Integrated laser processing path planning system and method with positioning and monitoring functions

Abstract

The invention discloses an integrated laser processing path planning system and method with positioning and monitoring functions, and relates to the technical field of laser processing path planning, and the method comprises the following steps: collecting information of a current to-be-processed part, including a processing surface, a processing mode and a process requirement, and generating an initial laser processing path based on the part information; the method comprises the following steps: analyzing thermal relevance of different processing surfaces, carrying out data acquisition on surface heat of the processing surfaces in a processing process based on a thermal imaging sensor, monitoring laser processing surface heat and setting a critical value, judging the temperature of the processing surfaces in a processing state based on the critical value, and generating a dynamic adjustment planning path based on a judgment result; and receiving the dynamic adjustment planning path in the machining process. The thermal imaging sensor is used for collecting heat data of the machining surface in real time, the critical value is set in combination with material attributes and machining parameters, the temperature of the machining surface in the machining process is judged, and the machining path is dynamically planned and adjusted.

Description

Technical Field

[0001] The present invention belongs to the technical field of laser processing path planning, and relates to laser processing path dynamic planning, thermal impact control and multi-sensor information fusion control technology. Specifically, it relates to an integrated laser processing path planning system and method with positioning and monitoring functions. Background Art

[0002] Laser is a type of high-intensity coherent light produced by stimulated emission of radiation. During laser processing, a laser generator generates a laser beam. After the beam is focused by an optical system, its energy is highly concentrated. When the focused laser beam strikes the surface of a material, the material absorbs the laser energy, converting it into heat. This causes the surface temperature to rise sharply in a very short period of time, leading to physical changes such as melting, vaporization, and ablation of the material. This enables processing operations such as cutting, welding, drilling, and marking. Laser processing technology offers the advantages of non-contact, high efficiency, and high precision, making it an important advanced manufacturing method in fields such as aerospace, automotive, mold manufacturing, and medical devices.

[0003] Existing laser processing path planning methods are mostly static planning, that is, processing is performed according to the sequence and path pre-set by CAD / CAM modeling. However, this type of path planning scheme lacks real-time feedback and dynamic control capabilities for the actual processing status. During the laser processing process, due to the characteristics of laser processing, a large amount of heat is generated during the process, causing localized heating of the material and forming a heat-affected zone. This can easily cause material deformation, cracks, or surface quality degradation, resulting in the processed surface not meeting the processing requirements.

[0004] Traditional path control systems, often based on open-loop position and velocity control architectures, fail to effectively integrate real-time sensing and feedback control of laser thermal effects. This is particularly true when performing continuous laser operations on complex parts with multiple processing surfaces or non-uniform thicknesses. Coupled analysis and intelligent response to path planning and thermal field conditions are impossible. Thermal properties such as thermal conductivity and specific heat capacity of materials change dynamically under high-temperature laser conditions, leading to significant deviations between theoretical heat distribution and actual temperature rise during processing.

[0005] On the other hand, with the development of sensing technologies such as machine vision and infrared thermal imaging, some laser processing systems have attempted to incorporate infrared thermal imagers for surface temperature monitoring, or use high-precision visual positioning cameras for workpiece posture recognition and processing surface tracking. However, these sensing mechanisms are primarily used for post-processing quality assessment and have not yet formed a closed-loop linkage with the processing path scheduling mechanism. Due to the lack of a path planning and control model based on the relationship between processing thermal load status and thermal coupling, it remains difficult to achieve active dynamic reconstruction of the laser processing path to avoid heat accumulation and improve overall processing quality and efficiency.

[0006] Furthermore, most existing machining path planning systems are limited in terms of functional integration. Geometric path planning, process parameter setting, thermal field monitoring, and equipment motion control are typically deployed in a decentralized manner. This lack of cross-module data fusion and joint decision-making mechanisms limits the system's adaptability and collaborative optimization capabilities in complex application scenarios. Although existing technologies such as Chinese patents CN112427655B and CN119249921A utilize temperature uniformity factors and predictive modeling algorithms, respectively, to achieve path optimization, the former focuses on real-time path planning based on temperature uniformity factors and fails to establish a multi-faceted thermal coupling control mechanism. While the latter possesses global predictive capabilities, its batch processing mode based on fixed-time sampling results in response delays.

