Semiconductor device posture correction device
Through the driving and material stop mechanism of the attitude correction device of the semiconductor device, automatic adjustment and material separation of the pin direction of the semiconductor device are realized, solving the problems of low efficiency and low accuracy in the prior art, and improving production efficiency and quality.
Patent Information
- Application Number
- CN202510929067.1
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2025-07-07
- Publication Date
- 2025-08-15
AI Technical Summary
In the prior art, the pin direction adjustment efficiency of semiconductor devices is low, manual adjustment takes a long time and is prone to errors, and the accuracy of mechanical equipment sorting is not high, resulting in production efficiency and quality problems.
The attitude correction device of semiconductor devices is adopted, and the material distribution mechanism is driven to classify according to the direction of the pin through the driving mechanism, and the material distribution rhythm is controlled by the material barrier mechanism, and combined with the automatic disk loading device to improve the material distribution accuracy.
It significantly improves the accuracy and efficiency of material separation of semiconductor devices, reduces manual adjustment time and error rate, and reduces production costs.
Smart Images
Figure CN120482683A_ABST
Abstract
Description
Technical Field
[0001] The present invention relates to the technical field of semiconductor device and circuit board connection, and in particular to a semiconductor device posture correction device. Background Art
[0002] During the PCB pin soldering process, semiconductor device pin orientation adjustment presents a significant efficiency bottleneck. Currently, industrial control board production lines require manual placement of 25,000 DIP-packaged relays per month. Operators must adjust the pin orientation piece by piece (with a downward orientation rate of ≥99.5%), consuming 4.2 hours per 1,000 pieces per day. This process contributes to a high 18% of overall costs, and fatigue leads to a 3.7% pin orientation error rate (compared to the industry average of 1.2%).
[0003] The limitations of manual operation include: first, adjusting a single component takes approximately 1.5 seconds (including visual positioning and manual flipping), while automated pin insertion equipment theoretically can process 1,200 components per minute, making manual efficiency only 1 / 50th of that of mechanized processes. Second, quality risks are prone to occur. For example, a single batch of 5,000 optocoupler components resulted in 12.3% defective solder joints due to manual placement errors.
[0004] Problems with mechanical placement include: first, the sorting pass rate of traditional vibrating hoppers is only 82%, frequently requiring secondary manual monitoring and intervention. Second, while industrial cameras are used to monitor the process and placement, existing 2D vision positioning systems only have a 91% accuracy rate for identifying the pin orientation of some packaged components due to reflections and occlusions. Summary of the Invention
[0005] The present invention provides a semiconductor device posture correction device to address the deficiencies of the above-mentioned prior art and solve the problem of low accuracy in the posture calibration of the existing equipment, and has strong practicality.
[0006] In order to achieve the purpose of the present invention, the following technologies are proposed: A semiconductor device posture correction device includes a vertical back plate, a drive mechanism is provided on the back side of the vertical back plate, a material separation mechanism is provided on the front side of the vertical back plate, the material separation mechanism is connected to the drive mechanism, a material stop mechanism is provided on the back side of the vertical back plate, and a pair of material guides are installed at the lower end of the material separation mechanism. The drive mechanism is used to drive the components in the material separation mechanism to rotate, so that the material separation mechanism can classify the semiconductor device according to the orientation of the pins, and the classified devices are transported to the material guides and placed on the tray by an automatic tray loading device. Since the positioning is based on the orientation of the pins of the semiconductor device during the material separation process, the accuracy of the material separation is improved. The material stop mechanism can provide the material separation mechanism with a rated number of semiconductors to control the material separation rhythm and also improve the accuracy of the material separation.
[0007] Furthermore, the driving mechanism includes a plurality of mounting rods connected to the vertical back plate by threads, a supporting sleeve is provided on the mounting rod, the inner end of the supporting sleeve abuts the back side of the vertical back plate, the outer end of the supporting sleeve is provided with a fixing plate, the mounting rod is passed through the fixing plate, and a planetary reducer is installed on the back side of the fixing plate, the input shaft of the planetary reducer is connected to the motor, the motor is fixed to the planetary reducer, the output shaft of the planetary reducer is connected to the turntable, a rotating arm is provided on the turntable, an action wheel is provided for rotation at the inner end of the rotating arm, a rotating shaft is provided for rotation on the vertical back plate, an inner end of the rotating shaft is formed with an inner disk, the inner disk is located on the front side of the vertical back plate, a rotating disk is fixed to the rotating shaft by a pin, and the rotating disk is provided with a circular array around the axial direction of the rotating shaft. There are four U-shaped grooves, the outer ends of the U-shaped grooves are open, and an inward-concave arc groove is formed between each adjacent U-shaped groove. When the action wheel and the U-shaped groove are not in action, the turntable is located in one of the arc grooves, and there is a fan-shaped notch on the turntable. When the action wheel acts on the U-shaped groove and drives the rotating shaft to rotate, the arc groove and the fan-shaped notch correspond to ensure that the action wheel can drive the rotating disk to rotate, so as to limit the rotation of the rotating disk through the turntable to avoid affecting the distribution and discharge of semiconductors due to the rotation of the rotating shaft when the distribution mechanism distributes semiconductors and moves semiconductors, and the driving mode of this driving mechanism is intermittent rotation, which provides sufficient time for the distribution and discharge of semiconductors.
