LED pouring sealant as well as preparation method and use method thereof

Abstract

The invention discloses an LED (light-emitting diode) pouring sealant which is prepared from the following components: alicyclic epoxy resin, a glycidyl ether toughening agent, a thermal initiation cation curing agent, an anhydride curing agent and the like. A rigid ring structure of the alicyclic epoxy resin and a flexible chain segment of the anhydride curing agent are subjected to ring-opening reaction to form a three-dimensional cross-linked network; the alicyclic epoxy resin and the anhydride curing agent are combined to form an interpenetrating polymer network, the anhydride curing agent is further crosslinked through an esterification reaction in a high-temperature stage to form a high-density interpenetrating network, and the structure not only retains the weather resistance of the alicyclic epoxy resin, but also relieves internal stress through a flexible chain segment of anhydride, so that the volume shrinkage rate after curing is reduced to 0.5% or below; meanwhile, a glycidyl ether toughening agent is inserted into double networks through long-chain ether bonds to form tough nodes, crack propagation is inhibited, and the comprehensive performance of the colloid is remarkably improved by combining an anhydride curing agent vacuum dehydration and staged curing process.

Description

Technical Field

[0001] The present invention relates to the technical field of LED potting adhesives, in particular to an LED potting adhesive and a preparation method and a use method thereof. Background Art

[0002] Potting compound, also known as electronic adhesive, is widely used in LEDs, electronic components, and other fields, primarily for bonding, sealing, potting, and protective coating. In its uncured state, potting compound is liquid and has good fluidity. Its viscosity varies depending on the material type, performance requirements, and production process. Only after it is fully cured can the potting compound truly realize its usefulness. Cured potting compound exhibits various properties, including waterproofing, dustproofing, insulation, thermal conductivity, confidentiality, corrosion resistance, temperature resistance, and shock absorption.

[0003] Traditional LED potting glue mostly uses a curing system consisting of anhydride curing agent and bisphenol A epoxy resin. However, the bisphenol A epoxy resin in this system contains hydrophilic hydroxyl groups in its molecular chain, making it susceptible to moisture absorption after curing and prone to hydrolysis or expansion in hot and humid environments, leading to performance degradation of LED lamps. Furthermore, the anhydride curing agent and the bisphenol A epoxy resin form a homogeneous network structure through a single ester crosslinking mechanism, resulting in poor weather resistance and inability to effectively withstand the long-term challenges of complex outdoor climate conditions such as UV exposure and temperature cycling. Furthermore, this type of curing system exhibits a high post-curing volume shrinkage (typically exceeding 5%), which can easily lead to internal stress concentration during the curing process, potentially causing microcracks within the encapsulation layer and even delamination or peeling from the LED chip, severely reducing the reliability of the LED lamp. Replacing the bisphenol A epoxy resin with a silicone resin, while reducing post-curing volume shrinkage, also sacrifices the epoxy resin's advantages, such as chemical resistance and mechanical strength. While attempts have been made to replace the anhydride curing agent with a UV curing agent, these efforts still suffer from high average mass loss, insufficient fatigue resistance, and a short service life, making them difficult to meet the high reliability and long life requirements of outdoor LED lamps. Summary of the Invention

[0004] In order to solve the above technical problems, one of the objects of this application is to provide an LED potting compound, which is composed of the following components in parts by mass: 43.3~76.7 parts of alicyclic epoxy resin, 13~33 parts of glycidyl ether toughening agent, 0.15~0.95 parts of thermally triggered cationic curing agent, 0.05~0.25 parts of stabilizer, 0.1~0.5 parts of defoaming agent, 0~2 parts of light diffuser, and 10~20 parts of acid anhydride curing agent.

[0005] Preferably, the alicyclic epoxy resin is one of 3,4-epoxycyclohexylmethyl-3'4'-epoxycyclohexylcarboxylate, 3,4-epoxy-1-cyclohexene, and dicyclopentadiene dioxide, or a mixture of any of them.

[0006] Preferably, the glycidyl ether toughening agent is one of polypropylene glycol diglycidyl ether, polyethylene glycol diglycidyl ether, glycerol triglycidyl ether, or a mixture of any of them.

