Automatic chip mounter for mounting electronic component and printed circuit board and chip mounting method thereof

Abstract

The invention relates to the technical field of chip mounters, and discloses an automatic chip mounter for mounting an electronic component and a printed circuit board and a chip mounting method thereof.The automatic chip mounter comprises a machine base, a mounting frame, a suction nozzle and an air pump, the suction nozzle and the air pump are both mounted on the mounting frame, and the suction nozzle comprises a shell, a suction head pipe and a pressing rod; the interior of the shell communicates with the air exhaust end of the air pump through a pipeline system. The suction head pipe and the pressing rod are slidably connected with the upper end and the lower end of the shell correspondingly. According to the automatic chip mounter, the unique suction nozzle is arranged, the pressing rod is associated with the suction head pipe, the stretching-out action of the suction head pipe and switching of the communication state of an air channel in the suction head pipe are achieved through sliding of the pressing rod, and pressing is accurately controlled through the arrangement of the translation assembly and the electric push rod; the air leakage hidden danger generally existing in a traditional suction nozzle replaceable type automatic chip mounter is effectively solved, it is ensured that electronic elements are kept stable in the adsorption, pickup and chip mounting processes, and the problem that the elements fall accidentally due to abnormal air pressure is completely eradicated.

Description

Technical Field

[0001] The present invention relates to the technical field of chip mounters, in particular to an automatic chip mounter for mounting electronic components and printed circuit boards and a chip mounting method thereof. Background Art

[0002] An automatic placement machine is an automated device used to precisely place electronic components (such as chips, resistors, capacitors, etc.) on a specified location on a printed circuit board (PCB). It is widely used in the electronics manufacturing industry. Its core function is to achieve high-speed and high-precision placement of electronic components from a feeder to a circuit board through mechanical movement, negative pressure adsorption, and precise positioning technology. It is one of the key devices in an SMT (surface mount technology) production line.

[0003] Chinese patent CN117677069B discloses a chip placement machine and a chip placement method. During the placement process, the screw rotates to drive the limit plate to move up and down, so that the clamping head can be plugged into the limit tube below it, so that when the air supply pipe is evacuated, negative pressure is formed inside the suction nozzle through the limit tube, which can suck up the chip. By arranging the suction nozzle to rotate around the screw, suction nozzles of different sizes can be moved to the bottom of the clamping head. Therefore, the appropriate suction nozzle can be automatically replaced according to the size and model of the chip, reducing the manual workload.

[0004] However, the above device docks the nozzle by docking the clamping head and the limiting tube, which easily causes air leakage between the clamping head and the limiting tube during use, resulting in insufficient suction force of the nozzle, thereby reducing the success rate of sucking up the chip. Summary of the Invention

[0005] (1) Technical problems solved

[0006] In response to the shortcomings of the existing technology, the present invention provides an automatic placement machine and placement method for electronic components and printed circuit boards, which has the function of quickly replacing the suction nozzle and preventing the suction nozzle from leaking, thereby solving the problems mentioned in the above background technology.

[0007] (2) Technical solution

[0008] In order to solve the above technical problems, the present invention provides the following technical solutions:

[0009] An automatic placement machine for electronic components and printed circuit boards, comprising a machine base, a mounting frame, a suction nozzle, and an air pump, wherein the suction nozzle and the air pump are both mounted on the mounting frame. The suction nozzle comprises a housing, a suction nozzle, and a pressure rod. The interior of the housing is connected to an air extraction end of the air pump via a pipeline system. The suction nozzle and the pressure rod are slidably connected to the upper and lower ends of the housing, respectively. When the pressure rod slides toward the interior of the housing, it can push the suction nozzle to slide toward the exterior of the housing. When the suction nozzle slides toward the exterior of the housing, the interior of the suction nozzle is connected to the interior of the housing.

[0010] The mounting frame is provided with a pressing mechanism, which includes a translation assembly, an electric push rod and a pressure block. The translation assembly is mounted on the mounting frame. The pressure block is adjusted in the horizontal direction by the translation assembly and in the vertical direction by the electric push rod, so that the pressure block pushes the pressure rod to slide toward the inside of the housing.

