Wafer cutting machine and placing platform

Abstract

The invention provides a wafer cutting machine and a placing platform, the wafer cutting machine comprises a wafer placing table, one side of the wafer placing table is provided with a wafer cutting table, and the other side of the wafer placing table is provided with a wafer grabbing structure. The device is reasonable in design, the first placement table, the second placement table and the third placement table are connected with the wafer placement table, the wafer cutting table and the wafer grabbing structure respectively, and the first placement table, the second placement table and the third placement table are separated from one another; vibration generated in the operation process of the wafer placing table, the wafer cutting table and the wafer grabbing structure is transmitted to the interiors of the first placing table, the second placing table and the third placing table respectively, so that interference of the devices in the operation process is reduced, and the phenomenon that in the operation process of the wafer placing table, the wafer cutting table and the wafer grabbing structure, vibration of the wafer cutting table and the wafer grabbing structure is caused is avoided. And the vibrations influence each other.

Description

Technical Field

[0001] The present invention mainly relates to the field of wafer cutting machines, and in particular to a wafer cutting machine and a placement platform. Background Art

[0002] Wafer dicing is a critical step in the semiconductor manufacturing process. Its goal is to precisely separate a wafer, after completing front-end processes (such as photolithography, etching, and thin film deposition), into individual chips along pre-designed dicing paths. Dicing quality directly impacts chip yield, performance, and reliability.

[0003] During the operation of the specific embodiment, the inventors found the following defects: However, direct installation of ordinary industrial concrete floors fails to effectively isolate ambient vibrations (such as low-frequency vibrations) and lacks sufficient suppression of the equipment's own vibrations. The floor's flatness, levelness, and long-term stability often fall short of the requirements of precision equipment. Temperature fluctuations and the slow release of stress (creep) within the floor can cause deformation of the equipment foundation, impacting precision retention.

[0004] It should be noted that the above content belongs to the technical knowledge scope of the inventor. Since the technical content in this field is vast and too complicated, the above content of this application does not necessarily constitute prior art. Summary of the Invention

[0005] 1. Technical problem to be solved by the invention: The present invention provides a wafer cutting machine and a wafer placement platform to solve the technical problems existing in the above-mentioned background technology.

[0006] 2. Technical solution: To achieve the above-mentioned purpose, the technical solution provided by the present invention is: a wafer cutting machine, comprising a wafer placement table, a wafer cutting table is provided on one side of the wafer placement table, and a wafer grabbing structure is provided on the other side of the wafer placement table.

[0007] Furthermore, the wafer placement table includes a base plate, guide rails are provided on both sides of the inner wall of the base plate, a motor is provided in the middle of one side of the base plate, a screw rod is provided at the output end of the motor, the top of the base plate is slidably connected to the placement table, the placement table is slidably connected to the guide rails, and a matching hole is provided at the bottom of the placement table, which is connected to the screw rod.

[0008] Furthermore, the wafer grasping structure includes a support frame, and two sets of transmission structures are provided at the top and bottom of the inner side of the support frame. The outer wall of one transmission structure is provided with a feeding structure, and the bottom of the other transmission structure is provided with a receiving structure.

[0009] Furthermore, the wafer cutting table includes a shell, a three-axis movable structure is provided inside the shell, a cutter is provided at the bottom of the three-axis movable structure, and the cutter is provided directly above the wafer placement table.

[0010] A placement platform, characterized in that it includes a placement platform structure, which includes a cement base, a first placement platform is provided in the middle of the top of the cement base, a second placement platform is provided on one side of the first placement platform, and a third placement platform is provided on the other side of the first placement platform, the second placement platform and the third placement platform are arranged in a concave shape, and fixing bolts are provided on the tops of the first placement platform, the second placement platform and the third placement platform.

[0011] Furthermore, a buffer layer is provided on the top of the cement base, and an anti-slip layer is provided on the top of the buffer layer.

[0012] 3.Beneficial effects: Compared with the prior art, the technical solution provided by the present invention has the following beneficial effects: The present invention sets a first placement table, a second placement table and a third placement table, which are respectively connected to the wafer placement table, the wafer cutting table and the wafer grasping structure, and the first placement table, the second placement table and the third placement table are separated from each other, so that the vibrations generated by the wafer placement table, the wafer cutting table and the wafer grasping structure during operation are respectively transmitted to the inside of the first placement table, the second placement table and the third placement table, so that the above-mentioned device reduces interference during operation and avoids the mutual influence of vibrations among the wafer placement table, the wafer cutting table and the wafer grasping structure during operation. BRIEF DESCRIPTION OF THE DRAWINGS

[0013] Figure 1 It is a schematic diagram of the three-dimensional structure of the present invention; Figure 2 It is a schematic diagram of the three-dimensional structure of the wafer placement table of the present invention; Figure 3 This is a schematic diagram of the three-dimensional structure of the placement platform structure of the present invention; Figure 4 It is a schematic diagram of the three-dimensional unfolded structure of the placement platform structure of the present invention.

