A smart bidirectional inverter

Abstract

The present invention relates to the field of inverter heat dissipation technology, and in particular to an intelligent bidirectional inverter. The technical problems to be solved are: electronic components hinder airflow and heat dissipation, and welding protrusions on circuit boards hinder the fitting of water cooling equipment. The technical solution of the present invention is: it includes a base, a shell, etc., the shell is fixedly mounted on the base, and the top of the shell is concave and convex, which is used to accelerate the heat dissipation inside the shell. The present invention arranges air guide plates and oblique heat dissipation strips, and the air flow absorbs the heat of the circuit board during the flow and contacts the oblique heat dissipation strips, so that the oblique heat dissipation strips absorb the heat of the air flow and transfer it to the shell through the air guide plates, and the shell dissipates the heat to the outside. At the same time, the air guide plates and oblique heat dissipation strips will guide the air flow, increase the air flow velocity, thereby reducing the air flow's absorption of heat, preventing the local air cooling effect of the circuit board from deteriorating, and enabling the air flow to effectively absorb heat, thereby improving the heat dissipation efficiency and service life of the circuit board.

Description

Technical Field

[0001] The present invention relates to the technical field of inverter heat dissipation, and in particular to an intelligent bidirectional inverter. Background Art

[0002] An inverter is an electrical device that converts direct current into alternating current and regulates the voltage. It is widely used in scenarios where an AC power supply is required. As a high-power electrical appliance, the inverter often generates a lot of heat during use. The high temperature of the inverter will reduce the working efficiency and service life of the internal electronic components. For existing cooling technology, the complex electronic components on the circuit board will hinder the flow of air, causing heat to accumulate on the circuit board. In addition, there will be many solder bumps on the circuit board, making it impossible for water cooling equipment to fit on the circuit board for cooling. In response to this, an intelligent bidirectional inverter with efficient heat dissipation is provided to ensure the working efficiency and service life of the inverter. Summary of the Invention

[0003] In order to overcome the shortcomings of electronic components hindering airflow and heat dissipation and solder bumps on circuit boards hindering the fit of water cooling equipment, the technical problem to be solved is to provide an intelligent bidirectional inverter with efficient heat dissipation.

[0004] The technical solution of the present invention is: an intelligent bidirectional inverter, comprising:

[0005] base;

[0006] The shell is fixedly mounted on the base, and the top of the shell is concave-convex to accelerate the heat dissipation inside the shell;

[0007] A circuit board is mounted on the base through bolts and is located inside the housing;

[0008] The suction fan and the exhaust fan are located on both sides of the base respectively. The suction fan is used to suck the external airflow into the shell, and the exhaust fan is used to guide the airflow inside the shell to be discharged, so that the suction fan and the exhaust fan form a stable airflow in the shell;

[0009] The air cooling enhancement unit is located at the top of the housing and is used to enhance the airflow formed by the suction fan and the exhaust fan in the housing, thereby improving the heat dissipation efficiency of the airflow on the circuit board;

[0010] The water-cooling enhancement unit is located on the top of the base and is used to further absorb the heat generated by the circuit board, thereby improving the heat dissipation efficiency of the circuit board.

[0011] Furthermore, the air cooling enhancement unit includes:

[0012] An air guide plate is provided at the top inner portion of the shell, and the bottom of the air guide plate is an inclined surface, and the inclined surface faces the suction fan.

[0013] Furthermore, the air cooling enhancement unit also includes:

[0014] The oblique heat dissipation strips are linearly and evenly distributed at the bottom of the air guide plate, which are used to guide the direction of the airflow in the shell during the flow process and absorb the heat of the airflow through their own surface. The heat is transferred to the shell through the air guide plate, so that the shell dissipates the heat to the outside through the concave and convex surface on its top, thereby improving the efficiency of the airflow in absorbing the heat of the circuit board.

[0015] Furthermore, the air cooling enhancement unit also includes:

[0016] Thermal conductive sponge is set between the oblique heat dissipation strip and the circuit board. The thermal conductive sponge has a high thermal conductivity coefficient and is used to transfer heat from the circuit board.

