Method and device for determining heat-setting heat preservation duration of capacitor element, terminal equipment and storage medium

Abstract

The invention discloses a method and device for determining the heat-setting heat preservation duration of a capacitor element, terminal equipment and a storage medium, and relates to the technical field of element heat-setting process.The method comprises the steps that when it is judged that the temperature of the capacitor element reaches the preset temperature, the duration needed when the capacitor element reaches the preset temperature of the heat-setting stage is output, and the duration is obtained; the heat preservation duration conforming to the actual temperature rise condition of the element can be obtained based on the actual temperature change condition of the capacitor element in the heat setting process, so that the more reasonable heat preservation duration can be adjusted, two different duration increments are introduced, the situation that the finally obtained heat preservation duration is too short or too long can be avoided, and the heat preservation efficiency is improved. And uniform internal and external heating of the capacitor element in the heat setting process is ensured, and a good shrinkage effect is achieved. By implementing the method and the device, the problem that the heat preservation time is too short or too long due to the fact that the heat preservation time which is accurate and conforms to the actual temperature rise condition of the element cannot be obtained in the prior art can be solved.

Description

Technical Field

[0001] The present invention relates to the technical field of heat setting treatment of capacitor elements, and in particular to a method, device, terminal equipment and storage medium for determining the heat setting insulation time of a capacitor element. Background Art

[0002] The DC link capacitor element is made of thousands of turns of polypropylene film coated with nano-metal on one side. The heat setting process is a key factor affecting the capacitor's electrical performance. The polypropylene film shrinks longitudinally at high temperatures, squeezing out air between the film layers. This increases the onset voltage of partial discharge, prevents air gap ionization, and thus ensures the capacitor's service life.

[0003] Because the heat conduction time between film layers of capacitor elements of different diameters or lengths varies, if the heat setting and holding time is too short, the polypropylene film in the inner ring of the capacitor element will not shrink completely, the metallized film layer in the inner ring will not be fully bonded, and bubbles will appear inside the core. If the heat setting and holding time is too long, the polypropylene film in the inner ring of the capacitor element will be damaged by excessive heat, which will not only reduce efficiency but also increase industrial costs. Therefore, setting a reasonable holding time for each heat setting stage of the capacitor element can ensure that the internal and external heat of the capacitor element film layers are evenly heated to achieve the desired shrinkage effect, and effectively reduce industrial costs.

[0004] In traditional technology, the holding time of capacitor components is often determined through empirical methods or simple calculations. For example, the holding time is set based on the experience of technicians, or the holding time is calculated using a simple formula or model based on factors such as the material and size of the capacitor component. However, relying on experience may make the holding time setting too subjective, and the calculation formula or model may be too simplified to accurately reflect the actual situation of the capacitor component during the heat setting process. As a result, it may not be possible to determine an accurate holding time that matches the actual temperature rise of the component. It may also result in the holding time being too short or too long, which in turn leads to problems such as uneven shrinkage of the capacitor component and excessively high production costs. Summary of the Invention

[0005] The embodiments of the present invention provide a method, apparatus, terminal device and storage medium for determining the heat setting insulation time of a capacitor element. The method can not only monitor the temperature of the capacitor element in real time and dynamically adjust the insulation time, but also introduce two different time increments to avoid the final insulation time being too short or too long. This can ensure that the capacitor element is heated evenly inside and outside during the heat setting process, achieving a good shrinkage effect. This can not only reduce industrial costs but also improve production efficiency, solving the problem of the prior art that the insulation time is too short or too long due to the inability to obtain an accurate insulation time that conforms to the actual temperature rise of the element.

[0006] An embodiment of the present invention provides a method for determining the heat setting holding time of a capacitor element, comprising:

[0007] Obtaining a preset temperature and a preset holding time corresponding to a heat setting stage of a capacitor element;

[0008] Obtaining the heating time required for the temperature of the capacitor element to reach the preset temperature;

[0009] When it is determined that the heating time is less than the preset heat preservation time, a first target heat preservation time corresponding to the capacitor element is generated according to the heating time and the first preset time increment; wherein the first target heat preservation time is less than the preset heat preservation time;

[0010] When it is determined that the heating time is not less than the preset insulation time, a second target insulation time corresponding to the capacitor element is generated based on the heating time and the second preset time increment; wherein the first preset time increment is less than the second preset time increment.

[0011] Preferably, obtaining the heating time required for the temperature of the capacitor element to reach the preset temperature includes:

[0012] The temperature of the capacitor components in the heat setting stage in the hot oven is detected in real time by a multi-channel temperature tester;

[0013] When the temperature of the capacitor element in the heat setting stage reaches the preset temperature, the heating time of the capacitor element in the heat oven is calculated.

[0014] Preferably, the multi-channel temperature tester is connected to any capacitor element via a thermocouple;

[0015] The thermocouple comprises: a measuring end and a connecting end;

[0016] Wherein, the measuring end of the thermocouple is fixedly connected to the capacitor element, and the connecting end of the thermocouple is connected to the port of the multi-channel temperature tester.

