Electroplating assembly and equipment

Abstract

The invention provides an electroplating assembly and equipment, the electroplating assembly is applied to vertical double-sided through hole electroplating, the electroplating assembly is composed of two cathode assemblies, and conductive locking sealing structures are arranged on the two cathode assemblies. The conductive locking and sealing structure comprises a locking structure, a sealing structure and a conductive structure, the locking structure is in an electric control permanent magnetic chuck design and comprises a chuck frame and a permanent magnet, no adsorption force is generated when power is on, the adsorption force is kept to clamp the substrate when power is off, and mechanical stress damage is avoided; the sealing structure is a butterfly valve sealing structure, and when the locking structure clamps the base plate, the sealing structure is pressed on the outer edge of the base plate to form closed-loop sealing; the conductive structure comprises a plurality of conductive teeth which are pre-embedded in the butterfly valve and are uniformly arranged, and the conductive teeth and the substrate are crimped to form a uniform current path. The first cathode assembly further comprises a rapid conductive structure, and the rapid conductive structure is physically connected with the electroplating bath in an inserted mode to achieve wire-free electrification. According to the design, the safety, the energy-saving property and the process reliability of electroplating are remarkably improved.

Description

Technical Field

[0001] The present invention relates to the field of semiconductor technology, and in particular to an electroplating component and equipment. Background Art

[0002] With the rapid development of semiconductor packaging technology, TGV (through-glass via) technology has gradually become an important alternative to traditional through-silicon via (TSV) technology due to its advantages such as high electrical performance and low cost. However, the application of TGV technology in electroplating equipment is still in its infancy and lacks mature solutions.

[0003] In the field of TGV electroplating equipment, the traditional conductive sealing head design has many shortcomings. For example, after the upper and lower substrates, the traditional head locking method usually adopts mechanical locking. This design is cumbersome and complicated in operation, has a slow response speed, and cannot keep the substrate fixed in the event of a power outage, posing a safety hazard. In addition, the traditional sealing structure mostly uses circular or strip sealing rings. This design is not as good as the butterfly valve in sealing effect, which affects the quality of electroplating. In terms of conductive structure, traditional designs mostly rely on wire connections. This method has limitations in liquid diversion and electromagnet control logic, which is not conducive to a fast and efficient electroplating process. Summary of the Invention

[0004] In response to the defects in the prior art, the purpose of the present invention is to provide an electroplating component and equipment, which simultaneously realizes the three functions of safe clamping of the substrate, zero leakage sealing, and uniform current conduction by integrating an electrically controlled permanent magnetic suction cup, a butterfly valve sealing mechanism and a pre-embedded conductive tooth structure. Combined with the physical plug-in power supply design of the conductive block and the electroplating tank, it significantly improves the safety, energy saving, efficiency and uniformity of vertical double-sided through-hole electroplating, and comprehensively optimizes the reliability and energy efficiency of high-frequency precision electroplating conditions.

[0005] According to a first aspect of the present invention, there is provided an electroplating assembly comprising a first cathode assembly and a second cathode assembly;

[0006] The first cathode assembly and the second cathode assembly both include a conductive locking and sealing structure, which is used to clamp the substrate to be electroplated; the conductive locking and sealing structure integrates a locking structure, a sealing structure and a conductive structure;

[0007] The locking structure adopts an electrically controlled permanent magnetic chuck design, which is configured to have no adsorption force when powered on and maintain adsorption force when powered off; the first cathode assembly and the second cathode assembly are kept in an adsorption state by the electrically controlled permanent magnetic chuck when powered off;

[0008] The sealing structure is designed as a butterfly valve sealing mechanism, which is arranged in the electrically controlled permanent magnetic chuck. When the first cathode assembly and the second cathode assembly are attracted to each other, the butterfly valve sealing mechanism is pressed against the outer edge of the substrate to be electroplated to form a closed-loop seal.

[0009] The conductive structure includes a plurality of conductive teeth evenly distributed on the butterfly valve sealing mechanism; when the butterfly valve sealing structure is pressed onto the outer edge of the substrate to be electroplated, the conductive teeth and the substrate to be electroplated are attached to form a conductive path;

[0010] The main body of the first cathode assembly also includes a fast conductive structure, which is used to be electrically connected to the electroplating tank; a conductive block is provided on the fast conductive structure, and the conductive block can form a conductive path with the electroplating tank through physical plug-in contact.