[0011] A translation drive mechanism and a lifting mechanism are provided inside the machine base. The translation drive mechanism is used to control the horizontal movement of the mounting frame, and the lifting mechanism is used to control the vertical movement of the mounting frame, thereby realizing precise movement positioning of the suction nozzle in three-dimensional space.

[0012] Preferably, the suction nozzle also includes a sealing plate and a lifting tube, the sealing plate is fixedly installed inside the shell, and a sealing block is provided at the lower end of the sealing plate, the lifting tube is slidably arranged inside the shell, and a sloped opening is provided at the upper end of the lifting tube, and the sloped opening is adapted to be plugged into the sealing block, a corrugated hose is provided inside the shell, and the two ends of the corrugated hose are respectively fixedly connected to the lower end of the lifting tube and the upper end of the suction nozzle, and the lifting tube and the suction nozzle are both connected to the interior of the corrugated hose.

[0013] Preferably, a pressing plate is fixedly mounted on the lower end of the pressing rod, a pushing rod is fixedly mounted on the pressing plate, a connecting block is fixedly mounted on the outer side wall of the lifting tube, and the connecting block is fixedly connected to the pushing rod.

[0014] Preferably, a sliding sleeve is fixedly installed on the outer wall of the nozzle tube, the sliding sleeve is slidably connected to the push rod, a support spring is sleeved on the push rod, and both ends of the support spring are fixedly connected to the sliding sleeve and the connecting block respectively.

[0015] Preferably, a return spring is sleeved on the pressure rod, and two ends of the return spring are fixedly connected to the upper surface of the pressure plate and the inner top wall of the shell respectively.

[0016] Preferably, sealing tubes are provided at both upper and lower ends of the shell, and sealing rings are provided on the inner side walls of the sealing tubes, and the sealing rings are respectively slidably sealed with the pipette head tube and the pressure rod.

[0017] Preferably, both side walls of the shell are provided with ventilation interfaces, the suction end of the air pump is connected to the suction pipe, the suction pipe and the ventilation interface are detachably connected, a connecting pipe is provided between adjacent shells, the two ends of the connecting pipe are respectively detachably connected to adjacent ventilation interfaces, a plug is detachably installed on the ventilation interface, the ends of the connecting pipe and the suction pipe are both provided with a baffle, a nut is sleeved on the baffle, the end of the ventilation interface is threadedly connected to the nut, the plug is threadedly connected to the end of the ventilation interface, the ends of the suction pipe and the connecting pipe connected to the ventilation interface are both provided with a sealing gasket, and a sealing gasket is provided inside the plug.

[0018] Preferably, a slotted plug is fixedly mounted on the outer surface of the shell, and a clamping block is fixedly mounted on the surface of the mounting frame in a linear array, the clamping block is adapted to be plugged into the slotted plug, and a bolt threadedly connected to the slotted plug passes through the slotted plug, and the bolt is adapted to be plugged into the clamping block.

[0019] Preferably, the translation assembly includes a threaded rod, a threaded sleeve and a drive motor. The threaded rod is rotatably mounted on a mounting frame. The threaded sleeve is threadedly connected to the threaded rod. The electric push rod is fixedly mounted on the threaded sleeve. A sliding hole is provided on the mounting frame, and the sliding hole is threadedly connected to the threaded sleeve.

[0020] The present invention also discloses a patch method, which specifically comprises the following steps:

[0021] According to the size and weight of the electronic components to be mounted, select nozzles suitable for different types of electronic components and install them in different positions on the mounting frame;

[0022] During the patch process, according to the model of the next electronic component to be patched, the pressing block is controlled by the translation component to move to the top of the corresponding suction nozzle, and the electric push rod pushes the pressing block to squeeze the pressure rod of the corresponding suction nozzle, so that the suction head tube of the corresponding suction nozzle extends downward;

[0023] The translation drive mechanism inside the machine base controls the horizontal movement of the mounting frame, so that the downwardly extending nozzle of the suction head tube is aligned with the electronic component placed on the machine base. Then, the lifting mechanism drives the mounting frame downward, so that the suction head tube is close to the electronic component.

