Electronic device and liquid cooling heat dissipation assembly

Abstract

An electronic device comprises a shell, a liquid cooling heat dissipation assembly and a hard disk. The shell is used for containing cooling fluid. The liquid cooling heat dissipation assembly is arranged in the shell and comprises a heat exchange part, a liquid inlet pipe, two liquid outlet pipes and a fin structure. The heat exchange part has a main flow channel and a plurality of branch flow channels. And the sub-runners are respectively communicated with two opposite sides of the main runner. And the liquid inlet pipe is communicated with the main runner. And the two liquid outlet pipes are respectively communicated with the sub-runners. The fin structure includes a plurality of first fins and a plurality of second fins. The first fins and the second fins are arranged in the sub-runners. The first fins are close to the main flow channel. The second fins are close to the two liquid outlet pipes respectively. The arrangement density of the first fins is smaller than that of the second fins. The hard disk is arranged in the shell and used for being immersed in the cooling fluid.

Description

Technical Field

[0001] The present application relates to the technical field of electronic devices, and in particular to an electronic device and a liquid cooling and heat dissipation component. Background Art

[0002] Modern society is in an era of rapid development of information technology. Most companies use servers to assist in business processing, such as using the hard disk in the server to store programs, files and data to improve work efficiency.

[0003] To cope with the increase in data processing volume, the number of hard drives has also increased. When these hard drives operate, they generate a significant amount of heat. Typically, these drives are cooled using air or liquid cooling systems. However, current hard drive cooling efficiency is still insufficient, which in turn affects hard drive operation. Therefore, improving hard drive cooling efficiency is one of the issues that researchers need to address. Summary of the Invention

[0004] The present invention provides an electronic device and a liquid cooling heat dissipation component, so as to improve the heat dissipation efficiency of a hard disk.

[0005] An electronic device disclosed in one embodiment of the present invention is used to accommodate a cooling fluid. The electronic device includes:

[0006] a housing for containing the cooling fluid;

[0007] a liquid-cooled heat dissipation component disposed in the housing and used for circulating the cooling fluid, the liquid-cooled heat dissipation component comprising a heat exchange portion, a liquid inlet pipe, two liquid outlet pipes, and a fin structure, the heat exchange portion having a main channel and a plurality of branch channels, the plurality of branch channels being respectively connected to opposite sides of the main channel, the liquid inlet pipe being connected to the main channel, the two liquid outlet pipes being respectively connected to the plurality of branch channels, the fin structure comprising a plurality of first fins and a plurality of second fins, the plurality of first fins and the plurality of second fins being disposed in and connected to the plurality of branch channels, the plurality of first fins being close to the main channel, the plurality of second fins being respectively close to the two liquid outlet pipes, and the arrangement density of the plurality of first fins being less than the arrangement density of the plurality of second fins; and

[0008] At least one hard disk is disposed in the housing and is used to be immersed in the cooling fluid.

[0009] Another embodiment of the present invention discloses a liquid cooling heat dissipation assembly for being disposed in a housing and for circulating a cooling fluid. The liquid cooling heat dissipation assembly includes:

[0010] a heat exchange portion having a main channel and a plurality of branch channels, wherein the plurality of branch channels are respectively connected to opposite sides of the main channel;

[0011] a liquid inlet pipe, connected to the main flow channel;

[0012] two liquid outlet pipes, respectively connected to the plurality of branch channels; and

[0013] A fin structure includes multiple first fins and multiple second fins, wherein the multiple first fins and the multiple second fins are arranged in the multiple branch channels and are connected, the multiple first fins are close to the main channels, and the multiple second fins are respectively close to the two liquid outlet pipes, and the setting density of the multiple first fins is less than the setting density of the multiple second fins.

[0014] According to the electronic device and liquid cooling assembly of the above embodiment, since the arrangement density of the first fins near the liquid inlet pipe is lower than the arrangement density of the second fins near the two liquid outlet pipes, the cooling fluid cooled by the first fins can be dissipated near the two liquid outlet pipes by the second fins arranged at a higher density, thereby improving the heat dissipation efficiency near the two liquid outlet pipes. This improves the overall heat dissipation efficiency of the hard drive.

[0015] Furthermore, because the liquid cooling heat dissipation assembly includes one liquid inlet pipe and two liquid outlet pipes, i.e., a one-inlet, two-outlet structure, and the heat exchange portion has multiple flow channels, the cooling fluid can flow more evenly within the heat exchange portion and reduce flow resistance within the heat exchange portion. This further improves the heat dissipation efficiency of the hard drive. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Figure 1 2 is an exploded schematic diagram of an electronic device according to an embodiment of the present invention.