[0017] Furthermore, the thermally conductive sponge has a porous structure, and a plurality of large vents and small vents are provided on the surface of the thermally conductive sponge. The small vents are distributed around the large vents, and the small vents are connected to the large vents through the porous structure of the thermally conductive sponge.

[0018] Furthermore, the air cooling enhancement unit also includes:

[0019] The wind limiting plates are arranged in a rectangular shape on both sides of the heat conducting sponge and are fixed to the shell.

[0020] Furthermore, the water cooling enhancement unit includes:

[0021] Water pump, the water pump is installed on the top of the base;

[0022] The heat pipe is arranged on the top of the base and below the circuit board. The heat pipe is filled with coolant and is connected to the water pump.

[0023] The reflux heat dissipation pipe is connected and installed on the water pump, so that the water pump, the heat conduction pipe and the reflux heat dissipation pipe form a coolant circulation loop.

[0024] Furthermore, the water cooling enhancement unit also includes:

[0025] The pipe network is arranged between the heat pipe and the circuit board and is in contact with the heat pipe and the circuit board to transfer heat from the circuit board.

[0026] Furthermore, the pipe network is composed of a plurality of metal pipes, and air flow holes are opened at the axis of the metal pipes to transfer heat from the circuit board.

[0027] Furthermore, the water cooling enhancement unit also includes:

[0028] A porous capillary layer is provided on the top surface of the heat pipe. The porous capillary layer has a porous structure and is used to accelerate the heat absorption of the coolant.

[0029] The beneficial effects are: 1. The present invention sets air guide plates and oblique heat dissipation strips, and the air flow absorbs the heat of the circuit board and contacts the oblique heat dissipation strips during the flow, so that the oblique heat dissipation strips absorb the heat of the air flow through their own surfaces and transfer it to the shell through the air guide plates. The shell dissipates the heat to the outside through its own top. At the same time, the air guide plates and oblique heat dissipation strips will guide the air flow, so that the flow cross-sectional area of ​​the air flow gradually decreases, thereby increasing the pressure and flow rate of the air flow, reducing the absorption of heat by the air flow, and preventing the air flow from absorbing too much heat before passing through the circuit board, resulting in a deterioration of the local air cooling effect of the circuit board, so that the air flow can always effectively absorb the heat from the circuit board when flowing above the circuit board, thereby improving the heat dissipation efficiency and service life of the circuit board.

[0030] 2. The present invention provides thermally conductive sponges. When the circuit board is working, the circuit board will transfer heat to the thermally conductive sponges, which will transfer the heat to the air guide plate through the oblique heat dissipation strips, so that the shell will dissipate the heat, thus achieving the initial heat dissipation of the circuit board. At the same time, the large and small air vents on the thermally conductive sponges will allow the heat of the thermally conductive sponges to dissipate into the air and be blown away by the airflow, thereby accelerating the heat dissipation of the circuit board and improving the service life of the circuit board.

[0031] 3. The present invention provides a porous capillary layer so that the porous capillary layer can quickly absorb the heat of the heat pipe through the porous structure. The porous structure of the porous capillary layer makes the flow path of the coolant more complicated, so that the coolant forms turbulence when flowing, and accelerates the heat exchange of the coolant through the self-collision of the turbulence, so that the coolant can more efficiently absorb the heat from the circuit board during the flow process, thereby improving the heat dissipation efficiency of the circuit board and increasing the service life of the circuit board. BRIEF DESCRIPTION OF THE DRAWINGS

[0032] Figure 1 It is a schematic diagram of the overall structure of the present invention;

[0033] Figure 2 is a schematic cross-sectional view of the housing of the present invention;

[0034] Figure 3 It is an overall exploded view of the present invention;

[0035] Figure 4 This is an exploded view of the air-cooling strengthening unit of the present invention;

[0036] Figure 5 Schematic diagram of the structure of the air guide plate of the present invention;

[0037] Figure 6 It is a structural schematic diagram of the suction fan and the exhaust fan of the present invention;

[0038] Figure 7 Schematic diagram of the structure of the heat pipe of the present invention;

[0039] Figure 8 It is a schematic cross-sectional view of the heat pipe and pipe network of the present invention.

