Light emitting device and manufacturing method thereof

Abstract

The light-emitting device has a barrier material disposed around the LED element, the barrier material containing a base resin, a first particle size filler, and a second particle size filler, the barrier material containing 10-50 wt% of the first particle size filler with respect to the base resin, the first particle size filler having an average particle size of 1-100 [mu] m, the barrier material containing 4-15 wt% of the second particle size filler with respect to the base resin, and the second particle size filler having an average particle size of 1-100 [mu] m. The average particle diameter of the second particle diameter filler is 1-500 nm, and the barrier material has cut side surfaces.

Description

Technical Field

[0001] The present disclosure relates to a light emitting device and a method for manufacturing the same. Background Art

[0002] From the viewpoint of preventing deterioration of shape retention properties, the barrier material in the light-emitting device preferably has a certain degree of viscosity. For this reason, it is known to use inorganic particles imparting thixotropy (see, for example, Japanese Patent Application Laid-Open No. 2009-135485). Summary of the Invention

[0003] However, Japanese Patent Application Laid-Open No. 2009-135485 does not describe a barrier material containing a substance that is good in both the barrier material's shape-retaining property and the barrier material's cuttability.

[0004] An object of the present disclosure is to provide a light-emitting device in which both the shape-retaining property of a barrier material and the cuttability of the barrier material are improved by adding two types of inorganic particles.

[0005] The light-emitting device disclosed herein comprises: a substrate, an LED element mounted on the substrate, a barrier material arranged around the LED element, and a sealing material arranged on the inner side of the barrier material and sealing the LED element, wherein the barrier material comprises a base resin, a first particle size filler, and a second particle size filler, the barrier material containing 10 to 50 wt% of the first particle size filler relative to the base resin, the average particle size of the first particle size filler being 1 to 100 μm, the barrier material containing 4 to 15 wt% of the second particle size filler relative to the base resin, the average particle size of the second particle size filler being 1 to 500 nm, and the barrier material having a cut side surface.

[0006] In the light-emitting device of the present disclosure, the ratio of the bottom width of the barrier material to the height of the barrier material is preferably 0.6 to 4.0.

[0007] In the light emitting device of the present disclosure, it is preferable that the surface of the barrier material facing the LED element has a convex shape that curves toward the LED element.

[0008] In the light emitting device of the present disclosure, the hardness of the barrier material is preferably D65 to D74 on the Shore A scale.

[0009] In the light-emitting device of the present disclosure, it is preferred that the barrier material further include titanium oxide, and the barrier material contains 10 to 70 wt % of titanium oxide based on the base resin.

[0010] In the light emitting device of the present disclosure, the barrier material preferably includes a first frame portion and a second frame portion disposed on an upper surface of the first frame portion, and the first and second frame portions preferably have the same height to bottom width ratio.

[0011] The light emitting device of the present disclosure preferably further includes a lead wire for supplying power to the LED element, and a portion of the lead wire is covered with a barrier material.

[0012] In the light-emitting device of the present disclosure, the barrier material preferably has light-transmitting properties.

[0013] In the light-emitting device disclosed herein, the substrate preferably has a rectangular planar shape having two pairs of sides, and the blocking material has a pair of first frame portions arranged along one side of the two pairs of sides, a pair of second frame portions arranged on the upper surfaces of each of the pair of first frame portions, and a pair of third frame portions arranged along the other side of the two pairs of sides.

[0014] In the light-emitting device disclosed herein, the substrate preferably has a rectangular planar shape having a pair of long sides and a pair of short sides shorter than the pair of long sides, a pair of first frame portions and a pair of second frame portions are arranged along the pair of long sides, and a pair of third frame portions are arranged along the pair of short sides.

[0015] In the light emitting device of the present disclosure, preferably, both ends of the pair of third frame portions are disposed on upper surfaces at both ends of the pair of first frame portions, and both ends of the pair of second frame portions are disposed on upper surfaces at both ends of the pair of third frame portions.

[0016] The light emitting device of the present disclosure preferably further includes a conductive wiring pattern disposed on the upper surface of the substrate so as to be surrounded by a barrier material, the LED element is disposed on the upper surface of the wiring pattern, and the barrier material covers the outer periphery of the wiring pattern.

[0017] In the light-emitting device of the present disclosure, the barrier material preferably further includes a phosphor that is disposed so as to cover the upper surface of the substrate and converts the wavelength of light emitted from the LED element 14 .

[0018] In the light-emitting device of the present disclosure, the barrier material preferably further includes a first frame portion disposed on the substrate and containing the phosphor, and a second frame portion disposed on an upper surface of the first frame portion and containing a filler having a first particle size and a filler having a second particle size.

[0019] The light-emitting device of the present disclosure preferably further includes a phosphor layer that is disposed between the barrier material and the substrate so as to cover the upper surface of the substrate and contains a phosphor that converts the wavelength of light emitted from the LED element.

[0020] In the light emitting device of the present disclosure, the substrate preferably has a recess formed therein, the recess having a bottom surface and side surfaces arranged to surround the bottom surface, the LED element is arranged on the bottom surface of the recess, and the barrier material is arranged to surround the recess.

[0021] The manufacturing method of the light-emitting device disclosed in the present invention includes: a process of mounting an LED element on the surface of an aggregate substrate, a process of disposing a barrier material from a dispenser around the LED element, a process of disposing a sealing material for sealing the LED element on the inner side of the barrier material, and a process of cutting the cured barrier material, wherein the barrier material comprises a base resin, a first particle size filler, and a second particle size filler, the barrier material containing 10 to 50 wt% of the first particle size filler relative to the base resin, the average particle size of the first particle size filler is 1 to 100 μm, and the barrier material contains 4 to 15 wt% of the second particle size filler relative to the base resin, the average particle size of the second particle size filler is 1 to 500 nm.

[0022] In the method for manufacturing a light-emitting device of the present disclosure, it is preferable that, in the step of cutting the barrier material, the barrier material is cut from the surface side of the collective substrate on which no LED elements are mounted.

[0023] In the method for manufacturing a light emitting device of the present disclosure, the light emitting device preferably further includes a conductive wire for supplying power to the LED element, and in the barrier material forming step, the barrier material is formed so as to cover a portion of the conductive wire.