[0008] Furthermore, the inner wall of the fixed plate is formed with a convex portion protruding from its inner wall, and the upper and lower ends of the convex portion are symmetrically provided with oblique grooves, the outer ends of the oblique grooves extend inwardly, and the outer ends of the oblique grooves are connected by vertical grooves. The rotating arm includes a connecting platform coaxially fixed to the turntable by screws, and the output shaft of the planetary reducer is fixed to the connecting platform by pins. A pair of side plates parallel to each other are formed on the outer periphery of the connecting platform, and strip holes are provided on the side plates. A guide rod is passed through the strip hole, and both ends of the guide rod are connected to a limit nut by a threaded connection. The limit nut is located on the side On the outside of the plate, a movable head is provided on the guide rod, and the movable head is located between the side plates. A sleeve rod is connected to the movable head through a thread, and the sleeve rod is passed through the connecting platform. A spring is sleeved on the sleeve rod, and the spring is located between the connecting platform and the movable head. The axle on the action wheel is rotatably provided on the movable head, and a roller is also fixed to the outer end of the axle on the action wheel. The roller moves in the inclined groove, vertical groove and inner side of the fixed plate. Through the setting of the inclined groove and vertical groove, when the roller moves therein, the stability of the rotation of the rotating arm can be ensured, and the setting of the spring can make the rotating arm have adaptive ability.
[0009] Furthermore, the material distribution mechanism includes a fixing ring fixed to the vertical back plate by screws, a cover plate is fixed to the front end of the fixing ring by screws, an inner turntable is provided for rotation inside the fixing ring, a circular groove is formed in the front end opening of the inner turntable, the inner turntable is mounted on the inner disk by screws, a middle round block is provided in the circular groove, the middle round block is mounted on the cover plate by screws, the inner turntable can drive the semiconductor to move, and the middle round block can prevent the semiconductor with incorrect posture from moving or allow the semiconductor with correct posture to pass through, so that the material distribution operation can be completed according to the pins of the semiconductor, and the fixing ring plays a role of limiting the semiconductor to avoid the problem of uncontrollable discharge and distribution of the semiconductor.
[0010] Furthermore, a first rectangular hole is formed at the lower end of the fixed ring, and a pair of mutually parallel first embedded grooves are formed on the inner wall of the first rectangular hole. The first rectangular hole is only used for discharging semiconductors with pins facing inward, while semiconductors with pins facing outward will not be discharged outward due to the limitation of its hole structure, thereby improving the accuracy of material distribution. A first groove is formed at the lower end of the fixed ring at a position opposite to the first rectangular hole. The first groove is used for discharging semiconductors with pins facing outward. The second embedded groove is formed on the outer periphery of the upper end of the fixed ring with a feed arm. The feed arm is provided with a feed groove. The inner end of the feed groove passes through the inner periphery of the fixed ring. The bottom of the feed groove is provided with a pair of mutually parallel third embedded grooves. The outer end of the feed groove is connected to the output trough of the vibrating hopper. The third embedded groove thereon provides an escape space for semiconductors with pins facing inward.
[0011] The outer end of the first rectangular hole extends downwardly at an angle, and the angle between the length direction of the first rectangular hole and the vertical direction is 45 degrees. The outer end of the first groove extends downwardly at an angle, and the inclination direction of the first groove is symmetrical with the inclination direction of the first rectangular hole along the vertical direction. The angle between the length direction of the first groove and the vertical direction is 45 degrees. The 45-degree inclination ensures that the first rectangular hole and the like are evenly located on the fixing ring, and when the inner turntable rotates 90 degrees, it ensures that the structure thereon can always be connected to the feed groove, the first groove and the first rectangular hole. The feed groove is located on the extension line of the first rectangular hole, and the length direction of the feed groove is consistent with the inclination direction and inclination angle of the first rectangular hole.
[0012] Furthermore, four second grooves are provided in a circular array at the front end of the inner turntable, and the length directions of each pair of adjacent second grooves are perpendicular to each other. A pair of fourth embedded grooves parallel to each other are provided at the bottom of the second grooves. The second grooves are used for the transfer of semiconductors, and whenever the inner turntable rotates 90 degrees, one of the second grooves will be connected to the feed groove, and at the same time, there is a second groove connected to the first rectangular hole to facilitate the discharge of the pin toward the inner semiconductor, and at the same time, there is a second groove connected to the first groove to discharge the pin toward the outer semiconductor.
[0013] Furthermore, the central block has a second rectangular hole extending through its circumference. A pair of parallel fifth recesses are formed on the inner wall of the second rectangular hole. The central block also has a third rectangular hole extending through its circumference. A pair of parallel sixth recesses are formed on the outer wall of the third rectangular hole. The second rectangular hole communicates with the feed groove and the first rectangular hole, and the third rectangular hole communicates with the first groove. When the second groove communicates with the second rectangular hole, the feed groove, and the first rectangular hole, semiconductor devices with their leads facing inward move outward along the second groove, the second rectangular hole, the feed groove, and the first rectangular hole to the guide member. When the second groove communicates with the third rectangular hole and the first groove, semiconductor devices with their leads facing outward move outward along the second groove, the third rectangular hole, and the first groove to the guide member. The central block blocks semiconductors with incorrect positioning. Specifically, semiconductors in the second groove with their leads facing inward will not be discharged through the third rectangular hole, and semiconductors in the second groove with their leads facing outward will not pass through the second rectangular hole. Only when the pins of the semiconductor are oriented correctly can they pass through the third rectangular hole or the second rectangular hole, thus achieving the purpose of dividing the materials according to the orientation of the semiconductor pins.