[0007] In summary, existing laser machining path planning solutions are unable to dynamically adjust the machining path during the machining process based on the heat accumulation of the specific machining surface, resulting in low practicality and functionality. Currently, no effective solutions have been proposed to address these issues. Therefore, how to construct an integrated laser machining path planning technology solution with real-time monitoring, thermal coupling analysis, and dynamic path reconstruction capabilities while ensuring machining accuracy is a technical problem that needs to be solved in the field of laser machining path planning and control systems. Summary of the Invention

[0008] (1) Purpose of the invention In response to the above-mentioned problems existing in the relevant existing technologies, the present invention proposes an integrated laser processing path planning system and method with positioning and monitoring functions. By integrating thermal imaging sensors, high-precision visual positioning devices and motion control systems, combined with thermal correlation analysis of the processing surface and dynamic path reconstruction algorithms, real-time monitoring of heat distribution during processing and adaptive optimization adjustment of the processing path are achieved. The present invention sets a critical heat value based on material properties and process parameters, and constructs a thermal coupling-driven path switching mechanism through dynamic judgment of the processing surface temperature and prediction of thermal load changes to avoid part deformation and processing defects caused by excessive heat concentration. At the same time, the system integrates visual perception and path interpolation algorithms to improve the coordination between the processing path and the actual position of the workpiece, thereby realizing high-precision and high-stability intelligent planning of laser processing paths and closed-loop control of thermal effects.

[0009] (2) Technical solution In order to achieve the purpose of the invention and solve the technical problems, the present invention adopts the following technical solutions: The first object of the present invention is to provide an integrated laser processing path planning method with positioning and monitoring functions, which is used to dynamically plan and execute the laser processing path under thermal effect control for a part to be processed with multiple processing surfaces. The method includes the following steps: S100. Parts information collection and initial path generation: Collect information about the part to be processed, including at least geometric information, material properties, processing surface, processing method, and process requirements, and generate an initial laser processing path for each processing surface based on the part information; S200. Thermal Correlation Analysis and Dynamic Path Adjustment: Based on the thermophysical properties of the part material, a heat conduction equation and boundary conditions are constructed to analyze the thermal correlation between different machined surfaces. Surface heat data of the current machined surface is collected, and the predicted heat of the remaining unmachined surfaces is calculated based on the thermal correlation. The surface heat of the current machined surface is determined, and if it exceeds a preset critical value, a dynamic adjustment planning path is generated based on the predicted heat ranking of the unmachined surfaces. S300. Part positioning and path execution control: The visual positioning device captures the part position and processing surface information in real time and converts it into the world coordinate system. The trajectory is interpolated with the received dynamic path to generate a smooth processing trajectory. The motion control system drives the laser equipment to complete the path execution and realize automatic adjustment of the laser processing path.

[0010] The second invention object of the present invention is to provide an integrated laser processing path planning system with positioning and monitoring functions. The integrated laser processing path planning method with positioning and monitoring functions of the present invention includes a data acquisition module, a processing surface path planning module, a closed-loop control module, a temperature monitoring module, and a dynamic adjustment module, wherein: The data acquisition module is used to collect the information of the parts to be processed, including the processing surface, processing method, and process requirements. MySQL Establish a parts machining surface database, number different machining surfaces and create files, which include the dimensions and machining requirements of the machining surfaces; The processing surface path planning module generates laser processing plans for different processing surfaces based on CAM software, combined with the current part's CAD 3D drawing and part processing requirements, and records the laser processing plans for different processing surfaces in the corresponding processing surface files; The closed-loop control module integrates a thermal imaging sensor, a laser processing device, and a motion control system to control the laser processing device to process parts according to a set processing path; The temperature monitoring module analyzes the thermal correlation between different machining surfaces of a part based on the information in the various machining surface files in the part machining surface database, obtains the amount of heat conduction between the different machining surfaces during machining, collects the heat data of the machining surfaces during machining, and calculates the predicted heat of the remaining machining surfaces based on the heat conduction; The dynamic adjustment module sets the critical value of part laser processing in combination with material properties and processing parameter requirements, determines the real-time heat of the processing surface during processing, and generates a dynamic adjustment planning path based on the heat determination result of the processing surface during processing and combined with the predicted heat of the remaining processing surfaces, and transmits it to the closed-loop control module.

