Display screen, preparation method of display screen and electronic equipment

Abstract

The invention provides a display screen, a preparation method of the display screen and electronic equipment, which are used for reducing the preparation cost of the display screen and improving the product competitiveness of the display screen. The preparation method of the display screen comprises the steps that a display module and a rubber frame are provided, the display module comprises a protection cover plate, a display panel and a back protection layer, the protection cover plate is provided with a bearing face, the display panel is arranged on the bearing face, the display panel is provided with a non-display face deviating from the protection cover plate, and the back protection layer is arranged on the non-display face; the back protection layer is provided with a first surface deviating from the display panel; the rubber frame is assembled to the display module through adhesive glue, the rubber frame is arranged on the bearing surface, is in lap joint with the edge of the non-display surface and the edge of the first surface and surrounds the display panel and the back protection layer, and the adhesive glue is bonded between the bearing surface and the rubber frame, between the non-display surface and the rubber frame and between the first surface and the rubber frame.

Description

Technical Field

[0001] The present application relates to the field of display technology, and in particular to a display screen, a method for manufacturing a display screen, and an electronic device. Background Art

[0002] With the continuous development of science and technology, electronic devices such as mobile phones are widely used in people's daily lives and work, becoming indispensable daily necessities. People's requirements for electronic devices are becoming increasingly higher. Currently, electronic devices generally use display screens to display information such as text and images. Display screens are often formed by injecting glue or 3D printing glue around the display module to form a plastic frame, and the plastic frame is used to assemble it with the housing. However, the display screens produced in this way are expensive, which reduces the product competitiveness of the display screen. Summary of the Invention

[0003] The present application provides a display screen, a method for manufacturing a display screen, and an electronic device, which are used to reduce the manufacturing cost of the display screen and improve the product competitiveness of the display screen.

[0004] In a first aspect, the present application provides a method for preparing a display screen, comprising:

[0005] A display module and a plastic frame are provided, wherein the display module includes a protective cover, a display panel, and a back protective layer. The protective cover has a bearing surface, the display panel is disposed on the bearing surface, the display panel has a non-display surface facing away from the protective cover, and the back protective layer is disposed on the non-display surface. The back protective layer has a first surface facing away from the display panel.

[0006] The adhesive frame is assembled to the display module using adhesive. The adhesive frame is arranged on the supporting surface, overlaps the edge of the non-display surface and the edge of the first surface, and is arranged around the display panel and the back protective layer. The adhesive is bonded between the supporting surface and the adhesive frame, between the non-display surface and the adhesive frame, and between the first surface and the adhesive frame.

[0007] In the manufacturing method of the display screen shown in this embodiment, the display module and the plastic frame are first prepared separately, and then the display module and the plastic frame are assembled using adhesive to achieve a secure assembly between the display module and the plastic frame. The plastic frame can be designed and formed directly at the structural parts factory. Because the display module is not involved in the plastic frame molding process, there is no need to protect the display module, and no complex mold design is required to achieve plastic frame molding. This can not only significantly reduce the production cost of the display screen, but also reduce the difficulty of plastic frame molding. While meeting the assembly requirements of the plastic frame flatness, it can improve the production efficiency, product precision, and product yield of the plastic frame, thereby enhancing the product competitiveness of the display screen.

[0008] In one embodiment, the step of providing the display module and the plastic frame includes: forming the plastic frame by an injection molding process.

[0009] The plastic frame can be designed and formed directly in the structural parts factory. Since the display module is not involved in the molding process of the plastic frame, there is no need to protect the display module, and there is no need to design complex molds to achieve the molding of the plastic frame. This can not only greatly reduce the production cost of the display screen, but also reduce the molding difficulty of the plastic frame. On the premise of meeting the assembly requirements of the plastic frame flatness, it can improve the production efficiency, product precision and product yield of the plastic frame, thereby improving the product competitiveness of the display screen.

[0010] In one embodiment, in the step of providing the display module and the plastic frame, the peripheral side surface of the back protective layer is located inside the peripheral side surface of the display panel;

[0011] After the step of providing the display module and the plastic frame, and before the step of assembling the plastic frame to the display module using adhesive, the method for preparing the display screen further includes:

[0012] The adhesive layer is provided on the first surface, the outer peripheral surface of the adhesive layer is located on the inner side of the peripheral side surface of the back protective layer, and the adhesive layer has a second surface away from the back protective layer;

[0013] In the step of assembling the glue frame on the display module by using the adhesive, the glue frame is also overlapped with the edge of the second surface, and the adhesive is also bonded between the second surface and the glue frame.

[0014] The adhesive layer is used to achieve assembly with the adhesive frame. Since the elastic modulus of the adhesive layer is low, the adhesive layer can absorb the step difference between the display panel and the back protective layer in the display module, ensuring that the adhesive frame can be effectively assembled with the display module.

[0015] In one embodiment, the step of assembling the adhesive frame to the display module using adhesive includes:

[0016] Apply adhesive glue to the adhesive frame;

[0017] Assemble the plastic frame on the display module;

[0018] The bonding adhesive is cured to form a bond.

[0019] The adhesive is first applied to the adhesive frame, and then the adhesive frame is assembled to the display module. Before the adhesive is cured, the assembly position of the adhesive frame can be adaptively fine-tuned to ensure that the adhesive frame can be assembled to the specified position of the display module, ensuring the assembly accuracy and stability of the adhesive frame and the display module.

[0020] In one embodiment, the adhesive is made of heat-curing adhesive, and the step of curing the adhesive to form the adhesive comprises heating the adhesive to heat-cure the adhesive to form the adhesive. The adhesive frame may be made of a resin with low light transmittance.

[0021] The material of the adhesive frame can be adaptively adjusted for different curing adhesives to ensure the assembly stability between the display module and the adhesive frame.

[0022] In one embodiment, the bonding glue is made of light-curing glue, and the light transmittance of the glue frame is greater than or equal to 60%. The step of curing the bonding glue to form the bonding glue includes: irradiating the bonding glue through the glue frame, and light-curing the bonding glue to form the bonding glue.

[0023] The material of the adhesive frame can be adaptively adjusted for different curing adhesives to ensure the assembly stability between the display module and the adhesive frame.

