AI + recognition accurate supply device for diamond fretsaw cutting fluid

Abstract

The invention discloses an AI + recognition accurate supply device for diamond wire saw cutting fluid, which comprises a multi-source sensing module, an intelligent decision module and a control adjustment module, and is characterized in that the multi-source sensing module is used for realizing comprehensive environment sensing and intelligent decision by integrating data of various heterogeneous sensors; the intelligent decision-making module is used for establishing an AI model to intelligently decide the fluid behavior requirement of the optimal cutting fluid; the control and adjustment module is used for adjusting the flow and atomization effect of the cutting fluid through a high-precision micro pump and an air pump according to an AI analysis optimization instruction; the cutting state is accurately monitored in real time through the multi-source sensing module, multi-modal data are fused through the intelligent decision making module, an AI model is established to dynamically decide the optimal cutting fluid requirement, and finally the high-precision micro pump and the air pump are driven by the control adjusting module to cooperatively regulate and control the flow, pressure and atomization effect of the cutting fluid. The permeability, the covering uniformity and the fluid behavior controllability of the cutting fluid are remarkably improved, and edge breakage and subsurface damage are effectively reduced.

Description

Technical Field

[0001] The present invention relates to the technical field of diamond wire saw cutting, and in particular to an AI+ identification precise supply device for diamond wire saw cutting fluid. Background Art

[0002] As a key material for third-generation semiconductors, single-crystal silicon carbide has broad application prospects in new energy vehicles, national defense construction, advanced medical fields, etc. due to its high efficiency, high density, and high reliability. Cutting processing is the primary process for preparing high-quality single-crystal silicon carbide substrate wafers. It faces problems such as edge collapse and sub-surface damage, which also introduces additional processing time and difficulty for the subsequent grinding and polishing process. Wire saw cutting fluid is one of the key factors affecting the quality and efficiency of SiC cutting, especially when facing the cutting of large-sized, ultra-thin SiC. Cutting fluid is particularly critical. On the other hand, the development of green and environmentally friendly cutting processes is an inevitable trend. Therefore, how to study new cutting fluids and effectively supply them based on the optimization of diamond wire saw cutting processes requires further in-depth research;

[0003] The diamond wire saw cutting fluid supply device is one of the core subsystems of the wire cutting system. It is responsible for cooling, lubrication, chip removal, rust prevention, and process optimization. It is crucial to cutting quality, efficiency, and cost control. The high-speed movement of the diamond wire saw generates high temperatures when it rubs against hard and brittle materials. The cutting fluid is directly applied to the cutting area through spraying or atomization, quickly removing heat and preventing phase change, micro-cracks, or warping of the material due to local overheating.

[0004] The existing diamond wire saw cutting fluid has problems of insufficient effective supply and uneven distribution. The high-speed moving saw wire generates a strong centrifugal force, which "throws off" most of the cutting fluid from the saw wire surface, making it difficult to accurately deliver sufficient cutting fluid to the deep part of the cutting seam. The liquid flow formed by traditional pouring or spraying methods is large in size and lacks kinetic energy, and cannot effectively break through the airflow barrier and penetrate to the cutting front. In addition, the cutting fluid is inconsistently distributed along the length of the saw wire, which easily leads to insufficient lubrication and cooling in local areas. At the same time, there is a lack of dynamic and precise control of the cutting fluid flow rate and atomization state, and it is impossible to supply on demand. Therefore, the present invention proposes an AI+ identification and precise supply device for diamond wire saw cutting fluid to solve the problems existing in the prior art. Summary of the Invention

[0005] In response to the above problems, the purpose of the present invention is to propose an AI+ identification and precise supply device for diamond wire saw cutting fluid. The AI+ identification and precise supply device for diamond wire saw cutting fluid uses a multi-source sensing module to accurately monitor the cutting status in real time, and uses an intelligent decision-making module to fuse multimodal data and establish an AI model to dynamically decide the optimal cutting fluid demand. Finally, the control and regulation module drives a high-precision micro pump and an air pump to collaboratively regulate the flow, pressure and atomization effect of the cutting fluid, significantly improving the permeability, coverage uniformity and controllability of the cutting fluid, thereby effectively reducing edge chipping and sub-surface damage in the silicon carbide cutting process, and reducing cutting load fluctuations, while achieving the green and environmentally friendly goal of minimal lubrication.

