High-performance processor chip packaging device and packaging method thereof

Abstract

The invention discloses a high-performance processor chip packaging device and a packaging method thereof, and relates to the technical field of semiconductor production, the high-performance processor chip packaging device comprises a flowing pipeline which is arranged in a fixture and extends towards a chip, one end of the flowing pipeline is provided with a connector, and the connector is installed on the outer side of the fixture and is communicated with a conveying system; the pressure unit comprises a plurality of pressing plates used for extruding the plastic packaging liquid, a synchronous frame is arranged at the bottoms of the pressing plates, and the synchronous frame is located in the fixture and can move up and down; and the plastic package cavity is formed in the fixture, the plastic package cavity is communicated with the flowing pipeline, a traction piece controlled by a telescopic rod is arranged on one side of the plastic package cavity, and the flowing direction of the plastic package liquid is changed through traction of the traction piece after the plastic package liquid enters the plastic package cavity. By changing the flowing state of the plastic packaging liquid, the impact force on the lead in the flowing process of the plastic packaging liquid is reduced, so that the lead is protected, and the lead is prevented from being broken due to the fact that the impact force on the lead in the flowing process of the plastic packaging liquid is too large.

Description

Technical Field

[0001] The present invention relates to the technical field of semiconductor production, and in particular to a high-performance processor chip packaging device and a packaging method thereof. Background Art

[0002] The package can provide stable protection for the chip. For example:

[0003] Physical protection: prevent the chip from mechanical damage, moisture, dust or chemical corrosion.

[0004] Electrical connection: Signal transmission between chip and package substrate is achieved through wire bonding or flip chip technology.

[0005] Thermal management: Dissipate the heat generated by the chip through heat dissipation materials and packaging structures.

[0006] Mechanical support: Provides a stable mounting platform (2) for the chip to facilitate integration into the circuit board.

[0007] Publication No. CN117116780B discloses an injection molding packaging structure for semiconductor modules, relating to the field of semiconductor injection molding packaging technology. The structure comprises an upper mold frame and a lower mold frame, each of which is provided with a first cavity and a second cavity that cooperate with each other. In this application, a dual-axis motor drives a first rotating shaft to rotate, which in turn causes a first half gear to drive a cutting blade downward, causing the cutting blade to cut between the lead pins and the lead frame. Once the cutting is completed, the first rotating shaft continues to drive the first half gear to rotate, at which point the teeth on the surface of the first half gear disengage from the first tooth plate, while the second half gear engages with the transmission gear. The transmission gear then engages the second tooth plate to drive the bending frame downward, causing the bottom of the bending frame to bend multiple groups of lead pins. This effectively avoids the problem in the prior art where additional process equipment is required to cut and bend the injection-molded semiconductor module after demolding.

[0008] After the semiconductor chip wire bonding is completed and soldered, the chip and substrate are encapsulated and molded with epoxy resin to form the final appearance. During the packaging process, there will be a tendency for underfilling. Because the epoxy resin gelation time is too short or the mold temperature is too high, the epoxy resin fluidity decreases, the reaction is accelerated, and the viscosity increases sharply, making it difficult to complete the filling before solidification. Increasing the melt viscosity of the epoxy resin will lead to excessive flow speed and increased impact force. The flow impact force of the epoxy resin will cause the bonding wire to deviate or break, and there will be gaps between the leads and the substrate, and bubbles are prone to appear at the leads. Summary of the Invention

[0009] One of the purposes of the present invention is to provide a high-performance processor chip packaging device and a packaging method thereof, which reduces the impact of epoxy resin on the leads during the packaging process by adjusting the flow state of epoxy resin, avoids packaging problems that are prone to occur at the leads, and improves the yield rate.

[0010] To achieve the above objectives, the present invention is implemented through the following technical solutions: A high-performance processor chip packaging device includes a frame that can move up and down, a platform is set at the bottom of the frame, and the platform and the frame are parallel to the ground;

[0011] The chip packaging device further includes:

[0012] A flow line is provided inside the jig and extends toward the chip. One end of the flow line is provided with a connector, which is mounted outside the jig and connected to a conveying system. The heated plastic film is disposed in and driven by the conveying system.

[0013] The pressure unit is arranged on the upper part of the mold frame. The pressure unit includes multiple pressure plates for squeezing the plastic sealing liquid. One end of the pressure plate is swingable, and an electromagnetic matrix is set on the inner side of the pressure plate to control the swing angle of the pressure plate. The bottom of the pressure plate is provided with a synchronization frame. The synchronization frame is located inside the mold frame and can move up and down.