[0007] Preferably, the heat-initiated cationic curing agent is one of triaryliodonium hexafluorophosphate, triaryliodonium hexafluoroantimonate, diarylsulfonium hexafluorophosphate, triarylsulfonium hexafluoroantimonate, p-nitrobenzenediazonium tetrafluoroborate, and p-tolyldiazonium hexafluorophosphate, or a mixture of any of them.

[0008] Preferably, the stabilizer is at least one of disodium ethylenediaminetetraacetate or 2,2,6,6-tetramethylpiperidinyl oxide.

[0009] Preferably, the defoaming agent is one of polydimethylsiloxane type, modified polysiloxane type, fatty acid and esters thereof, or a mixture of any of them.

[0010] Preferably, the anhydride curing agent is one of methylhexahydrophthalic anhydride, methyltetrahydrophthalic anhydride, methylnadic anhydride, and dodecenylsuccinic anhydride, or a mixture of any of them.

[0011] Preferably, the light diffusing agent is nano-silicon dioxide or polymethyl methacrylate microspheres with a particle size of 50nm-10um.

[0012] Another object of the present application is to provide a method for preparing an LED potting compound, comprising the following steps: Dehydrate 10-20 parts of anhydride curing agent in a vacuum at 40-50°C and store for later use; dehydration can prevent moisture from inducing cationic curing side reactions; Add 43.3-76.7 parts of alicyclic epoxy resin, 13-33 parts of glycidyl ether toughening agent, 0.05-0.25 parts of stabilizer, 0.1-0.5 parts of defoamer, and 0-2 parts of light diffuser to a container, mixing uniformly. Add 0.15-0.95 parts of thermally initiated cationic curing agent and stir to dissolve under vacuum for 1-3 hours to obtain mixture A. Store for later use. Mix low-viscosity components such as the resin and toughening agent first, then add the thermal initiator to avoid localized curing caused by uneven mixing in a high-viscosity system.

[0013] Another object of the present application is to provide a method for using LED potting adhesive, comprising the following steps: during potting, 10-20 parts of a vacuum-dehydrated anhydride curing agent are mixed with the aforementioned mixture a; after injection into the LED module, the mixture is pre-cured at 90-110°C for 20-40 minutes, followed by curing at 140-160°C for 40-60 minutes. During the pre-curing stage, the cationic system rapidly forms a preliminary network, partially releasing stress; during the post-curing stage, the anhydride system completes deep cross-linking, forming a dense three-dimensional network to enhance the colloid's heat resistance and mechanical strength. By combining vacuum dehydration pretreatment of the anhydride curing agent with a staged curing process, the curing shrinkage of the colloid is effectively controlled to less than 0.5%, while also reducing bubble formation and reducing the mass loss rate to below 0.3% (the mass loss rate refers to the proportion of mass loss during use or storage).

[0014] The beneficial effects are: The present application utilizes the rigid cyclic structure of the alicyclic epoxy resin and the flexible chain segments of the anhydride curing agent to form a three-dimensional cross-linked network through a ring-opening reaction. The two are combined to form an interpenetrating polymer network. Specifically, the heat-initiated cationic curing agent first triggers the ring-opening polymerization of the epoxy groups in the low-temperature pre-curing stage to generate a preliminary cross-linked network; the anhydride curing agent further cross-links through an esterification reaction in the high-temperature stage to form a high-density interpenetrating network. This structure not only retains the weather resistance of the alicyclic epoxy, but also relieves internal stress through the flexible chain segments of the anhydride, reducing the volume shrinkage rate after curing to 0.5. % or less; the glycidyl ether toughening agent, through long-chain ether bonds interspersed within the double network, acts as a reactive diluent to reduce system viscosity and participates in cross-linking through epoxy groups to form tough nodes, inhibiting crack propagation; the stabilizer inhibits free radical side reactions by chelating metal ions and capturing free radicals, preventing premature curing of the anhydride system during storage due to metal catalysis, thereby extending the shelf life of the LED potting compound. It also synergizes with the thermally initiated cationic curing agent to ensure the stability and controllability of the curing reaction; the defoamer effectively removes bubbles during the mixing process and ensures colloid uniformity. The anhydride curing agent is vacuum-dehydrated separately before being mixed with the premixed components during potting. This avoids the micropores in the adhesive layer caused by moisture absorption by the anhydride curing agent in traditional processes, while the step-by-step curing reduces internal stress accumulation, improving the colloid's fatigue resistance and moisture and heat resistance. The compound withstands over 200 thermal shock cycles and 1000 hours of UV aging with no yellowing, and a mass loss rate of less than 0.3%. DETAILED DESCRIPTION

