Self-heating type electroforming cathode clamp and device integrated with megasonic vibration patch

Abstract

The invention relates to the technical field of micro-nano manufacturing, and provides a self-heating type electroforming cathode clamp and device integrated with a megasonic vibration patch, megasonic vibration acting on a whole electroforming liquid system directly acts on a cathode piece, so that the performance of a casting layer is regulated and controlled, and the self-heating type electroforming cathode clamp and device are integrated with the megasonic vibration patch by utilizing the characteristic that vibration generates heat. Precise self-heating is realized, so that the heating requirement on an electroforming solution is reduced, efficient utilization of energy is realized, and the production cost is greatly reduced; by installing the piezoelectric ceramic piece, the quartz piece and the cathode piece in a surface-mounted mode, it is ensured that vibration energy is efficiently transmitted to the working face of the cathode from piezoelectric ceramic in a low-loss mode, the loss of megasonic transmission is reduced to a great extent, megasonic has the advantages of being high in penetrating power, large in energy density and small in cavitation effect, and the energy efficiency is improved. And during working, a glue microstructure on the surface of the cathode is not damaged, so that the temperature and flow field distribution of a local area on the surface of the cathode can be improved, and the processing efficiency is improved.

Description

Technical Field

[0001] The present application relates to the field of micro-nano manufacturing technology, and in particular to a self-heating electroforming cathode fixture and device with an integrated megasonic vibration patch. Background Art

[0002] Precision electroforming technology uses electrochemical deposition to form metal parts with surface microstructures. It boasts high replication accuracy, can form surfaces with complex features in a single pass, and is unconstrained by the hardness and toughness of the material being processed. During the precision electroforming process, electrodeposition primarily occurs on the cathode surface. The temperature, flow, and electric field distribution on the cathode surface directly impact the mold core's molding quality. Improper electroforming parameters can lead to various quality issues, such as core warpage, surface pinholes, and edge buildup.

[0003] In traditional electrodeposition processes, for example, Chinese patent CN108018584B discloses a megasonic electroforming device and method for improving the uniformity of metal micro-electroforming. By securing the entire cathode plate to a stirring mechanism and suspending it in a megasonic casting tank, the entire electroforming tank (including the electroforming solution, cathode, and anode components) is heated to control the temperature of the cathode surface. Introducing a megasonic vibration system in the electroforming area effectively reduces electroforming defects, facilitating the formation of precision metal devices with good morphology, appearance, and excellent mechanical properties.

[0004] However, as mentioned above, electrodeposition mainly occurs on the cathode surface. Heating and megasonic vibration of the entire electroforming area, especially the large-capacity electrolyte, not only causes a huge waste of energy, but also due to the loss of megasonic vibration transmitted in the electroforming liquid, the existing technology cannot effectively improve the temperature and flow field distribution in the local area of the cathode surface, and there is a large room for optimization of the electroforming effect.

[0005] In view of this, it is necessary to propose a self-heating electroforming cathode fixture and device with integrated megasonic vibration patch to solve or at least alleviate the above-mentioned defects. Summary of the Invention

[0006] The main purpose of the present application is to provide a self-heating electroforming cathode fixture and device with an integrated megasonic vibration patch, so as to solve the technical problems of the prior art in which the entire electroforming tank is heated and megasonically vibrated, resulting in large energy waste, large transmission loss of megasonic vibration in the electroforming liquid, and inability to effectively improve the temperature and flow field distribution in the local area of the cathode surface.

[0007] To achieve the above-mentioned object, the present application provides a self-heating electroforming cathode fixture with an integrated megasonic vibration patch, comprising an upper cathode cover plate, a lower cathode cover plate, a cathode assembly, and a sealing assembly, wherein the cathode assembly and the sealing assembly are both arranged between the upper cathode cover plate and the lower cathode cover plate; wherein: The cathode assembly includes a cathode wire, a megasonic wire, a piezoelectric ceramic sheet, a quartz sheet, and a cathode sheet stacked in sequence, wherein the megasonic wire is connected to the piezoelectric ceramic sheet, the piezoelectric ceramic sheet is bonded to the quartz sheet, the quartz sheet is directly in contact with the cathode sheet, and the cathode wire is connected to the cathode sheet; The bottom surface of the upper cathode cover plate is recessed with a first mounting groove that matches the quartz plate, and the quartz plate is placed in the first mounting groove. The bottom of the first mounting groove is recessed with a second mounting groove that matches the piezoelectric ceramic plate, and the piezoelectric ceramic plate is placed in the second mounting groove. The upper cathode cover plate is provided with a wire hole connected to the second mounting groove, so that the megasonic wire and the cathode wire can pass through to the outside. The lower cathode cover plate and the upper cathode cover plate are detachably connected, and the lower cathode cover plate is provided with a through hole for supplying molten metal to impact the cathode plate; The sealing assembly includes a first sealing structure and a second sealing structure. The top surface of the lower cathode cover plate is recessed with a third mounting groove that matches the first sealing structure. The first sealing structure is placed in the third mounting groove and the bottom surface of the cathode sheet is in direct contact and sealed with the first sealing structure. The second sealing structure is arranged on the outside of the first sealing structure and is clamped between the upper cathode cover plate and the lower cathode cover plate.