[0011] (3) Technical effects Compared with the existing technology, the integrated laser processing path planning system and method with positioning and monitoring functions of the present invention has the following beneficial and significant technical effects: 1. The present invention monitors the heat of the initial processing surface during laser processing and predicts the heat conditions of other processing surfaces. When the initial processing surface does not meet the processing requirements of the current part, the laser processing surface is switched based on the heat conditions of other processing surfaces. This can achieve dynamic planning of the processing path during laser processing, enhancing the practicality and functionality of the method. 2. The present invention can quantify the heat conduction between different processing surfaces through thermal correlation analysis. By calculating the heat conduction equation and boundary conditions, it can accurately obtain the distribution and transfer information of heat between different processing surfaces. During the processing, heat changes can be predicted in advance to avoid local overheating that may lead to part deformation or material performance degradation. 3. The present invention uses a thermal imaging sensor to collect heat data of the processing surface in real time, sets a critical value based on material properties and processing parameters, and determines the temperature of the processing surface during the processing process. When the temperature approaches or exceeds the critical value, the processing path can be adjusted in time, and the processing surface with low thermal correlation is preferentially selected for processing, thereby ensuring the continuity of laser processing and the quality stability of parts. 4. The present invention integrates thermal imaging sensors, laser processing equipment and motion control systems through a closed-loop control module, and can automatically process parts according to the set processing path. At the same time, the dynamic adjustment module generates a dynamic adjustment planning path based on temperature monitoring and other factors, and transmits it to the closed-loop control module to realize automatic adjustment of the processing path, thereby improving the flexibility and adaptability of processing. BRIEF DESCRIPTION OF THE DRAWINGS

[0012] In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the following briefly introduces the drawings required for use in the embodiments. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative work.

[0013] Figure 1 is a flow chart of an integrated laser processing path planning method with positioning and monitoring functions according to an embodiment of the present invention; Figure 2This is a block diagram of an integrated laser processing path planning system with positioning and monitoring functions according to an embodiment of the present invention. DETAILED DESCRIPTION

[0014] According to an embodiment of the present invention, an integrated laser machining path planning system and method with positioning and monitoring functions are provided for dynamically planning and executing laser machining paths for a part to be machined with multiple machining surfaces under thermal control. To further illustrate various embodiments, the present invention provides accompanying drawings, which form part of the disclosure and are primarily used to illustrate the embodiments and, in conjunction with the relevant description in the specification, to explain the operating principles of the embodiments. By referring to these drawings, those skilled in the art should be able to understand other possible implementations and the advantages of the present invention. The components in the drawings are not drawn to scale, and similar component symbols are generally used to represent similar components.

[0015] Example 1: Laser processing path planning method As a specific example, Figure 1 As shown, the embodiment of the present invention provides an integrated laser processing path planning method with positioning and monitoring functions, which mainly includes the following steps when implemented: S100. Parts information collection and initial path generation: Collect the information of the part to be processed, including at least geometric information, material properties, processing surface, processing method, and process requirements, and generate the initial laser processing path for each processing surface based on the part information.

[0016] As a preferred embodiment, S100 includes at least the following sub-steps when implemented: S110. Import the drawing of the part to be processed into the CAD software to obtain the basic information of the part to be processed, including shape, size, material and processing surface. MySQL Establish a parts machining surface database, number different machining surfaces and create files, which include the dimensions and machining requirements of the machining surfaces; It should be noted that the size of the processing surface is different for different laser processing. In plane processing, it usually refers to the maximum length and width dimensions of the processing surface. In contour processing, it refers to the contour size of the processing surface, including the size of complex curves or shapes. In etching processing, the size refers to the etching depth, that is, the depth of the groove or pattern etched by the laser on the surface of the material. At the same time, the size of the processing surface also includes the material thickness and hole diameter. The processing requirements include surface roughness, dimensional accuracy, position accuracy, etc.

[0017] S120. Import the part drawing into the CAM software, generate laser processing plans for different processing surfaces based on the part processing requirements, and record them in the corresponding processing surface files.

[0018] As a preferred embodiment, in step S100, the collection of part information also includes the detection and recording of the part clamping posture, coordinate system reference and possible obstructing structures; the processing surface information also includes the normal vector, area, heat conduction boundary and adjacent relationship of the processing surface, and the adjacent surface pairs connected by the heat conduction path are identified through the spatial topology analysis method, and the association data structure between the processing surfaces is established for subsequent thermal coupling modeling and processing path switching priority calculation.