[0024] In a second aspect, the present application provides a display screen, comprising a display module, a plastic frame, and an adhesive;

[0025] The display module includes a protective cover, a display panel, and a back protective layer. The protective cover has a bearing surface. The display panel is disposed on the bearing surface. The display panel has a non-display surface facing away from the protective cover. The back protective layer is disposed on the non-display surface. The peripheral side surface of the back protective layer is located inward of the peripheral side surface of the display panel. The back protective layer has a first surface facing away from the display panel.

[0026] The plastic frame is arranged on the carrying surface, overlaps the edge of the non-display surface and the edge of the first surface, and is arranged around the display panel and the back protective layer. The adhesive is bonded between the carrying surface and the plastic frame, between the non-display surface and the plastic frame, and between the first surface and the plastic frame.

[0027] In the display screen shown in this application, the display module and the plastic frame are first prepared separately, and then the display module and the plastic frame are assembled using adhesive to achieve a secure assembly between the display module and the plastic frame. The plastic frame can be designed and formed directly at the structural parts factory. Because the display module is not involved in the plastic frame molding process, there is no need to protect the display module, and no complex mold design is required to achieve plastic frame molding. This can not only greatly reduce the production cost of the display screen, but also reduce the difficulty of plastic frame molding. Under the premise of meeting the assembly requirements of the plastic frame flatness, it can improve the production efficiency, product precision and product yield of the plastic frame, thereby improving the product competitiveness of the display screen.

[0028] In one embodiment, the display screen further includes a back adhesive layer, the back adhesive layer is provided on the first surface, the outer peripheral surface of the back adhesive layer is located on the inner side of the peripheral side surface of the back protective layer, and the back adhesive layer has a second surface away from the back protective layer;

[0029] The glue frame is also overlapped with the edge of the second surface, and the adhesive is also bonded between the second surface and the glue frame.

[0030] The adhesive layer is used to achieve assembly with the adhesive frame. Since the elastic modulus of the adhesive layer is low, the adhesive layer can absorb the step difference between the display panel and the back protective layer in the display module, ensuring that the adhesive frame can be effectively assembled with the display module.

[0031] In one embodiment, the back adhesive layer is provided with an overflow glue groove, the opening of the overflow glue groove is located on the second surface, and at least a portion of the adhesive is filled in the overflow glue groove.

[0032] During the production process of the display screen, the overflow glue groove can accommodate excess adhesive glue, which not only enables an interference fit between the display module and the glue frame, ensuring that different step positions in the glue frame can be stably assembled with the display module, but also prevents glue from overflowing to other positions of the display screen, thereby improving the appearance of the display screen and ensuring the reliability of the display screen.

[0033] In one embodiment, the display panel includes a display portion, a connecting portion and a bending portion. Along the thickness direction of the display panel, the connecting portion is located on the side of the display portion away from the protective cover plate and is spaced apart from the display portion. The bending portion is located on the same side of the display portion and the connecting portion and is connected between the display portion and the bending portion. Along the thickness direction of the display screen, the bending portion and the back adhesive layer are staggered.

[0034] Along the thickness of the display (the Z-axis in the figure), the adhesive layer is offset from the curved portion of the display panel. That is, the projection of the adhesive layer on the display panel is spaced from the curved portion. Furthermore, along the thickness of the display, the adhesive layer and the curved portion do not overlap, preventing interference and impact from the adhesive layer, thereby ensuring the reliability of the display.

[0035] In a third aspect, the present application provides an electronic device comprising a housing and any of the above-mentioned display screens, wherein the display screen is mounted on the housing.

[0036] In the electronic device described in this application, the display module and the plastic frame in the display screen are first prepared separately, and then the display module and the plastic frame are assembled using adhesive to achieve a secure assembly between the display module and the plastic frame. The plastic frame can be designed and formed directly at the structural parts factory. Because the display module is not involved in the plastic frame molding process, there is no need to protect the display module, and no complex mold design is required to achieve plastic frame molding. This can not only greatly reduce the production cost of the display screen, but also reduce the difficulty of plastic frame molding. Under the premise of meeting the assembly requirements of the plastic frame flatness, it can improve the production efficiency, product precision and product yield of the plastic frame, thereby improving the product competitiveness of the display screen.

[0037] In one embodiment, the housing is provided with a mounting groove, the opening of the mounting groove is located on the upper surface of the housing, at least a portion of the display screen is located in the mounting groove, and the plastic frame has a third surface facing away from the protective cover plate;

[0038] The electronic device further comprises a connecting adhesive which is bonded between the third surface and the bottom wall of the installation groove.

[0039] Compared to the display screen being assembled to the housing via a step on the housing, the display screen shown in this application can be assembled to the housing directly via the rubber frame, eliminating the step design on the housing and reducing the width of the electronic device's border, thereby achieving a narrow-frame design for the electronic device. Furthermore, the rubber frame and the connecting adhesive can also seal the gap between the display screen and the housing, preventing external impurities such as moisture and dust from entering the interior of the electronic device through the gap between the display screen and the housing, thereby improving the sealing of the electronic device. BRIEF DESCRIPTION OF THE DRAWINGS

[0040] In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings required for use in the embodiments of the present application will be described below.

[0041] Figure 1 It is a structural diagram of the electronic device provided by this application;

[0042] Figure 2 yes Figure 1 The cross-sectional structure diagram of the electronic device shown is taken along point II;

[0043] Figure 3 yes Figure 1 A schematic diagram of the planar structure of a display screen in the electronic device shown;

[0044] Figure 4 yes Figure 3 The cross-sectional structure diagram of the display screen shown is taken along II-II;

[0045] Figure 5 yes Figure 3 The cross-sectional structure diagram of the display screen shown is taken along line III-III;

[0046] Figure 6 yes Figure 4 and Figure 5 The structural diagram of the display module in the display screen shown;

[0047] Figure 7 yes Figure 1 A schematic diagram of the partial structure of the display screen of the electronic device shown is cut along IV-IV;

[0048] Figure 8 yes Figure 4 Schematic diagram of the assembly structure of the display module and the adhesive layer in the display shown;

[0049] Figure 9 yes Figure 5 Schematic diagram of the assembly structure of the display module and the adhesive layer in the display shown;

[0050] Figure 10 yes Figure 4 and Figure 5 The structural diagram of the plastic frame in the display screen shown;

[0051] Figure 11 This is a process flow chart of the method for preparing the display screen provided in this application;

[0052] Figure 12 yes Figure 11 The schematic diagram of the structure of applying adhesive to the adhesive frame in the manufacturing method of the display screen is shown. DETAILED DESCRIPTION

[0053] The technical solutions in the embodiments of the present application will be described clearly and completely below in conjunction with the drawings in the embodiments of the present application.