[0014] Furthermore, an inner ring is formed on the inner circumference of the circular groove, protruding from the inner circumference of the circular groove. A pair of notches are formed in the inner ring, symmetrically arranged. A pair of fan-shaped protrusions are symmetrically formed on the outer circumference of the middle circular block. These fan-shaped protrusions are located at the second rectangular hole, within the circular groove, and outside the inner ring. A pair of fan-shaped inner protrusions are symmetrically formed on the outer circumference of the middle circular block. These inner protrusions are located at the third rectangular hole, within the circular groove, and inside the inner ring. The notches facilitate the insertion of the inner protrusions into the inner ring. Because there is a certain distance between the pins on the semiconductor and the end of the semiconductor, if only the internal groove for passage were used to limit the position, it would be easy for part of the semiconductor to be located in the second groove, while the other part would be inserted into the second or third rectangular hole. This would damage the semiconductor when the inner disk rotates. The fan-shaped protrusions and the inner protrusions act on the pins to prevent the semiconductor package from being inserted into the second or third rectangular hole.
[0015] Furthermore, the material guide comprises a fixed block mounted on the outer periphery of the fixed ring via screws. The fixed block is formed with an inclined plate, a convex strip welded to the upper surface of the inclined plate, and a pointed tip formed at the upper end of the convex strip, which serves as a material guide. One side of the convex strip is an inclined surface, and a limit plate is welded to the inclined plate. When the semiconductor moves on the inclined surface, the support provided by the inclined surface causes the semiconductor to lose stability, causing the semiconductor to tilt upward with its pins. When the semiconductor moves on the inclined plate, the convex strip is located on the side of the semiconductor with the pins, and when the semiconductor moves, the inclined surface of the convex strip on the inclined plate acts on the lower wall of the semiconductor, causing the semiconductor with the pins inserted to tilt onto the inclined plate.
[0016] Furthermore, in order to avoid too many semiconductors entering the fixed ring and rotating inner disk each time, which affects the rotation of the rotating inner disk and causes damage to the semiconductors, this solution adopts a method of providing only one pair of semiconductors at a time to limit the amount of feed to avoid the above problems. If it is a pair of semiconductors, the possible combinations are forward and reverse combinations, both are forward, and both are reverse. The above-mentioned forward direction is that the pins of the semiconductor are facing inward, and the reverse direction is that the pins of the semiconductor are facing outward. The specific material blocking mechanism includes a fixed end block installed on the back side of the vertical back plate by screws, a movable rod is passed through the fixed end block, the inner end of the movable rod is connected to the moving frame by a thread, an inner top spring is sleeved on the movable rod, the inner top spring is located between the moving frame and the fixed end block, the other end of the moving frame is welded with a connecting plate, a concave sleeve is sleeved on the connecting plate, the concave sleeve is fixed to the vertical back plate by screws, the other end of the connecting plate is welded with an inner rod, an abutment wheel is rotatably provided on the inner rod, the outer periphery of the abutment wheel is tangent to a top plate, the outer periphery of the top plate is an arc structure, a V-shaped groove is opened in a circumferential array on the top plate, and rings are formed at both ends of the top plate, which are coaxially fixed by screws On the rotating shaft, an inner pressure block is provided at the inner inner end of the moving frame, and an outer pressure block is provided at the inner outer end of the moving frame. An inner roller is rotatably provided on the inner pressure block, and an outer roller is rotatably provided on the outer pressure block. Both ends of the inner roller and the outer roller are respectively connected with end nuts by threads, and the end nuts are located on the outside of the moving frame. A first inclined hole is provided at the outer ends of both sides of the moving frame, and the inner end of the first inclined hole extends inwardly. A second inclined hole is provided at the inner ends of both sides of the moving frame, and the inner end of the second inclined hole extends outwardly. The inner roller is inserted into the second inclined hole, and the outer roller is inserted into the first inclined hole. An insert plate is formed on the inner side of the outer pressure block, and the other end of the insert plate is wedge-shaped. A baffle is formed on the inner side of the inner pressure block. The bottom of the material groove is provided with a plug hole and a slot, the plug hole is located on the outside of the slot, the plug plate is passed through the plug hole and the vertical back plate, the baffle is passed through the slot and the vertical back plate, the distance between the plug plate and the baffle is greater than the length of two semiconductors, and the distance between the plug plate and the baffle is less than the length of three semiconductors, the plug plate is used to cut off the feeding of semiconductors, and the baffle plays a role in limiting the semiconductors located between the plug plate and the baffle, so that the limit can be cancelled at an appropriate time, and then only this pair of semiconductors enters the inner turntable.
[0017] The advantages of the above technical solution are: The present invention significantly improves the accuracy of semiconductor material distribution, while avoiding damage to the semiconductor, and significantly improves the efficiency of semiconductor material distribution. BRIEF DESCRIPTION OF THE DRAWINGS
[0018] In order to make the objectives, technical solutions and advantages of the present invention more clear, the present invention will be further described in detail below with reference to the accompanying drawings.
[0019] Figure 1 A three-dimensional structural diagram of a semiconductor device posture correction device is shown.
[0020] Figure 2 Shows a three-dimensional structural diagram of the driving mechanism.
[0021] Figure 3 Shows a three-dimensional structural diagram of the fixing ring and the vertical back plate.
[0022] Figure 4 A three-dimensional structural diagram of the fixing ring and the cover plate is shown.