[0008] Preferably, the cathode wire is connected to the cathode sheet through a conductive component, and the conductive component includes a conductive part and a conductive copper sheet; wherein, the conductive part is placed on the outside of the first mounting groove and connected to the upper cathode cover plate, and the conductive copper sheet includes a first connecting part and a second connecting part, the first connecting part is connected to the conductive part, and the second connecting part is connected to the cathode sheet.

[0009] Preferably, the bottom surface of the upper cathode cover plate is provided with a plurality of positioning bosses surrounding the first mounting groove, and positioning holes corresponding to the positioning bosses are provided between the first connecting portion and the second connecting portion, and the positioning bosses are inserted into the corresponding positioning holes, the conductive part is located on the outside of the positioning bosses, and the cathode sheet is located on the inside of the positioning bosses, and the outer wall of the cathode sheet and the inner wall of the positioning bosses are matched.

[0010] Preferably, the conductive member includes a conductive ring and a T-shaped connecting terminal, the T-shaped connecting terminal is connected to the outer side wall of the conductive ring, and the cathode wire is connected to the T-shaped connecting terminal.

[0011] Preferably, the bottom surface of the upper cathode cover plate is further provided with a plurality of glue grooves, which are arranged at intervals around the conductive ring. The glue grooves and the conductive ring are arranged correspondingly, and the glue grooves are filled with glue to completely position the conductive ring.

[0012] Preferably, the upper cathode cover plate is provided with a first connection hole for the bolt to pass through, the lower cathode cover plate is provided with a plurality of second connection holes arranged in a one-to-one correspondence with the first connection holes, the second sealing structure is provided with a third connection hole arranged in a one-to-one correspondence with the first connection holes, and the upper cathode cover plate is detachably connected to the lower cathode cover plate by bolts passing through the first connection holes, the third connection holes and the second connection holes.

[0013] Preferably, the second connecting hole is a countersunk hole, and the head of the bolt is placed in the countersunk hole.

[0014] Preferably, the upper cathode cover plate and the lower cathode cover plate are both made of 3D printing resin material.

[0015] The present invention also provides a self-heating electroforming device with an integrated megasonic vibration patch, comprising an electroforming module, a cathode rotation module, an electroforming liquid circulation and filtration module, and the self-heating electroforming cathode fixture as described above; wherein; The electroforming module includes a water bath and an electroforming tank. The water bath is provided with a heating tube, a temperature sensor, and a support structure for supporting the electroforming tank. The electroforming tank is located within the water bath. The electroforming tank includes an anode and a shielding baffle. A flushing port corresponding to the through hole is provided in the middle of the shielding baffle, allowing the electroforming liquid in the electroforming tank to impact the cathode sheet. The self-heating electroforming cathode fixture is connected to the cathode rotating module and rotates synchronously with the cathode rotating module; The electroforming liquid circulation filtration module includes a pH meter probe, a filter and a hydraulic pump; wherein, the electroforming liquid flows from the electroforming tank through the first pipe adapter to the pH meter probe, then through the second pipe adapter to the filter, then through the third pipe adapter to the hydraulic pump, and then through the fourth pipe adapter back to the electroforming tank to achieve filtration circulation.

[0016] Preferably, the device further comprises a control module, wherein the control module comprises a single chip microcomputer, a first chip, a motor driver, a voltmeter, an ammeter, a pH meter, a second chip, a touch screen, a secure digital card, a megasonic generator, a relay and an electroforming power supply; The voltmeter is used to measure the voltage during the electroforming process, and the ammeter is used to measure the current during the electroforming process. The first chip is connected to the single-chip microcomputer, the voltmeter, the ammeter, and the pH meter, respectively, and transmits the signals of the pH meter, the voltmeter, and the ammeter to the single-chip microcomputer; The second chip is used to read the resistance change signal of the temperature sensor and transmit the resistance change signal to the single chip microcomputer, which controls the switch of the relay according to the resistance change signal to control the heating temperature of the heating tube; The single-chip microcomputer outputs PWM waveforms of different frequencies to the motor driver through a timer to realize speed control of the cathode rotation module, and controls the forward and reverse rotation of the cathode rotation module through the single-chip microcomputer. The single-chip microcomputer outputs PWM waveforms of different duty cycles to the megaacoustic generator to realize the megaacoustic generator to emit megaacoustic signals of different powers.