[0024] In the light-emitting device and the manufacturing method thereof disclosed herein, it is possible to provide a light-emitting device having both excellent shape retention properties of the barrier material and excellent cuttability of the barrier material by adding two types of inorganic particles. BRIEF DESCRIPTION OF THE DRAWINGS

[0025] Figure 1 It is a plan view of the light emitting device 1 according to the first embodiment. Figure 2 It is along Figure 1 Cross-sectional view along line AA'. Figure 3 yes Figure 2 Magnified view of part B. Figure 4 This is a flowchart showing an example of the flow of a method for manufacturing the light emitting device 1 . Figure 5 (A) to (E) are schematic diagrams for explaining the respective steps of the method for manufacturing the light emitting device 1 . Figure 6 This is a diagram showing an example of an aggregate substrate used in a method of manufacturing the light-emitting device 1 ′. Figure 7 (A) to (C) are schematic diagrams for explaining the respective steps of the method for manufacturing the light emitting device 1 ′. Figure 8 It is a cross-sectional view of a light emitting device 2 according to the second embodiment. Figure 9 It is a plan view of a light emitting device 3 according to a third embodiment. Figure 10 yes Figure 9 Cross-sectional view of part C. Figure 11 It is a plan view of a light emitting device 4 according to a fourth embodiment. Figure 12 It is along Figure 11 Cross-sectional view of the CC' line. Figure 13 It is along Figure 11 Cross-sectional view of line DD'. Figure 14 It is a cross-sectional view of a light emitting device 5 according to a fifth embodiment. Figure 15 It is a cross-sectional view of a light emitting device 6 according to a sixth embodiment. Figure 16 It is a cross-sectional view of a light emitting device 7 according to the seventh embodiment. Figure 17 This is a diagram for explaining the relationship between the mixing amount of the first particle size filler and the hardness. Figure 18 This is a diagram for explaining the relationship between the mixing amount of the second particle size filler and the viscosity. DETAILED DESCRIPTION

[0026] The following describes embodiments of the invention with reference to the accompanying drawings. However, it should be noted that the technical scope of the present invention is not limited to these embodiments and extends to the inventions set forth in the claims and their equivalents. Furthermore, for ease of description, the sizes, number of repetitions, and positional relationships of components shown in the drawings may be exaggerated or omitted.

[0027] Figure 1 is a top view of the light emitting device 1 according to the first embodiment. Figure 2 It is along Figure 1 The cross-sectional view of line AA', Figure 3 yes Figure 2 Magnified view of part B.

[0028] The light emitting device 1 includes a substrate 11 , a wiring pattern 12 , an electrode 13 , a single LED element 14 , a barrier material 15 , a sealing material 16 , bonding wires 17 and 18 , and the like.

[0029] Substrate 11 is formed from an electrically insulating resin such as phenolic resin, epoxy resin, polyimide resin, or polyester resin into a rectangular flat plate having a pair of long sides 111 and 112 and a pair of short sides 113 and 114 that are shorter than long sides 111 and 112. The thickness of substrate 11 is, for example, 200 μm. Substrate 11 may also be made of a ceramic material such as alumina or aluminum nitride.

[0030] The wiring pattern 12 has a flat first wiring 121 and a second wiring 122, which are arranged to be separated from each other on the upper surface of the substrate 11 and surrounded by a barrier material 15. The first wiring 121 and the second wiring 122 have a rectangular planar shape and are formed of silver. The first wiring 121 and the second wiring 122 have an area capable of arranging bonding wires 17 and 18, and the bonding wires 17 and 18 can be electrically connected to the LED element 14. In addition, the spacing distance between the first wiring 121 and the second wiring 122 has a length greater than a distance for maintaining sufficient insulation. By ensuring an area in which the bonding wires can be arranged for the first wiring 121 and the second wiring 122, and spacing the first wiring 121 and the second wiring 122 greater than the insulation distance, the substrate 11 has a rectangular planar shape with the arrangement direction of the first wiring 121 and the second wiring 122 as the length direction. Figure 1 In the example shown, first wiring 121 and second wiring 122 are arranged side by side along the longitudinal direction of substrate 11. The thickness of first wiring 121 and second wiring 122 is, for example, 50 μm. Alternatively, wiring pattern 12 may be formed of another conductive material such as gold, copper, or aluminum that reflects light from LED element 14.

[0031] The electrode 13 includes a first electrode 131 and a second electrode 132 that are separated from each other on the lower surface of the substrate 11. The first electrode 131 and the second electrode 132 are formed of a conductor such as gold or copper. The first electrode 131 is connected to the substrate 11 via a through hole (in the bottom) that passes through the substrate 11. Figure 1 Similarly, the second electrode 132 is connected to the first wiring 121 via a through hole (indicated by a dotted line) that passes through the substrate 11 from top to bottom. Figure 1 The first electrode 131 and the second electrode 132 are electrically connected to the second wiring 122. The first electrode 131 and the second electrode 132 are connected to an external power source (not shown) for supplying power to the LED element 14 via the wiring pattern 12.

[0032] LED element 14 is fixed to the upper surface of second wiring 122 by die bonding (not shown) using a bonding material such as resin paste, silver paste, or solder, and is positioned on the upper surface of second wiring 122. LED element 14 is, for example, a blue LED composed of an InGaN-based compound semiconductor that emits light with a wavelength of 440-455 nm. A pair of element electrodes is provided on upper surface 141 of LED element 14. The first element electrode is connected to first wiring 121 via bonding wire 17, and the second element electrode is connected to second wiring 122 via bonding wire 18. The bonding material may slightly protrude from LED element 14.

[0033] LED element 14 has, for example, a roughly rectangular parallelepiped shape with vertical and horizontal sides measuring 650 μm and a height of 260 μm. LED element 14 emits light as current is supplied between first wiring 121 and second wiring 122 from an external power source. LED element 14 is not limited to a blue LED; for example, it may be a violet LED, a near-ultraviolet LED, or an infrared LED. Its emission wavelength band may also be within the range of approximately 200-440 nm, including the ultraviolet region, or within the range of approximately 780-5000 nm, including the infrared region.

[0034] The barrier material 15 is arranged in a rectangular shape on the upper surface of the substrate 11 along the outer periphery of the substrate 11 so as to surround the LED element 14 and the first wiring 121 and the second wiring 122. The barrier material 15 is a white resin formed by dispersing titanium oxide (TiO2) particles in a base resin such as silicone resin or epoxy resin, and has the function of reflecting light from the LED element 14. In addition, as Figure 3 As shown, the barrier material 15 further includes a first particle size filler 19 and a second particle size filler 20. As will be described later, the left and right sides of the barrier material 15 are cut side surfaces 21. The barrier material 15 does not necessarily need to include titanium oxide (TiO2) particles.

[0035] Alternatively, the surfaces of the first and second wirings 121 and 122 may be roughened by irradiating plasma or the like. Roughening the surfaces of the first and second wirings 121 and 122 can prevent the barrier material 15 from unintentionally climbing onto and spreading the surfaces of the first and second wirings 121 and 122.

[0036] The first particle size filler 19 is an inorganic particle such as silica, iron oxide, or aluminum oxide, with an average particle size of 1 to 100 μm. The cured barrier material 15 in the finished light-emitting device 1 contains 10 to 50 wt% of the first particle size filler 19 relative to the base resin. The inclusion of the first particle size filler 19 in the barrier material increases the hardness of the cured barrier material 15. If the barrier material contains less than 10 wt% of the first particle size filler 19, the barrier material's hardness is insufficient, resulting in burrs and other issues during cutting, making it difficult to maintain a good product appearance. On the other hand, if the barrier material contains more than 50 wt% of the first particle size filler 19, the bearing effect of the particles makes it difficult to maintain the desired shape of the barrier material. Therefore, in order to achieve a good cut side surface, the cured barrier material 15 in the finished light-emitting device 1 contains 10 to 50 wt% of the first particle size filler 19 relative to the base resin. This will be described in detail later.