[0023] Figure 5 Shown is a three-dimensional structural diagram of the inner turntable.
[0024] Figure 6 A three-dimensional structural diagram of the middle circular block is shown.
[0025] Figure 7 A three-dimensional structural diagram of the material guide is shown.
[0026] Figure 8 A three-dimensional structural diagram of the material blocking mechanism is shown. DETAILED DESCRIPTION
[0027] like Figure 1 As shown, a semiconductor device posture correction device includes a vertical back plate 1, a driving mechanism 2 is provided on the back side of the vertical back plate 1, a material dividing mechanism 3 is provided on the front side of the vertical back plate 1, the material dividing mechanism 3 is connected to the driving mechanism 2, a material blocking mechanism 4 is provided on the back side of the vertical back plate 1, a pair of material guides 5 are installed at the lower end of the material dividing mechanism 3, and a tray loading device is provided at the material guide 5.
[0028] The loading device includes a vertical seat, on which is fixed a cylinder that can only be driven to rotate 225 degrees. A swing arm is connected to the output end of the cylinder, and the other end of the swing arm is rotatably provided with a cylinder clamp that can only rotate 90 degrees. A gear is fixed to the rotating end of the cylinder clamp, and an arc-shaped rack is fixed to the vertical seat. The gear and the arc-shaped rack are meshed, and the rotation of the cylinder clamp is based on the axial direction of the gear.
[0029] like Figure 2As shown, the driving mechanism 2 includes a plurality of mounting rods 200 connected to the vertical back plate 1 by screw threads, a support sleeve 202 is provided on the mounting rod 200, the inner end of the support sleeve 202 abuts against the back side of the vertical back plate 1, and the outer end of the support sleeve 202 is provided with a fixing plate 201, the mounting rod 200 is passed through the fixing plate 201, and a planetary reducer 203 is installed on the back side of the fixing plate 201, the input shaft of the planetary reducer 203 is connected to a motor 204, the motor 204 is fixed to the planetary reducer 203, and the output shaft of the planetary reducer 203 is connected to a turntable 220, and the turntable 220 is provided with a rotating shaft. The inner end of the rotating arm is provided with an action wheel 214 for rotation. A rotating shaft 216 is provided on the vertical back plate 1 for rotation. An inner disk 217 is formed on the inner end of the rotating shaft 216. The inner disk 217 is located on the front side of the vertical back plate 1. A rotating disk 218 is fixed to the rotating shaft 216 via a pin. The rotating disk 218 is provided with four U-shaped grooves 221 arranged in a circular array around the axial direction of the rotating shaft 216. The outer ends of the U-shaped grooves 221 are open, and an inwardly concave arc groove 219 is formed between each adjacent U-shaped groove 221. When the action wheel 214 and the U-shaped groove 221 are not in action, the rotating disk 220 is located in one of the arc grooves 219. The inner wall of the fixed plate 201 is provided with a protrusion 205 protruding from the inner wall. The upper and lower ends of the protrusion 205 are symmetrically provided with oblique grooves 206. The outer ends of the oblique grooves 206 extend inwardly and are connected by a vertical groove 207.
[0030] The rotating arm includes a connecting platform 208 coaxially fixed to the turntable 220 by screws, and the output shaft of the planetary reducer 203 is fixed to the connecting platform 208 by pins. A pair of parallel side plates 212 are formed on the outer periphery of the connecting platform 208. The side plates 212 are provided with strip holes 213. A guide rod 211 is passed through the strip holes 213. The two ends of the guide rod 211 are connected to the limit nuts by threads. The limit nuts are located on the outer sides of the side plates 212. The guide rod 211 is provided with a movable Head 210, the movable head 210 is located between the side plates 212, and a sleeve rod 209 is connected to the movable head 210 through a threaded connection. The sleeve rod 209 is passed through the connecting platform 208, and a spring is sleeved on the sleeve rod 209. The spring is located between the connecting platform 208 and the movable head 210. The axle on the action wheel 214 is rotatably provided on the movable head 210, and a roller 215 is also fixed to the outer end of the axle on the action wheel 214. The roller 215 moves on the inner side of the inclined groove 206, the vertical groove 207 and the fixed plate 201.
[0031] like Figures 3 to 6As shown, the material distribution mechanism 3 includes a fixed ring 300 fixed to the vertical back plate 1 by screws, and a cover plate 322 is fixed to the front end of the fixed ring 300 by screws. An inner turntable 310 is rotatably provided in the fixed ring 300, and a circular groove 312 is formed in the front end opening of the inner turntable 310. The inner turntable 310 is mounted on the inner disk 217 by screws, and a middle round block 311 is provided in the circular groove 312. The middle round block 311 is mounted on the cover plate 322 by screws.
[0032] The lower end of the retaining ring 300 defines a first rectangular hole 308. The inner wall of the first rectangular hole 308 defines a pair of mutually parallel first internal grooves 309. A first groove 306 is defined at the lower end of the retaining ring 300, opposite the first rectangular hole 308. A feed arm 301 is formed on the outer periphery of the upper end of the retaining ring 300. A feed groove 302 is defined on the feed arm 301. The inner end of the feed groove 302 extends through the inner periphery of the retaining ring 300. A pair of mutually parallel third internal grooves 305 are defined at the bottom of the feed groove 302. The outer end of the first rectangular hole 308 extends downward at an angle, with the longitudinal direction of the first rectangular hole 308 forming a 45-degree angle with the vertical direction. The outer end of the first groove 306 extends downward at an angle, with the inclination of the first groove 306 symmetrical with the inclination of the first rectangular hole 308 along the vertical direction, forming a 45-degree angle with the vertical direction. The feeding groove 302 is located on the extension line of the first rectangular hole 308 , and the length direction of the feeding groove 302 is consistent with the inclination direction and inclination angle of the first rectangular hole 308 .