[0040] In the accompanying drawings: 1-base, 2-shell, 3-circuit board, 4-suction fan, 401-exhaust fan, 5-air cooling enhancement unit, 501-air guide plate, 5011-oblique heat dissipation strip, 502-thermal sponge, 5021-large air vent, 5022-small air vent, 503-wind limiting plate, 6-water cooling enhancement unit, 601-water pump, 602-heat pipe, 603-reflux heat pipe, 604-pipe network, 6041-air flow hole, 605-porous capillary layer. DETAILED DESCRIPTION

[0041] The embodiments of the present invention are described in detail below with reference to the accompanying drawings. Example 1

[0042] A smart bidirectional inverter, such as Figure 1-Figure 3 As shown, it includes a base 1, a shell 2, a circuit board 3, an intake fan 4 and an exhaust fan 401. The shell 2 is fixedly mounted on the base 1, and the top of the shell 2 is concave and convex, which helps to accelerate the heat dissipation inside the shell 2. The circuit board 3 is mounted on the base 1 by bolts, and the circuit board 3 is located inside the shell 2. The intake fan 4 and the exhaust fan 401 are respectively mounted on both sides of the base 1. The intake fan 4 is used to suck the external airflow into the shell 2, and the exhaust fan 401 is used to guide the airflow inside the shell 2 to be discharged, so that the intake fan 4 and the exhaust fan 401 form an airflow with a stable flow direction in the shell 2, so that when the circuit board 3 dissipates heat, the airflow will efficiently absorb the heat of the circuit board 3 and discharge it outside the shell 2. It also includes an air cooling enhancement unit 5 and a water cooling enhancement unit 6. The air cooling enhancement unit 5 is located at the top of the shell 2, and is used to enhance the airflow formed by the intake fan 4 and the exhaust fan 401 in the shell 2, thereby improving the heat dissipation efficiency of the airflow on the circuit board 3. The water cooling enhancement unit 6 is located at the top of the base 1, and is used to further absorb the heat generated by the circuit board 3, thereby improving the heat dissipation efficiency of the circuit board 3.

[0043] like Figure 4-Figure 5 As shown, the air cooling enhancement unit 5 includes an air guide plate 501, and the air guide plate 501 is fixedly connected to the inner top of the shell 2. The bottom of the air guide plate 501 is an inclined surface, and the inclined surface faces the suction fan 4, so that when the airflow formed by the suction fan 4 and the exhaust fan 401 passes through the air guide plate 501, the airflow will be gradually compressed along the bottom inclined surface of the air guide plate 501, thereby gradually accelerating the flow of the airflow, so as to reduce the interference of the gradual increase in temperature of the airflow during the heat absorption process on the subsequent heat dissipation of the circuit board 3.

[0044] like Figure 4-Figure 5As shown, the air cooling enhancement unit 5 also includes an oblique heat dissipation strip 5011, which is linearly and evenly distributed at the bottom of the air guide plate 501. It can guide the direction of the airflow in the shell 2 during the flow process and absorb the heat of the airflow through its own surface. The heat is transferred to the shell 2 through the air guide plate 501, so that the shell 2 dissipates the heat to the outside through the concave and convex surface on its top, thereby improving the efficiency of the airflow in absorbing the heat of the circuit board 3.

[0045] like Figure 4-Figure 5 As shown, the air-cooling enhancement unit 5 also includes a thermally conductive sponge 502, which is arranged between the oblique heat dissipation strip 5011 and the circuit board 3. The thermally conductive sponge 502 has a high thermal conductivity coefficient, so that the heat of the circuit board 3 can be quickly absorbed by the thermally conductive sponge 502 and transferred to the thermally conductive sponge 502, thereby accelerating the heat dissipation speed between the circuit board 3 and the thermally conductive sponge 502, and effectively improving the heat dissipation efficiency of the circuit board 3.

