A pressure monitoring sensor for sewage entanglement pipes

Abstract

This invention belongs to the field of pressure monitoring technology and discloses a pressure monitoring sensor for sewage entanglement pipelines, comprising: a housing for placing objects; a load collector connected to the top of the housing to withstand mechanical stress caused by external forces; a strain gauge connected below the load collector, which withstands stress corresponding to the load collector, causing its resistance to change; an integrated circuit board connected to the bottom of the inner wall of the housing, responsible for processing the signal generated by the voltage change of the strain gauge and converting it into a usable output signal; and wires fixedly connected to the bottom of the housing for data transmission. The beneficial effects of this invention are: the limiting effect of the guide head ensures the accurate deformation direction of the strain gauge during the measurement process, improving measurement accuracy; and the device can operate stably in complex working environments, providing reliable data support for pipeline pressure monitoring.

Description

Technical Field

[0001] This invention belongs to the field of pressure monitoring technology, and in particular relates to a pressure monitoring sensor for sewage entanglement pipes. Background Technology

[0002] In the process of manufacturing sewage spiral pipes, in order to ensure that the protective layer can be tightly adhered to the outside of the pipe, it is usually necessary to coat the outside of the pipe with a protective material, and then press the protective layer onto the outside of the pipe with a pressure roller to form a tightly wound structure. In this process, it is very important to monitor the pressure between the pressure roller and the pipe.

[0003] The purpose of monitoring the pressure between the pressure roller and the pipe is to prevent the pressure from being too high or too low, and to ensure that the protective layer and the pipe are bonded more tightly and evenly. If the pressure is too low, the protective layer and the pipe may not bond tightly, thus affecting the long-term stability and protective effect of the pipe. If the pressure is too high, it may damage the pipe or the protective layer, leading to production failure or poor product quality.

[0004] To achieve this goal, specialized pressure sensors and control systems are typically used. These systems can monitor the pressure between the pressure roller and the pipe in real time and automatically adjust the pressure according to actual needs. This not only ensures the quality and performance of the product but also improves production efficiency and reduces the scrap rate.

[0005] When the load collector of the pressure monitoring sensor undergoes elastic bending due to the force applied, the strain gauge will bear corresponding stress, causing its resistance to change. At this time, the strain gauge will deform under stress, and it cannot move linearly during the deformation process, thus causing deviations in the measured data. Summary of the Invention

[0006] This invention addresses the problem in existing technologies where strain gauges deform under stress, preventing linear motion and thus causing measurement data deviations. The following technical solution is proposed:

[0007] A pressure monitoring sensor for sewage entanglement pipes includes: a housing for placing an object;

[0008] Load collector: Attached to the top of the housing, it bears the mechanical stress caused by external forces;

[0009] Strain gauge: Connected below the load collector, the strain gauge will be subjected to stress corresponding to that of the load collector, causing its resistance to change;

[0010] Integrated circuit board: Connected to the bottom of the inner wall of the housing, it is responsible for processing the signal generated by the voltage change of the strain gauge and converting it into a usable output signal;

[0011] Wire: Fixedly connected to the bottom of the casing for data transmission;

[0012] The positioning structure includes a guide head, strain gauges, an adjustment structure, and a support plate. The strain gauges are connected to the strain gauges via the guide head. The guide head synchronously moves the strain gauges and makes them fit against the outside of the support plate. The support plate is used to position the guide head to ensure the stability of the entire device and the accuracy of the measurement. The strain gauges are connected to the guide head via the adjustment structure, which is used to change the position of the strain gauges so that the positions of multiple strain gauges in contact with the outside of the support plate are consistent.

[0013] As a preferred embodiment of the above technical solution, the adjustment structure includes a connecting bar: the connecting bar is connected to the guide head and is used to drive its movement;

[0014] Miniature voltage ceramic plate one, which is connected to the connecting bar to drive the connecting bar to move;

[0015] Connecting frame: Connected to the connecting strip and the miniature voltage ceramic plate for limiting its position;

[0016] Miniature voltage ceramic plate 2: Connected to the guide head to drive the connecting frame, connecting strip and miniature voltage ceramic plate 1 to move synchronously.

