Display screen, method for manufacturing display screen, and electronic device

Abstract

This application provides a display screen, a method for manufacturing the display screen, and an electronic device, which are used to reduce the manufacturing cost of the display screen and improve the product competitiveness of the display screen. The method for manufacturing the display screen includes: providing a display module and a frame, wherein the display module includes a protective cover plate, a display panel, and a back protective layer, the protective cover plate has a bearing surface, the display panel is disposed on the bearing surface, the display panel has a non-display surface facing away from the protective cover plate, the back protective layer is disposed on the non-display surface, and the back protective layer has a first surface facing away from the display panel; assembling the frame to the display module using an adhesive, wherein the frame is disposed on the bearing surface and overlaps the edge of the non-display surface and the edge of the first surface, and is disposed around the display panel and the back protective layer, the adhesive is bonded between the bearing surface and the frame, between the non-display surface and the frame, and between the first surface and the frame.

Description

Technical Field

[0001] This application relates to the field of display technology, and in particular to a display screen, a method for manufacturing the display screen, and an electronic device. Background Technology

[0002] With the continuous development of science and technology, mobile phones and other electronic devices are widely used in people's daily lives and work, becoming indispensable daily necessities. People's requirements for electronic devices are getting higher and higher. Currently, electronic devices generally use displays to show information such as text and images. Displays are often made by forming a frame around the display module using injection molding or 3D printing adhesive, and the frame is used to assemble it with the housing. However, displays made in this way are expensive, reducing the competitiveness of the display products. Summary of the Invention

[0003] This application provides a display screen, a method for manufacturing the display screen, and an electronic device, which are used to reduce the manufacturing cost of the display screen and improve the product competitiveness of the display screen.

[0004] In a first aspect, this application provides a method for manufacturing a display screen, comprising:

[0005] A display module and a frame are provided, wherein the display module includes a protective cover, a display panel and a back protective layer, the protective cover has a bearing surface, the display panel is disposed on the bearing surface, the display panel has a non-display surface opposite to the protective cover, the back protective layer is disposed on the non-display surface, and the back protective layer has a first surface opposite to the display panel;

[0006] An adhesive frame is assembled onto the display module using adhesive. The adhesive frame is located on the support surface and overlaps the edge of the non-display surface and the edge of the first surface. It is also arranged around the display panel and the back protective layer. The adhesive is bonded between the support surface and the adhesive frame, between the non-display surface and the adhesive frame, and between the first surface and the adhesive frame.

[0007] In the display manufacturing method shown in this embodiment, the display module and the frame are first prepared separately, and then the display module and the frame are assembled using adhesive to achieve a firm assembly between them. The frame can be designed and molded directly in the structural component factory. Because the display module is not involved in the frame molding process, there is no need to protect the display module, and complex molds are not required to form the frame. This not only significantly reduces the production cost of the display screen but also simplifies the molding process of the frame. While meeting the assembly requirements for a flat frame, this method improves the production efficiency, product precision, and product yield of the frame, thereby enhancing the competitiveness of the display screen.

[0008] In one embodiment, the step of providing the display module and the frame includes: forming the frame using an injection molding process.

[0009] The frame can be designed and molded directly in the structural component factory. Since the display module is not involved in the molding process, there is no need to protect the display module. The frame can be molded without designing complex molds. This can not only greatly reduce the production cost of the display screen, but also reduce the molding difficulty of the frame. Under the premise of meeting the assembly requirements of frame flatness, the production efficiency, product precision and product yield of the frame can be improved, thereby enhancing the product competitiveness of the display screen.

[0010] In one embodiment, during the step of providing the display module and the frame, the peripheral side of the back protective layer is located inside the peripheral side of the display panel.

[0011] After the steps of providing the display module and the frame, and before the step of assembling the frame to the display module using adhesive, the method for manufacturing the display screen further includes:

[0012] An adhesive backing layer is disposed on a first surface, the outer peripheral surface of the adhesive backing layer is located inside the peripheral side surface of the back protective layer, and the adhesive backing layer has a second surface facing away from the back protective layer.

[0013] In the step of assembling the frame to the display module using adhesive, the frame also overlaps the edge of the second surface, and the adhesive also bonds the second surface and the frame together.

[0014] The adhesive backing layer is used to assemble with the frame. Because the adhesive backing layer has a low elastic modulus, it can absorb the step difference between the display panel and the back protective layer in the display module, ensuring that the frame can be effectively assembled with the display module.

[0015] In one embodiment, the step of assembling the frame to the display module using adhesive includes:

[0016] Apply the adhesive to the adhesive frame;

[0017] The frame is then assembled into the display module.

[0018] The adhesive is cured to form a bond.

[0019] First, apply the adhesive to the frame, then assemble the frame onto the display module. Before the adhesive cures, the assembly position of the frame can be adjusted to ensure that the frame can be assembled into the designated position on the display module, thus ensuring the accuracy and stability of the assembly between the frame and the display module.

[0020] In one embodiment, the adhesive is made of a thermosetting adhesive, and the step of curing the adhesive to form an adhesive includes: heating the adhesive to thermoset it into an adhesive. The frame may be made of a resin with low light transmittance.

[0021] The material of the frame can be adjusted to adapt to different curing adhesives to ensure the assembly stability between the display module and the frame.

[0022] In one embodiment, the adhesive is made of light-curing adhesive, and the light transmittance of the adhesive frame is greater than or equal to 60%. The step of curing the adhesive to form an adhesive includes: irradiating the adhesive with light through the adhesive frame, and the adhesive is light-cured to form an adhesive.

[0023] The material of the frame can be adjusted to adapt to different curing adhesives to ensure the assembly stability between the display module and the frame.

[0024] Secondly, this application provides a display screen, including a display module, a frame, and an adhesive.

[0025] The display module includes a protective cover, a display panel, and a back protective layer. The protective cover has a bearing surface, the display panel is disposed on the bearing surface, the display panel has a non-display surface facing away from the protective cover, the back protective layer is disposed on the non-display surface, the peripheral side of the back protective layer is located inside the peripheral side of the display panel, and the back protective layer has a first surface facing away from the display panel.