[0046] like Figure 5 As shown, the thermal sponge 502 is a porous structure, and a plurality of large vent holes 5021 and small vent holes 5022 are provided on the surface of the thermal sponge 502. The small vent holes 5022 are distributed around the large vent holes 5021, and the small vent holes 5022 are connected to the large vent holes 5021 through the porous structure of the thermal sponge 502. The heat of the thermal sponge 502 can be dissipated at the large vent holes 5021 and the small vent holes 5022 and absorbed by the air flow. The air flow can pass through the large vent holes 5021 and the small vent holes 5022. It can effectively take away the heat from the circuit board 3, thereby improving the heat dissipation efficiency of the circuit board 3. Among them, the large air vent 5021 can quickly pass the air flow, so that the air flow at the small air vent 5022 and the large air vent 5021 can be quickly discharged from the interior of the thermal sponge 502. The small air vent 5022 limits the flow rate of the air flow through the aperture, thereby making the air flow more uniform at the small air vent 5022, making the air flow absorb heat more stably at the small air vent 5022, thereby avoiding local overheating of the thermal sponge 502 and the circuit board 3.

[0047] like Figure 4 and Figure 6 As shown, the air cooling enhancement unit 5 also includes an air limiting plate 503, which is rectangularly distributed and fixed on both sides of the thermal conductive sponge 502, and the air limiting plate 503 is fixed to the shell 2 to prevent the air flow from bypassing the thermal conductive sponge 502 and causing heat accumulation in the thermal conductive sponge 502, thereby ensuring the stability of the thermal conductive sponge 502 during the heat dissipation process of the circuit board 3.

[0048] like Figure 6-Figure 7As shown, the water cooling enhancement unit 6 includes a water pump 601, a heat pipe 602 and a return heat pipe 603. The two water pumps 601 are installed on the top of the base 1, and the heat pipe 602 is installed on the top of the base 1. The heat pipe 602 is located below the circuit board 3. The heat pipe 602 is filled with coolant. The heat pipe 602 is connected to the two water pumps 601, so that one of the water pumps 601 pushes the coolant in the heat pipe 602, and the other water pump 601 extracts the coolant in the heat pipe 602, thereby accelerating the flow of the coolant in the heat pipe 602. The return heat pipe 603 is connected and arranged between the two water pumps 601, so that the water pump 601, the heat pipe 602 and the return heat pipe 603 form a coolant circulation loop.

[0049] like Figure 6-Figure 7 As shown, the water cooling enhancement unit 6 also includes a pipe network 604, which is installed on the top of the heat pipe 602. The top of the pipe network 604 is in contact with the circuit board 3, so that the heat of the circuit board 3 can be transferred to the heat pipe 602 through the pipe network 604, so that the pipe network 604 can adapt to the welding protrusions formed on the circuit board 3 due to welding electronic components during the heat transfer process.

[0050] like Figure 8 As shown, the pipe network 604 is composed of multiple metal pipes, and air flow holes 6041 are opened at the axis of each metal pipe. Heat is transferred to the pipe network 604 through the circuit board 3, so that the top of the air flow hole 6041 of the metal pipe has higher heat and the bottom of the air flow hole 6041 has lower heat, so that the air temperature at the top of the air flow hole 6041 is higher than the air at the bottom of the air flow hole 6041. The air at the top of the air flow hole 6041 absorbs heat and its density decreases and its volume increases, so that the air at the top of the air flow hole 6041 of the metal pipe overflows from both ends of the air flow hole 6041 and is discharged outside the shell 2 along with the air flow in the shell 2. At the same time, the air pressure at the top of the air flow hole 6041 decreases, and the air at the bottom of the air flow hole 6041 flows upward due to the pressure difference, and the outside air enters the air flow hole 6041, so that the outside air supplements the air overflowing from the air flow hole 6041, thereby improving the heat dissipation efficiency of the circuit board 3.