[0017] As a preferred embodiment of the above technical solution, the adjustment structure further includes a mounting column: connected to the support plate, used for the installation and positioning of the support plate, the mounting column is rectangular in shape and has protrusions on its outer side.

[0018] As a preferred embodiment of the above technical solution, the adjustment structure further includes a buffer frame: connected to the support plate and used for storing liquid;

[0019] Liquid flow channel: Located in the middle of the buffer frame, used to change the flow rate of the liquid;

[0020] Piston 1: Located inside one side of the buffer frame, used to compress the liquid;

[0021] Piston 2: Located inside the buffer frame and outside piston 1, it is used to drive the object upward.

[0022] As a preferred embodiment of the above technical solution, the buffer frame also includes a T-shaped column: connected to piston one, which has a supporting function;

[0023] Press-fit structure: Connected to the top of the T-shaped column, used to apply pressure to the T-shaped column.

[0024] As a preferred embodiment of the above technical solution, the adjustment structure also includes a connecting rod: connected to the top of the piston and having a supporting function;

[0025] Ring: Connected to the top of the link, used for the synchronous movement of multiple links;

[0026] Return spring: Connected to the bottom end of the connecting rod, used to drive the connecting rod to return to its original position.

[0027] As a preferred embodiment of the above technical solution, the integrated circuit board includes components such as signal amplifiers, filters, and analog-to-digital converters, which are used to amplify, filter, and convert the weak signals from the strain gauges to improve the signal quality and availability.

[0028] As a preferred embodiment of the above technical solution, the outer shell is made of a robust and stable material, has good protective performance, can effectively protect the internal components from the influence of the external environment, and at the same time provide a stable measurement platform.

[0029] As a preferred embodiment of the above technical solution, the buffer frame is rectangular in shape, and a partition plate is provided inside the buffer frame, which divides the interior of the buffer frame into two chambers.

[0030] The beneficial effects of this invention are as follows:

[0031] (1) The limiting function of the guide head ensures the accurate deformation direction of the strain gauge during the measurement process, which improves the measurement accuracy. In complex working environments, the device can operate stably and provides reliable data support for pipeline pressure monitoring.

[0032] (2) This enables the equipment to maintain stable measurement performance under different working conditions, making it highly adaptable. At the same time, the synergistic effect of multiple strain gauges further enhances the stability and measurement accuracy of the equipment, providing a guarantee for accurate pressure monitoring.

[0033] (3) Stable reset of the guide head was achieved, ensuring the reliability of the equipment during continuous operation. The buffer frame and piston effectively controlled the moving speed of the guide head, avoiding the impact and error caused by rapid movement. The tension drive of the reset spring enabled the guide head to quickly return to the initial position, improving the response speed and measurement efficiency of the equipment and providing strong support for real-time monitoring. Attached Figure Description

[0034] Figure 1 The diagram shown is a structural schematic of a pressure monitoring sensor for sewage entanglement pipes according to Embodiment 1;

[0035] Figure 2 The image shown is a cross-sectional view of a pressure monitoring sensor for sewage entanglement pipes according to Embodiment 1;

[0036] Figure 3 The diagram shown is a schematic of the installation structure of the pressing structure in Example 1;

[0037] Figure 4 The diagram shown is a schematic diagram of the liquid flow channel structure in Example 1;

[0038] Figure 5 The diagram shown is a structural schematic of the connecting strip in Embodiment 1.

[0039] In the diagram: 1. Outer shell; 2. Load collector; 3. Strain gauge; 4. Integrated circuit board; 5. Wire; 6. Guide head; 7. Strain bar; 8. Connecting bar; 9. Miniature voltage ceramic plate one; 10. Connecting frame; 11. Miniature voltage ceramic plate two; 12. Support plate; 13. Mounting post; 14. Buffer frame; 15. Fluid flow channel; 16. Piston one; 17. T-shaped post; 18. Pressing structure; 19. Connecting rod; 20. Ring; 21. Return spring. Detailed Implementation

[0040] To make the objectives, technical solutions, and advantages of the embodiments of the present invention clearer, the technical solutions of the present invention will be clearly and completely described below in conjunction with the embodiments.