[0006] To achieve the purpose of the present invention, the present invention is implemented through the following technical solutions: an AI+ identification precise supply device for diamond wire saw cutting fluid, including a multi-source perception module, an intelligent decision-making module and a control and adjustment module. The multi-source perception module is used to realize comprehensive perception and intelligent decision-making of the environment by integrating data from multiple heterogeneous sensors. The intelligent decision-making module is used to establish an AI model to intelligently decide the optimal cutting fluid behavior requirements. The control and adjustment module is used to adjust the flow and atomization effect of the cutting fluid through a high-precision micro pump and an air pump according to the AI analysis optimization instructions.

[0007] Further improvements are: the multi-source perception module includes a visual recognition module, a vibration sensing module and a current sensing module. The visual recognition module is used to capture and identify the image of the contact area between the saw wire and the workpiece in real time by deploying an industrial camera. The vibration sensing module is used to monitor the cutting force, tension fluctuations and vibration spectrum characteristics in real time. The current sensing module is used to detect the current fluctuations of the spindle motor, indirectly reflecting the changes in the cutting load.

[0008] A further improvement is that the vibration sensing module includes a tension sensor and a vibration sensor, and the tension sensor and the vibration sensor are installed on the main shaft and the tensioning guide wheel.

[0009] Further improvements are as follows: the intelligent decision-making module includes a data processing module and an effect evaluation module. The data processing module is used to filter and pre-process the original data to reduce noise and extract segmentation features from the image. The effect evaluation module is used to continuously monitor the image distribution and temperature changes after execution, and provide evaluation feedback based on the image changes and temperature changes.

[0010] Further improvements are: the control and adjustment module includes a micro-lubrication module and a precision liquid supply module. The micro-lubrication module is used to atomize the cutting fluid into micron-level liquid mist through compressed gas, and accurately spray it into the processing area for lubrication and cooling. The precision liquid supply module is used to achieve precise control of tiny flow rates through a high-precision micro pump, thereby affecting the spray distance.

[0011] Further improvements are: it includes a single crystal silicon block main body, an AI recognition controller, a wire cutting mechanism, an atomization mechanism and a cutting liquid supply mechanism, an AI recognition controller is provided above the single crystal silicon block main body, the wire cutting mechanism includes a wire pay-off drum, a wire take-up drum, a tensioning shaft and a diamond saw wire, a wire pay-off drum is rotatably provided on one side of the single crystal silicon block main body, a wire take-up drum is rotatably provided on the other side of the single crystal silicon block main body, and tensioning shafts are rotatably provided on the four corners of the single crystal silicon block main body, and diamond saw wire is wound on the tensioning shaft.

[0012] A further improvement is that one end of the diamond saw wire is wound around a wire-paying drum for paying out the wire, and the other end of the diamond saw wire is wound around a wire-receiving drum for taking up the wire.

[0013] Further improvements are: the atomization mechanism includes an air pump, an air supply pipe and an air supply nozzle, an air pump is placed on the other side of the single crystal silicon block body, the air pump is connected to an air supply pipe, the end of the air supply pipe is connected to an air supply nozzle, and the air supply nozzle is close to the cutting area on the single crystal silicon block body.

[0014] Further improvements are as follows: the cutting liquid supply mechanism includes a liquid storage tank, a high-precision micro pump, a flow meter and a liquid supply nozzle; a liquid storage tank is placed on the other side of the single crystal silicon block body; a high-precision micro pump is connected to the liquid storage tank pipeline; a flow meter is fixed on the liquid storage tank; and a liquid supply nozzle is connected to the liquid storage tank pipeline.