[0033] Four second grooves 315 are formed in a circular array at the front end of the inner turntable 310 . The length directions of each pair of adjacent second grooves 315 are perpendicular to each other. A pair of fourth embedded grooves 316 are formed at the bottom of the second grooves 315 and are parallel to each other.
[0034] A second rectangular hole 323 is formed throughout the circumference of the central circular block 311. A pair of parallel fifth internal grooves 319 are formed on the inner wall of the second rectangular hole 323. A third rectangular hole 317 is also formed throughout the circumference of the central circular block 311. A pair of parallel sixth internal grooves 318 are formed on the outer wall of the third rectangular hole 317. The second rectangular hole 323 communicates with the feed groove 302 and the first rectangular hole 308. The third rectangular hole 317 communicates with the first groove 306. When the second groove 315 communicates with the second rectangular hole 323, the feed groove 302, and the first rectangular hole 308, the semiconductor device with its pins facing inward moves outward along the second groove 315, the second rectangular hole 323, the feed groove 302, and the first rectangular hole 308 to the material guide 5. When the second groove 315 is connected to the third rectangular hole 317 and the first groove 306 , the semiconductor device with its pins facing outward moves outward along the second groove 315 , the third rectangular hole 317 and the first groove 306 to the material guide 5 .
[0035] In addition, an inner ring 313 is formed on the inner circumference of the circular groove 312. The inner ring 313 protrudes from the inner circumference of the circular groove 312 and is provided with a pair of notches 314, which are symmetrically arranged. A pair of fan-shaped protrusions 321 are symmetrically formed on the outer circumference of the middle circular block 311. The fan-shaped protrusions 321 are located at the second rectangular hole 323, and are located inside the circular groove 312 and outside the inner ring 313. A pair of fan-shaped inner protrusions 320 are symmetrically formed on the outer circumference of the middle circular block 311. The inner protrusions 320 are located at the third rectangular hole 317, and are located inside the circular groove 312 and inside the inner ring 313.
[0036] like Figure 7 As shown, the material guide 5 includes a fixing block 50 fixed to the outer periphery of the fixing ring 300 by screws. The fixing block 50 is formed with an inclined plate 51. A convex strip 53 is welded to the upper surface of the inclined plate 51. The upper end of the convex strip 53 is formed with a pointed tip 54. One side of the convex strip 53 is an inclined surface. A limit plate 52 is welded to the inclined plate 51. When the semiconductor moves on the inclined plate 51 , the ridge 53 is located on the side of the semiconductor with the pins, and when the semiconductor moves, the inclined surface of the ridge 53 on the inclined plate 51 acts on the lower wall of the semiconductor, so that the semiconductor with the pins inserted falls onto the inclined plate 51 .
[0037] like Figure 8As shown, the material blocking mechanism 4 includes a fixed end block 404 installed on the back side of the vertical back plate 1 by screws, a movable rod 405 is passed through the fixed end block 404, the inner end of the movable rod 405 is connected to a movable frame 407 by a thread, an inner top spring 406 is sleeved on the movable rod 405, and the inner top spring 406 is located between the movable frame 407 and the fixed end block 404, and the other end of the movable frame 407 is welded with a connecting plate 416, and a connecting plate 416 is sleeved on the connecting plate 416. There is a concave sleeve 419, which is fixed to the vertical back plate 1 by screws. The other end of the connecting plate 416 is welded with an inner rod 417. An abutment wheel 418 is rotatably provided on the inner rod 417. The outer periphery of the abutment wheel 418 is tangent to the top plate 402. The outer periphery of the top plate 402 is an arc-shaped structure. V-shaped grooves 403 are arranged in a circumferential array on the top plate 402. Rings 400 are formed at both ends of the top plate 402. The rings 400 are fixed coaxially with screws. Fixed on the rotating shaft 216, the inner end of the moving frame 407 is provided with an inner pressure block 413, the inner outer end of the moving frame 407 is provided with an outer pressure block 412, the inner pressure block 413 is provided with an inner roller 411, and the outer pressure block 412 is provided with an outer roller 410. The ends of the inner roller 411 and the outer roller 410 are respectively connected with end nuts through threads. The end nuts are located on the outside of the moving frame 407. The outer ends of both sides of the moving frame 407 are provided with first inclined holes 413, 411 and 410. 08, the inner end of the first inclined hole 408 extends inwardly, and the inner ends of the two sides of the movable frame 407 are provided with second inclined holes 409. The inner ends of the second inclined holes 409 extend outwardly, and the inner roller 411 is inserted into the second inclined hole 409. The outer roller 410 is inserted into the first inclined hole 408. The inner side of the outer pressure block 412 is formed with an insert plate 415, and the other end of the insert plate 415 is a wedge-shaped structure. The inner side of the inner pressure block 413 is formed with a baffle 414. The bottom of the feed groove 302 is provided with an insertion hole 303 and a slot 304. The insertion hole 303 is located outside the slot 304. The insert plate 415 is inserted through the insertion hole 303 and the vertical back plate 1. The baffle 414 is inserted through the slot 304 and the vertical back plate 1. The distance between the insert plate 415 and the baffle 414 is greater than the length of two semiconductors, and the distance between the insert plate 415 and the baffle 414 is less than the length of three semiconductors.
