Display assembly and display screen

Abstract

The invention discloses a display assembly and a display screen, which are used for solving the technical problem that the heat dissipation effect of a mapping area of a display driving chip in an existing display assembly is poor. The display assembly specifically comprises a backlight layer, a liquid crystal layer and a glass panel which are sequentially arranged in the first direction, the liquid crystal layer is connected with a display driving chip, and the display driving chip is arranged opposite to the inner side face of the glass panel. A heat dissipation layer is arranged at the position, corresponding to the display driving chip, of the inner side face of the glass panel.

Description

Technical Field

[0001] The present invention relates to the technical field of display screen design, and in particular to a display assembly and a display screen. Background Art

[0002] Displays are widely used in electronic devices, especially LCDs, which are widely used in smartphones, tablets, and laptops. As users' demand for display quality increases, the refresh rate of LCDs is also increasing, leading to a sharp increase in the power consumption of DDICs (display driver chips), and the surface temperature of the DDIC's mapping area in the display also increases.

[0003] Existing technologies have limited heat dissipation solutions for the DDIC in display screens. The main heat dissipation solution's heat dissipation structure is specifically applied to the metal frame of the display screen, indirectly improving the temperature of the DDIC mapping area of the display screen (i.e., the temperature of the area corresponding to the glass panel and the DDIC) by evenly dissipating the heat of the backlight LEDs. However, the heat dissipation structure of this solution cannot be applied to the DDIC mapping area, resulting in a technical problem of poor heat dissipation in the DDIC mapping area.

[0004] Therefore, finding a technical solution that can solve the above technical problems has become an important topic studied by those skilled in the art. Summary of the Invention

[0005] The embodiments of the present invention disclose a display assembly and a display screen, which are used to solve the technical problem of poor heat dissipation effect in a mapping area of a display driver chip in an existing display assembly.

[0006] A display assembly provided by the present invention includes a backlight layer, a liquid crystal layer, and a glass panel arranged in sequence along a first direction, wherein a display driver chip is connected to the liquid crystal layer, the display driver chip is arranged opposite to the inner side surface of the glass panel, and a heat dissipation layer is provided at a position on the inner side surface of the glass panel corresponding to the display driver chip.

[0007] Optionally, the display driver chip is disposed corresponding to one side edge of the inner side surface of the glass panel.

[0008] Optionally, the heat dissipation layer is provided on all four edges of the inner side surface of the glass panel, wherein a portion of the heat dissipation layer is provided corresponding to the display driver chip.

[0009] Optionally, the heat dissipation layer is a carbon nanocoating.

[0010] Optionally, the display assembly further comprises a display support frame;

[0011] The backlight layer is fixed on the display support frame, and a heat dissipation film is provided on the surface of the display support frame away from the backlight layer.

[0012] Optionally, a polarizing layer is further provided on the surface of the liquid crystal layer facing the glass panel, and an OCA adhesive layer is provided on the surface of the polarizing layer away from the liquid crystal layer. The polarizing layer is fixedly connected to the inner side of the glass panel via the OCA adhesive layer.

[0013] Optionally, the backlight layer includes a plurality of LED backlight beads arranged in a matrix.

[0014] Optionally, the backlight layer further includes a backlight enhancement film, a scattering sublayer, a light guide plate and a reflective sublayer;

[0015] The backlight enhancement film, the scattering sublayer, the light guide plate and the reflective sublayer are arranged in sequence along a first direction.

[0016] Optionally, a PCB control board is further provided on the display support frame;

[0017] The PCB control board is connected to a metal foil, and the PCB control board is electrically connected to the backlight layer and the display driver chip through the metal foil.

[0018] The present invention provides a display screen including the above-mentioned display assembly.

[0019] Compared with the prior art, the present invention has the following beneficial effects:

[0020] In the display component of this embodiment, a heat dissipation layer is directly set at the position corresponding to the glass panel and the display driver chip, which effectively improves the heat dissipation speed of the screen display driver chip mapping area, directly and evenly eliminates the hot spots caused by the display driver chip mapping on the glass panel, greatly reduces the surface temperature of the display driver chip mapping area, and can better improve the refresh rate of the high display component, thereby providing users with better display effects. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the following briefly introduces the drawings required for use in the embodiments or the description of the prior art. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative work.