[0026] The frame is located on the bearing surface and overlaps the edge of the non-display surface and the edge of the first surface. It surrounds the display panel and the back protective layer. The adhesive is bonded between the bearing surface and the frame, between the non-display surface and the frame, and between the first surface and the frame.

[0027] In the display screen shown in this application, the display module and the frame are first prepared separately, and then the display module and the frame are assembled using adhesive to achieve a firm assembly between them. The frame can be designed and molded directly in the structural component factory. Because the display module is not involved in the molding process, there is no need to protect the display module, and complex molds are not required to mold the frame. This not only significantly reduces the production cost of the display screen but also simplifies the molding process of the frame. While meeting the assembly requirements for a flat frame, this improves the production efficiency, product precision, and product yield of the frame, thereby enhancing the competitiveness of the display screen.

[0028] In one embodiment, the display screen further includes an adhesive layer disposed on a first surface, the outer peripheral surface of the adhesive layer being located inside the peripheral side surface of the back protective layer, and the adhesive layer having a second surface facing away from the back protective layer.

[0029] The frame also overlaps the edge of the second surface, and the adhesive is also bonded between the second surface and the frame.

[0030] The adhesive backing layer is used to assemble with the frame. Because the adhesive backing layer has a low elastic modulus, it can absorb the step difference between the display panel and the back protective layer in the display module, ensuring that the frame can be effectively assembled with the display module.

[0031] In one embodiment, the adhesive backing layer is provided with an overflow groove, the opening of which is located on the second surface, and at least part of the adhesive fills the overflow groove.

[0032] During the manufacturing process of the display screen, the overflow tank can contain excess adhesive, which not only allows the display module and the frame to achieve an interference fit, ensuring that different steps in the frame can be stably assembled with the display module, but also prevents the adhesive from overflowing to other parts of the display screen, improving the appearance of the display screen and thus ensuring the reliability of the display screen.

[0033] In one embodiment, the display panel includes a display portion, a connecting portion, and a bending portion. Along the thickness direction of the display panel, the connecting portion is located on the side of the display portion away from the protective cover and is spaced apart from the display portion. The bending portion is located on the same side of the display portion and the connecting portion and is connected between the display portion and the bending portion. Along the thickness direction of the display panel, the bending portion is offset from the adhesive layer.

[0034] Along the thickness direction of the display screen (Z-axis direction in the diagram), the adhesive layer is offset from the bending portion of the display panel. That is, the projection of the adhesive layer on the display panel is spaced apart from the bending portion. In other words, the adhesive layer and the bending portion do not overlap along the thickness direction of the display screen to avoid interference between them, prevent the adhesive layer from affecting the bending portion, and ensure the reliability of the display screen.

[0035] Thirdly, this application provides an electronic device, including a housing and any of the aforementioned displays, wherein the displays are mounted on the housing.

[0036] In the electronic device shown in this application, the display module and the frame are first prepared separately, and then the display module and the frame are assembled using adhesive to achieve a firm assembly between them. The frame can be designed and molded directly in the structural component factory. Because the display module is not involved in the molding process, there is no need to protect the display module, and the frame can be molded without designing complex molds. This not only significantly reduces the production cost of the display screen but also simplifies the molding process of the frame. While meeting the assembly requirements for a flat frame, it improves the production efficiency, product precision, and product yield of the frame, thereby enhancing the competitiveness of the display screen.

[0037] In one embodiment, the housing is provided with a mounting groove, the opening of the mounting groove is located on the upper surface of the housing, at least a portion of the display screen is located in the mounting groove, and the frame has a third surface facing away from the protective cover.

[0038] The electronic device also includes a bonding adhesive that adheres between the third surface and the bottom wall of the mounting groove.

[0039] Compared to the display screen being assembled with the housing via steps, the display screen shown in this application can be directly assembled with the housing via a frame, eliminating the need for a step design on the housing. This reduces the bezel width of the electronic device, enabling a narrow bezel design. Furthermore, the cooperation between the frame and the adhesive seals the gap between the display screen and the housing, preventing external moisture or dust from entering the interior of the electronic device and improving its airtightness. Attached Figure Description

[0040] To more clearly illustrate the technical solutions of the embodiments of this application, the accompanying drawings used in the embodiments of this application will be described below.

[0041] Figure 1 This is a schematic diagram of the structure of the electronic device provided in this application;

[0042] Figure 2 yes Figure 1 A schematic diagram of the cross-sectional structure of the electronic device shown after it has been cut along point II.

[0043] Figure 3 yes Figure 1 A schematic diagram of the planar structure of the display screen in the electronic device shown.

[0044] Figure 4 yes Figure 3 The diagram shows a cross-sectional structure of the display screen after it has been cut along point II-II.

[0045] Figure 5 yes Figure 3 The diagram shows a cross-sectional structure of the display screen after it has been cut along point III-III.

[0046] Figure 6 yes Figure 4 and Figure 5 The display screen shown is a schematic diagram of the module's structure.

[0047] Figure 7 yes Figure 1 A schematic diagram of a partial structure of the display screen in the electronic device shown, cut along line IV-IV.

[0048] Figure 8 yes Figure 4 The display screen shown is a schematic diagram of the assembly structure of the module and the adhesive backing layer.

[0049] Figure 9 yes Figure 5 The display screen shown is a schematic diagram of the assembly structure of the module and the adhesive backing layer.

[0050] Figure 10 yes Figure 4 and Figure 5 The diagram shows the structure of the frame in the display screen.

[0051] Figure 11 This is a process flow diagram of the manufacturing method of the display screen provided in this application;

[0052] Figure 12 yes Figure 11 The diagram shows a method for manufacturing a display screen in which adhesive is applied to the frame. Detailed Implementation

[0053] The technical solutions in the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings.

