Detection device, loader, and transport method

Abstract

A detection device is provided with a first table surface for supporting a substrate in contact with a contact probe, a second table surface provided at a position adjacent to the first table surface and supporting a polishing member capable of polishing the contact probe, a substrate storage unit for storing the substrate, a polishing member storage unit for storing the polishing member, and a conveyance device having a conveyance arm. The transfer arm transfers the substrate between the first table top and the storage unit for the substrate, and transfers the polishing member between the second table top and the storage unit for the polishing member. The transfer arm has a first holding part capable of holding the substrate, and a second holding part capable of holding the polishing member at a position different from that of the first holding part.

Description

Technical Field

[0001] The invention relates to a detection device, a loader and a transport method. Background Art

[0002] Patent Document 1 discloses a testing device (probe stage) that performs electrical testing on a substrate by bringing a plurality of contact probes of a probe card connected to a tester into contact with the substrate based on three-dimensional movement of a stage on which the substrate is placed.

[0003] Furthermore, the detection device disclosed in Patent Document 1 includes a grinding member support unit (tip grinding device) that supports a grinding member for grinding the contact probe. Conventionally, when replacing the grinding member of the grinding member support unit, the detection device is temporarily stopped and the user has to manually perform the replacement.

[0004]

Prior art literature

[0005] [Patent Literature]

[0006] [Patent Document 1] Japanese Patent Application Publication No. 2015-138888 Summary of the Invention

[0007] [Problems to be solved by the invention]

[0008] The present invention provides a technology that can reduce the burden on users and improve work efficiency.

[0009]

Methods for solving the problem

[0010] According to one embodiment of the present invention, a detection device is provided, which includes a first table for supporting a substrate that contacts a contact probe, a second table provided at an adjacent position of the first table for supporting a grinding member that can grind the contact probe, a substrate storage portion for storing the substrate, a grinding member storage portion for storing the grinding member, and a transport device having a transport arm, wherein the transport arm transports the substrate between the first table and the substrate storage portion and transports the grinding member between the second table and the grinding member storage portion, and the transport arm has a first holding portion for holding the substrate and a second holding portion for holding the grinding member at a position different from the first holding portion.

[0011] Effects of the Invention

[0012] According to one embodiment, the burden on the user can be reduced and the work efficiency can be improved. BRIEF DESCRIPTION OF THE DRAWINGS

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Figure 19D

[0042] Hereinafter, the embodiment of the present invention will be described with reference to the accompanying drawings. In each of the drawings, the same components are sometimes given the same reference numerals, and repeated descriptions are omitted.

[0043] like Figure 1 As shown, a testing device 1 according to one embodiment is a device for testing the electrical characteristics of multiple devices under test (DUTs) formed on a wafer W, an example of a substrate. The substrate is not limited to wafer W and may also be a carrier, glass substrate, single chip, circuit board, or the like on which the DUTs are mounted. Examples of DUTs include semiconductor devices and other electronic devices.

[0044] The inspection apparatus 1 includes an inspection body 10, a loader 20 located adjacent to the inspection body 10, and a tester 30 located above the inspection body 10. Furthermore, the inspection apparatus 1 is connected to a controller 90 that controls various components of the inspection apparatus 1 to inspect wafers W.

[0045] The inspection main unit 10 includes a rectangular parallelepiped (box-shaped) inspection side frame 11. Within the inspection side frame 11 is an inspection space 11s for actually inspecting the wafer W while transporting it in three dimensions. The inspection main unit 10 houses a substrate support unit (first stage) 40, which supports the wafer W, within the inspection space 11s. Furthermore, a tester 30 is secured to the top plate of the inspection side frame 11, with the lower portion of the tester 30 exposed within the inspection space 11s.

[0046] The loader 20 holds multiple wafers W on standby and, under the control of the controller 90, moves wafers W scheduled for inspection into the inspection main unit 10 and removes wafers W that have completed inspection from the inspection main unit 10. The loader 20 includes a loader-side frame 21 that houses the various components of the loader 20. For example, the loader-side frame 21 is formed into a generally rectangular parallelepiped shape that is taller than the inspection-side frame 11 and the tester 30. The various components within the loader 20 will be described in detail later.

[0047] The tester 30 is equipped with a mainboard (not shown) that replicates the circuit structure of each device under test on the wafer W. Based on the signals received from each device under test on the wafer W, the mainboard determines whether each device under test is good or bad. For example, by switching mainboards, the tester 30 can replicate the circuit structure of various wafers W. The tester 30 is communicatively connected to the controller 90 and performs wafer W testing under the control of the controller 90.

[0048] The tester 30 holds a probe card 32 connected to the mainboard, detachably mounted on the lower interface 31 of the tester 30. The probe card 32 includes a large number of needle-shaped contact probes 33 corresponding to the pads and solder bumps of each device under test on the wafer W. While in contact with the wafer W, each contact probe 33 supplies power from the mainboard to the device under test through the probe card 32, and transmits signals from the device under test to the mainboard through the probe card 32.

[0049] Furthermore, the inspection apparatus 1 moves the wafer W mounted on the substrate support unit 40 relative to the probe card 32 connected to the tester 30, and operates the tester 30 to perform testing while pressing each contact probe 33 against each device under test on the wafer W. This testing process is repeated sequentially while the substrate support unit 40 is moved in the X-, Y-, and Z-axis directions, shifting the position on the wafer W. Thus, the inspection apparatus 1 inspects all the devices under test on the wafer W.

[0050] The substrate support unit 40 moves the wafer W in the three-dimensional direction (X-axis, Y-axis, and Z-axis) within the detection space 11s. For example, the substrate support unit 40 transports the wafer W in the horizontal direction (XY-axis) from the receiving position with the loader 20 toward the opposite position of the probe card 32. Then, the substrate support unit 40 raises the wafer W upward (positive direction of the Z axis) so that each contact probe 33 contacts the wafer W. After the wafer W is inspected, the substrate support unit 40 lowers the inspected wafer W downward (negative direction of the Z axis), removes the wafer W from each contact probe 33, and then transports the wafer W in the horizontal direction from the opposite position of the probe card 32 toward the receiving position.

[0051] Specifically, the substrate support unit 40 includes a moving portion 41 (Y-axis moving mechanism 42, X-axis moving mechanism 43, and Z-axis moving mechanism 44) movable in the X-, Y-, and Z-axis directions, a mounting table 45, and a table control unit 49. Furthermore, the inspection body 10 includes a frame structure 12 that supports the moving portion 41 of the substrate support unit 40, the mounting table 45, and the table control unit 49 in two upper and lower sections.

[0052] The Y-axis moving mechanism 42 moves the mounting table 45 in the Y-axis direction. Figure 2 As shown, the Y-axis movement mechanism 42 includes a plurality of guide rails 42a extending along the Y-axis on the upper surface of the frame structure 12, a plurality of Y-axis movable bodies 42b mounted on each guide rail 42a, and a Y-axis plate 42c supported by each Y-axis movable body 42b. Each Y-axis movable body 42b is connected to a Y-axis actuator (not shown) comprising a motor and a gear mechanism. The Y-axis actuator reciprocates each Y-axis movable body 42b and the Y-axis plate 42c in the Y-axis direction based on power supplied by a motor driver (not shown) from the table control unit 49.

[0053] Similarly, the X-axis movement mechanism 43 moves the mounting table 45 in the X-axis direction. The X-axis movement mechanism 43 includes a plurality of guide rails 43a extending along the X-axis direction on the upper surface of the Y-axis plate 42c, a plurality of X-axis movable bodies 43b provided on each guide rail 43a, and an X-axis plate 43c supported by each X-axis movable body 43b. Each X-axis movable body 43b is connected to an X-axis actuator (not shown) composed of a motor and a gear mechanism. The X-axis actuator reciprocates each X-axis movable body 43b and the X-axis plate 43c in the X-axis direction based on the power supply from the motor driver (not shown) of the table control unit 49.

[0054] The Z-axis moving mechanism 44 includes a fixed body 44a provided on the X-axis plate 43c and a Z-axis movable body 44b that is raised and lowered in the Z-axis direction (vertical direction) relative to the fixed body 44a, and a mounting table 45 is held on the upper part of the Z-axis movable body 44b. The Z-axis movable body 44b is connected to a Z-axis action unit (not shown) composed of a motor and a gear mechanism. The Z-axis action unit shifts the Z-axis movable body 44b in the Z-axis direction based on the power supply from the motor driver (not shown) of the table control unit 49, thereby raising and lowering the wafer W supported on the mounting table 45. In addition, in addition to moving the mounting table 45 in the X-axis, Y-axis, and Z-axis directions, the moving unit 41 may also have a structure that rotates the mounting table 45 around the vertical axis (θ direction).

