Array type chip heat dissipation device based on ultrasonic capillary effect

Abstract

The invention discloses an array type chip heat dissipation device based on an ultrasonic capillary effect. Comprising a base, a copper sheet, a piezoelectric sheet, a concave lens, an input and output glass tube, a chip, a cavity and the like. In the operation process of the device, low-temperature cooling liquid flows into the cavity to be in contact with a heating chip; under the focusing action of the concave lens, the ultrasonic capillary effect of the piezoelectric plate is obviously enhanced, and cooling liquid is promoted to quickly flow in the cavity and fully exchange heat with the chip; the high-temperature cooling liquid absorbing heat flows out through the output glass tube, enters an external circulating system to be cooled and then flows back; uniform heat dissipation of the chip is realized through unique array type flow channels and ultrasonic focusing synergistic design; meanwhile, the device has a self-adaptive heat dissipation adjusting function, and electric signal parameters of the piezoelectric patch are dynamically adjusted in real time according to the temperature of the chip; according to the array type chip layout, uniform heat dissipation of the chips is ensured, the heat dissipation efficiency is remarkably improved, the temperature of the chips is reduced, and the stability is enhanced.

Description

Technical Field

[0001] The invention relates to an array chip heat dissipation device based on ultrasonic capillary effect. Background Art

[0002] Currently, chips, as core components of various electronic devices, face an increasingly urgent need for performance improvements and expanded functionality. As semiconductor manufacturing processes continue to shrink, array chips, with their powerful parallel processing capabilities and high integration, are finding widespread application in cutting-edge fields such as artificial intelligence, big data processing, and high-performance computing. However, this improvement in chip performance comes at the cost of a sharp increase in power consumption, which in turn exponentially increases the amount of heat generated by chips during operation. Heat dissipation has become a key bottleneck restricting further chip development.

[0003] Among traditional chip cooling technologies, air cooling is a common method. It uses fans and other devices to force air convection to remove heat. However, for high-power density array chips, air cooling's cooling efficiency is extremely limited, making it difficult to meet the chips' growing cooling needs. Liquid cooling technology is an improvement over air cooling, using coolant to exchange heat with the chip to achieve heat dissipation. However, existing liquid cooling devices have many shortcomings. On the one hand, the coolant's flow in the flow channel is poor, and the heat exchange efficiency with the chip is low, resulting in unsatisfactory cooling effects. On the other hand, traditional liquid cooling devices have difficulty achieving uniform heat dissipation for array chip layouts. Some chips may overheat due to uneven heat dissipation, affecting the normal operation of the entire chip system.

[0004] The introduction of ultrasonic technology into the field of heat dissipation has brought new insights, but the ultrasonic capillary effect is currently underutilized. Ultrasonic vibration waves are not optimally matched with coolant flow paths and chip layout, resulting in significant ultrasonic energy loss during transmission. This makes it difficult to effectively enhance microscopic flow in the coolant, resulting in limited improvements in heat dissipation efficiency. Furthermore, existing ultrasonic-assisted heat dissipation devices lack intelligent control, making it impossible to adjust ultrasonic parameters and heat dissipation strategies in real time based on chip temperature. Summary of the Invention

[0005] Purpose of the invention: The purpose of the present invention is to provide an array chip heat dissipation device based on ultrasonic capillary effect that can dissipate heat from chips.

[0006] The technical solution of the present invention is: an array chip heat dissipation device based on ultrasonic capillary effect described in the present invention includes a cavity, and an ultrasonic heat dissipation system is installed in the cavity.

[0007] Furthermore, the ultrasonic heat dissipation system includes an input glass tube, a chip, and an output glass tube; the output glass tube, the chip, and the input glass tube form a cooling liquid circulation channel.

[0008] Furthermore, one end of the input glass tube and the output glass tube are respectively connected to the cavity.

[0009] Furthermore, it also includes a piezoelectric piece installed at the bottom of the cavity and a base for supporting the entire ultrasonic heat dissipation structure.

[0010] Furthermore, a copper sheet is installed between the piezoelectric sheet and the base.

[0011] Furthermore, a concave lens for focusing ultrasonic vibration waves is installed in the cavity.

[0012] Furthermore, after receiving the electrical signal, the piezoelectric sheet generates ultrasonic vibration based on the piezoelectric effect; a power supply device for providing electrical signal excitation is also connected to the other side of the piezoelectric sheet.

