Communication equipment antenna flexible circuit board and manufacturing method thereof

Abstract

The invention relates to a method for manufacturing a flexible circuit board of a communication equipment antenna, and the method comprises the steps: providing a flexible circuit board which comprises a foaming layer, an insulating layer disposed on the foaming layer, and a circuit layer disposed on the insulating layer; placing the flexible circuit board blank board on a clamping tool; sliding blocks on the two sides of the clamping tool are pushed to slide towards the middle, so that the sliding blocks bend the two sides of the flexible circuit board; the clamping tool is fed into a press machine, and the two surfaces of the clamping tool are pressed through the press machine; and obtaining the flexible circuit board. The foaming layer is arranged on the back face of the insulating layer, the foaming layer is used for supporting the insulating layer, the clamping tool is used for clamping and fixing the flexible circuit board blank board, and the press machine is used for pressing the flexible circuit board blank board, so that the flexible circuit board is shaped, the foaming layer is pressed and shaped, the insulating layer can be supported for shaping, and the production efficiency of the flexible circuit board is improved. Therefore, the rebounding of the formed flexible circuit board is avoided, and the reliability of the flexible circuit board is improved.

Description

Technical Field

[0001] The present invention relates to the technical field of manufacturing circuit boards for communication equipment, and in particular to a flexible circuit board for a communication equipment antenna and a manufacturing method thereof. Background Art

[0002] To improve integration and reduce size, the circuit boards used in communication device antennas often need to adapt to the antenna's shape, for example, creating a triangular prism structure. To accommodate this triangular prism shape, a more flexible flexible printed circuit (FPC) is required. While FPCs offer excellent flexibility and can bend and fold well, they are difficult to fix and tend to spring back.

[0003] Therefore, there is an urgent need for a flexible circuit board with a fixed structure and not prone to rebound. Summary of the Invention

[0004] Based on this, it is necessary to provide a method for manufacturing a flexible circuit board for a communication device antenna.

[0005] A method for manufacturing a flexible circuit board for a communication device antenna, comprising:

[0006] A flexible circuit board is provided, wherein the flexible circuit board comprises a foaming layer, an insulating layer disposed on the foaming layer, and a circuit layer disposed on the insulating layer;

[0007] Place the flexible circuit board on the clamping fixture, press the inner core against the middle of the surface of the flexible circuit board, so that the middle of the flexible circuit board is recessed into the groove in the middle of the clamping fixture, so that the two sides of the flexible circuit board are tilted, and lock the two ends of the inner core to the clamping fixture;

[0008] Pushing the sliders on both sides of the clamping fixture to slide toward the middle, so that the sliders bend both sides of the flexible circuit board, and fixing the sliders when the sliders on both sides slide to preset positions;

[0009] The clamping tool is sent into a press, and the two surfaces of the clamping tool are pressed by the press, and the pressure is maintained for 60 to 120 seconds;

[0010] The clamping tool is removed from the press, the sliders on both sides of the clamping tool are opened, the two ends of the inner core are unlocked, the formed flexible circuit board is taken out, and the inner core is removed from the inner side of the flexible circuit board to obtain the flexible circuit board.

[0011] In one embodiment, the step of placing the clamping tool into a press and using the press to press the two surfaces of the clamping tool comprises:

[0012] The clamping tool is sent into a hot press, and the two opposite surfaces of the clamping tool are pressed by the hot press, wherein the hot pressing temperature of the hot press is 180° C. to 220° C. and the pressure is 8 to 15 tons.

[0013] In one embodiment, the step of placing the clamping tool into a press and pressing the two surfaces of the clamping tool using the press further includes:

[0014] The clamping tool is taken out of the hot press and placed in a cold press for cold pressing. The two opposite surfaces of the clamping tool are pressed by the cold press and the pressure is maintained for 90 to 180 seconds. The cold pressing temperature of the cold press is 2°C to 10°C and the pressure is 6 to 15 tons.

[0015] In one embodiment, the foaming layer, the insulating layer and the circuit layer are configured as follows:

[0016] The foamed layer comprises a foamed PET layer; and / or

[0017] The insulating layer comprises a PET layer; and / or

[0018] The circuit layer includes a copper foil layer.