[0055] On the other hand, the loading table 45 is a component that directly loads the wafer W and is transported by the moving part 41. The upper surface of the loading table 45 is a flat loading surface 45s on which the wafer W can be loaded. The loading table 45 has an appropriate mechanism according to the holding means for holding the wafer W on the loading surface 45s. For example, when the wafer W is vacuum-adsorbed, the holding means is a suction passage for suction (not shown) inside the loading table 45, and a pipe and a suction pump connected to the suction passage are also provided on the outside of the loading table 45. Furthermore, the detection device 1 may have a temperature control module (not shown) inside the loading table 45 for adjusting the temperature of the wafer W loaded on the loading surface 45s.

[0056] Back to Figure 1 The table control unit 49 is connected to the controller 90 and controls the operation of the substrate support unit 40 based on instructions from the controller 90. The table control unit 49 includes, for example, a general control unit that controls the overall operation of the substrate support unit 40, a PLC that controls the operation of the moving unit 41, a motor driver, a lighting control unit, a power supply unit, etc. (none of which are shown in the figure).

[0057] The controller 90 of the detection device 1 includes a main control unit 91 for controlling the entire detection device 1 and a user interface 95 connected to the main control unit 91. The main control unit 91 is composed of a computer, a control circuit board, and the like.

[0058] For example, the main control unit 91 includes a processor 92, memory 93, and input / output interfaces and circuits (not shown). The processor 92 is one or a combination of a CPU (central processing unit), a GPU (graphics processing unit), an ASIC (application integrated circuit), an FPGA (field programmable gate array), or a circuit composed of multiple discrete semiconductors. The memory 93 includes volatile memory and non-volatile memory (such as optical disks, DVDs (digital versatile disks), hard disks, and flash memory), and stores programs that operate the detection device 1 and records detection content.

[0059] On the other hand, the user interface 95 may be a keyboard for the user to input commands, or a display that visually displays the operating status of the detection device 1. Alternatively, the user interface 95 may be a touch screen, a mouse, a microphone, a speaker, or the like.

[0060] In addition, if Figure 2 As shown, the inspection apparatus 1 according to the present embodiment includes, in the inspection body 10, contact probes 33 (see FIG. 1 ) of a probe card 32 for grinding the worn wafer W during inspection. Figure 1 ) is provided with a grinding member support unit (second table) 50. The grinding member support unit 50 is provided on, for example, the X-axis plate 43c, thereby being moved horizontally integrally with the mounting table 45 via the Y-axis moving mechanism 42 and the X-axis moving mechanism 43 of the moving portion 41. The grinding member support unit 50 may be provided so as to be connected to the Z-axis movable body 44b or the mounting table 45.

[0061] The polishing member support unit 50 is formed in a substantially rectangular parallelepiped shape and supports the polishing member PP that performs polishing in direct contact with each contact probe 33. The polishing member support unit 50 includes, for example, a cylindrical outer frame 51 formed of a plurality of plates, a support body 52 disposed inside the outer frame 51 and capable of being raised and lowered in the vertical direction, and a lifting mechanism 53 for lifting the support body 52. The lifting mechanism 53 is composed of a drive source such as a motor or an air cylinder and a gear mechanism, and lifts the support body 52 up and down along a plurality of guide posts (not shown) disposed within the outer frame 51.

[0062] The support body 52 has a generally rectangular support surface 52s in a plan view. The support surface 52s is provided with a suction groove (not shown) for adsorbing the polishing element PP and a plurality of positioning pins (not shown) for positioning the polishing element PP. A suction passage (not shown) is formed within the support body 52 and communicates with the suction groove of the support surface 52s. This suction passage is connected to the unit-side adsorption unit 54 via a suction path external to the support body 52. The unit-side adsorption unit 54 includes a suction pump, a flow regulator, and an on-off valve (not shown) to apply an appropriate adsorption pressure (negative pressure) to the adsorption groove.

[0063] After the polishing component support unit 50 places the polishing component PP on the support surface 52s of the support body 52, it is suctioned by the unit-side suction portion 54, thereby firmly securing the polishing component PP. With the polishing component PP secured, the inspection apparatus 1 activates the Y-axis movement mechanism 42 and the X-axis movement mechanism 43 to move the polishing component PP to a position opposite each contact probe 33 of the probe card 32, so that it faces the contact probes 33. The inspection apparatus 1 then raises the support body 52 using the lifting mechanism 53, bringing the polishing component PP into contact with each contact probe 33, thereby polishing each contact probe 33.

[0064] Here, the polishing member PP provided on the support surface 52s of the polishing member support unit 50 is also gradually consumed as the contact probes 33 polish. In conventional inspection apparatuses, when a consumed polishing member PP is replaced, the user manually removes the used polishing member PP and simultaneously performs a replacement operation to set a replacement polishing member PP. During this replacement operation, inspection of the wafer W by the inspection apparatus 1 is suspended.

[0065] The detection device 1 according to this embodiment is a structure that automatically carries out the carrying of the polishing member PP to and from the polishing member support unit 50 in the detection main body 10. Figure 3 Provide specific instructions.

[0066] The loader 20 has a loader side frame 21, which is rectangular and elongated in the Y-axis direction in plan view. Inside, there are a substrate standby area 22 for holding multiple wafers W, and a polishing unit standby area 23 for holding multiple polishing units PP. The loader 20 also includes a transfer area 24 with a transfer device 60 located between the substrate standby area 22 and the polishing unit standby area 23. Specifically, the loader 20 includes the substrate standby area 22, the transfer area 24, and the polishing unit standby area 23, arranged in this order along the positive Y-axis direction (parallel to the longitudinal direction of the inspection body 10). Furthermore, the loader 20 includes a posture adjustment area 25 between the polishing unit standby area 23 and the transfer area 24 for adjusting the posture of the polishing units PP.

[0067] The substrate standby area 22 is provided with, for example, a FOUP (front-opening pod: substrate storage section) 29 serving as a storage container for a plurality of wafers W. In the installed state, the side surface of the FOUP 29 on the positive Y-axis side facing the transport device 60 is open to the space of the loader side frame 21. This allows the transport device 60 to smoothly contact each wafer W arranged in the vertical direction in the substrate standby area 22. On the other hand, the polishing part standby area 23 is provided with a polishing part storage container (polishing part storage section) 70 that can accommodate a plurality of polishing parts PP. The structure of the polishing part storage container 70 will be described in detail later.

[0068] The transport device 60 in the transport area 24 transports wafers W and polishing parts PP at appropriate times. Specifically, the transport device 60 performs a substrate-carrying operation, removing pre-inspection wafers W from the FOUP 29 and transferring them to the substrate support unit 40, and a substrate-unloading operation, receiving post-inspection wafers W from the substrate support unit 40 and storing them in the FOUP 29. Furthermore, the transport device 60 performs a polishing-part-carrying operation, removing replacement polishing parts PP from the polishing-part storage container 70 and transferring them to the polishing-part support unit 50, and a polishing-part-unloading operation, receiving used polishing parts PP from the polishing-part support unit 50 and storing them in the polishing-part storage container 70.

[0069] The transport device 60 is configured to rotate about a vertical axis and to be vertically movable within the transport area 24. It is also capable of linearly advancing and retreating from the transport area 24 to another area including the detection main unit 10. Therefore, the transport device 60 includes a lift drive unit 61 fixed to the loader-side frame 21, a rotation drive unit 62 fixed to the lift drive unit 61, and a base 63 fixed to the rotation drive unit 62.

[0070] Furthermore, the transport device 60 according to this embodiment includes two transport arms 64 that directly hold wafers W and move forward and backward relative to the transport area 24. Hereinafter, one transport arm 64 is referred to as the first transport arm 64A, and the other transport arm 64 is referred to as the second transport arm 64B. For example, the transport device 60 uses the first transport arm 64A to move pre-inspected wafers W received from the FOUP 29 into the substrate support unit 40. Conversely, the transport device 60 uses the second transport arm 64B to remove inspected wafers W from the substrate support unit 40 and transfer them to the FOUP 29. Alternatively, the transport device 60 may include only one transport arm 64 (the first transport arm 64A).

[0071] The lifting drive unit 61 raises and lowers the entire transport device 60 vertically. The lifting drive unit 61 includes a fixed rail fixed to the loader side frame 21 and extending in the vertical direction, a movable body movably mounted relative to the fixed rail, and a transport device lifting mechanism (not shown) that raises and lowers the movable body. A rotational drive unit 62 is mounted on the movable body. The transport device lifting mechanism raises and lowers the movable body to a vertical height position corresponding to commands from the controller 90.