[0024] The air pump works, generating suction at the suction head tube through its connection with the suction nozzle, sucking the electronic component. After the suction is completed, the lifting mechanism controls the mounting frame to rise, so that the electronic component is separated from the placement position. The translation drive mechanism operates again, controlling the mounting frame to move horizontally, and transporting the suction nozzle with the electronic component to the target patch position above the printed circuit board. Subsequently, the lifting mechanism drives the mounting frame to descend, so that the electronic component is close to the printed circuit board. After that, the air pump stops working, and the electronic component is separated from the suction head tube.

[0025] The electric push rod pushes the pressing block upward to release the pressing rod, and the translation drive mechanism moves the mounting frame back to the initial position, waiting for the next patch operation.

[0026] (3) Beneficial effects

[0027] Compared with the prior art, the present invention provides an automatic chip placement machine and chip placement method for electronic components and printed circuit boards, which have the following beneficial effects:

[0028] 1. This automatic placement machine, by setting a unique suction nozzle, connects the pressure rod with the suction head tube, uses the sliding of the pressure rod to realize the extension of the suction head tube and the switching of the internal air path connection state of the suction head tube. By setting a translation component and an electric push rod to accurately control the pressure, it effectively solves the common leakage risk of traditional automatic placement machines with replaceable suction nozzles, ensures that electronic components remain stable during the adsorption, picking and placement process, and eliminates the problem of accidental component falling due to abnormal air pressure.

[0029] 2. The automatic placement machine is provided with a sealing plate, a lifting tube, a corrugated hose, a pressure plate, a push rod and a sliding sleeve. When the pressure rod is squeezed and moved downward, the lifting tube moves away from the sealing plate, so that the interior of the lifting tube is connected to the interior of the shell. When the interior of the shell is in a negative pressure state, suction is generated inside the lifting tube, so that the suction head tube connected to the lifting tube through the corrugated hose can suck up the electronic component. By providing a connecting block and a reset spring, when the suction head tube contacts the surface of the electronic component, the reset spring can be compressed so that the suction head tube can move upward, which can reduce the pressure on the surface of the electronic component and avoid damaging the electronic component.

[0030] 3. The automatic placement machine is convenient for connecting the interior of all nozzle shells with the air pump by setting a ventilation interface, an exhaust pipe, a connecting pipe, a plug and a nut, so that the air pump can exhaust the interior of any lifting tube separated from the sealing plate, thereby ensuring that the adsorption and placement performance of the nozzle tubes on different nozzles is the same.

[0031] 4. The automatic placement machine is easy to disassemble the nozzle by setting the slotted plug, the clamping block and the bolt, so that different types of nozzles can be easily replaced when placing different types of electronic components. BRIEF DESCRIPTION OF THE DRAWINGS

[0032] Figure 1 This is one of the three-dimensional structural diagrams of the automatic placement machine of the present invention;

[0033] Figure 2 This is the second schematic diagram of the three-dimensional structure of the automatic placement machine of the present invention;

[0034] Figure 3 For the present invention Figure 2 A magnified schematic diagram of the local structure at point A in the middle;

[0035] Figure 4 This is the third schematic diagram of the three-dimensional structure of the automatic placement machine of the present invention;

[0036] Figure 5 For the present invention Figure 4 A magnified schematic diagram of the local structure at point B in the middle;

[0037] Figure 6 This is the fourth schematic diagram of the three-dimensional structure of the automatic placement machine of the present invention;

[0038] Figure 7 For the present invention Figure 6 A magnified schematic diagram of the local structure at point C in the middle;

[0039] Figure 8 This is the fifth schematic diagram of the three-dimensional structure of the automatic placement machine of the present invention;

[0040] Figure 9 This is the sixth schematic diagram of the three-dimensional structure of the automatic placement machine of the present invention;

[0041] Figure 10 FIG7 is a schematic diagram of the three-dimensional structure of the automatic placement machine of the present invention;

[0042] Figure 11 This is the eighth schematic diagram of the three-dimensional structure of the automatic placement machine of the present invention.