[0054] Please see Figure 1 and Figure 2 , Figure 1 This is a schematic diagram of the structure of the electronic device 1000 provided in this application. Figure 2 yes Figure 1 The diagram shows a cross-sectional view of the electronic device 1000 after it has been cut along point II. Here, "cut along point II" refers to cutting along the plane containing line II; other similar descriptions in this document can be understood in the same way.

[0055] The electronic device 1000 can be a mobile phone, tablet computer, laptop computer, in-vehicle infotainment system, smartwatch, smart bracelet, POS machine (point of sales terminal), or other electronic products. In the following description, this application will use a mobile phone as an example. For ease of description, the width direction of the electronic device 1000 is defined as the X-axis, the length direction as the Y-axis, and the thickness direction as the Z-axis. The X-axis, Y-axis, and Z-axis are mutually perpendicular. The X-axis and Y-axis form the XY plane, the X-axis and Z-axis form the XZ plane, and the Y-axis and Z-axis form the YZ plane.

[0056] Electronic device 1000 includes a housing 100, a display screen 200, a connecting adhesive 300, and a processor 400. The display screen 200 is mounted on the housing 100. Both the connecting adhesive 300 and the processor 400 are located inside the housing 100. The connecting adhesive 300 connects the display screen 200 and the housing 100 to mount the display screen 200 onto the housing 100. The processor 400 is electrically connected to the display screen 200. The processor may be a central processing unit (CPU). The processor 400 can send display signals to the display screen 200, and the display screen 200 can receive the display signals and display images or text information according to the display signals.

[0057] The housing 100 is provided with a mounting groove 101, which is located in the middle of the housing 100. The opening of the mounting groove 101 is located on the upper surface 102 of the housing 100. The mounting groove 101 is recessed from the upper surface 102 of the housing 100 to the lower surface 103 (in the negative Z-axis direction shown in the figure).

[0058] It should be noted that the directional terms such as "top," "bottom," "upper," "lower," "left," and "right" used in this application are for reference only. Figure 1 The descriptions of the orientations shown, with "top" referring to the positive Y-axis direction, "bottom" referring to the negative Y-axis direction, "up" referring to the positive Z-axis direction, "down" referring to the negative Z-axis direction, "right" referring to the positive X-axis direction, and "left" referring to the negative X-axis direction, are not intended to indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as limiting this application.

[0059] The display screen 200 is mounted in the mounting slot 101. Specifically, at least a portion of the display screen 200 is located in the mounting slot 101. The display screen 200 can be an LCD (liquid crystal display) or an OLED (organic light-emitting diode) display screen, etc., and this application does not impose any specific limitations on it.

[0060] Please see Figures 3 to 5 , Figure 3 yes Figure 1 A schematic diagram of the planar structure of the display screen 200 in the electronic device 1000 shown. Figure 4 yes Figure 3 The diagram shows a cross-sectional view of the display screen 200 after it has been cut along line II-II. Figure 5 yes Figure 3 The diagram shows a cross-sectional view of the display screen 200 after it has been cut along point III-III. Figure 3The schematic diagram shown is a planar structure diagram viewed from the non-display side to the display side of the display screen 200.

[0061] The display screen 200 includes a display module 210, an adhesive backing layer 220, a frame 230, and adhesive 240. The adhesive backing layer 220, frame 230, and adhesive 240 are all located on the non-display side of the display module 210. The adhesive 240 is located between the display module 210 and the frame 230, and between the adhesive backing layer 220 and the frame 230, and adheres to both the display module 210 and the frame 230 to achieve assembly between the display module 210 and the frame 230.

[0062] Please see Figure 6 and Figure 7 , Figure 6 yes Figure 4 and Figure 5 The diagram shows the structure of the display module 210 in the display screen 200. Figure 7 yes Figure 1 This is a partial structural diagram of the display screen 200 in the electronic device 1000, cut along line IV-IV. Figure 7 Only the display module 210 of the display screen 200 is shown.

[0063] The display module 210 includes a protective cover plate 10, a display panel 20, an optical film 30, an optically clear adhesive (OCA) layer 40, and a back protective layer 50. Along the thickness direction of the protective cover plate 10 (the Z-axis direction in the figure), the display panel 20, the optical film 30, the optical adhesive layer 40, and the back protective layer 50 are all located on the same side of the protective cover plate 10.

[0064] The protective cover 10 has an outer surface 104 and a supporting surface 105. The outer surface 104 is the surface of the protective cover 10 facing the outside of the electronic device 1000. Along the thickness direction of the protective cover 10 (the Z-axis direction in the figure), the supporting surface 105 is disposed opposite to the outer surface 104. The peripheral side surface 106 of the protective cover 10 is connected between the outer surface 104 and the supporting surface 105.

[0065] The display panel 20, optical film 30, optical adhesive layer 40, and back protective layer 50 are all disposed on the side of the bearing surface 105 facing away from the outer surface 104. Specifically, the display panel 20 is disposed on the bearing surface 105. The display panel 20 is located in the middle region of the bearing surface 105. The display panel 20 has a display surface 201 and a non-display surface 202. The display surface 201 is the surface of the display panel 20 facing the protective cover 10. Along the thickness direction of the display panel 20 (the Z-axis direction in the figure), the non-display surface 202 is disposed opposite to the display surface 201. The peripheral side surface 203 of the display panel 20 connects the display surface 201 and the non-display surface 202, and is located inside the peripheral side surface 106 of the protective cover 10, and is spaced apart from the peripheral side surface 106 of the protective cover 10. The distance between the peripheral side surface 203 of the display panel 20 and the peripheral side surface 106 of the protective cover 10 is w1.

[0066] In this embodiment, the display panel 20 includes a display portion 21, a connecting portion 22, and a bending portion 23. The display portion 21 is disposed on the bearing surface 105. Along the thickness direction of the display panel 20, the connecting portion 22 is located on the side of the display portion 21 away from the protective cover plate 10 and is spaced apart from the display portion 21. The connecting portion 22 is electrically connected to the processor to realize the electrical connection between the display screen 200 and the processor. The bending portion 23 is located on the same side of the display portion 21 and the connecting portion 22 and is connected between the display portion 21 and the connecting portion 22. The display portion 21 and the bending portion 23 are located at the bottom of the electronic device 1000. It should be noted that the display screen 200 is often packaged using COF (Chip On Film) or COP (Chip On Pi) technology, and the bending portion 23 shown above can also be referred to as the COF area or COP area of ​​the display panel 20.

