view of the receiver in a folded state.

[0051] Figure 13A is a perspective view of a probe contact assembly according to one embodiment.

[0052] Figure 13B is a perspective view of a probe contact assembly in a compressed state according to another embodiment.

[0053] Figure 14A FIG. 1 is a front view of a receiver (in a flat state during manufacture) of a probe contact assembly for a test system according to yet another embodiment.

[0054] Figure 14B According to yet another embodiment Figure 14A A perspective view of the receiver in a folded state.

[0055] Figure 15A is a perspective view of a probe contact assembly according to one embodiment.

[0056] Figure 15B is a perspective view of a probe contact assembly in a compressed state according to another embodiment.

[0057] Figure 16A is a front view of a receiver of a probe contact assembly for a test system according to yet another embodiment.

[0058] Figure 16B According to yet another embodiment Figure 16A A perspective view of the receiver.

[0059] Figure 17A is a front view of a probe contact assembly according to one embodiment.

[0060] Figure 17B According to an embodiment Figure 17A Side view of the probe contact assembly.

[0061] Figure 17C According to an embodiment Figure 17A A perspective view of the probe contact assembly.

[0062] Figure 17D is a front view of a probe contact assembly in a compressed state according to another embodiment.

[0063] Figure 17E According to another embodiment Figure 17D Side view of the probe contact assembly.

[0064] Figure 17F According to another embodiment Figure 17D A perspective view of the probe contact assembly.

[0065] Like reference numerals refer to like parts throughout. DETAILED DESCRIPTION

[0066] A test contactor (i.e., a portion of a test assembly including an alignment plate, a socket, etc.) can typically provide an electrical connection to a DUT, including, for example, S&P terminals, by forming a metal-to-metal contact with a printed circuit board (e.g., a load board, including, for example, S&P terminals of the load board). A compliant contact assembly offers advantages in testing by accommodating DUT package variations. It should be understood that the term "compliance" can refer to the property of a material to undergo elastic deformation or volume change when subjected to an applied force. Compliance can be equal to the inverse of stiffness.

[0067] The terminals of the DUT can be temporarily electrically connected to corresponding contact pads on the load board through a series of conductive contacts. The terminals can be pads, balls, wires (leads), or other contact points. Each terminal is connected to a contact, which is electrically connected to a corresponding contact pad on the load board.

[0068] Embodiments disclosed herein provide a spring-loaded probe contact assembly with high performance (e.g., high RF performance, etc.), low inductance, and low cost. The height of the contact assembly can be scalable. In one embodiment, the height of the contact assembly can be at or about one millimeter, and the diameter of the contact assembly or spring can be from at or about 100 microns to at or about 250 microns.

[0069] Figure 1Ais a perspective view of a portion of a test system 100 for housing a DUT 110 for testing according to an embodiment.

[0070] Test system 100 includes a test assembly 120 for a device under test (DUT) (e.g., a microcircuit, etc.) 110. Test assembly 120 includes a load board 170 that supports an alignment board 160 having an opening or aperture 130 that precisely defines the X and Y positioning of DUT 110 within test assembly 120 (see coordinate designators X and Y, where coordinate X is perpendicular to coordinate Y and coordinate Z is perpendicular to the plane of X and Y). If DUT 110 has orientation features, it is common practice to include cooperating features in aperture 130. Load board 170 carries connection pads on its surface that are connected to a cable 180 via signal and power (S&P) conductors. Cable 180 connects to electronics that perform electrical testing of DUT 110. Cable 180 can be very short, or even internal to test assembly 120, if the test electronics are integrated with test assembly 120, or can be longer if the test electronics are on a separate chassis. It should be understood that the cable 180 may be optional. In another embodiment, the load board may be connected to the test electronics by any other suitable mechanism, including but not limited to, for example, spring-loaded probes.

[0071] The test contact array 140 having a plurality of individual test contact elements accurately mirrors the S&P terminals carried on the surface of the DUT 110 (see Figure 1B 112 in). When the DUT 110 is inserted into the aperture 130, the S&P terminals of the DUT 110 are precisely aligned with the test contact array 140. The test assembly 120 is designed to be compatible with the test contact array 140 included in the device. The test contact array 140 is carried on the socket 150. The individual test contacts in the array 140 are preferably formed on and in the socket 150 using well-known photolithography and laser machining processes. The socket 50 has alignment features, such as holes or edge patterns located in the area between the alignment plate 160 and the load plate 170, which provide for precise alignment of the socket 150 with corresponding protruding features on the alignment plate 160. All of the test contacts 140 are precisely aligned with the socket 150 alignment features. In this way, the test contacts in the array 140 are placed in precise alignment with the aperture 130.

[0072] Figure 1B FIG. 1 is a bottom perspective view of a DUT 110 according to one embodiment. The DUT (e.g., microcircuit, etc.) 110 includes a top major surface (not shown) and a Z (see FIG. Figure 1AThe DUT 110 includes a bottom major surface 114 that is opposite the top major surface in the coordinate indicators (X, Y, and Z) directions. In one embodiment, the DUT 110 may have a BGA package. In some embodiments, the DUT 110 may have a flat no-lead package, such as a quad flat no-lead (QFN) and a dual flat no-lead (DFN). Flat no-lead, also known as micro lead frame (MLF) and SON (small outline no-lead), is a surface mount technology and one of several packaging technologies used to connect the DUT 110 to a surface such as a socket 150 or other printed circuit board (PCB) without through-holes. In one embodiment, the flat no-lead can be a near-chip-scale plastic package made with a planar copper leadframe substrate. Peripheral lands on the bottom of the package (e.g., terminals 112) provide electrical connection to the socket 150 or PCB. The flat no-lead package may include exposed thermal pads to improve heat transfer away from the DUT 110 (e.g., to the PCB). The QFN package can be similar to a quad flat package (QFP). In one embodiment, the DUT 110 may be a wafer level chip scale package (WL-CSP), a leaded package (eg, a thin small outline package (TSOP) or a diode outline (DO) package), or the like.

[0073] Figure 1C is a side view of a portion of a test system 100 for receiving a DUT 110 according to an embodiment. Figure 1D According to an embodiment Figure 1C 1 is a side view of the test system 100, wherein the DUT 110 is electrically engaged.