[0017] Preferably, the temperature of the capacitor element in the heat setting stage includes: the temperature corresponding to the first temperature measuring point and the temperature corresponding to the second temperature measuring point;

[0018] When the temperature of the capacitor element reaches the preset temperature in the heat setting stage, calculating the heating time of the capacitor element in the heat oven includes:

[0019] When it is determined that the temperature corresponding to the first temperature measuring point is equal to the preset temperature and the temperature corresponding to the second temperature measuring point is equal to the preset temperature, obtaining a first time required for the first temperature measuring point to reach the preset temperature during the heat setting stage and a second time required for the second temperature measuring point to reach the preset temperature during the heat setting stage;

[0020] When it is determined that the first time period is greater than the second time period, the first time period is output as the heating time period corresponding to the capacitor element;

[0021] When it is determined that the first time duration is not greater than the second time duration, the second time duration is output as the heating time duration corresponding to the capacitor element;

[0022] Among them, the first temperature measurement point is used to characterize the position point inside the capacitor element, and the first temperature measurement point includes: the position point corresponding to the midpoint of the total length of the capacitor element radially toward the core axis; the second temperature measurement point includes: the position point corresponding to the midpoint of the surface of the capacitor element.

[0023] Preferably, the measuring end of the thermocouple comprises: a temperature probe;

[0024] The temperature probe is fixedly connected to the first temperature measuring point of the capacitor element and the second temperature measuring point of the capacitor element through a sealant;

[0025] Wherein, the radius of the temperature probe is the same as the radius of the first temperature measuring point.

[0026] Preferably, the distance between any two adjacent capacitor elements in the thermal oven is not less than 10 mm.

[0027] Preferably, the first temperature measurement point is used to represent a hole obtained by drilling a hole at a point radially from the midpoint of the capacitor element toward the core axis.

[0028] The radius of the hole corresponding to the first temperature measuring point is 2 mm.

[0029] Based on the above method embodiments, the present invention provides corresponding device embodiments.

[0030] An embodiment of the present invention provides a device for determining heat setting and heat preservation time of a capacitor element, comprising: a heat setting data acquisition module, a heating time output module, and a heat preservation time generation module;

[0031] The heat setting data acquisition module is used to obtain the preset temperature and the preset holding time corresponding to the heat setting stage of the capacitor element;

[0032] The heating time output module is used to obtain the heating time required for the temperature of the capacitor element to reach the preset temperature;

[0033] The heat preservation time generation module is configured to generate a first target heat preservation time corresponding to the capacitor element based on the heating time and a first preset time increment when it is determined that the heating time is less than the preset heat preservation time; wherein the first target heat preservation time is less than the preset heat preservation time;

[0034] The heat preservation time generation module is further configured to generate a second target heat preservation time corresponding to the capacitor element based on the heating time and a second preset time increment when it is determined that the heating time is not less than the preset heat preservation time; wherein the first preset time increment is less than the second preset time increment;

[0035] The duration determination operation includes:

[0036] Obtain the temperature of the capacitor element during the heat setting stage;

[0037] When it is determined that the temperature of the capacitor element has not reached the preset temperature, the next time length determination operation is performed.

[0038] Based on the above method embodiments, the present invention provides corresponding terminal device embodiments.

[0039] Another embodiment of the present invention provides a terminal device, including a processor, a memory, and a computer program stored in the memory and configured to be executed by the processor. When the processor executes the computer program, it implements the method for determining the heat setting and heat preservation time of a capacitor element as described in the above-mentioned embodiment of the invention.

[0040] Based on the above method embodiment, the present invention provides a corresponding storage medium embodiment.

[0041] Another embodiment of the present invention provides a storage medium, wherein the computer-readable storage medium includes a stored computer program, wherein when the computer program is running, the device where the computer-readable storage medium is located is controlled to execute the method for determining the heat setting and heat preservation time of a capacitor element described in the above-mentioned embodiment of the invention.

[0042] The following beneficial effects are achieved by implementing the present invention:

[0043] An embodiment of the present invention provides a method, apparatus, terminal device, and storage medium for determining the heat setting insulation time of a capacitor element. The present invention obtains the real-time temperature of the capacitor element during the heat setting stage, and when it is determined that the temperature of the capacitor element has reached a preset temperature, outputs the actual heating time of the element during the heating process, that is, the time required for the capacitor element to reach the preset temperature during the heat setting stage. Furthermore, since the element temperature is monitored in real time, the insulation time that conforms to the actual heating conditions of the element can be obtained based on the actual conditions such as heat conduction and shrinkage of the capacitor element during the heat setting process, thereby adjusting a more reasonable insulation time. When adjusting a more reasonable insulation time, if the heating time is less than the preset insulation time, it means that the capacitor element has reached the preset temperature faster than expected. At this time, using a smaller first preset time increment to adjust the insulation time can avoid unnecessary long insulation times, thereby shortening the entire heat setting process and improving production efficiency. In the case where the heating time is not less than the preset holding time, it means that the capacitor element reaches the preset temperature slowly and may require a longer holding time to ensure the heat setting effect. In this case, a larger second preset time increment is used to ensure that the capacitor element has sufficient holding time to complete the heat setting process. Compared with the prior art, the present invention solves the problem that the holding time setting in traditional technology is too subjective and cannot accurately reflect the actual situation of the capacitor element during the heat setting process by monitoring the temperature of the capacitor element in real time and dynamically adjusting the holding time. By introducing two different time increments, such as the first preset time increment and the second preset time increment, it is possible to avoid the final holding time being too short or too long, thereby ensuring that the internal and external heat of the capacitor element is evenly heated during the heat setting process, achieving a good shrinkage effect, which can not only reduce industrial costs but also improve production efficiency. BRIEF DESCRIPTION OF THE DRAWINGS

[0044] Figure 1 The present invention is a flowchart of a method for determining the heat setting and heat preservation time of a capacitor element provided by one embodiment of the present invention.

[0045] Figure 2 FIG. 1 is a schematic diagram of setting temperature monitoring points of a capacitor element provided by an embodiment of the present invention.

[0046] Figure 3 This is an operational flow chart of a method for monitoring the step-by-step heating time of heat setting of a capacitor element provided by one embodiment of the present invention.

[0047] Figure 4 It is a structural schematic diagram of a device for determining the heat setting and heat preservation time of a capacitor element provided by one embodiment of the present invention. DETAILED DESCRIPTION

[0048] The following will clearly and completely describe the technical solutions in the embodiments of the present invention in conjunction with the accompanying drawings. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. All other embodiments obtained by ordinary technicians in this field based on the embodiments of the present invention without making any creative efforts shall fall within the scope of protection of the present invention.

[0049] like Figure 1 As shown, in order to solve the problem in the prior art that an accurate holding time that conforms to the actual temperature rise of the component cannot be obtained, resulting in a holding time that is too short or too long, an embodiment of the present invention provides a flow chart of a method for determining the heat setting holding time of a capacitor component. The method for determining the heat setting holding time of a capacitor component includes:

[0050] Step S1: obtaining a preset temperature and a preset holding time corresponding to a heat setting stage of a capacitor element;

[0051] Step S2: Obtaining the heating time required for the temperature of the capacitor element to reach the preset temperature;

[0052] Step S3: When it is determined that the heating time is less than the preset heat preservation time, a first target heat preservation time corresponding to the capacitor element is generated according to the heating time and the first preset time increment; wherein the first target heat preservation time is less than the preset heat preservation time;

[0053] When it is determined that the heating time is not less than the preset insulation time, a second target insulation time corresponding to the capacitor element is generated based on the heating time and the second preset time increment; wherein the first preset time increment is less than the second preset time increment.

[0054] In step S1, the present invention can pre-acquire the preset temperature and preset holding time corresponding to the current heat setting stage. It is understood that for different heat setting stages, the present invention can collect the corresponding preset temperature and preset holding time as reference data, thereby comparing the actual temperature of the capacitor element in the heat oven with the preset reference data and obtaining a comparison result.

[0055] Schematically, the heat setting stage is a stage in the capacitor component manufacturing process, which is used to stabilize the physical and chemical properties of the capacitor component and improve its electrical performance. In this process, the capacitor component is placed under specific temperature conditions to cause the expected physical and chemical changes in its internal materials (such as electrolytes, electrodes, etc.). Moreover, the heat setting stage generally includes different sub-stages such as heating, heat preservation and cooling, and each sub-stage has its own specific temperature and time requirements.

[0056] The preset temperature mentioned above refers to the specific temperature that the capacitor element should reach and maintain during the heat setting stage. The preset holding time mentioned above refers to the length of time the capacitor element needs to maintain the preset temperature during the heat setting stage. The length of the holding time will affect the degree of physical and chemical changes in the capacitor element, thereby affecting its ultimate performance and quality.

[0057] In a preferred embodiment, the heat setting stage of the present invention can be two different heat setting stages; the first heat setting stage can be heating from temperature T1 = 35°C to T2 = 85°C, and the insulation time is 6 hours, then the preset temperature of the first heat setting stage is 85°C, and the preset insulation time is 6 hours.

[0058] The second heat setting stage can be heating from temperature T1 = 85°C to T2 = 95°C, and the heat preservation time is 6 hours. Then the preset temperature of the second heat setting stage is 95°C, and the preset heat preservation time is 6 hours.

[0059] Regarding step S2, in a preferred embodiment, the present invention may repeatedly perform the following time determination operation until it is determined that the temperature of the capacitor element reaches the preset temperature, and then calculate the heating time of the capacitor element in the hot oven:

[0060] Obtain the temperature of the capacitor element during the heat setting stage;

[0061] When it is determined that the temperature of the capacitor element has not reached the preset temperature, the next time duration determination operation is performed, that is, the current temperature of the capacitor element in the heat setting stage is continuously acquired.