[0043] In the picture:

[0044] 1. Machine base;

[0045] 2. Mounting frame; 21. Clamping block; 22. Sliding hole;

[0046] 3. Suction nozzle; 31. Housing; 311. Sealing tube; 312. Sealing ring; 313. Ventilation port; 314. Slotted insert; 32. Suction head tube; 321. Sliding sleeve; 33. Press rod; 331. Press plate; 332. Push rod; 34. Sealing plate; 341. Sealing block; 35. Lifting tube; 351. Inclined opening; 352. Connecting block; 36. Corrugated hose; 37. Support spring; 38. Return spring; 4. Air pump; 41. Exhaust pipe; 42. Connecting pipe; 43. Plug; 44. Nut; 45. Sealing washer; 46. Sealing gasket;

[0047] 5. Pressing mechanism; 51. Translation assembly; 511. Threaded rod; 512. Threaded sleeve; 513. Driving motor; 52. Electric push rod; 53. Pressing block. DETAILED DESCRIPTION

[0048] The following will clearly and completely describe the technical solutions in the embodiments of the present invention in conjunction with the accompanying drawings. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of the present invention.

[0049] Example 1

[0050] See also Figure 1 、 Figure 2 、 Figure 8 、 Figure 9 and Figure 11 The present invention provides an automatic placement machine for electronic components and printed circuit boards, comprising a machine base 1, a mounting frame 2, a suction nozzle 3 and an air pump 4. The suction nozzle 3 and the air pump 4 are both mounted on the mounting frame 2. The suction nozzle 3 comprises a shell 31, a suction head tube 32 and a pressure rod 33. The interior of the shell 31 is connected to the air extraction end of the air pump 4 through a pipeline system. The suction head tube 32 and the pressure rod 33 are slidably connected to the upper and lower ends of the shell 31 respectively. When the pressure rod 33 slides toward the interior of the shell 31, it can push the suction head tube 32 to slide toward the outside of the shell 31. When the suction head tube 32 slides toward the outside of the shell 31, the interior of the suction head tube 32 is connected to the interior of the shell 31.

[0051] The mounting frame 2 is provided with a pressing mechanism 5, which includes a translation assembly 51, an electric push rod 52, and a pressing block 53. The translation assembly 51 is mounted on the mounting frame 2. The pressing block 53 is adjusted horizontally by the translation assembly 51 and vertically by the electric push rod 52, so that the pressing block 53 pushes the pressing rod 33 to slide toward the interior of the housing 31.

[0052] The interior of the base 1 is provided with a translation drive mechanism and a lifting mechanism. The translation drive mechanism is used to control the horizontal movement of the mounting frame 2, and the lifting mechanism is used to control the vertical movement of the mounting frame 2, thereby realizing the precise movement positioning of the suction nozzle 3 in three-dimensional space.

[0053] As can be seen from the above, when the pressure rod 33 slides toward the inside of the shell 31, the suction head tube 32 can be pushed to slide toward the outside of the shell 31. When the suction head tube 32 slides toward the outside of the shell 31, the inside of the suction head tube 32 is connected to the inside of the shell 31. Therefore, by controlling the pressure block 53 to squeeze the pressure rods 33 on different suction nozzles 3 through the pressing mechanism 5, the suction head tube 32 in the corresponding suction nozzle 3 can be connected to the inside of the shell 31. When the shell 31 is in a negative pressure state, the suction head tube 32 in the corresponding suction nozzle 3 can absorb and lift the electronic component. By setting a translation drive mechanism and a lifting mechanism, the three-dimensional movement of the suction nozzle 3 can be controlled, so that the suction head tube 32 of the suction nozzle 3 connected to the inside of the shell 31 moves to the top of the electronic component to perform the patch action on the electronic component. By setting an air pump 4, a negative pressure state can be formed inside the shell 31 of all suction nozzles 3.