[0074] like Figure 1C As shown, DUT 110 is placed onto test assembly 120, electrical testing is performed, and then DUT 110 is removed from test assembly 120. Any electrical connections are made by pressing components into electrical contact with other components; no soldering or desoldering occurs at any point during the testing of DUT 110. The entire electrical testing process may only last a fraction of a second, making fast, accurate placement of DUT 110 important to ensuring efficient use of test system 100. High throughput of test assembly 120 often requires automated handling of DUT 110. In most cases, an automated robotic system places DUT 110 onto test assembly 120 prior to testing and removes DUT 110 once testing is complete. The handling and placement mechanism may use mechanical and optical sensors to monitor the position of DUT 110 and a combination of translational and rotational actuators to align and place DUT 110 on or in test assembly 120. Alternatively, the DUT 110 may be placed by hand, or by a combination of manual feeding and automated equipment.

[0075] DUT 110 typically includes signal and power terminals 112 connected to a socket 150 or other PCB (see also Figure 1B Terminals 112). The terminals can be on one side of the DUT 100, or can be on both sides of the DUT 110. In order to be used in the test assembly 120, all terminals 112 should be accessible from one side of the DUT 110, although it is understood that there may be one or more components on the opposite side of the DUT 110, or other components and / or terminals on the opposite side that may not be tested by approaching the terminals 112. Each terminal 112 is formed as a small solder pad on the button side of the DUT 110 or may be formed as a lead (e.g., hemispherical) protruding from the body of the DUT 110. Before testing, the pads or leads 112 are attached to electrical leads that are internally connected to other leads, other electrical components, and / or one or more chips in the DUT. The volume and size of the pads or leads can be very precisely controlled, and there are usually not too many difficulties caused by size variations or placement variations from pad to pad or lead to lead. During testing, the terminals 112 remain solid and there is no melting or reflow of the solder.

[0076] The terminals 112 can be arranged on the surface of the DUT 110 in any suitable pattern. In some cases, the terminals 112 can be a generally square grid, which is the origin of the expression DUT 110, BGA, WL-CSP, QFN, DFN, TSOP, or DO to describe leaded components. Deviations from a rectangular grid are also possible, including irregular spacing and geometries. It will be understood that the specific location of the terminals can be changed as needed, with the corresponding locations of the pads on the load board 170 and the contacts on the socket 150 or housing being selected to match the locations of the terminals 112. Typically, the spacing between adjacent terminals 112 is in the range of 0.25 mm to 1.5 mm, where this spacing is generally referred to as the "pitch". When viewed from the side, as Figure 1C As shown, the DUT 110 displays a row of terminals 112, which may optionally include gaps and irregular spacing. These terminals 112 are made generally flat, or as flat as possible using typical manufacturing processes. In many cases, if a chip or other component is present on the DUT 110, the protrusion of the chip is typically less than the protrusion of the terminals 112 away from the DUT 110.

[0077] Figure 1CThe test assembly 120 includes a load board 170 (PCB board). The load board 170 includes a load board substrate 174 and circuitry for electrically testing the DUT 110. Such circuitry may include drive electronics capable of generating one or more AC voltages having one or more specific frequencies, and detection electronics capable of sensing the response of the DUT 110 to such drive voltages. Sensing may include detecting current and / or voltage at one or more frequencies. Typically, it is highly desirable that features on the load board 170 are aligned with corresponding features on the DUT 110 when mounted. Typically, both the DUT 110 and the load board 170 are mechanically aligned with one or more locating features on the test assembly 120. The load board 170 may include one or more mechanical locating features, such as fiducials or precisely located holes and / or edges, which ensure that the load board 170 can be precisely placed on the test assembly 120. These locating features typically ensure lateral alignment (X, Y, see Figure 1A ), and / or longitudinal alignment (Z, see Figure 1A ).

[0078] Typically, the load board 170 can be a relatively complex and expensive component. The housing / test assembly 120 performs many functions, including protecting the contact pads 172 of the load board 170 from wear and damage. Such an additional component can be a plug-in socket 150. The socket 150 is also mechanically aligned with the load board 170 by suitable locating features (not shown) and is positioned in the test assembly 120 above the load board 170, facing the DUT 110. The socket 150 includes a series of conductive contacts 152 extending longitudinally outward on either side of the socket 150. Each contact 152 can include a resilient element, such as a spring, elastomer, or other suitable material, and is capable of conducting current from the DUT 110 to the load board 170 / from the load board to the DUT 110 with sufficiently low resistance or impedance. Each contact 152 can be a single conductive element, or alternatively can be formed as a combination of conductive elements. Each contact 152 connects one contact pad 172 on the load board 170 to one terminal 112 on the DUT 110, although there may be test scenarios in which one or more contact pads 172 are connected to a single terminal 112, or multiple terminals 112 are connected to a single contact pad 172. In the text and figures, we assume that a single contact 152 connects a single pad 172 to a single terminal 112, although it is understood that any tester element disclosed herein may be used to connect one or more contact pads 172 to a single terminal 112, or one or more terminals 112 to a single contact pad 172. Note that this contact forms an electrical connection 154 between the terminal 112 and the contact pad 172.

[0079] Typically, the socket 150 electrically connects the load board pads 172 to the bottom contact surface of the DUT 110. While the socket 150 can be removed and replaced relatively easily compared to removing and replacing the load board 170, for this article, the socket 150 is considered to be part of the test assembly 120. During operation, the test assembly 120 includes the load board 170, the socket 150, and the mechanical structure (not shown) that mounts and holds them in place. Each DUT 110 is placed against the test assembly 120, electrically tested, and removed from the test assembly 120. A single socket 150 can test many DUTs 110 before it wears out, and can typically last for thousands or more tests before needing replacement. Generally speaking, it is desirable that socket 150 replacement be relatively quick and simple, so that the test assembly 120 only experiences a small amount of downtime for socket replacement. In some cases, the speed of socket 150 replacement may even be more important than the actual cost of each socket 150, with the increase in tester operating time resulting in a modest cost savings during operation.