[0017] Compared with the prior art, this application has the following beneficial effects: The present invention provides a self-heating electroforming cathode fixture and device with an integrated megasonic vibration patch. By directly applying the megasonic vibration acting on the entire electroforming liquid system to the cathode sheet, the performance of the casting layer can be regulated. The heat-generating property of the megasonic vibration is utilized to achieve precise self-heating, thereby reducing the heating requirements for the electroforming liquid, achieving efficient energy utilization, and greatly reducing production costs. By patch-mounting the piezoelectric ceramic sheet, quartz sheet, and cathode sheet, high-frequency ultrasonic vibration is generated under the drive of the megasonic wire. The vibration is transmitted to the surface of the cathode sheet in direct contact with it through the bonded quartz sheet, ensuring that the vibration energy is efficiently and low-loss transmitted from the piezoelectric ceramic to the cathode working surface, greatly reducing the loss of megasonic transmission. Moreover, the megasonic wave has the advantages of strong penetrating ability, high energy density, and low cavitation effect. During operation, it does not damage the glue microstructure of the cathode surface. Therefore, it can be used to improve the temperature and flow field distribution in a local area of the cathode surface, thereby improving processing efficiency. In addition, the self-heating electroforming cathode fixture of the present application facilitates the installation and removal of the cathode sheet, and only allows the bottom surface of the cathode sheet to contact the electroforming liquid, thereby improving the targeted electroforming area. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the following briefly introduces the drawings required for use in the embodiments or the description of the prior art. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on the structures shown in these drawings without paying any creative work.

[0019] Figure 1 Schematic diagram of the overall structure of a self-heating electroforming cathode fixture in one embodiment of the present application; Figure 2 is a half-section schematic diagram of a self-heating electroforming cathode fixture in one embodiment of the present application; Figure 3 This is a schematic structural diagram of a self-heating electroforming cathode fixture in one embodiment of the present application with the lower cathode cover removed; Figure 4 Schematic diagram of the structure of the upper cathode cover plate in one embodiment of the present application; Figure 5 Schematic diagram of the structure of the lower cathode cover in one embodiment of the present application; Figure 6 Schematic diagram of the control of a self-heating electroforming cathode fixture in one embodiment of the present application; Figure 7 Schematic diagram of the overall structure of a self-heating electroforming device in one embodiment of the present application.

[0020] The purpose, features and advantages of this application will be further explained in conjunction with the embodiments and with reference to the accompanying drawings.

[0021] Description of Figure Numbers: 10. Upper cathode cover; 110. First mounting slot; 120. Second mounting slot; 130. Wire hole; 140. Positioning boss; 150. Glue groove; 160. Wire groove; 20. Lower cathode cover; 210. Bolt; 220. Countersunk hole; 230. Through hole; 30. Cathode assembly; 310. Cathode wire; 320. Megaacoustic wire; 330. Piezoelectric ceramic plate; 340. Quartz plate; 350. Cathode plate; 360. Conductive assembly; 361. Conductive member; 3611. Conductive ring; 3612. T-type connecting terminal; 362. Conductive copper sheet; 3621. First connecting portion; 3622. Second connecting portion; 40. Sealing assembly; 410. First sealing structure; 42 0. Second sealing structure; 430. Third mounting slot; 50. Electroforming module; 510. Water bath; 520. Heating tube; 530. Temperature sensor; 540. Electroforming tank; 550. Anode; 560. Shielding baffle; 570. Flushing port; 60. Cathode rotation module; 610. Stepper motor; 710. pH meter probe; 720. Filter; 730. Hydraulic pump; 810. Single chip microcomputer; 820. First chip; 830. Motor driver; 840. Voltmeter; 850. Ammeter; 860. pH meter; 870. Second chip; 880. Touch screen; 890. Secure digital card; 900. Megaacoustic generator; 910. Relay; 920. Electroforming power supply. DETAILED DESCRIPTION

[0022] It should be understood that the specific embodiments described herein are only used to explain the present application and are not intended to limit the present application.

[0023] The following will be combined with the drawings in the embodiments of this application to clearly and completely describe the technical solutions in the embodiments of this application. Obviously, the embodiments described are only part of the embodiments of this application, not all of the embodiments. Based on the embodiments of this application, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of this application.

[0024] It should be noted that all directional indications in the embodiments of the present application (such as up, down, left, right, front, back, etc.) are only used to explain the relative position relationship, movement status, etc. between the various components under a certain specific posture (as shown in the accompanying drawings). If the specific posture changes, the directional indication will also change accordingly.

[0025] In addition, the descriptions of "right part" and "middle part" in this application are for descriptive purposes only and should not be understood as indicating or implying their relative importance or implicitly indicating the number of technical features indicated. Therefore, the features defined as "right part" and "middle part" may explicitly or implicitly include at least one such feature. In addition, the technical solutions between the various embodiments can be combined with each other, but this must be based on the fact that ordinary technicians in this field can implement them. When the combination of technical solutions is contradictory or cannot be implemented, it should be deemed that such combination of technical solutions does not exist and is not within the scope of protection required by this application.

[0026] Those skilled in the art are aware that precision electroforming is a key process in LIGA technology, offering unparalleled advantages in the manufacture of microelectromechanical systems (MEMS) and precision molds. In particular, in the manufacture of polymer chips (such as microfluidics and acoustofluidics), micro-electroforming of high-performance, high-precision metal mold cores is a prerequisite for achieving precise, mass-produced polymer chips.