[0037] The second particle size filler 20 is an inorganic particle such as silica, silicon dioxide, iron oxide, or aluminum oxide, and has an average particle size of 1 to 500 nm. The cured barrier material 15 in the completed light-emitting device 1 contains 4 to 15 wt% of the second particle size filler 20 relative to the base resin. The inclusion of the second particle size filler 20 in the barrier material 15 increases its viscosity during manufacturing, maintaining the inter-particle spacing at high viscosity and maintaining a shape that is tall in height and small in width. If the barrier material contains less than 4 wt% of the second particle size filler 20, the viscosity of the barrier material before curing is insufficient, making it difficult to maintain the desired shape. On the other hand, if the barrier material contains more than 15 wt% of the second particle size filler 20, the viscosity becomes excessively high, causing clogging in the application nozzle and making it difficult to apply the resin used to form the barrier material. Therefore, in order to achieve the desired barrier shape in the light-emitting device 1, the cured barrier material 15 in the completed light-emitting device 1 contains 4 to 15 wt% of the second particle size filler 20 relative to the base resin. This will be described in detail later. In addition, the second particle size filler 20 preferably has a particle size of 50 to 500 m 2 / g specific surface area.

[0038] The average particle size of the first and second particle size fillers 19, 20 described above is measured by the following method. For the first particle size filler 19, the barrier material 15 is first cut, and the cut surface is observed using an electron microscope. At this point, 50 first particle size fillers are selected within a 500 μm² range, and the average value of the major diameters of the first particle size fillers is used as the average particle size. Similarly, for the second particle size filler 20, the barrier material 15 is first cut, and the cut surface is observed using an electron microscope. At this point, 50 second particle size fillers are selected within a 100 μm² range, and the average value of the major diameters of the second particle size fillers is used as the average particle size.

[0039] The sealing material 16 is a translucent resin such as epoxy resin or silicone resin. The sealing material 16 fills the area surrounded by the barrier material 15 at least to a height where the upper surface 141 of the LED element 14 is not exposed, thereby sealing the LED element 14. A phosphor that converts the wavelength of light from the LED element 14 is mixed into the sealing material 16. As such a phosphor, a yellow phosphor such as YAG (Yttrium Aluminum Garnet) is mixed into the sealing material 16. The light-emitting device 1 emits white light obtained by mixing the blue light from the LED element 14, which is a blue LED, and the yellow light obtained by exciting the yellow phosphor with the blue light. In addition, Figures 1 to 3 In the figure, the sealing material 16 is shown as transparent, and the same applies to the following descriptions.

[0040] The yellow phosphor mentioned above is an example, and the sealing material 16 may also contain other phosphors. For example, the sealing material 16 may also contain both a green phosphor and a red phosphor. In this case, the light emitting device 1 emits white light obtained by mixing the blue light from the LED element 14, which is a blue LED, and the green light and red light obtained by exciting the green phosphor and the red phosphor. As the green phosphor, (BaSr)2SiO4:Eu can be used, which absorbs the blue light emitted by the LED element 14 and converts its wavelength into green light. 2+ As a red phosphor, CaAlSiN3:Eu2 can be used, which absorbs the blue light emitted by the LED element 14 and converts its wavelength into red light. 2+ Alternatively, the red phosphor may be KSF.

[0041] The green and red phosphors described above are examples. Sealing material 16 may also contain a small amount of green or red phosphor added to the yellow phosphor described above. In this case, light-emitting device 1 uses a mixture of blue light from LED element 14, which is a blue LED, and yellow light excited by the blue light, resulting in the yellow phosphor, as the basis for white light, and similarly excited green and red light are also mixed. This allows for the emission of white light with improved color rendering, although not as in the aforementioned combination.

[0042] In addition, the sealing material 16 may also contain fillers. If fillers are added, light can be scattered. Therefore, a luminous characteristic with wide directivity can be obtained. When there is no filler or the filler is small, a luminous characteristic with narrow directivity and strong light emitted directly above the light-emitting element can be obtained, so it is preferred. In addition, the phosphor can also be precipitated and contact the substrate surface, thereby facilitating the adjustment of the chromaticity. Furthermore, the sealing material 16 can also be set as a two-layer structure in which a layer obtained by precipitating the phosphor is provided on the lower layer and a filler layer with a small amount of phosphor is formed on the upper layer. By forming a two-layer structure, the color of the phosphor in the appearance of the sealing material 16 can be made thinner.

[0043] Figure 4 is a flowchart showing an example of the process of a method for manufacturing the light emitting device 1. Figure 5 (A)~ Figure 5 (E) is a schematic diagram for explaining each step of the manufacturing method of the light emitting device 1. Figure 4 and Figure 5 In the description, a plurality of light-emitting devices 1 are manufactured simultaneously, but a single light-emitting device 1 may be manufactured.

[0044] First, in the assembly substrate and wiring preparation process, such as Figure 5As shown in (A), a substrate assembly 110 having a plurality of wiring patterns 12 and electrodes 13 is prepared in advance (step S101). The wiring patterns 12 and electrodes 13 are arranged at predetermined locations on the upper and lower surfaces of substrate 11a, respectively, by, for example, electroless silver plating, and are electrically connected to each other. The term "substrate assembly" refers to the state of the integrated substrates 11 before they are cut.

[0045] Next, in the LED element placement process, as shown in FIG. Figure 5 As shown in FIG. 1B , LED elements 14 are mounted on the upper surface of each second wiring 122 of the assembly substrate 110 by die bonding or the like (step S102 ). Furthermore, in the LED element placement step, bonding wires 17 are arranged to connect the first element electrodes of the LED elements 14 to the first wiring 121, and bonding wires 18 are arranged to connect the second element electrodes of the LED elements 14 to the second wiring 122. Because the LED elements 14 are mounted on the wiring pattern 12 before the barrier material 15 is placed, they can be easily mounted even if the size of the light-emitting device 1 is reduced and the spacing between adjacent LED elements 14 is narrowed.

[0046] Next, in the barrier material disposition step, as Figure 5 As shown in (C), a barrier material 15 is arranged on the upper surface of the collective substrate 110 in a manner that surrounds each wiring pattern 12 and the LED element 14 (step S103). First, white resin droplets are prepared in which titanium oxide particles, a first particle size filler 19, and a second particle size filler 20 are dispersed in a thermosetting base resin such as a silicone resin. Then, white resin droplets are applied from a nozzle (not shown) on the collective substrate 110 in a manner that surrounds the wiring pattern 12 and the LED element 14. Then, the applied resin droplets are heated to solidify them, thereby forming the barrier material 15. The barrier material 15 before solidification is soft, so it can cover the bonding wire 17 or the bonding wire 18, and even if there is a bonding wire 17 or the bonding wire 18, it can be arranged close to the LED element 14. In addition, the height of the barrier material 15 is preferably higher than the LED element 14. With such a configuration, the directivity of the light-emitting device 1 can be narrowed.

[0047] By heating, the base resin of the barrier material 15 is volatilized, and the mass of the base resin is reduced by 0 to 10% compared to before curing. At this time, the inner peripheral surface of the barrier material 15 becomes a curved surface due to the surface tension of the resin droplets (see Figure 3The upper surface of the barrier material 15 can also be flattened by pressing the upper surface of the barrier material 15 during or after curing. Furthermore, if a convex shape is provided on the pressing jig, a depression can be formed on the pressing surface. This depression can serve as a polarity marker. Furthermore, the aspect ratio of the bottom width of the barrier material 15 relative to its height during curing and before cutting is preferably in the range of 0.6 to 1.1, and in one example, 0.83.

