Background heat flow numerical analysis method and device

Abstract

The embodiment of the invention provides a background heat flow numerical analysis method and device, and the method comprises the steps: carrying out the grid discretization of an environment simulation container model, a test tool model, and a spacecraft model, and obtaining a plurality of system nodes and a plurality of spacecraft nodes; after executing the heat balance test, calculating the temperature of each system node; after the radiation energy propagation test is executed, calculating a relative angle coefficient of the system node, and calculating a relative radiation coefficient of the system node according to the relative angle coefficient; and according to the temperature and the relative radiation coefficient of each system node, calculating a background heat flow value of each system node and a background heat flow total density. According to the embodiment of the invention, by integrating the multi-dimensional thermal control parameters and the intelligent algorithm, the completeness of thermal environment simulation and the temperature prediction precision of the complex system are remarkably improved.

Description

Technical Field

[0001] The embodiments of this specification relate to the technical field of spacecraft thermal balance testing, and in particular to a method and apparatus for numerical analysis of background heat flux. Background Art

[0002] Spacecraft must maintain a stable operating temperature in the vacuum and low-temperature radiation environment of outer space. Thermal balance testing is a key step in assessing the correctness of a spacecraft's thermal design. The external heat flux during thermal balance testing is typically simulated based on the spacecraft's on-orbit heat flux. However, the introduction of background heat flux by devices such as the ring-shaped container and test fixtures can lead to a certain deviation between the external heat flux experienced by the spacecraft during ground testing and the actual on-orbit heat flux, thus affecting the effectiveness of thermal test performance assessments.

[0003] In thermal balance test systems, devices such as the ring mold container and test fixtures introduce background heat flux, resulting in a certain deviation between the external heat flux experienced by the spacecraft during ground testing and the actual on-orbit heat flux, affecting the effectiveness of thermal test performance assessments. Existing experimental and simulation methods for obtaining background heat flux in test systems have limitations. They can only obtain a total background heat flux value, making it impossible to accurately determine the background heat flux values corresponding to each device component, hindering the further development of thermal balance tests. Summary of the Invention

[0004] In view of this, embodiments of this specification provide a background heat flow numerical analysis method. One or more embodiments of this specification also relate to a background heat flow numerical analysis apparatus, a computing device, a computer-readable storage medium, and a computer program to address technical deficiencies in the prior art.

[0005] According to a first aspect of an embodiment of this specification, a background heat flow numerical analysis method is provided. The method is applied to a thermal balance test system in a virtual space. The system includes an environmental simulation container model, a test tooling model, and a spacecraft model. The method includes:

[0006] Performing grid discretization processing on the environmental simulation container model, the test fixture model, and the spacecraft model to obtain multiple system nodes and multiple spacecraft nodes, wherein the system nodes include multiple container model nodes and multiple fixture model nodes, the container model nodes correspond one-to-one to the spacecraft nodes, and the fixture model nodes correspond one-to-one to the spacecraft nodes;

[0007] After performing the thermal balance test, calculate the temperature of each system node;

[0008] After performing the radiated energy propagation test, the relative angle coefficient of the system node is calculated, and the relative radiation coefficient of the system node is calculated based on the relative angle coefficient;

[0009] According to the temperature and relative emissivity of each system node, the background heat flux value of each system node and the total background heat flux density are calculated.

[0010] In some embodiments, the step of performing mesh discretization processing on the environmental simulation container model, the test tooling model, and the spacecraft model includes:

[0011] Perform structured discretization on spacecraft models and test fixture models;

[0012] Perform unstructured discretization on an environmental simulation container model.

[0013] In some embodiments, a thermal balance test is performed on each part of each model based on preset thermal parameters, optical parameters, thermal boundary parameters, and thermal insulation parameters to calculate the temperature of each system node, including:

[0014] Obtain the thermal parameters, optical parameters, thermal boundary parameters and thermal insulation parameters of each system node, and calculate the thermal conductivity coefficient, thermal radiation coefficient, number of thermal conduction network nodes, number of thermal radiation network nodes and node quality;

[0015] The temperature of each system node is calculated based on the thermal conductivity coefficient, thermal radiation coefficient, the number of heat conduction network nodes, the number of heat radiation network nodes and the node mass.

[0016] In some embodiments, the step of calculating the relative view factor includes:

[0017] Obtaining propagation paths of multiple radiation energy rays in a radiation energy propagation test;

[0018] determining a first ray number of target rays emitted from a mesh surface of each system node and a first ray number of target rays received by each system node;

[0019] The relative view factor of each system node is calculated based on the first ray number and the second ray number.

[0020] In some embodiments, the step of calculating the relative emissivity includes:

[0021] Obtain the emissivity and mesh area of each node's corresponding grid, as well as the reflectivity of the radiation nodes involved in the radiation path of each node, where the sum of the emissivity and reflectivity of each node's corresponding grid is 1;

[0022] Calculate the grayscale coefficient of each system node based on the relative angular coefficient of each system node, the reflectivity of the radiation node, and the emissivity of the corresponding grid of each system node corresponding to the spacecraft node;

[0023] According to the emissivity, grid area and grayscale coefficient of the grid corresponding to each system node, the relative radiation coefficient of each system node is calculated.