[0019] S200. Thermal Correlation Analysis and Dynamic Path Adjustment: Based on the thermophysical properties of the part material, heat conduction equations and boundary conditions are constructed to analyze the thermal correlation between different processing surfaces. The surface heat data of the current processing surface is collected, and the predicted heat of the remaining unprocessed surfaces is calculated based on the thermal correlation. The surface heat of the current processing surface is determined. If it exceeds the preset critical value, a dynamic adjustment planning path is generated based on the predicted heat ranking of the unprocessed surfaces.

[0020] As a preferred embodiment, S200 includes at least the following sub-steps when implemented: S210 based on the information in the files of each processing surface, the thermal correlation between different processing surfaces is analyzed to obtain the amount of heat conduction between different processing surfaces during the processing; S220. A thermal imaging sensor is provided at the laser cutter head to collect surface heat data of the current processing surface during processing. The predicted heat of the remaining processing surfaces is calculated based on the amount of heat conduction between the different processing surfaces. S230. Based on the part material properties and processing parameter requirements, a heat threshold is set to determine the real-time heat of the current processing surface during processing. If the heat threshold is exceeded, a dynamic adjustment planning path is generated based on the predicted heat ranking of the remaining processing surfaces.

[0021] Further preferably, S210 includes at least the following sub-steps when implemented: S211. Obtain the part processing surface density based on the material of the current processing part ρ , specific heat capacity c and thermal conductivity τ , calculate the heat conduction equation of the current part, and the algorithm formula is: in, Q Input energy for the laser processing of the current part processing surface, Represents the heat capacity term, which is the amount of heat absorbed or released by a unit volume of material due to temperature change per unit time. It represents the heat conduction caused by temperature gradient, that is, the diffusion of heat from high temperature area to low temperature area. T represents temperature, tRepresents time; It should be noted that by solving this heat conduction equation, we can obtain the change of the temperature field inside the material over time. Considering the physical properties of the material itself, including density, specific heat capacity, thermal conductivity, and the influence of external laser processing energy on the temperature change inside the material, the internal temperature distribution of the material calculated by the heat conduction equation is the basis for subsequent boundary condition analysis.

[0022] S212. Based on the heat conduction equation and the heat exchange process on the machining surface, the boundary conditions are calculated using the following formula: in, τ represents the thermal conductivity of the material, Represents the partial derivative of temperature with respect to the normal direction, indicating the rate of change of temperature in the normal direction of the boundary, q s represents the heat flux source intensity of the processing surface, h represents the convection heat transfer coefficient, T 、 T 0 represents the surface temperature of the processing surface and the ambient temperature, represents the heat flux density at the boundary by heat conduction, Represents the total heat flux density at the boundary; It should be noted that represents the intensity of the heat flux source on the processing surface, which indicates the amount of heat entering or flowing out of the processing surface per unit area per unit time. In laser processing, it can be calculated based on the laser power and scanning speed. represents the convective heat transfer coefficient, which describes the convective heat transfer capacity between the surface of the object and the surrounding fluid. The boundary condition equation describes the equilibrium relationship of heat exchange at the material boundary, that is, the amount of heat entering the boundary through heat conduction is equal to the sum of the heat generated by the processing surface itself and the heat from the surface and the environment through convective heat transfer. The boundary condition equation is used to solve the temperature distribution or heat flux density at the material boundary. Given the thermal conductivity of the material, the intensity of the heat flux source on the processing surface, the convective heat transfer coefficient and the ambient temperature, the temperature gradient at the boundary is calculated, and then the temperature distribution or heat flux density at the boundary is obtained.

[0023] S213. Calculate the thermal correlation coefficient between different processing surfaces to obtain the distribution and transfer of heat between the different processing surfaces. The specific steps are as follows: The temperature distribution inside and at the boundary of the machining surface is calculated using the heat conduction equation. Combined with the boundary conditions, the heat flux density is calculated from the first i The first processing surface is transmitted to the j Heat conduction of the processed surface q ij , where the heat flux is , calculate the thermal correlation coefficient between different processing surfaces: in, A ij is the thermal correlation coefficient, For the processing surface i The amount of heat transferred to all machined surfaces.

[0024] It should be noted that the thermal correlation matrix provides a quantitative way to describe the degree of thermal correlation between different processing surfaces, which facilitates the prediction of heat distribution between different processing surfaces and thus provides data support for subsequent technologies.

