Steel surface machining residual stress regulation and control device

Abstract

The invention relates to a steel surface machining residual stress regulating device, which relates to the technical field of steel surface machining, and comprises a walking mechanism, a rotating module, a stress regulating module, a scrap cleaning module, a swing driving structure and the like. The walking mechanism is positioned and moved through a pipe end clamp and a lead screw, the rotating module is connected with the stress regulation and control module and the chip removal module through a swing rod, and the chip removal module is composed of a frame-shaped chip removal brush, a chip suction pipeline and a chip removal rod internally provided with a spraying channel and connected with the swing rod through a mounting ring. By optimizing the mechanical structure design, the steel surface machining residual stress is effectively regulated and controlled, meanwhile, the scrap removing and spraying repairing functions are achieved, the machining efficiency and quality are improved, and the stability and reliability of device operation are ensured.

Description

Technical Field

[0001] The present application relates to the field of steel processing technology, and in particular to a residual stress control device for steel surface processing. Background Art

[0002] Steel parts are widely used in modern industry, particularly in aerospace, automotive, and other fields. With technological advancements, the quality requirements for steel parts are becoming increasingly stringent, and advances in surface processing have significantly improved the performance and service life of steel parts. However, the surface processing of steel parts inevitably generates residual stress, which directly affects the fatigue life and reliability of steel parts. Therefore, how to effectively control residual stress has become an important research direction in this field.

[0003] The existing Chinese patent with authorization announcement number CN113699472B discloses a method for electromagnetic coupling regulation of residual stress in an aluminum alloy engine bearing frame, which relates to the field of engine parts processing technology. It includes using different electromagnetic parameters to perform dynamic electromagnetic coupling processing on the four stages of the bearing frame: blanking, rough processing, semi-finishing and finishing. The stress and strain generated by the coupling of pulsed electric field and pulsed magnetic field and the electromagnetic field provide energy for electron transition and rearrangement, slowing down or reducing lattice distortion, and ultimately achieving effective regulation of the residual stress caused by material forming and processing in these four stages. By reducing residual tensile stress and residual compressive stress, the yield and service life of the bearing frame are improved.

[0004] The above-mentioned related technologies have the following defects: for tubular steel parts, metal debris often falls off the inner wall during the processing, and the metal debris of different sizes on the surface will also affect the effect of subsequent stress regulation, so it needs to be improved. Summary of the Invention

[0005] In order to improve the effect of stress regulation, the present application provides a steel surface processing residual stress regulation device.

[0006] The present application provides a device for regulating residual stress in steel surface machining, which adopts the following technical solution: A residual stress control device for steel surface processing includes a walking mechanism, the walking mechanism has a rotating module, the rotating module is connected to a stress control module and a chip cleaning module, the chip cleaning module includes a chip cleaning brush and a chip suction pipe, the chip cleaning brush is frame-shaped and is located on the circumferential outside of the stress control module, and the chip suction pipe is located on the inside of the chip cleaning brush.

[0007] By adopting the above technical solution, the walking mechanism can drive the rotating module to move and rotate inside the tubular workpiece, thereby achieving comprehensive treatment of the inner wall of the tube. The chip cleaning brush is arranged on the circumferential outside of the stress control module, which can effectively remove metal debris from the inner wall of the tube to prevent the debris from affecting the stress control effect. The chip suction pipe is located on the inner side of the chip cleaning brush, which can promptly suck away the debris swept by the chip cleaning brush to prevent the debris from re-adhering to the inner wall of the tube. The stress control module synchronously performs residual stress treatment on the inner wall of the tube during the rotation process, which improves the treatment efficiency and effect. By controlling the walking speed of the walking mechanism and the rotation speed of the rotating module, the effects of chip cleaning and stress control can be flexibly adjusted. The overall design realizes the coordinated operation of automatic chip cleaning and residual stress treatment inside the pipeline, significantly improving the treatment efficiency and quality.

[0008] Preferably, the rotating module is rotatably connected to a swing rod, the stress regulating module and the chip cleaning module are connected to the rotating module via the swing rod, and the rotating module is provided with a swing drive for driving the swing rod to rotate.