[0013] Furthermore, the output glass tube and the input glass tube are made of high borosilicate glass.

[0014] Furthermore, the output glass tube and the input glass tube are designed with multi-dimensional optimization in view of the array chip layout.

[0015] Furthermore, the chip is the heat dissipation target of the heat dissipation device, and transfers its own heat through heat exchange with the cooling liquid in the cavity.

[0016] Beneficial effects: Compared with the existing technology, the present invention has the following significant features: the present invention sets a piezoelectric plate at the bottom of the cavity, which generates ultrasonic vibration when stimulated by an electrical signal, and uses a concave lens to focus and guide the ultrasonic vibration wave to enhance the ultrasonic capillary effect; with optimized input and output glass tubes, multi-dimensional flow channels are designed for the array chip layout, so that low-temperature coolant can flow in quickly and evenly, and high-temperature coolant can be efficiently discharged; at the same time, the device has an adaptive heat dissipation adjustment function, which dynamically adjusts the piezoelectric plate electrical signal parameters in real time according to the chip temperature; it solves the heat dissipation problem of array chips in all aspects, greatly improves the heat dissipation efficiency, ensures stable operation of the chip, reduces heat dissipation costs, and promotes the upgrading of chip heat dissipation technology. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] Figure 1 It is a schematic diagram of the structure of the device of the present invention;

[0018] In the figure: 1 is the base, 2 is the copper sheet, 3 is the piezoelectric sheet, 4 is the concave lens, 5 is the output glass tube, 6 is the chip, 7 is the input glass tube, and 8 is the cavity. DETAILED DESCRIPTION

[0019] The specific technical solutions of the present invention are further described in detail below with reference to specific examples.

[0020] As shown in the figure, the array-type chip heat dissipation device based on ultrasonic capillary effect described in the present invention is completed in an ultrasonic heat dissipation system and is used for precise temperature control auxiliary research in chip R&D laboratories, stable operation of smart home device integration, and improved battery and electronic control system performance in new energy vehicle production. The ultrasonic capillary array-type chip heat dissipation device includes a base 1, a copper sheet 2, a piezoelectric sheet 3, a concave lens 4, an input glass tube 7, an output glass tube 5, a chip 6, and a cavity 8.

[0021] An ultrasonic heat dissipation system is also installed in the cavity 8. The ultrasonic heat dissipation system includes a piezoelectric sheet 3 installed at the bottom of the cavity 8. A copper sheet 2 is glued and fixed to the surface of the piezoelectric sheet 3 facing the coolant.

[0022] A base 1 is connected below the copper sheet 2 to support the entire ultrasonic heat dissipation structure;

[0023] A concave lens 4 is installed in the cavity 8 near the surface of the coolant to focus the ultrasonic vibration wave;

[0024] A power supply device for providing electrical signal excitation is also connected to the other side of the piezoelectric piece 3;

[0025] The input glass tube 7 and the output glass tube 5 are respectively connected to the cavity 8 for the inflow and outflow of the cooling liquid. The chip 6 is installed at a suitable position close to one side of the output glass tube 5 to construct a cooling liquid circulation channel for efficient heat exchange with the cooling liquid.

[0026] A base 1 is connected below the copper sheet 2 to perform fixing and bearing functions, thereby ensuring the stability of the overall structure of the device and providing a reliable physical platform for the subsequent realization of the heat dissipation function.

[0027] The copper sheet 2 utilizes its good electrical conductivity and thermal conductivity to, on the one hand, tightly adhere the two piezoelectric sheets 3 together, ensuring that the piezoelectric sheets can collaboratively generate ultrasonic vibrations during operation and effectively stimulate the ultrasonic capillary effect; on the other hand, it assists in conducting heat during the heat dissipation process and accelerates the heat transfer efficiency; at the same time, the heat conducted by the copper sheet can further promote thermal convection of the coolant, and cooperate with the ultrasonic capillary effect caused by the piezoelectric sheet to comprehensively improve the heat dissipation efficiency and ensure that the chip operates stably at an appropriate temperature.