[0067] An optical film 30 is located between the protective cover plate 10 and the display panel 20. Specifically, the optical film 30 is located between the bearing surface 105 and the display surface 201. The peripheral side surface 301 of the optical film 30 is located inside the peripheral side surface 106 of the protective cover plate 10 and is flush with the peripheral side surface 203 of the display panel 20. Exemplarily, the optical film 30 may include a polarizer. In some other embodiments, the peripheral side surface 301 of the optical film 30 may not be flush with the peripheral side surface 203 of the display panel 20; this application does not impose specific limitations on this.

[0068] The optical adhesive layer 40 is located between the protective cover plate 10 and the optical film 30, and connects the protective cover plate 10 and the optical film 30. Specifically, the optical adhesive layer 40 is located between the bearing surface 105 and the optical film 30, and connects the bearing surface 105 and the optical film 30. The peripheral side surface 401 of the optical adhesive layer 40 is located inside the peripheral side surface 106 of the protective cover plate 10, and is flush with the peripheral side surface 203 of the display panel 20 and the peripheral side surface 301 of the optical film 30. In some other embodiments, the peripheral side surface 401 of the optical adhesive layer 40 may not be flush with the peripheral side surface 203 of the display panel 20, and / or, the peripheral side surface 401 of the optical adhesive layer 40 may not be flush with the peripheral side surface 301 of the optical film 30.

[0069] A back protective layer 50 is located on the side of the display panel 20 facing away from the protective cover 10 to protect the non-display surface 202 of the display panel 20. Specifically, the back protective layer 50 is disposed on the non-display surface 202. The back protective layer 50 is located in the middle region of the non-display surface 202. For example, the back protective layer 50 may include super clean foam (SCF).

[0070] The back protective layer 50 has a first surface 501 and a fourth surface 502. The first surface 501 is the surface of the back protective layer 50 that faces away from the display panel 20. Along the thickness direction of the back protective layer 50 (the Z-axis direction in the figure), the fourth surface 502 is disposed opposite to the first surface 501 and faces the display panel 20. The peripheral side surface 503 of the back protective layer 50 is connected between the first surface 501 and the fourth surface 502, and is located inside the peripheral side surface 203 of the display panel 20, and is spaced apart from the peripheral side surface 203 of the display panel 20. The distance between the peripheral side surface 503 of the back protective layer 50 and the peripheral side surface 203 of the display panel 20 is w2. For example, w2 = 0.3 mm.

[0071] Please see Figure 8 , Figure 8 yes Figure 4 This is a schematic diagram of the assembly structure of the display module 210 and the adhesive layer 220 in the display screen 200 shown.

[0072] The adhesive layer 220 is located on the side of the back protective layer 50 facing away from the display panel 20. Specifically, the adhesive layer 220 is disposed on the first surface 501. The adhesive layer 220 is located at the edge of the first surface 501. In this embodiment, the adhesive layer 220 is annular and surrounds the middle region of the first surface 501. The adhesive layer 220 has a second surface 221 and a fifth surface 222. The second surface 221 is the surface of the adhesive layer 220 facing away from the back protective layer 50. Along the thickness direction of the adhesive layer 220 (the Z-axis direction in the figure), the fifth surface 222 is disposed opposite to the second surface 221 and faces the back protective layer 50. The inner peripheral surface 223 and the outer peripheral surface 224 of the adhesive layer 220 are both connected between the second surface 221 and the fifth surface 222, and are disposed opposite to each other. The outer peripheral surface 224 of the adhesive layer 220 is located inside the peripheral side surface 503 of the back protective layer 50, and is spaced apart from the peripheral side surface 503 of the back protective layer 50. The distance between the inner peripheral surface 223 and the outer peripheral surface 224 of the adhesive layer 220 is w3, where 2mm ≤ w3 ≤ 5mm. For example, w3 = 3mm. The distance between the outer peripheral surface 224 of the adhesive layer 220 and the peripheral side surface 503 of the back protective layer 50 is w4. For example, w4 = 0.5mm.

[0073] Please see Figure 9 , Figure 9 yes Figure 5 This is a schematic diagram of the assembly structure of the display module 210 and the adhesive layer 220 in the display screen 200 shown.

[0074] In addition, the adhesive backing layer 220 is provided with an adhesive overflow groove 225, which is located between the inner peripheral surface 223 and the outer peripheral surface 224 of the adhesive backing layer 220. Specifically, the opening of the adhesive overflow groove 225 is located on the second surface 221. The adhesive overflow groove 225 is recessed from the second surface 221 toward the fifth surface 222, and penetrates the fifth surface 222 and the outer peripheral surface 224 of the adhesive backing layer 220, and is spaced apart from the inner peripheral surface 223 of the adhesive backing layer 220. There are multiple adhesive overflow grooves 225, which are arranged at intervals.

[0075] Please read Figure 3 and Figure 7 Along the thickness direction of the display screen 200 (Z-axis direction in the diagram), the adhesive layer 220 is offset from the bent portion 23 of the display panel 20. That is, the projection of the adhesive layer 220 onto the display panel 20 is spaced apart from the bent portion 23. In other words, along the thickness direction of the display screen 200, the adhesive layer 220 and the bent portion 23 do not overlap, thus avoiding interference between the adhesive layer 220 and the bent portion 23, preventing the adhesive layer 220 from affecting the bent portion 23, and ensuring the reliability of the display screen 200.