[0024] In some embodiments, the step of calculating the background heat flux value of each system node includes:

[0025] Get the preset cosmic background temperature;

[0026] The background heat flux value of each system node is calculated based on the preset Stefan constant, the cosmic background temperature, and the temperature and relative emissivity of each system node.

[0027] In some embodiments, the step of calculating the total background heat flux density includes:

[0028] Obtain the background heat flux value and grid area of each system node;

[0029] Calculate the total heat flux value representing the sum of the background heat flux values of all system nodes;

[0030] Calculate the total area value representing the sum of the grid areas of all system nodes;

[0031] The total background heat flux density is obtained by calculating the quotient of the total heat flux value and the total area value.

[0032] According to a second aspect of an embodiment of this specification, a background heat flow numerical analysis device is provided, comprising:

[0033] The grid discretization processing module is configured to perform grid discretization processing on the environmental simulation container model, the test tooling model and the spacecraft model to obtain multiple system nodes and multiple spacecraft nodes, wherein the system nodes include multiple container model nodes and multiple tooling model nodes, the container model nodes correspond one-to-one to the spacecraft nodes, and the tooling model nodes correspond one-to-one to the spacecraft nodes.

[0034] The first calculation module is configured to calculate the temperature of each system node after executing a thermal balance test.

[0035] The second calculation module is configured to calculate the relative angle coefficient of the system node after performing the radiation energy propagation test, and calculate the relative radiation coefficient of the system node according to the relative angle coefficient.

[0036] The third calculation module is configured to calculate the background heat flux value of each system node and the total background heat flux density according to the temperature and relative emissivity of each system node.

[0037] In some embodiments, the step of performing mesh discretization processing on the environmental simulation container model, the test tooling model, and the spacecraft model includes:

[0038] Perform structured discretization on spacecraft models and test fixture models;

[0039] Perform unstructured discretization on an environmental simulation container model.

[0040] In some embodiments, a thermal balance test is performed on each part of each model based on preset thermal parameters, optical parameters, thermal boundary parameters, and thermal insulation parameters to calculate the temperature of each system node, including:

[0041] Obtain the thermal parameters, optical parameters, thermal boundary parameters and thermal insulation parameters of each system node, and calculate the thermal conductivity coefficient, thermal radiation coefficient, number of thermal conduction network nodes, number of thermal radiation network nodes and node quality;

[0042] The temperature of each system node is calculated based on the thermal conductivity coefficient, thermal radiation coefficient, the number of heat conduction network nodes, the number of heat radiation network nodes and the node mass.

[0043] In some embodiments, the step of calculating the relative view factor includes:

[0044] Obtaining propagation paths of multiple radiation energy rays in a radiation energy propagation test;

[0045] determining a first ray number of target rays emitted from a mesh surface of each system node and a first ray number of target rays received by each system node;

[0046] The relative view factor of each system node is calculated based on the first ray number and the second ray number.

[0047] In some embodiments, the step of calculating the relative emissivity includes:

[0048] Obtain the emissivity and mesh area of each node's corresponding grid, as well as the reflectivity of the radiation nodes involved in the radiation path of each node, where the sum of the emissivity and reflectivity of each node's corresponding grid is 1;

[0049] Calculate the grayscale coefficient of each system node based on the relative angular coefficient of each system node, the reflectivity of the radiation node, and the emissivity of the corresponding grid of each system node corresponding to the spacecraft node;

[0050] According to the emissivity, grid area and grayscale coefficient of the grid corresponding to each system node, the relative radiation coefficient of each system node is calculated.

[0051] In some embodiments, the step of calculating the background heat flux value of each system node includes:

[0052] Get the preset cosmic background temperature;

[0053] The background heat flux value of each system node is calculated based on the preset Stefan constant, the cosmic background temperature, and the temperature and relative emissivity of each system node.

[0054] In some embodiments, the step of calculating the total background heat flux density includes:

[0055] Obtain the background heat flux value and grid area of each system node;

[0056] Calculate the total heat flux value representing the sum of the background heat flux values of all system nodes;

[0057] Calculate the total area value representing the sum of the grid areas of all system nodes;

[0058] The total background heat flux density is obtained by calculating the quotient of the total heat flux value and the total area value.

[0059] According to a third aspect of an embodiment of this specification, a computing device is provided, including:

[0060] memory and processor;

[0061] The memory is used to store computer-executable instructions, and the processor is used to execute the computer-executable instructions. When the computer-executable instructions are executed by the processor, the steps of the above-mentioned background heat flow numerical analysis method are realized.

[0062] According to a fourth aspect of the embodiments of this specification, a computer-readable storage medium is provided, which stores computer-executable instructions, and when the instructions are executed by a processor, the steps of the above-mentioned background heat flow numerical analysis method are implemented.

[0063] According to a fifth aspect of the embodiments of this specification, a computer program is provided, wherein when the computer program is executed in a computer, the computer is caused to execute the steps of the above-mentioned background heat flow numerical analysis method.