[0014] The plastic sealing cavity is opened inside the mold frame and is connected to the flow pipeline. A traction piece controlled by a telescopic rod is set on one side of the plastic sealing cavity. When the plastic sealing liquid enters the plastic sealing cavity, it is pulled by the traction piece to change the flow direction.

[0015] In one or more embodiments of the present invention, the synchronization frame includes:

[0016] A positioning rod is provided in the middle of the jig, a bottom plate is provided at the bottom of the positioning rod, the bottom plate is fixed to the bottom plate, a collar is provided on the outside of the positioning rod, the positioning rod extends into the inside of the collar and can slide inside the collar, and a clamping plate is fixed on the outside of the collar;

[0017] A top plate is provided on the upper portion of the card plate, and an insertion rod is provided at the bottom of the top plate. The insertion rod extends into the interior of the collar and can slide relative to the collar;

[0018] The first elastic body and the second elastic body, the first elastic body is arranged between the top plate and the frame, the second elastic body is arranged between the clamping plate and the bottom plate, and the elastic force of the first elastic body is smaller than the elastic force of the second elastic body.

[0019] In one or more embodiments of the present invention, the pressure unit comprises:

[0020] A positioning frame, the pressure plate is installed inside the positioning frame, one end of the pressure plate is connected to the positioning frame through a rotating shaft and can swing relative to the positioning frame, and the electromagnetic matrix is installed inside the positioning frame;

[0021] A driving member is installed on the upper part of the positioning frame, and the driving end of the driving member is connected to the positioning frame and drives the positioning frame to move up and down;

[0022] The splint is arranged on the upper and lower sides of the inner side of the positioning frame. A pulling piece is arranged on the top of the splint. The two ends of the pulling piece are respectively connected to the positioning frame and the splint. The pressure plate supports the splint.

[0023] In one or more embodiments of the present invention, the splint is flexible and arc-shaped under the support of the pressure plate. A heating unit is provided on one side of the splint to heat the epoxy resin through the splint.

[0024] The epoxy resin is located between the clamping plate and the top plate. The upper wall of the top plate is arranged in an arc shape. The pressure plate supports the clamping plate to fit the upper wall of the top plate.

[0025] In one or more embodiments of the present invention, the traction member includes:

[0026] A slide plate is slidably mounted inside the mold frame. A detection head is provided on one end of the slide plate facing the chip to detect the flow position of the plastic sealing liquid on the upper part of the chip.

[0027] A turntable is installed at the bottom of the skateboard, and a traction rod is set at the bottom of the turntable. The traction rod is retractable, and the turntable drives the traction rod to rotate;

[0028] The telescopic part is installed inside the frame, and controls the sliding and telescopic movement of the slide plate.

[0029] In one or more embodiments of the present invention, the traction member further comprises:

[0030] The scraper is installed inside the jig. The scraper is provided with a plurality of slots on the inside. The size of the slots matches the traction rod. When the traction member swings to the inside of the slots, the epoxy resin attached to the surface of the traction member is separated from the traction member.

[0031] The rotating assembly is installed on one side of the skateboard and drives the skateboard to rotate circumferentially. The rotating assembly and the telescopic member can synchronously control the skateboard.

[0032] In one or more embodiments of the present invention, an electromagnet is provided inside the traction rod, and the electromagnet changes the magnetic force to adjust the extension length of the traction rod;

[0033] Electromagnetic blocks are installed inside the turntable and on the outer wall of the traction rod. The change of magnetic force of the electromagnetic blocks changes the distance between the traction rod and the center line of the turntable shaft.

[0034] The slide plate is set to a polygon, and the rotation of the slide plate changes the traction rod of the corresponding chip.

[0035] In one or more embodiments of the present invention, a partition is provided inside the frame, the partition is L-shaped, and the partition is used to separate the flow pipeline, and a spring is provided inside the partition, the spring is Z-shaped and used to support the partition;

[0036] The pressure head is arranged inside the pressure unit, contacts the spring and squeezes the spring. The pressure head is retractable and a compression spring is arranged inside the pressure head to support the pressure head.

[0037] In one or more embodiments of the present invention, a positioning frame is provided on the upper portion of the frame, the positioning frame is installed on the outside of the connector and is connected to the positioning frame, and the epoxy resin is melted inside the positioning frame and then squeezed into the flow pipeline.