[0017] Figure 2 for Figure 1 A three-dimensional schematic diagram of an electronic device with the top plate omitted.

[0018] Figure 3 For the Figure 2 Schematic cross-sectional view of the electronic device along the 3-3 secant line.

[0019] Figure 4 for Figure 1 A three-dimensional schematic diagram of a liquid cooling heat dissipation component of an electronic device.

[0020] Figure 5 For the Figure 4 A schematic cross-sectional view of a liquid cooling assembly of an electronic device taken along a 5-5 cut line.

[0021] Figure 6 For the Figure 4 Another schematic cross-sectional view of a liquid cooling assembly of an electronic device shown along the 6-6 cut line.

[0022] Figure 7 For cooling fluid Figure 1 A three-dimensional schematic diagram of the flow within an electronic device.

[0023] Figure 8 For cooling fluid along Figure 2 Schematic cross-sectional view of the flow of the busbar portion of the electronic device along the 8-8 secant line.

[0024] Figure 9 For cooling fluid Figure 1 A cross-sectional schematic diagram of the flow within a liquid cooling heat dissipation component of an electronic device.

[0025] Figure 10 For cooling fluid Figure 1 Another cross-sectional schematic diagram of the flow within the liquid cooling heat dissipation component of the electronic device.

[0026] Figure 11 For cooling fluid along Figure 2 A schematic cross-sectional view of the flow of the shunt portion of the electronic device along the 11-11 cut line.

[0027] Figure Number:

[0028] 10. Electronic devices;

[0029] 11. Shell; 111. Bottom plate; 112. Top plate; 113. Partition plate;

[0030] 12. Liquid cooling assembly; 121. Heat exchange unit; 1211. Main channel; 1212. Branch channel; 122. Liquid inlet pipe; 123. Liquid outlet pipe; 124. Fin structure; 1241. First fin; 1242. Second fin; 125. Pump; 126. Converging unit; 1261. Converging pipe; 1262. Inlet pipe; 127. Branching unit; 1271. Branch pipe; 1272. Outlet pipe;

[0031] 13. Fan;

[0032] 14. Hard disk;

[0033] A~P, direction; S1, first accommodation space; S2, second accommodation space. DETAILED DESCRIPTION

[0034] To make the above-mentioned objects, features, and advantages of the present application more clearly understood, the specific embodiments of the present application are described in detail below with reference to the accompanying drawings. The following description sets forth many specific details to facilitate a full understanding of the present application. However, the present application can be implemented in many other ways than those described herein, and those skilled in the art can make similar improvements without violating the scope of the present application. Therefore, the present application is not limited to the specific embodiments disclosed below.

[0035] In the description of this application, it should be understood that if the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc. appear, the orientation or position relationship indicated by these terms is based on the orientation or position relationship shown in the accompanying drawings, which is only for the convenience of describing this application and simplifying the description, and does not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on this application.

[0036] In addition, if the terms "first" or "second" appear, these terms are used for descriptive purposes only and should not be understood to indicate or imply relative importance or implicitly specify the number of technical features indicated. Therefore, a feature specified as "first" or "second" may explicitly or implicitly include at least one of such features. In the description of this application, if the term "plurality" appears, "plurality" means at least two, for example, two, three, etc., unless otherwise specifically defined.

[0037] In this application, unless otherwise specified or limited, the terms "mounted," "connected," "connected," "fixed," etc., should be interpreted broadly. For example, these terms may refer to fixed connections, removable connections, or integration; mechanical connections or electrical connections; direct connections or indirect connections through an intermediary; and internal communication between two components or interaction between two components, unless otherwise specified. Those skilled in the art will understand the specific meanings of these terms in this application based on the specific circumstances.

[0038] In this application, unless otherwise expressly specified or limited, if a first feature is described as being "above" or "below" a second feature, or similar descriptions, this may mean that the first and second features are in direct contact, or that the first and second features are in indirect contact through an intermediate medium. Furthermore, when a first feature is described as being "above," "above," or "above" a second feature, it may mean that the first feature is directly above or diagonally above the second feature, or simply means that the first feature is at a higher level than the second feature. When a first feature is described as being "below," "below," or "below" a second feature, it may mean that the first feature is directly below or diagonally below the second feature, or simply means that the first feature is at a lower level than the second feature.