[0025] As a preferred embodiment, S220 includes at least the following sub-steps when implemented: S221. A thermal imaging sensor is installed at the laser cutter head to collect thermal data from the processing surface during processing and establish a temperature field. The algorithm is as follows: in, T s(x,y,t) Represents the reconstructed temperature field, that is, the spatial position ( x , y ) in time t The temperature value, n Represents the number of thermal imaging sensors, T e,i(t) Representative i Sensors at time t The temperature value, ω i ( x , y ) represents the corresponding impact weight; It should be noted that the weight function needs to take into account factors such as the position and sensitivity of the sensor, as well as the geometric shape and thermal conduction characteristics of the processing surface. The appropriate form of the weight function is determined by fitting experimental data. For areas closer to the sensor, the weight can be relatively large, while the weight of areas farther away is smaller. Based on the reconstructed temperature field, the heat conduction amount of the current processing surface is calculated to provide data support for subsequent predictions.

[0026] S222. Calculate the predicted heat of different processing surfaces using the following formula: in, Represents the unprocessed surface i The spatial position on x , y ) in time t The predicted heat A ij 、 q j(t) Represent the thermal correlation coefficient and jThe processing surface in time t The heat flux density, m It is the number of all machining surfaces in machining state at the current moment.

[0027] It should be noted that after a processing surface being processed is determined as a reference surface, the heat of other non-processing surfaces can be predicted through the known thermal correlation matrix and the heat correlation of other processing surfaces. The thermal correlation matrix is used to consider the heat conduction relationship between different processing surfaces. If the value of is large, it means that the thermal correlation between the th and th processing surfaces is strong, then the heat of the th processing surface will be greatly affected by the th processing surface.

[0028] As a preferred embodiment, S230 includes at least the following sub-steps when implemented: S231. Based on the number of machined surfaces of the part N , taking the machining surface in the machining state as the reference surface, based on the machining time t Calculate the predicted heat of different other unprocessed surfaces separately Q N ; It should be noted that the critical value of laser processing of parts needs to be set by considering the thermophysical properties of the material, the processing parameter requirements and the laser processing setting parameters. It can be set through thermophysical property testing or by consulting experts in related fields through empirical methods.

[0029] S232. Based on the current part material and processing parameter requirements, combined with the laser processing setting parameters, set the heat threshold for the part laser processing Q max ; S233. Current processing surface temperature field obtained using thermal imaging sensor T s(x,y,t) , real-time calculation of the temperature difference between different unprocessed surfaces , and Δ Q N Δ of different unprocessed surfaces >0 Q N Sort in descending order; when T s(x,y,t) > Q max When the number of unprocessed surfaces in descending order is reached, the planned path is dynamically adjusted based on the descending order, the laser processing of the current processing surface is stopped, and the unprocessed surface that is first in the descending order is selected for laser processing; S234 determines the new processing surface as the reference processing surface, continues to calculate the predicted heat of the remaining unprocessed surfaces, when the temperature of the reference processing surface is higher than the critical value, then repeat step S233, continue to select a new unprocessed surface for laser processing, when there is no satisfying Δ QN When >0, stop part processing.

[0030] It should be noted that, by Q N The heat conditions of the remaining processing surfaces when >0 are arranged in descending order, and the processing surface with the smallest thermal correlation is preferentially selected for processing to ensure the continuity of laser processing.

[0031] S300. Part positioning and path execution control: The visual positioning device captures the part position and processing surface information in real time and converts it into the world coordinate system. The trajectory is interpolated with the received dynamic path to generate a smooth processing trajectory. The motion control system drives the laser equipment to complete the path execution and realize automatic adjustment of the laser processing path.

[0032] As a preferred embodiment, S300 includes at least the following sub-steps when implemented: S310. A high-precision vision positioning camera mounted above or to the side of the machining area captures part position and machined surface information, including its shape and texture, in real time. Image processing algorithms are then used to extract machining quality features, including surface cracks and melt pool shape. S320. Calibrate the vision positioning camera using a calibration plate to obtain the camera's focal length, distortion coefficient, and the conversion matrix between the camera coordinate system and the world coordinate system. Convert the part position captured by the vision positioning camera to the world coordinate system of the laser processing equipment. S330. Based on the received dynamically adjusted planned path, the adjusted path is interpolated to generate a smooth motion trajectory, and the interpolated path is sent to the motion control system to control the X, Y, and Z axis motion of the laser processing equipment to adjust the processing path planning.