[0038] The present application also provides a chip packaging method, which is used for the above-mentioned chip packaging device, comprising the following steps:

[0039] Place the chip to be packaged on the platform so that the position of the chip and the frame are aligned;

[0040] The pressure unit moves downward, changing the height of the pressure plate to squeeze the plastic sealing liquid into the flow pipe;

[0041] The traction member changes its position to adjust the flow state of the plastic sealing liquid;

[0042] The pressure unit continuously moves downward to control the synchronous frame to move downward, thereby shaping the plastic sealing liquid.

[0043] Through the above technical solution, the present invention has the following beneficial effects:

[0044] 1. This application reduces the impact force of the plastic sealing liquid on the lead during the flow process by changing the flow state of the plastic sealing liquid, thereby protecting the lead and preventing the lead from being broken due to excessive impact force during the flow of the plastic sealing liquid, thereby protecting the lead and avoiding the impact caused by the plastic sealing liquid.

[0045] 2. During the chip packaging process, changing the flow state of the plastic sealing liquid can guide the plastic sealing liquid to flow, and the plastic sealing liquid can move to the desired direction, thereby ensuring the good movement state of the plastic sealing liquid and avoiding the impact of the plastic sealing liquid on the chip during the flow.

[0046] 3. Through the retractable slide, the position of the slide can be controlled during the packaging process. When the slide is in the sliding and retracted state, it will not affect the packaging. When the slide moves into the injection cavity, the plastic sealing liquid can be controlled by the pulling rod.

[0047] 4. By using the setting of the telescopic part and the rotating component, the state of the slide can be changed, so that the position of the traction rod can be adjusted. The traction rod is used to control the flow of the plastic sealing liquid and move the traction rod to different positions.

[0048] Other features and advantages of the present invention will be described in the following description, and part of them will become obvious from the description, or will be understood by practicing the present invention. The purpose and other advantages of the present invention can be realized and obtained by the structures particularly pointed out in the written description and the accompanying drawings. BRIEF DESCRIPTION OF THE DRAWINGS

[0049] Figure 1 A perspective view of the present invention;

[0050] Figure 2 It is a partial schematic diagram of the present invention;

[0051] Figure 3 Schematic diagram of the platform of the present invention;

[0052] Figure 4 It is a schematic diagram of the jig of the present invention;

[0053] Figure 5 A cross-sectional view of a jig of the present invention;

[0054] Figure 6 is a schematic diagram of a pressure unit of the present invention;

[0055] Figure 7 An exploded diagram of the pressure unit of the present invention;

[0056] Figure 8 A bottom view of the pressure unit of the present invention;

[0057] Figure 9 It is a schematic diagram of a partial jig of the present invention;

[0058] Figure 10 Schematic diagram of the internal structure of the jig of the present invention;

[0059] Figure 11 Schematic diagram of the synchronous frame of the present invention Figure 1 ;

[0060] Figure 12 Schematic diagram of the synchronous frame of the present invention Figure 2 ;

[0061] Figure 13 An exploded view of the synchronization frame of the present invention;

[0062] Figure 14 Schematic diagram of the base plate of the present invention;

[0063] Figure 15 A bottom view of the jig of the present invention;

[0064] Figure 16 It is a schematic diagram of a traction member of the present invention;

[0065] Figure 17 A schematic diagram of a skateboard of the present invention;

[0066] Figure 18 The turntable of the present invention is shown in FIG. Figure 1 ;

[0067] Figure 19 The turntable of the present invention is shown in FIG. Figure 2 .

[0068] In the figure: 1 mold frame, 2 platform, 3 flow pipeline, 4 connector, 5 pressure unit, 6 synchronization frame, 7 plastic sealing chamber, 8 traction piece;

[0069] 61 positioning rod, 62 bottom plate, 63 collar, 64 clamping plate, 65 top plate, 66 insertion rod, 67 first elastic body, 68 second elastic body;

[0070] 51 positioning frame, 52 pressing plate, 53 electromagnetic matrix, 54 driving member, 55 clamping plate, 56 pulling member, 57 heating unit;

[0071] 81 slide plate, 82 detection head, 83 turntable, 84 traction rod, 85 telescopic member, 86 scraper, 87 slot, 88 rotating assembly, 89 electromagnet, 810 electromagnetic block;

[0072] 11 diaphragm, 12 spring piece, 13 pressure head, 14 compression spring. DETAILED DESCRIPTION

[0073] The following drawings illustrate various embodiments of the present invention. For clarity, many practical details are included in the following description. However, it should be understood that these practical details are not intended to limit the present invention. In other words, in some embodiments of the present invention, these practical details are optional. Furthermore, features from different embodiments may be interchangeably applicable, where practically possible.