[0009] By adopting the above technical solution, the setting of the swing arm enables the stress control module and the chip cleaning module to change their angle relative to the rotation module, thereby achieving fine-tuning of the control range and effect. During the stress treatment process, changing the angle of the stress control module can adjust the area of its affected range, thereby optimizing the stress control effect at various locations on the workpiece. In addition, the change in the angle of the chip cleaning module can adjust the degree of contact between the chip cleaning brush and the inner wall of the pipe. When the chip cleaning brush is tilted, the degree of contact between the local area and the inner wall of the pipe increases, effectively improving the ability to remove adhered debris and enhancing the chip cleaning effect.

[0010] Preferably, the swing arm is rotatably connected to a mounting ring, the chip cleaning brush is connected to the swing arm through the mounting ring, and the swing arm is connected to a chip cleaning drive for driving the mounting ring to rotate.

[0011] By adopting the above technical solution, during the chip cleaning process, while the rotating module is continuously running, the chip cleaning drive runs synchronously, and the chip cleaning drive continuously drives the chip cleaning brush to rotate, thereby forming an outward thrust on the debris. After the debris is peeled off, it has the drive to move outward, reducing the debris from entering the range of action of the stress regulation module, thereby further improving the effect of stress treatment.

[0012] Preferably, a telescopic drive is connected between the rotating module and the swing rod, a fixed plate is provided at the driving end of the telescopic drive, a movable plate is provided at the end of the swing rod, a sliding rod is fixed to the movable plate, a sliding hole is provided on the fixed plate for the sliding rod to pass through, and a buffer elastic member is connected between the fixed plate and the movable plate.

[0013] By employing this technical solution, the telescopic drive adjusts the spacing between the stress control module and the chip cleaning module relative to the inner wall of the pipe. Combined with the specific angle of the swing drive, this allows for precise adjustment of the module's position. The elastic buffer between the fixed and movable plates provides a cushioning effect during adjustment, reducing damage to the equipment caused by excessive force. The coordinated operation of the slide rod and the slide hole ensures the stability and precision of the swing rod's movement, thereby enhancing the adaptability and reliability of the overall device during residual stress control and chip cleaning.

[0014] Preferably, the mounting ring is provided with a plurality of chip cleaning rods along the circumference, the chip cleaning brush is connected to the surface of the chip cleaning rod, the chip cleaning rod includes a plurality of coaxially arranged chip cleaning segments, the outer sides of the ends of adjacent chip cleaning segments are rotatably connected, and a reset elastic member is provided between the ends of adjacent chip cleaning segments.

[0015] By adopting this technical solution, when the chip cleaning rod is pressed against the inner wall of the pipe, part of the chip cleaning segment can rotate relative to the axis, forming a nearly bent state. This structural design prevents the chip cleaning segment from directly scraping the inner wall of the pipe. At the same time, the chip cleaning brush fills the non-parallel gap between the chip cleaning rod and the inner wall of the pipe, which helps to increase the brushing area and improve the debris removal effect. In addition, the chip cleaning brushes on several chip cleaning rods are staggered, which enhances the sealing of the inner side of the chip cleaning brush, improves the stability of the chip suction pipe when removing debris, and further optimizes the overall effect of chip cleaning and stress regulation.

[0016] Preferably, a spraying channel is axially arranged inside the chip cleaning rod, the spraying channel is arranged inside a plurality of chip cleaning segments, and the spraying channel is connected to a spray repair module.

[0017] By adopting the above technical solution, when the chip cleaning rod and the inner wall of the pipe are pressed against each other to a certain extent and then deformed, a gap will appear between adjacent chip cleaning sections. At this time, the spray channel can spray repair materials, such as epoxy-metal composite powder, on the stress regulation area from the gap to form a metallurgical bonding layer on the damaged area during the processing, thereby not only cleaning debris and eliminating stress, but also repairing damage simultaneously.

[0018] Preferably, adjacent chip cleaning sections are connected with guide elbows, and the guide elbows are provided with guide holes on the inner side facing the stress regulating area.