[0014] Reference numerals: 1. Placement platform structure; 101. Cement base; 102. Buffer layer; 103. Anti-slip layer; 104. First placement platform; 105. Second placement platform; 106. Third placement platform; 107. Fixing bolts; 2. Wafer placement platform; 3. Wafer cutting platform; 4. Wafer grabbing structure. DETAILED DESCRIPTION

[0015] To facilitate understanding of the present invention, the present invention will be described more comprehensively below with reference to the relevant drawings. Several embodiments of the present invention are shown in the drawings. However, the present invention can be implemented in many different forms and is not limited to the embodiments described herein. On the contrary, the purpose of providing these embodiments is to make the disclosure of the present invention more thorough and comprehensive.

[0016] In the description of the present invention, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "page", "bottom", "inside", "outside", "clockwise", "counterclockwise" and the like to indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operate in a specific orientation, and therefore should not be understood as limiting the present invention.

[0017] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of the technical features being referred to. Thus, a feature identified as "first" or "second" may explicitly or implicitly include one or more of the features. In the description of the present invention, "plurality" means two or more, unless otherwise specifically defined.

[0018] In the present invention, unless otherwise expressly specified or limited, the terms "mounted," "connected," "connected," "fixed," "provided with," "provided on," etc. should be understood in a broad sense. For example, they may refer to fixed connection, detachable connection, or integral connection; they may refer to mechanical connection or electrical connection; they may refer to direct connection or indirect connection through an intermediate medium; and they may refer to internal communication between two components. Those skilled in the art will be able to understand the specific meanings of the above terms in the present invention based on specific circumstances. Example

[0019] Refer to the attached Figure 1-4 A wafer cutting machine and placement platform includes a wafer placement table 2, a wafer cutting table 3 is provided on one side of the wafer placement table 2, and a wafer grabbing structure 4 is provided on the other side of the wafer placement table 2.

[0020] Furthermore, the wafer placement table 2 includes a base plate, guide rails are provided on both sides of the inner wall of the base plate, a motor is provided in the middle of one side of the base plate, a screw is provided at the output end of the motor, the top of the base plate is slidably connected to the placement table, the placement table is slidably connected to the guide rails, a matching hole is provided at the bottom of the placement table, the matching hole is connected to the screw, and the motor is started, the motor drives the screw to rotate, and the screw drives the placement table to move, so that the placement table moves between the wafer cutting table 3 and the wafer grasping structure 4; The guide rail adopts high-precision linear guide rail (such as roller guide rail), the guide rail surface is hardened, and it is equipped with a slider with adjustable preload force to ensure that the moving flatness is ≤3μm.

[0021] The servo motor drives a C5-grade ball screw (lead 1-5mm). The screw is connected to the matching hole at the bottom of the placement table through a flange-type screw nut, with a repeatability accuracy of ±1μm.

[0022] A counterweight or pneumatic balancing cylinder needs to be installed inside the base plate to offset the inertial vibration when the wafer moves.

[0023] Furthermore, the wafer grasping structure 4 includes a support frame, and two sets of transmission structures are provided at the top and bottom of the inner side of the support frame. The outer wall of one transmission structure is provided with a feeding structure, and the bottom of the other transmission structure is provided with a receiving structure. The interiors of the receiving structure and the feeding structure are both provided with screws, motors, and movable frames, but the top of the receiving structure is provided with a platform for placing the wafer, and the interior of the bracket inside the feeding structure is provided with an electric telescopic rod, and one end of the electric telescopic rod is provided with a suction cup and a cylinder for adsorbing the wafer, so as to facilitate the wafer to be picked up.

[0024] Transmission structure: Two sets of synchronous belts or precision ball screw modules, driving respectively: Feeding structure: The top conveyor belt carries the wafer box, and the end is equipped with a vacuum suction cup + edge gripper.

[0025] Receiving structure: bottom conveyor belt with chip tray and integrated static elimination device.

[0026] Actuator: The electric telescopic rod is a servo electric cylinder, the suction cup is connected to a vacuum generator (Venturi principle), and the pressure sensor monitors the adsorption force in real time (typical value: -60kPa).