[0038] During operation of this embodiment, the vibrating hopper discharges semiconductors, and the semiconductors are arranged in a discharge trough connected to the vibrating hopper, and then these semiconductors move one by one along the discharge trough into the feed groove 302, so that the semiconductors are located in the outer end of the feed groove 302, and at this time the insert plate 415 is in an extended state, that is, it is in a state of waiting for semiconductor feeding, and at this time, the abutment wheel 418 abuts against the outer periphery of the top plate 402, and this state is the starting state of material distribution.
[0039] The motor 204 is started and drives the turntable 220 to rotate after passing through the planetary reducer 203. When the turntable 220 rotates, the rotating arm on it will drive the action wheel 214 and the roller 215 to rotate around the turntable 220. When the action wheel 214 rotates, it will pass through the U-shaped groove 221, and the roller 215 will enter from the inclined groove 206 at the upper end. Thereafter, with the action of the action wheel 214, the rotating disk 218 will rotate 90 degrees. After the rotation, the turntable 220 will rotate in the arc groove 219, which can prevent the turntable 220 from rotating. The rotation of the turntable 220 will drive the rotating shaft 216 and the inner turntable 310 to rotate 90 degrees.
[0040] When the rotating shaft 220 rotates 45 degrees, the V-shaped groove 403 on the top plate 402 will rotate to the abutment wheel 418, and then the abutment wheel 418 will move inward under the action of the inner top spring 406. During the movement, the first inclined hole 408 acts on the outer roller 410 to move the insert plate 415, and the wedge-shaped end of the insert plate 415 is submerged in the bottom of the feed groove 302. When the insert plate 415 moves, the second inclined hole 409 will act on the inner roller 411 to make the inner pressure block 413 and the baffle 414 protrude from the bottom of the feed groove 302. In this way, a pair of semiconductor devices are moved along the inclined feed groove 302 to the baffle 414 and the insert plate 415, and when the shaft 220 continues to rotate, the abutment wheel 418 will move out of the V-groove 403, and then abut against the outer periphery of the top plate 402, so that the inner top spring 406 is compressed again, and the moving frame 407 moves outward. During the movement, the insert plate 415 extends out and completes the separation of the two abutting semiconductor devices through its wedge-shaped structure. At the same time, the baffle 414 moves inward until the baffle 414 loses its limit on the semiconductor. Thereafter, the semiconductor will move inward along the feed groove 302, and its inner end will abut against the outer periphery of the inner turntable 310. When the shaft 216 rotates 90 degrees, the inner turntable 310 will stop rotating. At this point, the feed groove 302 is connected to one of the second grooves 315, and the semiconductor enters the second groove 315. If the pins on the semiconductor near the middle block 311 are facing inward, the pins of this semiconductor will pass through the fifth embedded groove 319 and move along the second rectangular hole 323 and the first rectangular hole 308 to the inclined plate 51. The inclined surface of the protrusion 53 causes it to lie flat on the inclined plate 51 with the pins facing upward. If the pins on the semiconductor near the middle block 311 are facing outward, the inner turntable 310 will be rotated. If the pins of the second semiconductor are facing inward, the semiconductor will be moved along the second rectangular hole 323 and the first rectangular hole 308 to the inclined plate 51 in the same manner as described above. If the pins of the second semiconductor are facing outward, the inner turntable 310 will be rotated.
[0041] The inner turntable 310 then rotates 180 degrees and stops. When the inner turntable 310 rotates 180 degrees, the semiconductors with pins facing outward that have not been ejected are driven along the third rectangular hole 317 and the first groove 306 to the other inclined plate 51 due to the presence of the sixth inner groove 318, which has pins that avoid the ejection. If there are still semiconductors with pins facing outward in the second groove 315 at this time, they will be ejected. If there is still a semiconductor with pins facing inward in the second groove 315 at this time, the inner turntable 310 will continue to rotate.
[0042] When the turntable 310 rotates 270 degrees, the semiconductor with the pins facing inward in the second groove 315 will be discharged along the first rectangular hole 308. At this time, the semiconductor in the second groove 315 is completely discharged, and then it rotates to the initial position and performs material distribution and discharge again.
[0043] Among them, in order to facilitate the feeding of semiconductors into the feed groove 302, an air nozzle can be installed on the outer end of the feed groove 302, and the efficiency of semiconductor feeding and discharging can be improved by jetting air from the air nozzle. At the same time, it can also avoid the problem of mutual blockage at the intersection of the third rectangular hole 317 and the second rectangular hole 323 due to equal moving speeds. The driving force provided by the airflow can make the semiconductor device move at different speeds in the third rectangular hole 317 and the second rectangular hole 323.
[0044] When the tray is swung, the swing arm rotates driven by the cylinder, which can make the cylinder clamp rotate 90 degrees, thereby turning the semiconductor device clamped by the cylinder clamp to a pin-down position, and then the cylinder clamp cancels the clamping of the semiconductor, and the semiconductor will be placed in the tray placed on the two-dimensional moving system.
[0045] The foregoing description is merely a preferred embodiment of the present invention and is not intended to limit the present invention. It is apparent that various modifications and variations may be made by those skilled in the art without departing from the spirit and scope of the present invention. Thus, the present invention is intended to encompass such modifications and variations as long as they fall within the scope of the claims and their equivalents.