[0064] At least one embodiment of the present specification significantly improves the integrity of complex system thermal environment simulation and temperature prediction accuracy by integrating multi-dimensional thermal control parameters and intelligent algorithms. BRIEF DESCRIPTION OF THE DRAWINGS

[0065] Figure 1 is a flow chart of some embodiments of a background heat flow numerical analysis method provided by some embodiments of this specification;

[0066] Figure 2 is a schematic diagram of some embodiments of a thermal balance test system provided in some embodiments of this specification;

[0067] Figure 3 The background heat flux density distribution of each model on the spacecraft grid surface in a thermal balance test system provided by some embodiments of this specification;

[0068] Figure 4 It is a background heat flux total density distribution in a thermal balance test system provided in some embodiments of this specification;

[0069] Figure 5is a flow chart of other embodiments of a background heat flow numerical analysis method provided by some embodiments of this specification;

[0070] Figure 6 This is a simplified structural diagram of a background heat flow numerical analysis device provided in some embodiments of this specification;

[0071] Figure 7 This is a structural block diagram of a computing device provided in some embodiments of this specification.

[0072] Among them, the reference numerals in the figure include:

[0073] 100. Environmental simulation container model; 1001. Main container model; 1002. Auxiliary container model; 200. Spacecraft model; 300. Test tooling model; 3001. Docking basket model; 3002. Test bracket model. DETAILED DESCRIPTION

[0074] The following description sets forth many specific details to facilitate a thorough understanding of this specification. However, this specification can be implemented in many other ways than those described herein, and those skilled in the art can make similar generalizations without violating the scope of this specification. Therefore, this specification is not limited to the specific implementations disclosed below.

[0075] The terms used in one or more embodiments of this specification are for the purpose of describing specific embodiments only and are not intended to limit one or more embodiments of this specification. The singular forms of "a" and "the" used in one or more embodiments of this specification and the appended claims are also intended to include plural forms, unless the context clearly indicates otherwise. It should also be understood that the term "and / or" used in one or more embodiments of this specification refers to and includes any or all possible combinations of one or more associated listed items. The modifications of "one" and "a plurality" mentioned in this disclosure are illustrative and not restrictive, and those skilled in the art should understand that unless the context clearly indicates otherwise, it should be understood as "one or more".

[0076] It should be understood that although the terms first, second, etc. may be used to describe various information in one or more embodiments of this specification, such information should not be limited to these terms. These terms are only used to distinguish the same type of information from each other. For example, without departing from the scope of one or more embodiments of this specification, the first may also be referred to as the second, and similarly, the second may also be referred to as the first. Depending on the context, the word "if" as used herein may be interpreted as "at the time of" or "when" or "in response to determining".

[0077] See also Figure 1 and Figure 2 , Figure 1 A flowchart of a background heat flow numerical analysis method provided according to some embodiments of this specification is shown. Figure 2 A simple model schematic diagram of an environment simulation container model 100 , a test tool model 300 and a spacecraft model 200 is shown. The method specifically includes the following steps.

[0078] Step 101: Perform grid discretization processing on the environmental simulation container model 100, the test tooling model 300 and the spacecraft model 200 to obtain multiple system nodes and multiple spacecraft nodes.

[0079] In some embodiments, the execution subject of the background heat flow numerical analysis method (such as a preset computing device) can be connected to the target device through a wired connection or a wireless connection, and then the environmental simulation container model 100, the test tooling model 300 and the spacecraft model 200 are grid discretized to obtain multiple system nodes and multiple spacecraft nodes. Among them, the system nodes include multiple container model nodes and multiple tooling model nodes, the container model nodes correspond one-to-one to the spacecraft nodes, and the tooling model nodes correspond one-to-one to the spacecraft nodes. The above-mentioned wireless connection method may include but is not limited to 3G / 4G / 5G / 6G connection, WiFi connection, Bluetooth connection, WiMAX connection, Zigbee connection, UWB (ultra wideband) connection, and other wireless connection methods currently known or to be developed in the future.

[0080] The environmental simulation container model 100 may refer to a digital model of a sealed cavity used to replicate the thermal environment of a spacecraft during on-orbit operation. It can simulate space thermal boundary conditions such as a vacuum cold black background, solar radiation, and infrared radiation. The test fixture model 300 may refer to a digital model of the auxiliary device that supports the positioning and installation of the spacecraft within the environmental simulation container. It has functions such as heat conduction and thermal isolation, and is used to precisely control the heat exchange path between the spacecraft and the container. The spacecraft model 200 may refer to a three-dimensional parametric model of a spacecraft such as a satellite / spacecraft and its components. Mesh discretization processing may refer to the process of decomposing a continuous three-dimensional geometric model (such as the environmental simulation container, test fixture, and spacecraft model 200) into discrete mesh units and nodes. Container model nodes may refer to nodes obtained by mesh discretization of the environmental simulation container model 100. Tool model nodes may refer to nodes obtained by mesh discretization of the test fixture model 300. Spacecraft nodes may refer to nodes obtained by mesh discretization of the spacecraft model 200. System nodes can refer to the container model nodes and tooling model nodes in general, for the convenience of subsequent description.

[0081] In some optional implementations, the steps of performing grid discretization processing on the environmental simulation container model 100, the test tooling model 300, and the spacecraft model 200 include: performing structured discretization on the spacecraft model 200 and the test tooling model 300; and performing unstructured discretization on the environmental simulation container model 100.