[0051] like Figure 8 As shown, the water cooling enhancement unit 6 also includes a porous capillary layer 605. The porous capillary layer 605 is provided on the internal top surface of the heat pipe 602. The porous capillary layer 605 greatly increases the contact area with the coolant through the porous structure, so that when the heat of the heat pipe 602 is transferred to the coolant through the porous capillary layer 605, the coolant can effectively absorb the heat of the porous capillary layer 605. When the coolant passes through the porous capillary layer 605, the porous structure of the porous capillary layer 605 will make the flow path of the coolant more complicated, causing the coolant to be disturbed when flowing, thereby making it easier to absorb heat.

[0052] When the circuit board 3 is working, the electronic components of the circuit board 3 will generate heat. The accumulation of heat on the circuit board 3 will reduce the working efficiency and service life of the electronic components. In severe cases, the current protection on the circuit board 3 will disconnect the current of the circuit board 3, causing the equipment to stop working. In order to improve the heat dissipation efficiency of the circuit board 3 and reduce the heat accumulation problem caused by the shape of the circuit board 3, the present invention provides an air-cooling enhancement unit 5 and a water-cooling enhancement unit 6, so that the heat on the top of the circuit board 3 is quickly released by the air-cooling enhancement unit 5, and the heat at the bottom of the circuit board 3 is quickly released by the water-cooling enhancement unit 6, thereby effectively improving the heat dissipation efficiency and service life of the circuit board 3.

[0053] When the circuit board 3 is working, since the thermal conductive sponge 502 has a high thermal conductivity, the electronic components on the circuit board 3 will transfer heat to the thermal conductive sponge 502, and the thermal conductive sponge 502 will transfer the heat to the oblique heat dissipation strip 5011 on its top, so that the oblique heat dissipation strip 5011 will transfer the heat to the shell 2 through the air guide plate 501, and the shell 2 will dissipate the heat to the outside through the concave and convex surface on its top, thereby achieving the initial heat dissipation of the circuit board 3. At the same time, the staff starts the suction fan 4 and the exhaust fan 401. The suction fan 4 draws the outside air into the shell 2, and the exhaust fan 401 draws the shell 2 The internal air is discharged, and the air pressure around the exhaust fan 401 is reduced. The external air flow sucked by the suction fan 4 flows toward the exhaust fan 401 through the pressure difference in the shell 2, so that the air flow is guided into the large vent 5021 and the small vent 5022 of the heat conductive sponge 502. The heat conductive sponge 502 dissipates the absorbed heat to the air at the large vent 5021 and the small vent 5022, so that the air at the large vent 5021 and the small vent 5022 absorbs heat and becomes hot air. The air flow passes through the large vent 5021 and the small vent 5022 and mixes with the hot air, and the air flow is mixed with the hot air when it flows through the large vent 5021 and the small vent 5022. The inclined heat dissipation strip 5011 is in contact with the heat dissipation strip 5011 during the process, and the inclined heat dissipation strip 5011 absorbs the heat of the airflow through its own surface and transfers it to the shell 2 through the air guide plate 501. The shell 2 dissipates the heat to the outside through its own top, so that the airflow can always effectively absorb the heat from the circuit board 3 when flowing over the circuit board 3, avoiding the reduction of the heat dissipation efficiency of the circuit board 3. After passing through the large vent 5021 and the small vent 5022, the airflow will be discharged from the shell 2 through the exhaust fan 401. It is worth noting that the temperature of the airflow will continue to rise in the process of absorbing heat, thereby reducing the heat absorption efficiency of the airflow. Absorbing too much heat will make it difficult for local heat of the circuit board 3 to dissipate. In this regard, when the air flow flows through the large air vents 5021 and the small air vents 5022, it will be guided by the air guide plate 501 and the oblique heat dissipation strips 5011, causing the flow cross-sectional area of ​​the air flow to gradually decrease, thereby increasing the pressure and flow rate of the air flow. The faster air flow rate can avoid excessive absorption of heat, prevent the air flow from absorbing too much heat before passing through the circuit board 3 and interfere with the heat dissipation of the circuit board 3, thereby achieving effective heat dissipation of the circuit board 3, and preventing the circuit board 3 from being interfered with by excessively high temperature and the working state, thereby increasing the service life of the circuit board 3.