[0027] Backplate electroforming technology can replicate the fine patterns on the surface of the cathode template. By extending the electrodeposition time, it can form thick mold cores with a certain thickness and supporting strength. It can be directly fixed and installed in injection molding and hot pressing molds. It is currently the mainstream method for manufacturing precision mold cores containing micro-nano structures at home and abroad.

[0028] Please see the attached Figures 1 to 7 In one embodiment of the present application, a self-heating electroforming cathode fixture with an integrated megasonic vibration patch is provided, comprising an upper cathode cover plate 10, a lower cathode cover plate 20, a cathode assembly 30, and a sealing assembly 40. The cathode assembly 30 and the sealing assembly 40 are both disposed between the upper cathode cover plate 10 and the lower cathode cover plate 20; wherein: The cathode assembly 30 includes a cathode wire 310, a megasonic wire 320, a piezoelectric ceramic sheet 330, a quartz sheet 340, and a cathode sheet 350, which are stacked in sequence. The megasonic wire 320 is connected to the piezoelectric ceramic sheet 330, the piezoelectric ceramic sheet 330 is bonded to the quartz sheet 340, the quartz sheet 340 is in direct contact with the cathode sheet 350, and the cathode wire 310 is connected to the cathode sheet 350. Specifically, the bottom surface of the cathode plate 350 is the core surface where electroforming occurs, on which metal ions are reduced and deposited. The piezoelectric ceramic plate 330 acts as a transducer, generating high-frequency ultrasonic vibrations driven by the megasonic wire 320. The vibrations are transmitted to the surface of the cathode plate 350, which is in direct contact with it, through the bonded quartz plate 340, ensuring that the vibration energy is efficiently and low-loss transmitted from the piezoelectric ceramic to the cathode working surface. It should be noted that compared with the existing method of introducing an ultrasonic / megasonic vibration system in the electroforming area, the loss of ultrasonic vibrations transmitted in the electroforming liquid can be greatly reduced by the megasonic transmission method of this application.

[0029] The current required for electroforming is conducted through cathode wire 310, ensuring normal electroforming. Furthermore, the megasonic vibration heat generation property enables precise self-heating of cathode sheet 350, reducing the heating requirements for the electroforming liquid, achieving efficient energy utilization, and significantly reducing production costs. Furthermore, megasonics has the advantages of strong penetration, high energy density, and low cavitation, and does not damage the surface microstructure of the cathode sheet 350 during operation. The megasonic vibration sound flow helps the electroforming liquid penetrate deep into micropores or complex structures, improving dispersion and deep plating ability, effectively reducing electroforming defects, and facilitating the formation of precision metal components with good morphology, appearance, and excellent mechanical properties.

[0030] The bottom surface of the upper cathode cover plate 10 is recessed with a first mounting groove 110 that matches the quartz plate 340. The quartz plate 340 is placed in the first mounting groove 110. The bottom of the first mounting groove 110 is recessed with a second mounting groove 120 that matches the piezoelectric ceramic plate 330. The piezoelectric ceramic plate 330 is placed in the second mounting groove 120. The upper cathode cover plate 10 is provided with a wire hole 130 that communicates with the second mounting groove 120, so that the megasonic wire 320 and the cathode wire 310 can pass through to the outside. Specifically, the piezoelectric ceramic sheet 330 is placed in the second mounting groove 120 of the upper cathode cover plate 10, the quartz sheet 340 is placed in the first mounting groove 110 of the upper cathode cover plate 10, covering and adhering to the piezoelectric ceramic sheet 330, and the cathode sheet 350 is placed on the quartz sheet 340, in direct contact therewith. The cathode lead 310 is connected to the cathode sheet 350, or the cathode lead 310 is connected to the cathode sheet 350 via the conductive component 360.

[0031] The lower cathode cover plate 20 and the upper cathode cover plate 10 are detachably connected, and the lower cathode cover plate 20 is provided with a through hole 230 for allowing electroforming liquid to impact the cathode plate 350; the electroforming liquid flows through the through hole 230 and impacts the surface of the cathode plate 350, and the current flows into the cathode plate 350 through the cathode wire 310, and metal ion reduction deposition (electroforming) occurs on the surface of the cathode plate 350.

[0032] The sealing assembly 40 includes a first sealing structure 410 and a second sealing structure 420. The top surface of the lower cathode cover plate 20 is recessed with a third mounting groove 430 that matches the first sealing structure 410. The first sealing structure 410 is placed in the third mounting groove 430, and the bottom surface of the cathode sheet 350 is in direct contact and sealed with the first sealing structure 410. The second sealing structure 420 is arranged on the outside of the first sealing structure 410, and the second sealing structure 420 is clamped between the upper cathode cover plate 10 and the lower cathode cover plate 20.