[0062] Illustratively, embodiments of the present invention can accurately determine the time required for the capacitor element to reach the preset temperature by repeatedly detecting the temperature of the capacitor element during the heat setting phase and determining whether it has reached the preset temperature. Different capacitor elements may have different heat setting requirements and temperature sensitivities. By repeatedly performing the time determination operation, the time required to reach the preset temperature can be determined based on the actual temperature changes of the capacitor element, thereby better adapting to the heat setting requirements of different capacitor elements.

[0063] In a preferred embodiment, obtaining the heating time required for the temperature of the capacitor element to reach the preset temperature includes:

[0064] The temperature of the capacitor components in the heat setting stage in the hot oven is detected in real time by a multi-channel temperature tester;

[0065] When the temperature of the capacitor element in the heat setting stage reaches the preset temperature, the heating time of the capacitor element in the heat oven is calculated.

[0066] In a preferred embodiment, the temperature of any capacitor element in any group of capacitor elements in the heat oven during the heat setting stage can be obtained by a multi-channel temperature tester;

[0067] The capacitor elements of different groups have different diameters and lengths.

[0068] It is understandable that the present invention can place multiple groups of capacitor elements in a hot oven, and the diameters and lengths of capacitor elements in different groups are different, so that the temperature changes of capacitor elements with different diameters and lengths can be monitored.

[0069] Since capacitor elements have different diameters and lengths, they may react differently to the heat setting process. By measuring the temperature of these capacitor elements of different sizes, the present invention can accurately determine their actual reaction to the heat setting process, thereby optimizing the holding time.

[0070] In a preferred embodiment, the multi-channel temperature tester is connected to any capacitor element via a thermocouple;

[0071] The thermocouple comprises: a measuring end and a connecting end;

[0072] Wherein, the measuring end of the thermocouple is fixedly connected to the capacitor element, and the connecting end of the thermocouple is connected to the port of the multi-channel temperature tester.

[0073] It is understood that, before obtaining the temperature of the capacitor element during the heat setting stage, the embodiment of the present invention can pass the insert end of the thermocouple (i.e., the aforementioned connecting end) with the measuring end fixed to the capacitor element out of the hot oven, and then insert the thermocouple insert into the port of the multi-channel temperature tester. Furthermore, the hot oven door is closed, the hot oven heating program is set, and then the hot oven heating is started, and the multi-channel temperature tester is started to collect the temperature and time of the temperature measurement points. In a preferred embodiment, the distance between any two adjacent capacitor elements in the hot oven is not less than 10 mm, so that the gas convection in the hot oven can be achieved, so that each capacitor element is heated more evenly.

[0074] In this embodiment, multiple groups of capacitor elements of different sizes can be set up to test the temperature changes of capacitor elements of different sizes during the heat setting stage, thereby more comprehensively understanding the thermal behavior of capacitor elements of different sizes. Because the size of a capacitor element may affect its thermal conductivity and heat dissipation performance, multiple groups of tests can provide more accurate data on the heat setting characteristics of capacitor elements of different sizes.

[0075] Regarding step S3, in a preferred embodiment, the temperature of the capacitor element in the heat setting stage includes: a temperature corresponding to the first temperature measuring point and a temperature corresponding to the second temperature measuring point;

[0076] When the temperature of the capacitor element reaches the preset temperature in the heat setting stage, calculating the heating time of the capacitor element in the heat oven includes:

[0077] When it is determined that the temperature corresponding to the first temperature measuring point is equal to the preset temperature and the temperature corresponding to the second temperature measuring point is equal to the preset temperature, obtaining a first time required for the first temperature measuring point to reach the preset temperature during the heat setting stage and a second time required for the second temperature measuring point to reach the preset temperature during the heat setting stage;

[0078] When it is determined that the first time period is greater than the second time period, the first time period is output as the heating time period corresponding to the capacitor element;

[0079] When it is determined that the first time duration is not greater than the second time duration, the second time duration is output as the heating time duration corresponding to the capacitor element;

[0080] Among them, the first temperature measurement point is used to characterize the position point inside the capacitor element, and the first temperature measurement point includes: the position point corresponding to the midpoint of the total length of the capacitor element radially toward the core axis; the second temperature measurement point includes: the position point corresponding to the midpoint of the surface of the capacitor element.

[0081] Furthermore, the measuring end of the thermocouple includes: a temperature probe;

[0082] The temperature probe is fixedly connected to the first temperature measuring point of the capacitor element and the second temperature measuring point of the capacitor element through a sealant;

[0083] The radius of the temperature probe is the same as the radius of the first temperature measurement point. The first temperature measurement point is used to represent the hole obtained by drilling a point radially from the midpoint of the capacitor element toward the core axis. The radius of the hole corresponding to the first temperature measurement point is 2 mm.

