Waveguide packaging system of millimeter wave radio frequency chip

Abstract

The invention is suitable for the technical field of chip packaging, and provides a waveguide packaging system of a millimeter wave radio frequency chip, which comprises an n-shaped frame arranged on a base, an X / Y-axis moving assembly arranged on the n-shaped frame, a glue injection tank arranged on the X / Y-axis moving assembly, a dispensing glue head detachably arranged at the bottom of the glue injection tank, a transmission shaft arranged in the glue injection tank, and a transmission shaft arranged on the transmission shaft. The lower end of the transmission shaft extends into the dispensing head, the outer surface of the lower end of the transmission shaft is sleeved with an auger blade, the lower side of the auger blade extends into the dispensing head, the outer surface of the auger blade is attached to the inner wall of the dispensing head, a transmission assembly for controlling the transmission shaft to rotate is arranged at the top of the glue injection tank, and a backflow prevention assembly is arranged on the transmission shaft. By arranging the auger blade, the bottom of the auger blade can cut off the residual glue, close to the glue outlet, of the dispensing glue head when the auger blade rotates reversely, and the problem that the glue on the base plate is wiredrawn due to rapid shrinkage of the glue injection tank is avoided as much as possible.

Description

Technical Field

[0001] The present invention relates to the technical field of chip packaging, and more particularly, to a waveguide packaging system for a millimeter-wave radio frequency chip. Background Art

[0002] Millimeter-wave RF chips refer to integrated circuits used to process millimeter-wave frequency band signals. Millimeter-wave RF chips have the advantages of high integration, greater bandwidth, small size, and low power consumption. They have huge application potential in communication systems, radar systems, and the Internet of Things. Existing RF chips require a dispensing machine when packaging.

[0003] The glue dispensing machine is mainly used to stick the chips sliced ​​from the wafer to the substrate. It squeezes the heated glue onto the substrate on the operating table, and then places the chip on the glue-stained substrate area for bonding, so as to prepare for the next welding process. However, since the glue dispensing machine heats and squeezes out the glue, there will be excess glue at the glue outlet after the glue is extruded, and the glue head will reset quickly, which will easily pull the glue on the substrate upwards, and the glue thread will easily dry out, so that glue threads will stand upright above the substrate, causing inconvenience to the sticking of the chip. Summary of the Invention

[0004] In view of the shortcomings of the existing technology, the purpose of the present invention is to provide a waveguide packaging system for millimeter wave radio frequency chips that avoids the glue stringing on the substrate caused by the rapid shrinkage of the glue injection tank.

[0005] To achieve the above object, the present invention provides the following technical solutions: A waveguide packaging system for a millimeter-wave radio frequency chip comprises an n-type frame provided on a base, an X / Y-axis moving component provided on the n-type frame, a glue injection tank provided on the X / Y-axis moving component, a glue dispensing head detachably provided on the bottom of the glue injection tank, a transmission shaft provided in the glue injection tank, the lower end of the transmission shaft extending into the glue dispensing head, an auger blade provided on the outer surface of the lower end of the transmission shaft, the lower side of the auger blade extending into the glue dispensing head, the outer surface of the auger blade being in contact with the inner wall of the glue dispensing head, a transmission component for controlling the rotation of the transmission shaft provided on the top of the glue injection tank, an anti-backflow component provided on the transmission shaft, a shielding component provided at the bottom of the glue dispensing head, and a vibration auxiliary component provided on the outer surface of the glue dispensing head.

[0006] The present invention is further configured as follows: a connecting pipe communicating with the interior of the glue injection tank is provided on the top, a placement platform located directly below the glue dispensing head is provided on the base, and the glue injection tank and the glue dispensing head can be arranged at an inclination of 30-60 degrees.

[0007] The present invention is further configured as follows: the anti-backflow component includes a leak-proof plate, which is arranged on one side of the transmission shaft close to the top of the glue dispensing head. A contraction groove is provided on the outer surface of the transmission shaft. The outer surface of the leak-proof plate is fitted with the inner wall of the contraction groove. A mounting shaft is provided between the upper and lower inner walls of the contraction groove. One side of the leak-proof plate extends into the contraction groove and is rotatably sleeved on the outer surface of the mounting shaft. The leak-proof plate rotates outward with the mounting shaft as the rotation point. The side of the leak-proof plate away from the mounting shaft can contact the inner wall of the glue dispensing head, and its upper and lower sides are both fitted with the auger blades.

[0008] The present invention is further configured as follows: a centrifugal slide groove is opened in the transmission shaft, a centrifugal slider is slidably connected in the centrifugal slide groove, a reset rod is provided on the side of the centrifugal slider facing the leakage prevention plate, the other end of the reset rod slides into the contraction groove, a connecting push rod is provided on the inner side of the leakage prevention plate, a connecting push rod is provided on the outer surface of the connecting push rod, a connecting sleeve is provided on the sliding sleeve, one end of the reset rod located in the contraction groove is hinged to the connecting sleeve, and a first tension spring movably sleeved on the outer surface of the reset rod is provided between the centrifugal slider and the inner wall of the centrifugal slide groove.