[0033] It is worth noting that since the top surface of the cathode sheet 350 is not subjected to electroplating, it is sealed and does not come into contact with the electroforming liquid. The present application uses the first sealing structure 410 and the second sealing structure 420 to keep the space between the two in a dry environment, and can also prevent the electroforming liquid from entering and interacting with the cathode wire 310, thereby avoiding affecting the final electroforming effect; the upper cathode cover plate 10 and the lower cathode cover plate 20 are fastened by a detachable connection (such as a bolt 210 connection), and the second sealing structure 420 is clamped to form an outer seal, and the inner seal is achieved by setting the second sealing structure 420.

[0034] In the present application, the megasonic vibration acting on the entire electroforming liquid system is directly applied to the cathode plate 350 to achieve regulation of the casting layer performance, and the characteristic of vibration heat generation is utilized to achieve precise self-heating to reduce the heating requirements of the electroforming liquid, achieve efficient use of energy, and greatly reduce production costs; by patch-mounting the piezoelectric ceramic plate 330, the quartz plate 340 and the cathode plate 350, high-frequency ultrasonic vibration is generated under the drive of the megasonic wire 320, and the vibration is transmitted to the surface of the cathode plate 350 in direct contact with it through the bonded quartz plate 340, ensuring that the vibration energy is efficiently and low-loss transmitted from the piezoelectric ceramic to the cathode working surface, greatly reducing the loss of megasonic transmission. In addition, megasonics has the advantages of strong penetrating ability, high energy density, and low cavitation effect. During operation, it will not damage the glue microstructure on the cathode surface. Therefore, it can be used to improve the temperature and flow field distribution in the local area of the cathode surface and improve processing efficiency. In addition, the self-heating electroforming cathode fixture of the present application facilitates installation and removal of the cathode sheet 350 and only allows the bottom surface of the cathode sheet 350 to contact the electroforming liquid, thereby improving the specificity of the electroforming area.

[0035] As a preferred embodiment, Figure 3 As shown, the cathode lead 310 is connected to the cathode sheet 350 through a conductive component 360, and the conductive component 360 includes a conductive member 361 and a conductive copper sheet 362; wherein, the conductive member 361 is placed on the outside of the first mounting groove 110 and is connected to the upper cathode cover plate 10, and the conductive copper sheet 362 includes a first connecting portion 3621 and a second connecting portion 3622, the first connecting portion 3621 is connected to the conductive member 361, and the second connecting portion 3622 is connected to the cathode sheet 350.

[0036] It should be noted that conventional cathodes in the prior art are made of non-conductive materials. In this embodiment, cathode plate 350 is a silicon wafer with a photolithographic microstructure on its surface. This surface undergoes a conductive treatment (spray-coating with gold). Specifically, a magnetron sputtering process is used to deposit a 5-10nm layer of Cr or Ti as a bonding layer, followed by a 30-50nm layer of Au or Pt as a conductive layer. In this embodiment, cathode lead 310 is connected to the conductive layer of cathode plate 350 via conductive assembly 360. This not only ensures conductivity but also facilitates installation and removal of cathode plate 350. Cathode plate 350 is placed on a conductive copper plate 362.

[0037] As a preferred embodiment, the bottom surface of the upper cathode cover plate 10 is provided with a plurality of positioning bosses 140 surrounding the first mounting groove 110, and positioning holes (not shown in the figure) are provided between the first connecting portion 3621 and the second connecting portion 3622 and are arranged one-to-one with the positioning bosses 140. The positioning bosses 140 are inserted into the corresponding positioning holes, the conductive member 361 is located on the outside of the positioning bosses 140, and the cathode sheet 350 is located on the inside of the positioning bosses 140, and the outer wall of the cathode sheet 350 and the inner wall of the positioning bosses 140 are matched.

[0038] like Figure 3 As shown, through the cooperation of multiple positioning bosses 140 and positioning holes, the positioning bosses 140 and the conductive copper sheet 362 are accurately aligned, which simplifies the assembly requirements and has high positioning accuracy. At the same time, the outer wall of the cathode sheet 350 and the inner wall of the positioning boss 140 are matched. For example, the cathode sheet 350 is a circular sheet, and the inner wall of the positioning boss 140 is an arc-shaped surface. Relying on the positioning of the positioning boss 140, the positioning and installation of the cathode sheet 350 can be quickly achieved. After installation, the circumferential outer wall of the cathode sheet 350 and the arc-shaped surface of the positioning boss 140 are matched and contacted.

[0039] As a preferred embodiment, the conductive member 361 includes a conductive ring 3611 and a T-shaped connecting terminal 3612 . The T-shaped connecting terminal 3612 is connected to the outer wall of the conductive ring 3611 , and the cathode wire 310 is connected to the T-shaped connecting terminal 3612 .