[0072] The rotation drive unit 62 rotates the base 63 about a vertical axis. The rotation drive unit 62 includes a table fixed to the movable body of the lift drive unit 61, a rotation shaft that is rotatable relative to the table and connected at its upper end to the base 63, and a transport device rotation mechanism (not shown) that rotates the rotation shaft. The transport device rotation mechanism rotates the base 63 to a rotation angle corresponding to a command from the controller 90.

[0073] like Figure 4 As shown, the base 63 is formed into a disk shape and includes an advance / retract drive unit 65 on its upper surface for advancing and retracting the first and second transport arms 64A and 64B, respectively. The advance / retract drive unit 65 includes a rectangular protrusion 651 in the center of the base 63. Furthermore, on either side of the rectangular protrusion 651, there are a drive source 652, such as a cylinder mechanism, and guide walls 653 extending parallel to the direction of extension and retraction of the cylinder mechanism. Each transport arm 64 (the first transport arm 64A and the second transport arm 64B) extends parallel to the guide walls 653. Thus, each transport arm 64 advances and retracts linearly along the guide walls 653, driven by the drive source 652 in response to commands from the controller 90.

[0074] Each transport arm 64 (first transport arm 64A, second transport arm 64B) includes a base arm 641 guided by its own guide wall 653, a connecting frame 642 fixed to the extended end (front end) of the base arm 641 and projecting upwards at a shorter angle, and a plate-shaped crank arm 643 that curves inward and toward the front end from the upper end of the connecting frame 642. The base arm 641, connecting frame 642, and crank arm 643 of the first transport arm 64A are symmetrical to the base arm 641, connecting frame 642, and crank arm 643 of the second transport arm 64B in plan view. A first end effector 66A, serving as the end effector 66 of the transport device 60, is fixed to the front end of the crank arm 643 of the first transport arm 64A. A second end effector 66B, serving as the end effector 66 of the transport device 60, is fixed to the front end of the crank arm 643 of the second transport arm 64B.

[0075] like Figure 5 As shown, the protrusion heights of the first transport arm 64A and the second transport arm 64B relative to the connection frame 642 of the base arm 641 are different from each other. As a result, the crank arms 643 and the end effector 66 are arranged in a manner that does not interfere with each other. Figure 5 In the embodiment, the first end effector 66A is provided above the second end effector 66B, but this arrangement may be reversed.

[0076] The first end effector 66A and the second end effector 66B can overlap each other in the vertical direction in the standby position retracted to the side of the base 63. When the end effectors 66 (first end effector 66A, second end effector 66B) are in the standby position, the transport device 60 accommodates each transport arm 64 (first transport arm 64A, second transport arm 64B) entirely inside the disc-shaped base 63 in plan view.

[0077] The first end effector 66A is configured to separately hold a wafer W and a polishing member PP. Specifically, the first end effector 66A has a first holding portion 67 on its upper surface for holding the wafer W, and a second holding portion 68 on its lower surface (located at a different position from the first holding portion 67) for holding the polishing member PP. To hold the polishing member PP on the lower surface of the first end effector 66A, the vertical distance between the first end effector 66A and the second end effector 66B is set to a width, for example, at least twice the thickness of the polishing member PP.

[0078] The second end effector 66B has, on its upper surface, only a holding portion (first holding portion 67 ) for holding the wafer W. Alternatively, the second end effector 66B may be configured to separately hold the wafer W and the polishing member PP.

[0079] like Figure 6 As shown, the end effector 66 has a crank arm 643 (see Figure 5 ) and a pair of fork plates 662 protruding from the base plate 661 toward the front end. The base plate 661 and the pair of fork plates 662 are integrally formed, with the upper and lower surfaces of each portion being flat and continuous in the horizontal direction. The facing inner edges of the pair of fork plates 662 are curved and continuous via the arc-shaped edge at the front end of the base plate 661. The shape of the end effector 66 is not particularly limited; for example, three or more fork plates 662 may be provided.

[0080] The transport device 60 includes a suction mechanism 69 that separately suctions the wafer W and the polishing part PP to the first end effector 66A. Furthermore, the transport device 60 includes a suction mechanism (not shown) that suctions only the wafer W to the second end effector 66B. The suction mechanism of the second end effector 66B is identical to the portion of the first end effector 66A that suctions the wafer W, and therefore, a detailed description thereof will be omitted.

[0081] The suction mechanism 69 independently applies suction pressure (negative pressure) to the first holding portion 67 and the second holding portion 68 of the first end effector 66A. In this embodiment, the first holding portion 67 is configured as one or more (two) suction ports 671 formed on the upper surface of the first end effector 66A. The suction ports 671 are each located near the inner edges of the pair of fork plates 662.

[0082] The second holding portion 68 is composed of one or more (five) suction pads 681 formed on the lower surface of the first end effector 66A. Specifically, the five suction pads 681 are located at the tip ends of the pair of fork plates 662, at the connection points between the base plate 661 and the pair of fork plates 662, and at the tip and widthwise center of the base plate 661. The presence of suction pads 681 on each of the base plate 661 and the pair of fork plates 662 ensures stable holding of the polishing part PP.

[0083] Furthermore, the suction mechanism 69 includes, in the first end effector 66A, a plurality of first suction passages 691 that communicate with the suction ports 671 , and a plurality of second suction passages 692 that communicate with the suction pads 681 .

[0084] The suction port 671 is a long groove along the extending direction of the pair of fork plate parts 662. Figure 7A As shown, the suction port 671 communicates with one end (front end) of the first suction passage 691 through a hole extending upward within the pair of fork plates 662. Furthermore, the suction port 671 opens along the flat upper surface of the first end effector 66A. This allows the first end effector 66A to stably hold the wafer W on the entire upper surface while applying suction pressure.

[0085] On the other hand, the adsorption pad portion 681 is as follows Figure 7B As shown, a slight protrusion protrudes from the bottom surface of the first end effector 66A. This protrusion contacts the polishing member PP, applying suction pressure to thereby suction and hold the polishing member PP. For example, the suction pad 681 includes a pad body 682 that directly contacts the polishing member PP, a fixing member 683 that secures the pad body 682 to the end effector 66, and a blocking member 684 that covers the fixing member 683 and blocks the second suction passage 692.

[0086] The pad body 682 is formed into a tapered shape (umbrella-shaped, conical) that gradually expands in diameter from the flat upper portion toward the lower portion. The fixing member 683 is composed of multiple components that sandwich the pad body 682 and the end effector 66 from above. A hole 683h is formed in the center of the fixing member 683. After the fixing member 683 is installed, the blocking member 684 blocks the upper surface of the end effector 66, thereby airtightly blocking the second suction passage 692 that was open when the fixing member 683 was installed.

[0087] The second suction passage 692 extends along an appropriate path within the end effector 66, with one end thereof passing around the upper end (on the side of the blocking member 684) of the fixing member 683, thereby communicating with the hole 683h. The end effector 66 applies suction pressure to the inside of the pad body 682 through the second suction passage 692 and the hole 683h, thereby causing the polishing member PP in contact to be sucked to the pad body 682.

[0088] Back to Figure 6 Each first suction passage 691 communicates with a first suction source 694 via a plurality of first suction paths 693 provided within the first transport arm 64A (including ducts provided outside the transport arm 64). Similarly, each second suction passage 692 communicates with a second suction source 696 via a plurality of second suction paths 695 provided within the first transport arm 64A (including ducts provided outside the transport arm 64). The plurality of first suction passages 691 (or the plurality of first suction passages 693) may merge at an intermediate position. Similarly, the plurality of second suction passages 692 (or the plurality of second suction passages 695) may merge at an intermediate position. Figure 6 6 shows an example where two second suction passages 692 merge in the end effector 66. The second suction passage 695 may be provided with a valve that can be opened to the atmosphere under the control of the controller 90, so as to introduce gas into the pad body 682 when the polishing part PP is separated.

[0089] The first suction source 694 and the second suction source 696 are provided on the base 63 of the transport device 60, for example. As an example, the second suction source 696 is configured to include a pump, a pressure controller, a valve, etc. (not shown). The second suction source 696 applies suction pressure, adjusted through the second suction path 695, the second suction passage 692, and the suction ports 671, to the wafer W placed on the top surface of the first end effector 66A.

[0090] On the other hand, the first adsorption source 694 is as follows Figure 8 As shown, to apply suction pressure to the suction pad 681, a blower 696a, an ejector mechanism 696b, and an exhaust path 696c are provided. The blower 696a supplies compressed air to the ejector mechanism 696b. Thus, the first holding section 67 and the second holding section 68 are constructed with different piping systems. Specifically, the first holding section 67 is constructed with vacuum-based piping, while the second holding section 68 is constructed with air-based piping. Therefore, each can be independently controlled, making it easy to control the desired pressure.

