Preparation method of material for heat dissipation module of notebook computer

Abstract

The invention relates to the technical field of heat dissipation materials, in particular to a preparation method of a material for a heat dissipation module of a notebook computer, which comprises the following steps: step 1, preparing a basic composite material, including nano copper powder, nano diamond powder, boron alkene and graphite powder, and preparing the basic composite material into a nano material base layer; 2, treating an intermediate bonding layer, combining the intermediate bonding layer with the base layer through hot pressing sintering, and improving the interlayer bonding strength by utilizing the interface enhancement effect of a hyperbranched polymer; and step 3, carrying out metal coating on the surface of the middle bonding layer. Through the synergistic effect of the nano copper powder, the nano diamond powder, the boron alkene and the graphite powder, a base layer, a middle layer and a metal coating are overlapped in sequence through a composite material melt prepared from a premixed material, methacryloyloxysilane and a hyperbranched polymer, seamless combination of multiple layers of materials is achieved through a vacuum hot-pressing process, and the composite material has the advantages of being simple in structure, low in cost and high in practicability. Therefore, the prepared material has the advantages of good heat-conducting property and corrosion resistance and the like.

Description

Technical Field

[0001] The present invention relates to the technical field of heat dissipation materials, in particular to a method for preparing a material for a notebook computer heat dissipation module. Background Art

[0002] Laptop computers, as small, portable personal computers, are a prime example of this type of highly integrated system. Despite their compact size and light weight, laptops require high overall performance and functionality, contain numerous components, and operate at high frequencies. As the performance of laptop CPUs continues to improve, their power consumption has significantly increased, and with it, the power consumption of all system components. This has led to a significant increase in heat dissipation requirements, making system heat dissipation design more complex and challenging.

[0003] The heat dissipation module is an essential unit for dissipating heat in laptop computers. During the heat dissipation process, this module requires high-quality materials to transfer heat from the components to the heat pipes, which are then dissipated through air convection between the heat dissipation fins and the centrifugal fan. Therefore, the materials used for the heat dissipation fins and the heat absorption block become a key issue in heat dissipation module design. Traditional laptop heat dissipation modules are usually made of aluminum or copper. However, these two materials have relatively poor thermal conductivity and corrosion resistance, and are relatively heavy. Therefore, a method for preparing a material with excellent thermal conductivity and corrosion resistance for laptop heat dissipation modules is needed. Summary of the Invention

[0004] (1) Technical problems solved

[0005] In view of the shortcomings of the existing technology, the present invention provides a method for preparing a material for a notebook computer heat dissipation module, which has the advantages of good thermal conductivity and corrosion resistance, and solves the above-mentioned problems.

[0006] (2) Technical solution

[0007] To achieve the above object, the present invention provides the following technical solutions:

[0008] A method for preparing a material for a notebook computer heat dissipation module comprises the following steps:

[0009] Step 1: Preparation of basic composite materials, including nano-copper powder, nano-diamond powder, boron nitride and graphite powder, which are made into nano-material base;

[0010] Step 2: Treatment of the intermediate bonding layer, which is bonded to the base layer through hot pressing and sintering, and the interfacial reinforcement effect of the hyperbranched polymer is used to improve the interlayer bonding strength;

[0011] Step 3: Metal plating is performed on the surface of the intermediate bonding layer, and a metal plating layer such as copper or aluminum is coated on the surface of the intermediate layer;

[0012] Step 4: The base layer, the middle layer and the metal coating are stacked in sequence, and a vacuum hot pressing process (temperature 400-500°C, pressure 15-20MPa) is used to achieve seamless bonding of the multi-layer materials.

[0013] Step 5: Use ultrasonic testing to detect the density of the interlayer bonding to ensure that there are no pores or cracks. The formed material is heat treated under the protection of an inert gas (such as nitrogen) at a temperature of 120-150°C for 2-4 hours to improve the cross-linking density and thermal conductivity.