[0015] The present invention will be further described in detail below with reference to specific embodiments so that those skilled in the art can understand the present invention more clearly.

[0016] The following embodiments are only used to illustrate the present invention, but are not intended to limit the scope of the present invention. Based on the specific embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without making creative work are within the scope of protection of the present invention.

[0017] In the examples of the present invention, unless otherwise specified, all raw material components are commercially available products well known to those skilled in the art; in the examples of the present invention, unless otherwise specified, the technical means used are conventional means well known to those skilled in the art.

[0018] Source of raw materials: 3,4-Epoxycyclohexylmethyl-3'4'-epoxycyclohexylcarboxylate was purchased from Wuhan Smike Biotechnology Co., Ltd.; 3,4-Epoxy-1-cyclohexene was purchased from Hubei Yunmei Technology Co., Ltd.; Dicyclopentadiene dioxide was purchased from Hubei Maidehao Biotechnology Co., Ltd. Bisphenol A epoxy resin was purchased from Langfang Tengchuang Environmental Protection Technology Co., Ltd. Polypropylene glycol diglycidyl ether was purchased from Zhongshan Yuanda New Materials Co., Ltd. Polyethylene glycol diglycidyl ether was purchased from Jinan Yunuo Chemical Co., Ltd. Glycerol triglycidyl ether was purchased from Shanghai Gaoming Chemical Co., Ltd. Triaryliodonium hexafluorophosphate was purchased from Shanghai MacLean Biochemical Technology Co., Ltd. Diarylsulfonium hexafluorophosphate was purchased from Henan Alpha Chemical Co., Ltd. Triarylsulfonium hexafluoroantimonate and triaryliodonium hexafluoroantimonate were purchased from Hubei Langbowan Biopharmaceutical Co., Ltd. p-Nitrobenzene diazonium tetrafluoroborate was purchased from Hubei Xinhongli Chemical Co., Ltd. p-Tolyldiazonium hexafluorophosphate was purchased from Hubei Yunmei Technology Co., Ltd. Ethylenediaminetetraacetic acid disodium (EDTA-2Na) was purchased from Guangzhou Fengsen New Materials Co., Ltd. 2,2,6,6-Tetramethylpiperidinyl oxide (TEMPO) was purchased from Zhongshan Dixin Chemical Co., Ltd. Polydimethylsiloxane defoamer was purchased from Jinan Xinglongda Chemical Co., Ltd. Polyether-modified polysiloxane defoamer was purchased from Foshan Nanhai Datian Chemical Co., Ltd. Palmitic acid was purchased from Shanghai Better Chemical Co., Ltd. Stearic acid was purchased from Shanghai Wenyan Chemical Technology Co., Ltd. Nano-silica was purchased from Shanghai Jizhi Biochemical Technology Co., Ltd. Polymethyl methacrylate (PMMA) microspheres (particle size 50 nm–10 μm) were purchased from Beijing Zhongke Keyou Nanotechnology Co., Ltd. Methyltetrahydrophthalic anhydride and methylhexahydrophthalic anhydride were purchased from Jinan Sunny Day Chemical Technology Co., Ltd. Methylnadic anhydride was purchased from Wuhan Smike Biotechnology Co., Ltd. Dodecenylsuccinic anhydride was purchased from Shanghai Hongzhuang Chemical Technology Co., Ltd. The remaining reagents are commercially available.

