Edge sealing adhesive for high-performance wafer-level packaging and preparation method of edge sealing adhesive

Abstract

The invention relates to edge sealing glue for high-performance wafer-level packaging. The edge sealing glue comprises a component A and a component B, the component A is prepared from the following components in percentage by mass: 49.2 to 72.6 percent of novolac epoxy resin, 10 to 20 percent of bisphenol F epoxy resin, 5 to 10 percent of organic silicon modified epoxy resin, 10 to 15 percent of toughened epoxy resin, 0.1 to 0.3 percent of defoaming agent, 2 to 5 percent of thixotropic agent and 0.3 to 0.5 percent of antioxidant; the component B comprises the following components in percentage by mass: 89.5-99% of a curing agent and 1-10.5% of a curing agent accelerator, the four resins are mixed to form a high-crosslinking-degree net-shaped structure, and through scientific compatibility of the formula and clamping of the special curing agent, the product has the characteristics of enhanced structural cohesion strength, increased crosslinking density and good viscosity of the edge sealing adhesive, and the edge sealing adhesive has the advantages of high strength, high strength, high cross-linking degree and the like. The problems of solidification layering and poor binding force of the film material and the wafer are solved.

Description

Technical Field

[0001] The present invention relates to the field of wafer-level edge sealing adhesives, and in particular to an edge sealing adhesive for high-performance wafer-level packaging and a preparation method thereof. Background Art

[0002] Chips are the core of smart devices such as smartphones and wearable devices. With the development of semiconductor manufacturing technology and the market demand for high frequency and high power, chips are showing a development trend of miniaturization, integration and intelligence, which puts higher requirements on chip design. At the same time, the packaging quality of the wafer is a critical link. These factors directly determine the service life and performance of the chip.

[0003] Currently, wafer-level packaging in the industry typically uses specialized packaging materials, such as ABF film, DAF film, or high-performance encapsulation film. During the production process, these films undergo cutting, leveling, lamination, curing, and debonding to achieve effective bonding and packaging with the wafer. However, during the implementation of wafer-level packaging, there is a practical problem that cannot be ignored. Due to limitations in the production process, the airbags in the laminator cannot effectively cover all areas of the entire wafer. Especially at the edges of the wafer, the packaging film and wafer cannot fully fit or bond tightly. This significantly reduces the packaging effect in small areas of the wafer, wasting energy, reducing the yield rate, and increasing the production costs of packaging companies.

[0004] To address the numerous challenges facing the industry, researchers have conducted extensive research on packaging technology, processes, and materials, achieving some promising results. However, this approach still falls short of the actual requirements of packaging companies. The market urgently needs a packaging solution that can adapt to both the process requirements of industrialization and the application requirements of wafer-level packaging, thus meeting the stringent production and processing requirements of wafer-level packaging.

[0005] It should be noted that the information disclosed in the above background technology section is only used to enhance the understanding of the background of the present disclosure, and therefore may include information that does not constitute prior art known to ordinary technicians in the field. Summary of the Invention

[0006] In view of the deficiencies in the prior art, the present invention discloses a high-performance edge sealing adhesive for wafer-level packaging and a preparation method thereof.

[0007] The technical solutions adopted in the present invention are as follows: A high-performance edge sealing adhesive for wafer-level packaging comprises a component A and a component B. The component A comprises, by mass percentage, 49.2-72.6% of a novolac epoxy resin, 10-20% of a bisphenol F epoxy resin, 5-10% of a silicone-modified epoxy resin, 10-15% of a toughened epoxy resin, 0.1-0.3% of a defoamer, 2-5% of a thixotropic agent, and 0.3-0.5% of an antioxidant. The component B comprises, by mass percentage, 89.5-99% of a curing agent and 1-10.5% of a curing agent accelerator.

[0008] Furthermore, the component A and the component B are mixed uniformly in a ratio range of 100:10-82.