[0080] Figure 1C The relationship between the test assembly 120 and the DUT 110 is shown. As each DUT 110 is tested, it is placed into an appropriate robotic handler with sufficiently precise placement features so that specific terminals 112 on the DUT 110 can be accurately and reliably placed relative to corresponding contacts 152 on the socket 150 and corresponding contact pads 172 on the load board 170 (see FIG. 1 ). Figure 1A ). A robotic handler (not shown) forces each DUT 110 into contact with the test assembly 120. The magnitude of the force depends on the exact configuration of the test, including the number of terminals 112 being tested, the force applied to each terminal, typical manufacturing and alignment tolerances, etc. Typically, the force is applied by a mechanical manipulator (not shown) of the tester, acting on the DUT 110. Typically, the force is generally longitudinal and generally normal to the load plate 170.

[0081] Figure 1D The test assembly 120 and the DUT 110 are shown in contact, with sufficient force being applied to the DUT 110 to engage the contacts 152 and form an electrical connection 154 between each terminal 112 and its corresponding contact pad 172 on the load board 170 .

[0082] Figure 2A FIG. 2 is a side view of an upper plunger 200 of a probe contact assembly for a test system according to one embodiment. Figure 2B According to an embodiment Figure 2A It will be appreciated that the probe contact assembly (e.g., Figure 1C and 1DThe contact member 152) can be a compliant spring loaded probe contact assembly.

[0083] In the Examples (see, for example, Figures 5A to 5C ), the probe contact assembly includes an upper plunger 200 (DUT plunger), a biasing member 400 (illustrated as a compliant compression spring) and a pair of receivers 300 (also referred to as lower plungers, PCB plungers, or load board plungers). It should be understood that the receivers can preferably be identical or matching pairs, but not necessarily so. It should also be understood that in one embodiment, the biasing member 400 can be a spring or other object other than a spring, which can provide the required elasticity. The top of the upper plunger 200 is configured to engage with the signal and power (S&P) terminals of the DUT. It should be understood that the S&P terminals of the DUT can be pins, pads, leads, balls, wires, etc. In one embodiment, the top of the upper plunger 200 is configured to engage with the solder balls of a ball grid array (BGA) package. The bottom or multiple bottoms of the receiver 300 are configured to engage with the signal and power (S&P) terminals of the PCB (i.e., load board). It should be understood that the S&P terminals of the PCB can be pins, pads, leads, wires, etc. In one embodiment, the bottom of the receiver 300 is configured to engage pads on the PCB that make electrical contact with the test equipment. It should be understood that the receiver 300 can be two separate identical components or a single, integral component.

[0084] Back to Figure 2A and 2B In one embodiment, the upper plunger 200 includes a DUT interface 210 (the top of the upper plunger 200), a DUT side shaft 220, a shoulder 230, an inner shaft 240, and a retainer 250. In one embodiment, the retainer 250 includes an end 260.

[0085] In one embodiment, the DUT interface 210 may be a crown-shaped interface configured to engage with a BGA ball (S&P terminal of the DUT). In other embodiments, the shape of the DUT interface 210 may be conical, pointed, round, flat, etc., depending on the interface type of the DUT terminal.

[0086] In one embodiment, the DUT side shaft 220 may have a cylindrical shape or other suitable shape. The diameter of the shoulder 230 is larger than the diameter of the DUT side shaft 220. The shoulder 230 may be configured to stop the upper plunger 200 in the socket housing (see Figures 10A to 11B Detailed description in ) in the height direction of the probe contact assembly (vertical direction or Z direction, see Figure 1A) so that the probe contact assembly can be retained in the socket housing. In one embodiment, the shoulder 230 extends from the DUT-side shaft 220, wherein the size / diameter of the shoulder 230 gradually increases and then gradually decreases toward the inner shaft 240. In one embodiment, the maximum width or diameter of the shoulder 230 can be the same as or close to the outer diameter of the spring 400, or between the outer diameter of the spring 400 and the inner diameter of the spring 400.

[0087] In one embodiment, the inner shaft 240 can be configured as a contact interface to a mating receiver (e.g., a planar receiver) 300, which can slide along the length of the inner shaft 240 and form an electrical contact. The diameter of the inner shaft 240 is smaller than the diameter of the shoulder 230 (and the diameter of the DUT side shaft 220). In one embodiment, the inner shaft 240 can have a cylindrical shape or other suitable shape.

[0088] The holder 250 is configured to hold the probe contact assembly together. In one embodiment, the holder 250 may have a knob shape or other suitable shape that may be partially received in the aperture 320 of the receiver 300 (see FIG. Figure 3A and 3B ). The end 260 of the retainer 250 may have a tapered chamfered end that facilitates assembly of the probe contact assembly. In one embodiment, the retainer 250 extends from the inner shaft 240, wherein the size / diameter of the retainer 250 gradually increases and then gradually decreases toward the conical chamfered end 260. It should be understood that the diameter of the retainer 250 can be larger than the width of the orifice 300 to prevent the retainer 250 from passing through. A portion of the conical end 260 can be sized to be partially accommodated within the orifice 320 so that when the upper plunger is pushed (for example, by the DUT), the conical end 260 can slide along the orifice. This sliding preferably occurs within the inner circumferential surface of the orifice 320. The end 260 does not have to be conical, but can be any shape that further a) partially passes through the orifice 320 and b) slides along the inner surface with minimal friction, but with complete electrical integrity and / or contact. The angle between the receiver 300 and the end 260 can further achieve this purpose.

[0089] Back to Figure 2A and 2BIn one embodiment, the diameter of the shoulder 230 can be 80% or approximately 80% of the minimum DUT spacing. The minimum DUT spacing can refer to the center-to-center spacing between the closest adjacent S&P terminals of the DUT. The minimum DUT spacing can be 300 microns or approximately 300 microns. The gap between the closest adjacent S&P terminals of the DUT can be 30 microns or approximately 30 microns. The diameter of the inner shaft 240 can be 50% or approximately 50% of the diameter of the shoulder 230. The diameter of the retainer can be 20% or approximately 20% larger than the diameter of the inner shaft 240. When the spring 400 is fully compressed, the length of the inner shaft 240 can be 10% or approximately 10% longer than the length of the spring 400 (see Figure 4A and 4B ).

[0090] In one embodiment, the upper plunger 200 can be CNC-machined on an automatic lathe. The upper plunger 200 can be plated or fabricated from a solid metal or alloy material, such as a homogeneous alloy including a copper alloy, a palladium alloy, or the like. In one embodiment, the upper plunger 200 can be formed from a flat metal element. In one embodiment, the upper plunger 200 can be plated with gold or other conductive materials. In one embodiment, the height of the upper plunger 200 can be between 500 microns or approximately 500 microns and 600 microns or approximately 600 microns.