Claims
1. A semiconductor device posture correction device, characterized in that: The invention comprises a vertical back plate (1), a driving mechanism (2) is provided on the back side of the vertical back plate (1), a material distribution mechanism (3) is provided on the front side of the vertical back plate (1), the material distribution mechanism (3) is connected to the driving mechanism (2), a material blocking mechanism (4) is provided on the back side of the vertical back plate (1), and a pair of material guide members (5) are installed at the lower end of the material distribution mechanism (3).
2. The semiconductor device posture correction device according to claim 1, characterized in that: The driving mechanism (2) comprises a plurality of mounting rods (200) connected to the vertical back plate (1) by screw threads, a support sleeve (202) is sleeved on the mounting rod (200), the inner end of the support sleeve (202) abuts against the back side of the vertical back plate (1), the outer end of the support sleeve (202) is provided with a fixing plate (201), the mounting rod (200) is passed through the fixing plate (201), a planetary reducer (203) is installed on the back side of the fixing plate (201), the input shaft of the planetary reducer (203) is connected to a motor (204), the motor (204) is fixed to the planetary reducer (203), the output shaft of the planetary reducer (203) is connected to a turntable (220), and the turntable (220) is provided with a rotating shaft. The arm is provided with an action wheel (214) at the inner end of the rotating arm, and a rotating shaft (216) is provided on the vertical back plate (1). The inner end of the rotating shaft (216) is formed with an inner disk (217). The inner disk (217) is located on the front side of the vertical back plate (1). A rotating disk (218) is fixed to the rotating shaft (216) by a pin. The rotating disk (218) is provided with four U-shaped grooves (221) in a circumferential array around the axial direction of the rotating shaft (216). The outer ends of the U-shaped grooves (221) are open, and an arc groove (219) with an inner concave shape is formed between two adjacent U-shaped grooves (221). When the action wheel (214) and the U-shaped groove (221) are not in action, the rotating disk (220) is located in one of the arc grooves (219).
3. The semiconductor device posture correction device according to claim 2, characterized in that: The inner wall of the fixing plate (201) is formed with a convex portion (205) protruding from the inner wall thereof, and the upper and lower ends of the convex portion (205) are symmetrically provided with oblique grooves (206), the outer ends of the oblique grooves (206) extend inwardly, and the outer ends of the oblique grooves (206) are connected through a vertical groove (207); The rotating arm includes a connecting platform (208) coaxially fixed to a rotating disk (220) by screws, an output shaft of a planetary reducer (203) is fixed to the connecting platform (208) by pins, a pair of mutually parallel side plates (212) are formed on the outer periphery of the connecting platform (208), a strip hole (213) is opened on the side plate (212), a guide rod (211) is passed through the strip hole (213), both ends of the guide rod (211) are connected to a limit nut by a thread, the limit nut is located on the outer side of the side plate (212), and a movable head (210) is provided on the guide rod (211). The movable head (210) is located between the side plates (212). A sleeve rod (209) is connected to the movable head (210) through a thread. The sleeve rod (209) is inserted into the connecting platform (208). A spring is sleeved on the sleeve rod (209). The spring is located between the connecting platform (208) and the movable head (210). The axle on the action wheel (214) is rotatably arranged on the movable head (210). A roller (215) is also fixed to the outer end of the axle on the action wheel (214). The roller (215) moves inside the inclined groove (206), the vertical groove (207) and the fixed plate (201).
4. The semiconductor device posture correction device according to claim 2, characterized in that: The material distribution mechanism (3) includes a fixed ring (300) fixed to the vertical back plate (1) by screws, a cover plate (322) is fixed to the front end of the fixed ring (300) by screws, an inner turntable (310) is rotatably provided in the fixed ring (300), a circular groove (312) is formed in the front end of the inner turntable (310), the inner turntable (310) is mounted on the inner disk (217) by screws, a middle round block (311) is provided in the circular groove (312), and the middle round block (311) is mounted on the cover plate (322) by screws.
5. The semiconductor device posture correction device according to claim 4, characterized in that: A first rectangular hole (308) is provided at the lower end of the fixing ring (300), a pair of mutually parallel first embedded grooves (309) are provided on the inner wall of the first rectangular hole (308), a first groove (306) is provided at a position of the lower end of the fixing ring (300) opposite to the first rectangular hole (308), a feed arm (301) is formed on the outer periphery of the upper end of the fixing ring (300), a feed groove (302) is provided on the feed arm (301), the inner side end of the feed groove (302) passes through the inner periphery of the fixing ring (300), and a pair of mutually parallel third embedded grooves (305) are provided at the bottom of the feed groove (302); The outer end of the first rectangular hole (308) extends downwardly in an inclined manner, and the angle between the length direction of the first rectangular hole (308) and the vertical direction is 45 degrees; The outer end of the first groove (306) extends downwardly in an inclined manner, the inclination direction of the first groove (306) and the inclination direction of the first rectangular hole (308) are symmetrical along the vertical direction, and the angle between the length direction of the first groove (306) and the vertical direction is 45 degrees; The feeding groove (302) is located on the extension line of the first rectangular hole (308), and the length direction of the feeding groove (302) is consistent with the inclination direction and inclination angle of the first rectangular hole (308).
6. The semiconductor device posture correction device according to claim 5, characterized in that: The front end of the inner turntable (310) is provided with four second grooves (315) in a circumferential array, the length directions of each pair of adjacent second grooves (315) are perpendicular to each other, and the bottoms of the second grooves (315) are provided with a pair of fourth embedded grooves (316) that are parallel to each other.