[0033] Further preferably, in S330, the adjusted path is interpolated, including speed segmentation, acceleration and deceleration smoothing, and posture and attitude solution processing of the laser processing path, and the path continuity constraint conditions before and after interpolation are introduced to ensure a smooth transition of the trajectory without sudden jumps; the processing path interpolation algorithm supports spline interpolation, B-spline curve or quintic polynomial interpolation to achieve high-precision path control and instruction issuance during continuous processing.

[0034] Example 2: Laser Processing Path Planning System On the basis of the above embodiment 1, Figure 2As shown, this embodiment 2 further provides an integrated laser processing path planning system with positioning and monitoring functions. Based on the above-mentioned integrated laser processing path planning method with positioning and monitoring functions of the present invention, it includes a data acquisition module, a processing surface path planning module, a closed-loop control module, a temperature monitoring module, and a dynamic adjustment module, wherein: The data acquisition module is used to collect the information of the parts to be processed, including the processing surface, processing method, and process requirements. MySQL Establish a parts machining surface database, number different machining surfaces and create files, which include the dimensions and machining requirements of the machining surfaces; The processing surface path planning module, based on CAM software, combines the current part's CAD 3D drawing and part processing requirements to generate laser processing plans for different processing surfaces, and records the laser processing plans for different processing surfaces in the corresponding processing surface files; Closed-loop control module, integrating thermal imaging sensors, laser processing equipment and motion control system, is used to control the laser processing equipment to process parts according to the set processing path; The temperature monitoring module analyzes the thermal correlation between different machining surfaces of a part based on the information in the various machining surface files in the part machining surface database, obtains the heat conduction between different machining surfaces during machining, collects the heat data of the machining surfaces during machining, and calculates the predicted heat of the remaining machining surfaces based on the heat conduction; The dynamic adjustment module sets the critical value of laser processing of parts based on material properties and processing parameter requirements, determines the real-time heat of the processing surface during processing, and generates a dynamic adjustment planning path based on the heat determination results of the processing surface during processing and the predicted heat of the remaining processing surfaces, and transmits it to the closed-loop control module.

[0035] In summary, the present invention monitors the heat of the initial processing surface during laser processing and predicts the heat conditions of other processing surfaces. When the initial processing surface does not meet the processing requirements of the current part, the laser processing surface is switched based on the heat conditions of other processing surfaces. This can achieve dynamic planning of the processing path during the laser processing process, thereby enhancing the practicality and functionality of the method. The thermal imaging sensor collects the heat data of the processing surface in real time, and the critical value is set in combination with the material properties and processing parameters to determine the temperature of the processing surface during the processing. When the temperature approaches or exceeds the critical value, the processing path can be adjusted in time, and the processing surface with low thermal correlation is preferentially selected for processing to ensure the continuity of laser processing and the quality stability of parts.

[0036] The above embodiments fully and effectively achieve the objectives of the present invention. Those skilled in the art will appreciate that the present invention includes, but is not limited to, the contents described in the accompanying drawings and the above specific embodiments. Although the present invention has been described with reference to the embodiments currently considered to be the most practical and preferred, it should be understood that the present invention is not limited to the disclosed embodiments, and any modifications that do not deviate from the functional and structural principles of the present invention are intended to be included within the scope of the claims.

Claims

1. An integrated laser processing path planning method with positioning and monitoring functions, characterized in that: The following steps are involved: S100. Part information collection and initial path generation: Collect information about the part to be processed, including at least geometric information, material properties, processing surface, processing method, and process requirements, and generate an initial laser processing path for each processing surface based on the part information; S200. Thermal Correlation Analysis and Dynamic Path Adjustment: Based on the thermophysical properties of the part material, a heat conduction equation and boundary conditions are constructed to analyze the thermal correlation between different machined surfaces. Surface heat data for the currently machined surface is collected and, based on the thermal correlation, the predicted heat of the remaining unmachined surfaces is calculated. The surface heat of the currently machined surface is determined. If it exceeds a preset threshold, a dynamically adjusted planning path is generated based on the predicted heat ranking of the unmachined surfaces. S300. Part Positioning and Path Execution Control: A vision-based positioning device captures part position and machining surface information in real time and converts it into a world coordinate system. This information is combined with the received dynamic path for trajectory interpolation to generate a smooth machining trajectory. The motion control system drives the laser equipment to execute the path, enabling automatic adjustment of the laser machining path.