[0091] Figure 3A FIG. 1 is a front view of a receiver 300 of a probe contact assembly for a test system according to an embodiment. Figure 3B According to an embodiment Figure 3A A perspective view of the receiver 300 is provided.

[0092] It should be understood that Figure 3A and 3B One of a pair of receivers 300 is shown. In one embodiment, two receivers 300 are used in the probe contact assembly. Receiver 300 can be manufactured as a flat component using etching, stamping, e-forming, water jet cutting, or other suitable manufacturing processes. Receiver 300 can be made of a copper alloy or other suitable metal alloy. Receiver 300 can be gold-plated to enhance lubricity and conductivity.

[0093] In one embodiment, the receiver 300 includes a top 380, an aperture 320 having an upper stop 310 and a gap 325, a body 330, two shoulders 350 (in the width direction), each having a shoulder stop 340, and a protrusion 360 having an end 370 (which decreases in width in the Z direction). In one embodiment, the aperture 320 extends vertically (the height of the receiver 300) from the upper stop 310 to a position near the bottom of the shoulders 350. The width of the bottom of the aperture 320 gradually decreases in the width direction (from one shoulder 350 to the other shoulder 350). In one embodiment, the aperture 320 can be sized to receive a portion of the retainer 250, but narrow enough to prevent the retainer 250 from passing through the aperture. The aperture 320 can have a uniform width along its length, or it can gradually widen toward the bottom to facilitate movement of the retainer 250, but still not be wide enough to allow the retainer 250 to pass through.

[0094] In one embodiment, the aperture 320 is where the retainer 250 of the upper plunger 300 slides vertically (e.g., from an uncompressed state to a compressed state of the probe contact assembly, or vice versa). In the uncompressed state, the retainer 250 of the upper plunger 200 can rest on the upper stop 310 of the aperture 320. The body 330 preferably has a tapered outer surface, and the taper can be designed so that in the assembled state of the probe contact assembly, the taper can force (the sides of) the receiver pair 300 together to form a single contact point on the PCB in a gradually narrowing gap such as a "V" shape or a substantially "V" shape (see, for example, FIG. Figures 5A to 6C ), wherein the bottom ends of the receiver pair 300 are drawn together and / or completely abut. The shoulder stop 340 can be configured to abut the end coils of the spring 400. The shoulder (or flange) 350 can be the widest portion of the receiver 300 and can be used to ensure that the probe contact assembly can be retained in the socket housing (see, for example, Figures 10A to 11B ). The end portion 370 of the protrusion 360 includes a contact surface that contacts the S&P terminal of the PCB.

[0095] In one embodiment, the thickness of the receiver 300 ( Figure 3AThe width or diameter (maximum width or diameter) of the shoulder 350 may be between the outer diameter and the inner diameter of the spring 400. The additional clearance area 325 may be configured to prevent the retainer 250 from bottoming out on the receiver 300 (e.g., in a compressed state). The upper stop 310 is configured to serve as an upper stop for the retainer 250 when the probe contact assembly is in an uncompressed state. The body 330 may taper to 10% or approximately 10% from the upper stop 310 to the lower portion of the body 330 (the length of the tapered portion is vertically indicated as "L"). That is, along the "L" direction and within the length of the "L" portion, the width of the body 330 gradually increases (tapers), and the width of the aperture 320 also increases (tapers). The width of the aperture 320 may decrease in the lower portion (below the "L") of the aperture 320 (e.g., to prevent the retainer 250 from moving downward toward the PCB). The rounded bottom surface of the end portion 370 may be configured to make good contact with a pad of a PCB.

[0096] In one embodiment, the receiver 300 may be made of beryllium copper, a copper alloy, nickel, or a nickel alloy. The receiver 300 may be etched, manufactured via metal additive manufacturing, electroforming, or the like. In one embodiment, the receiver 300 may be plated with gold, or the like. In one embodiment, the receiver 300 may have a height equal to or approximately 400 microns. It should be understood that the bottom of the receiver 300 may be flat, rounded, or the like. The receiver 300 may be manufactured at low cost using various methods (e.g., etching, electrospark machining, electroforming, stamping).

[0097] It should also be understood that the receiver 300 can be tapered internally (e.g., in the aperture 320) and externally (on the body 330) (the length of the tapered portion is shown as "L" in the vertical direction). The tapered portion can allow for easy compression without binding or catching, and can ensure that the receiver 300 gradually narrows so that, for example, a V-shape or similar shape can be maintained (e.g., from an uncompressed state to a compressed state, or vice versa). It should also be understood that the sides (in the thickness direction) of the upper portion of the receiver 300 (e.g., above or near the upper stop 310) can slide along and on the inner shaft 240 (e.g., from an uncompressed state to a compressed state, or vice versa). The sides (in the thickness direction) of the lower portion of the receiver 300 (e.g., above, near, or at the end 370) can contact each other.

[0098] Figure 4A FIG. 4 is a side view of a spring 400 for a probe contact assembly of a test system according to one embodiment. Figure 4B According to an embodiment Figure 4AIt should be understood that the biasing member 400 (a resilient member such as a spring) can perform two functions: 1) it can provide compression or resilience between the upper plunger 200 and the receiver(s) 300, and 2) it can always hold the combination of the upper plunger 200 and the receiver(s) 300 together during normal operation so that they not only do not fall apart, but also ensure electrical contact between the upper plunger 200 and the receiver(s) 300, thereby providing an electrical path between the DUT and the load board.

[0099] In one embodiment, spring 400 (having a body 410 and two ends 412, 414) is a compression spring wound from elastic wire on a precision winding machine. The spring end coils (412, 414) can be "closed," so that there can be little to no gap between the end coils (412, 414), for example to aid assembly. It should be understood that there are gaps between the spring coils of body 410. The wire material of spring 400 has a constant wire diameter. The outer diameter of spring 400 remains constant over the entire length of spring 400. The number of turns of spring 400 can vary depending on electrical and mechanical requirements. Spring 400 can be made of a metal such as a stainless steel alloy. Spring 400 can be gold-plated to enhance the electrical performance of the probe contact assembly and provide lubricity when the probe contact assembly is compressed.