[0011] In this technical solution, by integrating an electrically controlled permanent magnetic suction cup (unlocked when powered on / locked when powered off), a butterfly valve sealing mechanism and a conductive tooth structure, the three major functions of safe clamping of the substrate to be electroplated (to prevent it from falling off when powered off), zero leakage sealing, and uniform current conduction are simultaneously achieved. Combined with the fast conductive structure and the physical plug-in power supply design of the electroplating tank, the safety of electroplating (avoiding accidental power off and falling off), energy saving (electrically controlled permanent magnetic suction cup eliminates continuous power consumption), high efficiency (millisecond response) and electroplating uniformity are significantly improved, and the reliability and energy efficiency of high-frequency precision electroplating conditions are comprehensively optimized.

[0012] Optionally, the main body of the first cathode assembly further includes a conductive base, the conductive locking and sealing structure is arranged on the conductive base, and the fast conductive structure is arranged on the top of the conductive base.

[0013] Optionally, the electrically controlled permanent magnetic suction cup includes a suction cup frame structure, which is provided with a hollow portion and a plurality of permanent magnets evenly arranged around the hollow portion. The permanent magnets are configured to have no adsorption force when powered on and maintain adsorption force when powered off.

[0014] Optionally, a plurality of evenly distributed liquid guide structures are provided on the inner edge of the lower frame of the suction cup frame structure, and the liquid guide structures are designed as notch-type guide channels with a downward slope.

[0015] In the present technical solution, a liquid diversion structure is provided on the inner edge of the lower frame of the suction cup frame structure. When the electroplating is completed, the electrically controlled permanent magnetic suction cups on the first cathode assembly and the second cathode assembly clamp the substrate to be electroplated, lift it and move it out of the liquid surface of the electroplating tank, and the electroplating liquid remaining on the surface of the substrate can be directed back to the inside of the electroplating tank through the diversion channel under the action of gravity, thereby effectively preventing the electroplating liquid from adhering to and corroding the cathode assembly for a long time.

[0016] Optionally, the butterfly valve sealing mechanism is made of an integrally formed fluororubber material.

[0017] In this technical solution, the butterfly valve sealing mechanism is made of an integrally molded fluororubber material to replace the traditional circular or strip sealing ring structure, thereby achieving a better sealing effect at the periphery of the substrate.

[0018] Optionally, the size of the butterfly valve sealing mechanism is 20 inches.

[0019] Optionally, a conductive tooth seat is pre-embedded in the butterfly valve sealing mechanism, and the conductive teeth are evenly distributed on the conductive tooth seat.

[0020] Optionally, the conductive gear seat includes stainless steel.

[0021] In this technical solution, the conductive tooth seat includes stainless steel material, which can form an electroplating tank, a rapid conductive structure, a pre-embedded conductive tooth seat, and a conductive path of the conductive teeth.

[0022] Optionally, the conductive teeth are made of titanium-copper alloy.

[0023] In this technical solution, when the conductive teeth come into contact with the substrate to be plated, they can be forced to deform elastically due to the elasticity of their material, thereby buffering the contact stress. This feature effectively ensures that good and stable electrical contact reliability is maintained during repeated operations.

[0024] Optionally, the conductive block includes a copper alloy material.

[0025] The above-mentioned electroplating component is applied to vertical double-sided through-hole electroplating.

[0026] According to a second aspect of the present invention, an electroplating device is provided, comprising the above-mentioned electroplating component and an electroplating tank, wherein the electroplating tank is provided with a docking interface for engaging with a fast conductive structure in the electroplating component to achieve conductivity, thereby performing vertical double-sided through-hole electroplating.

[0027] Compared with the prior art, the present invention has the following beneficial effects:

[0028] 1. The electroplating components and equipment provided by the present invention use an electrically controlled permanent magnetic suction cup to replace the mechanical locking structure, maintaining the adsorption force when the power is off, completely preventing the substrate from accidentally falling off; there is no mechanical stress when the power is turned on to release the adsorption, eliminating the risk of substrate damage; at the same time, only instantaneous current is required when switching the magnetic field, maintaining zero energy consumption to maintain the lock, significantly saving energy, and adapting to high-frequency, high-precision operation scenarios.

[0029] 2. The electroplating components and equipment provided by the present invention use a butterfly valve sealing mechanism to replace the traditional sealing ring. By coordinating the pressing with the suction cup frame structure, the sealing reliability is significantly improved, and the leakage of the electroplating solution is effectively blocked.