[0082] Structured discretization can refer to the use of regularly arranged grid units (such as hexahedrons and quadrilaterals) to divide the geometric model, and achieve an orderly arrangement of nodes and units through preset topological relationships. Unstructured discretization can refer to the use of irregular grid units (such as tetrahedrons and pyramids) to adaptively divide complex geometries, by dynamically adjusting the unit size and shape to fit the surface contour. However, it should be pointed out that although different grid discretization methods are used, the number of grids generated for each model is the same, and the nodes of each model correspond one to one.

[0083] Step 102: After executing the thermal balance test, calculate the temperature of each system node.

[0084] When performing a thermal balance test, it needs to be performed based on the set parameters. For example, when performing a thermal balance test, the thermal physical parameters of the materials in different parts of different models can be set in advance, including thermal conductivity, density, and constant-pressure specific heat capacity. The optical parameters of the materials in different parts of different models can also be set, including solar absorptivity, infrared emissivity, and transmittance. The thermal boundary parameters and thermal insulation parameters of different parts of different models can also be set. Afterwards, after performing the thermal balance test, the thermal parameters, optical parameters, thermal boundary parameters, and thermal insulation parameters of each node are collected.

[0085] In some optional implementations, calculating the temperature of each system node includes: obtaining thermal parameters, optical parameters, thermal boundary parameters and thermal insulation parameters of each system node, calculating the thermal conductivity coefficient, thermal radiation coefficient, the number of thermal conduction network nodes, the number of thermal radiation network nodes and the node mass; and calculating the temperature of each system node based on the thermal conductivity coefficient, thermal radiation coefficient, the number of thermal conduction network nodes, the number of thermal radiation network nodes and the node mass.

[0086] Specifically, the steps of calculating the temperature of each system node according to the thermal conductivity coefficient, the thermal radiation coefficient, the number of heat conduction network nodes, the number of heat radiation network nodes, and the node mass include:

[0087] In the first step, the thermal conductivity, density and constant-pressure specific heat capacity in the thermal parameters of each system node, the solar absorptivity, infrared emissivity and transmittance in the optical parameters of each system node, multiple temperature setting values in the thermal boundary parameters of each system node, and the thermal insulation factor and contact thermal resistance factor in the thermal insulation parameters of each system node are obtained.

[0088] In the second step, the thermal conductivity is calculated based on the temperature setting value, thermal conductivity, density, specific heat capacity at constant pressure, insulation factor and contact thermal resistance factor.

[0089] The third step is to calculate the thermal radiation coefficient based on the temperature setting value, solar absorption ratio, infrared emissivity, penetration ratio and insulation factor.

[0090] The fourth step is to calculate the node quality based on the mesh area and density.

[0091] In the fifth step, the total number of nodes is determined as the number of nodes in the heat conduction network.

[0092] In the sixth step, the number of thermal contact nodes corresponding to any node set is determined as the number of nodes in the heat radiation network.

[0093] In the seventh step, the temperature of each system node is calculated based on the thermal conductivity coefficient, thermal radiation coefficient, the number of heat conduction network nodes, the number of heat radiation network nodes and the node mass.

[0094] The insulation factor can refer to a dimensionless parameter that characterizes the ability of a multi-layer insulation component (such as a spacecraft multi-layer insulation felt or a tooling bracket insulation sleeve) to prevent heat flow transfer. The contact thermal resistance factor can refer to a parameter that describes the additional thermal resistance caused by surface roughness and preload at the contact interface of an assembly (such as a spacecraft bracket and a tooling slot, or an instrument and equipment mounting surface). The thermal conductivity coefficient can refer to a comprehensive parameter that describes the overall thermal conductivity of a material and its contact interface. The thermal radiation coefficient can refer to a parameter that characterizes the ability of an object's surface to transfer heat through electromagnetic wave radiation. The number of heat conduction network nodes can refer to the total number of grid nodes involved in the conduction heat flow calculation, that is, the sum of the number of container model nodes, tooling model nodes, and spacecraft nodes. The number of heat radiation network nodes can refer to the number of nodes involved in the radiation heat transfer calculation, which only includes surface nodes with direct radiation visibility (such as the outer surface of the spacecraft, the inner wall of the container heat sink, etc.). This number can be obtained based on system calculations and will not be described in detail here.

[0095] These embodiments of the specification significantly improve the integrity of complex system thermal environment simulation and temperature prediction accuracy by integrating multi-dimensional thermal control parameters and intelligent algorithms.

[0096] In some optional implementations, the temperature of each system node is calculated based on a preset first calculation formula, as well as a thermal conductivity coefficient, a thermal radiation coefficient, the number of heat conduction network nodes, the number of heat radiation network nodes, and the node mass, wherein the first calculation formula includes:

[0097]

[0098] Where i is the i-th system node, j is the j-th spacecraft node, c i is the specific heat capacity of node i, M i is the mass of node i, Dji is the heat conduction network coefficient between nodes, E ji is the heat radiation network coefficient between nodes, T is the node temperature, t is the relative time of the experiment, L is the number of heat conduction network nodes, and M is the number of heat radiation network nodes.

[0099] Step 103: After performing the radiated energy propagation test, the relative angle coefficients of the system nodes are calculated, and the relative radiation coefficients of the system nodes are calculated based on the relative angle coefficients.