[0019] By adopting this technical solution, the guide elbow can bend freely when the chip cleaning section bends, thereby protecting and sealing the gap between adjacent chip cleaning sections. Repair material is sprayed only into the stress-regulating area through the guide hole, which makes the spray repair more focused and effectively improves the repair effect.

[0020] Preferably, the end wall of the chip cleaning section is provided with a giveway hole, the reset elastic member is located in the giveway hole, the side wall of the giveway hole away from the spray channel is provided with a sliding hole, an adjustment rod is slidably arranged in the sliding hole, the end of the adjustment rod extends into the giveway hole, the end of the reset elastic member is provided with a hanging ring for the adjustment rod to pass through, and the side wall of the giveway hole close to the spray channel is provided with several adjustment holes for the adjustment rod to be threadedly connected.

[0021] By adopting this technical solution, the end walls of the chip cleaning segments are provided with clearance holes and equipped with reset springs, which enable the relative positions of the chip cleaning segments to be adjusted and restored, thereby adapting to the inner walls of pipes of varying diameters and shapes. The adjustment rod within the sliding hole, in conjunction with the hanging ring, allows the tension of the reset spring to be adjusted according to actual needs, optimizing the working state of the chip cleaning brush to better fit the inner wall of the pipe. In addition, the threaded connection between the adjustment rod and the various adjustment holes allows the tension of the reset spring to be precisely controlled, ensuring that the chip cleaning module maintains excellent chip cleaning performance under different operating conditions.

[0022] Preferably, a blocking piece is connected to the middle of the resetting elastic member, and the blocking piece is adapted to the clearance hole and can slide along the clearance hole.

[0023] By adopting the above technical solution, the baffle automatically moves in the clearance hole as the reset elastic member deforms, maintaining the blockage of the middle part of the clearance hole and reducing the leakage of repair material from the clearance hole and the sliding hole during the spray repair process.

[0024] Preferably, the walking mechanism includes a detachable pipe end clamp installed to the end of the pipe fitting, the pipe end clamp is fixedly connected to a screw rod, the rotating module includes a walking sleeve threaded onto the outside of the screw rod, the walking sleeve is fixedly connected to a mounting plate, and the mounting plate is circumferentially provided with an injection device, and the injection device is arranged to be radially inclined compared to the pipe fitting.

[0025] By adopting the above technical solution, the jet device can apply a certain thrust in the circumferential direction of the mounting disk, promote the rotation of the mounting disk, and then realize the rotation of the rotating module as a whole, and finally realize walking and maintaining rotation under the action of the screw rod and the walking sleeve.

[0026] In summary, this application includes at least one of the following beneficial technical effects: 1. The chip cleaning module and stress control module are driven by the traveling mechanism to work synchronously inside the tubular workpiece. The chip cleaning brush and the chip suction pipe can effectively remove metal debris, preventing the debris from affecting subsequent stress control, thereby improving the overall stress control effect; 2. The stress control module and the chip cleaning module are integrated into one design. The rotation of the rotating module achieves uniform treatment of the pipe wall. At the same time, the tightness of the chip cleaning brush can be adjusted to enhance the cleaning ability of adhered debris and further improve the accuracy of stress control. 3. The air jet device provides additional driving force for the rotating module, optimizing the operating efficiency of the device. BRIEF DESCRIPTION OF THE DRAWINGS

[0027] Figure 1 This is a schematic structural diagram of an embodiment of the present application; Figure 2 In the embodiment of this application Figure 1 The cross-sectional view along the AA direction is used to illustrate the connection relationship between the air injection device and the mounting plate; Figure 3 This is a structural diagram illustrating the connection relationship between the mounting plate, the stress regulating module, and the chip cleaning module in an embodiment of the present application; Figure 4 This is a structural diagram illustrating the connection relationship between adjacent chip cleaning segments in an embodiment of the present application; Figure 5 This is a structural diagram illustrating the connection between the chip cleaning rod and the guide elbow in an embodiment of the present application; Figure 6 In the embodiment of this application Figure 5 The cross-sectional view along the BB direction is a structural diagram illustrating the connection relationship between the reset elastic member and the chip cleaning section.