[0100] It should be understood that when compressed, the resilient spring 400 can create or induce z-axis (in the height direction) compliance in the receptacle. The inner diameter, outer diameter, and wire diameter of the spring 400 are each constant. The spacing between the coils of the spring 400 can allow for compression, and when the probe contact assembly 500 is in a compressed state, the coils of the spring 400 can still have spacing (i.e., the spring 400 can remain undeformed and can last longer), except for a small to no gap at the end coils (412, 414).

[0101] Figure 5A FIG. 5 is a front view of a probe contact assembly 500 for a test system according to one embodiment. Figure 5B According to an embodiment Figure 5A 1 is a side view of the probe contact assembly 500. Figure 5C According to an embodiment Figure 5A 1 is a perspective view of a probe contact assembly 500 . Figure 5D According to an embodiment Figure 5A FIG. 5 is a top view of the probe contact assembly 500 . Figure 5E According to an embodiment Figure 5A A bottom view of the probe contact assembly 500 is shown.

[0102] Figures 5A to 5EThe probe contact assembly 500 is shown in an uncompressed state. It should be understood that the uncompressed state may refer to a state in which the probe contact assembly 500 is assembled and the spring 400 is in a free or uncompressed state. Figure 5B As shown, two receivers 300 are assembled from the bottom of the probe contact assembly 500, and the sides of the lower portions of the receivers 300 contact each other in a "V" or substantially "V" shape. The spring 400 is captured between the shoulder 230 of the upper plunger 200 and the shoulder stop 340 of the shoulder 350 of the receiver 300. The retainer 250 of the upper plunger 200 abuts against the upper stop 310 of the aperture 320 of the receiver 300. Since the body 330 of the receiver 300 (extending in the width direction from one shoulder stop 340 to the top 380 and then to the other shoulder stop 340) is constrained within the inner diameter of the spring 400, the probe contact assembly 500 can be independent and does not fall apart.

[0103] It should be understood that the retention system described above (i.e., the retainer 250 with the spring 400 holding the components of the probe contact assembly 500 together) can be more robust than prior art techniques that rely on latches. In contrast, latch geometry must be precisely manufactured to function properly, and during use of the probe or probe assembly, the latches on the components often wear, thereby losing their holding force. The retention system disclosed herein does not have the limitations of latches, and the receiver 300 can be retained on the retainer 250 within wide manufacturing tolerances, thereby reducing cost and complexity.

[0104] Figure 6A FIG. 5 is a front view of a probe contact assembly 500 (in a compressed state) for a test system according to another embodiment. Figure 6B According to another embodiment Figure 6A 1 is a side view of the probe contact assembly 500. Figure 6C According to another embodiment Figure 6A 1 is a perspective view of a probe contact assembly 500 . Figure 6D According to another embodiment Figure 6A FIG. 5 is a top view of the probe contact assembly 500 . Figure 6E According to another embodiment Figure 6A A bottom view of the probe contact assembly 500 is shown.

[0105] Figures 6A to 6E The probe contact assembly 500 is shown in a compressed state. It should be understood that the compressed state may refer to a state in which the probe contact assembly 500 is assembled and the spring 400 is in a fully compressed state. When the DUT (e.g., a semiconductor device) is pushed down onto the tip of the probe contact assembly 500 (e.g., a crown interface, etc.), the probe contact assembly 500 may be compressed. The resultant spring force can ensure a good electrical contact interface with the DUT. Figure 6B As shown, in the compressed state, the retainer 250 of the upper plunger 200 moves to the bottom of the aperture 320 of the (one or more) receivers 300, and the "V" shape of the receiver 300 is held in place. The "V" shape can provide good sliding contact between (the inner shaft of) the upper plunger and (the side of the upper portion of) the receiver 300. It should be understood that in the compressed state, due to the shape of the aperture 320 and the retainer 250, there is a gap area 325 between the retainer 250 and the bottom of the aperture 320.

[0106] It should be understood that during testing, for better RF performance, most of the current and resistance can come from the upper portion and receiver (which form the main path for the current). It should also be understood that there will be some current or minimal current through the spring.

[0107] Figure 7A FIG. 5 is a top view of a probe contact assembly 500 for a test system according to one embodiment. Figure 7B According to an embodiment Figure 7A A front view of the probe contact assembly 500 is shown. Figure 7C According to an embodiment Figure 7A A cross-sectional view of the probe contact assembly 500 along line AA. Figure 7D According to an embodiment Figure 7A A cross-sectional view of the probe contact assembly 500 along line BB. 7A to 7D The probe contact assembly 500 is shown in an uncompressed state.

[0108] Figure 8A FIG. 5 is a top view of a probe contact assembly 500 (in a compressed state) for use in a test system according to another embodiment. Figure 8B According to another embodiment Figure 8A A front view of the probe contact assembly 500 is shown. Figure 8C According to another embodiment Figure 8A A cross-sectional view of the probe contact assembly 500 along line CC. Figure 8D According to another embodiment Figure 8A A cross-sectional view of the probe contact assembly 500 along line DD. Figures 8A to 8D The probe contact assembly 500 is shown in a compressed state. In the compressed state, the entire retainer 250 or a portion of the retainer 250 extends outside the spring 400. The top of the retainer 250 is located at or near the shoulder stop 340.

[0109] Figure 9A FIG. 5 is a front view of a probe contact assembly 500 for a test system according to one embodiment. Figure 9B According to an embodiment Figure 9AA cross-sectional view of the probe contact assembly 500 along line EE. Figures 9A to 9B The probe contact assembly 500 is shown in an uncompressed state.

[0110] like Figure 9B As shown, the inner shaft 240 of the upper plunger 200 separates the receivers 300 from each other at their upper portions. The four corners of the receivers 300 (two outer corners of each receiver 300) contact the inner surface of the spring 400. The geometry of the retainer 250 and receiver 300, as well as the inner diameter of the spring 400, are configured so that if there is any outward bias (in a direction toward the exterior of the spring 400) attempting to disassemble the probe contact assembly 500, the receiver 300 can enter the spring 400 and be restrained. It should be understood that there is no press fit between the receiver 300 and the spring 400, so that the receiver 300 can slide along the length of the inner shaft 240.

[0111] Figure 10A is a cross-sectional perspective view of a plurality of probe contact assemblies 500 housed in a socket housing 600 according to one embodiment. Figure 10B yes Figure 10A FIG. 5 is an enlarged view of a portion F1 of FIG. 5 , showing the probe contact assembly 500 housed in a contact cavity (eg, a back-drilled hole, a countersink, a counterbore, etc.) of a socket housing 600 according to one embodiment. FIG. 10A to FIG. 10B The probe contact assembly 500 is shown in an uncompressed state.