[0028] After receiving the electrical signal, the piezoelectric plate 3 generates ultrasonic vibration based on the piezoelectric effect. This ultrasonic vibration acts on the coolant, triggering an ultrasonic capillary effect, which intensifies the microscopic flow of the coolant and fundamentally changes the microscopic flow state. The originally relatively smooth liquid flow is transformed into an active state full of tiny eddies and disturbances, greatly enhancing the coolant's ability to absorb and transfer chip heat, thereby efficiently achieving chip heat dissipation.

[0029] Concave lens 4 focuses and guides the ultrasonic vibration waves generated by the piezoelectric plate. From a focusing perspective, concave lens 4 can converge the originally divergent ultrasonic vibration waves into a specific area of the coolant, highly concentrating the ultrasonic energy in that area. Concave lens 4 also cleverly alters the propagation path of the ultrasonic vibration waves, guiding them in the direction that is most conducive to stimulating the ultrasonic capillary effect. By altering the propagation path and energy distribution of the ultrasonic vibration waves, the ultrasonic energy is more concentrated on the coolant, further strengthening the ultrasonic capillary effect, improving heat dissipation efficiency, and reducing ineffective ultrasonic energy loss.

[0030] The output glass tube 5 and the input glass tube 7 are made of high borosilicate glass, which has good chemical stability and thermal stability, can effectively resist the corrosion of the coolant, and maintain structural stability in a high temperature environment.

[0031] The chip 6 is the heat dissipation target of the heat dissipation device and generates a large amount of heat during operation. The chip 6 transfers its own heat through heat exchange with the coolant in the cavity, maintaining the chip in a suitable operating temperature range to ensure the performance and stability of the chip.

[0032] The ultrasonic heat dissipation system has an adaptive heat dissipation adjustment function, which dynamically adjusts the piezoelectric plate electrical signal parameters in real time according to the chip temperature to change the heat dissipation power.

[0033] The output glass tube 5 and the input glass tube 7 are designed with multi-dimensional optimization for the array chip layout. Driven by the pressure generated by the circulation pump, the low-temperature coolant flows into the cavity 8 from the three input glass tubes 7 respectively.

[0034] This multi-tube input design greatly increases the coolant inflow rate and coverage, allowing the coolant to quickly and evenly fill the cavity, providing a sufficient and stable cooling source for chip heat dissipation;

[0035] When the cooling liquid in the cavity absorbs a large amount of heat emitted by the chip and its temperature rises, the output glass tube 5 takes advantage of its own channel, relies on the thermal siphon effect and the pressure difference generated by the circulation system, and quickly and efficiently guides the high-temperature cooling liquid out of the heat dissipation device;

[0036] The present invention uses a base made of high-strength aluminum alloy, which has good mechanical strength and certain thermal conductivity, and can firmly support the entire heat dissipation device; a copper sheet 2 with a thickness of 0.5 mm is tightly adhered to the base 1 through thermal conductive adhesive to ensure that the thermal resistance between the two is extremely small, which is conducive to heat conduction;

[0037] Place two PZT-5H piezoelectric sheets 3 back to back and tightly connect them with a copper sheet 2. This connection enhances the vibration of the piezoelectric sheet 3, causing it to produce stronger ultrasonic vibrations when receiving an electrical signal. The assembled piezoelectric sheet 3 and copper sheet 2 structure is then fixed to the base 1 to ensure its stability.

[0038] A concave lens 4 is mounted in the cavity 8 5 mm below the coolant level using a high-temperature, corrosion-resistant bracket. The focal length of the concave lens 4 is precisely calculated and selected to ensure efficient focusing and guidance of the ultrasonic vibration waves generated by the piezoelectric element 3.

[0039] Multiple input glass tubes 7 and one output glass tube 5 are made of high borosilicate glass with an inner diameter of 3 mm. The input glass tubes 7 are evenly distributed on one side of the cavity 8, and the output glass tube 5 is installed on the other side near the chip 6. The chip 6 is fixed in a specific position near the output glass tube 5 in the cavity 8 to ensure sufficient heat exchange between the chip 6 and the coolant.

[0040] A power supply device with adjustable electrical signal parameters is connected to the piezoelectric piece 3 so that the working state of the piezoelectric piece 3 can be adjusted in real time according to the temperature of the chip 6; the input glass tube 7 and the output glass tube 5 are connected to an external coolant circulation system, which includes a coolant storage tank, a circulation pump and a cooler.