[0027] Furthermore, the wafer cutting table 3 includes a shell, a three-axis movable structure is provided inside the shell, a cutter is provided at the bottom of the three-axis movable structure, and the cutter is provided just above the wafer placement table 2; Three-axis moving structure: X / Y axis: linear motor driven, resolution 0.1μm (suitable for high-speed cutting).

[0028] Z-axis: Piezoelectric ceramic actuator to achieve nanometer-level cutting depth control.

[0029] Cutter: Air static pressure electric spindle with spindle speed ≥40,000 RPM, diamond-coated blade (thickness 15-20μm).

[0030] A placement platform, characterized in that: it includes a placement platform structure 1, which includes a cement base 101, a first placement platform 104 is provided in the middle of the top of the cement base 101, a second placement platform 105 is provided on one side of the first placement platform 104, and a third placement platform 106 is provided on the other side of the first placement platform 104, the second placement platform 105 and the third placement platform 106 are configured to be concave, and fixing bolts 107 are provided on the tops of the first placement platform 104, the second placement platform 105 and the third placement platform 106, a buffer layer 102 is provided on the top of the cement base 101, and an anti-slip layer 103 is provided on the top of the buffer layer 102; Buffer layer 102: multi-layer composite vibration isolation material (such as natural rubber + metal mesh damping layer), with a natural frequency designed to be 2-5 Hz, isolating environmental vibration.

[0031] The grooves of the first placement platform 104 , the second placement platform 105 and the third placement platform 106 are filled with epoxy resin mortar to increase the mass damping ratio.

[0032] Anti-slip layer 103: Polyurethane coating (Shore hardness 80A), surface conductive treatment (resistance value 10 6 Ω).

[0033] Cutting vibration: The cutting spindle vibrates at high frequencies and is dissipated through the concave structure of the second placement table 105 .

[0034] Movement shock: The wafer placement table starts and stops quickly → the buffer layer of the first placement table 104 absorbs low-frequency inertial force.

[0035] Robot arm disturbance: grabbing structure motor start and stop → the third placement platform 106 independent foundation blocks the vibration transmission path.

[0036] Engineering verification: The measured vibration transmissibility (TR) can be reduced to below 0.2 (traditional platform TR>0.8), and the cutting edge chipping rate is reduced by 40%.

[0037] 1. Amplitude decay rate (peak value comparison)

[0038] 2. Vibration Transmissibility (TR) Comparison

[0039] 3. Collaborative vibration coupling of multiple devices

[0040] The above-mentioned embodiments only express a certain implementation method of the present invention, and the description thereof is relatively specific and detailed, but it cannot be understood as limiting the patent scope of the present invention. It should be pointed out that for ordinary technicians in this field, several variations and improvements can be made without departing from the concept of the present invention, which all fall within the scope of protection of the present invention. Therefore, the scope of protection of the patent of the present invention shall be based on the attached claims.

Claims

1. A wafer cutting machine, characterized in that: include: A wafer placement platform (2) is provided with a wafer cutting platform (3) on one side of the wafer placement platform (2), and a wafer grabbing structure (4) is provided on the other side of the wafer placement platform (2).

2. The wafer cutting machine according to claim 1, wherein: The wafer placement table (2) comprises a base plate, guide rails are provided on both sides of the inner wall of the base plate, a motor is provided in the middle of one side of the base plate, a lead screw is provided at the output end of the motor, the top of the base plate is slidably connected to the placement table, the placement table is slidably connected to the guide rails, and a matching hole is provided at the bottom of the placement table, and the matching hole is connected to the lead screw.

3. The wafer cutting machine according to claim 1, wherein: The wafer grabbing structure (4) comprises a support frame, wherein two sets of transmission structures are provided at the top and bottom of the inner side of the support frame, a feeding structure is provided on the outer wall of one transmission structure, and a receiving structure is provided at the bottom of the other transmission structure.

4. The wafer cutting machine according to claim 1, wherein: The wafer cutting table (3) comprises a shell, a three-axis movable structure is provided inside the shell, a cutter is provided at the bottom of the three-axis movable structure, and the cutter is provided directly above the wafer placement table (2).

5. A placement platform, characterized in that: include: A placement platform structure (1) comprises a cement base (101), wherein a first placement platform (104) is provided in the middle of the top of the cement base (101), a second placement platform (105) is provided on one side of the first placement platform (104), and a third placement platform (106) is provided on the other side of the first placement platform (104), wherein the second placement platform (105) and the third placement platform (106) are arranged in a concave shape, and fixing bolts (107) are provided on the tops of the first placement platform (104), the second placement platform (105) and the third placement platform (106).

6. The placement platform according to claim 1, characterized in that: A buffer layer (102) is provided on the top of the cement base (101), and an anti-slip layer (103) is provided on the top of the buffer layer (102).

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