[0009] Furthermore, the novolac epoxy resin is a liquid novolac epoxy resin, and its epoxy equivalent weight ranges from 170 to 190 g / eq.

[0010] Furthermore, the bisphenol F epoxy resin is a liquid bisphenol F epoxy resin, and its epoxy equivalent range is 160~180g / eq.

[0011] Furthermore, the epoxy equivalent of the silicone modified epoxy resin is in the range of 180 to 850 g / eq. Furthermore, the toughened epoxy resin is one of nitrile rubber modified epoxy resin (RA1340), core-shell toughened epoxy resin (MX-136, MX-154), and bisphenol A type phenoxy resin (PKHH and PKHB), and the epoxy equivalent of the toughened epoxy resin ranges from 170 to 350 g / eq.

[0012] Furthermore, the defoaming agent is one of an organosilicon-modified defoaming agent (5300), a polysiloxane composite defoaming agent (BYK-A530), an organically modified polysiloxane defoaming agent (TEGO Airex 962), and a fluorosilicone polymer defoaming agent (Dow Corning 100F); the thixotropic agent is one of hydrophobic fumed silica (CAB-O-SIL TS 720), hydrophobic fumed silica (AEROSIL-R202), and hydrophilic fumed silica (wacker N20); and the antioxidant is one of tetraphenyl dipropylene glycol diphosphite (TP-10H), bis(2,4-di-tert-butylphenyl) pentaerythritol diphosphite (antioxidant 626), polyethylene glycol-modified phosphite (TP-20), and dilauryl thiodipropionate (TP-80).

[0013] Furthermore, the curing agent is one or more of polyetheramine (D-230, D-403), m-phenylenediamine, isophorone diamine, diethyltoluenediamine, 3,3-dimethyl-4,4-diaminodicyclohexylmethane, methylhexahydrophthalic anhydride, hexahydrophthalic anhydride, dicyandiamide and phenolic resin; the curing agent accelerator is one of tertiary amine curing agent accelerator (Accelerator 399), N-aminoethylpiperazine (AEP), 2-ethyl-4-methylimidazole (2E4MZ), 2-methylimidazoline (2MA-OK), complex amine curing agent accelerator (2014FG), and N,N'-dimethylurea (UR300).

[0014] A method for preparing a high-performance edge sealing adhesive for wafer-level packaging comprises the following steps: Step S1, adding the phenolic epoxy resin, bisphenol F epoxy resin, silicone modified epoxy resin and toughened epoxy resin in component A into a reaction kettle in proportion and heating and stirring, adding a defoamer, a thixotropic agent and an antioxidant during the stirring process, vacuum degassing the mixture after the stirring is completed, and discharging the mixture after passing the inspection for later use; Step S2: Mix the curing agent and curing agent accelerator of component B in proportion at room temperature, and unload the mixture after passing the inspection; Step S3: Component A and component B are mixed in proportion, and then the mixture is vacuum degassed, and a 10-30 μm adhesive layer is formed on the wafer surface by a dispensing machine; Step S4: the wafer surface is subjected to film lamination, leveling and lamination processes in sequence, and then heated and cured.

[0015] Furthermore, in step S1, the heating and stirring temperature range is 60-80°C, the stirring time range is 1-2 hours, and the vacuum degassing time range is 0.5-1 hour; In step S4 , the heat curing is first performed within a temperature range of 80 to 100° C. for 1 to 2 hours, and then within a temperature range of 130 to 150° C. for 2 to 3 hours.

[0016] The beneficial effects of the present invention are as follows: 1. The four resins are mixed, which contain a large number of polar groups such as phenolic hydroxyl groups, epoxy groups and ether bonds. The product can form a network structure with a high degree of cross-linking. The cohesive strength of the structure is enhanced, and the overall performance of the edge sealing adhesive is improved. In addition, the phenolic hydroxyl groups of the phenolic epoxy, the silane groups of the silicone modifier, and the polar end groups of the toughening agent can easily form hydrogen bonds with the wafer substrate, greatly improving the viscosity of the edge sealing adhesive, achieving effective bonding between the packaging film material and the wafer, and meeting the strict processing requirements of wafer-level packaging.