2. The integrated laser processing path planning method with positioning and monitoring functions according to claim 1 is characterized in that: When implemented, S100 includes at least the following sub-steps: S110. Import the drawing of the part to be processed into the CAD software to obtain basic information about the part to be processed, including shape, size, material, and processing surface. Build a database of the parts' processing surfaces, number the different processing surfaces, and create a file containing the dimensions and processing requirements of each processing surface. S120. Import the part drawing into the CAM software, generate laser processing plans for different processing surfaces based on the part processing requirements, and record them in the corresponding processing surface files.

3. The integrated laser processing path planning method with positioning and monitoring functions according to claim 1 is characterized in that: In S100, the collection of part information also includes the detection and recording of the part clamping posture, coordinate system reference and possible obstructing structures; the processing surface information also includes the normal vector, area, heat conduction boundary and adjacent relationship of the processing surface. The adjacent surface pairs connected by the heat conduction path are identified through the spatial topology analysis method, and the association data structure between the processing surfaces is established for subsequent thermal coupling modeling and processing path switching priority calculation.

4. The integrated laser processing path planning method with positioning and monitoring functions according to claim 1 is characterized in that: When implemented, S200 includes at least the following sub-steps: S210. Based on the information in each processing surface file, the thermal correlation between different processing surfaces is analyzed to obtain the amount of heat conduction between different processing surfaces during the processing; S220. A thermal imaging sensor is provided at the laser cutter head to collect surface heat data of the current processing surface during processing. The predicted heat of the remaining processing surfaces is calculated based on the amount of heat conduction between the different processing surfaces. S230. Based on the part material properties and processing parameter requirements, a heat threshold is set to determine the real-time heat of the current processing surface during processing. If the heat threshold is exceeded, a dynamic adjustment planning path is generated based on the predicted heat ranking of the remaining processing surfaces.

5. The integrated laser processing path planning method with positioning and monitoring functions according to claim 4 is characterized in that: The S210 at least includes the following sub-steps when implemented: S211. Obtain the part processing surface density based on the material of the current processing part ρ , specific heat capacity c and thermal conductivity τ , calculate the heat conduction equation of the current part, and the algorithm formula is: in, Q Input energy for the laser processing of the current part processing surface, Represents the heat capacity term, which is the amount of heat absorbed or released by a unit volume of material due to temperature change per unit time. It represents the heat conduction caused by temperature gradient, that is, the diffusion of heat from high temperature area to low temperature area. T represents temperature, t Represents time; S212. Based on the heat conduction equation and the heat exchange process on the machining surface, the boundary conditions are calculated using the following formula: in, τ represents the thermal conductivity of the material, Represents the partial derivative of temperature with respect to the normal direction, indicating the rate of change of temperature in the normal direction of the boundary, q s represents the heat flux source intensity of the processing surface, h represents the convection heat transfer coefficient, T 、 T 0 represents the surface temperature of the processing surface and the ambient temperature, represents the heat flux density at the boundary by heat conduction, Represents the total heat flux density at the boundary; S213. Calculate the thermal correlation coefficient between different processing surfaces to obtain the distribution and transfer of heat between the different processing surfaces. The specific steps are as follows: The temperature distribution inside and at the boundary of the machining surface is calculated using the heat conduction equation. Combined with the boundary conditions, the heat flux density is calculated from the first i The first processing surface is transmitted to the j Heat conduction of the processed surface q ij , where the heat flux is , calculate the thermal correlation coefficient between different processing surfaces: in, A ij is the thermal correlation coefficient, For the processing surface i The amount of heat transferred to all machined surfaces.

6. The integrated laser processing path planning method with positioning and monitoring functions according to claim 5, characterized in that: The S220 at least includes the following sub-steps when implemented: S221. A thermal imaging sensor is installed at the laser cutter head to collect thermal data from the processing surface during processing and establish a temperature field. The algorithm is as follows: in, T s(x,y,t) Represents the reconstructed temperature field, that is, the spatial position ( x , y ) in time t The temperature value, n Represents the number of thermal imaging sensors, T e,i(t) Representative i Sensors at time t The temperature value, ω i ( x , y ) represents the corresponding impact weight; S222. Calculate the predicted heat of different processing surfaces using the following formula: in, Represents the unprocessed surface i The spatial position on x , y ) in time t The predicted heat A ij 、 q j(t) Represent the thermal correlation coefficient and j The processing surface in time t The heat flux density, m It is the number of all machining surfaces in machining state at the current moment.