[0014] Preferably, the formula in step 1: nano copper powder (10-20 parts), nano diamond powder (15-20 parts), boron nitride (2-5 parts) and graphite powder (30-40 parts) are mixed in proportion and pre-dispersed using a high-speed stirring device to ensure uniform distribution of the components.

[0015] Preferably, the nanomaterial base layer in step 1 is prepared by hot pressing sintering technology, with the temperature controlled at 600-800° C. and the pressure at 20-30 MPa to densify the material and form a uniformly distributed heat-conducting network.

[0016] Preferably, the intermediate bonding layer in step 2 is prepared by adding the premixed material, methacryloxysilane, hyperbranched polymer, etc. into a twin-screw extruder, melt-blending at 180-220° C. to form a uniform composite melt, and then sintering the melt by hot pressing.

[0017] Preferably, in step three, a metal coating such as copper or aluminum is coated on the surface of the intermediate layer with a thickness of 0.1-0.3 mm to enhance corrosion resistance and thermal conductivity, and the graphene-coated nano-aluminum powder is surface oxidized and passivated to prevent agglomeration during high-temperature sintering.

[0018] (3) Beneficial effects

[0019] Compared with the prior art, the present invention provides a method for preparing a material for a notebook computer heat dissipation module, which has the following beneficial effects:

[0020] 1. The present invention uses the synergistic effect of nano-copper powder, nano-diamond powder, boron nitride and graphite powder to make a nano-material base layer, and then forms an intermediate bonding layer by hot pressing and sintering a composite material melt made of premixed materials, methacryloxysilane and hyperbranched polymer. The surface of the intermediate bonding layer is coated with a metal plating layer such as copper and aluminum. The base layer, the intermediate layer and the metal plating layer are stacked in sequence, and a vacuum hot pressing process is used to achieve seamless bonding of the multi-layer materials. As a result, the prepared material has the advantages of good thermal conductivity and corrosion resistance, breaking through the thermal conductivity limit of traditional metal materials.

[0021] 2. The present invention uses ultrasonic testing to detect the interlayer bonding density to ensure that there are no pores or cracks. The formed material is heat treated under the protection of an inert gas (such as nitrogen) at a temperature of 120-150°C for 2-4 hours to improve the cross-linking density and thermal conductivity. DETAILED DESCRIPTION

[0022] The following will be combined with the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the embodiments described are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of the present invention.

[0023] The present invention relates to a method for preparing a material for a notebook computer heat dissipation module, comprising the following steps:

[0024] Step 1: Preparation of basic composite materials, including nano-copper powder, nano-diamond powder, boron nitride and graphite powder, which are made into nano-material base;

[0025] The formula in step 1: nano copper powder (10-20 parts), nano diamond powder (15-20 parts), boron nitride (2-5 parts) and graphite powder (30-40 parts) are mixed in proportion and pre-dispersed using a high-speed stirring device to ensure uniform distribution of the components. The nano material base layer is prepared using hot pressing sintering technology, with a controlled temperature of 600-800°C and a pressure of 20-30 MPa to densify the material and form a uniformly distributed thermal conductive network.

[0026] Step 2: Treatment of the intermediate bonding layer, which is bonded to the base layer through hot pressing and sintering, and the interfacial reinforcement effect of the hyperbranched polymer is used to improve the interlayer bonding strength;

[0027] The intermediate bonding layer is prepared by adding premixed materials, methacryloxysilane, hyperbranched polymers, etc. into a twin-screw extruder, melt-blending at 180-220°C to form a uniform composite melt, and then sintering it through hot pressing. The hyperbranched polymer interface solves the problem of different thermal expansion coefficients between multi-layer materials and improves structural stability.

[0028] Step 3: Metal-plating the surface of the intermediate bonding layer, and coating the surface of the intermediate layer with a metal coating such as copper or aluminum. By coating the surface of the intermediate layer with a metal coating such as copper or aluminum, the thickness is controlled at 0.1-0.3 mm to enhance corrosion resistance and thermal conductivity. The graphene-coated nano-aluminum powder is surface-oxidized and passivated to prevent agglomeration during high-temperature sintering. The protective performance of the coating is evaluated through a salt spray test (48 hours), requiring no surface oxidation or peeling.