[0015] The beneficial effects of the present invention are: the present invention uses a multi-source sensing module to accurately monitor the cutting status in real time, uses an intelligent decision-making module to fuse multimodal data and establishes an AI model to dynamically decide the optimal cutting fluid demand, and finally the control and regulation module drives a high-precision micro pump and an air pump to coordinately regulate the flow, pressure and atomization effect of the cutting fluid, significantly improving the permeability, coverage uniformity and controllability of the cutting fluid, thereby effectively reducing edge chipping and sub-surface damage in the silicon carbide cutting process, and reducing cutting load fluctuations, while achieving the green and environmentally friendly goal of minimal lubrication. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Figure 1 This is a system architecture diagram of the present invention;

[0017] Figure 2 A three-dimensional schematic diagram of cutting a single crystal silicon block body according to the present invention;

[0018] Figure 3 This is the overall pipeline diagram of the cutting device of the present invention.

[0019] Among them: 1. Single crystal silicon block body; 2. AI recognition controller; 3. Pay-off reel; 4. Take-up reel; 5. Tensioning shaft; 6. Diamond saw wire; 7. Air pump; 8. Air supply pipe; 9. Air supply nozzle; 10. Liquid storage tank; 11. High-precision micro pump; 12. Flow meter; 13. Liquid supply nozzle. DETAILED DESCRIPTION

[0020] In order to deepen the understanding of the present invention, the present invention will be further described in detail below with reference to the examples. The examples are only used to explain the present invention and do not constitute a limitation on the scope of protection of the present invention.

[0021] A diamond wire saw is a linear cutting tool made by attaching diamond abrasive to a metal wire busbar through electroplating or resin bonding. It is widely used in the high-precision machining of hard and brittle materials. It uses high-toughness metal wire with high tensile strength and good flexibility to meet the cutting requirements of different materials. Diamond abrasives consist of high-hardness synthetic diamond particles, which are evenly bonded to the busbar surface as cutting edges. The bonding layer is electroplated nickel / nickel-cobalt alloy or resin coating, which encapsulates the abrasive and ensures its strong adhesion. Diamond wire saw cutting fluid is a key auxiliary material in the diamond wire saw cutting process, especially indispensable in the machining of hard and brittle materials such as silicon wafers, silicon carbide, and sapphire. By forming a lubricating film on the contact surface between the wire and the workpiece, it reduces the friction coefficient, minimizes diamond abrasive shedding and wire wear, extends wire life, and reduces wire breakage. Diamond wire saw cutting fluid addresses core pain points in the cutting of hard and brittle materials, such as edge chipping, thermal damage, and wire breakage, through a four-dimensional synergistic mechanism of "lubrication, cooling, cleaning, and rust prevention." Future technologies will focus on ultra-low viscosity, biodegradability, and intelligent fluid supply systems to meet the needs of semiconductor fine-wire cutting and green manufacturing.

[0022] Single-crystal silicon carbide is the core representative of the third-generation semiconductor materials, with characteristics such as large bandgap, high breakdown electric field strength, excellent thermal conductivity and strong high-temperature stability. These properties make it significantly superior to traditional silicon-based materials in high-temperature, high-frequency and high-power scenarios, making it a key material in the fields of new energy vehicles, photovoltaic inverters, 5G communications, rail transportation and aerospace. Its mainstream preparation technology is the physical vapor transport method, which grows crystals through high-temperature sublimation-recrystallization, but faces challenges such as slow crystal growth rate, high defect density and difficulty in large-size expansion. The emerging liquid phase method is regarded as a breakthrough direction for future low-cost industrialization because it can reduce defect density and achieve p-type doping. As the global industry upgrades to 8-inch wafers, China is accelerating technological research to break through cost and yield bottlenecks, and promote silicon carbide to replace silicon-based materials in power electronic devices;