[0019] Example 1 This embodiment provides an LED potting compound, which comprises the following components in parts by mass: 43.3 parts of an alicyclic epoxy resin, 33 parts of a glycidyl ether toughening agent, 0.95 parts of a thermally triggered cationic curing agent, 0.25 parts of a stabilizer, 0.5 parts of a defoaming agent, 2 parts of a light diffuser, and 20 parts of an acid anhydride curing agent; wherein the alicyclic epoxy resin is 3,4-epoxycyclohexylmethyl-3'4'-epoxycyclohexylcarboxylate; the glycidyl ether toughening agent is polypropylene glycol diglycidyl ether; the thermally triggered cationic curing agent is triaryliodonium hexafluorophosphate; the stabilizer is disodium ethylenediaminetetraacetic acid; the defoaming agent is polydimethylsiloxane; the acid anhydride curing agent is methylhexahydrophthalic anhydride; and the light diffuser is nano-silica. The above-mentioned method for preparing the LED potting compound includes the following steps: vacuum dehydrating 20 parts of anhydride curing agent at 40°C to a moisture content of less than 0.1%, and storing for later use; adding 43.3 parts of alicyclic epoxy resin, 33 parts of glycidyl ether toughening agent, 0.25 parts of stabilizer, 0.5 parts of defoaming agent and 2 parts of light diffuser to a container in order by mass, and mixing them evenly; then adding 0.95 parts of a thermally triggered cationic curing agent, stirring and dissolving it under vacuum for 1 hour to obtain a mixture A, and storing it for later use.

[0020] The method for using the above-mentioned LED potting glue includes the following steps: when potting, 20 parts of anhydride curing agent that has been vacuum dehydrated are mixed with mixture a, and after injecting into the LED module, it is pre-cured at 90°C for 20 minutes, and then heated to 140°C and cured for 40 minutes.

[0021] Example 2 The present embodiment provides an LED potting compound, which is composed of the following components in parts by mass: 60 parts of alicyclic epoxy resin, 23 parts of glycidyl ether toughening agent, 0.55 parts of thermally initiated cationic curing agent, 0.15 parts of stabilizer, 0.3 parts of defoaming agent, 1 part of light diffuser, and 15 parts of anhydride curing agent; wherein the alicyclic epoxy resin is obtained by mixing 3,4-epoxycyclohexylmethyl-3'4'-epoxycyclohexylcarboxylate and dicyclopentadiene dioxide in a mass ratio of 1:1; the glycidyl ether toughening agent is obtained by mixing polyethylene glycol diglycidyl ether and glycerol triglycidyl ether in a mass ratio of 1:1; the thermally initiated cationic curing agent ... thermally initiated cationic curing agent is obtained by mixing 3,4-epoxycyclohexylmethyl-3'4'-epoxycyclohexylcarboxylate and dicyclopentadiene dioxide in a mass ratio of 1:1; the thermally initiated cationic curing agent is obtained by mixing 3,4-epoxycyclohexylmethyl-3'4'-epoxycyclohexylcarboxylate and dicyclopentadiene dioxide in a mass ratio of 1:1; the thermally initiated cationic curing agent is obtained by mixing 3,4-epoxycyclohexylmethyl-3' The cationic curing agent is obtained by mixing triaryliodonium hexafluorophosphate, triarylsulfonium hexafluoroantimonate, triaryliodonium hexafluoroantimonate, p-nitrobenzenediazonium tetrafluoroborate, and p-tolyldiazonium hexafluorophosphate in a mass ratio of 1:1:1:1:1; the stabilizer is 2,2,6,6-tetramethylpiperidinyl oxide; the defoaming agent is obtained by mixing polydimethylsiloxane, polyether-modified polysiloxane, and palmitic acid in a mass ratio of 1:1:1; the anhydride curing agent is obtained by mixing methyltetrahydrophthalic anhydride, methylnadic anhydride, and dodecenylsuccinic anhydride in a mass ratio of 1:1:1; and the light diffuser is polymethyl methacrylate microspheres. The above-mentioned method for preparing LED potting glue includes the following steps: vacuum dehydrating 15 parts of anhydride curing agent at 45°C to a moisture content of less than 0.1%, and storing it for later use; adding 60 parts of alicyclic epoxy resin, 23 parts of glycidyl ether toughening agent, 0.15 parts of stabilizer, 0.3 parts of defoaming agent and 1 part of light diffuser to a container in the aforementioned parts by mass, mixing them evenly, and then adding 0.55 parts of thermally triggered cationic curing agent, stirring and dissolving them under vacuum for 2 hours to obtain a mixture A, and storing it for later use.