[0100] The relative angular coefficient can be a dimensionless parameter that describes the geometric relationship between the radiation energy transfer between two node surfaces. The relative radiative coefficient can be a comprehensive parameter of radiation heat transfer capacity based on the relative angular coefficient and the dynamic correction of the material optical parameters, reflecting the actual radiation heat transfer efficiency between nodes.

[0101] In some embodiments, the step of calculating the relative angular coefficient includes: obtaining propagation paths of multiple radiant energy rays in a radiant energy propagation test; determining the number of first rays of target rays emitted from the mesh surface of each system node, and the number of first rays of target rays received by each system node; and calculating the relative angular coefficient of each system node based on the first ray number and the second ray number. Specifically, the angular coefficient between each node can be calculated using a Monte Carlo method, which randomly simulates a large number of radiant energy ray propagation paths to evaluate the portion of radiant energy emitted by one node that reaches another node.

[0102] In some optional implementations, the relative angular coefficient of each system node may be calculated by combining the first ray number and the second ray number using a preset second calculation formula, wherein the second calculation formula includes:

[0103]

[0104] Where N is the number of first rays emitted from the mesh surface of node a, n is the number of second rays reaching the mesh surface of node b, and FF ab is the relative angular coefficient from node a to node b.

[0105] In some optional implementations, the steps of calculating the relative radiation coefficient include: obtaining the emissivity, reflectivity and grid area of the grid corresponding to each node, wherein the sum of the emissivity and reflectivity of the grid corresponding to each node is 1; calculating the grayscale coefficient of each system node based on the relative angular coefficient of each system node, the reflectivity of the radiation node, and the emissivity of the grid corresponding to the spacecraft node of each system node; calculating the relative radiation coefficient of each system node based on the emissivity, grid area and grayscale coefficient of the grid corresponding to each system node.

[0106] In some optional implementations, the gamma coefficient of each system node is calculated using a preset third calculation formula, combined with the relative angular coefficient of each system node and the emissivity of the grid corresponding to the spacecraft node corresponding to each system node, wherein the third calculation formula includes:

[0107]

[0108] Where i is the i-th system node, j is the j-th spacecraft node, B ij is the grayscale coefficient, N S is the number of nodes in the object heat transfer network, FF jk is the relative angular coefficient between spacecraft node j and radiation node k, ε j is the emissivity of the grid corresponding to the spacecraft node, k is the radiation node number, 1-ε k is the reflectivity of the kth radiation node.

[0109] In some optional implementations, the relative emissivity of each system node is calculated by combining the emissivity, grid area, and gamma coefficient of the grid corresponding to each system node using a preset fourth calculation formula, wherein the fourth calculation formula includes:

[0110] (G rad ) ij =ε i A i B ij

[0111] Where i is the i-th system node, j is the j-th spacecraft node, (G rad ) ij is the relative radiation coefficient between the i-th system node and the j-th spacecraft node, ε i is the emission rate of the i-th system node, A i is the emissivity area of the ith system node.

[0112] Through radiation energy propagation experiments and parameter coupling calculations, multi-dimensional and accurate modeling of radiation heat transfer in complex systems is achieved, thereby greatly improving the calculation accuracy.

[0113] Step 104: Calculate the background heat flux value and total background heat flux density for each system node based on the temperature and relative emissivity of each system node. The background heat flux value refers to the heat flux intensity per unit area of a single system node, calculated based on its temperature parameters and relative emissivity under a steady-state thermal environment. The total background heat flux density refers to the spatial superposition of the background heat flux values of all nodes in the system, reflecting the combined effect of thermal radiation interactions among multiple nodes.

[0114] In some optional implementations, the step of calculating the background heat flux value of each system node includes: obtaining a preset cosmic background temperature; and calculating the background heat flux value of each system node based on a preset Stefan constant, the cosmic background temperature, and the temperature and relative emissivity of each system node.

[0115] In some optional implementations, the environmental simulation container model 100 includes a main container model 1001 and an auxiliary container model 1002. The test fixture model 300 includes a docking basket model 3001 and a test stand model 3002. The main container nodes, the auxiliary container nodes corresponding to the auxiliary container model 1002, the docking basket nodes corresponding to the docking basket model 3001, and the test stand nodes corresponding to the test stand model 3002 can be screened from the background heat flux values of each system node for precise processing.

[0116] Reference Figure 3 , which shows the background heat flux density distribution of each model for the spacecraft grid surface in some embodiments of the present invention.

[0117] In some optional implementations, the steps for calculating the total background heat flux density include: obtaining the background heat flux value and grid area of each system node; calculating the total heat flux value representing the sum of the background heat flux values of all system nodes; calculating the total area value representing the sum of the grid areas of all system nodes; and calculating the quotient of the total heat flux value to the total area value to obtain the total background heat flux density.

[0118] Reference Figure 4 , which shows the background heat flux total density distribution in some embodiments of the present invention.

[0119] The beneficial effects of one of the embodiments of this specification include at least: significantly improving the integrity of complex system thermal environment simulation and temperature prediction accuracy by integrating multi-dimensional thermal control parameters and intelligent algorithms.

[0120] The following combined Figure 5 , shows a processing flow chart of a background heat flow numerical analysis method provided in some other embodiments of this specification, which specifically includes the following steps.

[0121] Step 201: Perform grid discretization processing on the environmental simulation container model 100, the test tooling model 300 and the spacecraft model 200 to obtain multiple system nodes and multiple spacecraft nodes.