[0091] The ejector mechanism 696b is connected to the first suction path 693 connected to the first suction path 691 while being connected to the blower 696a and the exhaust path 696c. The ejector mechanism 696b is provided with a main flow path in the middle having an orifice whose diameter gradually decreases relative to the opening, and a sub-flow path that merges at the orifice. The upstream port of the main flow path is connected to the blower 696a through an air supply path (not shown), the downstream port of the main flow path is connected to the exhaust path 696c, and the sub-port of the sub-flow path is connected to the first suction path 693. The ejector mechanism 696b constructed in this way guides the compressed air supplied from the air supply path 696d to the main flow path to the exhaust path 696c, and at the same time accelerates the flow rate at the orifice to generate a large negative pressure on the sub-flow path. Thus, the ejector mechanism 696b can impart adsorption pressure to each adsorption pad 681 through the first suction path 693 and the first suction path 691 connected to the sub-flow path. In addition, Figure 7B The second holding portion 68 may have the function of removing particles using air and the function of removing abrasive particles using vacuum. For example, the ejector mechanism 696b may be configured to switch between ejecting compressed air from the pad body 682 to remove particles on the abrasive component PP and generating suction pressure while being spaced from the abrasive component PP to suction floating particles.

[0092] like Figure 3 As shown, the above-described transport device 60 rotates the base 63 based on the rotation axis of the rotary drive unit 62 under the command of the controller 90, thereby setting the forward and backward directions of each transport arm 64. For example, the transport device 60 orients each end effector 66 in the direction facing the FOUP 29 (the negative direction of the Y axis). As a result, each end effector 66 can advance and retreat in the negative direction of the Y axis, contact the FOUP 29, and retreat from the FOUP 29 in the positive direction of the Y axis to return to the standby position. In addition, the transport device 60 orients each end effector 66 in the direction facing the grinding component standby area 23 (the positive direction of the Y axis). As a result, the first end effector 66A advances and retreats in the positive direction of the Y axis, contacting the grinding component storage container 70, and retreating from the grinding component storage container 70 in the negative direction of the Y axis to return to the standby position.

[0093] Furthermore, the transport device 60 orients each end effector 66 in a direction facing the detection body 10 (the positive direction of the X-axis). Thus, each end effector 66 can move in and out in the positive direction of the X-axis, contacting the substrate support unit 40 or the polishing component support unit 50, and can retreat from the substrate support unit 40 or the polishing component support unit 50 in the negative direction of the X-axis to return to the standby position. That is, when the wafer W is moved in and out, the controller 90 controls the moving unit 41 to move the substrate support unit 40 in the horizontal direction (e.g., the Y-axis direction), and provides a placement surface 45s below the entry and exit position of each end effector 66. Furthermore, when the polishing component PP is moved in and out, the controller 90 controls the moving unit 41 to move the polishing component support unit 50 in the horizontal direction (e.g., the Y-axis direction), and provides a support surface 52s below the entry and exit position of each end effector 66.

[0094] like Figure 9 As shown, the first end effector 66A absorbs and holds the center of the grinding member PP by each suction pad 681 when the grinding member PP is transported. The grinding member PP is formed to have a predetermined thickness and is thicker than the support surface 52s of the grinding member support unit 50 in a plan view (see FIG. Figure 3 ) is a smaller rectangular shape.

[0095] More specifically, the polishing member PP includes a polishing plate portion P1 and a pair of positioning protrusions P2 provided at both ends of the polishing plate portion P1 in the longitudinal direction. A polishing sheet PS for polishing the contact probes 33 is attached to the upper surface (one side) of the polishing plate portion P1. The polishing sheet PS is formed into a rectangular shape that is slightly smaller than the polishing plate portion P1.

[0096] The pair of positioning protrusions P2 are formed into a trapezoidal shape that is continuous with a pair of short sides of the grinding plate portion P1 in a planar view. The connection between the grinding plate portion P1 and each positioning protrusion P2 is smoothly curved. In addition, each positioning protrusion P2 is provided with one or more positioning holes P2h. When the grinding part PP is transported, the one or more positioning holes P2h are provided with positioning pins (not shown) provided on the support surface 52s of the grinding part support unit 50, or positioning pins 73 (see FIG. 1 ) provided on the grinding part storage container 70. Figure 11 ) and other insertions.

[0097] like Figure 10As shown, the abrasive component storage container 70 is formed into a generally rectangular parallelepiped shape capable of storing a plurality (five) of abrasive components PP in the vertical direction. Obviously, there is no particular limit to the number of abrasive components PP that can be stored in the abrasive component storage container 70. The abrasive component storage container 70 is assembled from multiple frames 70f to form a frame structure with an open side facing the transport device 60 in the negative direction of the Y axis. The abrasive component storage container 70 is provided with multiple gripping levers 71 on the outside for a user to grasp the abrasive component storage container 70.

[0098] Inside the polishing component storage container 70, multiple inner shelves 72 are provided at both ends in the longitudinal direction. The polishing component storage container 70 horizontally supports the polishing components PP via a pair of inner shelves 72 located at the same height at both ends in the longitudinal direction. The spacing between the multiple inner shelves 72 is set to be greater than the combined thickness of the first end effector 66A and the thickness of the polishing components PP, allowing the first end effector 66A to move in and out.

[0099] The grinding component standby area 23 of the loader 20 is configured so that the grinding component storage container 70 can be pulled out in the negative X-axis direction. The grinding component standby area 23 includes a loading plate 23p on which the grinding component storage container 70 is placed, and the loading plate is slidable in the X-axis direction. This allows the user to pull the loading plate and the grinding component storage container 70 outward from the loader 20 and replace the grinding component storage container 70 itself (or replace the individual grinding components PP inside).

[0100] like Figure 11 As shown, the polishing member PP is positioned by inserting a positioning pin 73 into the positioning hole P2h while being supported by the inner shelves 72 of the polishing member storage container 70. This holds the polishing member PP so that its outer edge is substantially parallel to the frame of the polishing member storage container 70.

[0101] Here, the positioning hole P2h is formed larger than the positioning pin 73, and sometimes the polishing part PP is slightly tilted (for example, about 1°) relative to the reference standby position of the polishing part storage container 70 and stored. Figure 3 As shown, in the inspection device 1, in order to transport a rectangular grinding component PP along the X-axis direction of the grinding component support unit 50, the longitudinal direction of the grinding component PP must be aligned with the X-axis direction when entering the inspection body 10 relative to the long support surface 52s. Therefore, the loader 20 is equipped with a posture adjustment device 80 in the posture adjustment area 25, which adjusts the horizontal posture of the grinding component PP, which is the posture in the horizontal direction (XY axis).

[0102] like Figure 12As shown, the posture adjustment device 80 includes a rotation mechanism 81 for adjusting the rotational orientation of the grinding member PP, and a clamping mechanism 86 for clamping and centering the grinding member PP. Specifically, "adjusting the horizontal posture" of the grinding member PP refers to at least one of determining the rotational orientation around the vertical axis with the center of the grinding member PP as a base point, and positioning (centering) the grinding member PP with the center of the grinding member PP as a reference.

[0103] The rotating mechanism 81 rotates the polishing member PP conveyed by the conveying device 60 about a vertical axis. The rotating mechanism 81 includes a table 82 on which the polishing member PP is placed, a rotating operation unit 83 for rotating the table 82, and a rotating mechanism-side suction unit 84 for sucking the polishing member PP placed on the table 82.

[0104] The table 82 is a circular plate having a true circular shape in a plan view and is provided at the center of the posture adjustment area 25. The upper surface of the table 82 is formed flat. The table 82 also has a suction groove 841 for sucking the lower surface of the polishing member PP.

[0105] The rotational operation unit 83 includes a rotational shaft 831 that supports the center of the worktable 82, a motor 832 that drives the rotation, and a rotation transmission unit 833 that transmits the rotational drive of the motor 832 to the rotational shaft 831. For example, the rotation transmission unit 833 is configured by multiple pulleys, multiple gears, etc. between the rotational shaft 831 and the motor 832. The rotational operation unit 833 rotates the worktable 82 in units of a specified angle (such as 90 degrees) based on commands from the controller 90.

[0106] The rotating mechanism-side suction section 84 has suction grooves 841 formed on the upper surface of the worktable 82 and a suction path 842 communicating with the suction grooves 841 through the interior of the worktable 82. The suction path 842 extends through the interior of the rotating shaft 831 to the exterior of the posture adjustment area 25, where it connects to the rotating mechanism-side suction mechanism 843. The rotating mechanism-side suction mechanism 843 includes a suction pump, a flow rate regulator, an on-off valve, and other components. Thus, in the rotating mechanism-side suction section 84, the rotating mechanism-side suction mechanism 843 is activated based on commands from the controller 90, thereby applying suction to the lower surface of the polishing component PP placed on the worktable 82.