[0022] The method for using the above-mentioned LED potting glue includes the following steps: during potting, the 15 parts of the acid anhydride curing agent after vacuum dehydration are mixed with the mixture a, and after injecting into the LED module, they are pre-cured at 100°C for 30 minutes, and then heated to 150°C for curing for 50 minutes.

[0023] Example 3 The present embodiment provides an LED potting compound, which is composed of the following components in parts by mass: 76.7 parts of alicyclic epoxy resin, 13 parts of glycidyl ether toughening agent, 0.15 parts of thermally triggered cationic curing agent, 0.05 parts of stabilizer, 0.1 parts of defoaming agent, and 10 parts of anhydride curing agent; wherein the alicyclic epoxy resin is 3,4-epoxy-1-cyclohexene; the glycidyl ether toughening agent is obtained by mixing polypropylene glycol diglycidyl ether and glycerol triglycidyl ether in a mass ratio of 1:1; the thermally triggered cationic curing agent is 0.15 parts of a stabilizer, 0.1 parts of a defoaming agent, and 10 parts of an acid ... The invention discloses a novel polyurethane foaming agent comprising a mixture of diarylsulfonium hexafluorophosphate, p-nitrobenzenediazonium tetrafluoroborate, and p-tolyldiazonium hexafluorophosphate in a mass ratio of 1:1:1; a stabilizer comprising a mixture of disodium ethylenediaminetetraacetate and 2,2,6,6-tetramethylpiperidinyl oxide in a mass ratio of 1:1; a defoamer comprising a mixture of polyether-modified polysiloxane and stearic acid in a mass ratio of 1:1; an anhydride curing agent comprising a mixture of methyltetrahydrophthalic anhydride and methylnadic anhydride in a mass ratio of 1:1; and a light diffuser comprising polymethyl methacrylate microspheres. The above-mentioned method for preparing LED potting glue includes the following steps: vacuum dehydrating 10 parts of anhydride curing agent at 50°C to a moisture content of less than 0.1%, and storing it for later use; adding 76.7 parts of alicyclic epoxy resin, 13 parts of glycidyl ether toughening agent, 0.05 parts of stabilizer, and 0.1 parts of defoaming agent to a container in the aforementioned parts by mass, mixing them evenly, and then adding 0.15 parts of thermally triggered cationic curing agent, stirring and dissolving them under vacuum for 3 hours to obtain a mixture A, and storing it for later use.

[0024] The method for using the above-mentioned LED potting glue includes the following steps: during potting, the 15 parts of the acid anhydride curing agent after vacuum dehydration are mixed with the mixture a, and after injecting into the LED module, the mixture is pre-cured at 110°C for 40 minutes, and then heated to 160°C for curing for 60 minutes.

[0025] Comparative Example 1 The difference between this comparative example and Example 2 is that 60 parts of bisphenol A epoxy resin are used to replace 60 parts of alicyclic epoxy resin in Example 2. Other components and experimental steps are the same as those in Example 2.

[0026] Comparative Example 2 This comparative example differs from Example 2 in that the amount of the alicyclic epoxy resin is increased from 60 parts to 75 parts, and no anhydride curing agent is added. Other components and experimental steps are the same as those in Example 2.

[0027] Comparative Example 3 This comparative example differs from Example 2 in that the amount of the alicyclic epoxy resin is increased from 60 parts to 60.55 parts, and no heat-induced cationic curing agent is added. Other components and experimental steps are the same as those in Example 2.

[0028] Comparative Example 4 This comparative example differs from Example 2 in that the amount of the anhydride curing agent is increased from 15 parts to 38 parts, and no glycidyl ether toughening agent is added. Other components and experimental steps are the same as those in Example 2.