[0122] Step 202: After executing the thermal balance test, calculate the temperature of each system node.

[0123] Step 203: After executing the radiation energy propagation test, the propagation paths of the plurality of radiation energy rays in the radiation energy propagation test are obtained.

[0124] Step 204: Determine the first ray number of target rays emitted by the mesh surface of each system node, and the first ray number of target rays received by each system node.

[0125] Step 205: Calculate the relative angular coefficient of each system node according to the first ray number and the second ray number.

[0126] Step 206: Obtain the emissivity and mesh area of the mesh corresponding to each node, and the reflectivity of the radiation nodes involved in the radiation path of each node.

[0127] Step 207: Calculate the grayscale coefficient of each system node based on the relative angular coefficient of each system node, the reflectivity of the radiation node, and the emissivity of the corresponding grid of the spacecraft node corresponding to each system node.

[0128] Step 208: Calculate the relative emissivity of each system node based on the emissivity, grid area, and grayscale coefficient of the grid corresponding to each system node.

[0129] Step 209: Calculate the background heat flux value of each system node and the total background heat flux density based on the temperature and relative emissivity of each system node.

[0130] In some embodiments, steps 201-209 are Figure 1 The specific implementation of the corresponding steps in the corresponding embodiments and the technical effects brought about can be referred to Figure 1 The steps in will not be repeated here.

[0131] Corresponding to the above method embodiment, this specification also provides an embodiment of a background heat flow numerical analysis device, Figure 6 FIG. 1 shows a schematic diagram of a background heat flow numerical analysis device provided in some embodiments of this specification. Figure 6 As shown, the device includes:

[0132] The grid discretization processing module 301 is configured to perform grid discretization processing on the environmental simulation container model 100, the test tooling model 300 and the spacecraft model 200 to obtain multiple system nodes and multiple spacecraft nodes, wherein the system nodes include multiple container model nodes and multiple tooling model nodes, the container model nodes correspond one-to-one to the spacecraft nodes, and the tooling model nodes correspond one-to-one to the spacecraft nodes.

[0133] The first calculation module 302 is configured to calculate the temperature of each system node after executing the thermal balance test.

[0134] The second calculation module 303 is configured to calculate the relative angle coefficient of the system node after performing the radiation energy propagation test, and calculate the relative radiation coefficient of the system node according to the relative angle coefficient.

[0135] The third calculation module 304 is configured to calculate the background heat flux value of each system node and the total background heat flux density according to the temperature and relative emissivity of each system node.

[0136] In some optional implementations, module 301 is further configured to:

[0137] In some embodiments, the steps of performing mesh discretization processing on the environmental simulation container model 100 , the test tool model 300 , and the spacecraft model 200 include:

[0138] Performing structured discretization on the spacecraft model 200 and the test fixture model 300;

[0139] Unstructured discretization is performed on the environmental simulation container model 100 .

[0140] In some embodiments, a thermal balance test is performed on each part of each model based on preset thermal parameters, optical parameters, thermal boundary parameters, and thermal insulation parameters to calculate the temperature of each system node, including:

[0141] Obtain the thermal parameters, optical parameters, thermal boundary parameters and thermal insulation parameters of each system node, and calculate the thermal conductivity coefficient, thermal radiation coefficient, number of thermal conduction network nodes, number of thermal radiation network nodes and node quality;

[0142] The temperature of each system node is calculated based on the thermal conductivity coefficient, thermal radiation coefficient, the number of heat conduction network nodes, the number of heat radiation network nodes and the node mass.

[0143] In some embodiments, the step of calculating the relative view factor includes:

[0144] Obtaining propagation paths of multiple radiation energy rays in a radiation energy propagation test;

[0145] determining a first ray number of target rays emitted from a mesh surface of each system node and a first ray number of target rays received by each system node;

[0146] The relative view factor of each system node is calculated based on the first ray number and the second ray number.

[0147] In some embodiments, the step of calculating the relative emissivity includes:

[0148] Obtain the emissivity and mesh area of each node's corresponding grid, as well as the reflectivity of the radiation nodes involved in the radiation path of each node, where the sum of the emissivity and reflectivity of each node's corresponding grid is 1;

[0149] Calculate the grayscale coefficient of each system node based on the relative angular coefficient of each system node, the reflectivity of the radiation node, and the emissivity of the corresponding grid of each system node corresponding to the spacecraft node;

[0150] According to the emissivity, grid area and grayscale coefficient of the grid corresponding to each system node, the relative radiation coefficient of each system node is calculated.

[0151] In some embodiments, the step of calculating the background heat flux value of each system node includes:

[0152] Get the preset cosmic background temperature;

[0153] The background heat flux value of each system node is calculated based on the preset Stefan constant, the cosmic background temperature, and the temperature and relative emissivity of each system node.

[0154] In some embodiments, the step of calculating the total background heat flux density includes:

[0155] Obtain the background heat flux value and grid area of each system node;

[0156] Calculate the total heat flux value representing the sum of the background heat flux values of all system nodes;

[0157] Calculate the total area value representing the sum of the grid areas of all system nodes;

[0158] The total background heat flux density is obtained by calculating the quotient of the total heat flux value and the total area value.