[0039] It should be noted that if an element is referred to as being "fixed to" or "disposed on" another element, it may be directly on the other element or there may be an intermediate element. If an element is considered to be "connected to" another element, it may be directly connected to the other element or there may be an intermediate element. If any, the terms "vertical", "horizontal", "upper", "lower", "left", "right" and similar expressions used in this application are for illustrative purposes only and do not represent the only embodiment.

[0040] See also Figures 1 to 3 . Figure 1 2 is an exploded schematic diagram of an electronic device according to an embodiment of the present invention. Figure 2 for Figure 1 A three-dimensional schematic diagram of an electronic device with the top plate omitted. Figure 3 For the Figure 2 Schematic cross-sectional view of the electronic device along the 3-3 secant line.

[0041] The electronic device 10 of this embodiment is, for example, in the form of a JBOD (Just a Bunch of Disks). JBOD combines multiple hard drives into a single storage component, thereby providing greater storage capacity. For example, JBOD can be applied in areas such as big data analysis, multimedia storage, and data archiving.

[0042] The electronic device 10 is used to contain a cooling fluid (not shown). The cooling fluid is, for example, mineral oil, but is not limited thereto. In other embodiments, the cooling fluid may also be, for example, water or a refrigerant.

[0043] The electronic device 10 includes a housing 11, a liquid cooling heat dissipation component 12, a plurality of fans 13 and a plurality of hard disks 14. The housing 11 includes a bottom plate 111, a top plate 112 and a partition 113. The partition 113 is located between the bottom plate 111 and the top plate 112. A first accommodation space S1 is formed between the bottom plate 111 and the partition 113. A second accommodation space S2 is formed between the partition 113 and the top plate 112. The distance between the bottom plate 111 and the partition 113 is, for example, 4U, and the distance between the partition 113 and the top plate 112 is, for example, 1U. The first accommodation space S1 is used to accommodate the cooling fluid. The liquid cooling heat dissipation component 12 is arranged in the second accommodation space S2 and is used for the circulation of the cooling fluid.

[0044] Please also refer to Figures 4 to 6 . Figure 4 for Figure 1 A three-dimensional schematic diagram of a liquid cooling heat dissipation component of an electronic device. Figure 5 For the Figure 4 A schematic cross-sectional view of a liquid cooling assembly of an electronic device taken along a 5-5 cut line. Figure 6 For the Figure 4 Another schematic cross-sectional view of a liquid cooling assembly of an electronic device shown along the 6-6 cut line.

[0045] The liquid cooling heat dissipation assembly 12 is, for example, in the form of a tube-and-belt radiator and includes a heat exchange portion 121, a liquid inlet pipe 122, two liquid outlet pipes 123, a fin structure 124, and a pump 125. The heat exchange portion 121 has a main channel 1211 and a plurality of branch channels 1212. These branch channels 1212 are respectively connected to opposite sides of the main channel 1211. The first accommodating space S1 and the second accommodating space S2 are connected to the two liquid outlet pipes 123 via the liquid inlet pipe 122. The liquid inlet pipe 122 is connected to the main channel 1211, and the two liquid outlet pipes 123 are respectively connected to these branch channels 1212.

[0046] Furthermore, the arrangement direction of the branch channels 1212 on each side of the main channel 1211 is, for example, perpendicular to the arrangement direction of the two liquid outlet pipes 123. In other words, the branch channels 1212 on each side of the main channel 1211 are stacked vertically, while the two liquid outlet pipes 123 are arranged horizontally.

[0047] The fin structure 124 includes a plurality of first fins 1241 and a plurality of second fins 1242. The first fins 1241 and the second fins 1242 are disposed within and connected to the branch channels 1212. The first fins 1241 are located adjacent to the main channel 1211. The second fins 1242 are located adjacent to the two liquid outlet pipes 123. The arrangement density of the first fins 1241 is, for example, less than the arrangement density of the second fins 1242.

[0048] In this embodiment, the heat exchange capacity of the liquid-cooled heat dissipation component 12 can satisfy the following equation: Q = H × A × (T1-T2). Among them, Q refers to the heat exchange capacity. H refers to the heat exchange coefficient. A refers to the heat exchange area. T1 refers to the temperature of the heat source. T2 refers to the temperature of the cooling fluid. When the flow rate of the cooling fluid is higher or the degree of turbulence of the cooling fluid is higher, the heat exchange coefficient is higher, and the heat exchange capacity can be increased to improve the heat dissipation efficiency. In addition, the greater the temperature difference between the heat source and the cooling fluid, the greater the value of T1-T2, and the heat exchange capacity can be increased to improve the heat dissipation efficiency.