[0019] In one embodiment, before the step of providing a flexible circuit board prototype, the method includes:

[0020] Laminating the foamed PET layer and the copper foil on two opposite surfaces of the PET layer to obtain a flexible board;

[0021] Etching the copper foil on the flexible substrate to obtain a copper foil layer;

[0022] Laser cutting and punching the flexible blank;

[0023] The foamed PET layer and the PET layer are irradiated by a high-energy particle radiation source to obtain the flexible circuit board prototype.

[0024] In one embodiment, the step of laminating the foamed PET layer and the copper foil to two opposite surfaces of the PET layer to obtain a flexible prototype comprises:

[0025] The foamed PET layer is adhered to the back side of the PET layer by using adhesive, and the copper foil is adhered to the front side of the PET layer by using adhesive to obtain the flexible prototype.

[0026] In one embodiment, the step of pushing the sliders on both sides of the clamping fixture to slide toward the middle so that the sliders bend both sides of the flexible circuit board, and when the sliders on both sides slide to a preset position, fixing the sliders includes:

[0027] Push the sliders on both sides of the clamping tool to slide toward the middle, so that the sliders bend the two sides of the flexible circuit board. When the sliders on both sides slide to abut against the positioning columns located on the inner side of the clamping tool, the sliders are fixed.

[0028] In one embodiment, the step of pushing the sliders on both sides of the clamping fixture to slide toward the middle so that the sliders bend both sides of the flexible circuit board, and when the sliders on both sides slide to a preset position, fixing the sliders includes:

[0029] Push the sliders on both sides of the clamping tool to slide toward the middle, so that the sliders bend the two sides of the flexible circuit board. When the sliders on both sides slide to the preset positions, plugs are installed on the outside of the two sliders, and the plugs abut against the outer edges of the sliders to fix the sliders.

[0030] In one embodiment, a slide rail is provided on the clamping fixture, an extension direction of the slide rail is perpendicular to an extension direction of the groove, and the slider is slidably provided on the slide rail.

[0031] A flexible circuit board for a communication device antenna is manufactured using the method for manufacturing a flexible circuit board for a communication device antenna described in any of the above embodiments.

[0032] The above-mentioned method for manufacturing a flexible circuit board for a communication device antenna provides a foaming layer on the back of the insulating layer, uses the foaming layer to support the insulating layer, clamps and fixes the flexible circuit board prototype with a clamping tool, and uses a press to press the flexible circuit board prototype, thereby shaping the flexible circuit board. Since the foaming layer is pressed and shaped, it can effectively support the shaping of the insulating layer, thereby avoiding the rebound of the flexible circuit board after molding, thereby improving the reliability of the flexible circuit board. BRIEF DESCRIPTION OF THE DRAWINGS

[0033] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the following briefly introduces the drawings required for use in the embodiments or the description of the prior art. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative work.

[0034] Figure 1 A flowchart of a method for manufacturing a flexible circuit board for a communication device antenna according to an embodiment;

[0035] Figure 2 This is a structural diagram of a flexible circuit board for a communication device antenna according to an embodiment;

[0036] Figure 3 This is a schematic diagram of a partially enlarged structure of a flexible circuit board for a communication device antenna according to an embodiment;

[0037] Figure 4 Schematic diagram of the structure of a clamping tool according to an embodiment.

[0038] Description of reference numerals:

[0039] 300, flexible circuit board; 310, circuit layer; 320, PET layer; 330, foamed PET layer; 400, clamping fixture; 410, slider; 420, inner core; 430, plug; DETAILED DESCRIPTION

[0040] The following will clearly and completely describe the technical solutions in the embodiments of the present invention in conjunction with the accompanying drawings. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of the present invention.

[0041] like Figure 1 As shown, a method for manufacturing a flexible circuit board for a communication device antenna according to an embodiment of the present invention includes:

[0042] Step 110 : providing a flexible circuit board prototype, wherein the flexible circuit board prototype includes a foaming layer, an insulating layer disposed on the foaming layer, and a circuit layer disposed on the insulating layer.

[0043] In this embodiment, the FPC prototype is a flat, unformed flexible circuit board. Compared to traditional FPCs, this prototype comprises a three-layer structure. The bottom layer is a foam layer, made of a foaming material that is easy to shape and resists springback. This layer effectively supports the insulation layer, preventing springback. The insulation layer supports the circuit layer and provides insulation properties. The circuit layer implements circuit logic functions and enables signal transmission.