[0159] The above is a schematic diagram of a background heat flow numerical analysis device according to this embodiment. It should be noted that the technical solution of this background heat flow numerical analysis device and the technical solution of the background heat flow numerical analysis method described above are based on the same concept. For details not described in detail in the technical solution of the background heat flow numerical analysis device, please refer to the description of the technical solution of the background heat flow numerical analysis method described above.

[0160] Figure 7 4 shows a block diagram of a computing device according to some embodiments of the present disclosure. Components of the computing device include, but are not limited to, a memory 401 and a processor 402. The processor 402 is connected to the memory 401 via a bus 403, and a database 405 is used to store data.

[0161] The computing device also includes an access device 404 that enables the computing device to communicate via one or more networks 406. Examples of such networks include a public switched telephone network (PSTN), a local area network (LAN), a wide area network (WAN), a personal area network (PAN), or a combination of communication networks such as the Internet. The access device 404 may include one or more of any type of network interface (e.g., a network interface card (NIC)) whether wired or wireless, such as an IEEE 802.11 wireless local area network (WLAN) wireless interface, a Worldwide Interoperability for Microwave Access (Wi-MAX) interface, an Ethernet interface, a universal serial bus (USB) interface, a cellular network interface, a Bluetooth interface, or a near field communication (NFC) interface.

[0162] In one embodiment of the present specification, the above components of the computing device and Figure 7 Other components not shown in the figure may also be connected to each other, for example, via a bus. Figure 7 The computing device structure block diagram shown is for illustrative purposes only and is not intended to limit the scope of this specification. Those skilled in the art may add or replace other components as needed.

[0163] The computing device may be any type of stationary or mobile computing device, including a mobile computer or mobile computing device (e.g., a tablet computer, a personal digital assistant, a laptop computer, a notebook computer, a netbook computer, etc.), a mobile phone (e.g., a smartphone), a wearable computing device (e.g., a smartwatch, smart glasses, etc.), or other types of mobile devices, or a stationary computing device such as a desktop computer or a personal computer (PC). The computing device may also be a mobile or stationary server.

[0164] The processor 402 is configured to execute the following computer-executable instructions, which, when executed by the processor, implement the steps of the aforementioned background heat flux numerical analysis method. The above is a schematic diagram of a computing device according to this embodiment. It should be noted that the technical solution of the computing device and the technical solution of the aforementioned background heat flux numerical analysis method are based on the same concept. For details not described in detail in the technical solution of the computing device, please refer to the description of the technical solution of the aforementioned background heat flux numerical analysis method.

[0165] An embodiment of the present specification further provides a computer-readable storage medium storing computer-executable instructions, which, when executed by a processor, implement the steps of the above-mentioned background heat flow numerical analysis method.

[0166] The above is a schematic diagram of a computer-readable storage medium according to this embodiment. It should be noted that the technical solution of this storage medium is based on the same concept as the technical solution of the aforementioned background heat flow numerical analysis method. For details not described in detail in the technical solution of the storage medium, please refer to the description of the technical solution of the aforementioned background heat flow numerical analysis method.

[0167] An embodiment of the present specification further provides a computer program, wherein when the computer program is executed in a computer, the computer is caused to execute the steps of the above-mentioned background heat flow numerical analysis method.

[0168] The above is a schematic diagram of a computer program according to this embodiment. It should be noted that the technical solution of this computer program is based on the same concept as the technical solution of the aforementioned background heat flux numerical analysis method. For details not described in detail in the technical solution of the computer program, please refer to the description of the technical solution of the aforementioned background heat flux numerical analysis method.

[0169] The foregoing description of this specification describes specific embodiments. Other embodiments are within the scope of the appended claims. In some cases, the actions or steps recited in the claims can be performed in an order different from that described in the embodiments and still achieve the desired results. Furthermore, the processes depicted in the accompanying drawings do not necessarily require the specific order shown or the sequential order to achieve the desired results. In certain embodiments, multitasking and parallel processing are also possible or may be advantageous.

[0170] Computer instructions include computer program code, which may be in source code form, object code form, executable files, or some intermediate form. Computer-readable media may include any entity or device capable of carrying computer program code, recording media, USB flash drives, removable hard drives, magnetic disks, optical disks, computer memory, read-only memory (ROM), random access memory (RAM), electric carrier signals, telecommunications signals, and software distribution media. It should be noted that the content of computer-readable media may be appropriately expanded or reduced based on the requirements of legislation and patent practice within a jurisdiction. For example, in some jurisdictions, based on legislation and patent practice, computer-readable media does not include electric carrier signals or telecommunications signals.

[0171] It should be noted that for the aforementioned method embodiments, for the sake of simplicity of description, they are all expressed as a series of action combinations, but those skilled in the art should be aware that the embodiments of this specification are not limited by the order of the actions described, because according to the embodiments of this specification, certain steps can be performed in other orders or simultaneously. Secondly, those skilled in the art should also be aware that the embodiments described in this specification are all preferred embodiments, and the actions and modules involved are not necessarily required by the embodiments of this specification.

[0172] In the above embodiments, the description of each embodiment has its own focus. For parts that are not described in detail in a certain embodiment, reference can be made to the relevant descriptions of other embodiments.