[0049] In this embodiment, by disposing the first fins 1241 and the second fins 1242 in the branch channels 1212 , the turbulence of the cooling fluid can be increased, thereby increasing the heat exchange coefficient and improving the heat dissipation efficiency of the liquid-cooled heat dissipation assembly 12 .

[0050] Furthermore, when the heat-absorbing cooling fluid flows into the inlet pipe 122, it is cooled by flowing through the first fins 1241. As the cooled cooling fluid flows near the second outlet pipe 123, the value of T1-T2 decreases, reducing heat dissipation efficiency. Therefore, by providing a higher density of second fins 1242 near the second outlet pipe 123, the heat dissipation efficiency near the second outlet pipe 123 is improved, allowing the cooling fluid to maintain high heat dissipation efficiency even when its temperature is reduced.

[0051] The pump 125 is arranged in the liquid inlet pipe 122 and is connected to the liquid inlet pipe 122. The pump 125 is used to drive the cooling fluid to flow. These fans 13 are arranged in the second accommodating space S2 of the shell 11 and are located on one side of the two liquid outlet pipes 123. These fans 13 are used to generate a cooling airflow flowing through the heat exchange part 121 to dissipate heat from the heat exchange part 121. Among them, these fans 13 are, for example, exhaust fans. In addition, the liquid-cooled heat dissipation component 12 and these fans 13 together constitute a heat dissipation system that combines air cooling and liquid cooling. The hard disk 14 is arranged in the first accommodating space S1 of the shell 11 and is used to be immersed in the cooling fluid so that the cooling fluid absorbs the heat generated when the hard disk 14 is in operation.

[0052] In this embodiment, the liquid cooling heat dissipation assembly 12 may further include a confluence portion 126. The confluence portion 126 includes a confluence pipe 1261 and a plurality of inlet pipes 1262. These inlet pipes 1262 and the liquid inlet pipe 122 are respectively connected to the opposite sides of the confluence pipe 1261, so that the first accommodation space S1 and the second accommodation space S2 are connected. The confluence pipe 1261 and these inlet pipes 1262 are used to allow the cooling fluid flowing through these hard disks 14 to converge to the liquid inlet pipe 122. In detail, these inlet pipes 1262 extend from the first accommodation space S1 through the partition 113 to the second accommodation space S2. By providing the confluence portion 126, the flow of the cooling fluid can be accelerated, thereby improving the heat dissipation efficiency.

[0053] In this embodiment, the liquid cooling heat dissipation assembly 12 may further include a diverter portion 127. The diverter portion 127 includes a diverter pipe 1271 and a plurality of outlet pipes 1272. These outlet pipes 1272 and the two liquid outlet pipes 123 are respectively connected to the opposite sides of the diverter pipe 1271, so that the first accommodation space S1 and the second accommodation space S2 are connected. The diverter pipe 1271 and these outlet pipes 1272 are used to divert the cooling fluid flowing toward these hard disks 14. In detail, these outlet pipes 1272 extend from the first accommodation space S1 through the partition 113 to the second accommodation space S2. By providing the diverter portion 127, the flow of the cooling fluid can be accelerated, thereby improving the heat dissipation efficiency.

[0054] In this embodiment, because the arrangement density of the first fins 1241 near the liquid inlet pipe 122 is lower than the arrangement density of the second fins 1242 near the second liquid outlet pipes 123, the cooling fluid cooled by flowing through the first fins 1241 can be dissipated near the second liquid outlet pipes 123 by the second fins 1242 having a higher density, thereby improving the heat dissipation efficiency near the second liquid outlet pipes 123. In this way, the overall heat dissipation efficiency of the hard disk 14 can be improved.

[0055] Furthermore, since the liquid cooling heat dissipation assembly 12 includes a liquid inlet pipe 122 and two liquid outlet pipes 123, i.e., the liquid cooling heat dissipation assembly 12 is a one-inlet, two-outlet type, and the heat exchange portion 121 has multiple flow channels 1212, the cooling fluid can flow more evenly within the heat exchange portion 121, and the flow resistance within the heat exchange portion 121 can be reduced. This further improves the heat dissipation efficiency of the hard disk 14.