[0107] The clamping mechanism 86 has a pair of sliding movable parts 87 on both sides of the Y-axis direction, with the worktable 82 of the rotating mechanism 81 as the base point. The pair of sliding movable parts 87 includes a fixed driving part 88 fixed to the base of the posture adjustment area 25 and a slide body 89 that moves forward and backward via the fixed driving part 88.

[0108] The fixed drive unit 88 includes a drive source, such as an air cylinder mechanism, and also includes multiple rods protruding outward in the Y-axis direction and connected to the slide 89. A pair of movable slides 87 includes multiple rods and slides 89 protruding in opposite directions in the X-axis direction. The fixed drive unit 88 activates the drive source under the control of the controller 90, causing the multiple rods and slides 89 to advance and retract. This allows the pair of slides 89 to move toward or away from each other.

[0109] The pair of slides 89 includes a frame 891 elongated in the X-axis direction and contact rollers 892 on each end of the frame 891 in the longitudinal direction (X-axis direction). The pair of contact rollers 892 on each slide 89 are supported so as to be rotatable relative to the frame 891, spaced apart by a distance based on the size of the positioning protrusion P2 of the grinding member PP. When the pair of slides 89 approach each other, the contact rollers 892 come into contact with the inclined portion of the positioning protrusion P2.

[0110] The clamping mechanism 86 constructed as above, Figure 13 As shown, as the pair of slides 89 approach, the longitudinal ends of the grinding component PP placed on the worktable 82 can be clamped by the pair of slides 89. As the pair of slides 89 approach, each contact roller 892 first contacts the inclined portion P2i of the positioning protrusion P2, guiding the positioning protrusion P2 of the grinding component PP between the contact rollers 892. Furthermore, by clamping (bringing the pair of slides 89 closer), the clamping mechanism 86 can center the grinding component PP so that the center and the worktable 82 are aligned. Furthermore, if the grinding component PP placed on the worktable 82 is slightly tilted, the clamping mechanism 86 guides the inclined portion P2i via the contact rollers 892, thereby enabling precise fine-tuning of the grinding component PP's orientation.

[0111] The detection device 1 and the loader 20 according to this embodiment are basically configured as described above. Figure 14 to Figure 1 9 for explanation.

[0112] The controller 90 of the inspection device 1 carries out the transportation of the wafer W and the transportation of the polishing part PP through the transportation device 60 of the loader 20. Figure 14 As shown, during the inspection of the wafer W, the controller 90 performs a substrate carry-in operation (step S1), and transports the wafer W from the FOUP 29 to the substrate support unit 40 via the first end effector 66A of the transport device 60. At this time, the controller 90 suctions the wafer W onto the first holding portion 67 on the upper surface of the first end effector 66A to transport the wafer W. Furthermore, during the transport of the wafer W, if an inspected wafer W is present on the substrate support unit 40, the controller 90 performs a substrate carry-out operation, for example, using the second end effector 66B, to remove the wafer W from the substrate support unit 40.

[0113] Then, the controller 90 moves the moving section 41 to bring the wafer W conveyed on the substrate support unit 40 into contact with the contact probes 33 of the tester 30 (probe card 32 ), thereby performing electrical testing of each device under test on the wafer W (step S2 ).

[0114] Furthermore, during a break in wafer W inspection or during maintenance of the inspection apparatus 1, the controller 90 determines the status (wear, etc.) of each contact probe 33 (step S3). If each contact probe 33 is worn (step S3: Yes), step S4 is executed. If each contact probe 33 is not worn (step S3: No), step S4 is omitted and the process proceeds to step S5.

[0115] In step S4, after the controller 90 unloads the wafer W from the inspection body 10, it moves the polishing member support unit 50 via the moving unit 41, causing each contact probe 33 to contact the polishing member PP, thereby polishing each contact probe 33. For example, during polishing, the polishing member support unit 50 reciprocates along a predetermined horizontal path via the moving unit 41, thereby polishing each contact probe 33.

[0116] Furthermore, when the detection device 1 is in operation, the controller 90 continuously monitors the triggering conditions for replacing the grinding component PP and determines whether the grinding component PP needs to be replaced (step S5). For example, the triggering condition can be cited as counting the number of times the contact probe 33 of the probe card 32 of the grinding component PP provided in the grinding component support unit 50 is ground, and determining whether the number of grindings is greater than a specified number. That is, when the number of grindings is greater than a specified number, it can be considered that the grinding component PP needs to be replaced, and when the number of grindings is less than a specified number, it can be considered that the grinding component PP does not need to be replaced. In addition, the triggering condition can be measuring the usage time period of the grinding component PP of the grinding component support unit 50 to determine whether the usage time period is greater than a specified time period, or it can be receiving a replacement instruction from the user through the user interface 95.

[0117] If the controller 90 determines that polishing part PP does not need to be replaced (step S5: No), the process proceeds to step S6. In step S6, the controller 90 determines whether to terminate wafer W inspection. If wafer W inspection is to continue (step S6: No), the process returns to step S1 and repeats the same process. On the other hand, if wafer W inspection is to be terminated (step S6: Yes), the process ends.

[0118] Furthermore, if the controller 90 determines in step S5 that the grinding member PP needs to be replaced (step S5: YES), the process proceeds to the grinding member PP replacement process (step S7). During the grinding member PP replacement process, the grinding member PP is first unloaded, and the used grinding member PP held by the grinding member support unit 50 of the detection body 10 is transferred to the grinding member storage container 70 of the loader 20.

[0119] Specifically, the controller 90 follows Figure 15 In each step of the process flow shown, the polishing component is carried out.

[0120] The controller 90 first receives the used polishing member PP placed on the polishing member support unit 50 through the first end effector 66A of the transport device 60 (step S101). Figure 16A As shown, first, the moving portion 41 of the detection body 10 is activated. The moving portion 41 moves the polishing member support unit 50 to place the polishing member PP below the in-and-out position of the first end effector 66A.

[0121] The controller 90 then controls the transport device 60 to receive the grinding component PP via the first end effector 66A. Specifically, the transport device 60 uses the advance / retract drive unit 65 to move the first transport arm 64A, which is waiting in the standby position, forward and backward, so that the grinding component PP of the grinding component support unit 50 and the first end effector 66A face each other. Next, the transport device 60 uses the lift drive unit 61 to lower the first end effector 66A (or raise the grinding component support unit 50) so that the upper surface of the grinding component PP contacts the suction pads 681. The transport device 60 then applies suction pressure from the suction pads 681 to the grinding component PP via the suction mechanism 69, thereby suctioning the grinding component PP. After receiving the grinding component PP from the grinding component support unit 50 via the first end effector 66A, the longitudinal direction (advance / retract direction) of the first end effector 66A and the longitudinal direction of the grinding component PP become parallel to each other.

[0122] Next, the conveying device 60 conveys the polishing member PP held by the first end effector 66A to the posture adjustment device 80 ( Figure 15 Step S102). Figure 16BAs shown, the transport device 60 uses the forward / retract drive unit 65 to move the first end effector 66A in the negative X-axis direction (from the in-and-out position to the standby position). The transport device 60 then uses the rotation drive unit 62 to rotate the base 63 and the first transport arm 64A (first end effector 66A) 90° clockwise. This allows the first end effector 66A to move in and out in the positive Y-axis direction (toward the polishing component standby area 23).

[0123] Here, the longitudinal direction of the polishing component PP held by the first end effector 66A is parallel to the forward and backward direction of the first end effector 66A and perpendicular to the longitudinal direction of the polishing component storage container 70 (which is inconsistent with the storage posture of the polishing component storage container 70). Therefore, the controller 90 performs the following processing to control the posture adjustment device 80 to rotate the horizontal posture of the polishing component PP 90 degrees clockwise or counterclockwise.

[0124] The transport device 60 uses the forward / retract drive unit 65 to move the first end effector 66A forward and backward to a position facing the work table 82 of the posture adjustment device 80. The lift drive unit 61 then lowers the first end effector 66A, placing the polishing component PP on the work table 82. In this state, the controller 90 releases the suction of the suction pads 681 of the first end effector 66A and activates the rotation mechanism-side suction unit 84 to cause the work table 82 to suction the polishing component PP. After suctioning the work table 82, the transport device 60 uses the lift drive unit 61 to lift the first end effector 66A away from the polishing component PP.