[0044] Step 120: Place the flexible circuit board prototype on a clamping fixture, press the inner core against the middle of the surface of the flexible circuit board prototype, so that the middle of the flexible circuit board prototype is recessed into the groove in the middle of the clamping fixture, so that both sides of the flexible circuit board prototype are tilted up, and lock the two ends of the inner core onto the clamping fixture.

[0045] In this embodiment, please combine Figure 4The flexible circuit board is placed on the clamping fixture 400, and the inner core 420 is pressed against the middle of the surface of the flexible circuit board, so that the middle of the flexible circuit board is recessed into the groove in the middle of the clamping fixture 400, causing the two sides of the flexible circuit board to tilt up. The ends of the inner core 420 are then locked and fixed to the clamping fixture 400. Specifically, the flexible circuit board is first placed on the clamping fixture 400, and the position of the flexible circuit board on the clamping fixture 400 is adjusted so that the edge of the flexible circuit board is aligned with the positioning groove on the clamping fixture 400. The clamping fixture 400 is provided with a groove in the middle, and the middle of the flexible circuit board is aligned with the groove. In this way, when the inner core 420 is pressed against the middle of the flexible circuit board, the middle of the flexible circuit board is recessed downward, which can cause the two sides of the flexible circuit board to tilt up, making it easier for the slider 410 to bend the two sides of the flexible circuit board.

[0046] In this embodiment, the positioning of the flexible circuit board is particularly important, so that the middle of the flexible circuit board can be accurately aligned with the groove, and the bending position of the flexible circuit board can be exactly aligned with the side wall (edge) of the groove.

[0047] Step 130 , pushing the sliders on both sides of the clamping fixture to slide toward the middle, so that the sliders bend both sides of the flexible circuit board, and fixing the sliders when the sliders on both sides slide to a preset position.

[0048] In this embodiment, the sliders 410 on either side of the clamping fixture 400 are pushed toward the center, causing them to bend the sides of the flexible circuit board. When the sliders 410 on either side slide to a predetermined position, the sliders 410 are secured. Specifically, the sliders 410 are slid toward the center, causing them to contact the raised edges of the flexible circuit board. The sliders 410 apply force to the flexible circuit board, causing it to bend. This causes the sides of the flexible circuit board to bend toward the inner core 420 and adhere to the surface of the inner core 420. This ensures that the bent shape of the flexible circuit board matches the cross-sectional shape of the inner core 420. Subsequently, the sliders 410 are secured to the clamping fixture 400, for example, by screwing them to the clamping fixture 400, or by using snaps. Once secured, the sliders 410 clamp the flexible circuit board securely, preventing it from rebounding.

[0049] Step 140 : Send the clamping tool into a press, use the press to press the two surfaces of the clamping tool, and maintain the pressure for 60 to 120 seconds.

[0050] In this embodiment, the clamping tool 400 is used to clamp and fix the bent flexible circuit board prototype, and the press applies pressure to the bottom and top of the clamping tool 400, so that the slider 410 located at the top presses both sides of the flexible circuit board prototype against the surface of the inner core 420, and maintains the pressure for 60 to 120 seconds to shape the flexible circuit board prototype.

[0051] Step 150, remove the clamping tool from the press, open the sliders on both sides of the clamping tool, unlock the two ends of the inner core, take out the formed flexible circuit board, and remove the inner core from the inner side of the flexible circuit board to obtain the flexible circuit board.

[0052] In this embodiment, please combine Figure 4 , remove the clamping tool 400 from the press, open the sliders 410 on both sides of the clamping tool 400, unlock the two ends of the inner core 420, take out the formed flexible circuit board, and remove the inner core 420 from the inner side of the flexible circuit board to obtain the flexible circuit board.

[0053] After the press is maintained, the flexible circuit board is shaped to obtain a flexible circuit board. Subsequently, the flexible circuit board is taken out, and the inner core 420 inside the flexible circuit board is taken out.

[0054] In the above embodiment, a foaming layer is provided on the back of the insulating layer, the insulating layer is supported by the foaming layer, the flexible circuit board prototype is clamped and fixed by the clamping fixture 400, and the flexible circuit board prototype is pressed by a press, so that the flexible circuit board is shaped. Since the foaming layer is pressed and shaped, it can effectively support the shaping of the insulating layer, thereby avoiding the rebound of the flexible circuit board after molding, thereby improving the reliability of the flexible circuit board.