[0112] Figure 11A is a cross-sectional perspective view of a plurality of probe contact assemblies 500 (in a compressed state) housed in a receptacle housing 600 according to one embodiment. Figure 11B yes Figure 11A FIG. 5 is an enlarged view of a portion F2 of FIG. 5 , showing the probe contact assembly 500 housed in a contact cavity (eg, a back-drilled hole, a countersink, a counterbore, etc.) of the receptacle housing 600 according to one embodiment. Figures 11A to 11B The probe contact assembly 500 is shown in a compressed state.

[0113] like Figures 10A to 11B As shown, the socket 150 (see Figures 1A to 1D) includes a housing 600. The housing 600 includes a housing body 650 having a plurality of cavities or holes (e.g., back-drilled holes, countersunk holes, counterbores, etc.) 680, each cavity being configured to accommodate the probe contact assembly 500. In one embodiment, the housing 600 may be made of a non-conductive material such as plastic, ceramic, etc. A thin retainer plate 640 may hold the probe contact assembly 500 in place on the bottom of the probe contact assembly 500. The retainer plate 640 may be a flat plate with simple through-holes 660 to reduce the overall complexity of the socket 150 (including the housing 600 and the probe contact assembly 500), or may be a countersunk plate. In one embodiment, the thickness of the retainer plate 640 may be 0.05 mm or approximately 0.05 mm. The retainer plate 640 may be mounted or secured to the housing body 650 using screws, tape, or other means. The cavity or hole 680 includes a first cavity (eg, countersunk hole, etc.) 630 , an upper stop 610 , and a second cavity 620 .

[0114] like FIG. 10A to FIG. 10B As shown, each probe contact assembly 500 can be positioned in the housing cavity (cavity 680) in an uncompressed or free state. The shoulder 230 abuts against the upper stop 610. The upper stop 610 is configured to prevent or inhibit the shoulder 230 from moving upward toward the DUT 110. The bottom of the shoulder 350 of the receiver 300 abuts against the retainer plate 640. The retainer plate 640 is configured to prevent or inhibit the shoulder 350 from moving downward toward the PCB (load board). The DUT interface 210 and the upper portion of the DUT side shaft 220 are positioned outside or above the cavity 630. The lower portion of the DUT side shaft 220 is housed within the cavity 630. The shoulder 230 and the spring 400 are housed within the cavity 620. The protrusion 360 and its end 370 extend through the through-hole 660 of the retainer plate 640, with a portion of the protrusion 360 and / or its end 370 located outside or below the through-hole 660. In one embodiment, the diameter of cavity 630 is smaller than the diameter of cavity 620 and smaller than the diameter of shoulder 230. The diameter of through-hole 660 is smaller than the diameter of cavity 620 and smaller than the width of shoulder 350, but larger than the width of protrusion 360 and its end 370.

[0115] When the probe contact assembly 500 is in a compressed state, the socket 150 is mounted to a PCB (not shown), and the DUT 110 (e.g., the terminal(s) 112 of the DUT 110) is compressing the probe contact assembly 500. Figures 11A to 11BAs shown, contact assembly 500 is fully compressed by DUT 110. DUT interface 210 is pushed downward to or near the top surface of housing 600. Shoulder 230 is pushed away from upper stop 610 and downward into cavity 620. Spring 400 is compressed. End 370 of protrusion 360 is located at or near the bottom surface of retainer plate 640. Shoulder 350 is pushed away from retainer plate 640 and upward into cavity 620. In one embodiment, the compressed length of the probe contact assembly is 1 mm or approximately 1 mm.

[0116] It should be understood that the shape (eg, circular shape, etc.) or diameter of the contact assembly 500 may match the shape (eg, circular shape, etc.) or diameter of the cavity of the housing 600 .

[0117] Figure 12A FIG. 1 is a front view of a receiver 301 (in a flat state during manufacture) of a probe contact assembly for a test system according to another embodiment. Figure 12B According to another embodiment Figure 12A A perspective view of the receiver 301 (in a folded state).

[0118] It should be understood that the receiver 301 can be a single, unitary piece. That is, the receiver 301 can be made of a single piece that is formed into a joined piece (e.g., joined at or near the location of the end 370 of the protrusion 360) instead of two separate receivers 300, and then folded together to form a "V" shaped assembly (see Figure 12B ). The folded receiver 301 can then be snapped onto the upper plunger 200. It should also be understood that a probe contact assembly having a single integral receiver 301 can function identically to an embodiment having two separate receivers 300.

[0119] Figure 13A is a perspective view of a probe contact assembly 501 according to one embodiment. Figure 13B 2 is a perspective view of a probe contact assembly 501 in a compressed state according to another embodiment. The probe contact assembly 501 includes an upper plunger 200, a spring 400, and a receiver 301. Figure 13A The probe contact assembly 501 is shown in an uncompressed state. Figure 13B The probe contact assembly 501 is shown in a compressed state.

[0120] Figure 14A FIG. 1 is a front view of a receiver 302 (in a flat state during manufacture) of a probe contact assembly for a test system according to yet another embodiment. Figure 14B According to yet another embodiment Figure 14A A perspective view of the receiver 302 (in a folded state).

[0121] It should be understood that the receiver 302 can be a single, integral piece. That is, the receiver 302 can be made of a single component that is made into a joined piece (e.g., joined at or near the side of the shoulder 350) instead of two separate receivers 300, and then folded sideways to form a "V"-shaped assembly. The folded receiver 302 can then be snapped onto the upper plunger 200. It should also be understood that a probe contact assembly having a single, integral receiver 302 can function identically to an embodiment having two separate receivers 300.

[0122] Figure 15A is a perspective view of a probe contact assembly 502 according to one embodiment. Figure 15B 4 is a perspective view of a probe contact assembly 502 in a compressed state according to another embodiment. The probe contact assembly 502 includes an upper plunger 200, a spring 400, and a receiver 302. Figure 15A The probe contact assembly 502 is shown in an uncompressed state. Figure 15B The probe contact assembly 502 is shown in a compressed state.