[0054] See also Figure 1 and Figure 2 , Figure 1 is a structural diagram of the electronic device 1000 provided in this application, Figure 2 yes Figure 1 The cross-sectional structure diagram of the electronic device 1000 is shown after being cut along line II. Here, when cut along line II, it means cutting along the plane where line II is located. Other similar descriptions in this document can be understood in the same way.

[0055] The electronic device 1000 can be an electronic product such as a mobile phone, a tablet computer, a laptop computer, a car computer, a smart watch, a smart bracelet, a POS machine (point of sales terminal, point of sales terminal) or the like. Next, the embodiment of the present application is described by taking the electronic device 1000 as an example of a mobile phone. For the convenience of description, the width direction of the electronic device 1000 is defined as the X-axis direction, the length direction of the electronic device 1000 is defined as the Y-axis direction, and the thickness direction of the electronic device 1000 is defined as the Z-axis direction. The X-axis direction, the Y-axis direction and the Z-axis direction are perpendicular to each other. The X-axis direction and the Y-axis direction constitute an XY plane, the X-axis direction and the Z-axis direction constitute an XZ plane, and the Y-axis direction and the Z-axis direction constitute a YZ plane.

[0056] The electronic device 1000 includes a housing 100, a display screen 200, a connecting adhesive 300, and a processor 400. The display screen 200 is mounted on the housing 100. The connecting adhesive 300 and the processor 400 are both located on the inner side of the housing 100. The connecting adhesive 300 is connected between the display screen 200 and the housing 100 to mount the display screen 200 on the housing 100. The processor 400 is electrically connected to the display screen 200. The processor may be a central processing unit (CPU). The processor 400 may send a display signal to the display screen 200, and the display screen 200 may receive the display signal and display information such as images or text based on the display signal.

[0057] The housing 100 is provided with a mounting groove 101, which is located in the middle of the housing 100. The opening of the mounting groove 101 is located on the upper surface 102 of the housing 100. The mounting groove 101 is recessed from the upper surface 102 of the housing 100 toward the lower surface 103 (in the negative direction of the Z axis in the figure).

[0058] It should be noted that the directional terms such as “top”, “bottom”, “upper”, “lower”, “left” and “right” in this application are referenced to the attached Figure 1 The description of the orientations shown, with the positive direction of the Y axis as the "top", the negative direction of the Y axis as the "bottom", the positive direction of the Z axis as the "up", the negative direction of the Z axis as the "down", the positive direction of the X axis as the "right", and the negative direction of the X axis as the "left", does not indicate or imply that the devices or elements referred to must have a specific orientation, be constructed and operate in a specific orientation, and therefore should not be understood as limiting the present application.

[0059] The display screen 200 is mounted in the mounting groove 101. Specifically, at least a portion of the display screen 200 is located in the mounting groove 101. The display screen 200 can be a display screen such as an LCD (liquid crystal display) or an OLED (organic light-emitting diode display), and this application does not impose specific limitations on this.

[0060] See also Figures 3 to 5 , Figure 3 yes Figure 1 The schematic diagram of the planar structure of the display screen 200 in the electronic device 1000 is shown. Figure 4 yes Figure 3 The cross-sectional structure diagram of the display screen 200 after being cut along II-II is shown. Figure 5 yes Figure 3 The cross-sectional structure diagram of the display screen 200 is shown along III-III. Figure 3The planar structural diagram shown is a planar structural diagram when viewed from the non-display side to the display side of the display screen 200.

[0061] Display screen 200 includes a display module 210, an adhesive layer 220, a plastic frame 230, and adhesive 240. The adhesive layer 220, plastic frame 230, and adhesive 240 are all disposed on the non-display side of the display module 210. Adhesive 240 is located between the display module 210 and the plastic frame 230, as well as between the adhesive layer 220 and the plastic frame 230. Adhesive 240 adheres to the display module 210 and the plastic frame 230, and to the adhesive layer 220 and the plastic frame 230, thereby assembling the display module 210 and the plastic frame 230.

[0062] See also Figure 6 and Figure 7 , Figure 6 yes Figure 4 and Figure 5 The structural diagram of the display module 210 in the display screen 200 is shown. Figure 7 yes Figure 1 The partial structure diagram of the display screen 200 in the electronic device 1000 is shown after being cut along IV-IV. Figure 7 Only the display module 210 of the display screen 200 is shown.

[0063] The display module 210 includes a protective cover 10, a display panel 20, an optical film 30, an optically clear adhesive (OCA) layer 40, and a back protective layer 50. Along the thickness direction of the protective cover 10 (the Z-axis direction in the figure), the display panel 20, the optical film 30, the optical adhesive layer 40, and the back protective layer 50 are all located on the same side of the protective cover 10.

[0064] The protective cover 10 has an exterior surface 104 and a support surface 105. The exterior surface 104 is the surface of the protective cover 10 facing the exterior of the electronic device 1000. Along the thickness direction of the protective cover 10 (the Z-axis direction in the figure), the support surface 105 is disposed opposite the exterior surface 104. A peripheral side surface 106 of the protective cover 10 is connected between the exterior surface 104 and the support surface 105.

[0065] The display panel 20, the optical film 30, the optical adhesive layer 40 and the back protective layer 50 are all arranged on the side of the bearing surface 105 away from the appearance surface 104. Specifically, the display panel 20 is arranged on the bearing surface 105. Among them, the display panel 20 is arranged in the middle area of the bearing surface 105. The display panel 20 has a display surface 201 and a non-display surface 202. The display surface 201 is the surface of the display panel 20 facing the protective cover plate 10. Along the thickness direction of the display panel 20 (Z-axis direction in the figure), the non-display surface 202 is arranged opposite to the display surface 201. The peripheral side surface 203 of the display panel 20 is connected between the display surface 201 and the non-display surface 202, and is located on the inner side of the peripheral side surface 106 of the protective cover plate 10, and is spaced apart from the peripheral side surface 106 of the protective cover plate 10. Among them, the distance between the peripheral side surface 203 of the display panel 20 and the peripheral side surface 106 of the protective cover plate 10 is w1.