[0022] Figure 1 A schematic diagram of the front and side structure of a display assembly provided by the present invention;

[0023] Figure 2A schematic structural diagram of the rear side of a display assembly provided by the present invention;

[0024] Figure 3 for Figure 1 Structural explosion diagram;

[0025] Figure 4 for Figure 2 Structural explosion diagram;

[0026] Figure 5 A schematic side view of a partial structure of a display assembly provided by the present invention;

[0027] Figure 6 A temperature comparison diagram of a display assembly provided by the present invention and a display assembly of prior art at a display driver chip mapping area;

[0028] Illustration: glass panel 1; heat dissipation layer 2; display support frame 3; heat dissipation film 4; PCB control board 5; metal foil 6; display driver chip 7; OCA adhesive layer 8; polarizing layer 9; liquid crystal layer 10; backlight layer 11; LED backlight beads 12; first direction X. DETAILED DESCRIPTION

[0029] The invention discloses a display assembly and a display screen, which are used to solve the technical problem of poor heat dissipation effect in a mapping area of a display driver chip in an existing display assembly.

[0030] In order to enable those skilled in the art to better understand the present invention, the present invention is further described in detail below with reference to the accompanying drawings and specific embodiments. Obviously, the embodiments described are only some embodiments of the present invention, not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative work are within the scope of protection of the present invention.

[0031] See also Figures 1 to 6 A display component provided by an embodiment of the present invention includes a backlight layer 11, a liquid crystal layer 10 and a glass panel 1 arranged in sequence along a first direction, wherein a display driver chip 7 is connected to the liquid crystal layer 10, and the display driver chip 7 is arranged opposite to the inner side surface of the glass panel 1, and a heat dissipation layer 2 is provided on the inner side surface of the glass panel 1 at a position corresponding to the display driver chip 7.

[0032] It should be noted that the first direction in this embodiment is specifically the light emitting direction of the backlight layer 11 .

[0033] In the display component of this embodiment, a heat dissipation layer 2 is directly arranged at the position corresponding to the glass panel 1 and the display driver chip 7, which effectively improves the heat dissipation speed of the mapping area of the screen display driver chip 7, directly and evenly eliminates the hot spots of the glass panel 1 caused by the mapping of the display driver chip 7, greatly reduces the surface temperature of the mapping area of the display driver chip 7, and can better improve the refresh rate of the high display component, thereby providing users with better display effects.

[0034] Furthermore, the display driver chip 7 in this embodiment is disposed corresponding to one side edge of the inner side surface of the glass panel 1 .

[0035] It should be noted that, in one specific embodiment, the glass panel 1 is a rectangular structure having a length side and a width side, wherein the display driver chip 7 is arranged corresponding to one of the length sides, and the above-mentioned heat dissipation layer 2 is coated on the length side, thereby improving the heat dissipation speed of the mapping area of the screen display driver chip 7, directly and evenly dissipating and eliminating the hot spots of the glass panel 1 caused by the mapping of the display driver chip 7.

[0036] In another specific embodiment, the heat dissipation layer 2 can be provided on all four edges of the inner side surface of the glass panel 1 , wherein a portion of the heat dissipation layer 2 is provided corresponding to the display driver chip 7 .

[0037] It should be noted that by providing the heat dissipation layer 2 around the inner edge of the glass panel 1 , in addition to effectively reducing the temperature of the mapping area of the display driver chip 7 , it can also effectively reduce light leakage and halo at the edge of the glass panel 1 .

[0038] Specifically, the heat dissipation layer 2 in this embodiment is a carbon nanocoating.

[0039] It should be noted that the above-mentioned carbon nano coating is specifically an existing technology, wherein the carbon nano coating has high thermal conductivity, high radiation, wear resistance and corrosion resistance, and can directly and evenly eliminate the hot spots caused by the mapping of the display driver chip 7 on the glass panel 1, such as Figure 6 As shown, compared with the existing technology, the temperature of the mapping area of the screen display driver chip 7 can be directly optimized by 2°C-5°C by selecting the carbon nanocoating design.