[0123] Figure 16A FIG. 3 is a front view of a receiver 303 of a probe contact assembly for a test system according to yet another embodiment. Figure 16B According to yet another embodiment Figure 16A Receiver 303 is identical to receiver 300 except that receiver 303 includes a gap 390 at top 380 to allow for the manufacturing process. Gap 390 extends from orifice 320 to the outer top surface of plunger 303.

[0124] Figure 17A FIG. 5 is a front view of a probe contact assembly 503 according to one embodiment. Figure 17B According to an embodiment Figure 17A 5. A side view of the probe contact assembly 503 is shown. Figure 17C According to an embodiment Figure 17A A perspective view of the probe contact assembly 503 is shown. Figure 17D is a front view of a probe contact assembly 503 in a compressed state according to another embodiment. Figure 17E According to another embodiment Figure 17D 5. A side view of the probe contact assembly 503 is shown. Figure 17F According to another embodiment Figure 17D 4. A perspective view of a probe contact assembly 503. The probe contact assembly 503 includes an upper plunger 200, a spring 400, and a pair of receivers 303.

[0125] The description of the present invention and its application set forth herein are illustrative and are not intended to limit the scope of the invention. Variations and modifications of the embodiments disclosed herein are possible, and those of ordinary skill in the art will understand actual alternatives and equivalents of the various components of the embodiments after studying this patent document. These and other variations and modifications may be made to the embodiments disclosed herein without departing from the scope and spirit of the invention.

[0126] aspect

[0127] Note that any of the following aspects can be combined with each other.

[0128] Aspect 1. A compliant probe contact assembly for a test system for testing integrated circuit devices, the contact assembly comprising: an upper plunger, the upper plunger comprising a first shoulder separating an upper shaft from a lower shaft and a retainer adjacent to an end of the lower shaft; a first receiver and a second receiver, the first receiver and the second receiver being configured to engage with the upper plunger, each of the first receiver and the second receiver comprising a second shoulder having a shoulder stop; and a biasing member, wherein when the contact assembly is assembled, the biasing member is captured between the bottom of the first shoulder and the shoulder stops of the first receiver and the second receiver, the upper plunger separating the side of the upper portion of the first receiver and the side of the upper portion of the second receiver, and the side of the lower portion of the first receiver and the side of the lower portion of the second receiver contacting each other.

[0129] Aspect 2. The contact assembly of aspect 1, wherein the retainer, the lower shaft, and the upper portions of the first and second receivers are constrained into an interior space of the biasing member.

[0130] Aspect 3. The contact assembly of aspect 1 or aspect 2, wherein the first receiver and the second receiver form a generally V-shape when the contact assembly is assembled.

[0131] Aspect 4. A contact assembly according to any one of Aspects 1 to 3, wherein, when the contact assembly is assembled, the contact assembly has an uncompressed state and a compressed state, and when the contact assembly is in the uncompressed state, the retainer abuts against the upper stop of the orifice of the first receiver and the upper stop of the orifice of the second receiver.

[0132] Aspect 5. A contact assembly according to Aspect 4, wherein, when the contact assembly is in the compressed state, the retainer is close to the bottom of the orifice of the first receiver and the bottom of the orifice of the second receiver, and a gap area is formed between the retainer and the bottom of the orifice.

[0133] Aspect 6. The contact assembly according to any one of aspects 1 to 5, wherein the first receiver and the second receiver are separate components.

[0134] Aspect 7. The contact assembly according to any one of aspects 1 to 6, wherein the first receiver and the second receiver are joined together and form a single integral component.

[0135] Aspect 8. The contact assembly according to aspect 7, wherein the first receiver and the second receiver are joined at a bottom end of the first receiver and a bottom end of the second receiver.

[0136] Aspect 9. The contact assembly of aspect 7, wherein the first receiver and the second receiver are joined at a second shoulder of the first receiver and a second shoulder of the second receiver.

[0137] Aspect 10. The contact assembly of any one of aspects 1 to 9, wherein each of the first receptacle and the second receptacle includes a gap at a top of the first receptacle and a top of the second receptacle.

[0138] Aspect 11. A test system for testing an integrated circuit device, the test system comprising: a device under test (DUT); a load board; and a compliant probe contact assembly, the compliant probe contact assembly comprising: an upper plunger, the upper plunger comprising a first shoulder separating an upper shaft from a lower shaft; and a retainer adjacent an end of the lower shaft; a first receiver and a second receiver, the first receiver and the second receiver being configured to engage with the upper plunger, each of the first receiver and the second receiver comprising a second shoulder having a shoulder stop; and a biasing member, wherein when the When contacting the assembly, the biasing member is captured between the bottom of the first shoulder and the shoulder stops of the first receiver and the second receiver, the upper plunger separates the side of the upper portion of the first receiver and the side of the upper portion of the second receiver, and the side of the lower portion of the first receiver and the side of the lower portion of the second receiver contact each other, wherein the upper plunger includes a DUT interface, the DUT interface is configured to engage with the DUT, and the end of the first receiver and the end of the second receiver are configured to engage with the load board.

[0139] Aspect 12. The test system according to aspect 11, wherein the DUT is a device having a ball grid array package.

[0140] Aspect 13. The testing system according to aspect 11 or aspect 12, further comprising: a housing configured to accommodate the contact assembly.

[0141] Aspect 14. The test system according to Aspect 13, further comprising: a socket comprising the housing and the contact assembly, wherein the socket is configured to provide a path from the input and output of the DUT to the input and output of the load board, respectively.

[0142] Aspect 15. A testing system according to Aspect 13, wherein the housing includes a hole configured to accommodate the contact assembly, the hole including an upper stop between a first cavity and a second cavity, the diameter of the second cavity being larger than the diameter of the first cavity.

[0143] Aspect 16. The testing system of aspect 15, wherein the upper stop of the hole is configured to prevent the first shoulder from moving upward toward the DUT.

[0144] Aspect 17. The testing system according to aspect 15, further comprising: a holder plate disposed at the bottom of the housing.

[0145] Aspect 18. The testing system of aspect 17, wherein the holder plate includes a through hole configured to allow the bottom end of the first receiver and the bottom end of the second receiver to pass therethrough.

[0146] Aspect 19. The testing system according to aspect 18, wherein a diameter of the through hole is smaller than a diameter of the second cavity of the housing.