[0040] like Figure 3 As shown, this embodiment provides a specific structural form of a conductive part 361, in which the conductive ring 3611 serves as the main conductor and bears the main current load, and the T-type connecting terminal 3612 serves as the external connecting terminal of the conductive ring 3611. The T-type connecting terminal 3612 is located on the outside of the conductive ring 3611, so as to facilitate connection with the cathode wire 310 and ensure connection reliability. Furthermore, in order to facilitate the routing of the cathode wire 310, a wire groove 160 is opened at the bottom of the upper cathode cover plate 10. The cathode wire 310 passes through the wire groove 160 and enters the wire hole 130, and is then connected to the power supply to realize continuous power supply to the cathode sheet 350 and ensure the normal operation of electroforming; at the same time, the megasonic wire 320 is also led out from the wire hole 130 and connected to the megasonic source to input high-frequency current to the piezoelectric ceramic sheet 330 to realize megasonic vibration. In order to prevent the electroforming liquid from entering the wire hole 130, the wire hole 130 is extended, as shown in FIG. Figure 2 shown.

[0041] Furthermore, the bottom surface of the upper cathode cover plate 10 is also provided with a plurality of glue grooves 150, and the plurality of glue grooves 150 are arranged at intervals around the conductive ring 3611. The glue grooves 150 and the conductive ring 3611 are arranged correspondingly, and the glue grooves 150 are filled with glue to completely position the conductive ring 3611.

[0042] In this embodiment, by filling glue into the glue groove 150, the conductive ring 3611 can be stably fixed, which can prevent the conductive ring 3611 from being displaced or loosened under complex working conditions, thereby ensuring stable electrical contact performance between the conductive ring 3611 and the conductive copper sheet 362. In addition, multiple glue grooves 150 can also provide a positioning basis for the installation of the glue groove 150, thereby improving positioning accuracy and reliability.

[0043] Furthermore, the upper cathode cover plate 10 is provided with a first connection hole (not shown) for the bolt 210 to pass through, the lower cathode cover plate 20 is provided with a plurality of second connection holes (not shown) arranged in a one-to-one correspondence with the first connection holes, and the second sealing structure 420 is provided with a third connection hole (not shown) arranged in a one-to-one correspondence with the first connection hole. The upper cathode cover plate 10 is detachably connected to the lower cathode cover plate 20 by the bolt 210 passing through the first connection hole, the third connection hole and the second connection hole.

[0044] In this embodiment, a detachable connection between the upper cathode cover plate 10 and the lower cathode cover plate 20 is achieved by bolts 210. The bolt 210 connection ensures the connection strength and the working stability of the self-heating electroforming cathode fixture. Since the upper cathode cover plate 10 and the lower cathode cover plate 20 are detachable, the upper cathode cover plate 10 and the lower cathode cover plate 20 can be disassembled after the current cathode sheet 350 is electroformed. By loosening and removing the bolts 210, the upper cathode cover plate 10, the second sealing structure 420 and the lower cathode cover plate 20 can be easily separated, and the electroformed cathode sheet 350 can be taken out and replaced with the next cathode sheet 350 to be electroformed. The assembly requirements are relatively low, which is conducive to improving assembly efficiency and quality consistency.

[0045] Preferably, the second connection hole is a countersunk hole 220, and the head of the bolt 210 is placed in the countersunk hole 220. It is worth noting that the second connection hole is a countersunk hole 220, and the head of the bolt 210 is placed in the countersunk hole 220 to ensure that there is no bulge on the lower cathode cover plate 20 after the bolt 210 is installed, so as not to affect the flow field distribution in front of the cathode plate 350 and the cooperation with the anode 550, thereby improving the final electroforming quality.

[0046] Preferably, the upper cathode cover plate 10 and the lower cathode cover plate 20 are both made of 3D printing resin material. 3D printing resin material can significantly reduce the overall weight of the fixture, facilitating precise control in electroforming equipment.

[0047] The present invention further provides a self-heating electroforming device with an integrated megasonic vibration patch, comprising an electroforming module 50, a cathode rotating module 60, an electroforming liquid circulation and filtration module (not shown), and the self-heating electroforming cathode fixture as described above; wherein; The electroforming module 50 includes a water bath 510 and an electroforming tank 540. The water bath 510 is provided with a heating tube 520, preferably a U-shaped heating tube 520, a temperature sensor 530, preferably a PT100 temperature sensor 530, and a support structure for supporting the electroforming tank 540, preferably made of acrylic. The electroforming tank 540 is disposed within the water bath 510. The electroforming tank 540 includes an anode 550 and a shielding baffle 560. A flushing port 570 corresponding to the through hole 230 is provided in the middle of the shielding baffle 560, allowing the electroforming liquid in the electroforming tank 540 to impact the cathode sheet 350. The self-heating electroforming cathode fixture is connected to the cathode rotating module 60 and rotates synchronously with the cathode rotating module 60. Preferably, the top of the upper cathode cover plate 10 is provided with an annular boss with a pin hole circumferentially formed therein. The cathode rotating module 60 is provided with a corresponding pin hole (not shown). A pin passes through the pin hole, enabling the self-heating electroforming cathode fixture to rotate synchronously with the cathode rotating module 60. In other embodiments, the self-heating electroforming cathode fixture and the cathode rotating module 60 may also be connected in other ways to achieve synchronous rotation.