7. The semiconductor device posture correction device according to claim 6, characterized in that: A second rectangular hole (323) is provided on the central circular block (311) through the circumference thereof, and a pair of fifth parallel embedded grooves (319) are provided on the inner side of the inner wall of the second rectangular hole (323). A third rectangular hole (317) is also provided on the central circular block (311) through the circumference thereof, and a pair of sixth parallel embedded grooves (318) are provided on the outer side of the inner wall of the third rectangular hole (317). The second rectangular hole (323) is in communication with the feed groove (302) and the first rectangular hole (308); The third rectangular hole (317) is in communication with the first groove (306); When the second groove (315) is connected to the second rectangular hole (323), the feed groove (302) and the first rectangular hole (308), the semiconductor device with the pins facing inward moves outward along the second groove (315) and the second rectangular hole (323), the feed groove (302) and the first rectangular hole (308) to the material guide member (5); When the second groove (315) is connected to the third rectangular hole (317) and the first groove (306), the semiconductor device with its pins facing outward moves outward along the second groove (315), the third rectangular hole (317) and the first groove (306) to the material guide (5).
8. The semiconductor device posture correction device according to claim 7, characterized in that: An inner ring (313) is formed on the inner circumference of the circular groove (312), and the inner ring (313) protrudes from the inner circumference of the circular groove (312). A pair of notches (314) are formed on the inner ring (313), and the notches (314) are symmetrically arranged with each other; A pair of fan-shaped protrusions (321) are symmetrically formed on the outer periphery of the middle circular block (311), the fan-shaped protrusions (321) are located at the second rectangular hole (323), and the fan-shaped protrusions (321) are located inside the circular groove (312) and outside the inner ring (313); A pair of inner convex portions (320) having a fan-shaped structure are symmetrically formed on the outer periphery of the middle circular block (311). The inner convex portions (320) are located at the third rectangular hole (317), and the inner convex portions (320) are located inside the circular groove (312) and inside the inner ring (313).
9. The semiconductor device posture correction device according to claim 7, characterized in that: The material guide member (5) includes a fixed block (50) mounted on the outer periphery of the fixed ring (300) by screws, an inclined plate (51) is formed on the fixed block (50), a convex strip (53) is welded on the upper surface of the inclined plate (51), a pointed tip (54) is formed at the upper end of the convex strip (53), one side of the convex strip (53) is an inclined surface, and a limiting plate (52) is welded on the inclined plate (51); When the semiconductor moves on the inclined plate (51), the convex strip (53) is located on the side of the semiconductor with the pin, and when the semiconductor moves, the inclined surface of the convex strip (53) on the inclined plate (51) acts on the lower wall of the semiconductor, so that the semiconductor pin is tilted onto the inclined plate (51).
10. The semiconductor device posture correction device according to claim 5, wherein: The material blocking mechanism (4) includes a fixed end block (404) mounted on the back side of the vertical back plate (1) by screws, a movable rod (405) is provided on the fixed end block (404), the inner end of the movable rod (405) is connected to a movable frame (407) by a thread, an inner top spring (406) is sleeved on the movable rod (405), and the inner top spring (406) is located between the movable frame (407) and the fixed end block (404), and a connecting plate (416) is welded to the other end of the movable frame (407), and a connecting plate (416) is sleeved on the connecting plate (416). There is a concave sleeve (419), which is fixed to the vertical back plate (1) by screws. The other end of the connecting plate (416) is welded with an inner rod (417), and an abutment wheel (418) is rotatably provided on the inner rod (417). The outer periphery of the abutment wheel (418) is tangent to a top plate (402). The outer periphery of the top plate (402) is an arc-shaped structure. V-shaped grooves (403) are arranged in a circumferential array on the top plate (402). Rings (400) are formed at both ends of the top plate (402). The rings (400) are coaxially screwed. The movable frame (407) is fixed on the rotating shaft (216), the inner inner end of the movable frame (407) is provided with an inner pressure block (413), the inner outer end of the movable frame (407) is provided with an outer pressure block (412), an inner roller (411) is rotatably provided on the inner pressure block (413), an outer roller (410) is rotatably provided on the outer pressure block (412), the inner roller (411) and the outer roller (410) are respectively connected with end nuts through threads at both ends, and the end nuts are located on the outer side of the movable frame (407), and the outer ends of both sides of the movable frame (407) are provided with first oblique holes ( 408), the inner end of the first inclined hole (408) extends inwardly, and the inner ends of both sides of the movable frame (407) are provided with second inclined holes (409), and the inner ends of the second inclined holes (409) extend outwardly, the inner roller (411) is inserted into the second inclined hole (409), and the outer roller (410) is inserted into the first inclined hole (408), and an inserting plate (415) is formed on the inner side of the outer pressure block (412), and the other end of the inserting plate (415) is wedge-shaped. A baffle (414) is formed on the inner side of the inner pressure block (413); The bottom of the feed groove (302) is provided with an insertion hole (303) and a slot (304), the insertion hole (303) is located outside the slot (304), the insertion plate (415) is passed through the insertion hole (303) and the vertical back plate (1), the baffle (414) is passed through the slot (304) and the vertical back plate (1), the spacing between the insertion plate (415) and the baffle (414) is greater than the length of two semiconductors, and the spacing between the insertion plate (415) and the baffle (414) is less than the length of three semiconductors.