[0084] It is understandable that the diameter of the drill hole can be determined according to the diameter of the thermocouple probe, so that the radius of the probe is the same as the radius of the first temperature measurement point.

[0085] Indicatively, in the above process, two temperature measuring points are set - one is at the position radially toward the core axis at the midpoint of the length of the capacitor element (such as the first temperature measuring point, that is, the midpoint inside the capacitor element, which is different from the midpoint of the surface), and the other is at the midpoint of the surface of the capacitor element (such as the second temperature measuring point). Since the internal temperature measuring point can reflect the temperature change of the core area of the capacitor element, and the external temperature measuring point can reflect the heat exchange between the surface of the element and the environment, the setting of the internal and external temperature measuring points can provide a more comprehensive understanding of the temperature distribution of the capacitor element during the heat setting stage.

[0086] By comparing the time it takes for the two temperature measurement points to reach the preset temperature (the first duration and the second duration), it is possible to more accurately determine whether the capacitor element has completed the heat setting process. The heat setting process is considered complete only when both temperature measurement points reach the preset temperature and the required time meets the predetermined standard.

[0087] By recording and analyzing the heating time at different temperature measuring points and comparing the heating time at two temperature measuring points, and taking the longest time as the corresponding heating time of the capacitor element, it can be ensured that both the inside and outside of the capacitor element have fully reached the temperature conditions required for heat setting, so as to ensure that the capacitor element obtains sufficient heat during the heat setting process, thereby achieving a sufficient heat setting effect.

[0088] In a preferred embodiment, the present invention can place three groups of capacitor elements of different sizes in a hot oven. The first group of capacitor elements 1 has a diameter of D1 and a length of L1; the second group of capacitor elements 3 has a diameter of D2 and a length of L1; and the third group of capacitor elements 4 has a diameter of D1 and a length of L2.

[0089] Schematically, the diameter of the capacitor element D1>D2, and the length of the capacitor element L1>L2, then it can be determined that the diameter of the first group of capacitor elements is 85mm and the length is 150mm, the diameter of the second group of capacitor elements is 60mm and the length is 150mm, and the diameter of the third group of capacitor elements is 85mm and the length is 75mm.

[0090] like Figure 2 As shown in the schematic diagram of the setting of temperature monitoring points, a first group of capacitor elements 1, a second group of capacitor elements 3, a third group of capacitor elements 4, thermocouples 51-56 and a high temperature resistant sealant 7 are arranged in the hot oven.

[0091] The first set of capacitor elements 1 has a diameter of D1 and a length of L1 and includes a core shaft 2, a hole 1-S1, a point 1-S2, and a gold-sprayed surface 61. Hole 1-S1 is drilled at a point radially toward the core shaft 2 at the midpoint of length L1. Furthermore, point 1-S2 is drilled at a point at the midpoint of length L1 and on the outer surface of the capacitor element.

[0092] The temperature probe of the thermocouple 52 penetrates into the bottom of the hole 1-S1 and is sealed and fixed with the high-temperature resistant sealant 7; the temperature probe of the thermocouple 51 is pasted at the position of the point 1-S2 and is sealed and fixed with the high-temperature resistant sealant 7.

[0093] Furthermore, the second set of capacitor elements 3 has a diameter of D2 and a length of L1, and includes a core shaft 2, a hole 2-S1, a point 2-S2, and a gold-sprayed surface 62. Hole 2-S1 is drilled from a point radially toward the core shaft 2 at the midpoint of the length L1; point 2-S2 is drilled from a point at the midpoint of the length L1 and on the outer surface of the capacitor element.

[0094] The temperature probe of the thermocouple 54 penetrates into the bottom of the hole 2-S1 and is sealed and fixed with the high-temperature resistant sealant 7; the temperature probe of the thermocouple 53 is pasted at the position of the point 2-S2 and is sealed and fixed with the high-temperature resistant sealant 7.

[0095] Furthermore, the third set of capacitor elements 4 has a diameter of D1 and a length of L2, and includes a core shaft 2, a hole 3-S1, a point 3-S2, and a gold-sprayed surface 63. Hole 3-S1 is drilled at a point radially toward the core shaft 2 at the midpoint of the length L2; point 3-S2 is drilled at a point on the outer surface of the capacitor element at the midpoint of the length L2.

[0096] The temperature probe of thermocouple 56 penetrates into the bottom of hole 3-S1 and is sealed and fixed with the high-temperature resistant sealant 7; the temperature probe of thermocouple 55 is pasted at the position of point 3-S2 and is sealed and fixed with the high-temperature resistant sealant 7.

[0097] In a preferred embodiment, the depth of hole 1-S1 is approximately (D1-9) / 2, and the hole diameter is approximately 4 mm; the depth of hole 2-S1 is approximately (D2-9) / 2, and the hole diameter is approximately 4 mm; the depth of hole 3-S1 is approximately (D1-9) / 2, and the hole diameter is approximately 4 mm.