[0056] In this embodiment, the number of hard disks 14 is multiple, but not limited to this. In other embodiments, the number of hard disks can also be only one.

[0057] In this embodiment, the liquid cooling heat dissipation assembly 12 includes a diverter 127 for diverting the cooling fluid from the liquid outlet pipe 123, and a confluence 126 for confluence of the cooling fluid to the liquid inlet pipe 122, but the present invention is not limited thereto. In other embodiments, the liquid cooling heat dissipation assembly may not include a diverter or confluence.

[0058] In this embodiment, the number of fans 13 is multiple, but not limited to this. In other embodiments, the number of fans can also be only one.

[0059] Please also refer to Figures 7 to 11 . Figure 7 For cooling fluid Figure 1 A three-dimensional schematic diagram of the flow within an electronic device. Figure 8 For cooling fluid along Figure 2Schematic cross-sectional view of the flow of the busbar portion of the electronic device along the 8-8 secant line. Figure 9 For cooling fluid Figure 1 A cross-sectional schematic diagram of the flow within a liquid cooling heat dissipation component of an electronic device. Figure 10 For cooling fluid Figure 1 Another cross-sectional schematic diagram of the flow within the liquid cooling heat dissipation component of the electronic device. Figure 11 For cooling fluid along Figure 2 A schematic cross-sectional view of the flow of the shunt portion of the electronic device along the 11-11 cut line.

[0060] In this embodiment, the cooling cycle of the cooling fluid is as follows. First, Figure 7 As shown, the cooling fluid flows in the first accommodating space S1 along the direction A to absorb the heat generated by the hard disks 14 during operation. Figure 8 As shown, the cooling fluid flows from the first accommodating space S1 through the inlet pipes 1262 into the manifold 1261 along direction B, and then flows from the manifold 1261 into the liquid inlet pipe 122 along directions C and D.

[0061] Then, if Figure 7 As shown, the cooling fluid is driven by the pump 125 and flows from the liquid inlet pipe 122 into the main channel 1211 of the heat exchange part 121 along the direction E. Figure 9 and Figure 10 As shown, the cooling fluid flows along direction F within the main channel 1211 and into the branch channels 1212. The cooling fluid then flows along direction G within the branch channels 1212. Within the branch channels 1212, the cooling fluid transfers heat to the first fins 1241 and the second fins 1242. The cooling fluid then flows along directions H and I from the branch channels 1212 to the two liquid outlet pipes 123.

[0062] Then, if Figure 7 As shown, the cooling fluid flows from the second liquid outlet pipe 123 to the diversion pipe 1271 along the direction J-L. Figure 11 As shown, the cooling fluid flows from the diversion pipe 1271 to the outlet pipes 1272 along directions M and N, and then flows back to the first accommodating space S1 to perform the next cooling cycle.

[0063] In addition, the fans 13 generate cooling airflow in the first accommodating space S1 to dissipate heat from the liquid cooling element 12. Figure 7 As shown, the cooling airflow flows through the heat exchange portion 121 along direction O to dissipate heat from the first fins 1241 and the second fins 1242 disposed within the heat exchange portion 121. The cooling airflow then flows out of the housing 11 along direction P through the fans 13. This completes the cooling cycle for the hard disks 14.

[0064] According to the electronic device and liquid cooling assembly of the above embodiment, since the arrangement density of the first fins near the liquid inlet pipe is lower than the arrangement density of the second fins near the two liquid outlet pipes, the cooling fluid cooled by flowing through the first fins can be improved near the two liquid outlet pipes by the second fins arranged with a higher density. In this way, the overall heat dissipation efficiency of the hard disk can be improved.

[0065] Furthermore, because the liquid cooling heat dissipation assembly includes one liquid inlet pipe and two liquid outlet pipes, i.e., a one-inlet, two-outlet structure, and the heat exchange portion has multiple flow channels, the cooling fluid can flow more evenly within the heat exchange portion and reduce flow resistance within the heat exchange portion. This further improves the heat dissipation efficiency of the hard drive.

[0066] The technical features of the above-mentioned embodiments can be combined arbitrarily. In order to make the description concise, not all possible combinations of the technical features in the above-mentioned embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0067] The above-described embodiments merely represent several implementation methods of the present application. While the descriptions are relatively specific and detailed, they should not be construed as limiting the scope of the patent application. It should be noted that a person of ordinary skill in the art may make various modifications and improvements without departing from the spirit of the present application, and these modifications and improvements fall within the scope of protection of the present application. Therefore, the scope of protection of the present patent application shall be determined by the appended claims.