[0041] Example 1: This invention provides a pressure monitoring sensor for sewage entanglement pipes, such as... Figures 1 to 5 As shown, it includes: a housing 1, used for placing objects;

[0042] Load collector 2: Attached to the top of housing 1, it is a disc-shaped component that bears the mechanical stress caused by external forces and transmits this force to other parts of the sensor;

[0043] Strain gauge 3: Connected below the load collector 2, it is usually made of silicon piezoresistive material. When the load collector 2 undergoes elastic bending due to the force, the strain gauge 3 will bear the corresponding stress of the load collector 2, causing its resistance to change. This change in resistance is the key to measuring the magnitude of the force.

[0044] Integrated circuit board 4: Connected to the bottom of the inner wall of the housing 1, it is responsible for processing the signal generated by the voltage change of the strain gauge 3 and converting it into a usable output signal. Integrated circuit board 4 ensures that the output signal of the sensor is standardized, so that different sensors are interchangeable.

[0045] Wire 5: Fixedly connected to the bottom of the outer casing 1, used for data transmission;

[0046] The positioning structure includes a guide head 6, a strain gauge 7, an adjustment structure, and a support plate 12. The strain gauge 7 is connected to the strain gauge 3 through the guide head 6. The guide head 6 synchronously drives the strain gauge 7 to move and fit against the outside of the support plate 12. The support plate 12 is used to position the guide head 6 to ensure the stability of the entire device and the accuracy of the measurement. The strain gauge 7 is connected to the guide head 6 through the adjustment structure. The adjustment structure is used to change the position of the strain gauge 7 so that the positions of multiple strain gauges 7 fitting against the outside of the support plate 12 are consistent.

[0047] The positioning structure ensures that the guide head 6 remains stable during horizontal movement, avoiding measurement errors caused by axial movement, thereby improving the overall measurement accuracy of the sensor. At the same time, the adjustment structure allows the positions of multiple strain gauges 7 to be adjusted during installation, ensuring that the forces on the multiple strain gauges 7 are consistent, thus limiting the position of the guide head 6.

[0048] In this embodiment: The outer casing 1 is made of a robust and stable material, specifically aluminum, which provides excellent protection, effectively shielding internal components from external environmental influences. It also provides a stable measurement platform. The integrated circuit board 4 includes components such as a signal amplifier, filter, and analog-to-digital converter, used to amplify, filter, and convert the weak signal from the strain gauge 3 to improve signal quality and availability. A placement slot is provided at the top of the outer casing 1, through which the load collector 2 is mounted. The strain gauge 3 is snap-fitted into the interior of the outer casing 1. A positioning ring is located inside the outer casing 1 at the outer surface of the strain gauge 3. The strain gauge 3 is made of semiconductor strain gauge material, capable of accurately measuring the minute deformation of an object under stress and converting the deformation into a change in resistance, thus achieving high-precision force measurement. A wire 5 passes through the outer casing 1 and connects to the integrated circuit board 4 for data transmission.

[0049] As the load collector 2 deforms under stress, the middle of the strain gauge 3 deforms synchronously, which in turn moves the guide head 6. The guide head 6 moves the inside of the strain gauge 7 outside the support plate 12, thereby limiting the movement of the guide head 6 and preventing deviations from occurring during its movement.