[0066] In this embodiment, the display panel 20 includes a display portion 21, a connecting portion 22 and a bending portion 23. The display portion 21 is provided on the bearing surface 105. Along the thickness direction of the display panel 20, the connecting portion 22 is located on the side of the display portion 21 away from the protective cover plate 10, and is spaced apart from the display portion 21. The connecting portion 22 is electrically connected to the processor to achieve an electrical connection between the display screen 200 and the processor. The bending portion 23 is located on the same side of the display portion 21 and the connecting portion 22, and is connected between the display portion 21 and the connecting portion 22. Among them, the display portion 21 and the bending portion 23 are located at the bottom of the electronic device 1000. It should be noted that the display screen 200 is often packaged using COF (Chip On Film) or COP (Chip On Pi) technology, and the bending portion 23 shown above can also be referred to as the COF area or COP area of the display panel 20.

[0067] The optical film 30 is located between the protective cover 10 and the display panel 20. Specifically, the optical film 30 is located between the supporting surface 105 and the display surface 201. The peripheral side surface 301 of the optical film 30 is located inside the peripheral side surface 106 of the protective cover 10 and is flush with the peripheral side surface 203 of the display panel 20. Exemplarily, the optical film 30 may include a polarizer. In other embodiments, the peripheral side surface 301 of the optical film 30 may not be flush with the peripheral side surface 203 of the display panel 20, and this application does not impose any specific limitations on this.

[0068] The optical adhesive layer 40 is located between the protective cover plate 10 and the optical film 30, and is connected between the protective cover plate 10 and the optical film 30. Specifically, the optical adhesive layer 40 is located between the supporting surface 105 and the optical film 30, and is connected between the supporting surface 105 and the optical film 30. The peripheral side surface 401 of the optical adhesive layer 40 is located inside the peripheral side surface 106 of the protective cover plate 10, and is flush with the peripheral side surface 203 of the display panel 20 and the peripheral side surface 301 of the optical film 30. In other embodiments, the peripheral side surface 401 of the optical adhesive layer 40 may not be flush with the peripheral side surface 203 of the display panel 20, and / or the peripheral side surface 401 of the optical adhesive layer 40 may not be flush with the peripheral side surface 301 of the optical film 30.

[0069] The back protective layer 50 is located on the side of the display panel 20 facing away from the protective cover 10 to protect the non-display surface 202 of the display panel 20. Specifically, the back protective layer 50 is disposed on the non-display surface 202. Specifically, the back protective layer 50 is disposed in the middle region of the non-display surface 202. Exemplarily, the back protective layer 50 may comprise super clean foam (SCF).

[0070] The back protective layer 50 has a first surface 501 and a fourth surface 502. The first surface 501 is the surface of the back protective layer 50 facing away from the display panel 20. Along the thickness direction of the back protective layer 50 (Z-axis direction in the figure), the fourth surface 502 is arranged opposite to the first surface 501 and faces the display panel 20. The peripheral side surface 503 of the back protective layer 50 is connected between the first surface 501 and the fourth surface 502, and is located on the inner side of the peripheral side surface 203 of the display panel 20, and is spaced apart from the peripheral side surface 203 of the display panel 20. The distance between the peripheral side surface 503 of the back protective layer 50 and the peripheral side surface 203 of the display panel 20 is w2. Exemplarily, w2 = 0.3 mm.

[0071] See also Figure 8 , Figure 8 yes Figure 4 The display screen 200 is a schematic diagram of the assembly structure of the display module 210 and the adhesive layer 220.

[0072] The adhesive layer 220 is located on the side of the back protective layer 50 away from the display panel 20. Specifically, the adhesive layer 220 is provided on the first surface 501. Among them, the adhesive layer 220 is provided at the edge of the first surface 501. In this embodiment, the adhesive layer 220 is annular and is arranged around the middle area of the first surface 501. The adhesive layer 220 has a second surface 221 and a fifth surface 222. The second surface 221 is the surface of the adhesive layer 220 away from the back protective layer 50. Along the thickness direction of the adhesive layer 220 (Z-axis direction in the figure), the fifth surface 222 is arranged opposite to the second surface 221 and faces the back protective layer 50. The inner circumference 223 and the outer circumference 224 of the adhesive layer 220 are both connected between the second surface 221 and the fifth surface 222, and are arranged opposite to each other. The outer peripheral surface 224 of the adhesive layer 220 is located inward of the peripheral side surface 503 of the back protective layer 50 and is spaced apart from the peripheral side surface 503 of the back protective layer 50. The distance between the inner peripheral surface 223 and the outer peripheral surface 224 of the adhesive layer 220 is w3, where 2 mm ≤ w3 ≤ 5 mm. For example, w3 = 3 mm. The distance between the outer peripheral surface 224 of the adhesive layer 220 and the peripheral side surface 503 of the back protective layer 50 is w4. For example, w4 = 0.5 mm.

[0073] See also Figure 9 , Figure 9 yes Figure 5 The display screen 200 is a schematic diagram of the assembly structure of the display module 210 and the adhesive layer 220.

[0074] In addition, the adhesive layer 220 is provided with an overflow groove 225, which is located between the inner circumferential surface 223 and the outer circumferential surface 224 of the adhesive layer 220. Specifically, the overflow groove 225 opens on the second surface 221. The overflow groove 225 is recessed from the second surface 221 toward the fifth surface 222, penetrates the fifth surface 222 and the outer circumferential surface 224 of the adhesive layer 220, and is spaced apart from the inner circumferential surface 223 of the adhesive layer 220. There are multiple overflow grooves 225, which are arranged at intervals.

[0075] Please read Figure 3 and Figure 7 Along the thickness direction of the display screen 200 (the Z-axis direction in the figure), the adhesive layer 220 is offset from the bent portion 23 of the display panel 20. That is, the projection of the adhesive layer 220 on the display panel 20 is spaced apart from the bent portion 23. Furthermore, along the thickness direction of the display screen 200, the adhesive layer 220 and the bent portion 23 do not overlap, thereby preventing interference between the adhesive layer 220 and the bent portion 23 and preventing the adhesive layer 220 from affecting the bent portion 23, thereby ensuring the reliability of the display screen 200.

[0076] In this embodiment, the adhesive layer 220 includes a first adhesive portion 226 and two second adhesive portions 227. The first adhesive portion 226 is located on the top side of the electronic device 1000. The first adhesive portion 226 extends in the X-axis direction. The first adhesive portion 226 is provided with a plurality of adhesive overflow grooves 225 spaced apart along the X-axis direction. Along the extension direction of the first adhesive portion 226 (the X-axis direction shown in the figure), the two second adhesive portions 227 are respectively located on opposite sides of the first adhesive portion 226, and are both spaced apart from the first adhesive portion 226. Specifically, one second adhesive portion 227 is located on the left side of the electronic device 1000, and the other second adhesive portion 227 is located on the right side of the electronic device 1000. Both the second adhesive portions 227 extend in the Y-axis direction, and are both provided with a plurality of adhesive overflow grooves 225 spaced apart along the Y-axis direction.