[0125] The posture adjustment device 80 rotates the table 82 and the polishing member PP by 90 degrees by the rotation operation unit 83 while the polishing member PP is being attracted by the table 82, and then releases the attraction of the polishing member PP by the table 82 ( Figure 15 Step S103). Thus, Figure 16C As shown, on the table 82 of the posture adjusting device 80 , the longitudinal direction of the polishing member PP and the longitudinal direction of the polishing member storage container 70 are substantially parallel to each other.

[0126] Therefore, the controller 90 takes out the polishing member PP adjusted to a horizontal posture from the table 82 by the first end effector 66A of the transport device 60 and stores it in the polishing member storage container 70 ( Figure 15At this time, the transport device 60 lowers the first end effector 66A via the lift drive 61, bringing each suction pad 681 into contact with the upper surface of the polishing component PP. The suction mechanism 69 causes each suction pad 681 to suction the polishing component PP. Furthermore, the transport device 60 adjusts the vertical position of the first end effector 66A and the polishing component PP via the lift drive 61 so that the height matches the intended storage space (the pair of inner shelves 72) of the polishing component storage container 70.

[0127] Then, if Figure 16D As shown, the transport device 60 moves the first end effector 66A forward and backward via the forward / retractable drive unit 65, thereby placing the polishing component PP into the polishing component storage container 70. With the pair of inner shelves 72 facing the polishing component PP, the transport device 60 lowers the first end effector 66A, releasing the polishing component PP from its position.

[0128] Through the above process flow, the inspection device 1, loader 20, and transport method enable smooth transport of the grinding components PP from the grinding component support unit 50 to the grinding component storage container 70. In particular, the inspection device 1 uses a posture adjustment device 80, located between the transport device 60 and the grinding component storage container 70 (on the transport path of the grinding components PP), to adjust the horizontal posture of the grinding components PP before they are stored in the grinding component storage container 70. This allows the grinding components PP to be accurately stored in the grinding component storage container 70 without wasting time.

[0129] Next, the grinding component carrying-in operation for replacing the grinding component PP, which is performed after the grinding component carrying-out operation, will be described. During the grinding component carrying-in operation, the controller 90 uses the transport device 60 to transport the replacement grinding component PP, which is waiting in the grinding component storage container 70, to the grinding component support unit 50. Obviously, if the grinding component PP is not mounted on the grinding component support unit 50, the grinding component carrying-in operation can be performed instead of the grinding component carrying-out operation.

[0130] The controller 90 pre-manages the status and position of each polishing component PP within the polishing component storage container 70, and selects a replacement polishing component PP before the polishing component is loaded (e.g., when a trigger condition for replacement is met). The replacement polishing component PP can be an unused (new) polishing component PP or a polishing component PP that has been used and has low consumption.

[0131] Specifically, the controller 90 follows Figure 17 In each step of the process flow shown, the grinding component carrying operation is performed.

[0132] The controller 90 receives the specific replacement polishing member PP in the polishing member storage container 70 through the first end effector 66A of the transport device 60 (step S201). Figure 18A As shown, the transport device 60 moves the first end effector 66A forward and backward via the forward / retractable drive unit 65, allowing the first end effector 66A to enter the space above the replacement polishing components PP in the polishing component storage container 70. Furthermore, when the polishing component storage container 70 has previously stored used polishing components PP, the first end effector 66A can be slightly retracted from the polishing component storage container 70, and then the height position of the first end effector 66A can be adjusted to allow the first end effector 66A to reenter the polishing component storage container 70.

[0133] Next, the transport device 60 lowers the first end effector 66A through the lifting drive unit 61, so that the upper surface of the grinding part PP contacts the suction pads 681. Furthermore, in the transport device 60, the suction mechanism 69 is activated, and suction pressure is applied to the grinding part PP from the suction pads 681, thereby sucking the grinding part PP. After the grinding part PP is received by the first end effector 66A, the longitudinal direction (advance and retreat direction) of the first end effector 66A and the longitudinal direction of the grinding part PP are perpendicular to each other. Therefore, the controller 90 rotates the horizontal posture of the grinding part PP clockwise (or counterclockwise) by 90 degrees through the posture adjustment device 80.

[0134] The conveying device 60 conveys the polishing component PP held by the first end effector 66A to the work table 82 ( Figure 17 Step S202). Figure 18B As shown, the transport device 60 uses the forward / backward drive unit 65 to retract the first end effector 66A in the negative direction of the Y-axis, positioning the held polishing component PP against the worktable 82 located on the transport path for the polishing component PP. The transport device 60 then uses the lift drive unit 61 to lower the first end effector 66A, placing the polishing component PP on the worktable 82. In this state, the controller 90 releases the suction of the suction pads 681 of the first end effector 66A and, at the same time, activates the rotation mechanism-side suction unit 84 to cause the worktable 82 to suction the polishing component PP. After suction is applied to the worktable 82, the transport device 60 uses the lift drive unit 61 to raise the first end effector 66A from the polishing component PP.

[0135] The posture adjustment device 80 rotates the table 82 clockwise (or counterclockwise) by 90 degrees through the rotation operation unit 83 while the polishing part PP is adsorbed on the table 82, and then releases the adsorption of the polishing part PP on the table 82 ( Figure 17 Step S203). Thus, Figure 18C and Figure 18D As shown, the grinding member PP is also rotated 90 degrees. The posture adjustment device 80 on the workbench 82 can make the longitudinal direction of the grinding member PP and the longitudinal direction (advance and retreat direction) of the first end effector 66A substantially parallel to each other. Figure 18D and Figure 19A In order to facilitate understanding of the operation of the posture adjusting device 80 , the first end effector 66A is omitted from the illustration.

[0136] Next, the posture adjustment device 80 clamps the polishing member PP by the clamping mechanism 86, thereby finely adjusting the horizontal posture of the polishing member PP ( Figure 17 Step S204). Figure 18D As shown, the posture adjustment device 80 moves the pair of slides 89 in a direction toward each other, thereby sandwiching the grinding member PP in the longitudinal direction. As a result, the center of the grinding member PP and the center position of the work table 82 are aligned, and the longitudinal direction of the grinding member PP and the forward and backward direction of the first end effector 66A are finely adjusted to be parallel (refer to Figure 13 ).

[0137] When the grinding member PP is clamped by the clamping mechanism 86, the posture adjustment device 80 adsorbs the grinding member PP on the upper surface of the work table 82 by the rotation mechanism side adsorption portion 84, and then releases the clamping of the grinding member PP by the clamping mechanism 86 ( Figure 17 Step S205). That is, Figure 19A As shown, the posture adjusting device 80 moves the pair of slide bodies 89 in directions away from each other. Thus, the posture adjusting device 80 holds the polishing member PP, whose horizontal posture is adjusted according to the polishing member support unit 50 , on the table 82 .

[0138] Then, the controller 90 takes out the polishing member PP whose horizontal posture is adjusted by the transport device 60 through the first end effector 66A ( Figure 17 Step S206). Figure 19B As shown, the transport device 60 lowers the first end effector 66A via the lift drive 61, bringing each suction pad 681 into contact with the top surface of the polishing member PP. The suction mechanism 69 then causes each suction pad 681 to suction the polishing member PP. Meanwhile, the posture adjustment device 80 activates the rotation mechanism-side suction unit 84, releasing the suction of the polishing member PP from the worktable 82. This allows the transport device 60 to lift the polishing member PP from the worktable 82 without shifting its position as the lift drive 61 ascends.

[0139] Then, the transport device 60 carries the polishing member PP held by the first end effector 66A into the polishing member support unit 50 ( Figure 17Step S207). At this time, Figure 19C As shown, the transport device 60 moves the first end effector 66A in the negative direction of the Y axis (standby position) by the forward and backward driving unit 65. Figure 19D As shown, the transport device 60 rotates the base 63 and the first transport arm 64A (first end effector 66A) counterclockwise by 90° via the rotation drive unit 62. This allows the first end effector 66A to move in and out in the positive X-axis direction (detecting the in and out position of the main body 10).

[0140] Inside the detection body 10, the grinding component support unit 50 is pre-positioned below the entry / exit position by the moving unit 41. Therefore, after the transport device 60 moves the first end effector 66A in and out of the entry / exit position via the advance / retract drive unit 65, the first end effector 66A is lowered via the lifting drive unit 61. This allows the grinding component PP to be accurately placed on the support surface 52s of the grinding component support unit 50. Furthermore, after transporting the grinding component PP directly above the grinding component support unit 50, the controller 90 can raise the grinding component support unit 50, narrowing the gap between the grinding component PP and the grinding component PP, and transferring the grinding component PP from the first end effector 66A to the grinding component support unit 50. Alternatively, the controller 90 can be configured to operate both the grinding component support unit 50 and the first end effector 66A to transfer the grinding component PP.