[0048] The electroforming liquid circulation filtration module includes a pH meter probe 710, a filter 720 and a hydraulic pump 730; wherein, the electroforming liquid flows from the electroforming tank 540 through a first pipe adapter (not shown in the figure) to the pH meter probe 710, then through a second pipe adapter (not shown in the figure) to the filter 720, then through a third pipe adapter (not shown in the figure) to the hydraulic pump 730, and then through a fourth pipe adapter (not shown in the figure) back to the electroforming tank 540 to achieve a filtration cycle.

[0049] Preferably, the control module further comprises a single chip microcomputer 810, preferably an STM32F429 single chip microcomputer 810, a first chip 820, preferably an RS485 chip, a motor driver 830, a voltmeter 840, an ammeter 850, a pH meter 860, a second chip 870, preferably a MAX31865 chip, a touch screen 880, a secure digital card 890, i.e., an SD card, a mega-sound generator 900, a relay 910, and an electroforming power supply 920. The voltmeter 840 is used to measure the voltage during the electroforming process, and the ammeter 850 is used to measure the current during the electroforming process. The first chip 820 is connected to the single-chip microcomputer 810, the voltmeter 840, the ammeter 850, and the pH meter 860, respectively, and transmits the signals of the pH meter 860, the voltmeter 840, and the ammeter 850 to the single-chip microcomputer 810; The second chip 870 is used to read the resistance change signal of the temperature sensor 530 and transmit the resistance change signal to the single-chip microcomputer 810. The single-chip microcomputer 810 controls the switch of the relay 910 according to the resistance change signal to control the heating temperature of the heating tube 520. Specifically, the target temperature required by the cathode plate 350 can be determined based on preliminary tests, and the difference between the current temperature and the target temperature obtained according to the resistance change signal can be used to dynamically adjust the heating temperature of the heating tube 520.

[0050] The single-chip microcomputer 810 outputs PWM waveforms of different frequencies to the motor driver 830 through a timer to realize speed control of the cathode rotation module 60, and controls the forward and reverse rotation of the cathode rotation module 60 through the single-chip microcomputer 810. The single-chip microcomputer 810 outputs PWM waveforms of different duty cycles to the megaacoustic generator 900 to realize the megaacoustic generator 900 to emit megaacoustic signals of different powers.

[0051] Preferably, the timer adopts a TIM timer, which outputs high and low levels through the IO port to realize the forward and reverse rotation of the stepper motor 610. Furthermore, through the FSMC interface, the microcontroller 810 is connected to an external memory chip to realize the display of the touch screen 880, and communicates with the IIC of the capacitive screen to realize the touch control of the touch screen 880; through the SDIO interface and related commands, communication with the secure digital card 890 is realized to realize the storage of voltage, current, temperature, and pH value data.

[0052] The above are only preferred embodiments of the present application and do not limit the patent scope of the present application. Any equivalent structure or equivalent process transformation made using the contents of the present application specification and drawings, or directly or indirectly applied in other related technical fields, are also included in the patent protection scope of the present application.

Claims

1. A self-heating electroforming cathode fixture with integrated megasonic vibration patch, characterized in that: It includes an upper cathode cover plate, a lower cathode cover plate, a cathode assembly and a sealing assembly, wherein the cathode assembly and the sealing assembly are both arranged between the upper cathode cover plate and the lower cathode cover plate; wherein: The cathode assembly includes a cathode wire, a megasonic wire, a piezoelectric ceramic sheet, a quartz sheet, and a cathode sheet stacked in sequence, wherein the megasonic wire is connected to the piezoelectric ceramic sheet, the piezoelectric ceramic sheet is bonded to the quartz sheet, the quartz sheet is directly in contact with the cathode sheet, and the cathode wire is connected to the cathode sheet; The bottom surface of the upper cathode cover plate is recessed with a first mounting groove that matches the quartz plate, and the quartz plate is placed in the first mounting groove. The bottom of the first mounting groove is recessed with a second mounting groove that matches the piezoelectric ceramic plate, and the piezoelectric ceramic plate is placed in the second mounting groove. The upper cathode cover plate is provided with a wire hole connected to the second mounting groove, so that the megasonic wire and the cathode wire can pass through to the outside. The lower cathode cover plate and the upper cathode cover plate are detachably connected, and the lower cathode cover plate is provided with a through hole for supplying molten metal to impact the cathode plate; The sealing assembly includes a first sealing structure and a second sealing structure. The top surface of the lower cathode cover plate is recessed with a third mounting groove that matches the first sealing structure. The first sealing structure is placed in the third mounting groove and the bottom surface of the cathode sheet is in direct contact and sealed with the first sealing structure. The second sealing structure is arranged on the outside of the first sealing structure and is clamped between the upper cathode cover plate and the lower cathode cover plate.