[0055] In one embodiment, the step of placing the clamping tool into a press and using the press to press the two surfaces of the clamping tool comprises:

[0056] The clamping tool is sent into a hot press, and the two opposite surfaces of the clamping tool are pressed by the hot press, wherein the hot pressing temperature of the hot press is 180° C. to 220° C. and the pressure is 8 to 15 tons.

[0057] In this embodiment, a hot press is used to hot-press the flexible circuit board. The heating of the foam layer and the insulating layer allows for a tighter connection between them. The hot press also allows the foam layer to be shaped and better maintain its bent state. In this embodiment, the hot press is preheated to 180°C to 220°C. Using a high temperature of 180°C to 220°C and a pressure of 8 to 15 tons, the pressure is maintained for 60 to 120 seconds. This allows the foam layer to be fully and thoroughly bent, effectively preventing springback. Furthermore, in this embodiment, the foam layer and the insulating layer are made of the same plastic material, with the foam layer being a plastic foam layer. The high temperature of 180°C to 220°C softens the foam layer and the insulating layer, allowing them to better maintain their bent state. The bent insulating layer is then securely attached to the foam layer, secured by the foam layer to prevent springback.

[0058] In one embodiment, the step of placing the clamping tool into a press and pressing the two surfaces of the clamping tool using the press further includes:

[0059] The clamping tool is removed from the hot press and placed in a cold press for cold pressing. The two opposing surfaces of the clamping tool are pressed by the cold press for 90 to 180 seconds. The cold pressing temperature of the cold press is 2° C. to 10° C. and the pressure is 6 to 15 tons.

[0060] The clamping tool is taken out from the cold press, and the slide blocks on both sides of the clamping tool are opened.

[0061] In this embodiment, the process of maintaining pressure on the flexible circuit board prototype using a press includes hot pressing and cold pressing. The flexible circuit board prototype is first hot pressed and then cold pressed. The cold pressing temperature is 2°C to 10°C. In this way, the foaming layer and the insulating layer melted by hot pressing can be quickly cooled, and a pressure of 6 to 15 tons can be maintained during the cooling process, so that the foaming layer and the insulating layer are tightly fitted during the cooling process, keep bent, and thus take shape.

[0062] In this embodiment, a hot press and a cold press are used successively to perform hot pressing and cold pressing on the flexible circuit board prototype, so that the foaming layer and the insulating layer can be softened at high temperature, so that the foaming layer can maintain bending, and the foaming layer can be prevented from rebounding. Moreover, the foaming layer and the insulating layer can be tightly fitted after hot pressing and cold pressing, and then the insulating layer can be tightly fitted to the foaming layer, and the insulating layer can be prevented from rebounding, thereby making the shaping effect of the shaped flexible circuit board prototype better.

[0063] In one embodiment, the foaming layer, the insulating layer and the circuit layer are configured as follows: the foaming layer includes a foamed PET layer; and / or the insulating layer includes a PET layer; and / or the circuit layer includes a copper foil layer.

[0064] In one embodiment, the foaming layer includes a foamed PET (polyethylene glycol terephthalate) layer, the insulating layer includes a PET layer, and the circuit layer includes a copper foil layer.

[0065] In this embodiment, PET not only has insulating properties but also is easily bendable, while foamed PET is easily shaped and resists springback. After hot and cold pressing, the foamed PET layer and the PET layer can be fully bent and shaped. The foamed PET layer provides support for the PET layer, effectively preventing springback. Furthermore, because the foamed PET and PET layers are made from the same PET material, their compatibility is enhanced, resulting in a better interface bonding. Thus, once the foamed PET layer is shaped, it better secures the PET layer, resulting in a more effective shaping effect for the flexible circuit board.

[0066] In one embodiment, before the step of providing a flexible circuit board prototype, the method includes:

[0067] Laminating the foamed PET layer and the copper foil on two opposite surfaces of the PET layer to obtain a flexible board;

[0068] Etching the copper foil on the flexible substrate to obtain a copper foil layer;

[0069] Laser cutting and punching the flexible blank;

[0070] The foamed PET layer and the PET layer are irradiated by a high-energy particle radiation source to obtain the flexible circuit board prototype.