[0074] Unless otherwise defined, all words used herein (including technical and scientific terms) have their ordinary meanings as understood by those skilled in the art. Furthermore, the definitions of the above-mentioned words in commonly used dictionaries should be interpreted in the context of this specification as having the same meanings as those in the relevant field of the present invention. Unless otherwise explicitly defined, these words should not be interpreted as having idealized or overly formal meanings.

[0075] The following explains the relationships and terms used in this application:

[0076] Parallel: The parallel defined in this application is not limited to absolute parallelism. This definition of parallelism can be understood as basic parallelism, allowing for situations where the two sides are not absolutely parallel due to factors such as assembly tolerance, design tolerance, and the influence of structural flatness. Small angle errors are allowed. For example, within an assembly error range of 10 degrees, it can be understood as a parallel relationship.

[0077] Vertical: The vertical defined in this application is not limited to an absolute vertical intersection relationship (angle of 90 degrees). It allows for non-absolute vertical intersection relationships caused by factors such as assembly tolerance, design tolerance, and structural flatness. It allows for errors in a small angle range. For example, the assembly error range of 80 to 100 degrees can be understood as a vertical relationship.

[0078] Floor: The floor defined in this application is not limited to a specific material or location. It only needs to be a platform for supporting the application, and it can be stacked, tilted, and have varying flatness. For example, cement floors, tile floors, work platforms, etc. can all be interpreted as floors.

[0079] The above explanation does not fully include the relationship definitions given in this application, but only represents part of it.

[0080] The present invention provides a high-performance processor chip packaging device, which can be connected to a heating device to change the flow device and flow position of epoxy resin during the packaging process, reduce packaging problems at the lead, and improve the yield rate.

[0081] See Figure 1-4 As shown, in one embodiment, the chip packaging device includes a frame 1 that can move up and down, and a platform 2 is provided at the bottom of the frame 1, and the platform 2 and the frame 1 are parallel to the ground; wherein, the chip to be packaged is placed on the platform 2, and the frame 1 moves up and down to fit the platform 2. In this state, the chip to be packaged is located inside the frame 1;

[0082] Optionally, the platform 2 is provided with a plurality of recesses for placing chips, and when welding, the chips are placed inside the recesses to position the chips.

[0083] Alternatively, a conveying unit is configured at the position of the platform 2 corresponding to the position of the jig 1 , and the conveying unit drives the chip and changes the position of the chip to realize automatic conveying.

[0084] The chip packaging device further includes:

[0085] A flow line 3 is provided inside the mold frame 1 and extends toward the chip. One end of the flow line 3 is provided with a connector 4, which is mounted outside the mold frame 1 and connected to a conveying system. The heated plastic film is disposed in and driven by the conveying system.

[0086] The pressure unit 5 is provided on the upper portion of the mold frame 1 and includes a plurality of pressure plates 52 for squeezing the plastic encapsulation liquid. One end of the pressure plate 52 is swingable, and an electromagnetic matrix 53 is provided inside the pressure plate 52 to control the swing angle of the pressure plate 52. A synchronization frame 6 is provided at the bottom of the pressure plate 52. The synchronization frame 6 is located inside the mold frame 1 and can move up and down.

[0087] The plastic sealing cavity 7 is opened inside the mold frame 1 and is connected to the flow pipeline 3. A traction member 8 controlled by a telescopic rod is set on one side of the plastic sealing cavity 7. When the plastic sealing liquid enters the plastic sealing cavity 7, it is pulled by the traction member 8 to change the flow direction.

[0088] In one feasible method, by changing the flow state of the plastic sealing liquid, the plastic sealing liquid enters the plastic sealing cavity 7 from the side of the plastic sealing cavity 7. During the flow of the plastic liquid, the flow position of the plastic liquid is changed by the traction member 8, and the coverage state of the plastic liquid is further ensured according to the flow position of the plastic liquid.

[0089] Among them, the multiple pressure plates 52 set in the pressure unit 5 can be individually controlled by the corresponding electromagnetic matrix 53, and the pressure applied by each pressure plate 52 is different. The flow speed of the plastic liquid at different positions is controlled according to the pressure. The corresponding flow speed of the plastic liquid is coordinated with the traction member 8 to ensure the coverage stability of the plastic liquid.

[0090] The function of the traction member 8 is to divert the plastic liquid. By guiding the flow of liquid epoxy resin through the traction member 8, its impact force can be effectively reduced. By controlling the flow path and speed of the epoxy resin, it can enter the predetermined position more smoothly, thereby reducing impact and stress, achieving the purpose of protecting the lead and avoiding lead breakage.