[0023] As a core material for third-generation semiconductors, single-crystal silicon carbide (SiC) faces challenges in cutting due to its high hardness, high brittleness, and chemical stability. Mainstream cutting technologies include diamond wire sawing, slurry wire sawing, and laser cutting. Diamond wire sawing utilizes high-speed reciprocating motion to achieve "two-body processing" by attaching diamond particles to a steel wire through electroplating or brazing. While its advantages lie in its high efficiency and environmental friendliness, it also suffers from large kerf widths, high material loss rates, and the tendency for surface cracks to form, making it unsuitable for ultra-thin, large wafers. Slurry wire sawing utilizes a copper-coated steel wire carrying diamond or SiC abrasive particles, cutting through a "rolling-indentation" mechanism. While achieving narrow kerfs and uniform thickness, it suffers from slow cutting speeds, low abrasive utilization, high pollution levels, and the tendency for stray abrasive particles to cause uneven wafer thickness. Water-guided laser cutting utilizes a high-pressure water jet to guide the laser beam, resulting in narrow kerfs and minimal thermal damage, but is only suitable for wafers ≤6 inches.

[0024] Based on this, according to Figure 1 、 Figure 2 、 Figure 3 As shown, this embodiment provides an AI+ recognition precision supply device for diamond wire saw cutting fluid, including a multi-source perception module, an intelligent decision-making module, and a control and regulation module. The multi-source perception module is used to achieve comprehensive environmental perception and intelligent decision-making by integrating data from multiple heterogeneous sensors. The multi-source perception module includes a visual recognition module, a vibration sensing module, and a current sensing module. The visual recognition module is used to capture and identify images of the contact area between the wire and the workpiece in real time by deploying an industrial camera. The image identifies the shape and color of the chips, thereby evaluating the uniformity and permeability of the area covered by the cutting fluid. The vibration sensing module is used to monitor cutting force, tension fluctuations, and vibration spectrum characteristics in real time. The vibration sensing module includes a tension sensor and a vibration sensor. The tension sensor and vibration sensor are installed on the main shaft and tensioning guide pulley, thereby directly reflecting the smoothness of the cutting process, the wire load, and potential sub-surface damage. The current sensing module is used to detect spindle motor current fluctuations, indirectly reflecting changes in cutting load. The three-phase current of the spindle motor is detected by a Hall sensor, and the harmonic distortion rate is calculated to reflect the load change.

[0025] The intelligent decision-making module is used to establish an AI model to intelligently decide the optimal cutting fluid behavior requirements. The intelligent decision-making module includes a data processing module and an effect evaluation module. The data processing module is used to filter and pre-process the original data for noise reduction, extract segmentation features from the image, and construct a sum feature vector reflecting the cutting state by fusing multimodal data. The training model establishes a mapping relationship from the cutting state features to the optimal cutting fluid requirements. The effect evaluation module is used to continuously monitor the image distribution and temperature changes after execution, and provide evaluation feedback based on the image changes and temperature changes.

[0026] The control and regulation module uses a high-precision micro-pump and air pump to adjust the flow and atomization of the cutting fluid based on AI analysis and optimization instructions. The control and regulation module includes a micro-lubrication module and a precision fluid supply module. The micro-lubrication module uses compressed air to atomize the cutting fluid into micron-sized liquid mist, which is precisely sprayed onto the processing area for lubrication and cooling. The precision fluid supply module uses a high-precision micro-pump to precisely control tiny flow rates, affecting spray distance.