[0147] Aspect 20. A compliant probe contact assembly for a test system for testing integrated circuit devices, the contact assembly comprising: a plunger, the plunger including a retainer adjacent the end of a lower shaft; a first receiver plate and a second receiver plate having a top and a bottom, each receiver plate having a longitudinal aperture, the longitudinal aperture being sized to receive only a portion of the retainer, the aperture being not wide enough to allow the retainer to pass therethrough; and a biasing member, wherein the first receiver plate and the second receiver plate are aligned relative to each other so that the first receiver plate and the second receiver plate are gradually closer to each other at the bottom relative to the top; wherein, when the contact assembly is assembled, the biasing member surrounds at least a portion of the plunger and receives the first receiver plate and the second receiver plate, thereby maintaining the first receiver plate and the second receiver plate and the retainer in physical and electrical contact when the plunger moves along the aperture of the first receiver plate and the aperture of the second receiver plate.

[0148] The terms used in this specification are intended to describe particular embodiments and are not intended to be limiting. The terms "a," "an," and "the" also include plural forms unless otherwise clearly indicated. When used in this specification, the terms "include" and / or "comprise" specify the presence of stated features, integers, steps, operations, elements, and / or components, but do not preclude the presence or addition of one or more other features, integers, steps, operations, elements, and / or components.

[0149] With respect to the foregoing description, it should be understood that changes may be made in detail, especially in the construction materials employed and the shapes, sizes and arrangements of parts without departing from the scope of the present disclosure. This specification and the described embodiments are exemplary only, with the true scope and spirit of the present disclosure being indicated by the appended claims.

Claims

1. A compliant probe contact assembly for a test system for testing an integrated circuit device, wherein: The contact assembly comprises: an upper plunger including a first shoulder separating an upper shaft from a lower shaft and a retainer adjacent an end of the lower shaft; first and second receivers configured to engage the upper plunger, each of the first and second receivers including a second shoulder having a shoulder stop; and biasing member, wherein, when the contact assembly is assembled, the biasing member is captured between the bottom of the first shoulder and the shoulder stop of the first receiver and the shoulder stop of the second receiver, the upper plunger separates the side of the upper portion of the first receiver and the side of the upper portion of the second receiver, and the side of the lower portion of the first receiver and the side of the lower portion of the second receiver contact each other.

2. The contact assembly according to claim 1, wherein The retainer, the lower shaft, and the upper portions of the first and second receivers are constrained into the interior space of the biasing member.

3. The contact assembly according to claim 1, wherein When the contact assembly is assembled, the first receiver and the second receiver form a gradually narrowing gap. The contact assembly according to claim 1 , wherein: When the contact assembly is assembled, the contact assembly has an uncompressed state and a compressed state, When the contact assembly is in the uncompressed state, the retainer abuts an upper stop of the aperture of the first receiver and an upper stop of the aperture of the second receiver.

5. The contact assembly according to claim 4, wherein When the contact assembly is in a compressed state, the retainer is proximate to a bottom of the aperture of the first receiver and a bottom of the aperture of the second receiver, and a void area is formed between the retainer and the bottom of the aperture. The contact assembly according to claim 1 , wherein: The first receiver and the second receiver are separate components.

7. The contact assembly according to claim 1, wherein The first receiver and the second receiver are joined together and form a single integral component.

8. The contact assembly according to claim 7, wherein The first receiver and the second receiver are combined at bottom ends of the first receiver and the second receiver.

9. The contact assembly according to claim 7, wherein: The first receiver and the second receiver are joined at a second shoulder of the first receiver and a second shoulder of the second receiver.

10. The contact assembly according to claim 1, wherein The first receiver includes a gap at a top of the first receiver, and the second receiver includes a gap at a top of the second receiver.

11. A test system for testing an integrated circuit device, wherein: The test system comprises: Device under test (DUT); load board; and A compliant probe contact assembly, the compliant probe contact assembly comprising: an upper plunger including a first shoulder separating an upper shaft from a lower shaft and a retainer adjacent an end of the lower shaft; first and second receivers configured to engage the upper plunger, each of the first and second receivers including a second shoulder having a shoulder stop; and biasing member, wherein, when the contact assembly is assembled, the biasing member is captured between the bottom of the first shoulder and the shoulder stops of the first receiver and the second receiver, the upper plunger separates the sides of the upper portion of the first receiver and the upper portion of the second receiver, and the sides of the lower portion of the first receiver and the lower portion of the second receiver contact each other, The upper plunger includes a DUT interface configured to engage with the DUT, and the end of the first receiver and the end of the second receiver are configured to engage with the load board.

12. The test system according to claim 11, wherein: The DUT is a device having a ball grid array package.

13. The test system according to claim 11, further comprising: A housing is configured to accommodate the contact assembly.

14. The test system according to claim 13, further comprising: A socket comprising the housing and the contact assembly, The socket is configured to provide paths from an input and an output of the DUT to an input and an output of the load board, respectively.

15. The test system according to claim 13, wherein: The housing includes a bore configured to receive the contact assembly, the bore including an upper stop between a first cavity and a second cavity, the second cavity having a larger diameter than the first cavity.

16. The test system according to claim 15, wherein: The upper stop of the hole is configured to prevent the first shoulder from moving upward toward the DUT.

17. The testing system according to claim 15, further comprising: A retainer plate is disposed at a bottom portion of the housing.

18. The test system according to claim 17, wherein: The holder plate includes a through hole configured to allow bottom ends of the first receiver and the second receiver to pass therethrough.

19. The test system according to claim 18, wherein: A diameter of the through hole is smaller than a diameter of the second cavity of the housing.

20. A compliant probe contact assembly for a test system for testing integrated circuit devices, wherein: The contact assembly comprises: a plunger including a retainer adjacent an end of the lower shaft; first and second receiver plates having a top and a bottom, each receiver plate having a longitudinal aperture sized to receive only a portion of the retainer, the apertures being insufficiently wide to allow the retainer to pass through the aperture; and offset member; wherein the first receiver plate and the second receiver plate are aligned relative to each other such that the first receiver plate and the second receiver plate are progressively closer to each other at the bottom than at the top; wherein, when the contact assembly is assembled, the biasing member surrounds at least a portion of the plunger and receives the first and second receiver plates, thereby maintaining the first and second receiver plates and the retainer in physical and electrical contact as the plunger moves along the apertures of the first and second receiver plates.

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