[0054] When using the device, according to the size and weight of the electronic components to be mounted, the suction nozzles 3 suitable for different types of electronic components are selected and installed at different positions on the mounting frame 2 respectively; during the mounting process, according to the type of the next electronic component to be mounted, the pressing block 53 is controlled by the translation component 51 to move to the top of the corresponding suction nozzle 3, and the pressing block 53 is pushed by the electric push rod 52 to squeeze the pressure rod 33 of the corresponding suction nozzle 3, so that the suction head tube 32 of the corresponding suction nozzle 3 extends downward; the translation drive mechanism in the machine base 1 is used to control the mounting frame 2 to move in the horizontal direction, so that the suction nozzle 3 with the suction head tube 32 extending downward is aligned with the electronic component placed on the machine base 1; then, the lifting mechanism drives the mounting frame 2 to descend, so that the suction head tube 32 is close to the electronic component; when the suction head tube 32 is lowered, the suction head tube 32 is pushed downward. When 32 is connected to the inside of the shell 31, the air pump 4 works and generates suction at the suction head tube 32 through the connection with the suction nozzle 3 to adsorb the electronic components; after the adsorption is completed, the lifting mechanism controls the mounting frame 2 to rise, so that the electronic components are separated from the placement position, and the translation drive mechanism operates again to control the mounting frame 2 to move in the horizontal direction, and transports the suction nozzle 3 with the electronic components adsorbed to the target patch position above the printed circuit board. Subsequently, the lifting mechanism drives the mounting frame 2 to descend, so that the electronic components are close to the printed circuit board, and then the air pump 4 stops working, and the electronic components are separated from the suction head tube 32; the electric push rod 52 pushes the pressure block 53 to move upward to release the pressure rod 33, and the translation drive mechanism moves the mounting frame 2 back to the initial position, waiting for the next patch operation.

[0055] Example 2

[0056] like Figure 2-Figure 7As shown, the difference between this embodiment and the above embodiment is that the suction nozzle 3 also includes a sealing plate 34 and a lifting tube 35, the sealing plate 34 is fixedly installed inside the shell 31, and the lower end of the sealing plate 34 is provided with a sealing block 341, the lifting tube 35 is slidably arranged inside the shell 31, and the upper end of the lifting tube 35 is provided with an inclined opening 351, the inclined opening 351 is adapted to be plugged into the sealing block 341, and a corrugated hose 36 is provided inside the shell 31, and the two ends of the corrugated hose 36 are fixedly connected to the lower end of the lifting tube 35 and the upper end of the suction nozzle 3 respectively, and the lifting tube 35 and the suction nozzle 3 are both connected to the interior of the corrugated hose 36.

[0057] As can be seen from the above, by setting a sealing plate 34 and utilizing a sealing block 341 installed at the bottom of the sealing plate 34 to adapt to the inclined opening 351 fixed on the top of the lifting tube 35, the sealing plate 34 can seal the upper end of the lifting tube 35, so that the interior of the shell 31 is not connected to the interior of the lifting tube 35. When a negative pressure is formed inside the shell 31, the interior of the lifting tube 35 maintains normal pressure. By setting a corrugated hose 36, the lifting tube 35 is always connected to the interior of the suction head tube 32. Therefore, when the lifting tube 35 moves downward so that the sealing plate 34 no longer seals the upper end of the lifting tube 35, the lifting tube 35 and the suction head tube 32 are both connected to the interior of the shell 31. When the interior of the shell 31 is in a negative pressure state, air is pumped from the suction head tube 32 to the outside, so that the suction head tube 32 can suck up electronic components.

[0058] A pressing plate 331 is fixedly mounted on the lower end of the pressing rod 33 , a pushing rod 332 is fixedly mounted on the pressing plate 331 , a connecting block 352 is fixedly mounted on the outer wall of the lifting tube 35 , and the connecting block 352 is fixedly connected to the pushing rod 332 .

[0059] As can be seen from the above, by setting the pressure plate 331, the push rod 332 and the connecting block 352, when the pressure rod 33 is squeezed and moved downward, the push rod 332 pushes the lifting tube 35 fixedly connected thereto to move downward, so that the sealing plate 34 no longer seals the upper end of the lifting tube 35. At this time, the air pump 4 can draw air to the suction head tube 32 to the outside, thereby sucking up the electronic components.

[0060] A sliding sleeve 321 is fixedly installed on the outer wall of the suction head tube 32, and the sliding sleeve 321 is slidably connected to the push rod 332. A support spring 37 is sleeved on the push rod 332, and the two ends of the support spring 37 are fixedly connected to the sliding sleeve 321 and the connecting block 352 respectively.