[0098] Specifically, in an embodiment of the present invention, one temperature measuring point can be selected at the midpoint of the length direction of the capacitor element and the outer surface of the capacitor element. The temperature measuring point of the first group of capacitor elements 1 is set to be symmetrical with 1-S1 in the diameter direction and marked as 1-S2; the temperature measuring point of the second group of capacitor elements 3 is set to be symmetrical with 2-S1 in the diameter direction and marked as 2-S2; the temperature measuring point of the third group of capacitor elements 4 is set to be symmetrical with 3-S1 in the diameter direction and marked as 3-S2.

[0099] Insert a temperature probe of a thermocouple 52 into the 1-S1 hole of the first group of capacitor elements 1, insert a temperature probe of a thermocouple 54 into the 2-S1 hole of the second group of capacitor elements 3, and insert a temperature probe of a thermocouple 56 into the 3-S1 hole of the third group of capacitor elements 4; then fix the temperature probes of the thermocouples 52, 54, and 56 with high-temperature resistant sealant 7 and seal them.

[0100] The temperature probes of the three thermocouples 51, 53, and 55 are fixed at the positions corresponding to the 1-S2 point of the first group of capacitor elements 1, the 2-S2 point of the second group of capacitor elements 3, and the 3-S2 point of the third group of capacitor elements 4, respectively, using a high-temperature resistant sealant 7;

[0101] Furthermore, after the temperature measuring points are made and the thermocouples are fixedly connected, the components in the hot oven can be heated and kept warm. Figure 3 The operation flow chart of the method for monitoring the thermal setting step temperature rise time of capacitor elements shown in FIG. 1 includes:

[0102] In the first heat setting stage, the heat oven can be maintained at the starting temperature T1, and then the capacitor elements of the first group, the second group, and the third group are neatly placed on the stainless steel bracket of the heat oven, with the spacing between the capacitor elements being no less than 10 mm, and especially the distance between the gold-sprayed surfaces 61 to 63 being no less than 10 mm, so as to facilitate gas convection in the heat oven and make each capacitor element more evenly heated;

[0103] Pass the insert ends of the six thermocouples fixed to the capacitor elements out of the hot oven, and then insert the inserts of the thermocouples into the ports of the multi-channel temperature tester.

[0104] Close the door of the hot oven, set the heating program of the hot oven, then start the hot oven heating, and start the multi-channel temperature tester to collect the temperature and time of the temperature measurement points;

[0105] After the heat treatment program of the hot oven is completed, the power of the hot oven is turned off, and the temperature and corresponding time data of the multi-channel temperature tester can be calculated and analyzed.

[0106] In a preferred embodiment, the hot oven is a high-temperature blast cycle and has a volume of 8m 3 The number of ports of the multi-channel temperature tester is 6 groups. The hot oven is kept at a starting temperature of 35°C for 0.5 hours.

[0107] Then, the first heat setting stage: temperature 85°C, heating time 0.5 hours, heat preservation time 6 hours. The second heat setting stage: temperature 95°C, heating time 0.5 hours, heat preservation time 6 hours.

[0108] Then start the hot oven to heat up, start the multi-channel temperature tester, and automatically collect the temperatures and times reached by 1-S1, 1-S2, 2-S1, 2-S2, 3-S1, and 3-S2 every 1 minute.

[0109] Based on the collected data from the multi-channel temperature tester, the following data can be obtained:

[0110] Table 1 Data record of the time it takes for the component to reach the set temperature

[0111]

[0112] According to Table 1, the maximum time for the first group of capacitor elements, the second group of capacitor elements, and the third group of capacitor elements to rise from T1 = 35 ° C to T2 = 85 ° C is 4h35min, 3h35min, and 3h10min respectively, which are all less than the set holding time of 6 hours;

[0113] The maximum time for the first, second, and third groups of capacitor elements to heat up from T1 = 85°C to T2 = 95°C is 2 hours and 30 minutes, 1 hour and 30 minutes, and 1 hour and 10 minutes, respectively, all of which are less than the set holding time of 6 hours.

[0114] Furthermore, according to the data in Table 1, the holding time for the heat setting process of the first group of capacitor elements, the second group of capacitor elements, and the third group of capacitor elements from T1 = 35°C to T2 = 85°C, and from T2 = 85°C to T3 = 95°C can be set to the data corresponding to Table 2.

[0115] Table 2 Component heating and holding time setting table

[0116]

[0117]

[0118] The present invention can obtain the holding time values of capacitor elements of different diameters and lengths during the heat setting process, avoiding the situation where the holding time is too short to achieve uniform shrinkage or the holding time is too long to waste power and time, thereby achieving the heat shrinkage effect and reasonably utilizing industrial costs.