[0028] In the picture: 1. Traveling mechanism; 11. Pipe end clamp; 12. Screw; 2. Rotating module; 21. Traveling sleeve; 22. Mounting plate; 23. Jet device; 24. Telescopic drive; 25. Swing rod; 251. Swing drive; 26. Movable plate; 27. Sliding rod; 28. Fixed plate; 281. Buffer elastic member; 29. Limit nut; 3. Stress control module; 4. Chip cleaning module; 41. Chip cleaning brush; 42. Chip suction pipe; 43. Mounting ring; 44. Chip cleaning rod; 440. Spray channel; 441. Chip cleaning section; 45. Chip cleaning drive; 46. Gear ring; 47. Gear; 48. Reset elastic member; 49. Spray repair module; 5. Guide elbow; 51. Guide hole; 6. Clearance hole; 61. Sliding hole; 62. Adjustment rod; 63. Hanging ring; 64. Adjustment hole; 65. Blocking piece. DETAILED DESCRIPTION

[0029] The following will be combined with the accompanying drawings to clearly and completely describe the technical solutions in the embodiments of the present invention. The described embodiments are only possible technical implementations of the present invention and are not all possible implementations. Those skilled in the art can fully combine the embodiments of the present invention to derive other embodiments without creative work, and these embodiments are also within the scope of protection of the present invention.

[0030] Residual stress is easily generated during surface machining of steel parts. Metal debris often falls from the inner walls of tubular steel parts, which can affect the subsequent stress control. Therefore, this application primarily utilizes a residual stress control device for steel surface machining. This device utilizes a traveling mechanism to drive a chip cleaning module and a stress control module to operate simultaneously, achieving both automatic chip cleaning and stress control. Example

[0031] Reference Figure 1 The steel surface machining residual stress control device provided in the embodiment of the present application includes a travel mechanism 1, a rotation module 2, a stress control module 3, and a chip cleaning module 4. The travel mechanism 1 includes a detachable pipe end clamp 11 mounted to the end of a pipe fitting. The pipe end clamp 11 has a U-shaped clamping portion for clamping the thick wall of the pipe fitting and clamping and fixing it by tightening with bolts. The pipe end clamp 11 is fixedly connected to a screw rod 12, which extends into the interior of the pipe fitting and is coaxial with the pipe fitting.

[0032] Reference Figure 1 and Figure 2 The rotating module 2 includes a traveling sleeve 21 threadedly sleeved to the outside of the screw rod 12 and a mounting plate 22 fixedly arranged at the end of the traveling sleeve 21. The mounting plate 22 is provided with jet devices 23 on the circumference. The jet direction of the jet device 23 is inclined compared to the radial direction of the pipe fitting. In this embodiment, it is vertically set. During the continuous jetting process of the jet device 23, a thrust can be applied to the circumference of the mounting plate 22, thereby promoting the rotation of the mounting plate 22, and achieving walking and maintaining rotation under the action of the screw rod 12 and the traveling sleeve 21.

[0033] Reference Figure 3 The mounting plate 22 is connected to a swinging rod 25 via a telescopic drive 24. The telescopic drive 24 is a pneumatic cylinder with a fixed plate 28 at the drive end. A movable plate 26 is mounted at the end of the swinging rod 25. A sliding rod 27 is fixed to the movable plate 26. The fixed plate 28 has a through-hole through which the sliding rod 27 fits. The cooperation between the sliding rod 27 and the through-hole enables stable sliding between the movable plate 26 and the fixed plate 28. Furthermore, a limit nut 29 is threadedly mounted on the end of the sliding rod 27. The limit nut 29 is located on the side of the fixed plate 28 away from the movable plate 26 to achieve adjustable relative position. Furthermore, a buffering elastic member 281 is connected between the fixed plate 28 and the movable plate 26. In this embodiment, the buffering elastic member 281 is a spring that provides buffering during the adjustment process of the telescopic drive 24.