[0071] In this embodiment, a foamed PET layer and copper foil are respectively attached to two opposing surfaces of the PET layer, such that the PET layer is fixed to the foamed PET layer and the copper foil, respectively. Subsequently, the copper foil on the PET layer is etched to form a copper foil layer, which serves as the circuit layer. Subsequently, the flexible substrate is cut into the desired size and shape using laser cutting, and the flexible circuit board is punched to form positioning holes on the flexible circuit board. Subsequently, the foamed PET layer and the PET layer are irradiated using a high-energy particle radiation source, such as gamma rays or X-rays. The radiation causes crosslinking between the foamed PET layer and the PET layer and the adhesive between them. The intermolecular crosslinking and polymerization between the foamed PET layer and the adhesive forms a polymer network, thereby providing a stable connection between the foamed PET layer and the PET layer. This allows the foamed PET layer to better support the PET layer after being bent and shaped, preventing the PET layer from falling off and rebounding.

[0072] In one embodiment, the step of laminating the foamed PET layer and the copper foil to two opposite surfaces of the PET layer to obtain a flexible prototype comprises:

[0073] The foamed PET layer is adhered to the back side of the PET layer by using adhesive, and the copper foil is adhered to the front side of the PET layer by using adhesive to obtain the flexible prototype.

[0074] In this embodiment, the foamed PET layer and the copper foil are respectively attached to two opposite surfaces of the PET layer using adhesive, which can fully fix the foamed PET layer and the PET layer, and the PET layer and the copper foil, avoid separation between the foamed PET layer and the PET layer, and prevent the copper foil from falling off the PET layer.

[0075] In one embodiment, the sliders 410 on both sides of the clamping fixture 400 are pushed to slide toward the middle so that the sliders 410 bend both sides of the flexible circuit board. When the sliders 410 on both sides slide to a preset position, the step of fixing the sliders 410 includes:

[0076] Please combine Figure 4 , push the sliders 410 on both sides of the clamping tool 400 to slide toward the middle, so that the sliders 410 bend the two sides of the flexible circuit board. When the sliders 410 on both sides slide to abut against the positioning columns 440 located on the inner side of the clamping tool 400, the sliders 410 are fixed.

[0077] In this embodiment, the slider 410 can be limited by the positioning column 440, so that the slider 410 can accurately bend the two sides of the flexible circuit board.

[0078] In one embodiment, the sliders 410 on both sides of the clamping fixture 400 are pushed to slide toward the middle so that the sliders 410 bend both sides of the flexible circuit board. When the sliders 410 on both sides slide to a preset position, the step of fixing the sliders 410 includes:

[0079] Push the sliders 410 on both sides of the clamping tool 400 to slide toward the middle, so that the sliders 410 bend the two sides of the flexible circuit board. When the sliders 410 on both sides slide to the preset position, plugs 430 are installed on the outside of the two sliders 410. The plugs 430 abut against the outer edges of the sliders 410 to fix the sliders 410.

[0080] In this embodiment, the plug 430 can be fixed to the clamping tool 400 by means of clips, screws or clamping. The abutment of the plug 430 on both sides of the slider 410 can effectively prevent the slider 410 from sliding out from both sides, thereby fixing the slider 410 and clamping the flexible circuit board.

[0081] In one embodiment, a slide rail is provided on the clamping fixture 400 , and an extension direction of the slide rail is perpendicular to an extension direction of the groove, and the slider 410 is slidably provided on the slide rail.

[0082] In this embodiment, the extension direction of the groove is parallel to the length direction of the flexible circuit board prototype to accommodate the flexible circuit board prototype, and since the extension direction of the slide rail is perpendicular to the extension direction of the groove, the slider 410 can slide inward from both sides along the direction perpendicular to the groove, thereby clamping and fixing the flexible circuit board prototype.