[0119] like Figure 4 As shown, based on the above-mentioned embodiments of the method for determining the heat setting and heat preservation time of various capacitor elements, the present invention provides corresponding device embodiments;

[0120] An embodiment of the present invention provides a device for determining heat setting and heat preservation time of a capacitor element, comprising: a heat setting data acquisition module, a heating time output module, and a heat preservation time generation module;

[0121] The heat setting data acquisition module is used to obtain the preset temperature and the preset holding time corresponding to the heat setting stage of the capacitor element;

[0122] The heating time output module is used to obtain the heating time required for the temperature of the capacitor element to reach the preset temperature;

[0123] The heat preservation time generation module is configured to generate a first target heat preservation time corresponding to the capacitor element based on the heating time and a first preset time increment when it is determined that the heating time is less than the preset heat preservation time; wherein the first target heat preservation time is less than the preset heat preservation time;

[0124] The insulation time generation module is also used to generate a second target insulation time corresponding to the capacitor element based on the heating time and the second preset time increment when it is determined that the heating time is not less than the preset insulation time; wherein the first preset time increment is less than the second preset time increment.

[0125] It should be noted that the device embodiments described above are merely illustrative, wherein the modules described as separate components may or may not be physically separated, and the components displayed as modules may or may not be physical modules, and may be located in one place or distributed across multiple network modules. Some or all of the modules may be selected according to actual needs to achieve the purpose of the present embodiment. In addition, in the drawings of the device embodiments provided by the present invention, the connection relationship between the modules indicates that there is a communication connection between them, which may be specifically implemented as one or more communication buses or signal lines. A person of ordinary skill in the art can understand and implement the present invention without paying any creative effort.

[0126] Those skilled in the art can clearly understand that, for the sake of convenience and brevity, the specific working process of the device described above can refer to the corresponding process in the aforementioned method embodiment, and will not be repeated here.

[0127] Based on the above-mentioned embodiments of the method for determining the heat setting and heat preservation time of various capacitor elements, the present invention provides corresponding embodiments of terminal equipment.

[0128] An embodiment of the present invention provides a terminal device, comprising a processor, a memory, and a computer program stored in the memory and configured to be executed by the processor. When the processor executes the computer program, it implements a method for determining the heat setting insulation time of a capacitor element as described in any method embodiment of the present invention.

[0129] The terminal device may be a computing terminal device such as a desktop computer, a notebook computer, a palmtop computer, a cloud server, etc. The terminal device may include, but is not limited to, a processor and a memory.

[0130] The processor may be a central processing unit (CPU), other general-purpose processors, digital signal processors (DSP), application-specific integrated circuits (ASIC), field-programmable gate arrays (FPGA) or other programmable logic devices, discrete gate or transistor logic devices, discrete hardware components, etc. The general-purpose processor may be a microprocessor or any conventional processor, etc. The processor is the control center of the terminal device, connecting various parts of the entire terminal device using various interfaces and lines.

[0131] The memory can be used to store the computer program, and the processor implements various functions of the terminal device by running or executing the computer program stored in the memory and calling the data stored in the memory. The memory can mainly include a program storage area and a data storage area, wherein the program storage area can store an operating system, at least one application required for a function, etc.; the data storage area can store data created based on the use of the mobile phone, etc. In addition, the memory can include a high-speed random access memory and can also include a non-volatile memory, such as a hard disk, internal memory, a plug-in hard disk, a smart memory card (Smart Media Card, SMC), a secure digital (Secure Digital, SD) card, a flash card (Flash Card), at least one disk storage device, a flash memory device or other volatile solid-state storage device.

[0132] Based on the above-mentioned embodiments of the method for determining the heat setting and heat preservation time of various capacitor elements, the present invention provides corresponding embodiments of storage media items.

[0133] An embodiment of the present invention provides a storage medium, which includes a stored computer program, wherein when the computer program is running, the device where the computer-readable storage medium is located is controlled to execute a method for determining the heat setting and heat preservation time of a capacitor element as described in any method embodiment of the present invention.

[0134] The storage medium is a computer-readable storage medium, and the computer program is stored in the computer-readable storage medium. When the computer program is executed by the processor, it can implement the steps of the above-mentioned various method embodiments. The computer program includes computer program code, and the computer program code can be in source code form, object code form, executable file or some intermediate form. The computer-readable medium may include: any entity or device that can carry the computer program code, recording medium, USB flash drive, mobile hard disk, magnetic disk, optical disk, computer memory, read-only memory (ROM, Read-Only Memory), random access memory (RAM, Random Access Memory), electric carrier signal, telecommunication signal and software distribution medium. It should be noted that the content contained in the computer-readable medium can be appropriately increased or decreased according to the requirements of legislation and patent practice in the jurisdiction. For example, in some jurisdictions, according to legislation and patent practice, computer-readable media do not include electric carrier signals and telecommunication signals.

[0135] The above is a preferred embodiment of the present invention. It should be pointed out that for ordinary technicians in this technical field, several improvements and modifications can be made without departing from the principles of the present invention. These improvements and modifications are also considered to be within the scope of protection of the present invention.