2. The self-heating electroforming cathode fixture with integrated megasonic vibration patch according to claim 1, characterized in that: The cathode wire is connected to the cathode sheet through a conductive assembly, and the conductive assembly includes a conductive member and a conductive copper sheet; wherein the conductive member is placed on the outside of the first mounting groove and connected to the upper cathode cover plate, and the conductive copper sheet includes a first connecting portion and a second connecting portion, the first connecting portion is connected to the conductive member, and the second connecting portion is connected to the cathode sheet.

3. The self-heating electroforming cathode fixture with integrated megasonic vibration patch according to claim 2, characterized in that: The bottom surface of the upper cathode cover plate is provided with a plurality of positioning bosses surrounding the first mounting groove, and positioning holes corresponding to the positioning bosses are provided between the first connecting portion and the second connecting portion, and the positioning bosses are inserted into the corresponding positioning holes. The conductive part is located on the outside of the positioning bosses, and the cathode sheet is located on the inside of the positioning bosses, and the outer wall of the cathode sheet and the inner wall of the positioning boss are matched.

4. The self-heating electroforming cathode fixture with integrated megasonic vibration patch according to claim 2, characterized in that: The conductive member includes a conductive ring and a T-shaped connecting terminal. The T-shaped connecting terminal is connected to the outer side wall of the conductive ring. The cathode wire is connected to the T-shaped connecting terminal.

5. The self-heating electroforming cathode fixture with integrated megasonic vibration patch according to claim 4, characterized in that: The bottom surface of the upper cathode cover plate is also provided with a plurality of glue grooves, which are arranged at intervals around the conductive ring. The glue grooves and the conductive ring are arranged correspondingly. The glue grooves are filled with glue to completely position the conductive ring.

6. The self-heating electroforming cathode fixture with integrated megasonic vibration patch according to claim 1, characterized in that: The upper cathode cover plate is provided with a first connection hole for the bolt to pass through, the lower cathode cover plate is provided with a plurality of second connection holes arranged in a one-to-one correspondence with the first connection holes, the second sealing structure is provided with a third connection hole arranged in a one-to-one correspondence with the first connection holes, and the upper cathode cover plate is detachably connected to the lower cathode cover plate by bolts passing through the first connection holes, the third connection holes and the second connection holes.

7. The self-heating electroforming cathode fixture with integrated megasonic vibration patch according to claim 6, characterized in that: The second connecting hole is a countersunk hole, and the head of the bolt is placed in the countersunk hole.

8. The self-heating electroforming cathode fixture with integrated megasonic vibration patch according to any one of claims 1 to 7, characterized in that: The materials of the upper cathode cover plate and the lower cathode cover plate are both 3D printing resin materials.

9. A self-heating electroforming device with integrated megasonic vibration patch, characterized in that: It comprises an electroforming module, a cathode rotating module, an electroforming liquid circulation and filtration module, and a self-heating electroforming cathode fixture as claimed in any one of claims 1 to 8; wherein; The electroforming module includes a water bath and an electroforming tank. The water bath is provided with a heating tube, a temperature sensor, and a support structure for supporting the electroforming tank. The electroforming tank is located within the water bath. The electroforming tank includes an anode and a shielding baffle. A flushing port corresponding to the through hole is provided in the middle of the shielding baffle, allowing the electroforming liquid in the electroforming tank to impact the cathode sheet. The self-heating electroforming cathode fixture is connected to the cathode rotating module and rotates synchronously with the cathode rotating module; The electroforming liquid circulation filtration module includes a pH meter probe, a filter and a hydraulic pump; wherein, the electroforming liquid flows from the electroforming tank through the first pipe adapter to the pH meter probe, then through the second pipe adapter to the filter, then through the third pipe adapter to the hydraulic pump, and then through the fourth pipe adapter back to the electroforming tank to achieve filtration circulation.

10. The self-heating electroforming device with integrated megasonic vibration patch according to claim 9, characterized in that: The device further comprises a control module, wherein the control module comprises a single chip microcomputer, a first chip, a motor driver, a voltmeter, an ammeter, a pH meter, a second chip, a touch screen, a secure digital card, a mega-sound generator, a relay and an electroforming power supply; The voltmeter is used to measure the voltage during the electroforming process, and the ammeter is used to measure the current during the electroforming process. The first chip is connected to the single-chip microcomputer, the voltmeter, the ammeter, and the pH meter, respectively, and transmits the signals of the pH meter, the voltmeter, and the ammeter to the single-chip microcomputer; The second chip is used to read the resistance change signal of the temperature sensor and transmit the resistance change signal to the single chip microcomputer, which controls the switch of the relay according to the resistance change signal to control the heating temperature of the heating tube; The single-chip microcomputer outputs PWM waveforms of different frequencies to the motor driver through a timer to realize speed control of the cathode rotation module, and controls the forward and reverse rotation of the cathode rotation module through the single-chip microcomputer. The single-chip microcomputer outputs PWM waveforms of different duty cycles to the megaacoustic generator to realize the megaacoustic generator to emit megaacoustic signals of different powers.

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