[0050] like Figure 4 and Figure 5 As shown, the adjustment structure includes a connecting strip 8, which is fixedly installed on one end of the strain gauge 7. A miniature voltage ceramic sheet 9 is glued to one end of the connecting strip 8 with adhesive. When the miniature voltage ceramic sheet 9 is energized, it drives the connecting strip 8 to move. A connecting frame 10 is sleeved on the outside of the miniature voltage ceramic sheet 9 and the connecting strip 8. The connecting frame 10 has a placement groove inside for placing the miniature voltage ceramic sheet 9 and the connecting strip 8. The placement groove is used for the installation of the miniature voltage ceramic sheet 9 and the connecting strip 8 and allows the position of the connecting strip 8 to move. A miniature voltage ceramic sheet 11 is glued to one end of the connecting frame 10 near the edge of the strain gauge 7 with adhesive. The top edge of the miniature voltage ceramic sheet 11 is fixedly connected to the guide head 6. The guide head 6 has an movable groove inside that fits the connecting frame 10 for the placement and movement of the connecting frame 10.

[0051] In this embodiment: When the miniature voltage ceramic sheet 11 is energized, it contracts. When the miniature voltage ceramic sheet 11 contracts, it moves the connecting frame 10. At this time, the connecting frame 10 moves the connecting strip 8 and the miniature voltage ceramic sheet 9. The miniature voltage ceramic sheet 9 causes the strain gauge 7 to bend. Since the miniature voltage ceramic sheet 11 only has the function of extension and retraction after being energized, the bottom end of the strain gauge 7 bends, which increases the distance between the strain gauge 7 and the outer side of the support plate 12. When the distance between the strain gauge 7 and the outer side of the support plate 12 is too large, the miniature voltage ceramic sheet 9 moves. When the miniature voltage ceramic sheet 9 moves, it moves the connecting strip 8. When the connecting strip 8 moves, it moves the bottom end of the strain gauge 7 closer to the outer side of the support plate 12, so that the strain gauge 7 fits with the outer side of the support plate 12.

[0052] like Figures 2 to 5 As shown, a mounting post 13 is welded to the bottom of the support plate 12. The mounting post 13 penetrates the interior of the outer shell 1. The bottom of the mounting post 13 is rectangular, and a semi-circular protrusion is provided on the outer side of the mounting post 13 to increase the stability between the mounting post 13 and the outer shell 1. A buffer frame 14 is welded to the top of the outer surface of the support plate 12. A liquid flow groove 15 is opened at the bottom of the inner wall of the buffer frame 14. A piston 16 is slidably connected inside the buffer frame 14 at one side of the liquid flow groove 15. A T-shaped post 17 is welded to the top of the piston 16 and penetrates the interior of the buffer frame 14. A pressing structure 18 is attached to the top of the T-shaped post 17. The structure 18 is composed of a sphere and a cylinder. The cylinder is welded to the bottom of the guide head 6. A piston 22 is slidably connected inside the buffer frame 14 at the position on the other side of the liquid flow channel 15. A partition plate is provided inside the buffer frame 14, which divides the interior of the buffer frame 14 into two chambers. Piston 16 and piston 22 are vertically movably connected to the interior of the two chambers to prevent interference between them. Multiple connecting rods 19 that penetrate the buffer frame 14 are snapped onto the top of piston 22. A ring 20 is welded between the tops of the connecting rods 19. A return spring 21 is welded to the bottom of the ring 20 and the top of the buffer frame 14, located outside the connecting rods 19.

[0053] In this embodiment: When the guide head 6 moves, it drives the pressing structure 18 to move. At this time, the bottom end of the pressing structure 18 is a ball, which means that when the guide head 6 moves or deflects, it can drive the pressing structure 18 to move or deflect. When the pressing structure 18 moves or deflects, it can only drive the T-shaped column 17 to descend. When the T-shaped column 17 descends, it drives the piston 16 to squeeze the liquid inside the buffer frame 14. Due to the action of the liquid flow groove 15, the piston 16 slowly moves the liquid squeezed inside the buffer frame 14 to prevent the guide head 6 from moving rapidly. During this process, since the liquid is flowing, the liquid drives the piston 22 to rise. When the piston 22 rises, it drives the ring 20 to rise through the connecting rod 19. When the ring 20 rises, it drives the return spring 21 to stretch. At this time, the tension of the return spring 21 drives the piston 22 to reset, thereby driving the guide head 6 to reset, which changes the difficulty of resetting the guide head 6.