[0048] Next, in the sealing material filling process, as Figure 5 As shown in (D), the sealing material 16 is placed in each area surrounded by the barrier material 15 to a height where the upper surface 141 of the LED element 14 is not exposed (step S104). The placed (or filled) sealing material 16 is heated and cured.

[0049] Finally, in the cutting process, Figure 5 As shown in (E), the collective substrate 110 is cut into individual pieces at approximately the center (position D1) of each barrier material 15 to produce the light-emitting device 1 (step S105). This forms cut side surfaces 21 on the outer side surfaces of the barrier materials 15. The aspect ratio of the bottom width to the height of the cut barrier materials 15 is preferably in the range of 1.0 to 2.4, more preferably in the range of 1.6 to 2.0. In one example, it is 1.94.

[0050] The cutting process is preferably performed from the surface of the collective substrate 110 on which the LED elements 14 are not mounted. As will be described later, if the hardness of the barrier material 15 is set to Shore D hardness 65 to 74, cutting can be performed from the back side of the collective substrate 110 without damaging the sealing material 16. By cutting from the surface of the collective substrate 110 on which the LED elements 14 are not mounted, the generation of burrs on the substrate 11 can be suppressed. The burrs on the substrate 11 cause tilting when the light-emitting device 1 is mounted on a heat sink, etc., which worsens the heat absorption and leads to a decrease in luminous efficiency. By maintaining the barrier material 15 at a Shore D hardness harder than usual, even if cutting is performed from the surface of the collective substrate 110 on which the LED elements 14 are not mounted, peeling of the resin will not occur.

[0051] Figure 6 This is a top view of an example of an assembly substrate 110 used to manufacture a light-emitting device 1', which is a variation of the light-emitting device 1. The light-emitting device 1' differs from the light-emitting device 1 only in the width of the barrier material 15'. The remaining components are identical to the light-emitting device 1 and are therefore denoted by the same reference numerals and their descriptions omitted. Furthermore, the materials and other components of the barrier material 15' are also identical to those of the barrier material 15. The assembly substrate 110 itself is identical to the assembly substrate 110 used for the light-emitting device 1 and is pre-disposed with a plurality of first wirings 121 and second wirings 122.

[0052] Figure 7 (A)~ Figure 7 (C) is a schematic diagram for explaining each step of the manufacturing method of the light emitting device 1'. Figure 5 (A) and Figure 5 The description is omitted because it is the same as (B).

[0053] In the barrier material configuration process, such as Figure 7 As shown in (A), on the upper surface of the collective substrate 110, along Figure 6 The barrier material 15 ′ is arranged as shown by arrows 201 and 202 . The barrier material 15 ′ is arranged between the wiring patterns. Thus, the barrier material 15 does not meander, and the barrier material 15 ′ is arranged to surround each LED element 14 .

[0054] Next, in the sealing material filling process, as Figure 7 As shown in FIG. 1B , the sealing material 16 is placed in each region surrounded by the barrier material 15 ′ to a height where the upper surface 141 of the LED element 14 is not exposed. The placed (or filled) sealing material 16 is heated and cured.

[0055] Finally, in the cutting process, Figure 7 As shown in (C), the light emitting device 1' is manufactured by cutting the collective substrate 110 into individual pieces at the approximate center portion (position D1') of each barrier material 15'. As a result, a cut side surface 21 is formed on the outer side surface of the barrier material 15'. In the light emitting device 1', since the width of the barrier material 15' is different, the end portion of the barrier material 15' is formed to contact a portion of the first wiring 121 and the second wiring 122. Figure 7 As shown in FIG. 1 (C), in a light-emitting device 1', a modified example of light-emitting device 1, the width of barrier material 15' is wide, so the ends of barrier material 15' contact first wiring 121 and second wiring 122. This minimizes the deviation between wiring pattern 12 and electrode 13, enabling precise positioning. While barrier material 15 is positioned relative to wiring pattern 12, it is cut relative to electrode 13 during dicing, allowing the center of barrier material 15 to be cut.

[0056] Figure 8 : is a cross-sectional view of the light emitting device 2 according to the second embodiment. Figure 8 In, with Figures 1 to 3 The same components as those of the light emitting device 1 are denoted by the same reference numerals and their descriptions are omitted. The light emitting device 2 differs from the light emitting device 1 only in the shape of the barrier material 15a.

[0057] The barrier material 15a of the light-emitting device 2 contains the same base resin, titanium oxide particles, first-size filler 19, and second-size filler 20 as barrier material 15. The difference lies in the fact that it is formed from a first frame portion 151 and a second frame portion 152. First, white resin droplets, similar to those used in barrier material 15, are applied to form first frame portion 151. After treatment to flatten the top of first frame portion 151, the material is heated to cure. Next, white resin droplets are further applied to the top surface of the flattened first frame portion 151. The applied resin droplets are heated to cure, forming second frame portion 152. At this point, the inner circumference of second frame portion 152 becomes curved due to the surface tension of the resin droplets. Furthermore, since the top surface of first frame portion 151 of the first barrier layer is flat, the resin droplets are prevented from flowing down the sides of first frame portion 151. In this manner, two layers of barrier material 15a are arranged on the top surface of substrate 11. In the barrier material 15 , since there is no need to specially form the connection portion between the first frame portion 151 and the second frame portion 152 , the barrier material 15 a can be manufactured simply.

[0058] Alternatively, the upper surface of the second frame portion 152 can be formed flat by pressing the upper surface of the second frame portion 152 during or after the second frame portion 152 is cured. When the upper surface of the second frame portion 152 is formed flat, even if the cutting position for unilateral cutting is slightly offset, the height of the barrier material 15 after cutting will not be affected, and a light-emitting device 2 of uniform quality can be manufactured. By pressing, the curvature of the inner circumference of the first frame portion 151 and the second frame portion 152 can be adjusted. For example, if pressed hard, the center of the curvature can be moved from the substrate surface toward the vertex of the barrier, and the width of the barrier material in the lateral and height range of the LED element 14 increases, so that light does not leak from the side.

[0059] As described above, by adopting a structure in which multiple frame portions are stacked within the barrier material 15a, the height of the product can be adjusted. The bottom width of the second frame portion 152 is the same as the width of the flat portion of the upper surface of the first frame portion 151. If the aspect ratio of the bottom width relative to the height of the first frame portion 151 and the second frame portion 152 is made the same, the height of the barrier of the second frame portion 152 can be controlled by utilizing the width of the flat portion of the upper surface of the first frame portion 151. The total height of the first frame portion 151 and the second frame portion 152 can also be the same as the height of the barrier material 15. Alternatively, the width of the first frame portion 151 can also be the same as the width of the barrier material 15.

[0060] The inclination angle (θ) formed between the tangent plane connecting the inner curved surface of the first frame portion 151 and the inner curved surface of the second frame portion 152 and the substrate 11 is preferably 65 degrees or greater and 75 degrees or less, more preferably 70 degrees or greater and 75 degrees or less. By setting the inclination angle (θ) of the tangent plane to 65 degrees or greater and 75 degrees or less, most of the light emitted horizontally from the LED element 14 is reflected vertically upward by the barrier material 15. This improves the light extraction efficiency of the light-emitting device 1 and suppresses the expansion of the light beam emitted from the light-emitting device 1 to the outside. Furthermore, by setting the inclination angle (θ) of the tangent plane to 65 degrees or greater and 75 degrees or less, most of the light emitted horizontally from the LED element 14 is reflected vertically upward by the barrier material 15. This improves the light extraction efficiency of the light-emitting device 2 and suppresses the expansion of the light beam emitted from the light-emitting device 1 to the outside, thereby improving the optical characteristics of the light-emitting device 2.