[0077] It is understood that the adhesive layer 220 is not disposed on the bottom side of the electronic device 1000, thereby preventing interference between the adhesive layer 220 and the bent portion 23 of the display panel 20, thereby ensuring the reliability of the display screen 200. In other embodiments, the adhesive layer 220 may further include a third adhesive portion, which may be connected between the first adhesive portion 226 and the second adhesive portion 227. In this case, the third adhesive portion may be located at a corner of the electronic device 1000, and this application does not impose any specific limitations on this.

[0078] See also Figure 4 and Figure 5 The plastic frame 230 is located on the same side of the protective cover 10 as the display panel 20, optical film 30, optical adhesive layer 40, back protective layer 50, and adhesive layer 220. Specifically, the plastic frame 230 is disposed on the supporting surface 105 and overlaps the edges of the non-display surface 202, the edges of the first surface 501, and the edges of the second surface 221. It surrounds the display panel 20, optical film 30, optical adhesive layer 40, back protective layer 50, and adhesive layer 220. The plastic frame 230 can be formed by an injection molding process.

[0079] Please also refer to Figure 10 , Figure 10 yes Figure 4 and Figure 5 FIG. 2 is a schematic structural diagram of the plastic frame 230 in the display screen 200 .

[0080] The plastic frame 230 has a third surface 231 and a sixth surface 232. The third surface 231 is the surface of the plastic frame 230 away from the protective cover 10, and is located on the side of the second surface 221 of the adhesive layer 220 away from the fifth surface 222, and is spaced apart from the second surface 221. Along the thickness direction of the plastic frame 230 (Z-axis direction in the figure), the sixth surface 232 is arranged opposite to the third surface 231, facing the protective cover 10, and is spaced apart from the bearing surface 105. The inner circumference 233 and the outer circumference 234 of the plastic frame 230 are connected between the third surface 231 and the sixth surface 232, and are arranged opposite to each other. The inner circumference 233 of the plastic frame 230 is located between the inner circumference 223 of the adhesive layer 220 and the outer circumference 224 of the adhesive layer 220, and is spaced apart from the inner circumference 223 of the adhesive layer 220 and the outer circumference 224 of the adhesive layer 220. The outer peripheral surface 234 of the plastic frame 230 is located between the peripheral side surface 203 of the display panel 20 and the peripheral side surface 106 of the protective cover plate 10, and is spaced apart from both the peripheral side surface 203 of the display panel 20 and the peripheral side surface 106 of the protective cover plate 10. The distance between the inner peripheral surface 233 of the plastic frame 230 and the outer peripheral surface 234 of the plastic frame 230 is w5, where 1mm≤w5≤5mm. For example, w5=2mm. The distance between the outer peripheral surface 234 of the plastic frame 230 and the peripheral side surface 106 of the protective cover plate 10 is w6, where w6 is greater than 0mm. For example, w6=0.1mm. The distance between the outer peripheral surface 234 of the plastic frame 230 and the peripheral side surface 203 of the display panel 20 is w7, where 0.2mm≤w7≤0.5mm. For example, w7=0.3mm.

[0081] Please also refer to Figure 6The plastic frame 230 is provided with a first receiving groove 235 and a second receiving groove 236. The first receiving groove 235 and the second receiving groove 236 are both located on the inner side of the outer peripheral surface 234 of the plastic frame 230 and are spaced apart from the outer peripheral surface 234 of the plastic frame 230. The opening of the first receiving groove 235 is located on the sixth surface 232. The first receiving groove 235 is recessed from the sixth surface 232 toward the direction of the third surface 231 (the negative direction of the Z axis in the figure), and accommodates the display panel 20, the optical film 30 and the optical adhesive layer 40. The first receiving groove 235 has a first groove bottom wall 2351 and a first groove side wall 2352. The first groove bottom wall 2351 is arranged opposite to the opening of the first receiving groove 235, and is located between the sixth surface 232 and the third surface 231, and is spaced apart from the sixth surface 232 and the third surface 231. Among them, the first groove bottom wall 2351 faces the non-display surface 202 of the display panel 20 and is spaced apart from the non-display surface 202 of the display panel 20. The first groove sidewall surface 2352 is disposed around the first groove bottom wall surface 2351 and is connected between the first groove bottom wall surface 2351 and the sixth surface 232. The first groove sidewall surface 2352 faces the peripheral side surface 203 of the display panel 20, the peripheral side surface 301 of the optical film 30, and the peripheral side surface 401 of the optical adhesive layer 40, and is spaced apart from the peripheral side surface 203 of the display panel 20, the peripheral side surface 301 of the optical film 30, and the peripheral side surface 401 of the optical adhesive layer 40.

[0082] Please also refer to Figure 8 The second receiving groove 236 is located on the inner side of the first groove side wall 2352 and is spaced apart from the first groove side wall 2352. The opening of the second receiving groove 236 is located on the first groove bottom wall 2351. The second receiving groove 236 is recessed from the first groove bottom wall 2351 toward the third surface 231 (the negative direction of the Z axis in the figure), and accommodates the back protective layer 50 and the back adhesive layer 220. The second receiving groove 236 has a second groove bottom wall 2361 and a second groove side wall 2362. The second groove bottom wall 2361 is arranged opposite to the opening of the second receiving groove 236, and is located between the first groove bottom wall 2351 and the third surface 231, and is spaced apart from the first groove bottom wall 2351 and the third surface 231. The second groove bottom wall 2361 faces the first surface 501 of the back protective layer 50 and the second surface 221 of the adhesive layer 220, and is spaced apart from the fourth surface 502 of the back protective layer 50 and the second surface 221 of the adhesive layer 220. The second groove side wall 2362 surrounds the second groove bottom wall 2361 and is connected between the first groove bottom wall 2351 and the second groove bottom wall 2361. The second groove side wall 2362 faces the peripheral side surface 503 of the back protective layer 50 and the outer peripheral surface 224 of the adhesive layer 220, and is spaced apart from the peripheral side surface 503 of the back protective layer 50 and the outer peripheral surface 224 of the adhesive layer 220.