[0029] Comparative Example 5 This comparative example differs from Example 2 in that, during potting of the LED potting glue, the 15 parts of the acid anhydride curing agent after vacuum dehydration are mixed with mixture a and then injected into the LED module, and directly cured at a constant temperature of 150° C. for 80 minutes. The other components and experimental steps are the same as those in Example 2.

[0030] Comparative Example 6 Commercially available bisphenol A epoxy resin potting glue, model 8014, was purchased from Dongguan Excellence Chemical Technology Co., Ltd.

[0031] The LED potting compounds provided in Examples 1 to 3 and Comparative Examples 1 to 6 were tested.

[0032] Test method: The volume shrinkage after curing is referred to as curing shrinkage, which is tested in accordance with ISO9142 "Determination of curing shrinkage of epoxy resin adhesives" standard; The wet heat aging performance is tested according to GB / T 14522-2008, and the quality loss rate is calculated as follows: quality loss rate = (quality loss after aging / initial quality) × 100%; The thermal shock cycle resistance is tested in accordance with IEC 60068-2-14:2009 "Environmental testing Part 2-14: Test method Test N: Temperature change"; Weather resistance was tested by UV aging test according to ISO 188-2011 (UV intensity 0.6W / m 2 @340nm, for 1000h); The test results are shown in Table 1.

[0033] Table 1 LED potting performance test results

[0034] According to the test results in Table 1, the LED potting compounds provided by Examples 1-3 of the present application significantly outperformed Comparative Examples 1-6 in key performance indicators. The curing shrinkage of Examples 1-3 was stable at 0.38-0.45%, the mass loss rate was controlled within 0.3%, and the number of thermal shocks they endured exceeded 200. They also exhibited excellent weather resistance, with no cracking or yellowing observed after 1000 hours of continuous UV irradiation. In Comparative Example 1, the deterioration of various indicators after replacing the alicyclic epoxy resin with bisphenol A epoxy resin may be due to the lack of the rigid ring structure of the alicyclic epoxy, low cross-linking density, and inability to form an interpenetrating network, resulting in a high volume shrinkage rate after curing and poor weather resistance. It can be seen that the present application significantly reduces the curing shrinkage rate and effectively reduces the internal stress and avoids the formation of microcracks through the interpenetrating polymer network structure of the alicyclic epoxy resin and the anhydride curing agent; in Comparative Example 2, after no anhydride curing agent is added, the mass loss rate also increases and the number of cold and hot shock resistance cycles decreases. This may be due to the lack of synergistic cross-linking of the anhydride flexible chain segment, relying only on cationic curing, insufficient cross-linking density, and loose network structure; in Comparative Example 3, after removing the heat-induced cationic curing agent, the curing shrinkage rate increases, cracking, yellowing, etc. may be due to the lack of heat-induced cationic curing agent, which cannot be cured at low temperatures. Preliminary cross-linking is formed in the warm pre-curing stage. Relying solely on high-temperature curing will cause a sudden increase in internal stress, thereby concentrating internal stress; in comparative example 4, the excess of anhydride curing agent and the lack of glycidyl ether toughening agent result in increased curing shrinkage and cracking. This may be because the lack of glycidyl ether toughening agent makes it impossible to form tough nodes, and there are no long-chain ether bonds to intersperse to relieve stress, which increases the brittleness of the cured network and causes continuous accumulation of internal stress, leading to cracking; in comparative example 5, a single temperature curing is used during potting, resulting in a significant increase in curing shrinkage and mass loss rate. This may be because the stress is not released in stages, and the internal stress continues to accumulate during the curing process; the LED potting glue provided by the present application is significantly superior to the existing commercially available bisphenol A epoxy resin potting glue in key indicators such as curing shrinkage, mass loss rate, weather resistance, and fatigue resistance, meeting the needs of outdoor LED lamps for high reliability and long-life potting materials.