[0061] As can be seen from the above, by setting the sliding sleeve 321, the suction head tube 32 can slide relative to the push rod 332. Therefore, the distance between the suction head tube 32 and the lifting tube 35 can be changed, and the corrugated hose 36 connecting the suction head tube 32 and the lifting tube 35 has compression and stretching properties, which can maintain the connectivity between the suction head tube 32 and the lifting tube 35 when they are relatively close to and far away from each other, and avoid air leakage. By setting the support spring 37, when the suction head tube 32 does not touch the object, the suction head tube 32 and the lifting tube 35 remain relatively fixed. When the suction head tube 32 touches the electronic component, the support spring 37 can be squeezed to make it contract, thereby avoiding excessive squeezing pressure on the electronic component.

[0062] A return spring 38 is sleeved on the pressure rod 33 , and two ends of the return spring 38 are fixedly connected to the upper surface of the pressure plate 331 and the inner top wall of the housing 31 respectively.

[0063] As can be seen from the above, by setting the reset spring 38, when the pressure block 53 moves upward to release the pressure rod 33, under the action of the reset spring 38, the pressure plate 331 is pulled upward, causing the lifting tube 35 and the suction head tube 32 to slide upward and reset.

[0064] Example 3

[0065] like Figure 3 、 Figure 5 、 Figure 7 、 Figure 8 and Figure 9 As shown, the difference between this embodiment and the above embodiment is that sealing tubes 311 are provided at the upper and lower ends of the shell 31, and a sealing ring 312 is provided on the inner wall of the sealing tube 311. The sealing ring 312 is respectively slidably sealed with the suction head tube 32 and the pressure rod 33.

[0066] As can be seen from the above, by providing the sealing tube 311 and the sealing ring 312 , it is possible to avoid the shell 31 from being tightly sealed, thereby ensuring the stable suction force of the suction head tube 32 .

[0067] Both side walls of the shell 31 are provided with ventilation interfaces 313, and the suction end of the air pump 4 is connected to the suction pipe 41, and the suction pipe 41 is detachably connected to the ventilation interface 313. A connecting pipe 42 is provided between adjacent shells 31, and the two ends of the connecting pipe 42 are detachably connected to the adjacent ventilation interfaces 313 respectively, and a plug 43 is detachably installed on the ventilation interface 313. The ends of the connecting pipe 42 and the suction pipe 41 are provided with baffles, and a nut 44 is sleeved on the baffle. The end of the ventilation interface 313 is threadedly connected to the nut 44, and the plug 43 is threadedly connected to the end of the ventilation interface 313. A sealing gasket 45 is provided at one end of the suction pipe 41 and the connecting pipe 42 connected to the ventilation interface 313, and a sealing gasket 46 is provided inside the plug 43.

[0068] As can be seen from the above, in this embodiment, since the ventilation interfaces 313 on both sides of the shell 31 are threadedly connected to the nuts 44, that is, the ends of the ventilation interfaces 313 are provided with threads that are compatible with the nuts 44. Therefore, the ventilation interfaces 313 can be quickly connected and fixed with the exhaust pipe 41 and the connecting pipe 42 through the nuts 44, and the setting of the sealing gasket 45 can effectively prevent air leakage in the connection gap. By setting the plug 43 and the sealing gasket 46, the ventilation interfaces 313 that are not connected to the exhaust pipe 41 and the connecting pipe 42 are closed by the plug 43, so that the air pump 4 can form a stable negative pressure environment inside all the suction nozzles 3.

[0069] Example 4

[0070] like Figure 8 and Figure 10 As shown, the difference between this embodiment and the above embodiment is that a slotted plug 314 is fixedly installed on the outer surface of the shell 31, and a clamping block 21 is fixedly installed on the surface of the mounting frame 2 in a linear array, and the clamping block 21 is adapted to be plugged into the slotted plug 314, and a bolt threadedly connected to the slotted plug 314 passes through the slotted plug 314, and the bolt is adapted to be plugged into the clamping block 21.

[0071] As can be seen from the above, by providing the slotted insert 314, the clamping block 21 and the bolts, the nozzle 3 can be easily disassembled and assembled, so that different types of nozzles 3 can be easily replaced when performing patching on electronic components of different types.

[0072] The translation assembly 51 includes a threaded rod 511, a threaded sleeve 512 and a drive motor 513. The threaded rod 511 is rotatably mounted on the mounting frame 2. The threaded sleeve 512 is threadedly connected to the threaded rod 511. The electric push rod 52 is fixedly mounted on the threaded sleeve 512. A sliding hole 22 is opened on the mounting frame 2, and the sliding hole 22 is threadedly connected to the threaded sleeve 512.