[0083] See also Figure 5 and Figure 6 The adhesive 240 is located between the protective cover 10 and the frame 230, between the display panel 20 and the frame 230, between the optical adhesive layer 40 and the frame 230, between the optical film 30 and the frame 230, between the back protective layer 50 and the frame 230, and between the back adhesive layer 220 and the frame 230, and is adhered between the protective cover 10 and the frame 230, between the display panel 20 and the frame 230, between the optical adhesive layer 40 and the frame 230, between the optical film 30 and the frame 230, between the back protective layer 50 and the frame 230, and between the back adhesive layer 220 and the frame 230, and is arranged around the display panel 20, the optical film 30, the optical adhesive layer 40, the back protective layer 50, and the back adhesive layer 220.

[0084] Specifically, the adhesive 240 is located between the bearing surface 105 of the protective cover 10 and the sixth surface 232 of the adhesive frame 230, between the first groove side wall 2352 and the peripheral side surface 203 of the display panel 20, between the first groove side wall 2352 and the peripheral side surface 301 of the optical film 30, between the first groove side wall 2352 and the peripheral side surface 401 of the optical adhesive layer 40, between the first groove bottom wall 2351 and the non-display surface 202 of the display panel 20, between the second groove side wall 2362 and the peripheral side surface 503 of the back protective layer 50, between the second groove side wall 2362 and the outer peripheral surface 224 of the back adhesive layer 220, between the second groove bottom wall 2361 and the first surface 501 of the back protective layer 50, and between the second groove bottom wall 2361 and the second surface 221 of the adhesive layer 220, and is bonded between the carrying surface 105 and the sixth surface 232, between the first groove sidewall surface 2352 and the peripheral side surface 203 of the display panel 20, between the first groove sidewall surface 2352 and the peripheral side surface 301 of the optical film 30, between the first groove sidewall surface 2352 and the peripheral side surface 401 of the optical adhesive layer 40, between the first groove bottom wall surface 2351 and the non-display surface 202, between the second groove sidewall surface 2362 and the peripheral side surface 503 of the back protective layer 50, between the second groove sidewall surface 2362 and the outer peripheral surface 224 of the adhesive layer 220, between the second groove bottom wall surface 2361 and the fourth surface 502, and between the second groove bottom wall surface 2361 and the second surface 221. At least a portion of the adhesive 240 may fill the overflow groove 225 of the adhesive layer 220. Exemplarily, the adhesive 240 may be formed by a dispensing process.

[0085] In one embodiment, the adhesive 240 is made of a thermosetting adhesive. The adhesive frame 230 can be made of a resin with low light transmittance. For example, the light transmittance of the adhesive frame 230 is less than 60%. In this case, due to the low light transmittance of the adhesive frame 230, the adhesive 240 can be cured by heating during the production process of the display screen 200.

[0086] In another embodiment, the adhesive 240 can be made of a light-curing adhesive. For example, the adhesive 240 can be made of an ultraviolet (UV) light-curing adhesive. The adhesive frame 230 can be made of a resin with high light transmittance. For example, the light transmittance of the adhesive frame 230 is greater than or equal to 60%. In this case, the high light transmittance of the adhesive frame 230 allows the adhesive 240 to be light-cured during the production process of the display screen 200 by light passing through the adhesive frame 230.

[0087] In the display screen 200 shown in this embodiment, the display module 210 and the plastic frame 230 are first prepared separately, and then the display module 210 and the plastic frame 230 are assembled using adhesive 240 to achieve a secure assembly between the display module 210 and the plastic frame 230. The plastic frame 230 can be designed and molded directly at a structural parts factory. Because the display module 210 is not involved in the molding process of the plastic frame 230, there is no need to protect the display module 210, and no complex mold design is required to mold the plastic frame 230. This not only significantly reduces the production cost of the display screen 200, but also reduces the molding difficulty of the plastic frame 230. While meeting the assembly requirements of the flattened plastic frame 230, the production efficiency, product precision, and product yield of the plastic frame 230 can be improved, thereby enhancing the product competitiveness of the display screen 200.

[0088] Furthermore, the display module 210 utilizes the adhesive layer 220 to achieve assembly with the adhesive frame 230. Due to the low elastic modulus of the adhesive layer 220, the adhesive layer 220 can absorb the step difference between the display panel 20 and the back protective layer 50, ensuring effective assembly of the adhesive frame 230 with the display module 210. Furthermore, the adhesive overflow groove 225 in the adhesive layer 220 can accommodate excess glue. This not only creates an interference fit between the display module 210 and the adhesive frame 230, ensuring stable assembly with the display module 210 at various stepped positions within the adhesive frame 230, but also prevents glue from overflowing onto other locations on the display screen 200, improving the appearance and cleanliness of the display screen 200 and thereby ensuring the reliability of the display screen 200.

[0089] It should be noted that, in some other embodiments, the display screen 200 may not include the adhesive layer 220 , and the display module 210 may be directly assembled with the adhesive frame 230 through the adhesive 240 . This application does not impose any specific restrictions on this.

[0090] See also Figure 2The connecting adhesive 300 is located between the third surface 231 of the adhesive frame 230 and the bottom wall 1011 of the mounting groove 101, and is bonded between the third surface 231 and the bottom wall 1011 of the mounting groove 101 to mount the display screen 200 in the mounting groove 101. The supporting surface 105 of the protective cover 10 is spaced apart from and opposite to the bottom wall 1011 of the mounting groove 101.

[0091] It is understood that, compared to the assembly of the display screen 200 to the housing 100 via a step on the housing 100, the display screen 200 shown in this embodiment can be assembled to the housing 100 directly via the rubber frame 230, eliminating the step design on the housing 100 and reducing the width of the bezel of the electronic device 1000, thereby achieving a narrow-bezel design for the electronic device 1000. Furthermore, the combination of the rubber frame 230 and the connecting adhesive 300 can also seal the gap between the display screen 200 and the housing 100, preventing external impurities such as moisture or dust from entering the interior of the electronic device 1000 through the gap between the display screen 200 and the housing 100, thereby improving the sealing performance of the electronic device 1000.

[0092] See also Figure 11 , Figure 11 This is a process flow chart of the method for preparing the display screen provided in this application.

[0093] The method for preparing a display screen provided in this application is used to prepare the display screen described above. The method for preparing a display screen comprises steps S1 to S3.