[0076] In this embodiment, the adhesive layer 220 includes a first adhesive portion 226 and two second adhesive portions 227. The first adhesive portion 226 is located on the top side of the electronic device 1000. The first adhesive portion 226 extends along the X-axis. The first adhesive portion 226 has a plurality of overflow grooves 225 spaced apart along the X-axis. Along the extending direction of the first adhesive portion 226 (the X-axis direction shown in the figure), the two second adhesive portions 227 are located on opposite sides of the first adhesive portion 226, and are spaced apart from it. Specifically, one second adhesive portion 227 is located on the left side of the electronic device 1000, and the other second adhesive portion 227 is located on the right side of the electronic device 1000. Both second adhesive portions 227 extend along the Y-axis and each has a plurality of overflow grooves 225 spaced apart along the Y-axis.

[0077] It is understood that the adhesive layer 220 is not disposed on the bottom side of the electronic device 1000 to avoid interference between the adhesive layer 220 and the bending portion 23 of the display panel 20, thus ensuring the reliability of the display screen 200. In some other embodiments, the adhesive layer 220 may also include a third adhesive portion, which may be connected between the first adhesive portion 226 and the second adhesive portion 227. In this case, the third adhesive portion may be located at the corner of the electronic device 1000, and this application does not impose specific limitations on this.

[0078] Please see Figure 4 and Figure 5 The frame 230 is located on the same side of the protective cover 10 as the display panel 20, optical film 30, optical adhesive layer 40, back protective layer 50, and adhesive backing layer 220. Specifically, the frame 230 is disposed on the bearing surface 105 and overlaps the edge of the non-display surface 202, the edge of the first surface 501, and the edge of the second surface 221, and surrounds the display panel 20, optical film 30, optical adhesive layer 40, back protective layer 50, and adhesive backing layer 220. The frame 230 can be formed by injection molding.

[0079] Please refer to the following: Figure 10 , Figure 10 yes Figure 4 and Figure 5 The diagram shows the structure of the frame 230 in the display screen 200.

[0080] The frame 230 has a third surface 231 and a sixth surface 232. The third surface 231 is the surface of the frame 230 facing away from the protective cover plate 10, and is located on the side of the second surface 221 of the adhesive layer 220 facing away from the fifth surface 222, and is spaced apart from the second surface 221. Along the thickness direction of the frame 230 (Z-axis direction in the figure), the sixth surface 232 is positioned opposite to the third surface 231, facing the protective cover plate 10, and is spaced apart from the bearing surface 105. The inner peripheral surface 233 and the outer peripheral surface 234 of the frame 230 are connected between the third surface 231 and the sixth surface 232, and are positioned opposite to each other. The inner peripheral surface 233 of the frame 230 is located between the inner peripheral surface 223 and the outer peripheral surface 224 of the adhesive layer 220, and is spaced apart from both the inner peripheral surface 223 and the outer peripheral surface 224 of the adhesive layer 220. The outer peripheral surface 234 of the frame 230 is located between the peripheral side surface 203 of the display panel 20 and the peripheral side surface 106 of the protective cover 10, and is spaced apart from both the peripheral side surface 203 of the display panel 20 and the peripheral side surface 106 of the protective cover 10. The distance between the inner peripheral surface 233 and the outer peripheral surface 234 of the frame 230 is w5, where 1mm ≤ w5 ≤ 5mm. For example, w5 = 2mm. The distance between the outer peripheral surface 234 of the frame 230 and the peripheral side surface 106 of the protective cover 10 is w6, where w6 is greater than 0mm. For example, w6 = 0.1mm. The distance between the outer peripheral surface 234 of the frame 230 and the peripheral side surface 203 of the display panel 20 is w7, where 0.2mm ≤ w7 ≤ 0.5mm. For example, w7 = 0.3mm.

[0081] Please refer to the following: Figure 6The frame 230 is provided with a first receiving groove 235 and a second receiving groove 236. Both the first receiving groove 235 and the second receiving groove 236 are located inside the outer peripheral surface 234 of the frame 230 and are spaced apart from the outer peripheral surface 234. The opening of the first receiving groove 235 is located on the sixth surface 232. The first receiving groove 235 is recessed from the sixth surface 232 towards the third surface 231 (in the negative Z-axis direction shown in the figure), and houses the display panel 20, the optical film 30, and the optical adhesive layer 40. The first receiving groove 235 has a first groove bottom wall surface 2351 and a first groove side wall surface 2352. The first groove bottom wall surface 2351 is opposite to the opening of the first receiving groove 235 and is located between the sixth surface 232 and the third surface 231, and is spaced apart from the sixth surface 232 and the third surface 231. The first groove bottom wall surface 2351 faces the non-display surface 202 of the display panel 20 and is spaced apart from the non-display surface 202 of the display panel 20. The first groove sidewall 2352 is disposed around the first groove bottom wall 2351 and connects the first groove bottom wall 2351 and the sixth surface 232. The first groove sidewall 2352 faces the peripheral side surface 203 of the display panel 20, the peripheral side surface 301 of the optical film 30 and the peripheral side surface 401 of the optical adhesive layer 40, and is spaced apart from the peripheral side surface 203 of the display panel 20, the peripheral side surface 301 of the optical film 30 and the peripheral side surface 401 of the optical adhesive layer 40.

[0082] Please refer to the following: Figure 8 The second receiving groove 236 is located inside the side wall 2352 of the first groove and is spaced apart from the side wall 2352. The opening of the second receiving groove 236 is located on the bottom wall 2351 of the first groove. The second receiving groove 236 is recessed from the bottom wall 2351 of the first groove towards the third surface 231 (in the negative Z-axis direction of the figure) and receives the back protective layer 50 and the adhesive layer 220. The second receiving groove 236 has a second bottom wall 2361 and a second side wall 2362. The second bottom wall 2361 is disposed opposite to the opening of the second receiving groove 236 and is located between the first bottom wall 2351 and the third surface 231, and is spaced apart from the first bottom wall 2351 and the third surface 231. The second groove bottom wall surface 2361 faces the first surface 501 of the back protective layer 50 and the second surface 221 of the adhesive layer 220, and is spaced apart from the fourth surface 502 of the back protective layer 50 and the second surface 221 of the adhesive layer 220. The second groove side wall surface 2362 surrounds the second groove bottom wall surface 2361 and connects the first groove bottom wall surface 2351 and the second groove bottom wall surface 2361. The second groove side wall surface 2362 faces the peripheral side surface 503 of the back protective layer 50 and the outer peripheral surface 224 of the adhesive layer 220, and is spaced apart from the peripheral side surface 503 of the back protective layer 50 and the outer peripheral surface 224 of the adhesive layer 220.