[0091] See Figure 10-14 In one embodiment, the synchronization frame 6 includes:

[0092] A positioning rod 61 is provided in the middle of the frame 1. A bottom plate 62 is provided at the bottom of the positioning rod 61. The bottom plate 62 is fixed to the bottom plate 62. A collar 63 is provided on the outside of the positioning rod 61. The positioning rod 61 extends into the inside of the collar 63 and can slide inside the collar 63. A clamping plate 64 is fixed on the outside of the collar 63.

[0093] A top plate 65 is provided on the upper portion of the clamping plate 64. A plug rod 66 is provided at the bottom of the top plate 65. The plug rod 66 extends into the interior of the collar 63 and is capable of sliding relative to the collar 63.

[0094] The first elastic body 67 and the second elastic body 68 , the first elastic body 67 is arranged between the top plate 65 and the frame 1 , the second elastic body 68 is arranged between the clamping plate 64 and the bottom plate 62 , and the elastic force of the first elastic body 67 is smaller than the elastic force of the second elastic body 68 .

[0095] In one feasible method, a top plate 65 and a bottom plate 62 are respectively provided at the upper and lower parts of the card plate 64, and the distance between the top plate 65 and the bottom plate 62 can be adjusted. By utilizing the arrangement of the first elastic body 67 and the second elastic body 68, when squeezed by the pressure unit 5, since the elastic force of the first elastic body 67 is smaller than that of the second elastic body 68, the top plate 65 will be squeezed first. The combination of the top plate 65 and the pressure plate 52 can squeeze the plastic sealing liquid. At this time, the action of the pressure unit 5 will not affect the second elastic body 68.

[0096] The pressure unit 5 continuously applies pressure to the synchronization frame 6 to drive the base plate 62 to move.

[0097] Optionally, the first elastic body 67 and the second elastic body 68 are both configured as support springs, and the support springs are used to support the top plate 65 and the bottom plate 62 .

[0098] Alternatively, the first elastic body 67 and the second elastic body 68 are elastic rubber, and the positions of the top plate 65 and the bottom plate 62 are changed by squeezing the elastic rubber.

[0099] In another embodiment, the first elastic body 67 and the second elastic body 68 are configured as support components filled with gas, and two ends of the support components are respectively connected to the clamping plate 64 and the top plate 65 / bottom plate 62.

[0100] See Figure 5-9 In one embodiment, the pressure unit 5 comprises:

[0101] A positioning frame 51, the pressure plate 52 is installed inside the positioning frame 51, one end of the pressure plate 52 is connected to the positioning frame 51 via a rotating shaft and can swing relative to the positioning frame 51, and the electromagnetic matrix 53 is installed inside the positioning frame 51;

[0102] A driving member 54 is mounted on the upper portion of the positioning frame 51. The driving end of the driving member 54 is connected to the positioning frame 51 and drives the positioning frame 51 to move up and down.

[0103] The splint 55 is arranged on the inner side of the positioning frame 51 up and down. A pulling member 56 is set on the top of the splint 55. The two ends of the pulling member 56 are respectively connected to the positioning frame 51 and the splint 55. The pressure plate 52 supports the splint 55.

[0104] In one practicable manner, the clamping plate 55 is perpendicular to the epoxy resin and can extrude the epoxy resin, so that the epoxy resin enters the interior of the flow conduit 3 by means of the extrusion of the epoxy resin.

[0105] Exemplarily, the driving member 54 is an electric telescopic rod, which controls the height change of the positioning frame 51 by telescoping to extrude the epoxy resin.

[0106] Alternatively, the driving member 54 is a driving motor, which drives the screw to rotate to change the height of the positioning frame 51.

[0107] The setting of the pulling member 56 can limit the position of the splint 55, so that the pressing plate 52 controls the splint 55 to change the position of the splint 55. After the splint 55 changes, the epoxy resin is squeezed.

[0108] See Figure 7-8 In one embodiment, the clamping plate 55 is flexible and has an arc shape under the support of the pressing plate 52. A heating unit 57 is provided on one side of the clamping plate 55. The heating unit 57 heats the epoxy resin through the clamping plate 55.

[0109] The epoxy resin is located between the clamping plate 55 and the top plate 65 . The upper wall of the top plate 65 is arc-shaped. The pressing plate 52 supports the clamping plate 55 to fit the upper wall of the top plate 65 .

[0110] In one feasible method, the arc-shaped setting of the upper wall of the top plate 65 is utilized, and the splint 55 is fitted to the top plate 65, so that the splint 55 can be made arc-shaped. Under the support of the pressure plate 52, the splint 55 moves downward, and the bottom wall of the splint 55 is a plane. The inner side of the splint 55 will first fit the top plate 65. The pressure plate 52 continues to squeeze the splint 55, causing the splint 55 to bend, thereby changing the fitting area between the splint 55 and the top plate 65.