[0017] 2. Silicone-type epoxy resin is selected in the resin system to form a network structure with Si-O structure in the resin system. Si-O has large bond energy, good dimensional stability, and excellent heat resistance and aging resistance. At the same time, it is matched with antioxidants. This additive has a good heat resistance effect and delays the decomposition rate of the product under high temperature conditions. The combination of the two substances produces a comprehensive effect, which can greatly improve the temperature resistance of the edge sealing glue, thereby meeting the high reliability requirements of wafer-level packaging.

[0018] 3. The cross-linking density of the resin product is high, the density is high, and the gap between molecules is small. It is not easy for water molecules to enter the gap between the resin molecules, thereby improving the ability of the resin polymer to resist moisture erosion.

[0019] 4. Adjusting the ratio of high cross-link density resin and flexible resin can not only ensure that the material has a glass transition temperature of more than 140°C, but also ensure that the material has a good flexibility to resist external forces. Flexible resin can reduce the deformation of the material during curing and temperature changes, reduce the possibility of internal delamination and cracking of the material, ensure that the material has good anti-deformation effect, and has excellent applicability. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] Figure 1 Schematic diagram of the steps of the method for preparing edge sealing adhesive for high-performance wafer-level packaging. DETAILED DESCRIPTION

[0021] The specific embodiments of the present invention will be described below with reference to the accompanying drawings.

[0022] Example 1: A high-performance edge sealing adhesive for wafer-level packaging comprises a component A and a component B, wherein the mixing ratio of the components A and B is 100:82.

[0023] Component A includes the following components by mass percentage: 61% phenolic epoxy resin, 15% bisphenol F epoxy resin, 8% silicone modified epoxy resin, 12% toughened epoxy resin, 0.2% defoaming agent, 3.5% thixotropic agent and 0.3% antioxidant.

[0024] The novolac epoxy resin is liquid novolac epoxy resin SQPN-638, and the epoxy equivalent weight range is 170~190g / eq.

[0025] The bisphenol F epoxy resin is liquid bisphenol F epoxy resin EPIKOTE 862, and the epoxy equivalent weight range is 160-180 g / eq.

[0026] The organosilicon-modified epoxy resin is organosilicon-modified epoxy resin EPSI-3866, and the epoxy equivalent weight range is 180~850g / eq.

[0027] The toughened epoxy resin is nitrile rubber modified epoxy resin RA1340, and the epoxy equivalent weight range is 170~350g / eq.

[0028] The defoamer is the organic modified polysiloxane defoamer TEGO Airex 962.

[0029] The thixotropic agent is hydrophobic fumed silica CAB-O-SIL TS 720.

[0030] The antioxidant is tetraphenyldipropylene glycol diphosphite (TP-10H).

[0031] Component B includes 78.5% methyl hexahydrophthalic anhydride curing agent, 20% hexahydrophthalic anhydride curing agent, and 1.5% curing agent accelerator 2-ethyl-4-methylimidazole (2E4MZ).

[0032] Preparation method of edge sealing adhesive for high performance wafer level packaging, such as Figure 1 As shown, the following steps are included: Step S1, the phenolic epoxy resin, bisphenol F epoxy resin, silicone modified epoxy resin and toughened epoxy resin in component A are added into a reactor in proportion and heated and stirred. The reaction temperature is controlled at 60°C and the stirring time is 1.5 hours. A defoamer, a thixotropic agent and an antioxidant are added during the stirring process. After the stirring is completed, the mixture is vacuum degassed and unloaded after passing the inspection.

[0033] Step S2: Mix the curing agent and curing agent accelerator of component B in proportion at room temperature, and unload the mixture after passing the inspection for later use.