[0035] In summary, this application forms an interpenetrating polymer network structure through the synergistic action of multiple components such as alicyclic epoxy resin, anhydride curing agent, glycidyl ether toughening agent, and thermally initiated cationic curing agent, significantly improving the overall performance of the colloid. Combined with the anhydride curing agent vacuum dehydration and staged curing process, the material's curing shrinkage, mass loss rate, resistance to cold and hot shock, and weather resistance are significantly improved. Compared with traditional anhydride-cured bisphenol A epoxy resin systems and existing silicone potting compounds, this application demonstrates significant advantages in multiple key performance indicators, meeting the demand for high-reliability, long-life potting materials for outdoor LED lamps.

[0036] The above is merely an embodiment of the present invention and is not intended to limit the present invention. It will be apparent to those skilled in the art that various modifications and variations of the present invention are possible. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of the present invention shall be included within the scope of the claims of the present invention.

Claims

1. An LED potting compound, characterized in that: The composition is composed of the following components in parts by mass: 43.3~76.7 parts of alicyclic epoxy resin, 13~33 parts of glycidyl ether toughening agent, 0.15~0.95 parts of thermally initiated cationic curing agent, 0.05~0.25 parts of stabilizer, 0.1~0.5 parts of defoaming agent, 0~2 parts of light diffuser, and 10~20 parts of acid anhydride curing agent.

2. The LED potting compound according to claim 1, characterized in that: The alicyclic epoxy resin is one of 3,4-epoxycyclohexylmethyl-3'4'-epoxycyclohexylcarboxylate, 3,4-epoxy-1-cyclohexene, and dicyclopentadiene dioxide, or a mixture of any of them.

3. The LED potting compound according to claim 1, characterized in that: The glycidyl ether toughening agent is one of polypropylene glycol diglycidyl ether, polyethylene glycol diglycidyl ether, glycerol triglycidyl ether, or a mixture of any of the above.

4. The LED potting compound according to claim 1, characterized in that: The thermally initiated cationic curing agent is one of triaryl iodonium hexafluorophosphate, diaryl sulfonium hexafluorophosphate, triaryl sulfonium hexafluoroantimonate, triaryl iodonium hexafluoroantimonate, p-nitrobenzenediazonium tetrafluoroborate, and p-tolyldiazonium hexafluorophosphate, or a mixture of any of the above.

5. The LED potting compound according to claim 1, characterized in that: The stabilizer is at least one of disodium ethylenediaminetetraacetate and 2,2,6,6-tetramethylpiperidinyl oxide.

6. The LED potting compound according to claim 1, characterized in that: The defoaming agent is one or a mixture of any of polydimethylsiloxane, polyether-modified polysiloxane, fatty acid and esters thereof.

7. The LED potting compound according to claim 1, characterized in that: The acid anhydride curing agent is one of methylhexahydrophthalic anhydride, methyltetrahydrophthalic anhydride, methylnadic anhydride, and dodecenylsuccinic anhydride, or a mixture of any of them.

8. The LED potting compound according to claim 1, characterized in that: The light diffusing agent is nano silicon dioxide or polymethyl methacrylate microspheres.

9. A method for preparing an LED potting compound according to any one of claims 1 to 8, characterized in that: The following steps are involved: Dehydrate 10-20 parts of anhydride curing agent under vacuum at 40-50°C and store for later use; Add 43.3-76.7 parts of alicyclic epoxy resin, 13-33 parts of glycidyl ether toughening agent, 0.05-0.25 parts of stabilizer, 0.1-0.5 parts of defoaming agent and 0-2 parts of light diffuser to the container in the stated parts by mass and mix evenly. Then add 0.15-0.95 parts of thermally triggered cationic curing agent and stir and dissolve it under vacuum for 1-3 hours to obtain mixture a, which is stored for later use.

10. A method for using the LED potting compound according to claim 9, characterized in that: The method comprises the following steps: mixing 10 to 20 parts of the vacuum-dehydrated anhydride curing agent with the mixture a during potting; injecting the mixture into the LED module; pre-curing the mixture at 90 to 110° C. for 20 to 40 minutes; and then heating the mixture to 140 to 160° C. for curing for 40 to 60 minutes.

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