[0111] The gradual fitting of the clamping plate 55 and the top plate 65 can more stably squeeze the epoxy resin, allowing the epoxy resin liquid to enter the flow pipeline 3 .

[0112] See Figure 16-19 In one embodiment, the traction member 8 includes:

[0113] The slide 81 is slidably mounted inside the mold frame 1. A detection head 82 is provided at one end of the slide 81 facing the chip. The detection head 82 detects the flow position of the plastic encapsulation liquid on the upper part of the chip.

[0114] A turntable 83 is installed at the bottom of the slide 81, and a traction rod 84 is set at the bottom of the turntable 83. The traction rod 84 is retractable, and the turntable 83 drives the traction rod 84 to rotate;

[0115] The telescopic member 85 is installed inside the frame 1, and controls the sliding and telescopic movement of the slide plate 81.

[0116] In one feasible method, the traction member 8 is set to a retractable state. When in use, the position of the traction member 8 can be controlled to prevent the slide plate 81 from interfering with the chip package. When it is necessary to pull the molding liquid, the flow position of the molding liquid is changed and the impact force of the molding liquid on the lead is reduced. Due to the setting of the retractable traction rod 84, the traction rod 84 can be controlled according to the position of the molding liquid.

[0117] The position of turntable 83 can be used to change the position of traction rod 84. The rotation of turntable 83 drives the change of traction rod 84, which is used to drive the flow of the molding liquid. The surface tension of the epoxy resin affects the flow and distribution of the epoxy resin. The higher the surface tension, the greater the resistance to the flow of the epoxy resin on the substrate and chip surface. This may prevent the epoxy resin from evenly covering the surface, thus affecting the final curing effect. When the molding liquid is pulled by traction rod 84, the surface tension of the molding liquid is destroyed, reducing the impact force of the molding liquid.

[0118] See Figure 16-19 In one embodiment, the traction member 8 further comprises:

[0119] The scraper 86 is installed inside the frame 1. A plurality of slots 87 are arranged inside the scraper 86. The size of the slots 87 is adapted to the traction rod 84. When the traction member 8 swings to the inside of the slots 87, the epoxy resin attached to the surface of the traction member 8 is separated from the traction member 8.

[0120] The rotating assembly 88 is installed on one side of the slide 81 and drives the slide 81 to rotate circumferentially. The rotating assembly 88 and the telescopic member 85 can synchronously control the slide 81.

[0121] In one feasible method, the traction rod 84 is used to control the change in the tension state of the plastic sealing liquid. The setting of the telescopic rod and the rotating assembly 88 changes the position state of the slide 81, so that the traction rod 84 enters the slot 87. During the continuous rotation of the slide 81, the epoxy resin on the surface of the traction rod 84 will separate from the traction rod 84, thereby preventing the epoxy resin from accumulating on the surface of the traction rod 84.

[0122] See Figure 18-19 In one embodiment, an electromagnet 89 is provided inside the traction rod 84, and the electromagnet 89 changes the magnetic force to adjust the telescopic length of the traction rod 84;

[0123] An electromagnetic block 810 is provided inside the turntable 83. The electromagnetic block 810 is installed inside the turntable 83 and on the outer wall of the traction rod 84. The change in the magnetic force of the electromagnetic block 810 changes the distance between the traction rod 84 and the center line of the rotating shaft of the turntable 83.

[0124] The slide plate 81 is configured as a polygon, and the slide plate 81 rotates to change the traction rod 84 of the corresponding chip.

[0125] In one feasible method, the position of the traction rod 84 can be controlled by setting the electromagnet 89 and the electromagnetic block 810, and the traction state of the traction rod 84 can be changed, that is, by adjusting the traction rod 84 to different positions, the traction member 8 can drive the plastic packaging liquid to flow to different positions.

[0126] By utilizing the staggered arrangement of multiple traction rods 84, the molding liquid can be pulled to different positions, and the molding liquid can flow to a larger range. By increasing the flow range of the molding liquid, the impact force of the molding liquid is reduced, and the leads are protected.

[0127] See Figure 15-16 In one embodiment, a partition 11 is provided inside the frame 1. The partition 11 is L-shaped and is used to separate the flow pipe 3. A spring piece 12 is provided inside the partition 11. The spring piece 12 is Z-shaped and is used to support the partition 11.