[0040] Furthermore, by applying a carbon nanocoating to the edge of the inner side of the glass panel 1, it can replace the conventional ink black edge coating. Carbon nanocoatings offer superior reliability compared to ink black edge coatings. The dyne value of ink is generally 38-45 dyn / cm, while that of pure graphene is approximately 30-50 dyn / cm. Adjusting the composition ratio of the carbon nanocoating or performing surface modification can further enhance its wettability, raising its dyne value to a maximum of 40-60 dyn / cm, approaching or slightly exceeding that of ink. Therefore, in addition to reducing the temperature of the display driver chip 7 mapping area, the carbon nanocoating can also replace conventional ink black edge coatings. Given the excellent wear and corrosion resistance of the carbon nanocoating, this design also offers improved reliability.

[0041] Furthermore, the display assembly in this embodiment further includes a display support frame 3;

[0042] The backlight layer 11 is fixed on the display support frame 3 , and a heat dissipation film 4 is provided on the surface of the display support frame 3 away from the backlight layer 11 .

[0043] It should be noted that in the above design, the display support frame 3 is preferably a metal frame structure. This design can further accelerate the heat transfer of the display component, thereby reducing the operating temperature of the display component. In addition, by providing a heat dissipation film 4 on the display support frame 3, the technical effect of further heat dissipation can be achieved.

[0044] In addition, the above-mentioned heat dissipation film 4 is specifically the existing technology, so this embodiment does not elaborate on the specific type of the heat dissipation film 4 here.

[0045] Furthermore, in this embodiment, a polarizing layer 9 is provided on the surface of the liquid crystal layer 10 facing the glass panel 1, and an OCA adhesive layer 8 is provided on the surface of the polarizing layer 9 away from the liquid crystal layer 10. The polarizing layer 9 is fixedly connected to the inner side surface of the glass panel 1 through the OCA adhesive layer 8.

[0046] It should be noted that the polarizing layer 9 is used to redirect light after passing through the liquid crystal layer 10. The OCA adhesive layer 8 is used to adhere the polarizing layer 9 to the glass panel 1. In addition to having excellent bonding performance, the OCA adhesive layer 8 also has high light transmittance, thereby allowing light to pass through and enter the glass panel 1.

[0047] Furthermore, the backlight layer 11 in this embodiment includes a plurality of LED backlight lamp beads 12 arranged in a matrix.

[0048] It should be noted that the present embodiment does not limit the number and arrangement of the LED backlight beads 12 . Designers can select a suitable number of LED backlight beads 12 and a suitable arrangement to arrange the LED backlight beads 12 according to actual conditions.

[0049] In addition, in order to better improve the light transmission effect, the backlight layer 11 also includes a backlight enhancement film, a scattering sublayer, a light guide plate and a reflective sublayer;

[0050] Specifically, the backlight enhancement film, the scattering sublayer, the light guide plate and the reflective sublayer are arranged in sequence in a first direction. Specifically, the backlight enhancement film is located in front of the LED backlight bead 12, that is, in the light-emitting direction of the LED backlight bead 12.

[0051] Furthermore, a PCB control board 5 is also provided on the display support frame 3 in this embodiment;

[0052] The PCB control board 5 is connected to a metal foil 6 , and the PCB control board 5 is electrically connected to the backlight layer 11 and the display driver chip 7 through the metal foil 6 .

[0053] It should be noted that the aforementioned metal foil 6, as a conductive metal layer, creates a "Faraday cage" effect. By reflecting or absorbing electromagnetic waves, it blocks the outward radiation of internal interference, reducing EMI. It also isolates external interference from entering the PCB control board 5, improving EMS immunity. Furthermore, as a conductive layer, the metal foil 6 forms an equipotential shield on the surface of the PCB control board 5. When static electricity contacts the metal foil 6, it is quickly discharged through the ground path connected to the PCB's GND, preventing static electricity from directly breaking down internal circuits. Furthermore, the metal foil 6 reduces the accumulation of static electricity on the surface of the PCB control board 5 due to friction.