[0061] Figure 9 is a top view of a light emitting device 3 according to a third embodiment. Figure 10 yes Figure 9 Section C of the Figure 7 and Figure 10 In, with Figures 1 to 3 Components identical to those in the illustrated light-emitting device 1 are denoted by the same reference numerals, and their descriptions are omitted. Light-emitting device 3 differs from light-emitting device 1 only in that the bonding wire 17 and first wiring 121 are covered by barrier material 15b due to the different shape of barrier material 15b. Barrier material 15b is composed of the same components as barrier material 15 in light-emitting device 1.

[0062] In the light emitting device 3, the barrier material 15b is arranged close to the LED element 14, as shown in FIG. Figure 10 As shown, the barrier material 15b has an inwardly convex shape, so a portion of the bonding wire 17 is covered by the barrier material 15b. Since the barrier material 15b is placed after wire bonding, it can cover a portion of the bonding wire 17 or 18. This allows the light-emitting device 3 to have a more compact structure. Furthermore, although the bonding wire 17 or 18 is covered by both the barrier material 15b and the sealing material 16, the barrier material 15b and the sealing material 16 have the same hardness, preventing wire breakage caused by stress during curing.

[0063] As described above, by covering a portion of the bonding wire 17 or 18 with the barrier material 15 b , the barrier material 15 b can be brought closer to the LED element 14 , thereby narrowing the directivity of the light emitting device 3 .

[0064] Figure 11 is a top view of a light emitting device 4 according to a fourth embodiment. Figure 12 It is along Figure 11 The cross-sectional view of the CC' line, Figure 13 It is along Figure 11 The cross-sectional view of the DD' line. Figures 11-13 In, with Figures 1 to 3 The same components as those of the light emitting device 1 are denoted by the same reference numerals, and their description is omitted. The light emitting device 4 differs from the light emitting device 1 only in the shape of the barrier material 15c.

[0065] The base resin, titanium oxide particles, first particle size filler 19, and second particle size filler 20 contained in barrier material 15c of light-emitting device 4 are the same as those of barrier material 15. However, the barrier material 15c is formed of a pair of first frame portions 153, a pair of second frame portions 154, and a pair of third frame portions 155. The pair of first frame portions 153 are arranged along the pair of long sides 111 and 112 of substrate 11. The pair of second frame portions 154 are arranged on the upper surfaces of the pair of long sides 111 and 112, respectively. The pair of third frame portions 155 are arranged along the pair of short sides 113 and 114 of substrate 11. The ends of the pair of third frame portions 155 are arranged on the upper surfaces of the pair of first frame portions 153, and the ends of the pair of second frame portions 154 are arranged on the upper surfaces of the pair of third frame portions 155.

[0066] When viewing the light-emitting device 4 from above, the width of the third frame portion 155 is greater than that of the first frame portion 153. The width of the third frame portion 155 is preferably not less than 150% and not more than 200% of the width of the first frame portion 153. If the width of the third frame portion 155 is less than 150% of the width of the first frame portion 153, it is difficult to increase the height of the third frame portion 155. Furthermore, if the width of the third frame portion 155 is greater than 200% of the width of the first frame portion 153, the amount of coating applied to the third frame portion 155 increases, increasing manufacturing costs.

[0067] First, white resin droplets, similar to those used for barrier material 15, are applied to form a pair of first frame portions 153 along the pair of long sides 111 and 112 of substrate 11. After processing to flatten the tops of first frame portions 153, they are heated and cured. Next, white resin droplets, similar to those used for barrier material 15, are applied to form a pair of third frame portions 155 along the pair of short sides 113 and 114 of substrate 11. After processing to flatten the tops of third frame portions 155, they are heated and cured. Next, white resin droplets are further applied to the tops of the flattened first frame portions 153. Processing to flatten the tops of second and third frame portions 154 and 155 is performed, and then heated and cured, thereby forming second frame portion 154. At this point, the inner and outer circumferential surfaces of second frame portion 152 are curved due to the surface tension of the resin droplets. Furthermore, since the upper surfaces of the first frame portion 153 and the third frame portion 155 are formed flat, it is possible to prevent droplets of resin from flowing down the side surfaces of the first frame portion 151. Furthermore, by processing the upper portions of the second frame portion 154 and the third frame portion 155 to make them flat and then heating and curing them, the heights of the first frame portion 153 and the second frame portion 154 arranged along the pair of long sides 111 and 112 of the substrate 11 are equal to the height of the third frame portion arranged along the pair of short sides 113 and 114 of the substrate 11.

[0068] One of the pair of third frame portions 155 is arranged to cover the outer periphery of the first wiring 121, and the other of the pair of third frame portions 155 is arranged to cover the outer periphery of the second wiring 122. Preferably, the pair of third frame portions 155 are formed to cover a depth of 100 μm from the outer periphery of each of the first wiring 121 and the second wiring 122. The barrier material 15c does not necessarily have to cover the outer periphery of the first wiring 121 and the second wiring 122.

[0069] Light-emitting device 4 utilizes only the third frame portion 155 to form the barrier material disposed along the pair of short sides 113 and 114 of substrate 11, thereby reducing the number of frame layers compared to light-emitting device 2. Compared to light-emitting device 2, light-emitting device 4 reduces the number of frame layers that intersect, thereby preventing the angles of the barrier material from becoming higher due to overlapping frames. By preventing the angles of the barrier material from becoming higher, light-emitting device 4 reduces interference between frame portions, thereby suppressing manufacturing variations caused by interference. Furthermore, light-emitting device 4 reduces the number of frame layers compared to light-emitting device 2, thereby simplifying the manufacturing process and reducing manufacturing costs.

[0070] Furthermore, by reducing the number of frame layers compared to light-emitting device 2, light-emitting device 4 can suppress deformation of the previously placed frame during subsequent frame placement. In light-emitting device 4, as second frame 154 is applied, a pair of protrusions 155a are formed that protrude from the pair of third frame portions 155. By reducing the coating speed during the application of second frame 154, the size of protrusions 155a can be reduced. Furthermore, protrusions 155a can also be used for polarity determination.

[0071] In light-emitting device 4, the width of third frame portion 155, which is arranged along a pair of short sides 113 and 114 of substrate 11, is increased, thereby narrowing the light-emitting surface. Since light-emitting device 4 has a narrow light-emitting surface, it is preferably used as a light-emitting device for a backlight light source using a lens, etc., in which the light-emitting area is to be reduced.

[0072] In the light-emitting device 4, the pair of third framing portions 155 covers the peripheries of the first and second wirings 121, 122. Light reaching the peripheries of the first and second wirings 121, 122 is reflected by the pair of third framing portions 155, which are unaffected by the sulfide gas. Since the light reaching the peripheries of the first and second wirings 121, 122 is reflected by the pair of third framing portions 155, the light-emitting device 4 can minimize the reduction in light extraction efficiency due to the influence of the sulfide gas. By covering the periphery of the first and second wirings 121, 122 by 100 μm, the pair of third framing portions 155 can minimize the reduction in light extraction efficiency.