[0128] The pressure head 13 is arranged inside the pressure unit 5 , and contacts the spring 12 and presses the spring 12 . The pressure head 13 is retractable, and a compression spring 14 is arranged inside the pressure head 13 to support the pressure head 13 .

[0129] In one practicable manner, the partition 11 can be provided to isolate the plastic liquid, thereby cutting off the connection between the heat-plastic film and the plastic liquid during packaging, so that the plastic film inside the plastic cavity 7 can solidify.

[0130] The setting of the pressure head 13 can control the spring 12. When the spring 12 is compressed, the partition 11 isolates the plastic sealing liquid. When the spring 12 is not squeezed, the spring 12 supports the partition 11.

[0131] In one embodiment, a positioning frame is provided on the upper portion of the jig 1 , the positioning frame is installed outside the connector 4 and is connected to the positioning frame, and the epoxy resin is melted inside the positioning frame and then squeezed into the flow conduit 3 .

[0132] In one practicable manner, the epoxy resin is squeezed from the position of the positioning frame and then melted, and the molding liquid is squeezed from the inside of the positioning frame into the inside of the flow pipe 3 .

[0133] The present application also provides a chip packaging method, which is used for the above-mentioned chip packaging device, comprising the following steps:

[0134] Place the chip to be packaged on platform 2 so that the chip is aligned with the position of the frame 1;

[0135] The pressure unit 5 moves downward, changing the height of the pressure plate 52 and squeezing the plastic sealing liquid into the flow pipe 3;

[0136] The traction member 8 changes its position to adjust the flow state of the plastic sealing liquid;

[0137] The pressure unit 5 continuously moves downward to control the synchronous frame 6 to move downward, thereby shaping the plastic sealing liquid.

[0138] Although the present invention is disclosed in conjunction with the above embodiments, it is not intended to limit the present invention. Anyone familiar with this technology can make various changes and modifications without departing from the spirit and scope of the present invention. Therefore, the scope of protection of the present invention should be based on the definition of the attached claims.

Claims

1. A high-performance processor chip packaging device, comprising a frame (1) that can move up and down, a platform (2) provided at the bottom of the frame (1), and the platform (2) and the frame (1) being parallel to the ground; It is characterized in that The chip packaging device further includes: A flow pipe (3) is provided inside the mold frame (1) and extends toward the chip. A connector (4) is provided at one end of the flow pipe (3). The connector (4) is installed outside the mold frame (1) and is connected to a transmission system. The heated plastic film is arranged in the transmission system and is driven by the transmission system. A pressure unit (5) is arranged on the upper part of the mold frame (1), and the pressure unit (5) includes a plurality of pressure plates (52) for squeezing the plastic sealing liquid. One end of the pressure plate (52) is swingably arranged, and an electromagnetic matrix (53) is arranged inside the pressure plate (52) to control the swing angle of the pressure plate (52). A synchronous frame (6) is arranged at the bottom of the pressure plate (52), and the synchronous frame (6) is located inside the mold frame (1) and can move up and down. A plastic sealing cavity (7) is provided inside the mold frame (1), the plastic sealing cavity (7) is communicated with the flow pipeline (3), a traction member (8) controlled by a telescopic rod is provided on one side of the plastic sealing cavity (7), and the plastic sealing liquid enters the plastic sealing cavity (7) and is pulled by the traction member (8) to change the flow direction.

2. The high-performance processor chip packaging device according to claim 1, characterized in that: The synchronous frame (6) comprises: A positioning rod (61) is arranged in the middle of the frame (1); a bottom plate (62) is arranged at the bottom of the positioning rod (61); the bottom plate (62) is fixed to the bottom plate (62); a collar (63) is arranged on the outside of the positioning rod (61); the positioning rod (61) extends into the inside of the collar (63) and can slide inside the collar (63); a clamping plate (64) is fixed on the outside of the collar (63); A top plate (65) is provided on the upper portion of the card plate (64), and an insertion rod (66) is provided at the bottom of the top plate (65). The insertion rod (66) extends into the interior of the collar (63) and is capable of sliding relative to the collar (63); A first elastic body (67) and a second elastic body (68), wherein the first elastic body (67) is arranged between the top plate (65) and the mold frame (1), and the second elastic body (68) is arranged between the clamping plate (64) and the bottom plate (62), and the elastic force of the first elastic body (67) is smaller than the elastic force of the second elastic body (68).