[0034] In step S3, component A and component B are mixed in a ratio of 100:82, and then the mixture is vacuum degassed and a 20 μm adhesive layer is formed on the surface of the wafer using a dispensing machine.

[0035] Step S4: The wafer surface is subjected to film lamination, leveling, and lamination processes in sequence, and then heat-cured at 90° C. / 1 h and 150° C. / 2 h.

[0036] Example 2: A high-performance edge sealing adhesive for wafer-level packaging comprises a component A and a component B, wherein the mixing ratio of the components A and B is 100:45.

[0037] Component A includes the following components by mass percentage: 63.3% phenolic epoxy resin, 12% bisphenol F epoxy resin, 12% silicone modified epoxy resin, 10% toughened epoxy resin, 0.3% defoaming agent, 4% thixotropic agent and 0.4% antioxidant.

[0038] The novolac epoxy resin is liquid novolac epoxy resin NPPN-638, and the epoxy equivalent weight range is 170~190g / eq.

[0039] The bisphenol F epoxy resin is bisphenol F epoxy resin EPIKOTE 862, and the epoxy equivalent weight range is 160-180 g / eq.

[0040] The organosilicon-modified epoxy resin is organosilicon-modified epoxy resin ALBIFLEX 296, and the epoxy equivalent weight range is 180~850g / eq.

[0041] The toughened epoxy resin is a core-shell toughened epoxy resin MX-154, and the epoxy equivalent weight range is 170~350g / eq.

[0042] The defoaming agent is silicone modified defoaming agent 5300.

[0043] The thixotropic agent is hydrophilic fumed silica Wacker N20.

[0044] The antioxidant is dilauryl thiodipropionate TP-80.

[0045] Component B contains 74.5% curing agent polyetheramine D-230, 15% curing agent m-xylylenediamine, and 10.5% tertiary amine curing agent accelerator Accelerator 399.

[0046] Preparation method of edge sealing adhesive for high performance wafer level packaging, such as Figure 1 As shown, the following steps are included: Step S1, adding the phenolic epoxy resin, bisphenol F epoxy resin, silicone modified epoxy resin and toughened epoxy resin in component A into a reactor in proportion and heating and stirring, the reaction temperature is controlled at 80° C., the stirring time is 1 hour, and a defoamer, a thixotropic agent and an antioxidant are added during the stirring process. After the stirring is completed, the mixture is vacuum degassed and unloaded after passing the inspection for later use; Step S2: Mix the curing agent and curing agent accelerator of component B in proportion at room temperature, and unload the mixture after passing the inspection; Step S3: Component A and component B are mixed in a ratio of 100:45, and then the mixture is vacuum degassed and a 15 μm adhesive layer is formed on the wafer surface using a dispensing machine; Step S4: The wafer surface is subjected to film lamination, leveling and lamination processes in sequence, and then heat-cured at 80° C. / 1.5 h and 130° C. / 3 h.

[0047] Example 3: A high-performance edge sealing adhesive for wafer-level packaging comprises a component A and a component B, wherein the mixing ratio of the components A and B is 100:12.

[0048] Component A includes the following components by mass percentage: 54.4% phenolic epoxy resin, 20% bisphenol F epoxy resin, 5% silicone modified epoxy resin, 15% toughened epoxy resin, 0.1% defoaming agent, 5% thixotropic agent and 0.5% antioxidant.

[0049] The novolac epoxy resin is novolac epoxy resin ARALDITE PY 307-1, and the epoxy equivalent weight range is 170~190g / eq.

[0050] The bisphenol F epoxy resin is bisphenol F epoxy resin NPEF-165, and the epoxy equivalent weight ranges from 160 to 180 g / eq.

[0051] The organosilicon-modified epoxy resin is organosilicon-modified epoxy resin KR-470, and the epoxy equivalent weight range is 180~850g / eq.