[0094] Step S1: Provide a display module 210 and a plastic frame 230. Figure 6 As shown, the display module 210 includes a protective cover plate 10, a display panel 20 and a back protective layer 50. The protective cover plate 10 has a bearing surface 105. The display panel 20 is arranged on the bearing surface 105. The display panel 20 has a non-display surface 202 facing away from the protective cover plate 10. The back protective layer 50 is arranged on the non-display surface 202. The back protective layer 50 has a first surface 501 facing away from the display panel 20. Among them, the peripheral side surface 503 of the back protective layer 50 is located on the inner side of the peripheral side surface 203 of the display panel 20. It can be understood that the display module 210 may also include an optical film 30 and an optical adhesive layer 40. The matching relationship between the optical film 30 and the optical adhesive layer 40 and the protective cover plate 10 and the display panel 20 can refer to the relevant description above and will not be repeated here.

[0095] In this embodiment, the plastic frame 230 is formed by an injection molding process. It should be noted that before injection molding the plastic frame 230, the size of the plastic frame 230 can be designed according to the size of the display module 210, and then the plastic frame 230 can be injection molded in the structural parts factory. Since the display module 210 does not need to participate in the process of molding the plastic frame 230, there is no need to design a protective fixture to protect the display module 210, so that the molding of the plastic frame 230 can be achieved without designing a complex mold. This can not only greatly reduce the production cost of the display screen 200, but also reduce the molding difficulty of the plastic frame 230. On the premise of meeting the assembly requirements of the flattening of the plastic frame 230, the production efficiency, product precision and product yield of the plastic frame 230 can be improved, thereby improving the product competitiveness of the display screen 200.

[0096] Step S2: Place the adhesive layer 220 on the first surface 501. Figure 3 、 Figure 8 and Figure 9 As shown, the adhesive layer 220 is arranged in the middle area of the first surface 501. The outer peripheral surface 224 of the adhesive layer 220 is located on the inner side of the peripheral side surface 503 of the back protective layer 50. The adhesive layer 220 has a second surface 221 and a fifth surface 222. The second surface 221 is the surface of the adhesive layer 220 away from the back protective layer 50. Along the thickness direction of the adhesive layer 220 (Z-axis direction shown in the figure), the fifth surface 222 is arranged opposite to the second surface 221 and faces the back protective layer 50. Among them, the adhesive layer 220 is provided with an overflow glue groove 225. The overflow glue groove 225 is recessed from the second surface 221 to the direction of the fifth surface 222. Exemplarily, there are multiple overflow glue grooves 225, and the multiple overflow glue grooves 225 are arranged at intervals.

[0097] It should be noted that step S2 can be performed in a display module factory. Based on the design of the display module 210, a matching design of the adhesive layer 220 can be added. After the display module 210 is manufactured in the display module factory, a further step of applying the adhesive layer 220 to the first surface 501 of the back protective layer 50 can be directly added. In other embodiments, step S2 can also be performed in the device manufacturer, and this application does not impose specific limitations on this.

[0098] Step S3: assemble the frame 230 to the display module 210 using adhesive 240. Figure 4 and Figure 5 As shown, the plastic frame 230 is disposed on the carrying surface 105 and overlaps the edges of the non-display surface 202, the edges of the first surface 501, and the edges of the second surface 221. It surrounds the display panel 20, the back protective layer 50, and the back adhesive layer 220. Adhesive 240 is bonded between the carrying surface 105 and the plastic frame 230, between the non-display surface 202 and the plastic frame 230, and between the first surface 501 and the plastic frame 230. Step S3 can be performed at the assembly plant.

[0099] In this embodiment, step S3 may include steps S31 and S32.

[0100] Step S31, applying adhesive 240a to the adhesive frame 230. Figure 12 , the adhesive glue 240 is provided on the sixth surface 232, the first groove side wall surface 2352, the first groove bottom wall surface 2351, the second groove side wall surface 2362 and the second groove bottom wall surface 2361. Specifically, the adhesive glue 240a can be formed by a dispensing process. Exemplarily, the glue frame 230 can be dispensing glue at a designated position by a fixture. It should be noted that at this time, the adhesive glue 240a can be in a fluid or semi-solid state, and the adhesive glue 240a has a certain fluidity, and the adhesive glue 240a can flow on the glue frame 230.

[0101] In step S32, the glue frame 230 is assembled to the display module 210. For example, the glue frame 230 can be assembled to a designated position of the display module 210 using a jig or equipment. It should be noted that, because the adhesive glue 240a has a certain fluidity, during the assembly process of the glue frame 230 and the display module 210, the position of the glue frame 230 can be fine-tuned to ensure that the glue frame 230 can be assembled to the designated position of the display module 210, thereby ensuring the assembly accuracy and stability of the glue frame 230 and the display module 210. Moreover, the fluid adhesive glue 240a can flow into the overflow glue groove 225, which can accommodate excess adhesive glue 240a to prevent excess adhesive glue 240a from flowing to other positions of the display module 210 and causing contamination.

[0102] In step S33, the adhesive 240a is cured to form the adhesive 240. Specifically, a fixture can be used to maintain pressure on the display module 210 and the adhesive frame 230, and the assembled display module 210, adhesive layer 220, adhesive frame 230, and adhesive 240a can be cured using the fixture to ensure that the display module 210, adhesive layer 220, and adhesive frame 230 are firmly bonded.

[0103] It should be noted that the material of the glue frame 230 can be adaptively adjusted for adhesives with different curing methods to ensure assembly stability between the display module 210 and the glue frame 230 .

[0104] In one embodiment, the adhesive glue 240a is made of thermosetting glue. The glue frame 230 can be made of a resin with low light transmittance. In step S33, the display module 210 and the glue frame 230 are pressurized by a fixture, and the assembled display module 210, the backing layer 220, the glue frame 230 and the adhesive glue 240a are placed in a heating furnace for heating. The adhesive glue 240a is thermally cured to form the adhesive glue 240. Figure 4 and Figure 5shown.

[0105] In one embodiment, the adhesive glue 240a is made of light-curing glue. Exemplarily, the adhesive glue 240a is made of ultraviolet light-curing glue. The glue frame 230 can be made of a resin with a high light transmittance. Exemplarily, the light transmittance of the glue frame 230 is greater than or equal to 60%. In step S33, the display module 210 and the glue frame 230 are pressurized by a fixture, and ultraviolet light is used to illuminate the adhesive glue 240a through the glue frame 230, and the adhesive glue 240a is photocured to form the adhesive glue 240, as shown in FIG. Figure 4 and Figure 5 shown.