[0034] The swing arm 25 is rotatably connected to the movable plate 26. A swing drive 251, a motor, is fixedly mounted on the sidewall of the movable plate 26 and controls the swing arm 25's relative swinging motion relative to the movable plate 26. The end of the swing arm 25, distal from the movable plate 26, is connected to the stress control module 3 and the chip cleaning module 4. This allows the stress control module 3's active area and angle of action to be adjusted during its swing. The stress control module 3's transmitter head is mounted to the bottom of the swing arm 25 and is used to perform stress control on specific areas of the pipe's inner wall within its range. The chip cleaning module 4 includes a frame-shaped chip cleaning brush 41 and a chip suction duct 42. The chip cleaning brush 41 is located circumferentially outside the stress control module 3, while the chip suction duct 42 is located inside the brush 41 and connected to the swing arm 25. The chip cleaning brush 41 directly contacts the inner wall of the pipe, sweeping away debris. The chip suction duct 42 is used to promptly remove debris that enters the stress control area.

[0035] The process of stress regulation inside the tubular workpiece is to use the walking mechanism 1 to walk along the inside of the pipe. During the walking, the rotating module 2 continuously drives the stress regulation module 3 and the chip cleaning module 4 to rotate. During the rotation, the chip cleaning module 4 can process the metal debris inside the pipe, and the chip cleaning brush 41 brushes the debris. Then, the chip suction pipe 42 is used to generate negative pressure inside the chip cleaning brush 41 and finally remove the debris. In addition, during the rotation of the rotating module 2, the stress regulation module 3 can simultaneously perform residual stress treatment on the inner wall of the pipe, and the actual stress treatment method is selected as needed. In this way, automatic chip cleaning inside the pipe can be achieved while automatically performing residual stress treatment. By controlling the walking speed of the walking mechanism 1 and the rotation speed of the rotating module 2, the effects of chip cleaning and residual stress treatment can be adjusted. In addition, the circumferentially arranged chip cleaning brushes 41 can make the scope of action of the residual stress treatment more concentrated, which is more conducive to improving the local stress treatment effect.

[0036] During the stress treatment process, the swing drive 251 can also be used to realize the angle of the stress control module 3 and the chip cleaning module 4 compared to the radial direction of the pipe. Taking the influence range of the stress control module 3 as a fan-shaped area as an example, when the angle of the stress control module 3 changes, the influence range area of the stress control module 3 also changes, and the stress control effect distributed to various parts of the workpiece also changes accordingly. Therefore, in this way, the control range and control effect can be finely adjusted. In addition, when the angle of the chip cleaning module 4 changes, the degree of contact between the circumferentially arranged chip cleaning brush 41 and the inner wall of the pipe also changes. When the chip cleaning brush 41 tilts, the degree of contact between the chip cleaning brush 41 and the inner wall of the pipe is different, and the chip cleaning brush 41 is locally more closely contacted with the inner wall of the pipe. This state is suitable for situations where there is debris stuck to the inner wall of the pipe. The chip cleaning brush 41 is in a tight state to peel off the stuck debris, thereby improving the treatment effect of the stuck debris.

[0037] In other embodiments, the chip suction pipe 42 can also be connected to the jet device 23. The jet device 23 generates negative pressure inside the chip suction pipe 42 to suck chips, which are then ejected from the jet device 23 after filtering, and the chips are sucked and rotated simultaneously.