[0054] While the circuit board 3 is dissipating heat through the air flow, the staff starts the water pump 601, so that the water pump 601 drives the coolant in the heat pipe 602 to flow, and the coolant in the heat pipe 602 enters the return heat pipe 603 through the water pump 601 for heat dissipation. At the same time, the coolant in the return heat pipe 603 is driven by the water pump 601 to flow back into the heat pipe 602, realizing the circulation of the coolant. When the circuit board 3 is dissipating heat, the heat of the circuit board 3 is transferred to the heat pipe 602 through the pipe network 604 in contact with its bottom, so that the heat pipe 602 absorbs the heat and transfers it to the porous capillary layer 605. On the one hand, since the porous capillary layer 605 has a porous structure, the porous capillary layer 605 can greatly increase the contact area with the coolant through the porous structure, and the heat pipe 60 2 is quickly transferred to the coolant through the porous structure of the porous capillary layer 605, so that the coolant absorbs the heat. On the other hand, the porous structure of the porous capillary layer 605 makes the flow path of the coolant more complicated, so that the coolant is disturbed and forms turbulence when flowing. The self-collision of the turbulence can accelerate the heat exchange between the coolant and the porous capillary layer 605, so that the coolant can more efficiently absorb the heat from the circuit board 3 during the flow process, improve the heat dissipation efficiency of the circuit board 3, and thus increase the service life of the circuit board 3. It is worth noting that since the heat dissipation of the circuit board 3 is to transfer the heat from the circuit board 3 to the pipe network 604, and the pipe network 604 further transfers the heat to the heat pipe 602, a temperature gradient will be generated at the pipe network 604. , that is, the temperature of the top of the pipe network 604 close to the circuit board 3 is higher, and the temperature of the bottom of the pipe network 604 close to the heat pipe 602 is lower. At this time, the air at the top of the air flow hole 6041 absorbs the heat at the top of the pipe network 604, thereby reducing its density and increasing its volume, causing the air at the top of the air flow hole 6041 to overflow from both ends of the air flow hole 6041. The multiple metal tubes of the pipe network 604 are crisscrossed, allowing the pipe network 604 to absorb the heat of the circuit board 3 evenly over a large area, thereby causing the top of the air flow holes 6041 of the multiple metal tubes to overflow the heat-absorbing air at the same time. The heat-absorbing air increases in density due to its own density and mixes with the air flow flowing at the circuit board 3. The mixed gas is then discharged out of the shell 2 through the exhaust fan 401. As the air at the top of the air flow hole 6041 flows out, the air flow The air pressure at the top of the hole 6041 decreases accordingly, and the air at the bottom of the air hole 6041 flows upward due to the pressure difference, and the outside air flows into the air hole 6041 along with the air flow from the bottom of the air hole 6041, so that the outside air replenishes the air overflowing from the air hole 6041. It is worth noting that the thermal conductive sponge 502 and the wind limiting plate 503 limit the flow direction of the airflow in the shell 2, and the porous structure of the thermal conductive sponge 502 has the function of dustproof and dust absorption, so that the dust in the airflow will be blocked by the thermal conductive sponge 502, preventing the dust from entering the multiple metal pipes of the pipe network 604, thereby avoiding the dust from clogging the air hole 6041, effectively ensuring the airflow at the air hole 6041 of the multiple metal pipes, and there is continuous air flow in the air hole 6041 to discharge heat.The heat dissipation efficiency of the circuit board 3 is further improved, and the service life of the circuit board 3 is increased.

[0055] While the present disclosure has been described with respect to only a limited number of embodiments, those skilled in the art, having benefit of this disclosure, will appreciate that numerous other embodiments can be devised without departing from the scope of the invention. Accordingly, the scope of the present invention should be limited only by the claims appended hereto.