[0054] The metal foil 6 has a high thermal conductivity. The metal foil 6 covering the PCB control board 5 can serve as a "heat diffusion layer" to quickly and evenly diffuse the locally concentrated heat to a larger area, thereby reducing the IC junction temperature.

[0055] In addition, the metal foil 6 can also increase the rigidity of the PCB control board 5, reduce the bending deformation of the PCB control board 5, protect the internal circuits such as the wiring and the pads from mechanical stress damage, and also play a role in further fixing the PCB.

[0056] The invention discloses a display screen, comprising the above-mentioned display component.

[0057] It should be noted that the display screen in this embodiment is specifically an LCD display screen, which is mainly used in electronic devices such as smart phones, tablet computers, laptops, etc.

[0058] In the display screen of this embodiment, a heat dissipation layer 2 is directly arranged at the position corresponding to the glass panel 1 and the display driver chip 7, which effectively improves the heat dissipation speed of the mapping area of the screen display driver chip 7, directly and evenly eliminates the hot spots of the glass panel 1 caused by the mapping of the display driver chip 7, greatly reduces the surface temperature of the mapping area of the display driver chip 7, and can better improve the refresh rate of the high display component, thereby providing users with better display effects.

[0059] The above is a detailed introduction to a display assembly and display screen provided by the present invention. For those skilled in the art, according to the ideas of the embodiments of the present invention, there may be changes in the specific implementation methods and application scopes. In summary, the content of this specification should not be understood as limiting the present invention.

Claims

1. A display assembly comprising a backlight layer (11), a liquid crystal layer (10), and a glass panel (1) arranged in sequence along a first direction, wherein: A display driver chip (7) is connected to the liquid crystal layer (10), and is characterized in that the display driver chip (7) is arranged opposite to the inner side surface of the glass panel (1), and a heat dissipation layer (2) is provided at a position on the inner side surface of the glass panel (1) corresponding to the display driver chip (7).

2. The display assembly according to claim 1, wherein The display driving chip (7) is arranged corresponding to one side edge of the inner side surface of the glass panel (1).

3. The display assembly according to claim 2, wherein: The heat dissipation layer (2) is provided on all four edges of the inner side surface of the glass panel (1), wherein a portion of the heat dissipation layer (2) is provided corresponding to the display driver chip (7).

4. The display assembly according to any one of claims 1 to 3, characterized in that: The heat dissipation layer (2) is a carbon nanocoating.

5. The display assembly according to claim 1, wherein: The display assembly further comprises a display support frame (3); The backlight layer (11) is fixed on the display support frame (3), and a heat dissipation film (4) is provided on a surface of the display support frame (3) away from the backlight layer (11).

6. The display assembly according to claim 1, wherein: A polarizing layer (9) is further provided on the surface of the liquid crystal layer (10) facing the glass panel (1), and an OCA adhesive layer (8) is provided on the surface of the polarizing layer (9) away from the liquid crystal layer (10). The polarizing layer (9) is fixedly connected to the inner side surface of the glass panel (1) via the OCA adhesive layer (8).

7. The display assembly according to claim 1, wherein: The backlight layer (11) comprises a plurality of LED backlight lamp beads (12) arranged in a matrix.

8. The display assembly according to claim 7, wherein: The backlight layer (11) further comprises a backlight enhancement film, a scattering sublayer, a light guide plate and a reflective sublayer; The backlight enhancement film, the scattering sublayer, the light guide plate and the reflective sublayer are arranged in sequence along a first direction.

9. The display assembly according to claim 5, wherein: The display support frame (3) is also provided with a PCB control board (5); A metal foil (6) is connected to the PCB control board (5), and the PCB control board (5) is electrically connected to the backlight layer (11) and the display driver chip (7) via the metal foil (6).

10. A display screen, characterized in that: The display assembly comprises the display assembly according to any one of claims 1 to 9.

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