[0106] In the manufacturing method of the display screen shown in this embodiment, the display module 210 and the plastic frame 230 are first prepared separately, and then the display module 210 and the plastic frame 230 are assembled using adhesive 240 to achieve a secure assembly between the display module 210 and the plastic frame 230. The plastic frame 230 can be designed and molded directly at a structural parts factory. Because the display module 210 is not involved in the molding process of the plastic frame 230, there is no need to protect the display module 210, and no complex mold design is required to mold the plastic frame 230. This can not only significantly reduce the production cost of the display screen 200, but also reduce the molding difficulty of the plastic frame 230. While meeting the assembly requirements of the flattened plastic frame 230, the production efficiency, product precision, and product yield of the plastic frame 230 can be improved, thereby enhancing the product competitiveness of the display screen 200.

[0107] Furthermore, the display module 210 utilizes the adhesive layer 220 to achieve assembly with the adhesive frame 230. Due to the low elastic modulus of the adhesive layer 220, the adhesive layer 220 can absorb the step difference between the display panel 20 and the back protective layer 50, ensuring that the adhesive frame 230 can be effectively assembled with the display module 210. It should be noted that in some other embodiments, the method for preparing a display screen may not include step S2, and this application does not impose any specific limitations on this.

[0108] The above description is only a specific embodiment of the present application, but the scope of protection of the present application is not limited thereto. Any changes or substitutions that can be easily conceived by any person skilled in the art within the technical scope disclosed in this application should be included in the scope of protection of this application; the embodiments of this application and the features of the embodiments can be combined with each other unless there is a conflict. Therefore, the scope of protection of this application should be based on the scope of protection of the claims.

Claims

1. A method for preparing a display screen, characterized in that: include: A display module and a plastic frame are provided, wherein the display module includes a protective cover, a display panel, and a back protective layer, the protective cover having a bearing surface, the display panel being disposed on the bearing surface, the display panel having a non-display surface facing away from the protective cover, the back protective layer being disposed on the non-display surface, and the back protective layer having a first surface facing away from the display panel; The adhesive frame is assembled to the display module using adhesive, wherein the adhesive frame is arranged on the supporting surface, overlaps the edge of the non-display surface and the edge of the first surface, and is arranged around the display panel and the back protective layer. The adhesive is bonded between the supporting surface and the adhesive frame, between the non-display surface and the adhesive frame, and between the first surface and the adhesive frame.

2. The method for preparing a display screen according to claim 1, wherein: The step of providing the display module and the plastic frame includes: forming the plastic frame by an injection molding process.

3. The method for preparing a display screen according to claim 1 or 2, characterized in that: In the step of providing the display module and the plastic frame, the peripheral side surface of the back protection layer is located inside the peripheral side surface of the display panel; After the step of providing the display module and the plastic frame, and before the step of assembling the plastic frame to the display module using adhesive, the method for preparing the display screen further includes: The adhesive layer is provided on the first surface, wherein the outer peripheral surface of the adhesive layer is located on the inner side of the peripheral side surface of the back protective layer, and the adhesive layer has a second surface away from the back protective layer; In the step of assembling the glue frame to the display module using adhesive, the glue frame is also overlapped with the edge of the second surface, and the adhesive is also bonded between the second surface and the glue frame.

4. The method for preparing a display screen according to any one of claims 1 to 3, characterized in that: The step of assembling the adhesive frame on the display module by using adhesive includes: Applying adhesive glue to the adhesive frame; Assembling the plastic frame on the display module; The bonding glue is cured to form the bonding adhesive.

5. The method for preparing a display screen according to claim 4, wherein: The bonding glue is made of heat-curing glue, and the step of curing the bonding glue to form the bonding adhesive includes: heating the bonding glue, and the bonding glue is heat-cured to form the bonding adhesive.

6. The method for preparing a display screen according to claim 4, wherein: The bonding glue is made of light-curing glue, and the light transmittance of the glue frame is greater than or equal to 60%. The step of curing the bonding glue to form the bonding glue includes: irradiating the bonding glue through the glue frame, and the bonding glue is light-cured to form the bonding glue.

7. A display screen, characterized in that: Including display module, plastic frame and adhesive; The display module includes a protective cover, a display panel, and a back protective layer. The protective cover has a supporting surface. The display panel is disposed on the supporting surface. The display panel has a non-display surface facing away from the protective cover. The back protective layer is disposed on the non-display surface. The peripheral side surface of the back protective layer is located inward of the peripheral side surface of the display panel. The back protective layer has a first surface facing away from the display panel. The plastic frame is arranged on the carrying surface, overlaps the edge of the non-display surface and the edge of the first surface, and is arranged around the display panel and the back protective layer. The adhesive is bonded between the carrying surface and the plastic frame, between the non-display surface and the plastic frame, and between the first surface and the plastic frame.

8. The display screen according to claim 7, characterized in that The display screen further includes a back adhesive layer, the back adhesive layer being disposed on the first surface, the outer peripheral surface of the back adhesive layer being located on the inner side of the peripheral side surface of the back protective layer, and the back adhesive layer having a second surface facing away from the back protective layer; The glue frame is also overlapped with the edge of the second surface, and the adhesive is also bonded between the second surface and the glue frame.

9. The display screen according to claim 8, characterized in that The back adhesive layer is provided with a glue overflow groove, the opening of the glue overflow groove is located on the second surface, and at least a portion of the adhesive is filled in the glue overflow groove.

10. The display screen according to claim 8 or 9, characterized in that: The display panel includes a display portion, a connecting portion and a bending portion. The connecting portion is located on the side of the display portion away from the protective cover plate and is spaced apart from the display portion. The bending portion is located on the same side of the display portion and the connecting portion and is connected between the display portion and the bending portion. Along the thickness direction of the display screen, the bending portion and the back adhesive layer are staggered.

11. An electronic device, characterized in that: The invention comprises a housing and a display screen according to any one of claims 7 to 10, wherein the display screen is mounted on the housing.

12. The electronic device according to claim 11, wherein: The housing is provided with a mounting groove, the opening of the mounting groove is located on the upper surface of the housing, at least a portion of the display screen is located in the mounting groove, and the plastic frame has a third surface facing away from the protective cover plate; The electronic device further includes a connecting adhesive, and the connecting adhesive is bonded between the third surface and the bottom wall of the installation groove.

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