[0052] The toughened epoxy resin is bisphenol A type phenoxy resin PKHH, and the epoxy equivalent range is 170~350g / eq.

[0053] The defoamer is polysiloxane composite defoamer BYK-A530.

[0054] The thixotropic agent is hydrophobic fumed silica CAB-O-SIL TS 720.

[0055] The antioxidant is bis(2,4-di-tert-butylphenyl) pentaerythritol diphosphite 626.

[0056] Component B contains 90% dicyandiamide curing agent and 10% complex amine curing agent accelerator 2014FG.

[0057] Preparation method of edge sealing adhesive for high performance wafer level packaging, such as Figure 1 As shown, the following steps are included: Step S1, adding the phenolic epoxy resin, bisphenol F epoxy resin, silicone modified epoxy resin and toughened epoxy resin in component A into a reactor in proportion and heating and stirring, the reaction temperature is controlled at 70° C., the stirring time is 2 hours, and a defoamer, a thixotropic agent and an antioxidant are added during the stirring process. After the stirring is completed, the mixture is vacuum degassed and unloaded after passing the inspection for later use; Step S2: Mix the curing agent and curing agent accelerator of component B in proportion at room temperature, and unload the mixture after passing the inspection; Step S3: Component A and component B are mixed in a ratio of 100:12, and then the mixture is vacuum degassed and a 25 μm adhesive layer is formed on the wafer surface using a dispensing machine; Step S4: The wafer surface is sequentially subjected to film lamination, leveling, and lamination processes, and then heat-cured at 100° C. / 1 h and 150° C. / 2.5 h.

[0058] Example 4: A high-performance edge sealing adhesive for wafer-level packaging comprises a component A and a component B, wherein the mixing ratio of the components A and B is 100:63.

[0059] Component A includes the following components by mass percentage: 68.4% phenolic epoxy resin, 10% bisphenol F epoxy resin, 6% silicone modified epoxy resin, 13% toughened epoxy resin, 0.2% defoaming agent, 2% thixotropic agent and 0.4% antioxidant.

[0060] The novolac epoxy resin is novolac epoxy resin SQPN-638, and the epoxy equivalent weight range is 170~190g / eq.

[0061] The bisphenol F epoxy resin is bisphenol F epoxy resin 830S, and the epoxy equivalent weight ranges from 160 to 180 g / eq.

[0062] The organosilicon-modified epoxy resin is organosilicon-modified epoxy resin EPSI-6862, and the epoxy equivalent weight range is 180~850g / eq.

[0063] The toughened epoxy resin is a core-shell toughened epoxy resin MX-136 with an epoxy equivalent weight ranging from 170 to 350 g / eq.

[0064] The defoaming agent is fluorosilicone polymer defoaming agent Dow Corning 100F.

[0065] The thixotropic agent is hydrophobic fumed silica (AEROSIL-R202).

[0066] The antioxidant is polyethylene glycol modified phosphite TP-20.

[0067] Component B contains 98% phenolic resin and 2% curing agent accelerator 2-methylimidazoline 2MA-OK.

[0068] Preparation method of edge sealing adhesive for high performance wafer level packaging, such as Figure 1 As shown, the following steps are included: Step S1, adding the phenolic epoxy resin, bisphenol F epoxy resin, silicone modified epoxy resin and toughened epoxy resin in component A into a reactor in proportion and heating and stirring, the reaction temperature is controlled at 65° C., the stirring time is 1.5 hours, and a defoamer, a thixotropic agent and an antioxidant are added during the stirring process. After the stirring is completed, the mixture is vacuum degassed and unloaded after passing the inspection for later use; Step S2: Mix the curing agent and curing agent accelerator of component B in proportion at room temperature, and unload the mixture after passing the inspection; Step S3: Component A and component B are mixed in a ratio of 100:63, and then the mixture is vacuum degassed and a 25 μm adhesive layer is formed on the wafer surface using a dispensing machine; Step S4: The wafer surface is sequentially subjected to film lamination, leveling, and lamination processes, and then heat-cured at 100° C. for 1.5 h and 145° C. for 2 h.