[0030] 3. In the electroplating components and equipment provided by the present invention, evenly distributed conductive teeth are provided on the butterfly valve sealing mechanism. The conductive teeth are directly pressed against the outer edge of the substrate to form a uniform conductive network, thereby reducing electroplating dead angles and improving the uniformity of current density distribution.

[0031] 4. The electroplating components and equipment provided by the present invention use a fast conductive structure and a physical embedding method with the electroplating tank to achieve wire-free power supply, eliminating the steps of plugging and unplugging cables, and greatly simplifying the cathode component removal process. BRIEF DESCRIPTION OF THE DRAWINGS

[0032] Other features, objects and advantages of the present invention will become more apparent upon reading the detailed description of non-limiting embodiments with reference to the following drawings:

[0033] Figure 1 Schematic diagram of the structure of the first cathode assembly described in the first embodiment;

[0034] Figure 2 Schematic diagram of the structure of the second cathode assembly described in the first embodiment;

[0035] Figure 3 is a cross-sectional view of a first cathode assembly and a second cathode assembly sandwiching a substrate, wherein the shaded portion shows the first cathode assembly portion;

[0036] Figure 4 is a cross-sectional view of a first cathode assembly and a second cathode assembly sandwiching a substrate, wherein the shaded portion shows the second cathode assembly portion;

[0037] Figure 5 is a partially enlarged schematic diagram of a cross-sectional view of the first cathode assembly and the second cathode assembly clamping the substrate;

[0038] Figure 6 The structural relationship between the liquid guide structure and the first suction cup frame is shown in FIG;

[0039] Figure 7 : shows an enlarged structural schematic diagram of the liquid guide structure;

[0040] Figure 8 Schematic diagram of the structure of the electroplating equipment described in the second embodiment.

[0041] 1-First cathode assembly

[0042] 2-Second cathode assembly

[0043] 3-Conductive base

[0044] 4-Electroplating tank

[0045] 5-Substrate

[0046] 6-First suction cup frame

[0047] 7-Second suction cup frame

[0048] 8-First hollow part

[0049] 9-Second hollow part

[0050] 10-First permanent magnet

[0051] 11-Second permanent magnet

[0052] 12-Liquid diversion structure

[0053] 13-First seal

[0054] 14-Second seal

[0055] 15-First gear seat

[0056] 16-Second gear seat

[0057] 17-Conductive teeth

[0058] 18-Conductive block

[0059] 19- Docking interface DETAILED DESCRIPTION

[0060] To make the objectives, technical solutions, and advantages of the embodiments of the present application more clear, the technical solutions in the embodiments of the present application will be clearly and completely described below in conjunction with the accompanying drawings of the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, not all of the embodiments. Generally, the components of the embodiments of the present application described and shown in the drawings herein can be arranged and designed in various different configurations.

[0061] Therefore, the following detailed description of the embodiments of the present application provided in the accompanying drawings is not intended to limit the scope of the present application for protection, but merely represents selected embodiments of the present application. All other embodiments obtained by persons of ordinary skill in the art based on the embodiments in the present application without making any creative efforts shall fall within the scope of protection of the present application.

[0062] It should be noted that similar numbers and letters represent similar items in the following figures. Therefore, once an item is defined in one figure, it does not need to be further defined or explained in subsequent figures. In addition, all directional indications in this application (such as up, down, left, right, front, back, bottom...) are only used to explain the relative position relationship, movement, etc. between the components under a specific posture (as shown in the figures). If the specific posture changes, the directional indication will also change accordingly. Furthermore, the descriptions of "first", "second", etc. in the application are for descriptive purposes only and cannot be understood as indicating or implying their relative importance or implicitly indicating the number of the indicated technical features.

[0063] Example 1

[0064] This embodiment provides an electroplating assembly, which is used for vertical double-sided through-hole electroplating, including: Figure 1 The first cathode assembly 1 shown and Figure 2 The second cathode assembly 2 shown, the first cathode assembly 1 and the second cathode assembly 2 both include conductive locking and sealing devices, and the two can fit together in the power-off state to clamp the substrate 5 to be electroplated. The cross-sectional view of the first cathode assembly 1 and the second cathode assembly 2 clamping the substrate 5 to be electroplated is shown in FIG. Figure 3 、 Figure 4 As shown ( Figure 3 The shaded part in the figure is the first cathode assembly 1. Figure 4 The shaded portion in FIG. 2 is the second cathode assembly 2).