[0029] Step 4: The base layer, the middle layer and the metal coating are stacked in sequence, and a vacuum hot pressing process (temperature 400-500°C, pressure 15-20MPa) is used to achieve seamless bonding of the multi-layer materials.

[0030] Step 5: Use ultrasonic testing to detect the density of the interlayer bonding to ensure that there are no pores or cracks. The formed material is heat treated under the protection of an inert gas (such as nitrogen) at a temperature of 120-150°C for 2-4 hours to improve the cross-linking density and thermal conductivity.

[0031] The beneficial effects of the present invention are as follows: the present invention uses the synergistic effect of nano copper powder, nano diamond powder, boron olefin and graphite powder to prepare a nano material base layer, and then prepares an intermediate bonding layer by hot pressing and sintering a composite material melt prepared by premixing the material with methacryloxysilane and hyperbranched polymer. The surface of the intermediate bonding layer is coated with a metal plating layer such as copper and aluminum. The base layer, the intermediate layer and the metal plating layer are sequentially stacked, and a vacuum hot pressing process is used to achieve seamless bonding of the multi-layer materials, so that the prepared material has the advantages of good thermal conductivity and corrosion resistance, etc., breaking through the thermal conductivity limit of traditional metal materials.

[0032] While embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions, and variations may be made to these embodiments without departing from the principles and spirit of the invention, and that the scope of the invention is defined by the appended claims and their equivalents.

Claims

1. A method for preparing a material for a notebook computer heat dissipation module, characterized in that: The following steps are involved: Step 1: Preparation of basic composite materials, including nano-copper powder, nano-diamond powder, boron nitride and graphite powder, which are made into nano-material base; Step 2: Treatment of the intermediate bonding layer, which is bonded to the base layer through hot pressing and sintering, and the interfacial reinforcement effect of the hyperbranched polymer is used to improve the interlayer bonding strength; Step 3: Metal plating is performed on the surface of the intermediate bonding layer, and a metal plating layer such as copper or aluminum is coated on the surface of the intermediate layer; Step 4: Stack the base layer, middle layer and metal plating layer in sequence, and achieve seamless combination of multiple layers of materials through vacuum hot pressing process; Step 5: Use ultrasonic testing to detect the density of the interlayer bonding to ensure that there are no pores or cracks. The formed material is heat treated under inert gas protection.

2. The method for preparing a material for a notebook computer heat dissipation module according to claim 1, wherein: The formula in step 1: nano copper powder (10-20 parts), nano diamond powder (15-20 parts), boron nitride (2-5 parts) and graphite powder (30-40 parts) are mixed in proportion and pre-dispersed using a high-speed stirring device to ensure uniform distribution of the components.

3. The method for preparing a material for a notebook computer heat dissipation module according to claim 1, wherein: The preparation of the nanomaterial base layer in step 1 adopts hot pressing sintering technology, controlling the temperature at 600-800° C. and the pressure at 20-30 MPa to densify the material and form a uniformly distributed heat conduction network.

4. The method for preparing a material for a notebook computer heat dissipation module according to claim 1, wherein: The intermediate bonding layer in step 2 is prepared by adding the premixed material, methacryloxysilane, hyperbranched polymer, etc. into a twin-screw extruder, melting and blending at 180-220° C. to form a uniform composite melt, and then sintering the melt by hot pressing.

5. The method for preparing a material for a notebook computer heat dissipation module according to claim 1, wherein: In the step three, a metal coating such as copper or aluminum is coated on the surface of the intermediate layer with a thickness of 0.1-0.3 mm to enhance corrosion resistance and thermal conductivity, and the surface of the graphene-coated nano-aluminum powder is oxidized and passivated to prevent agglomeration during high-temperature sintering.