[0083] In one embodiment, a method for manufacturing a flexible circuit board for a communication device antenna is provided, comprising:

[0084] Step 211, laminating the foamed PET layer to the back side of the PET layer using a first adhesive, and laminating the copper foil to the front side of the PET layer using a second adhesive, to obtain the flexible board, wherein the first adhesive contains a photoinitiator;

[0085] Step 212, etching the copper foil on the flexible substrate to obtain a copper foil layer, and laser cutting and punching the flexible substrate;

[0086] Step 213: placing the flexible prototype in an environment of 45° C. to 55° C., and irradiating the foamed PET layer and the PET layer using a high-energy particle radiation source to obtain the flexible circuit board prototype, wherein the irradiation dose for the foamed PET layer and the PET layer is greater than or equal to 65 Gy and less than 125 Gy;

[0087] Step 214: Place the FPC prototype on a clamping fixture, press the inner core against the middle of the surface of the FPC prototype so that the middle of the FPC prototype is recessed into the groove in the middle of the clamping fixture, thereby causing both sides of the FPC prototype to tilt upwards, and lock both ends of the inner core onto the clamping fixture.

[0088] Step 215: Push the sliders on both sides of the clamping fixture to slide toward the middle, so that the sliders bend both sides of the flexible circuit board. When the sliders on both sides slide to a preset position, fix the sliders.

[0089] Step 216: Place the clamping fixture into a hot press, and use the hot press to press the two opposing surfaces of the clamping fixture for 60 to 120 seconds. The hot press temperature is 180° C. to 220° C., and the pressure is 8 to 15 tons.

[0090] Step 217: After hot pressing, the clamping fixture is removed from the hot press and placed in a cold press for cold pressing. The two opposing surfaces of the clamping fixture are pressed together by the cold press for 90 to 180 seconds. The cold pressing temperature of the cold press is 2° C. to 10° C., and the pressure is 6 to 15 tons.

[0091] In step 218, the clamping tool is removed from the hot press. After the clamping tool is cooled, the sliders on both sides of the clamping tool are opened, the two ends of the inner core are unlocked, the formed flexible circuit board is taken out, and the inner core is removed from the inner side of the flexible circuit board to obtain the flexible circuit board.

[0092] In this embodiment, the first viscose contains a photoinitiator, which is TPO (diphenyl (2,4,6-trimethylbenzoyl) phosphine oxide). Under the irradiation of light of a specific wavelength, the photoinitiator absorbs photon energy and decomposes to produce free radicals or active intermediates, triggering the polymerization and cross-linking reaction of the monomers in the first viscose, so that the foamed PET layer and the PET layer are initially cross-linked, so that the foamed PET layer and the PET layer are tightly connected. Specifically, in step 212, when the flexible blank is laser cut and punched, the method is used.

[0093] Laser cutting and punching of 350-430nm, the thickness of the PET layer is greater than 40μm and less than or equal to 100μm, the laser in this wavelength band can penetrate the PET layer, and when the flexible prototype is laser cut and punched, the laser penetrates the PET layer and is absorbed by the photoinitiator TPO in the first viscose. The effective absorption wavelength range of the photoinitiator TPO is 350-430nm. In one embodiment, a femtosecond laser of 355nm or 380nm is used for cutting and punching. The laser of 355nm or 380nm can penetrate the PET layer well and be effectively absorbed by the photoinitiator TPO, so that during the cutting and punching process, the polymerization and cross-linking reaction of the monomers in the first viscose is triggered, so that the foamed PET layer and the PET layer are initially cross-linked. The advantage of this is that microcracks or delamination at the interface between the first viscose and the foamed PET layer or the PET layer is avoided due to stress or thermal expansion difference generated during the copper foil cutting process. In addition, the areas where the photoinitiator in the first viscose is affected by the laser and triggers the cross-linking reaction are mainly concentrated in the areas where the copper foil is cut and punched. These parts are the main stress points. Through cross-linking reaction in the cut and punched areas, the bonding strength of these parts can be effectively improved.

[0094] It's worth noting that the photoinitiator content in the first viscose is 0.5%-5%. Since the laser doesn't directly act on the first viscose but instead penetrates the PET layer during the cutting process, adding too much photoinitiator isn't necessary if laser penetration is low. Therefore, in this embodiment, the photoinitiator content in the first viscose is 0.5%-5%, effectively ensuring that the photoinitiator fully absorbs light energy to trigger the crosslinking reaction, achieving initial crosslinking between the foamed PET layer and the PET layer.