[0173] The preferred embodiments disclosed above are intended only to help illustrate this specification. The optional embodiments do not exhaustively describe all details, nor do they limit the invention to specific embodiments. Obviously, many modifications and variations are possible based on the content of the embodiments described herein. These embodiments are selected and specifically described in this specification to better explain the principles and practical applications of the embodiments, thereby enabling those skilled in the art to better understand and utilize this specification. This specification is limited only by the claims and their full scope and equivalents.

Claims

1. A background heat flow numerical analysis method, characterized in that: The method is applied to a thermal balance test system in a virtual space, the system including an environmental simulation container model, a test tooling model, and a spacecraft model, and the method includes: Performing grid discretization processing on the environmental simulation container model, the test tooling model, and the spacecraft model to obtain a plurality of system nodes and a plurality of spacecraft nodes, wherein the system nodes include a plurality of container model nodes and a plurality of tooling model nodes, the container model nodes correspond one-to-one to the spacecraft nodes, and the tooling model nodes correspond one-to-one to the spacecraft nodes; After performing the thermal balance test, calculate the temperature of each system node; After performing the radiant energy propagation test, calculating the relative angle coefficient of the system node, and calculating the relative radiation coefficient of the system node based on the relative angle coefficient; According to the temperature and relative emissivity of each system node, the background heat flux value of each system node and the total background heat flux density are calculated.

2. The method according to claim 1, characterized in that The steps of performing grid discretization processing on the environmental simulation container model, the test tooling model, and the spacecraft model include: performing structured discretization on the spacecraft model and the test fixture model; Unstructured discretization is performed on the environmental simulation container model.

3. The method according to claim 1, characterized in that The thermal balance test is performed on each part of each model based on preset thermal parameters, optical parameters, thermal boundary parameters, and thermal insulation parameters. The temperature of each system node is calculated, including: Obtain the thermal parameters, optical parameters, thermal boundary parameters and thermal insulation parameters of each system node, and calculate the thermal conductivity coefficient, thermal radiation coefficient, number of thermal conduction network nodes, number of thermal radiation network nodes and node quality; The temperature of each system node is calculated according to the thermal conductivity coefficient, the thermal radiation coefficient, the number of heat conduction network nodes, the number of heat radiation network nodes and the node mass.

4. The method according to claim 1, wherein The calculation step of the relative angular coefficient includes: Obtaining propagation paths of multiple radiation energy rays in a radiation energy propagation test; Determining a first ray number of target rays emitted by a grid surface of each system node and a first ray number of the target rays received by each system node; The relative angular coefficient of each system node is calculated according to the first ray number and the second ray number.

5. The method according to claim 4, characterized in that The calculation steps of the relative emissivity include: Obtain the emissivity and mesh area of each node's corresponding grid, as well as the reflectivity of the radiation nodes involved in the radiation path of each node, where the sum of the emissivity and reflectivity of each node's corresponding grid is 1; Calculating the gamma coefficient of each system node according to the relative angular coefficient of each system node, the reflectivity of the radiation node, and the emissivity of the corresponding grid of the spacecraft node corresponding to each system node; According to the emissivity, grid area and grayscale coefficient of the grid corresponding to each system node, the relative radiation coefficient of each system node is calculated.

6. The method according to claim 1, characterized in that The calculation steps of the background heat flux value of each system node include: Get the preset cosmic background temperature; The background heat flow value of each system node is calculated based on the preset Stefan constant, the cosmic background temperature, and the temperature and relative emissivity of each system node.

7. The method according to claim 1, characterized in that The calculation steps of the total background heat flux density include: Obtain the background heat flux value and grid area of each system node; Calculate the total heat flux value representing the sum of the background heat flux values of all system nodes; Calculate the total area value representing the sum of the grid areas of all system nodes; The quotient of the total heat flux value and the total area value is calculated to obtain the total background heat flux density.

8. A background heat flow numerical analysis device, characterized in that: The device is applied to a thermal balance test system in a virtual space, the system comprising an environmental simulation container model, a test tooling model, and a spacecraft model, and the device comprises: a grid discretization processing module configured to perform grid discretization processing on the environmental simulation container model, the test tooling model, and the spacecraft model to obtain a plurality of system nodes and a plurality of spacecraft nodes, wherein the system nodes include a plurality of container model nodes and a plurality of tooling model nodes, the container model nodes correspond one-to-one to the spacecraft nodes, and the tooling model nodes correspond one-to-one to the spacecraft nodes; a first calculation module, configured to calculate the temperature of each system node after performing a thermal balance test; a second calculation module, configured to calculate the relative angle coefficient of the system node after performing the radiation energy propagation test, and calculate the relative radiation coefficient of the system node according to the relative angle coefficient; The third calculation module is configured to calculate the background heat flux value of each system node and the total background heat flux density according to the temperature and relative emissivity of each system node.

9. A computing device, characterized in that include: memory and processor; The memory is used to store computer-executable instructions, and the processor is used to execute the computer-executable instructions. When the computer-executable instructions are executed by the processor, the steps of the background heat flow numerical analysis method according to any one of claims 1 to 7 are implemented.

10. A computer-readable storage medium storing computer-executable instructions, characterized in that: When the computer executable instructions are executed by a processor, the steps of the background heat flow numerical analysis method according to any one of claims 1 to 7 are implemented.

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