[0038] Reference Figure 3 The outer side of the swing arm 25 is sleeved with a mounting ring 43 and is rotatably connected to it. The mounting ring 43 is circumferentially connected to a number of chip cleaning rods 44. The chip cleaning brush 41 is connected to the surface of the chip cleaning rod 44. The chip cleaning brush 41 is made of a soft, wear-resistant material, such as nylon or pig bristles. In the figure, it is only set at the bottom of the chip cleaning rod 44 for a clearer display. In reality, the chip cleaning brush 41 can be set along the entire surface of the chip cleaning rod 44. In addition, the swing arm 25 is connected to a chip cleaning drive 45 for driving the mounting ring 43 to rotate. The chip cleaning drive 45 is a motor that cooperates with a ring gear 46 and a gear 47 to realize the rotation of the mounting ring 43. The ring gear 46 is coaxial with the mounting ring 43 and is fixedly connected. The gear 47 is mounted on the drive shaft of the chip cleaning drive 45. During the chip cleaning process, while the rotating module 2 is continuously running, the chip cleaning drive 45 runs synchronously, and the chip cleaning drive 45 continuously drives the chip cleaning brush 41 to rotate, thereby forming an outward thrust on the debris. After the debris is peeled off, it has a tendency to move outward, reducing the debris from entering the range of action of the stress regulation module 3, thereby further improving the effect of stress treatment.

[0039] Reference Figure 4 and Figure 5The chip cleaning rod 44 includes several coaxially arranged chip cleaning segments 441. The chip cleaning segments 441 are made of high-hardness stainless steel and have good wear resistance. In this embodiment, two segments are taken as an example. The ends of adjacent chip cleaning segments 441 are rotatably connected on the outside. A reset elastic member 48 is set between the ends of adjacent chip cleaning segments 441. In this embodiment, the reset elastic member 48 adopts an elastic rope structure. The two ends of the reset elastic member 48 are respectively fixed to the ends of adjacent chip cleaning segments 441. The elastic force of the reset elastic member 48 ensures that the chip cleaning segment 441 can automatically reset after being bent by external force. When the chip cleaning rod 44 is squeezed against the inner wall of the pipe, the chip cleaning segment 441 at the bottom rotates relative to the axis of the chip cleaning segment 441 above, so that the entire chip cleaning rod 44 is in an approximately bent state. At this time, the chip cleaning brush 41 on the surface of the chip cleaning section 441 at the bottom abuts against the inner wall of the pipe and can fill the gap between the chip cleaning section 441 at the bottom and the inner wall of the pipe as much as possible, especially when the chip cleaning section 441 at the bottom is closer to the inner wall of the pipe, the chip cleaning brush 41 can, on the one hand, brush the inner wall of the pipe to a greater extent, and on the other hand, avoid scratching between the chip cleaning section 441 and the inner wall of the pipe.

[0040] Reference Figure 3 and Figure 4A spray channel 440 is also axially arranged inside the chip cleaning rod 44, and the spray channel 440 is connected to the spray repair module 49. The spray repair module 49 is connected to the spray channel 440 through a control valve, and is used to transport repair materials, such as epoxy-metal composite powder, into the spray channel 440. The spray channel 440 is actually arranged inside several chip cleaning segments 441, but the chip cleaning segment 441 located at the bottom does not have a spray channel 440. When the chip cleaning rod 44 and the inner wall of the pipe are abutted to a certain extent and then deformed, a gap automatically leaks out between adjacent chip cleaning segments 441. At this time, the spray channel 440 sprays the repair material from the gap to the stress control area, so that a metallurgical bonding layer is formed in the damaged area during the processing, thereby simultaneously achieving debris cleaning, stress elimination and damage repair. Whether or not to actually perform spray repair depends on the damage to the inner wall of the pipe. On the one hand, the opening and closing of the spray repair module 49 can be directly controlled by the control valve. On the other hand, whether the chip cleaning segments 441 are bent (i.e., whether the chip cleaning module 4, especially the chip cleaning brush 41, is in working condition) can be directly used to automatically control whether the damage repair is enabled. For example, when a certain processing operation on the inner wall of the pipe causes damage to all parts of the inner wall of the pipe, the chip cleaning brush 41 can be pressed against the inner wall of the pipe to clean chips while automatically repairing the damage. The damage repair will automatically stop when the chip cleaning brush 41 no longer presses against the inner wall of the pipe. In addition, the chip cleaning brushes 41 of several chip cleaning rods 44 are staggered with each other, thereby further enhancing the sealing effect of the inner side of the chip cleaning brush 41, and providing higher stability when the chip suction pipe 42 sucks away internal debris. For example, when the chip cleaning module 4 is tilted compared to the pipe diameter, it can cause different sealing effects in different circumferential directions. In this state, the chip suction pipe 42 can realize the air flow from a specific direction of the chip cleaning module 4 into the inside of the chip cleaning module 4 during the chip suction process. In combination with the rotating module 2 and the swing drive 251, more flexible direction adjustment can be performed.