[0065] The conductive locking and sealing structure is mainly used to clamp and fix the substrate 5 to be electroplated. It integrates three key parts: a locking structure for clamping and fixing the substrate 5 to be electroplated, a sealing structure for preventing leakage of the electroplating solution, and a conductive structure for forming an electroplating current path. Specifically:

[0066] The locking structure utilizes an electrically controlled permanent magnetic chuck, which is configured to have no suction force when powered on and maintain suction force when powered off. The electrically controlled permanent magnetic chuck maintains suction to the first and second cathode assemblies 1 and 2 in the powered-off state. In this embodiment, the locking structure utilizes an electrically controlled permanent magnetic chuck instead of a traditional mechanical locking method. As a core component, the electrically controlled permanent magnetic chuck integrates electromagnetic control and permanent magnet properties and is controlled by an external electrical signal. Compared to mechanical locking methods, this design significantly improves safety and reliability when clamping the substrate 5 to be plated for electroplating. It offers the following advantages: First, low energy consumption: The electrically controlled permanent magnetic chucks of the first and second cathode assemblies 1 and 2 only require instantaneous current (power on activation / power off deactivation) when switching the magnetic field state (on / off). No continuous power is required to maintain the electrically controlled permanent magnetic chucks' mutual suction to clamp the substrate 5. Second, high safety: When external power is applied (on), the electro-controlled permanent magnetic chuck has no attraction. When external power is removed (off / locked), the electro-controlled permanent magnetic chuck maintains attraction. This feature effectively prevents the substrate 5 from falling out of the first cathode assembly 1 and the second cathode assembly 2 due to an unexpected power outage. Third, fast response: The electro-controlled permanent magnetic chuck's magnetic field state switching time is fast, meeting the processing requirements of high-frequency operation and high-precision positioning of the substrate 5. Fourth, maintenance-free: The core electro-controlled permanent magnetic chuck has no moving parts, completely eliminating mechanical wear and tear. The theoretical service life is long (expected to be over 10 years), requiring no regular replacement or maintenance. Fifth, strong attraction: The electro-controlled permanent magnetic chuck utilizes high-energy-grade permanent magnets to provide strong, stable attraction. Testing has proven that it can hold (adsorb) substrates 5 weighing up to 50 kg.

[0067] The sealing structure for preventing leakage of electroplating solution is designed as a butterfly valve sealing mechanism, which is arranged in the said electric-controlled permanent magnetic chuck. When the first cathode assembly 1 and the second cathode assembly 2 are attracted to each other, the said butterfly valve sealing mechanism is pressed against the outer edge of the substrate to be electroplated to form a closed-loop seal. Specifically, Figure 5As shown, corresponding sealing structures, namely the first seal 13 and the second seal 14, are fixedly arranged inside the electrically controlled permanent magnetic suction cups of the first cathode assembly 1 and the second cathode assembly 2. In this embodiment, the first seal 13 and the second seal 14 are both designed as butterfly valve sealing mechanisms to replace the traditional circular or strip sealing ring structure, thereby achieving a better sealing effect around the periphery of the substrate 5. When the electrically controlled permanent magnetic suction cups of the first cathode assembly 1 and the second cathode assembly 2 clamp the substrate 5 to be electroplated, the first seal 13 and the second seal 14 are driven by the clamping force to press tightly against the outer edge area of the substrate 5, respectively, and form a continuous and uninterrupted closed-loop sealing surface along the circumference of the substrate 5. This sealing surface effectively confines the electroplating liquid to the electroplating area formed by the exposed double sides of the substrate 5 and the inner wall of its through hole, thereby achieving reliable leakage isolation.

[0068] like Figure 5 As shown, the conductive structure includes several conductive teeth 17 evenly distributed on the butterfly valve sealing mechanism. When the butterfly valve sealing structure is pressed against the outer edge of the substrate 5 to be plated, the conductive teeth 17 and the substrate 5 to be plated form a conductive path. By adopting this conductive structure, the conductive teeth 17 not only establish a current path between the substrate 5 and the conductive teeth 17, but their regular arrangement also helps optimize the current density distribution flowing through the substrate 5 surface, effectively reducing electroplating blind spots.