[0095] In addition, this embodiment also irradiates the foamed PET layer and the PET layer, achieving deep crosslinking. Specifically, irradiating the foamed PET layer and the PET layer with a high-energy particle radiation source results in deep crosslinking between the foamed PET layer and the PET layer and the first adhesive, thereby strengthening the connection between the foamed PET layer and the PET layer. It is worth noting that in this embodiment, irradiating the flexible sheet at a temperature of 45°C to 55°C, with an irradiation dose greater than or equal to 65Gy and less than 125Gy, can enhance crosslinking effectiveness. It should be understood that adjusting the ambient temperature can improve crosslinking efficiency. For example, within a certain temperature range, higher temperatures increase crosslinking efficiency and activity. However, above a certain temperature, efficiency is not further improved. For example, above 50°C, crosslinking activity gradually decreases. Within a certain irradiation dose range, higher irradiation doses increase crosslinking efficiency. However, above a certain dose, crosslinking strength decreases. This is because excessive irradiation doses can cause molecular breakage. Therefore, in this embodiment, the flexible prototype is exposed to radiation with a dose greater than or equal to 65Gy and less than 125Gy in an environment of 45°C to 55°C, which can enable rapid cross-linking between the foamed PET layer and the PET layer and the first viscose, making the connection between the foamed PET layer and the PET layer more stable.

[0096] In addition, when the flexible circuit board is placed in the clamping tooling and clamped, and sent to the hot press for hot pressing, the temperature of the hot pressing not only softens the foamed PET layer and the PET layer, but also further melts the interface between the foamed PET layer and the PET layer. Since the foamed PET layer and the PET layer are cross-linked by radiation, a cross-linked interface layer with relatively high strength is formed between the foamed PET layer and the PET layer. The cross-linked interface layer can not only better connect the foamed PET layer and the PET layer, but also better shape it. Due to its greater strength, it is not easy to rebound after hot pressing. In this way, after hot pressing, not only the foamed PET layer is shaped, but also the cross-linked interface layer between the foamed PET layer and the PET layer can be shaped, so that the flexible circuit board as a whole is shaped and fixed, and the PET layer is effectively prevented from falling off from the foamed PET layer, so that the molding effect of the flexible circuit board is better.

[0097] After hot pressing, cold pressing is carried out. The cold pressing process can quickly cool the flexible circuit board prototype and maintain pressure during the cooling process so that the flexible circuit board prototype remains in shape. After cooling, the hardness of the foamed PET layer and the PET layer increases, and the structure is fixed, so that the flexible circuit board is formed.

[0098] In one embodiment, a flexible circuit board for a communication device antenna is provided. The flexible circuit board for a communication device antenna is manufactured using the method for manufacturing a flexible circuit board for a communication device antenna described in any of the above embodiments.

[0099] In this embodiment, Figure 2 and Figure 3 As shown, the flexible circuit board 300 for the communication device antenna includes a foamed PET layer 330 , a PET layer 320 disposed on the foamed PET layer 330 , and a copper foil circuit layer located on the PET layer 320 .

[0100] The flexible circuit board 300 is bent and formed by utilizing the characteristics of the foamed PET layer 330 that is easy to shape and not easy to rebound, so that the flexible circuit board 300 can maintain the bending shape required by the antenna, and the foamed PET layer 330 is used to support the PET layer 320, which can prevent the PET layer 320 from rebounding, making the shaping effect of the flexible circuit board 300 better.

[0101] The technical features of the above-mentioned embodiments can be combined arbitrarily. In order to make the description concise, not all possible combinations of the technical features in the above-mentioned embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0102] The above-described embodiments merely illustrate several implementations of the present invention, and while their descriptions are relatively specific and detailed, they should not be construed as limiting the scope of the patent. It should be noted that a person skilled in the art would be able to make numerous variations and improvements without departing from the spirit of the present invention, all of which fall within the scope of protection of the present invention. Therefore, the scope of protection of the patent for this invention shall be determined by the appended claims.