[0041] Reference Figure 4 and Figure 5 A guide elbow 5 is sleeved between adjacent cleaning segments 441. Made of a flexible material, such as silicone or rubber, the guide elbow 5 can bend freely in accordance with the bending state of the adjacent cleaning segments 441, while protecting and sealing the gap between the two adjacent cleaning segments 441. A guide hole 51 is provided on the inner side of the guide elbow 5 facing the stress control area. During the spray repair process in the gap between the cleaning segments 441, only the guide hole 51 is left for spraying the repair material toward the stress control area, thereby concentrating the spraying range and improving the repair effect.

[0042] Reference Figure 5 and Figure 6The end wall of the chip cleaning segment 441 is provided with a clearance hole 6 for accommodating the reset elastic member 48. When the end walls of adjacent chip cleaning segments 441 are in contact, the reset elastic member 48 is located in the space enclosed by the two clearance holes 6. The side wall of the clearance hole 6 away from the injection channel is provided with a sliding hole 61. An adjustment rod 62 is slidingly provided in the sliding hole 61. The end of the adjustment rod 62 extends into the clearance hole 6 and can slide axially along the chip cleaning segment 441 in the sliding hole 61. The end of the reset elastic member 48 is provided with a hanging ring 63 for the adjustment rod 62 to pass through. The side wall of the clearance hole 6 close to the injection channel is provided with a plurality of adjustment holes 64 for the adjustment rod 62 to be threadedly connected. The reset elastic member 48 is tensioned between the two adjacent chip cleaning segments 441 by means of two adjustment rods 62 cooperating with the hanging ring 63. The tensioning degree of the reset elastic member 48 is adjusted by adjusting the adjustment hole 64 to which the adjustment rod 62 is threadedly connected. Furthermore, a stopper 65 is fixedly connected to the middle portion of the reset elastic member 48. This stopper 65 fits within the clearance hole 6 and can slide along the clearance hole 6. Made of high-strength plastic, the stopper 65 does not affect the expansion and contraction of the reset elastic member 48. As the reset elastic member 48 deforms, it automatically moves within the clearance hole 6, maintaining a seal around the middle portion of the clearance hole 6 and reducing leakage of repair material from the clearance hole 6 and the sliding hole 61 during the spray repair process.

[0043] The implementation principle of this embodiment is as follows: the walking mechanism 1 walks along the inside of the pipe, and the rotating module 2 continuously drives the stress control module 3 and the chip cleaning module 4 to rotate during the walking. The chip cleaning brush 41 in the chip cleaning module 4 brushes the debris, and the chip suction pipe 42 is used to generate negative pressure inside the chip cleaning brush 41 and finally remove the debris. During the rotation of the rotating module 2, the stress control module 3 performs residual stress treatment on the inner wall of the pipe, and adjusts the chip cleaning and stress treatment effects by controlling the walking speed of the walking mechanism 1 and the rotation speed of the rotating module 2. The circumferentially arranged chip cleaning brush 41 makes the scope of action of the residual stress treatment more concentrated, thereby improving the local stress treatment effect. In addition, the structural design of the chip cleaning rod 44 improves the chip cleaning efficiency, and the spray repair module 49 realizes synchronous damage repair, thereby improving the overall performance of the device.

[0044] The above are all preferred embodiments of the present application, and are not intended to limit the scope of protection of the present application. Therefore, any equivalent changes made based on the structure, shape, and principle of the present application should be included in the scope of protection of the present application.

Claims

1. A device for regulating residual stress in steel surface machining, characterized by: The invention comprises a walking mechanism (1), wherein the walking mechanism (1) has a rotating module (2), wherein the rotating module (2) is connected to a stress regulating module (3) and a chip cleaning module (4), wherein the chip cleaning module (4) comprises a chip cleaning brush (41) and a chip suction pipe (42), wherein the chip cleaning brush (41) is frame-shaped and is located on the circumferential outside of the stress regulating module (3), and the chip suction pipe (42) is located on the inner side of the chip cleaning brush (41).