[0069] like Figure 1 、 Figure 8 As shown, the main body of the first cathode assembly 1 also includes a fast conductive structure, which is used to electrically connect to the electroplating tank 4. A conductive block 18 is provided on the fast conductive structure, and the conductive block 18 can form a conductive path with the electroplating tank 4 through physical plug-in contact. When the first cathode assembly 1 moves into the electroplating tank 4, the conductive block 18 is directly embedded in the docking interface 19 on the side wall of the electroplating tank 4 to form a physical contact conductive path; the current is conducted from the electroplating tank 4 to the conductive block 18 through the embedded contact interface, and further conducted by the conductive block 18 to the first cathode assembly 1, and then conducted to the substrate 5 and the second cathode assembly 2 through the conductive structure in the first cathode assembly 1. This design replaces the traditional wire connection method, realizes a wire-free and physical embedded contact method for power transmission, and also simplifies the operation of taking the cathode assembly (no need to plug and unplug cables).

[0070] In some possible implementations, such as Figure 1 As shown, the main body of the first cathode assembly 1 further includes a conductive base 3 , the conductive locking and sealing structure is arranged on the conductive base 3 , and the fast conductive structure is arranged on the top of the conductive base 3 .

[0071] In some possible implementations, the electrically controlled permanent magnetic chuck includes a chuck frame structure, wherein the chuck frame structure is provided with a hollow portion and a plurality of permanent magnets uniformly arranged around the hollow portion, wherein the permanent magnets are configured to have no adsorption force when powered on and maintain adsorption force when powered off. Figure 1 、 2 As shown, the suction cup frame structure includes a first suction cup frame 6 on the first cathode assembly 1 and a second suction cup frame 7 on the second cathode assembly 2. The first suction cup frame 6 and the second suction cup frame 7 are respectively provided with a first hollow portion 8 and a second hollow portion 9 for exposing the electroplated surface of the substrate 5, and a plurality of first permanent magnets 10 and a second permanent magnet 11 arranged around the first hollow portion 8 and the second hollow portion 9. The first permanent magnet 10 and the second permanent magnet 11 are configured to have no adsorption force when powered on and maintain adsorption force when powered off. The first suction cup frame 6 and the second suction cup frame 7 are mutually adsorbed by the first permanent magnet 10 and the second permanent magnet 11 to clamp the substrate 5. Therefore, when the power is on, the substrate 5 to be electroplated can be placed between the first suction cup frame 6 and the second suction cup frame 7, so that the upper and lower plating surfaces of the substrate 5 to be electroplated are exposed through the first hollow part 8 and the second hollow part 9 respectively, and then the first suction cup frame 6 and the second suction cup frame 7 are attached and the power is turned off, so that they maintain the adsorption state based on the first permanent magnet 10 and the second permanent magnet 11, thereby clamping the substrate 5.

[0072] In some possible implementations, such as Figure 6 、 Figure 7 As shown, a number of evenly distributed liquid guide structures 12 are provided on the inner edge of the lower frame of the suction cup frame structure; the liquid guide structure 12 is designed as a notch-type guide channel with a downward slope. Specifically, a number of evenly distributed liquid guide structures 12 are provided at the positions where the inner edges of the lower frames of the first suction cup frame 6 and the second suction cup frame 7 contact the outer edge of the substrate 5. The liquid guide structure 12 is designed as a notch-type guide channel with a downward slope. Its function is that when the electroplating is completed, the first suction cup frame 6 and the second suction cup frame 7 clamp the substrate 5, lift it and move it out of the liquid level of the electroplating tank 4, the electroplating liquid remaining on the surface of the substrate 5 can be directed back to the inside of the electroplating tank 4 through the guide channel under the action of gravity, thereby effectively preventing the electroplating liquid from adhering to and corroding the cathode assembly for a long time.

[0073] In some possible implementations, the butterfly valve sealing mechanism is made of an integrally formed fluororubber material to replace a traditional circular or strip-shaped sealing ring structure, thereby achieving a better sealing effect around the periphery of the substrate 5 .

[0074] In some possible implementations, the size of the butterfly valve sealing mechanism matches the size of the substrate to be electroplated. In this embodiment, the size of the butterfly valve sealing mechanism is 20 inches.

[0075] In some possible implementations, a conductive tooth seat is pre-embedded in the butterfly valve sealing mechanism, and the conductive teeth are evenly distributed on the conductive tooth seat. Figure 5 As shown, corresponding conductive tooth seats, namely the first tooth seat 15 and the second tooth seat 16, are pre-installed and fixed inside the first seal 13 and the second seal 14. A plurality of conductive teeth 17 are evenly arranged on the first tooth seat 15 and the second tooth seat 16.

[0076] In some possible implementations, the conductive tooth seats (the first tooth seat 15 and the second tooth seat 16 ) can be made of conductive and stable materials such as stainless steel.