[0069] Example 5: The difference from Example 1 is that: Component B includes 78.5% polyetheramine D-403, 20% isophorone diamine, and 1.5% curing agent accelerator N,N'-dimethylurea UR300.

[0070] Example 6: The difference from Example 1 is that: Component B includes 78.5% diethyltoluenediamine, 20% 3,3-dimethyl-4,4-diaminodicyclohexylmethane, and 1.5% curing agent accelerator N-aminoethylpiperazine AEP.

[0071] Product performance testing: Test group: Samples were randomly selected from the products prepared in Examples 1 to 6.

[0072] Table 1 Test items Test conditions unit Example 1 Example 2 Example 3 Example 4 Example 5 Example 6 Shear strength 25℃ MPa 11.6 10.7 12.9 12.3 13.4 11.8 Elongation at break 25℃ % 8.6 10.7 8.3 8.0 8.5 8.6 Young's modulus 25℃ GPa 7.5 6.2 8.3 8.5 7.6 7.9 Glass transition temperature DSC, 10℃ / min ℃ 152.6 141.5 175.8 162.7 156.3 166.1 High temperature resistance 200℃ / 96h weight loss % 1.25 1.56 0.75 1.13 1.39 1.44 PCT water absorption 121℃, RH100 / 24h % 0.35 0.66 0.79 0.29 0.47 0.36 Thermal shock test -50℃-150℃ cracking Number of cycles 105 90 155 125 109 142 Analysis of test results: The above table lists the performance comparison results of Examples 1-6 of the present invention. It can be seen that the examples provided by the present invention have excellent bonding performance, high temperature resistance, outstanding moisture absorption and good reliability, and meet the technical requirements of edge sealing adhesives for wafer-level packaging.

[0073] Specifically, the shear strength of the six examples is higher than 10MPa, the elongation at break is greater than 8%, and the bonding performance is good; the glass transition temperature of the six examples is higher than 140℃, and they have good processing performance of thermosetting epoxy resin; the thermal weight loss at 200℃ / 96h is less than 2%, indicating that the six examples have low thermal degradation at high temperatures and have good high-temperature stability; and the PCT water absorption rate of the six examples is less than 1%, and the hot and cold shock tests are all higher than 90 cycles, which reflects the moisture and heat resistance and high reliability of the edge sealing adhesive.

[0074] The technical features of the above-mentioned embodiments can be combined arbitrarily. In order to make the description concise, not all possible combinations of the technical features in the above-mentioned embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0075] The above-described embodiments merely illustrate several implementations of the present invention, and while their descriptions are relatively specific and detailed, they should not be construed as limiting the scope of the patent. It should be noted that a person skilled in the art would be able to make numerous variations and improvements without departing from the spirit of the present invention, all of which fall within the scope of protection of the present invention. Therefore, the scope of protection of the patent for this invention shall be determined by the appended claims.

Claims

1. A high-performance edge sealing adhesive for wafer-level packaging, characterized by: Includes component A and component B; The component A comprises the following components by mass percentage: 49.2-72.6% phenolic epoxy resin, 10-20% bisphenol F epoxy resin, 5-10% organosilicon modified epoxy resin, 10-15% toughened epoxy resin, 0.1-0.3% defoaming agent, 2-5% thixotropic agent and 0.3-0.5% antioxidant; The component B includes the following components by mass percentage: 89.5-99% curing agent and 1-10.5% curing agent accelerator.

2. The high-performance edge sealing adhesive for wafer-level packaging according to claim 1, characterized in that: The components A and B are mixed evenly in a ratio of 100:10-82.