[0027] The precise supply device includes a single crystal silicon block main body 1, an AI identification controller 2, a wire pulling cutting mechanism, an atomizing mechanism and a cutting liquid supply mechanism. An AI identification controller 2 is provided above the single crystal silicon block main body 1. The wire pulling cutting mechanism includes a wire pay-off drum 3, a wire take-up drum 4, a tensioning shaft 5 and a diamond saw wire 6. A wire pay-off drum 3 is provided for rotation on one side of the single crystal silicon block main body 1, and a wire take-up drum 4 is provided for rotation on the other side of the single crystal silicon block main body 1. Tensioning shafts 5 are provided for rotation at the four corners of the single crystal silicon block main body 1. Diamond saw wire 6 is wound on the tensioning shaft 5. One end of the diamond saw wire 6 is wound around the wire pay-off drum 3 for pay-off, and the other end of the diamond saw wire 6 is wound around the wire take-up drum 4 for take-up. When cutting, the diamond saw wire 6 is wound around the single crystal silicon block main body 1, stretched and tensioned by the tensioning shaft 5, and the wire pay-off drum 3 and the wire take-up drum 4 rotate to pull the diamond saw wire 6 for cutting.

[0028] The atomization mechanism includes an air pump 7, an air supply pipe 8 and an air supply nozzle. The air pump 7 is placed on the other side of the single crystal silicon block body 1. The air pump 7 is connected to the air supply pipe 8. The end of the air supply pipe 8 is connected to the air supply nozzle. The air supply nozzle is close to the cutting area on the single crystal silicon block body 1. When cutting is performed, the air pump 7 starts to supply air through the air supply pipe 8 and sprays air through the air supply nozzle to break up the cutting fluid and atomize it to achieve trace lubrication, so that the cutting fluid can more easily penetrate the cutting seam.

[0029] The cutting liquid supply mechanism includes a liquid storage tank 10, a high-precision micro pump 11, a flow meter 12 and a liquid supply nozzle 13. A liquid storage tank 10 is placed on the other side of the single crystal silicon block body 1. The liquid storage tank 10 is connected to a high-precision micro pump 11 through a pipeline. A flow meter 12 is fixed on the liquid storage tank 10. The liquid storage tank 10 is connected to a liquid supply nozzle 13 through a pipeline. When cutting, the AI recognition controller 2 cooperates with the high-precision micro pump 11 to dynamically adjust the flow, pressure and atomization characteristics of the cutting liquid, thereby effectively improving the controllability and effect of the fluid behavior.

[0030] The AI+ identification and precise supply device of the diamond wire saw cutting fluid uses an industrial camera to capture images of the cutting area to identify chip morphology and liquid film coverage, a vibration sensor to monitor wire tension fluctuations, and a current sensor to analyze motor load changes. It collects multimodal data of the cutting state in real time, and the AI model performs feature fusion on the pre-processed data to establish a mapping relationship between the cutting state and the cutting fluid demand. It dynamically decides on the optimal flow rate, atomization particle size and injection parameters, and coordinates the control of the high-precision micro pump and air pump according to the AI instructions to convert the cutting fluid into a directional and highly penetrating aerosol and precisely spray it to the wire-workpiece contact area. Based on the feedback of chip morphology changes and temperature distribution after execution, the parameters are continuously iterated and adjusted to break through the bottlenecks of insufficient penetration and uneven distribution of traditional supply, and realize precise supply of cooling and lubrication on demand.

[0031] The basic principles, main features, and advantages of the present invention are shown and described above. Those skilled in the art should understand that the present invention is not limited to the foregoing embodiments. The foregoing embodiments and descriptions are merely illustrative of the principles of the present invention. Various changes and modifications may be made to the present invention without departing from the spirit and scope of the present invention. Such changes and modifications are intended to fall within the scope of the present invention. The scope of protection claimed in the present invention is defined by the appended claims and their equivalents.

Claims

1. An AI+ identification and precise supply device for diamond wire saw cutting fluid, characterized by: It includes a multi-source perception module, an intelligent decision-making module and a control and adjustment module. The multi-source perception module is used to achieve comprehensive perception of the environment and intelligent decision-making by integrating data from multiple heterogeneous sensors. The intelligent decision-making module is used to establish an AI model to intelligently decide the optimal cutting fluid behavior requirements. The control and adjustment module is used to adjust the flow and atomization effect of the cutting fluid through a high-precision micro pump and air pump according to the AI analysis optimization instructions.