[0141] After the polishing member PP is placed on the polishing member support unit 50, the controller 90 uses the unit-side adsorption portion 54 of the polishing member support unit 50 to adsorb the polishing member PP onto the support surface 52s ( Figure 17 In step S208, the inspection apparatus 1 can thereby automatically place the polishing member PP for replacement on the polishing member support unit 50. The inspection apparatus 1 can then polish the contact probes 33 of the probe card 32 using the polishing member PP.

[0142] The inspection device 1 can perform the above-described transport method (polishing component moving in and moving out) at appropriate times while inspecting the wafer W. The inspection device 1 can cause the first end effector 66A to hold and transport the polishing component PP alone. Alternatively, the inspection device 1 can implement the above-described transport method in a state where the wafer W is held on the upper surface of the first end effector 66A and the polishing component PP is held on the lower surface of the first end effector 66A.

[0143] In addition, the detection device 1, the loader 20, and the transport method are not limited to the above-mentioned embodiment, and various modifications are possible. For example, in the above-mentioned embodiment, the horizontal posture of the grinding component PP is adjusted by the posture adjustment device 80, but the detection device 1 may be a structure that transports the grinding component PP to the grinding component support unit 50 without passing through the posture adjustment device 80. As an example, the storage posture of the grinding component PP in the grinding component storage container 70 is adjusted (for example, Figure 3 Thus, even if the conveying device 60 conveys the polishing member PP without rotating it, the polishing member PP can be placed while the longitudinal direction of the supporting surface 52s of the polishing member supporting unit 50 and the longitudinal direction of the polishing member PP are aligned.

[0144] Furthermore, the first end effector 66A according to the above embodiment has a first holding portion 67 on its upper surface for holding the wafer W and a second holding portion 68 on its lower surface for holding the polishing member PP. However, the first end effector 66A may also have a first holding portion 67 on its lower surface and a second holding portion 68 on its upper surface. In this case, the suction pad 681 may be provided on the lower surface side of the first holding portion 67.

[0145] The loader 20 arranges the FOUP 29, the transport device 60, and the polishing component storage container 70 in parallel in a plan view, parallel to the longitudinal direction of the inspection body 10. However, this arrangement is not limited to this. For example, the loader 20 may be configured such that the FOUP 29 and the polishing component storage container 70 overlap in the vertical direction.

[0146] The technical ideas and effects of the present invention described in the above embodiments are as follows.

[0147] The first embodiment of the present invention involves a detection device 1 comprising a first table (substrate support unit 40) supporting a substrate (wafer W) in contact with a contact probe 33, a second table (grinding component support unit 50) arranged at an adjacent position to the first table supporting a grinding component PP capable of grinding the contact probe 33, a substrate storage portion (FOUP29) for storing substrates, a grinding component storage portion (grinding component storage container 70) for storing grinding components PP, and a conveying device 60 having a conveying arm 64, wherein the conveying arm conveys the substrate between the first table and the substrate storage portion and conveys the grinding component PP between the second table and the grinding component storage portion, and the conveying arm 64 has a first holding portion 67 capable of holding the substrate, and a second holding portion 68 capable of holding the grinding component PP at a position different from the first holding portion 67.

[0148] As described above, the inspection apparatus 1 can transport the substrate (wafer W) and the polishing part PP separately using the first holding portion 67 and the second holding portion 68 of the transport arm 64. This allows the inspection apparatus 1 to automatically replace the polishing part PP, reducing the user's burden associated with replacing the polishing part PP and improving work efficiency.

[0149] Furthermore, the transport arm 64 includes a flat-plate-shaped end effector 66. The end effector 66 has one or more suction ports 671 on its upper surface, forming one of the first holding portion 67 and the second holding portion 68, and one or more suction pads 681 on its lower surface, forming the other of the first holding portion 67 and the second holding portion 68. Thus, the inspection apparatus 1 can securely hold the wafer W (or polishing component PP) on its upper surface via the one or more suction ports 671, and can also securely hold the polishing component PP (or wafer W) on its lower surface via the one or more suction pads 681.

[0150] The end effector 66 also includes an ejector mechanism 696b that applies suction pressure to the polishing member PP to hold it via one or more suction pads 681 constituting the second holding portion 68. Thus, the inspection device 1 can more firmly hold the polishing member PP via the end effector 66.

[0151] Furthermore, the suction pad portion 681 includes a tapered pad body 682 that contacts the polishing member PP. The end effector 66 includes a suction passage (second suction passage 692) that communicates with the inner side of the pad body 682 and applies suction pressure to the pad body 682. This allows the detection device 1 to stably apply suction pressure within the pad body 682 in contact with the polishing member PP while also smoothly releasing suction.

[0152] Furthermore, the end effector 66 includes a base plate portion 661 and a pair of fork plates 662 protruding from the base plate portion 661. The suction pads 681 are provided on the base plate portion 661 and the pair of fork plates 662. Thus, the inspection device 1 can hold the polishing component PP entirely with the end effector 66, enabling more stable transport of the polishing component PP.

[0153] The apparatus further comprises a detection body 10 having a first table (substrate support unit 40) and a second table (polishing component support unit 50), and a loader 20 disposed adjacent to the detection body 10. The loader 20, in plan view, sequentially arranges a substrate storage unit (FOUP 29), a transport device 60, and a polishing component storage unit (polishing component storage container 70) in a direction parallel to the detection body 10. This allows the detection apparatus 1 to easily access both the substrate storage unit and the polishing component storage unit via the transport device 60.

[0154] The transport device 60 also includes a lift drive unit 61 that vertically lifts and lowers a transport arm 64, a rotation drive unit 62 that rotates the transport arm 64 about a vertical axis, and an advance / retract drive unit 65 that linearly advances and retracts the transport arm 64. Thus, the transport device 60 can smoothly transport substrates (wafers W) and polishing parts PP within the loader 20 and between the loader 20 and the inspection body 10.

[0155] Furthermore, the substrate storage section (FOUP 29) stores multiple substrates (wafers W) in a vertical direction, and the polishing component storage section (polishing component storage container 70) stores multiple polishing components PP in a vertical direction. The transport device 60 adjusts the height of the transport arm 64 by raising and lowering the lift drive 61, adjusts the forward and backward movement of the transport arm 64 by rotating the rotation drive 62, and brings the transport arm 64 into contact with the substrates in the substrate storage section or the polishing components PP in the polishing component storage section by advancing and retreating the forward and backward drive 65. Thus, the transport device 60 can smoothly transport wafers W between the substrate storage section and the polishing components PP between the polishing component storage section and the polishing component storage section.

[0156] Furthermore, the inspection body 10 includes a moving portion 41 that can horizontally move the first table (substrate support unit 40) and the second table (polishing component support unit 50). When moving polishing components PP in or out of the second table, the moving portion 41 positions the second table perpendicular to the polishing component storage section (polishing component storage container 70) with the transport device 60 as a base point. While the polishing components PP are being held by the transport arm 64, the transport device 60 rotates the transport arm 64 90°, thereby transporting the polishing components between the second table and the polishing component storage section. Consequently, the inspection device 1 can quickly and accurately transport polishing components PP between the polishing component storage section and the second table.

[0157] Furthermore, directly above the second table (the polishing member support unit 50), at least one of the transport arm 64 and the second table moves vertically, narrowing the gap between the polishing member PP and the second table. This allows the polishing member PP to be transferred from the transport arm 64 to the second table. This allows the inspection device 1 to accurately place the polishing member PP on the second table. Furthermore, the second table eliminates the need for support pins, etc., for receiving and delivering the polishing member PP, contributing to a simpler structure and lower costs.

[0158] The inspection apparatus 1 further includes a posture adjustment device 80 for adjusting the horizontal posture of the polishing member PP between the conveying device 60 and the polishing member storage portion (the polishing member storage container 70). By using the posture adjustment device 80, the inspection apparatus 1 can accurately place the polishing member PP on the second table (the polishing member support unit 50) and the polishing member storage container 70.

[0159] Furthermore, when the conveying device 60 conveys a used grinding component PP to the grinding component storage section (grinding component storage container 70) via the conveying arm 64, the grinding component PP is placed on the posture adjustment device 80 and rotated 90° in the longitudinal direction of the grinding component PP. When the conveying arm 64 conveys a replacement grinding component from the grinding component storage section, the grinding component PP is placed on the posture adjustment device 80 and rotated 90° in the longitudinal direction of the grinding component, while simultaneously adjusting the horizontal position of the grinding component PP. Thus, the detection device 1 can perform a short adjustment when the grinding component PP returns to the grinding component storage container 70, and can fully adjust the horizontal posture when conveying the grinding component PP to the second table (grinding component support unit 50), thereby improving positioning accuracy.