[0073] As can be seen from the above, since the threaded sleeve 512 is threadedly connected to the threaded rod 511 rotatably mounted on the mounting frame 2 and is also slidably connected to the sliding hole 22 opened on the mounting frame 2, when the driving motor 513 drives the threaded rod 511 to rotate, the threaded sleeve 512 moves linearly therewith, thereby driving the electric push rod 52 to move horizontally.

[0074] Example 5

[0075] See also Figure 1 - Figure 11 The present invention also discloses a patch method, which comprises the following steps:

[0076] According to the size and weight of the electronic components to be mounted, nozzles 3 suitable for different types of electronic components are selected and installed at different positions on the mounting frame 2;

[0077] During the patch process, according to the model of the next electronic component to be patched, the pressing block 53 is controlled by the translation assembly 51 to move to the top of the corresponding suction nozzle 3, and the electric push rod 52 pushes the pressing block 53 to squeeze the pressure rod 33 of the corresponding suction nozzle 3, so that the suction head tube 32 of the corresponding suction nozzle 3 extends downward;

[0078] The translation drive mechanism within the base 1 controls the horizontal movement of the mounting frame 2, so that the downwardly extending nozzle 3 of the suction head tube 32 is aligned with the electronic component placed on the base 1. Next, the lifting mechanism drives the mounting frame 2 downward, allowing the suction head tube 32 to approach the electronic component.

[0079] The air pump 4 works, and through the connection with the suction nozzle 3, it generates suction at the suction head tube 32 to absorb the electronic component. After the absorption is completed, the lifting mechanism controls the mounting frame 2 to rise, so that the electronic component is separated from the placement position. The translation drive mechanism operates again, controlling the mounting frame 2 to move horizontally, and transports the suction nozzle 3 with the electronic component to the target patch position above the printed circuit board. Then, the lifting mechanism drives the mounting frame 2 to descend, so that the electronic component is close to the printed circuit board. After that, the air pump 4 stops working, and the electronic component is separated from the suction head tube 32.

[0080] The electric push rod 52 pushes the pressing block 53 to move upward to release the pressing rod 33, and the translation drive mechanism moves the mounting frame 2 back to the initial position to wait for the next patch operation.

[0081] While embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions, and variations may be made to these embodiments without departing from the principles and spirit of the invention, and that the scope of the invention is defined by the appended claims and their equivalents.

Claims

1. An automatic chip placement machine for electronic components and printed circuit boards, comprising a machine base, a mounting frame, a suction nozzle, and an air pump, wherein the suction nozzle and the air pump are both mounted on the mounting frame, and characterized in that: The suction nozzle includes a shell, a suction head tube and a pressure rod. The interior of the shell is connected to the air extraction end of the air pump through a pipeline system. The suction head tube and the pressure rod are slidably connected to the upper and lower ends of the shell respectively. When the pressure rod slides toward the interior of the shell, it can push the suction head tube to slide toward the outside of the shell. When the suction head tube slides toward the outside of the shell, the interior of the suction head tube is connected to the interior of the shell. The mounting frame is provided with a pressing mechanism, which includes a translation assembly, an electric push rod and a pressure block. The translation assembly is mounted on the mounting frame. The pressure block is adjusted in the horizontal direction by the translation assembly and in the vertical direction by the electric push rod, so that the pressure block pushes the pressure rod to slide toward the inside of the housing. A translation drive mechanism and a lifting mechanism are provided inside the machine base. The translation drive mechanism is used to control the horizontal movement of the mounting frame, and the lifting mechanism is used to control the vertical movement of the mounting frame, thereby realizing precise movement positioning of the suction nozzle in three-dimensional space.

2. The automatic chip mounter for mounting electronic components and printed circuit boards according to claim 1, characterized in that: The suction nozzle also includes a sealing plate and a lifting tube. The sealing plate is fixedly installed inside the shell, and a sealing block is provided at the lower end of the sealing plate. The lifting tube is slidably arranged inside the shell, and an inclined opening is provided at the upper end of the lifting tube. The inclined opening is adapted to be plugged into the sealing block. A corrugated hose is provided inside the shell, and both ends of the corrugated hose are fixedly connected to the lower end of the lifting tube and the upper end of the suction nozzle respectively, and the lifting tube and the suction nozzle are both connected to the interior of the corrugated hose.