[0073] In the light-emitting device 4, two layers of the first frame portion 153 and the second frame portion 154 are arranged along the pair of long sides 111 and 112, and one layer of the third frame portion 155 is arranged along the pair of short sides 113 and 114. However, in the light-emitting device of the embodiment, the number of layers of the frame portion arranged along the pair of short sides 113 and 114 may be one or more less than the number of layers of the frame portion arranged along the pair of long sides 111 and 112.

[0074] In the light-emitting device 4, two layers of first frame portions 153 and second frame portions 154 are arranged along a pair of long sides 111 and 112, and a single layer of third frame portion 155 is arranged along a pair of short sides 113 and 114. However, the arrangement of the first frame portions 153 to the third frame portions 155 may be another arrangement. In the light-emitting device of the embodiment, a pair of first frame portions are arranged along one side of a rectangular planar substrate having two pairs of sides, and a pair of second frame portions are arranged on the upper surface of each of the pair of first frame portions. In addition, a pair of third frame portions are arranged along the other side of the two pairs of sides. For example, when the light-emitting element has a rectangular planar shape having a pair of long sides and a pair of short sides, the pair of first frame portions and the pair of second frame portions are arranged so as to oppose the pair of long sides of the light-emitting element, and the pair of third frame portions are arranged so as to oppose the pair of short sides of the light-emitting element.

[0075] Figure 14 : is a cross-sectional view of a light emitting device 5 according to the fifth embodiment. Figure 14 In, with Figures 1 to 3 The same components as those of the light emitting device 1 are denoted by the same reference numerals and their description is omitted. The light emitting device 5 differs from the light emitting device 1 only in the shape of the barrier material 15d.

[0076] The barrier material 15d of the light emitting device 5 includes a phosphor layer 156 and a frame 157. The phosphor layer 156 is arranged to cover the upper surface of the substrate 11 and is formed of a phosphor that converts the wavelength of light emitted from the LED element 14. The phosphor forming the phosphor layer 156 is preferably CaAlSiN3:Eu2 2+ The phosphor material in particle form may be (BaSr)2SiO4:Eu or the like, and a red phosphor such as KSF. 2+ The phosphor layer 156 is formed by applying the phosphor to the region where the barrier material 15d is disposed using a spraying device such as a sprayer.

[0077] Frame 157 comprises a base resin, first-diameter filler 19, and second-diameter filler 20, and does not contain any reflective material such as titanium oxide particles. Because frame 157 does not contain any reflective material, it is a transparent member that transmits light emitted from LED element 14 and light radiated from the phosphor, thus exhibiting light transmissivity. Frame 157 may also contain any reflective material.

[0078] By disposing the phosphor forming phosphor layer 156 so as to cover the upper surface of substrate 11, light-emitting device 5 can convert short-wavelength blue light incident on first frame portion 156 into long-wavelength red or green light, which is then irradiated onto the surface of substrate 11. By converting short-wavelength light emitted from LED element 14 into long-wavelength light and irradiating the surface of substrate 11, light-emitting device 5 can suppress degradation of the surface of substrate 11 caused by the incident light emitted from LED element 14. Since light-emitting device 5 can suppress degradation of the surface of substrate 11, it can reduce the possibility of barrier material 15d peeling off from substrate 11 due to degradation of the surface of substrate 11, thereby improving reliability.

[0079] Figure 15 : is a cross-sectional view of a light emitting device 6 according to a sixth embodiment. Figure 15 In, with Figures 1 to 3 The same components as those of the light emitting device 1 are denoted by the same reference numerals, and their description is omitted. The light emitting device 6 differs from the light emitting device 1 only in the shape of the barrier material 15e.

[0080] The barrier material 15e of the light emitting device 6 includes a first frame portion 158 and a second frame portion 159. The first frame portion 158 includes, in addition to the base resin, a phosphor that is arranged to cover the upper surface of the substrate 11 and converts the wavelength of light emitted from the LED element 14. The phosphor included in the first frame portion 158 is preferably CaAlSiN3:Eu2 2+ The phosphor material may be a particle-shaped phosphor material such as , and a red phosphor such as KSF. In addition, the phosphor contained in the first frame portion 158 may also be (BaSr)2SiO4:Eu 2+ In addition, the first frame portion 158 may also include a reflective material.

[0081] The second frame portion 159 contains a base resin, the first particle size filler 19, and the second particle size filler 20, and does not contain any reflective material such as titanium oxide particles. Because the second frame portion 159 does not contain any reflective material, it is a transparent member that transmits light emitted from the LED element 14 and light radiated from the phosphor, and thus has light transmissivity. Alternatively, the second frame portion 159 may contain any reflective material.

[0082] The barrier material 15e is formed by applying the raw materials of the first frame portion 158 and the second frame portion 159 separately using a dispenser. Alternatively, the barrier material 15e can be formed by, after placing a phosphor sheet corresponding to the first frame portion 158, applying the raw materials of the second frame portion 159 including a base resin, the first particle size filler 19, and the second particle size filler 20 using a dispenser. Alternatively, the barrier material 15e can be formed by, after placing a phosphor sheet corresponding to the first frame portion 158, placing a resin sheet corresponding to the second frame portion 159 including a base resin, the first particle size filler 19, and the second particle size filler 20 on the phosphor sheet.

[0083] By arranging the first frame portion 158 so as to cover the upper surface of the substrate 11, the light-emitting device 6, similar to the light-emitting device 5, can convert short-wavelength blue light incident on the first frame portion 158 into long-wavelength red or green light, which is then irradiated onto the surface of the substrate 11. By converting the short-wavelength light emitted by the LED element 14 into long-wavelength light and irradiating the surface of the substrate 11, the light-emitting device 6 can suppress degradation of the surface of the substrate 11 caused by the light emitted by the LED element 14. The light-emitting device 6 can suppress degradation of the surface of the substrate 11, thereby reducing the possibility of the barrier material 15e peeling off from the substrate 11 due to degradation of the substrate 11 surface, thereby improving reliability.

[0084] The light-emitting device 6 includes a barrier material 15e having a first frame portion 158 and a second frame portion 159. However, the light-emitting device of the embodiment may include a phosphor layer instead of the barrier material 15e. The phosphor layer is disposed between the barrier material 15 and the substrate 10 so as to cover the upper surface of the substrate 10 and contains a phosphor that converts the wavelength of light emitted from the light-emitting element 14.

[0085] Figure 16 : is a cross-sectional view of a light emitting device 7 according to the seventh embodiment. Figure 16 In, with Figures 1 to 3 The same components as those of the light emitting device 1 are denoted by the same reference numerals, and their description is omitted. The light emitting device 7 differs from the light emitting device 1 only in the structure of the substrate 11a and the shape of the barrier material 15f.

[0086] Substrate 11a is, for example, a glass epoxy substrate, with a solder pad 11c disposed in the center. This solder pad 11c forms a recess 11b for housing LED element 14. Recess 11b, also known as a cavity, has a recessed bottom surface 11d in which LED element 14 is disposed, and recessed side surfaces 11e surrounding the bottom surface. A heat sink can be disposed behind recessed bottom surface 11dc.