[0160] The posture adjustment device 80 includes a rotation mechanism 81 for rotating the polishing member PP at a predetermined angle and a clamp mechanism 86 for horizontally clamping the polishing member PP.

[0161] Furthermore, the rotation mechanism 81 includes a table 82 on which the polishing member PP is placed, and a rotational motion unit 83 for rotating the table 82. The clamping mechanism 86 includes sliding movable units 87 disposed on either side of the table 82. The pair of sliding movable units 87, via sliding bodies 89 that can move toward and away from each other, clamp the polishing member PP placed on the table 82, thereby adjusting the horizontal position of the polishing member PP. This allows the detection device 1 to more accurately adjust the horizontal position of the polishing member PP.

[0162] In addition, the loader 20 involved in the second embodiment of the present invention includes a substrate storage section (FOUP29) for storing a substrate (wafer W) that contacts the contact probe 33, a grinding component storage section (grinding component storage container 70) for storing a grinding component PP that can grind the contact probe 33, and a conveying device 60 having a conveying arm 64, wherein the conveying arm conveys the substrate between the first table (substrate support unit 40) supporting the substrate and the substrate storage section, and conveys the grinding component PP between the second table (grinding component support unit 50) supporting the grinding component PP at an adjacent position of the first table and the grinding component storage section, and the conveying arm 64 has a first holding section 67 that can hold the substrate, and a second holding section 68 that can hold the grinding component PP at a position different from the first holding section 67.

[0163] Furthermore, a third embodiment of the present invention relates to a transport method for an inspection apparatus 1, comprising a first table (substrate support unit 40) for supporting a substrate (wafer W) to be brought into contact with contact probes 33, a second table (polishing component support unit 50) provided adjacent to the first table for supporting a polishing component PP capable of polishing the contact probes 33, a substrate storage unit (FOUP 29) for storing substrates, a polishing component storage unit (polishing component storage container 70) for storing polishing components PP, and a transport device 60 having a transport arm 64 for transporting substrates between the first table and the substrate storage unit and for transporting polishing components PP between the second table and the polishing component storage unit. The method comprises the steps of transporting the substrate by holding it with a first holding portion 67 of the transport arm 64, and transporting the polishing component PP by holding it with a second holding portion 68 provided at a position of the transport arm 64 different from the first holding portion 67. The second and third embodiments can reduce the burden on the user and improve work efficiency.

[0164] The detection device 1, loader 20, and transport method disclosed herein are illustrative in all respects and are not intended to be limiting. The embodiments may be modified and improved in various ways without departing from the appended claims and their spirit. The various embodiments described above may be configured differently and combined to the extent consistent.

[0165] This application claims the benefit of priority from basic application No. 2023-2575, filed in the Japan Patent Office on January 11, 2023, the entire contents of which are incorporated herein by reference.

[0166] Reference numerals

[0167] 1. Detection device

[0168] 29FOUP

[0169] 33 contact probe

[0170] 40 substrate support units

[0171] 50 grinding parts support unit

[0172] 60 handling device

[0173] 64 transport arm

[0174] 70 Storage container for grinding parts

[0175] 67 1st maintenance unit

[0176] 68 Second Maintenance Unit

[0177] PP grinding parts

[0178] W wafer

Claims

1. A detection device comprising: The first table supports the substrate that contacts the contact probe, A second table is provided adjacent to the first table and supports a grinding member capable of grinding the contact probe. a substrate storage portion for storing the substrate, a polishing member storage portion for storing the polishing member, and a transport device having a transport arm, wherein the transport arm transports the substrate between the first table and the substrate storage portion and transports the polishing member between the second table and the polishing member storage portion; The transport arm includes a first holding portion capable of holding the substrate, and a second holding portion capable of holding the polishing member at a position different from that of the first holding portion.

2. The detection device according to claim 1, wherein the transport arm includes a flat end effector. The end effector has one or more suction ports constituting one of the first holding portion and the second holding portion on its upper surface, and one or more suction pads constituting the other of the first holding portion and the second holding portion on its lower surface. 3 . The detection device according to claim 2 , wherein the end effector includes an ejector mechanism that applies suction pressure to the polishing member by using one or more of the suction pads constituting the second holding portion to hold the polishing member.

4. The detection device according to claim 2, wherein the adsorption pad portion includes a tapered pad body that contacts the polishing member. The end effector has a suction passage therein that communicates with the inner side of the pad body and can apply suction pressure to the pad body.

5. The detection device according to claim 2, wherein the end effector comprises a base plate portion and a pair of fork plate portions protruding from the base plate portion. The adsorption pads are respectively provided on the base plate portion and the pair of fork plate portions.

6. The detection device according to any one of claims 1 to 5, comprising: a detection body having the first table and the second table, and A loader is provided at a position adjacent to the detection body, The loader is provided with the substrate storage portion, the transport device, and the polishing member storage portion in this order along a direction parallel to the detection main body portion in a plan view.

7. The detection device according to claim 6, wherein the transport device comprises: a lifting drive unit for lifting the transport arm in the vertical direction; a rotation drive unit for rotating the transport arm about a vertical axis, and An advance / retract drive unit that causes the transport arm to advance / retract linearly.

8. The detection device according to claim 7, wherein the substrate storage portion stores a plurality of the substrates in a vertical direction. The abrasive component storage portion stores a plurality of the abrasive components in a vertical direction. The transport device adjusts the height of the transport arm by raising and lowering the lifting drive unit, adjusts the forward and backward direction of the transport arm by rotating the rotating drive unit, and makes the transport arm contact the substrate in the substrate storage unit or the grinding component in the grinding component storage unit by advancing and retreating the forward and backward drive unit.

9. The detection device according to claim 6, wherein the detection body has a moving portion capable of moving the first table and the second table in a horizontal direction. When the moving portion carries the polishing member in or out relative to the second table, the second table is arranged in a direction perpendicular to the polishing member storage portion with the transport device as a base point. The conveying device conveys the polishing member between the second table and the polishing member storage portion by rotating the conveying arm 90 degrees while the polishing member is being held by the conveying arm.

10. The detection device according to claim 9, wherein the conveying arm that conveys the grinding component to the position directly above the second table and at least one of the second table moves in the vertical direction to reduce the gap between the grinding component and the second table, thereby transferring the grinding component from the conveying arm to the second table.

11. The detection device according to any one of claims 1 to 5, wherein: A posture adjusting device is provided between the conveying device and the polishing member storage portion for adjusting the horizontal posture of the polishing member.

12. The detection device according to claim 11, wherein when the conveying device conveys the used grinding member to the grinding member storage portion via the conveying arm, the conveying device places the grinding member on the posture adjusting device so as to rotate the longitudinal direction of the grinding member by 90 degrees. When the conveying device conveys the replacement grinding component from the grinding component storage portion via the conveying arm, the conveying device places the grinding component on the posture adjusting device, rotates the longitudinal direction of the grinding component by 90 degrees, and adjusts the horizontal position of the grinding component.

13. The detection device according to claim 11, wherein the posture adjustment device comprises: a rotating mechanism for rotating the grinding member at a specified angle, and A clamping mechanism for clamping the grinding component in a horizontal direction.

14. The detection device according to claim 13, wherein the rotating mechanism comprises a table on which the polishing member is placed and a rotating operation unit for rotating the table. The clamping mechanism has a sliding movable portion provided on both sides of the workbench. The sliding movable parts on both sides sandwich the polishing member placed on the table via sliding bodies that are movable in directions approaching and separating from each other, thereby adjusting the horizontal posture of the polishing member.

15. A loader comprising: a substrate storage portion for storing a substrate to be brought into contact with a contact probe; a polishing member storage portion for storing a polishing member capable of polishing the contact probe, and a transport device having a transport arm, wherein the transport arm transports the substrate between a first table supporting the substrate and the substrate storage portion, and transports the polishing member between a second table provided at a position adjacent to the first table and supporting the polishing member and the polishing member storage portion, The transport arm includes a first holding portion capable of holding the substrate, and a second holding portion capable of holding the polishing member at a position different from that of the first holding portion.

16. A method for transporting a detection device, the detection device comprising: The first table supports the substrate that contacts the contact probe, A second table is provided adjacent to the first table and supports a grinding member capable of grinding the contact probe. a substrate storage portion for storing the substrate, a polishing member storage portion for storing the polishing member, and a transport device having a transport arm, wherein the transport arm transports the substrate between the first table and the substrate storage portion and transports the polishing member between the second table and the polishing member storage portion; The transport method has the following features: a step of holding the substrate by the first holding portion of the transport arm and transporting the substrate; and A step of holding the polishing member by a second holding portion provided at a position different from the first holding portion of the transport arm, and transporting the polishing member.

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