[0077] In some possible embodiments, the conductive teeth 17 are preferably made of a titanium-copper alloy. When pressed against the substrate 5, the conductive teeth 17 can undergo forced elastic deformation due to the elasticity of the material, thereby buffering contact stress. This property effectively ensures good and stable electrical contact reliability during repeated operation.

[0078] In some possible embodiments, the conductive block 18 can be made of a conductive and stable material such as copper alloy, and a docking interface 19 matching the shape of the conductive block 18 is provided on the side wall of the electroplating tank 4 for physical plugging with the conductive block 18 to achieve electrical connection.

[0079] Example 2

[0080] like Figure 8 As shown, this embodiment provides an electroplating device for vertical double-sided through-hole electroplating, including the electroplating component for vertical double-sided through-hole electroplating and the electroplating tank 4 described in Example 1. The electroplating tank 4 is provided with a docking interface 19 for engaging with the fast conductive structure in the electroplating component to achieve conductivity, thereby performing vertical double-sided through-hole electroplating.

[0081] The above describes the specific embodiments of the present invention. Based on the above description, relevant personnel can make various changes and modifications without departing from the scope of the technical concept of this invention.

Claims

1. An electroplating component, characterized in that: including a first cathode assembly and a second cathode assembly; The first cathode assembly and the second cathode assembly both include a conductive locking and sealing structure, which is used to clamp the substrate to be electroplated; the conductive locking and sealing structure integrates a locking structure, a sealing structure and a conductive structure; The locking structure adopts an electrically controlled permanent magnetic chuck design, which is configured to have no adsorption force when powered on and maintain adsorption force when powered off; the first cathode assembly and the second cathode assembly are kept in an adsorption state by the electrically controlled permanent magnetic chuck when powered off; The sealing structure is designed as a butterfly valve sealing mechanism, which is arranged in the electrically controlled permanent magnetic chuck. When the first cathode assembly and the second cathode assembly are attracted to each other, the butterfly valve sealing mechanism is pressed against the outer edge of the substrate to be electroplated to form a closed-loop seal. The conductive structure includes a plurality of conductive teeth evenly distributed on the butterfly valve sealing mechanism; when the butterfly valve sealing structure is pressed onto the outer edge of the substrate to be electroplated, the conductive teeth and the substrate to be electroplated are attached to form a conductive path; The main body of the first cathode assembly also includes a fast conductive structure for electrically connecting to the electroplating tank; the fast conductive structure is provided with a conductive block, and the conductive block can form a conductive path with the electroplating tank through physical plug-in contact.

2. The electroplating assembly according to claim 1, characterized in that The main body of the first cathode assembly further includes a conductive base, the conductive locking and sealing structure is arranged on the conductive base, and the fast conductive structure is arranged on the top of the conductive base.

3. The electroplating assembly according to claim 1, characterized in that: The electrically controlled permanent magnetic suction cup includes a suction cup frame structure, which is provided with a hollow portion and a plurality of permanent magnets uniformly arranged around the hollow portion. The permanent magnets are configured to have no adsorption force when powered on and maintain adsorption force when powered off.

4. The electroplating assembly according to claim 3, characterized in that: A plurality of evenly distributed liquid guide structures are arranged on the inner edge of the lower frame of the suction cup frame structure. The liquid guide structures are designed as notch-type guide channels with a downward slope.

5. The electroplating assembly according to claim 1, wherein: The butterfly valve sealing mechanism is made of fluororubber material in one piece.

6. The electroplating assembly according to claim 5, characterized in that: The size of the butterfly valve sealing mechanism is 20 inches.

7. The electroplating assembly according to claim 1, wherein: A conductive tooth seat is pre-buried in the butterfly valve sealing mechanism, and the conductive teeth are evenly distributed on the conductive tooth seat.

8. The electroplating assembly according to claim 7, characterized in that: The conductive gear seat is made of stainless steel.

9. The electroplating assembly according to claim 1, wherein: The conductive teeth are made of titanium-copper alloy.

10. The electroplating assembly according to claim 1, wherein: The conductive block is made of copper alloy.

11. The electroplating assembly according to any one of claims 1 to 10, characterized in that: Applicable to vertical double-sided through-hole plating.

12. An electroplating device, characterized in that: The invention comprises an electroplating assembly and an electroplating tank as claimed in any one of claims 1 to 10, wherein the electroplating tank is provided with a docking interface for engaging with a fast conductive structure in the electroplating assembly to achieve electrical conduction, thereby performing vertical double-sided through-hole electroplating.

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