[0083] Please see Figure 5 and Figure 6 The adhesive 240 is located between the protective cover plate 10 and the frame 230, between the display panel 20 and the frame 230, between the optical adhesive layer 40 and the frame 230, between the optical film 30 and the frame 230, between the back protective layer 50 and the frame 230, and between the back adhesive layer 220 and the frame 230. It is bonded to the protective cover plate 10 and the frame 230, between the display panel 20 and the frame 230, between the optical adhesive layer 40 and the frame 230, between the optical film 30 and the frame 230, between the back protective layer 50 and the frame 230, and between the back adhesive layer 220 and the frame 230, and is disposed around the display panel 20, the optical film 30, the optical adhesive layer 40, the back protective layer 50 and the back adhesive layer 220.

[0084] Specifically, the adhesive 240 is located between the bearing surface 105 of the protective cover plate 10 and the sixth surface 232 of the adhesive frame 230, between the first groove sidewall 2352 and the peripheral side surface 203 of the display panel 20, between the first groove sidewall 2352 and the peripheral side surface 301 of the optical film 30, between the first groove sidewall 2352 and the peripheral side surface 401 of the optical adhesive layer 40, between the first groove bottom wall 2351 and the non-display surface 202 of the display panel 20, between the second groove sidewall 2362 and the peripheral side surface 503 of the back protective layer 50, between the second groove sidewall 2362 and the outer peripheral surface 224 of the back adhesive layer 220, between the second groove bottom wall 2361 and the first surface 501 of the back protective layer 50, and between the second groove bottom wall 2361 and the first surface 501 of the back protective layer 50. The adhesive 240 is bonded between the second surface 221 of the adhesive backing layer 220 and the second surface 221 of the backing layer 220, and is also bonded between the bearing surface 105 and the sixth surface 232, between the first groove sidewall 2352 and the peripheral side surface 203 of the display panel 20, between the first groove sidewall 2352 and the peripheral side surface 301 of the optical film 30, between the first groove sidewall 2352 and the peripheral side surface 401 of the optical adhesive layer 40, between the first groove bottom wall 2351 and the non-display surface 202, between the second groove sidewall 2362 and the peripheral side surface 503 of the back protective layer 50, between the second groove sidewall 2362 and the outer peripheral surface 224 of the adhesive backing layer 220, between the second groove bottom wall 2361 and the fourth surface 502, and between the second groove bottom wall 2361 and the second surface 221. At least a portion of the adhesive 240 can fill the overflow groove 225 of the adhesive backing layer 220. For example, the adhesive 240 can be formed by a dispensing process.

[0085] In one embodiment, the adhesive 240 is made of thermosetting adhesive. The frame 230 can be made of a resin with low light transmittance. For example, the light transmittance of the frame 230 is less than 60%. In this case, the light transmittance of the frame 230 is low, and during the fabrication of the display screen 200, the adhesive 240 can be photocured by heating.

[0086] In another embodiment, the adhesive 240 can be made of a light-curing adhesive. For example, the adhesive 240 can be made of an ultraviolet (UV) light-curing adhesive. The frame 230 can be made of a resin with high light transmittance. For example, the light transmittance of the frame 230 is greater than or equal to 60%. In this case, the frame 230 has high light transmittance, and during the fabrication of the display screen 200, the adhesive 240 can be light-cured by the light passing through the frame 230.

[0087] In the display screen 200 shown in this embodiment, the display module 210 and the frame 230 are first prepared separately, and then the display module 210 and the frame 230 are assembled using adhesive 240 to achieve a firm assembly between them. The frame 230 can be designed and molded directly in the structural component factory. Because the display module 210 is not involved in the molding process of the frame 230, there is no need to protect the display module 210, and the frame 230 can be molded without designing complex molds. This not only greatly reduces the production cost of the display screen 200 but also reduces the molding difficulty of the frame 230. While meeting the assembly requirements for a flat frame 230, it improves the production efficiency, product precision, and product yield of the frame 230, thereby enhancing the product competitiveness of the display screen 200.

[0088] Furthermore, the display module 210 utilizes an adhesive backing layer 220 to assemble with the frame 230. Due to the low elastic modulus of the adhesive backing layer 220, it can absorb the step difference between the display panel 20 and the back protective layer 50, ensuring effective assembly between the frame 230 and the display module 210. In addition, the excess adhesive groove 225 in the adhesive backing layer 220 can contain excess adhesive, not only enabling an interference fit between the display module 210 and the frame 230, ensuring stable assembly with the display module 210 at different step positions in the frame 230, but also preventing adhesive overflow onto other parts of the display screen 200, improving the cleanliness of the display screen 200 and thus ensuring its reliability.

[0089] It should be noted that in some other embodiments, the display screen 200 may not include the backing adhesive layer 220, and the display module 210 may be directly assembled with the frame 230 through the adhesive 240. This application does not impose specific restrictions on this.

[0090] Please see Figure 2The adhesive 300 is located between the third surface 231 of the frame 230 and the bottom wall 1011 of the mounting groove 101, and is bonded between the third surface 231 and the bottom wall 1011 of the mounting groove 101 to mount the display screen 200 in the mounting groove 101. The bearing surface 105 of the protective cover 10 is spaced apart from and opposite to the bottom wall 1011 of the mounting groove 101.

[0091] Understandably, compared to the display screen 200 being assembled with the housing 100 via a step, the display screen 200 in this embodiment can be directly assembled with the housing 100 via the frame 230, eliminating the step design on the housing 100. This reduces the bezel width of the electronic device 1000, enabling a narrow bezel design. Furthermore, the cooperation between the frame 230 and the adhesive 300 seals the gap between the display screen 200 and the housing 100, preventing external moisture or dust from entering the interior of the electronic device 1000 through this gap, thus improving the airtightness of the electronic device 1000.