[0087] The base resin, titanium oxide particles, first-size filler 19, and second-size filler 20 contained in barrier material 15f of light-emitting device 7 are identical to barrier material 15. However, barrier material 15f entirely covers the first wiring 121 and second wiring 122, and its top end is positioned near recess 11b. In a plan view of light-emitting device 7, barrier material 15f is positioned so as to surround recess 11b.

[0088] Since the light emitting device 7 has the LED element 14 disposed on the bottom surface 11d of the recess where a heat sink can be disposed, heat dissipation efficiency can be improved, and the current flowing through the LED element 14 can be increased to improve brightness.

[0089] Furthermore, the light emitting device 7 can be used as a light emitting device that is desired to narrow the light emitting surface, such as a backlight light source using a lens, by disposing the barrier material 15f to surround the concave portion 11b.

[0090] Furthermore, since the light emitting device 7 includes the substrate 11 a which is a glass epoxy substrate, a higher degree of design freedom can be achieved compared to a light emitting device using a metal substrate such as an aluminum substrate.

[0091] The light-emitting device of the embodiment may include an LED element that emits infrared (IR) light instead of the LED element 14. In addition, the light-emitting device 6 includes a single LED element 14 that emits blue light, but the light-emitting device of the embodiment may include a plurality of LED elements that respectively emit red light, green light, and blue light instead of the LED element 14.

[0092] When the light-emitting device of the embodiment includes three LED elements that emit red, green, and blue light, respectively, three Zener diodes may be arranged adjacent to the three LED elements. By arranging the three Zener diodes adjacent to the three LED elements, the light-emitting device of the embodiment can function as light-absorbing members that absorb light emitted from the LED elements. By allowing the three Zener diodes to function as light-absorbing members, the light-emitting device of the embodiment can adjust the luminosity of the red, green, and blue light emitted from the three LED elements, respectively, and emit light having a desired color temperature.

[0093] Figure 17 This graph shows the relationship between the amount of first particle size filler 19 mixed in barrier material 15 and the hardness of barrier material 15. The mixing amount represents the mass ratio (wt%) of first particle size filler 19 to base resin in the cured barrier material 15 in the completed light-emitting device 1. The hardness represents Shore D hardness. Figure 17 These are the results of measuring the Shore D hardness of the barrier material 15 when the mixing amount of the first particle size filler 19 contained in the barrier material 15 was changed.

[0094] like Figure 18 As shown, when the barrier material contains the first particle size filler 19, the hardness of the cured barrier material 15 increases. Generally, if the Shore D hardness is 65 or above, no obvious burrs or notches are visible when cutting, etc., and a light-emitting device with a good appearance can be manufactured. In addition, if the first particle size filler 19 is included, the viscosity of the barrier material 15 decreases. If the Shore D hardness exceeds 74, it is difficult to maintain the shape of the barrier material in a predetermined shape due to the bearing effect of the particles. As described above, in the cured barrier material 15 of the completed light-emitting device 1, the preferred range of the mass ratio (wt%) of the first particle size filler 19 to the base resin is 10 to 50 wt%. If the content of the first particle size filler 19 is increased and the Shore D hardness exceeds 74, clogging occurs in the coating nozzle, making it difficult to apply the resin used to form the barrier material.

[0095] Figure 18This graph shows the relationship between the amount of the second particle size filler 20 mixed in the barrier material 15 and its viscosity. The mixing amount represents the mass ratio (wt%) of the second particle size filler 20 to the base resin in the cured barrier material 15 of the completed light-emitting device 1. The viscosity represents the viscosity (Pa·s) of the white resin droplet before curing. Figure 18 These are the results of measuring the viscosity of the filler 20 with the second particle size contained in the white resin droplets before curing for use in forming the barrier material 15 while changing the mixing amount.

[0096] like Figure 18 As shown in FIG80 , if the white resin droplets before curing contain a second particle size filler 20, the viscosity increases. Generally, if the viscosity is 200 (Pa·S) or more, the viscosity becomes high during manufacturing, and the particles can be maintained at a high viscosity, and the shape can be kept high in the height direction and small in the width direction. In addition, if the viscosity is greater than 1200 (Pa·S), the viscosity becomes too high, causing clogging in the nozzle used for coating, making it difficult to apply the resin used to form the barrier material. As described above, in the cured barrier material 15 in the completed light-emitting device 1, the preferred range of the mass ratio (wt%) of the second particle size filler 20 to the base resin is 4 to 15 wt%. In addition, the mass ratio (wt%) of the second particle size filler 20 in FIG80 is calculated taking into account the fact that the barrier material 15 loses 0 to 10% of its mass after curing.

[0097] If the viscosity of the white resin droplets before curing used to form the barrier material 15 is low, the aspect ratio of the bottom width to the height of the barrier material 15 cannot be maintained high, resulting in a drooping barrier shape. As a result, the barrier material 15 contacts the LED element 14, causing a decrease in luminous efficiency and making it difficult to obtain a compact light-emitting device.

[0098] The shape of the barrier material 15 is an important factor in preventing the luminous efficiency of the light-emitting device 1 from decreasing. The ratio of the bottom width of the barrier material 15 (the width from the position of the barrier material 15 parallel to the upper surface of the first wiring 121 to the side surface 21: W1) to the height (H1) from the first wiring 121 is preferably 0.6 to 4.0 (see Figure 3 When the ratio of the bottom width (W1) to the height (H1) of the barrier material 15 is 0.6 to 4.0, it is possible to prevent the reduction in the luminous efficiency of the light-emitting device 1 and to prevent light leakage without reducing the width of the barrier material 15.

[0099] When the ratio of the bottom width (W1) of the barrier material 15 to the height (H1) from the first wiring 121 is 0.6 to 4.0, the side surface of the barrier material facing the LED element 14 is convexly curved toward the LED element 14 (see FIG. Figure 3). In this case, the barrier material 15 is formed into a shape inclined inward, and the inclined surface is formed into a shape convex inward toward the element. The barrier material 15 has a vertex (P) of a curved convex shape of the barrier material 15 within the height range of the light-emitting element, which protrudes inward, so that the light reflected on the upper side of the vertex stands up better and the light extraction efficiency is improved. In addition, the barrier material 15 is arranged on a substrate including a wiring pattern, and the cross-sectional shape of the barrier material 15 is as follows: Figure 3 As shown, the bottom width (W1) of the barrier material 15 is narrower than the width (W2) of the portion of the barrier material 15 that protrudes most toward the element side (see FIG. Figure 3 By forming a structure with a narrow bottom width (W1) and a deep structure of the barrier material 15, light can be reflected multiple times, improving color mixing. If the width of the barrier material 15 in the lateral direction of the LED element 14 is reduced, light can be easily emitted. Therefore, by setting the vertex (P) of the curved convex shape of the barrier material 15, that is, the maximum width of the barrier material 15, within the height range of the LED element 14, the light extraction efficiency of the light-emitting device 1 is improved.

[0100] In addition, the ratio of the bottom width of the first frame portion 151 in the light emitting device 2 (the width from the position of the barrier material 15a parallel to the upper surface of the first wiring 121 to the side surface 21: W3) to the height (H2) from the first wiring 121 (see Figure 8 ) is preferably 1.2 to 2.0, in which case it becomes a shape suitable for forming the second frame portion 152.