[0054] Working Principle: In actual use, the load collector 2 is brought into contact with an external pressure roller. When the pressure roller moves, the load collector 2 is subjected to force and undergoes elastic bending. The strain gauge 3 will bear the corresponding stress, causing its resistance to change. At this time, the strain gauge 3 will deform under stress, and at the same time, the strain gauge 3 will generate resistance when deformed. The resistance is transmitted through the integrated circuit board 4 and the wire 5. At the same time, the strain gauge 3 drives the guide head 6 to move. When the guide head 6 moves, it drives the strain bar 7 to move outside the support plate 12. At this time, the movement of the guide head 6 is limited, which makes the strain gauge 3 move vertically. This design realizes accurate pressure measurement through the deformation and resistance change of the strain gauge 3. At the same time, the limiting effect of the guide head 6 ensures that the deformation direction of the strain gauge 3 is accurate during the measurement process, improving the measurement accuracy. In complex working environments, the device can operate stably and provide reliable data support for pipeline pressure monitoring.

[0055] During this process, the second micro-voltage ceramic plate 11 is energized and retracts. As it retracts, it moves the connecting frame 10. This movement, in turn, causes the connecting strip 8 and the first micro-voltage ceramic plate 9 to move. The first micro-voltage ceramic plate 9 then causes the strain gauge 7 to bend. Since the second micro-voltage ceramic plate 11 only has a telescopic function after being energized, the bottom of the strain gauge 7 bends, increasing the distance between the strain gauge 7 and the outer side of the support plate 12. When this distance becomes too large, the first micro-voltage ceramic plate 9 moves. This movement of the first micro-voltage ceramic plate 9 then moves the connecting strip 8, which in turn moves the strain gauge 7. The bottom end of the strain gauge 7 moves close to the outside of the support plate 12, thereby making the strain gauge 7 fit against the outside of the support plate 12. This method makes the strain gauge 7 fit against the outside of the guide head 6, and makes multiple strain gauges 7 fit against the outside of the guide head 6, while maintaining consistent pressure. Through the precise adjustment of the micro voltage ceramic plate, the strain gauge 7 can fit tightly against the outside of the support plate 12, ensuring uniform force transmission and improving the reliability of measurement. This adjustment mechanism enables the equipment to maintain stable measurement performance under different working conditions and has strong adaptability. At the same time, the synergistic effect of multiple strain gauges 7 further enhances the stability and measurement accuracy of the equipment, providing a guarantee for accurate pressure monitoring.

[0056] As the guide head 6 moves, it drives the pressing structure 18 to move. Since the bottom of the pressing structure 18 is spherical, the movement or deflection of the guide head 6 can cause the pressing structure 18 to move or deflect. At this time, the pressing structure 18 can only cause the T-shaped column 17 to descend. When the T-shaped column 17 descends, it drives the piston 16 to squeeze the liquid inside the buffer frame 14. Due to the action of the liquid flow groove 15, the piston 16 slowly moves the liquid being squeezed inside the buffer frame 14, preventing the guide head 6 from moving rapidly. During this process, because the liquid is flowing, it drives the piston 22 to rise. When the piston 22 rises, it is connected to the connecting rod... 19 drives the ring 20 to rise, and when the ring 20 rises, it stretches the return spring 21. At this time, the tension of the return spring 21 drives the piston 22 to reset, thereby driving the guide head 6 to reset. This changes the difficulty of resetting the guide head 6. The coordinated work of this series of components achieves stable reset of the guide head 6, ensuring the reliability of the equipment in continuous operation. The setting of the buffer frame 14 and the piston effectively controls the moving speed of the guide head 6, avoiding the impact and error caused by rapid movement. The tension drive of the return spring 21 enables the guide head 6 to quickly return to the initial position, improving the response speed and measurement efficiency of the equipment, and providing strong support for real-time monitoring.

[0057] The above embodiments are only used to illustrate the technical solutions of the present invention, and are not intended to limit it.