Claims

1. A method for determining the heat setting and heat preservation time of a capacitor element, characterized in that: include: Obtaining a preset temperature and a preset holding time corresponding to a heat setting stage of a capacitor element; Obtaining the heating time required for the temperature of the capacitor element to reach the preset temperature; When it is determined that the heating time is less than the preset heat preservation time, a first target heat preservation time corresponding to the capacitor element is generated according to the heating time and the first preset time increment; wherein the first target heat preservation time is less than the preset heat preservation time; When it is determined that the heating time is not less than the preset insulation time, a second target insulation time corresponding to the capacitor element is generated based on the heating time and the second preset time increment; wherein the first preset time increment is less than the second preset time increment.

2. The method for determining the heat setting and heat preservation time of a capacitor element according to claim 1, wherein: The obtaining of the heating time required for the temperature of the capacitor element to reach the preset temperature includes: The temperature of the capacitor components in the heat setting stage in the hot oven is detected in real time by a multi-channel temperature tester; When the temperature of the capacitor element in the heat setting stage reaches the preset temperature, the heating time of the capacitor element in the heat oven is calculated.

3. The method for determining the heat setting and heat preservation time of a capacitor element according to claim 2, wherein: The multi-channel temperature tester is connected to any capacitor element via a thermocouple; The thermocouple comprises: a measuring end and a connecting end; Wherein, the measuring end of the thermocouple is fixedly connected to the capacitor element, and the connecting end of the thermocouple is connected to the port of the multi-channel temperature tester.

4. A method for determining the heat setting and heat preservation time of a capacitor element according to claim 3, characterized in that: The temperature of the capacitor element in the heat setting stage includes: the temperature corresponding to the first temperature measuring point and the temperature corresponding to the second temperature measuring point; When the temperature of the capacitor element reaches the preset temperature in the heat setting stage, calculating the heating time of the capacitor element in the heat oven includes: When it is determined that the temperature corresponding to the first temperature measuring point is equal to the preset temperature and the temperature corresponding to the second temperature measuring point is equal to the preset temperature, obtaining a first time required for the first temperature measuring point to reach the preset temperature during the heat setting stage and a second time required for the second temperature measuring point to reach the preset temperature during the heat setting stage; When it is determined that the first time period is greater than the second time period, the first time period is output as the heating time period corresponding to the capacitor element; When it is determined that the first time duration is not greater than the second time duration, the second time duration is output as the heating time duration corresponding to the capacitor element; Among them, the first temperature measurement point is used to characterize the position point inside the capacitor element, and the first temperature measurement point includes: the position point corresponding to the midpoint of the total length of the capacitor element radially toward the core axis; the second temperature measurement point includes: the position point corresponding to the midpoint of the surface of the capacitor element.

5. The method for determining the heat setting and heat preservation time of a capacitor element according to claim 4, wherein: The measuring end of the thermocouple includes: a temperature probe; The temperature probe is fixedly connected to the first temperature measuring point of the capacitor element and the second temperature measuring point of the capacitor element through a sealant; Wherein, the radius of the temperature probe is the same as the radius of the first temperature measuring point.

6. A method for determining the heat setting and heat preservation time of a capacitor element according to claim 5, characterized in that: The distance between any two adjacent capacitor elements in the thermal oven is not less than 10 mm.

7. The method for determining the heat setting and heat preservation time of a capacitor element according to claim 5, wherein: The first temperature measurement point is used to represent a hole obtained by drilling a hole at a point radially from the midpoint of the capacitor element toward the core axis; The radius of the hole corresponding to the first temperature measuring point is 2 mm.

8. A device for determining the heat setting and heat preservation time of a capacitor element, characterized in that: include: Heat setting data acquisition module, heating time output module and heat preservation time generation module; The heat setting data acquisition module is used to obtain the preset temperature and the preset holding time corresponding to the heat setting stage of the capacitor element; The heating time output module is used to obtain the heating time required for the temperature of the capacitor element to reach the preset temperature; The heat preservation time generation module is configured to generate a first target heat preservation time corresponding to the capacitor element based on the heating time and a first preset time increment when it is determined that the heating time is less than the preset heat preservation time; wherein the first target heat preservation time is less than the preset heat preservation time; The insulation time generation module is also used to generate a second target insulation time corresponding to the capacitor element based on the heating time and the second preset time increment when it is determined that the heating time is not less than the preset insulation time; wherein the first preset time increment is less than the second preset time increment.

9. A terminal device, characterized in that: The method comprises a processor, a memory, and a computer program stored in the memory and configured to be executed by the processor, wherein when the processor executes the computer program, the method for determining the heat setting holding time of a capacitor element according to any one of claims 1 to 7 is implemented.

10. A storage medium, characterized in that: The storage medium includes a stored computer program, wherein when the computer program is running, the device where the storage medium is located is controlled to execute the method for determining the heat setting and heat preservation time of a capacitor element according to any one of claims 1 to 7.

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