3. The automatic chip mounter for mounting electronic components and printed circuit boards according to claim 2, characterized in that: A pressing plate is fixedly mounted on the lower end of the pressing rod, a pushing rod is fixedly mounted on the pressing plate, a connecting block is fixedly mounted on the outer side wall of the lifting tube, and the connecting block is fixedly connected to the pushing rod.

4. The automatic chip mounter for mounting electronic components and printed circuit boards according to claim 3, characterized in that: A sliding sleeve is fixedly installed on the outer wall of the suction head tube, and the sliding sleeve is slidably connected to the push rod. A support spring is sleeved on the push rod, and both ends of the support spring are fixedly connected to the sliding sleeve and the connecting block respectively.

5. The automatic chip mounter for mounting electronic components and printed circuit boards according to claim 3, characterized in that: A return spring is sleeved on the pressure rod, and two ends of the return spring are fixedly connected to the upper surface of the pressure plate and the inner top wall of the shell respectively.

6. The automatic chip mounter for mounting electronic components and printed circuit boards according to claim 1, characterized in that: The upper and lower ends of the shell are both provided with sealing tubes, the inner side wall of the sealing tube is provided with a sealing ring, and the sealing ring is respectively slidably sealed with the pipette head tube and the pressure rod.

7. The automatic chip mounter for mounting electronic components and printed circuit boards according to claim 1, characterized in that: The air vents are press-fitted into the vent tubes and the vent tubes are press-fitted into the vent tubes to release the venting agent, and the venting agent is passed through a pipe that is detachably connected to the vent tubes.

8. The automatic chip mounter for mounting electronic components and printed circuit boards according to claim 1, characterized in that: A slotted plug is fixedly mounted on the outer surface of the shell, and clamping blocks are fixedly mounted on the surface of the mounting frame in a linear array. The clamping blocks are adapted to be plugged into the slotted plug. Bolts threadedly connected to the slotted plug are passed through the slotted plug, and the bolts are adapted to be plugged into the clamping blocks.

9. The automatic chip mounter for mounting electronic components and printed circuit boards according to claim 1, characterized in that: The translation assembly includes a threaded rod, a threaded sleeve and a drive motor. The threaded rod is rotatably mounted on a mounting frame. The threaded sleeve is threadedly connected to the threaded rod. The electric push rod is fixedly mounted on the threaded sleeve. A sliding hole is provided on the mounting frame, and the sliding hole is threadedly connected to the threaded sleeve.

10. A chip placement method using an automatic chip placement machine for mounting electronic components and printed circuit boards according to any one of claims 1 to 9, characterized in that: The specific steps are: According to the size and weight of the electronic components to be mounted, select nozzles suitable for different types of electronic components and install them in different positions on the mounting frame; During the patch process, according to the model of the next electronic component to be patched, the pressing block is controlled by the translation component to move to the top of the corresponding suction nozzle, and the electric push rod pushes the pressing block to squeeze the pressure rod of the corresponding suction nozzle, so that the suction head tube of the corresponding suction nozzle extends downward; The translation drive mechanism inside the machine base controls the horizontal movement of the mounting frame, so that the downwardly extending nozzle of the suction head tube is aligned with the electronic component placed on the machine base. Then, the lifting mechanism drives the mounting frame downward, so that the suction head tube is close to the electronic component. The air pump works, generating suction at the suction head tube through its connection with the suction nozzle, sucking the electronic component. After the suction is completed, the lifting mechanism controls the mounting frame to rise, so that the electronic component is separated from the placement position. The translation drive mechanism operates again, controlling the mounting frame to move horizontally, and transporting the suction nozzle with the electronic component to the target patch position above the printed circuit board. Subsequently, the lifting mechanism drives the mounting frame to descend, so that the electronic component is close to the printed circuit board. After that, the air pump stops working, and the electronic component is separated from the suction head tube. The electric push rod pushes the pressing block upward to release the pressing rod, and the translation drive mechanism moves the mounting frame back to the initial position, waiting for the next patch operation.

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