Claims

1. A smart bidirectional inverter, characterized by comprising have: Base (1); The housing (2) is fixedly mounted on the base (1), and the top of the housing (2) is concave-convex, which is used to accelerate the heat dissipation inside the housing (2); A circuit board (3), the circuit board (3) is mounted on the base (1) by means of bolts, and the circuit board (3) is located inside the housing (2); A suction fan (4) and an exhaust fan (401), the suction fan (4) and the exhaust fan (401) are respectively located on both sides of the base (1), the suction fan (4) is used to suck external airflow into the housing (2), and the exhaust fan (401) is used to guide the internal airflow of the housing (2) to be discharged, so that the suction fan (4) and the exhaust fan (401) form an airflow with a stable flow direction in the housing (2); An air cooling enhancement unit (5), the air cooling enhancement unit (5) is located at the top end of the housing (2) and is used to enhance the airflow formed by the suction fan (4) and the exhaust fan (401) in the housing (2), thereby improving the heat dissipation efficiency of the airflow on the circuit board (3); A water-cooling enhancement unit (6), the water-cooling enhancement unit (6) is located on the top of the base (1) and is used to further absorb heat generated by the circuit board (3), thereby improving the heat dissipation efficiency of the circuit board (3); The air cooling enhancement unit (5) includes: An air guide plate (501) is provided at the top end of the inner portion of the housing (2), and the bottom of the air guide plate (501) is an inclined surface, and the inclined surface faces the suction fan (4); The air cooling enhancement unit (5) further comprises: Oblique heat dissipation strips (5011), the oblique heat dissipation strips (5011) are linearly and evenly distributed at the bottom of the air guide plate (501), and are used to guide the flow direction of the airflow in the housing (2) during the flow process; The air cooling enhancement unit (5) further comprises: Thermally conductive sponge (502), the thermally conductive sponge (502) is arranged between the oblique heat dissipation strip (5011) and the circuit board (3), and the thermally conductive sponge (502) has a high thermal conductivity and is used to transfer heat from the circuit board (3); The thermally conductive sponge (502) has a porous structure, and a plurality of large vent holes (5021) and small vent holes (5022) are provided on the surface of the thermally conductive sponge (502), the small vent holes (5022) are distributed around the large vent holes (5021), and the small vent holes (5022) are connected to the large vent holes (5021) through the porous structure of the thermally conductive sponge (502); The water cooling enhancement unit (6) includes: A water pump (601), the water pump (601) is installed on the top of the base (1); A heat conducting pipe (602), the heat conducting pipe (602) is arranged on the top of the base (1), the heat conducting pipe (602) is located below the circuit board (3), the heat conducting pipe (602) is filled with coolant, and the heat conducting pipe (602) is connected to the water pump (601); The reflux heat dissipation pipe (603) is connected and installed on the water pump (601), so that the water pump (601), the heat conduction pipe (602) and the reflux heat dissipation pipe (603) form a coolant circulation loop.

2. The intelligent bidirectional inverter according to claim 1, wherein: The air cooling enhancement unit (5) further comprises: The wind limiting plates (503) are arranged in a rectangular distribution on both sides of the heat-conducting sponge (502), and the wind limiting plates (503) are fixedly connected to the shell (2).

3. The intelligent bidirectional inverter according to claim 2, wherein: The water cooling enhancement unit (6) further comprises: The pipe network (604) is arranged between the heat conducting pipe (602) and the circuit board (3), and is in contact with the heat conducting pipe (602) and the circuit board (3), and is used to transfer heat from the circuit board (3).

4. The intelligent bidirectional inverter according to claim 3, wherein: The pipe network (604) is composed of a plurality of metal pipes, each of which has an air flow hole (6041) at its axis for transferring heat from the circuit board (3).

5. The intelligent bidirectional inverter according to claim 4, characterized in that: The water cooling enhancement unit (6) further comprises: A porous capillary layer (605) is provided on the top surface of the heat conducting tube (602). The porous capillary layer (605) has a porous structure and is used to accelerate the heat absorption of the cooling liquid.

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