[0092] Please see Figure 11 , Figure 11 This is a process flow diagram of the method for manufacturing the display screen provided in this application.

[0093] The method for manufacturing a display screen provided in this application is used to manufacture the display screen described above. The method for manufacturing a display screen includes steps S1 to S3.

[0094] Step S1, providing the display module 210 and the frame 230. (e.g.) Figure 6 As shown, the display module 210 includes a protective cover plate 10, a display panel 20, and a back protective layer 50. The protective cover plate 10 has a bearing surface 105. The display panel 20 is disposed on the bearing surface 105. The display panel 20 has a non-display surface 202 facing away from the protective cover plate 10. The back protective layer 50 is disposed on the non-display surface 202. The back protective layer 50 has a first surface 501 facing away from the display panel 20. The peripheral side surface 503 of the back protective layer 50 is located inside the peripheral side surface 203 of the display panel 20. It is understood that the display module 210 may also include an optical film 30 and an optical adhesive layer 40. The mating relationships between the optical film 30 and the optical adhesive layer 40 and the protective cover plate 10 and the display panel 20 can be referred to the relevant descriptions above, and will not be repeated here.

[0095] In this embodiment, the frame 230 is formed using injection molding. It should be noted that before injection molding the frame 230, the dimensions of the frame 230 can be designed according to the dimensions of the display module 210, and then the frame 230 is injection molded at the structural component factory. Since the display module 210 is not required during the molding process of the frame 230, there is no need to design protective fixtures for the display module 210. Therefore, the molding of the frame 230 can be achieved without designing complex molds. This not only significantly reduces the production cost of the display screen 200 but also reduces the molding difficulty of the frame 230. While meeting the assembly requirements for a flat frame 230, it improves the production efficiency, product precision, and product yield of the frame 230, thereby enhancing the product competitiveness of the display screen 200.

[0096] Step S2, the adhesive backing layer 220 is applied to the first surface 501. For example... Figure 3 , Figure 8 and Figure 9 As shown, the adhesive layer 220 is disposed in the middle region of the first surface 501. The outer peripheral surface 224 of the adhesive layer 220 is located inside the peripheral side surface 503 of the back protective layer 50. The adhesive layer 220 has a second surface 221 and a fifth surface 222. The second surface 221 is the surface of the adhesive layer 220 that faces away from the back protective layer 50. Along the thickness direction of the adhesive layer 220 (the Z-axis direction in the figure), the fifth surface 222 is disposed opposite to the second surface 221 and faces the back protective layer 50. The adhesive layer 220 is provided with an overflow groove 225. The overflow groove 225 is recessed from the second surface 221 toward the fifth surface 222. For example, there are multiple overflow grooves 225, which are arranged at intervals.

[0097] It should be noted that step S2 can be performed at the display module factory. Based on the design of the display module 210, a matching design for the backing adhesive layer 220 can be added. After the display module 210 is manufactured at the display module factory, a new process can be directly added to apply the backing adhesive layer 220 to the first surface 501 of the back protective layer 50. In some other embodiments, step S2 can also be performed at the OEM factory; this application does not impose specific limitations on this.

[0098] Step S3: Use adhesive 240 to assemble the frame 230 onto the display module 210. For example... Figure 4 and Figure 5 As shown, the frame 230 is disposed on the bearing surface 105 and overlaps the edges of the non-display surface 202, the first surface 501, and the second surface 221, and surrounds the display panel 20, the back protective layer 50, and the adhesive layer 220. Adhesive 240 is bonded between the bearing surface 105 and the frame 230, between the non-display surface 202 and the frame 230, and between the first surface 501 and the frame 230. Step S3 can be performed at the OEM factory.

[0099] In this embodiment, step S3 may include steps S31 to S32.

[0100] Step S31: Apply adhesive 240a to the adhesive frame 230. (Example) Figure 12 The adhesive 240 is applied to the sixth surface 232, the first groove sidewall 2352, the first groove bottomwall 2351, the second groove sidewall 2362, and the second groove bottomwall 2361. Specifically, the adhesive 240a can be formed by a dispensing process. For example, the adhesive frame 230 can be dispensed at a designated location using a fixture. It should be noted that the adhesive 240a can be in a fluid or semi-solid state, and it has a certain degree of fluidity, allowing it to flow on the adhesive frame 230.

[0101] Step S32: Assemble the frame 230 onto the display module 210. For example, the frame 230 can be assembled into a designated position on the display module 210 using a fixture or device. It should be noted that, due to the fluidity of the adhesive 240a, the position of the frame 230 can be fine-tuned during the assembly process between the frame 230 and the display module 210, ensuring that the frame 230 can be assembled into the designated position on the display module 210, thus ensuring the accuracy and stability of the assembly. Furthermore, the fluid adhesive 240a can flow into the overflow tank 225, which can contain excess adhesive 240a, preventing it from flowing to other parts of the display module 210 and causing contamination.

[0102] Step S33: Curing the adhesive 240a to form adhesive 240. Specifically, a clamp can be used to hold the display module 210 and the frame 230 under pressure, and the clamp can be used to cure the assembled display module 210, the backing layer 220, the frame 230 and the adhesive 240a into an integrated assembly to ensure a firm bond between the display module 210 and the backing layer 220 and the frame 230.

[0103] It should be noted that the material of the frame 230 can be adjusted to adapt to different curing methods of adhesives in order to ensure the assembly stability between the display module 210 and the frame 230.

[0104] In one embodiment, the adhesive 240a is made of thermosetting adhesive. The frame 230 can be made of a resin with low light transmittance. In step S33, the display module 210 and the frame 230 are held under pressure using a clamp, and the assembled display module 210, backing layer 220, frame 230, and adhesive 240a are placed in a heating furnace for heating. The adhesive 240a is thermosetting to form adhesive 240. Figure 4 and Figure 5As shown.