3. The high-performance edge sealing adhesive for wafer-level packaging according to claim 1, characterized in that: The novolac epoxy resin is a liquid novolac epoxy resin, and its epoxy equivalent range is 170-190 g / eq.

4. The high-performance edge sealing adhesive for wafer-level packaging according to claim 1, characterized in that: The bisphenol F epoxy resin is a liquid bisphenol F epoxy resin, and its epoxy equivalent range is 160-180 g / eq.

5. The high-performance edge sealing adhesive for wafer-level packaging according to claim 1, characterized in that: The epoxy equivalent weight of the organosilicon-modified epoxy resin is in the range of 180 to 850 g / eq.

6. The high-performance edge sealing adhesive for wafer-level packaging according to claim 1, characterized in that: The toughened epoxy resin is one of nitrile rubber modified epoxy resin (RA1340), core-shell toughened epoxy resin (MX-136, MX-154), and bisphenol A type phenoxy resin (PKHH and PKHB). The epoxy equivalent of the toughened epoxy resin ranges from 170 to 350 g / eq.

7. The high-performance edge sealing adhesive for wafer-level packaging according to claim 1, characterized in that: The defoamer is one of an organosilicon-modified defoamer (5300), a polysiloxane composite defoamer (BYK-A530), an organically modified polysiloxane defoamer (TEGO Airex 962), and a fluorosilicone polymer defoamer (Dow Corning 100F); The thixotropic agent is one of hydrophobic fumed silica (CAB-O-SIL TS 720), hydrophobic fumed silica (AEROSIL-R202) and hydrophilic fumed silica (wacker N20); The antioxidant is one of tetraphenyl dipropylene glycol diphosphite (TP-10H), bis(2,4-di-tert-butylphenyl) pentaerythritol diphosphite (antioxidant 626), polyethylene glycol modified phosphite (TP-20), and dilauryl thiodipropionate (TP-80).

8. The high-performance edge sealing adhesive for wafer-level packaging according to claim 1, characterized in that: The curing agent is one or more of polyetheramine (D-230, D-403), m-xylenediamine, isophorone diamine, diethyltoluenediamine, 3,3-dimethyl-4,4-diaminodicyclohexylmethane, methylhexahydrophthalic anhydride, hexahydrophthalic anhydride, dicyandiamide and phenolic resin; The curing agent accelerator is one of tertiary amine curing agent accelerator (Accelerator 399), N-aminoethylpiperazine (AEP), 2-ethyl-4-methylimidazole (2E4MZ), 2-methylimidazoline (2MA-OK), complex amine curing agent accelerator (2014FG), and N,N'-dimethylurea (UR300).

9. A method for preparing a high-performance edge sealant for wafer-level packaging according to any one of claims 1 to 8, characterized in that: The following steps are involved: Step S1, adding the phenolic epoxy resin, bisphenol F epoxy resin, silicone modified epoxy resin and toughened epoxy resin in component A in proportion to a reactor, heating and stirring, adding a defoamer, a thixotropic agent and an antioxidant during the stirring process, vacuum degassing the mixture after the stirring is completed, and discharging the mixture after passing the inspection for later use; Step S2: Mix the curing agent and curing agent accelerator of component B in proportion at room temperature, and unload the mixture after passing the inspection; Step S3: Component A and component B are mixed in proportion, and then the mixture is vacuum degassed, and a 10-30 μm adhesive layer is formed on the wafer surface by a dispensing machine; Step S4: the wafer surface is subjected to film lamination, leveling and lamination processes in sequence, and then heated and cured.

10. The method for preparing a high-performance edge sealant for wafer-level packaging according to claim 9, wherein: In step S1, the heating and stirring temperature range is 60-80°C, the stirring time range is 1-2 hours, and the vacuum degassing time is 0.5-1 hour; In step S4 , the heat curing is first performed within a temperature range of 80 to 100° C. for 1 to 2 hours, and then within a temperature range of 130 to 150° C. for 2 to 3 hours.

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