Claims

1. A method for manufacturing a flexible circuit board for a communication device antenna, characterized in that: include: A flexible circuit board is provided, wherein the flexible circuit board comprises a foam layer, an insulating layer disposed on the foam layer, and a circuit layer disposed on the insulating layer; Place the flexible circuit board on the clamping fixture, press the inner core against the middle of the surface of the flexible circuit board, so that the middle of the flexible circuit board is recessed into the groove in the middle of the clamping fixture, so that the two sides of the flexible circuit board are tilted, and lock the two ends of the inner core to the clamping fixture; Pushing the sliders on both sides of the clamping fixture to slide toward the middle, so that the sliders bend both sides of the flexible circuit board, and fixing the sliders when the sliders on both sides slide to preset positions; The clamping tool is sent into a press, and the two surfaces of the clamping tool are pressed by the press, and the pressure is maintained for 60 to 120 seconds; The clamping tool is removed from the press, the sliders on both sides of the clamping tool are opened, the two ends of the inner core are unlocked, the formed flexible circuit board is taken out, and the inner core is removed from the inner side of the flexible circuit board to obtain the flexible circuit board.

2. The method for manufacturing a flexible circuit board for a communication device antenna according to claim 1, wherein: The step of placing the clamping tool into a press and pressing the two surfaces of the clamping tool by the press comprises: The clamping tool is sent into a hot press, and the two opposite surfaces of the clamping tool are pressed by the hot press, wherein the hot pressing temperature of the hot press is 180° C. to 220° C. and the pressure is 8 to 15 tons.

3. The method for manufacturing a flexible circuit board for a communication device antenna according to claim 2, wherein: The step of feeding the clamping tool into a press and using the press to press the two surfaces of the clamping tool may further include: The clamping tool is taken out of the hot press and placed in a cold press for cold pressing. The two opposite surfaces of the clamping tool are pressed by the cold press and the pressure is maintained for 90 to 180 seconds. The cold pressing temperature of the cold press is 2°C to 10°C and the pressure is 6 to 15 tons.

4. The method for manufacturing a flexible circuit board for a communication device antenna according to claim 1, wherein: The foaming layer, the insulating layer, and the circuit layer are configured as follows: The foamed layer comprises a foamed PET layer; and / or The insulating layer comprises a PET layer; and / or The circuit layer includes a copper foil layer.

5. The method for manufacturing a flexible circuit board for a communication device antenna according to claim 1, wherein: Before the step of providing a flexible circuit board prototype, the method includes: Laminating the foamed PET layer and the copper foil on two opposite surfaces of the PET layer to obtain a flexible board; Etching the copper foil on the flexible substrate to obtain a copper foil layer; Laser cutting and punching the flexible blank; The foamed PET layer and the PET layer are irradiated by a high-energy particle radiation source to obtain the flexible circuit board prototype.

6. The method for manufacturing a flexible circuit board for a communication device antenna according to claim 1, wherein: The step of laminating the foamed PET layer and the copper foil to two opposite surfaces of the PET layer to obtain a flexible prototype comprises: The foamed PET layer is adhered to the back side of the PET layer by using adhesive, and the copper foil is adhered to the front side of the PET layer by using adhesive to obtain the flexible prototype.

7. The method for manufacturing a flexible circuit board for a communication device antenna according to claim 1, wherein: The step of pushing the sliders on both sides of the clamping fixture to slide toward the middle so that the sliders bend both sides of the flexible circuit board, and when the sliders on both sides slide to the preset positions, fixing the sliders includes: Push the sliders on both sides of the clamping tool to slide toward the middle, so that the sliders bend the two sides of the flexible circuit board. When the sliders on both sides slide to abut against the positioning columns located on the inner side of the clamping tool, the sliders are fixed.

8. The method for manufacturing a flexible circuit board for a communication device antenna according to claim 1, wherein: The step of pushing the sliders on both sides of the clamping fixture to slide toward the middle so that the sliders bend both sides of the flexible circuit board, and when the sliders on both sides slide to the preset positions, fixing the sliders includes: Push the sliders on both sides of the clamping tool to slide toward the middle, so that the sliders bend the two sides of the flexible circuit board. When the sliders on both sides slide to the preset positions, plugs are installed on the outside of the two sliders, and the plugs abut against the outer edges of the sliders to fix the sliders.

9. The method for manufacturing a flexible circuit board for a communication device antenna according to claim 1, wherein: The clamping fixture is provided with a slide rail, the extension direction of the slide rail is perpendicular to the extension direction of the groove, and the slider is slidably arranged on the slide rail.

10. A flexible circuit board for a communication device antenna, characterized in that: The flexible circuit board for a communication device antenna is manufactured using the manufacturing method of the flexible circuit board for a communication device antenna as described in any one of claims 1 to 9.

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