Claims

1. A pressure monitoring sensor for sewage entanglement pipes, characterized in that, include: The outer shell (1) is used to place objects; Load collector (2): Connected to the top of the outer casing (1), it bears the mechanical stress caused by external forces; Strain gauge (3): Connected below the load collector (2), the strain gauge (3) will be subjected to stress corresponding to the load collector (2), causing its resistance to change; Integrated circuit board (4): Connected to the bottom of the inner wall of the outer shell (1), responsible for processing the signal generated by the voltage change of the strain gauge (3) and converting it into a usable output signal; Wire (5): Fixedly connected to the bottom of the outer casing (1) for data transmission; The positioning structure includes a guide head (6), a strain gauge (7), an adjustment structure, and a support plate (12). The strain gauge (7) is connected to the strain gauge (3) through the guide head (6). The guide head (6) synchronously drives the strain gauge (7) to move and fit against the outside of the support plate (12). The support plate (12) is used to position the guide head (6) to ensure the stability of the entire device and the accuracy of the measurement. The strain gauge (7) is connected to the guide head (6) through the adjustment structure. The adjustment structure is used to change the position of the strain gauge (7) so that the multiple strain gauges (7) are all in the same position as the outside of the support plate (12).

2. The pressure monitoring sensor for sewage entanglement pipes according to claim 1, characterized in that, The adjustment structure includes: A connecting bar (8) is connected to the guide head (6) and is used to drive its movement; Miniature voltage ceramic plate 1 (9) is connected to the connecting bar (8) and is used to drive the connecting bar (8) to move; A connecting frame (10) is connected to the connecting strip (8) and the miniature voltage ceramic plate (9) for limiting its position; Miniature voltage ceramic plate two (11) is connected to the guide head (6) to drive the connecting frame (10), connecting strip (8) and miniature voltage ceramic plate one (9) to move synchronously.

3. The pressure monitoring sensor for sewage entanglement pipes according to claim 1, characterized in that, The adjustment structure also includes a mounting column (13): connected to the support plate (12) for the installation and positioning of the support plate (12). The mounting column (13) is rectangular in shape and has protrusions on its outer side.

4. The pressure monitoring sensor for sewage entanglement pipes according to claim 2, characterized in that, The adjustment structure also includes: A buffer frame (14) is connected to a support plate (12) and is used to store liquid; A liquid flow channel (15) is set in the middle of the buffer frame (14) to change the flow rate of the liquid; Piston 1 (16) is located inside one side of the buffer frame (14) and is used to compress the liquid; Piston 2 (22), located inside the buffer frame (14) and outside the piston 1 (16), is used to drive the object to rise.

5. The pressure monitoring sensor for sewage entanglement pipes according to claim 4, characterized in that, The buffer box (14) also includes: The T-shaped column (17) is connected to the piston (16) and has a supporting function; A press-fit structure (18) is connected to the top of the T-shaped column (17) and is used to apply pressure to the T-shaped column (17).

6. The pressure monitoring sensor for sewage entanglement pipelines according to claim 4, characterized in that, The adjustment structure also includes: The connecting rod (19) is connected to the top of the piston (22) and has a supporting function; A ring (20) is connected to the top of a link (19) for the synchronous movement of multiple links (19); The return spring (21) is connected to the bottom end of the connecting rod (19) and is used to drive the connecting rod (19) to return to its original position.

7. The pressure monitoring sensor for sewage entanglement pipes according to claim 1, characterized in that, The integrated circuit board (4) includes components such as signal amplifiers, filters and analog-to-digital converters, which are used to amplify, filter and convert the weak signals from the strain gauge (3) to improve the quality and availability of the signals.

8. The pressure monitoring sensor for sewage entanglement pipes according to claim 1, characterized in that, The outer casing (1) is made of robust and stable materials, has good protective performance, can effectively protect internal components from external environmental influences, and provides a stable measurement platform.

9. The pressure monitoring sensor for sewage entanglement pipes according to claim 4, characterized in that, The buffer frame (14) is rectangular in shape, and a partition plate is provided inside the buffer frame (14) to divide the interior of the buffer frame (14) into two chambers.

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