2. The AI+ identification precise supply device for diamond wire saw cutting fluid according to claim 1, characterized in that: The multi-source perception module includes a visual recognition module, a vibration sensing module and a current sensing module. The visual recognition module is used to capture and identify the image of the contact area between the saw wire and the workpiece in real time by deploying an industrial camera. The vibration sensing module is used to monitor the cutting force, tension fluctuation and vibration spectrum characteristics in real time. The current sensing module is used to detect the current fluctuation of the spindle motor and indirectly reflect the changes in the cutting load.

3. The AI+ identification precise supply device for diamond wire saw cutting fluid according to claim 2, characterized in that: The vibration sensing module includes a tension sensor and a vibration sensor, and the tension sensor and the vibration sensor are installed on the main shaft and the tensioning guide wheel.

4. The AI+ identification precise supply device for diamond wire saw cutting fluid according to claim 1, characterized in that: The intelligent decision-making module includes a data processing module and an effect evaluation module. The data processing module is used to filter and pre-process the original data to reduce noise and extract segmentation features from the image. The effect evaluation module is used to continuously monitor the image distribution and temperature changes after execution, and provide evaluation feedback based on the image changes and temperature changes.

5. The AI+ identification precise supply device for diamond wire saw cutting fluid according to claim 1, characterized in that: The control and adjustment module includes a micro-lubrication module and a precision liquid supply module. The micro-lubrication module is used to atomize the cutting fluid into micron-sized liquid mist through compressed gas, and accurately spray it into the processing area for lubrication and cooling. The precision liquid supply module is used to achieve precise control of tiny flow rates through a high-precision micro pump, thereby affecting the spray distance.

6. The AI+ identification precise supply device for diamond wire saw cutting fluid according to claim 1 comprises a single crystal silicon block main body (1), an AI identification controller (2), a wire cutting mechanism, an atomizing mechanism and a cutting fluid supply mechanism, wherein an AI identification controller (2) is provided above the single crystal silicon block main body (1), and the wire cutting mechanism comprises a pay-off drum (3), a take-up drum (4), a tensioning shaft (5) and a diamond saw wire (6), a pay-off drum (3) is rotatably provided on one side of the single crystal silicon block main body (1), and a take-up drum (4) is rotatably provided on the other side of the single crystal silicon block main body (1), and tensioning shafts (5) are rotatably provided on the four corners of the single crystal silicon block main body (1), and a diamond saw wire (6) is wound on the tensioning shaft (5).

7. The AI+ identification precise supply device for diamond wire saw cutting fluid according to claim 6, characterized in that: One end of the diamond saw wire (6) is wound around the wire pay-off drum (3) for wire pay-off, and the other end of the diamond saw wire (6) is wound around the wire take-up drum (4) for wire take-up.

8. The AI+ identification precise supply device for diamond wire saw cutting fluid according to claim 6, characterized in that: The atomizing mechanism comprises an air pump (7), an air supply pipe (8) and an air supply nozzle. The air pump (7) is placed on the other side of the single crystal silicon block body (1). The air pump (7) is connected to the air supply pipe (8). The end of the air supply pipe (8) is connected to the air supply nozzle. The air supply nozzle is close to the cutting area on the single crystal silicon block body (1).

9. The AI+ identification precise supply device for diamond wire saw cutting fluid according to claim 6, characterized in that: The cutting liquid supply mechanism comprises a liquid storage tank (10), a high-precision micro pump (11), a flow meter (12) and a liquid supply nozzle (13); the liquid storage tank (10) is placed on the other side of the single crystal silicon block body (1); a pipeline of the liquid storage tank (10) is connected to the high-precision micro pump (11); a flow meter (12) is fixed on the liquid storage tank (10); and a pipeline of the liquid storage tank (10) is connected to the liquid supply nozzle (13).

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