2. The device for regulating residual stress in steel surface machining according to claim 1, characterized in that: The rotating module (2) is rotatably connected to a swing rod (25); the stress regulating module (3) and the chip cleaning module (4) are connected to the rotating module (2) via the swing rod (25); and the rotating module (2) is provided with a swing drive (251) for driving the swing rod (25) to rotate.

3. The device for regulating residual stress in steel surface machining according to claim 2, characterized in that: The swing rod (25) is rotatably connected to a mounting ring (43), the chip cleaning brush (41) is connected to the swing rod (25) via the mounting ring (43), and the swing rod (25) is connected to a chip cleaning drive (45) for driving the mounting ring (43) to rotate.

4. The device for regulating residual stress in steel surface machining according to claim 3, characterized in that: A telescopic drive (24) is connected between the rotating module (2) and the swing rod (25); a fixed plate (28) is provided at the driving end of the telescopic drive (24); a movable plate (26) is provided at the end of the swing rod (25); a sliding rod (27) is fixedly provided on the movable plate (26); a through hole is provided on the fixed plate (28) for the sliding rod (27) to pass through; and a buffer elastic member (281) is connected between the fixed plate (28) and the movable plate (26).

5. The device for regulating residual stress in steel surface machining according to claim 3, characterized in that: The mounting ring (43) is provided with a plurality of chip cleaning rods (44) along the circumference, the chip cleaning brush (41) is connected to the surface of the chip cleaning rod (44), the chip cleaning rod (44) includes a plurality of coaxially arranged chip cleaning segments (441), the outer sides of the ends of adjacent chip cleaning segments (441) are rotatably connected, and a reset elastic member (48) is provided between the ends of adjacent chip cleaning segments (441).

6. The device for regulating residual stress in steel surface machining according to claim 5, characterized in that: A spraying channel (440) is axially arranged inside the chip cleaning rod (44), the spraying channel (440) is arranged inside a plurality of chip cleaning segments (441), and the spraying channel (440) is connected to a spray repair module (49).

7. The device for regulating residual stress in steel surface machining according to claim 6, characterized in that: A guide bend (5) is connected between adjacent chip cleaning sections (441), and a guide hole (51) is provided on the inner side of the guide bend (5) facing the stress regulating area.

8. The device for regulating residual stress in steel surface machining according to claim 5, characterized in that: The end wall of the chip cleaning section (441) is provided with a clearance hole (6), the reset elastic member (48) is located in the clearance hole (6), the side wall of the clearance hole (6) away from the spray channel (440) is provided with a sliding hole (61), an adjusting rod (62) is slidably provided in the sliding hole (61), the end of the adjusting rod (62) extends into the clearance hole (6), the end of the reset elastic member (48) is provided with a hanging ring (63) for the adjusting rod (62) to pass through, and the side wall of the clearance hole (6) close to the spray channel (440) is provided with a plurality of adjusting holes (64) for the adjusting rod (62) to be threadedly connected.

9. The device for regulating residual stress in steel surface machining according to claim 8, characterized in that: A blocking piece (65) is connected to the middle of the resetting elastic member (48), and the blocking piece (65) is adapted to the clearance hole (6) and can slide along the clearance hole (6).

10. The device for regulating residual stress in steel surface machining according to claim 1, characterized in that: The walking mechanism (1) comprises a detachable pipe end clamp (11) mounted on the end of the pipe fitting, wherein the pipe end clamp (11) is fixedly connected to a screw rod (12), and the rotating module (2) comprises a walking sleeve (21) threadedly sleeved on the outside of the screw rod (12), wherein the walking sleeve (21) is fixedly connected to a mounting plate (22), and an air jet device (23) is circumferentially arranged on the mounting plate (22), and the air jet device (23) is arranged to be inclined relative to the radial direction of the pipe fitting.

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