[0105] In one embodiment, the adhesive 240a is made of a UV-curable adhesive. For example, the adhesive 240a is made of an ultraviolet-curable adhesive. The frame 230 can be made of a resin with high light transmittance. For example, the light transmittance of the frame 230 is greater than or equal to 60%. In step S33, the display module 210 and the frame 230 are held under pressure using a clamp, and ultraviolet light is used to irradiate the adhesive 240a through the frame 230, causing the adhesive 240a to photocur and form adhesive 240. Figure 4 and Figure 5 As shown.

[0106] In the display screen manufacturing method shown in this embodiment, the display module 210 and the frame 230 are first prepared separately, and then the display module 210 and the frame 230 are assembled using adhesive 240 to achieve a firm assembly between the display module 210 and the frame 230. The frame 230 can be designed and molded directly in the structural component factory. Because the display module 210 is not involved in the molding process of the frame 230, there is no need to protect the display module 210, and the frame 230 can be molded without designing complex molds. This not only greatly reduces the production cost of the display screen 200, but also reduces the molding difficulty of the frame 230. While meeting the assembly requirements for a flat frame 230, it improves the production efficiency, product precision, and product yield of the frame 230, thereby enhancing the product competitiveness of the display screen 200.

[0107] Furthermore, the display module 210 utilizes the adhesive backing layer 220 to assemble with the frame 230. Because the adhesive backing layer 220 has a low elastic modulus, it can absorb the step difference between the display panel 20 and the back protective layer 50, ensuring effective assembly between the frame 230 and the display module 210. It should be noted that in some other embodiments, the display screen manufacturing method may not include step S2; this application does not impose specific limitations on this.

[0108] The above description is merely a specific embodiment of this application, but the scope of protection of this application is not limited thereto. Any variations or substitutions that can be easily conceived by those skilled in the art within the scope of the technology disclosed in this application should be included within the scope of protection of this application. Where there is no conflict, the embodiments and features in the embodiments of this application can be combined with each other. Therefore, the scope of protection of this application should be determined by the scope of the claims.

Claims

1. A method for manufacturing a display screen, characterized in that, include: A display module and a frame are provided, wherein the display module includes a protective cover, a display panel and a back protective layer, the protective cover has a bearing surface, the display panel is disposed on the bearing surface, the display panel has a non-display surface facing away from the protective cover, the back protective layer is disposed on the non-display surface, the peripheral side of the back protective layer is located inside the peripheral side of the display panel, and the back protective layer has a first surface facing away from the display panel; An adhesive backing layer is disposed on the first surface, the outer peripheral surface of the adhesive backing layer is located inside the peripheral side surface of the back protective layer, and the adhesive backing layer has a second surface facing away from the back protective layer. The adhesive frame is assembled to the display module using adhesive. The adhesive frame is located on the supporting surface and overlaps the edge of the non-display surface, the edge of the first surface, and the edge of the second surface. It surrounds the display panel, the back protective layer, and the adhesive backing layer. The adhesive is bonded between the supporting surface and the adhesive frame, between the non-display surface and the adhesive frame, between the first surface and the adhesive frame, and between the second surface and the adhesive frame.

2. The method for manufacturing a display screen according to claim 1, characterized in that, The step of providing the display module and the frame includes: forming the frame using an injection molding process.

3. The method for manufacturing a display screen according to claim 1 or 2, characterized in that, The step of assembling the adhesive frame to the display module using adhesive includes: Apply adhesive to the adhesive frame; The frame is assembled into the display module; The adhesive is cured to form the adhesive.

4. The method for manufacturing a display screen according to claim 3, characterized in that, The adhesive is made of thermosetting adhesive, and the step of curing the adhesive to form the adhesive includes: heating the adhesive to heat-cur the adhesive to form the adhesive.

5. The method for manufacturing a display screen according to claim 3, characterized in that, The adhesive is made of light-curing adhesive, and the light transmittance of the adhesive frame is greater than or equal to 60%. The step of curing the adhesive to form the adhesive includes: irradiating the adhesive through the adhesive frame with light, and the adhesive being light-cured to form the adhesive.

6. A display screen, characterized in that, This includes the display module, backing layer, frame, and adhesive. The display module includes a protective cover, a display panel, and a back protective layer. The protective cover has a bearing surface, the display panel is disposed on the bearing surface, the display panel has a non-display surface facing away from the protective cover, the back protective layer is disposed on the non-display surface, the peripheral side of the back protective layer is located inside the peripheral side of the display panel, and the back protective layer has a first surface facing away from the display panel. The adhesive backing layer is disposed on the first surface, the outer peripheral surface of the adhesive backing layer is located inside the peripheral side surface of the back protective layer, and the adhesive backing layer has a second surface facing away from the back protective layer. The adhesive frame is disposed on the bearing surface and overlaps the edge of the non-display surface, the edge of the first surface and the edge of the second surface, and surrounds the display panel, the back protective layer and the adhesive layer. The adhesive is bonded between the bearing surface and the adhesive frame, between the non-display surface and the adhesive frame, between the first surface and the adhesive frame, and between the second surface and the adhesive frame.

7. The display screen according to claim 6, characterized in that, The adhesive backing layer is provided with an overflow groove, the opening of which is located on the second surface, and at least a portion of the adhesive fills the overflow groove.

8. The display screen according to claim 6 or 7, characterized in that, The display panel includes a display part, a connecting part, and a bending part. The connecting part is located on the side of the display part away from the protective cover plate and is spaced apart from the display part. The bending part is located on the same side of the display part and the connecting part and is connected between the display part and the bending part. Along the thickness direction of the display screen, the bending part is offset from the adhesive layer.

9. An electronic device, characterized in that, It includes a housing and a display screen as described in any one of claims 6 to 8, wherein the display screen is mounted on the housing.

10. The electronic device according to claim 9, characterized in that, The housing is provided with a mounting groove, the opening of the mounting groove is located on the upper surface of the housing, at least part of the display screen is located in the mounting groove, and the frame has a third surface facing away from the protective cover. The electronic device also includes a bonding adhesive, which is bonded between the third surface and the bottom wall of the mounting groove.

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