7. The integrated laser processing path planning method with positioning and monitoring functions according to claim 6, characterized in that: The S230 at least includes the following sub-steps when implemented: S231. Based on the number of machined surfaces of the part N , taking the machining surface in the machining state as the reference surface, based on the machining time t Calculate the predicted heat of different other unprocessed surfaces separately Q N ; S232. Based on the current part material and processing parameter requirements, combined with the laser processing setting parameters, set the heat threshold for the part laser processing Q max ; S233. Current processing surface temperature field obtained using thermal imaging sensor T s(x,y,t) , real-time calculation of the temperature difference between different unprocessed surfaces , and Δ Q N Δ of different unprocessed surfaces >0 Q N Sort in descending order; when T s(x,y,t) > Q max When the number of unprocessed surfaces in descending order is reached, the planned path is dynamically adjusted based on the descending order, the laser processing of the current processing surface is stopped, and the unprocessed surface that is first in the descending order is selected for laser processing; S234 determines the new processing surface as the reference processing surface, continues to calculate the predicted heat of the remaining unprocessed surfaces, when the temperature of the reference processing surface is higher than the critical value, then repeat step S233, continue to select a new unprocessed surface for laser processing, when there is no satisfying Δ Q N When >0, stop part processing.

8. The integrated laser processing path planning method with positioning and monitoring functions according to claim 1 is characterized in that: When implemented, S300 includes at least the following sub-steps: S310. A high-precision vision positioning camera mounted above or to the side of the machining area captures part position and machined surface information, including its shape and texture, in real time. Image processing algorithms are then used to extract machining quality features, including surface cracks and melt pool shape. S320. Calibrate the vision positioning camera using a calibration plate to obtain the camera's focal length, distortion coefficient, and the conversion matrix between the camera coordinate system and the world coordinate system. Convert the part position captured by the vision positioning camera to the world coordinate system of the laser processing equipment. S330. Based on the received dynamically adjusted planned path, the adjusted path is interpolated to generate a smooth motion trajectory, and the interpolated path is sent to the motion control system to control the X, Y, and Z axis motion of the laser processing equipment to adjust the processing path planning.

9. The integrated laser processing path planning method with positioning and monitoring functions according to claim 8, characterized in that: In S330, the adjusted path is interpolated, including speed segmentation, acceleration and deceleration smoothing, and posture and attitude solution processing of the laser processing path, and the introduction of path continuity constraints before and after interpolation to ensure smooth transition of the trajectory without sudden jumps; the processing path interpolation algorithm supports spline interpolation, B-spline curve or quintic polynomial interpolation to achieve high-precision path control and instruction issuance during continuous processing.

10. An integrated laser processing path planning system with positioning and monitoring functions, characterized in that: The system adopts the integrated laser processing path planning method with positioning and monitoring functions as described in any one of claims 1 to 9, including a data acquisition module, a processing surface path planning module, a closed-loop control module, a temperature monitoring module, and a dynamic adjustment module, wherein: The data acquisition module is used to collect the information of the parts to be processed, including the processing surface, processing method, and process requirements. MySQL Establish a parts machining surface database, number different machining surfaces and create files, which include the dimensions and machining requirements of the machining surfaces; The processing surface path planning module generates laser processing plans for different processing surfaces based on CAM software, combined with the current part's CAD 3D drawing and part processing requirements, and records the laser processing plans for different processing surfaces in the corresponding processing surface files; The closed-loop control module integrates a thermal imaging sensor, a laser processing device, and a motion control system to control the laser processing device to process parts according to a set processing path; The temperature monitoring module analyzes the thermal correlation between different machining surfaces of a part based on the information in the various machining surface files in the part machining surface database, obtains the amount of heat conduction between the different machining surfaces during machining, collects the heat data of the machining surfaces during machining, and calculates the predicted heat of the remaining machining surfaces based on the heat conduction; The dynamic adjustment module sets the critical value of part laser processing in combination with material properties and processing parameter requirements, determines the real-time heat of the processing surface during processing, and generates a dynamic adjustment planning path based on the heat determination result of the processing surface during processing and combined with the predicted heat of the remaining processing surfaces, and transmits it to the closed-loop control module.

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