[0101] As described above, barrier material 15 includes titanium oxide, but the mass ratio (wt%) of titanium oxide to the base resin is preferably in the range of 10 to 70 wt% relative to the base resin. In this case, light is effectively reflected. As described above, the ratio of the bottom width (W1) to the height (H1) of barrier material 15 is preferably 0.6 to 4.0. However, in this case, there is a possibility that the width of barrier material 15 will be thinner, requiring a larger mass ratio of titanium oxide than usual. If the mass ratio (wt%) of titanium oxide to the base resin in barrier material 15 is 10 to 70 wt%, even if the width of barrier material 15 is, for example, less than 0.1 mm, light from LED element 14 will not be emitted, and can be efficiently reflected.

[0102] As described above, the barrier material 15 does not have to contain titanium oxide. In other words, the barrier material 15 can also be transparent. By making the barrier material 15 transparent, the directivity of the light can be expanded. In addition, the barrier material 15 can also be black or blue. By making the barrier material 15 black, the generation of yellow rings can be suppressed. In addition, the barrier material 15 can contain a phosphor. By including a phosphor in the barrier material 15, the directivity of the color temperature and chromaticity can be adjusted. In the case of the barrier material 15a, only one of the first frame portion 151 and the second frame portion 152 can be transparent, black, blue, or contain a phosphor.

[0103] Each side of the light-emitting device 2 may also be composed solely of a first frame portion 151, a second frame portion 152 stacked on the first frame portion 151, or a combination of these. Alternatively, a two-layer frame portion may be arranged on the long side of the light-emitting device 2, followed by a single-layer frame portion on the short side. When the center spacing of the frame portions arranged on the long side is 1.5 mm or less, the barrier material arranged on the two-layer barrier enters between the two layers of barrier. Therefore, even if the short side is provided with a single-layer barrier, the barrier material can be made the same height as the two-layer barrier, thereby reducing labor. By arranging the barriers on the short side horizontally instead of vertically overlapping them, the connection between the wires and the wiring can be protected, and the directivity of the long side can be narrowed.

[0104] The barrier material 15 can also vary the R dimensions of the four corners when viewing the light-emitting device 1 from above. For example, if the R dimensions of two adjacent corners are larger than the other two, this can serve as a marker for identifying the direction. Furthermore, in the light-emitting device 2, the first frame portion 151 and the second frame portion 152 can each vary the angle that increases R dimensions. This makes the identification marker easier to see.

[0105] In light-emitting device 2, when the phosphor contained in sealing material 16 is allowed to settle, the phosphor can be deposited on the upper portion of first frame portion 151, at the interface with second frame portion 152. When the phosphor settles, the side surfaces of LED element 14 may be exposed through the phosphor sedimentation layer. This strongly emits blue light to the side, so by supplementing the yellow color with the phosphor at the interface between first frame portion 151 and second frame portion 152, the amount of blue light to the side can be reduced.

[0106] It should be understood by those skilled in the art that various changes, substitutions, and modifications may be made without departing from the scope of the present invention. For example, the above-mentioned embodiments and modifications may be appropriately combined and implemented within the scope of the present invention.

Claims

1. A light emitting device, characterized in that: have: substrate; an LED element mounted on the substrate; a barrier material disposed around the LED element; and a sealing material disposed inside the barrier material and sealing the LED element; The barrier material comprises: a base resin, a filler having a first particle size and a filler having a second particle size, The barrier material contains 10 to 50 wt% of the first particle size filler relative to the base resin, and the average particle size of the first particle size filler is 1 to 100 μm. The barrier material contains 4 to 15 wt% of the second particle size filler relative to the base resin. The average particle size of the second particle size filler is 1 to 500 nm, The barrier material has cut sides.

2. The light emitting device according to claim 1, wherein The ratio of the bottom width of the barrier material to the height of the barrier material is 0.6 to 4.

0.

3. The light emitting device according to claim 1, wherein The surface of the barrier material facing the LED element has a convex shape that curves toward the LED element.

4. The light emitting device according to claim 1, wherein The hardness of the barrier material is Shore hardness D65-D74.

5. The light emitting device according to claim 1, wherein The barrier material further comprises titanium oxide, The barrier material contains 10 to 70 wt % of the titanium oxide relative to the base resin.

6. The light emitting device according to claim 1, wherein The barrier material further includes a first frame portion and a second frame portion disposed on an upper surface of the first frame portion. The first frame portion and the second frame portion have the same ratio of height to bottom width.

7. The light emitting device according to claim 1, wherein: It also has a wire for supplying power to the LED element. A portion of the conductive line is covered by the barrier material.

8. The light emitting device according to claim 1, wherein The barrier material is light-transmissive.

9. The light emitting device according to claim 1, wherein: The substrate has a rectangular planar shape, and the rectangular planar shape has two pairs of sides. The barrier material has: a pair of first frame portions arranged along one of the two pairs of sides; a pair of second frame portions disposed on respective upper surfaces of the pair of first frame portions; and A pair of third frame portions is arranged along the other of the two pairs of sides.

10. The light emitting device according to claim 9, characterized in that The substrate has a rectangular planar shape having a pair of long sides and a pair of short sides shorter than the pair of long sides. The pair of first frame portions and the pair of second frame portions are arranged along the pair of long sides. The pair of third frame portions is arranged along the pair of short sides.

11. The light emitting device according to claim 1, wherein It also has a conductive wiring pattern arranged on the upper surface of the substrate so as to be surrounded by the barrier material, The LED element is arranged on the upper surface of the wiring pattern, The barrier material covers the outer periphery of the wiring pattern.

12. The light emitting device according to claim 1, wherein The barrier material further includes a phosphor that is arranged to cover the upper surface of the substrate and converts the wavelength of light emitted from the LED element.

13. The light emitting device according to claim 12, characterized in that: The barrier material further includes a first frame portion disposed on the substrate and containing the phosphor, and a second frame portion disposed on an upper surface of the first frame portion and containing the filler having the first particle size and the filler having the second particle size.

14. The light emitting device according to claim 1, wherein The invention further includes a phosphor layer that is disposed between the barrier material and the substrate so as to cover the upper surface of the substrate and contains a phosphor that converts the wavelength of light emitted from the LED element.

15. The light emitting device according to claim 1, wherein The substrate is formed with a recess having a bottom surface and side surfaces arranged so as to surround the bottom surface. The LED element is disposed on the bottom surface of the recess, and the barrier material is disposed so as to surround the recess.

16. A method for manufacturing a light emitting device, characterized in that: have: A step of mounting LED elements on the surface of the assembly substrate; a step of disposing a barrier material from a dispenser around the LED element; a step of disposing a sealing material for sealing the LED element inside the barrier material; and The process of cutting the cured barrier material, The barrier material comprises: a base resin, a filler having a first particle size and a filler having a second particle size, The barrier material contains 10 to 50 wt% of the first particle size filler relative to the base resin. The average particle size of the first particle size filler is 1 to 100 μm, The barrier material contains 4 to 15 wt% of the second particle size filler relative to the base resin. The average particle size of the second particle size filler is 1 to 500 nm.

17. The method for manufacturing a light emitting device according to claim 16, wherein: In the barrier material cutting step, the barrier material is cut from a surface side of the collective substrate on which the LED elements are not mounted.

18. The method for manufacturing a light emitting device according to claim 16, wherein: The light emitting device further includes a lead wire for supplying power to the LED element. In the barrier material forming step, the barrier material is formed so as to cover a portion of the conductive line.

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