Claims

1. An electronic device for accommodating a cooling fluid, characterized in that: The electronic device comprises: a housing for containing the cooling fluid; a liquid-cooled heat dissipation component disposed in the housing and used for circulating the cooling fluid, the liquid-cooled heat dissipation component comprising a heat exchange portion, a liquid inlet pipe, two liquid outlet pipes, and a fin structure, the heat exchange portion having a main channel and a plurality of branch channels, the plurality of branch channels being respectively connected to opposite sides of the main channel, the liquid inlet pipe being connected to the main channel, the two liquid outlet pipes being respectively connected to the plurality of branch channels, the fin structure comprising a plurality of first fins and a plurality of second fins, the plurality of first fins and the plurality of second fins being disposed in and connected to the plurality of branch channels, the plurality of first fins being close to the main channel, the plurality of second fins being respectively close to the two liquid outlet pipes, and the arrangement density of the plurality of first fins being less than the arrangement density of the plurality of second fins; and At least one hard disk is disposed in the housing and is used to be immersed in the cooling fluid.

2. The electronic device according to claim 1, wherein: The liquid cooling heat dissipation component also includes a confluence portion, which includes a confluence pipe and multiple inlet pipes. The multiple inlet pipes and the liquid inlet pipe are respectively connected to opposite sides of the confluence pipe, and the confluence pipe and the multiple inlet pipes are used to allow the cooling fluid flowing through at least one hard disk to converge into the liquid inlet pipe.

3. The electronic device according to claim 1, wherein: The liquid cooling heat dissipation component also includes a diversion part, which includes a diversion pipe and multiple outlet pipes. The multiple outlet pipes and the two liquid outlet pipes are respectively connected to the opposite sides of the diversion pipe, and the diversion pipe and the multiple outlet pipes are used to divert the cooling fluid flowing toward at least one hard disk.

4. The electronic device according to claim 1, wherein: The liquid cooling heat dissipation component further includes a pump, which is arranged on the liquid inlet pipe and is connected to the liquid inlet pipe. The pump is used to drive the cooling fluid to flow.

5. The electronic device according to claim 1, wherein: The heat exchanger further comprises at least one fan, which is disposed in the housing and located on one side of the two liquid outlet pipes. The at least one fan is used to generate a cooling airflow flowing through the heat exchange portion.

6. The electronic device according to claim 1, wherein: The arrangement direction of the plurality of branch channels located on each side of the main channel is perpendicular to the arrangement direction of the two liquid outlet pipes.

7. A liquid cooling heat dissipation assembly, arranged in a housing and allowing a cooling fluid to flow, characterized in that: The liquid cooling heat dissipation component includes: a heat exchange portion having a main channel and a plurality of branch channels, wherein the plurality of branch channels are respectively connected to opposite sides of the main channel; a liquid inlet pipe, connected to the main flow channel; two liquid outlet pipes, respectively connected to the plurality of branch channels; and A fin structure includes multiple first fins and multiple second fins, wherein the multiple first fins and the multiple second fins are arranged in the multiple branch channels and are connected, the multiple first fins are close to the main channels, and the multiple second fins are respectively close to the two liquid outlet pipes, and the setting density of the multiple first fins is less than the setting density of the multiple second fins.

8. The liquid cooling heat dissipation assembly according to claim 7, characterized in that: The liquid cooling heat dissipation component also includes a confluence portion, which includes a confluence pipe and multiple inlet pipes. The multiple inlet pipes and the liquid inlet pipe are respectively connected to the opposite sides of the confluence pipe, and the confluence pipe and the multiple inlet pipes are used to allow the cooling fluid to converge to the liquid inlet pipe.

9. The liquid cooling heat dissipation assembly according to claim 7, characterized in that: The liquid cooling heat dissipation component also includes a diversion part, which includes a diversion pipe and multiple outlet pipes. The multiple outlet pipes and the two liquid outlet pipes are respectively connected to the opposite sides of the diversion pipe, and the diversion pipe and the multiple outlet pipes are used to divert the cooling fluid from the two liquid outlet pipes.

10. The liquid cooling heat dissipation assembly according to claim 7, characterized in that: The liquid cooling heat dissipation component further includes a pump, which is arranged on the liquid inlet pipe and is connected to the liquid inlet pipe. The pump is used to drive the cooling fluid to flow.

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