3. The high-performance processor chip packaging device according to claim 2, characterized in that: The pressure unit (5) comprises: A positioning frame (51), the pressing plate (52) is installed inside the positioning frame (51), one end of the pressing plate (52) is connected to the positioning frame (51) via a rotating shaft and can swing relative to the positioning frame (51), and the electromagnetic matrix (53) is installed inside the positioning frame (51); A driving member (54) is installed on the upper portion of the positioning frame (51), wherein the driving end of the driving member (54) is connected to the positioning frame (51) and drives the positioning frame (51) to move up and down; The clamping plate (55) is arranged on the inner side of the positioning frame (51) at the top and bottom. A pulling piece (56) is arranged on the top of the clamping plate (55). The two ends of the pulling piece (56) are respectively connected to the positioning frame (51) and the clamping plate (55). The pressing plate (52) supports the clamping plate (55).

4. The high-performance processor chip packaging device according to claim 3, characterized in that: The clamping plate (55) is flexibly arranged, and the clamping plate (55) is in an arc shape under the support of the pressing plate (52). A heating unit (57) is arranged on one side of the clamping plate (55), and the heating unit (57) heats the epoxy resin through the clamping plate (55); The epoxy resin is located between the clamping plate (55) and the top plate (65), the upper wall of the top plate (65) is arranged in an arc shape, and the pressing plate (52) supports the clamping plate (55) to fit the upper wall of the top plate (65).

5. The high-performance processor chip packaging device according to claim 4, characterized in that: The traction member (8) comprises: A slide plate (81) is slidably mounted inside the mold frame (1). A detection head (82) is provided at one end of the slide plate (81) facing the chip, and the detection head (82) obtains the flow position of the plastic sealing liquid on the upper part of the chip; A turntable (83) is installed at the bottom of the slide (81), and a traction rod (84) is arranged at the bottom of the turntable (83). The traction rod (84) is retractable, and the turntable (83) drives the traction rod (84) to rotate; The telescopic member (85) is installed inside the mold frame (1), and the telescopic member (85) controls the sliding and telescopic movement of the slide plate (81).

6. The high-performance processor chip packaging device according to claim 5, characterized in that: The traction member (8) further comprises: A scraper (86) is installed inside the mold frame (1). A plurality of slots (87) are arranged inside the scraper (86). The size of the slots (87) is adapted to the traction rod (84). When the traction member (8) swings to the inside of the slots (87), the epoxy resin attached to the surface of the traction member (8) is separated from the traction member (8); The rotating assembly (88) is installed on one side of the slide plate (81) and drives the slide plate (81) to rotate in a circumferential direction. The rotating assembly (88) and the telescopic member (85) can synchronously control the slide plate (81).

7. The high-performance processor chip packaging device according to claim 6, characterized in that: An electromagnet (89) is provided inside the traction rod (84), and the electromagnet (89) changes the magnetic force to adjust the telescopic length of the traction rod (84); An electromagnetic block (810) is provided inside the turntable (83), and the electromagnetic block (810) is respectively installed inside the turntable (83) and on the outer wall of the traction rod (84). The change in magnetic force of the electromagnetic block (810) changes the distance between the traction rod (84) and the center line of the rotating shaft of the turntable (83); The slide plate (81) is configured as a polygon, and the slide plate (81) rotates to change the traction rod (84) of the corresponding chip.

8. The high-performance processor chip packaging device according to claim 7, characterized in that: A partition (11) is provided inside the frame (1), the partition (11) is L-shaped, and the partition (11) is used to separate the flow pipeline (3), and a spring piece (12) is provided inside the partition (11), and the spring piece (12) is Z-shaped and used to support the partition (11); A pressure head (13) is arranged inside the pressure unit (5). The pressure head (13) contacts the spring (12) and presses the spring (12). The pressure head (13) is retractable, and a compression spring (14) is arranged inside the pressure head (13) to support the pressure head (13).

9. The high-performance processor chip packaging device according to claim 8, characterized in that: A positioning frame is provided on the upper portion of the mold frame (1), the positioning frame being installed on the outside of the connector (4) and being connected to the positioning frame. The epoxy resin is melted inside the positioning frame and then squeezed into the flow pipe (3).

10. A chip packaging method, used for the chip packaging device according to any one of claims 1 to 9, characterized in that: The following steps are involved: Placing the chip to be packaged on the platform (2) so that the chip corresponds to the position of the frame (1); The pressure unit (5) moves downward, changing the height of the pressure plate (52) to squeeze the plastic sealing liquid into the flow pipe (3); The traction member (8) changes its position to adjust the flow state of the plastic sealing liquid; The pressure unit (5) continuously moves downward to control the position of the synchronous frame (6) to move downward, thereby shaping the plastic sealing liquid.

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