[0041] The present invention is an array chip heat dissipation device based on ultrasonic capillaries, and its implementation includes the following:

[0042] Initial state: Before the server is started, the heat sink is filled with low-temperature coolant at a temperature of 25°C. At this time, the power supply does not output an electrical signal to the piezoelectric piece 3, and the coolant is in a relatively static state.

[0043] Operation phase: After the server is started, chip 6 starts working and heats up rapidly. When the temperature of chip 6 reaches 50°C, the temperature sensor transmits a signal to the power supply device, which starts to output an electrical signal with a frequency of 20kHz and a voltage of 50V to the piezoelectric plate 3. The piezoelectric plate 3 generates ultrasonic vibrations, and under the focusing action of the concave lens 4, the ultrasonic capillary effect is stimulated, and the coolant flows rapidly in the cavity 8.

[0044] The low-temperature coolant flows from the input glass tube 7 into the cavity 8, fully contacting with the heat-generating chip 6 for heat exchange; after absorbing heat, the temperature of the high-temperature coolant rises to 40°C, flows out through the output glass tube 5, and enters the external circulation system; in the circulation system, the high-temperature coolant is cooled to 25°C by the cooler and then flows into the heat dissipation device again, completing a cycle.

[0045] Adjustment stage: As the server operating load increases, the temperature of chip 6 rises to 70°C; after the temperature sensor detects the temperature change, the power supply device increases the electrical signal frequency of the piezoelectric plate 3 to 30kHz and the voltage to 70V, enhancing the ultrasonic vibration intensity and further improving the heat dissipation power; at this time, the coolant flow rate is accelerated, the heat exchange efficiency with chip 6 is improved, and the temperature of chip 6 gradually decreases and stabilizes at around 60°C.

[0046] After long-term operation tests, the heat dissipation device can effectively control the temperature of chip 6 within an appropriate range. Compared with traditional heat dissipation devices, the average temperature of chip 6 is reduced by 15°C, and the temperature difference between each chip 6 is controlled within 5°C, achieving efficient and uniform heat dissipation, and significantly improving the performance and stability of the server.

Claims

1. An array chip heat dissipation device based on ultrasonic capillary effect, characterized in that: It comprises a cavity (8) in which an ultrasonic heat dissipation system is arranged.

2. The array chip heat dissipation device based on ultrasonic capillary effect according to claim 1, characterized in that: The ultrasonic heat dissipation system comprises an input glass tube (7), a chip (6) and an output glass tube (5); the output glass tube (5), the chip (6) and the input glass tube (7) form a cooling liquid circulation channel.

3. The array chip heat dissipation device based on ultrasonic capillary effect according to claim 1, characterized in that: One end of the input glass tube (7) and the output glass tube (5) are respectively connected to the cavity (8).

4. The array chip heat dissipation device based on ultrasonic capillary effect according to claim 1, characterized in that: It also includes a piezoelectric sheet (3) installed at the bottom of the cavity (8) and a base (1) for supporting the entire ultrasonic heat dissipation structure.

5. The array chip heat dissipation device based on ultrasonic capillary effect according to claim 4, characterized in that: A copper sheet (2) is installed between the piezoelectric sheet (3) and the base (1).

6. The array chip heat dissipation device based on ultrasonic capillary effect according to claim 1, characterized in that: A concave lens (4) for focusing ultrasonic vibration waves is also installed in the cavity (8).

7. The array chip heat dissipation device based on ultrasonic capillary effect according to claim 4, characterized in that: The piezoelectric sheet (3) generates ultrasonic vibration based on the piezoelectric effect after receiving the electrical signal; a power supply device for providing electrical signal excitation is also connected to the other side of the piezoelectric sheet.

8. The array chip heat dissipation device based on ultrasonic capillary effect according to claim 2, characterized in that: The output glass tube (5) and the input glass tube (7) are made of high borosilicate glass.

9. The array chip heat dissipation device based on ultrasonic capillary effect according to claim 6, characterized in that: The output glass tube (5) and the input glass tube (7) are designed with multi-dimensional optimization in view of the array chip layout.

10. The array chip heat dissipation device based on ultrasonic capillary effect according to claim 2, characterized in that: The chip (6) is the heat dissipation object of the heat dissipation device, and transfers its own heat through heat exchange with the cooling liquid in the cavity (8).

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