[0009] The present invention is further configured as follows: the transmission assembly includes a top shell, which is arranged on the top wall of the glue injection tank, and a first rotating shaft is arranged in the top shell. The first rotating shaft rotates and passes through the outer surface of the top shell at one end close to the connecting tube, and the other end of the first rotating shaft is rotatably connected to the inner wall of the top shell, and a clockwork spring is arranged between the inner wall of the top shell, and a fan blade is provided at the end of the first rotating shaft located outside the top shell, and one side of the fan blade is located directly below the connecting tube, and a first bevel gear is sleeved on the outer surface of the first rotating shaft located inside the top shell, and the lower side of the first bevel gear is meshed and connected with the second bevel gear, and a connecting shaft is provided on the lower surface of the second bevel gear, and the lower end of the connecting shaft rotates and passes through the lower surface of the top shell and is connected to the upper end of the transmission shaft.

[0010] The present invention is further configured as follows: the shielding assembly includes a base plate, and the two sides of the base plate are installed on the inner walls on the opposite sides of the bottom of the glue dispensing head. The lower end of the transmission shaft contacts the upper surface of the base plate and rotates. A U-shape is provided on the opposite sides of the base plate, and a sleeve shaft is provided between the inner walls on the opposite sides of the base plate groove. A convex shielding plate is provided on the opposite sides of the base plate, and the protruding part of the shielding plate extends into the groove of the base plate and is rotatably sleeved on the outer surface of the sleeve shaft. A torsion spring is provided between the shielding plate and the inner wall of the base plate groove. The two shielding plates remain horizontal under the action of the torsion spring and can block the bottom of the glue dispensing head.

[0011] The present invention is further configured as follows: the vibration auxiliary component includes a fixed plate, which is arranged on the outer surface of the bottom of the dispensing glue head, a control rod is slidably sleeved on the fixed plate, and a sleeve plate is sleeved on the outer surface of the control rod. A first spring movably sleeved on the outer surface of the control rod is arranged between the lower surface of the sleeve plate and the fixed plate, a plurality of vertically arranged rotating seats are provided on the outer surface of the dispensing glue head close to the control rod, a knocking plate is rotatably connected to the rotating seat, a knocking ball is provided on the lower side of the knocking plate, and the knocking plate remains vertical under the action of the gravity of the knocking ball, and a right-angled trapezoidal extrusion block is provided on the surface of the control rod close to the upper side of the knocking plate, and the inclined surface of the extrusion block faces and slides in contact with the upper surface of the knocking plate.

[0012] The present invention is further configured as follows: a transmission assembly for controlling the operation of the vibration auxiliary assembly is provided at the bottom of the baffle plate, the transmission assembly includes a transmission housing, the transmission housing is installed on the lower surface of the baffle plate, the lower surface of the base plate is rotatably connected to the second rotating shaft, the upper end of the second rotating shaft rotates and passes through the upper surface of the base plate, the upper end of the second rotating shaft is provided with a square block, the lower surface of the transmission shaft is provided with a square groove that matches the square block, the lower end of the second rotating shaft is provided with a third bevel gear, and the third rotating shaft is provided in the transmission housing, and the end of the third rotating shaft close to the base plate movably passes through the outer surface of the transmission housing, and the end of the third rotating shaft located outside the transmission housing is provided with a fourth bevel gear meshing with the third bevel gear.

[0013] The transmission gear of the present invention is a gear selected from the group consisting of a first gear and a second gear selected from the group consisting of a first gear and a second gear selected from the group consisting of a first gear and a second gear selected from the group consisting of a first gear and a second gear selected from the group consisting of a first gear and a second gear selected from the group consisting of a first gear and a second gear selected from the group consisting of a first gear and a second gear selected from the group consisting of a

[0014] The present invention is further configured as follows: the interior of the baffle plate is hollow, the outer surface of the sleeve shaft located in the baffle plate is sleeved with a fixed cam, the top wall of the baffle plate is provided with a second mounting plate, the second mounting plate is slidingly sleeved with a contact push rod, the other end of the contact push rod contacts the outer surface of the fixed cam, the outer surface of the contact push rod is sleeved with a reset push plate, a second spring movably sleeved on the outer surface of the contact push rod is provided between the reset push plate and the second mounting plate, a push rod with an upper end sliding through the baffle plate is provided in the transmission housing, a first rotating plate is hinged between the upper end of the push rod and the contact push rod, a rotating ring is rotatably sleeved on the outer surface of the third rotating shaft and the adjacent end of the fourth rotating shaft, and a second rotating plate is hinged between the lower end of the push rod and the outer surface of the rotating ring.

[0015] The advantages of the present invention are: First, the present invention is provided with an auger blade, which can drip glue onto the RF substrate when glue dispensing is needed. After dripping, the auger blade can transport the glue in the glue dispensing head upward into the glue injection tank. At the same time, the auger blade rotates in the opposite direction and its bottom can cut off the remaining glue near the glue outlet of the glue dispensing head, thereby avoiding the problem of glue stringing on the substrate caused by rapid shrinkage of the glue injection tank, ensuring the bonding effect of the millimeter wave wafer and the production quality of the millimeter wave RF chip. At the same time, it also avoids the problem of the glue in the glue dispensing head solidifying when encountering cold air, causing the glue dispensing head to be blocked, thereby ensuring the efficiency of RF chip packaging.

[0016] Secondly, the present invention can block the falling space of the glue by setting an anti-backflow component, thereby avoiding the problem of the glue sliding to the bottom of the dispensing head under the action of inertia when the auger blade stops rotating, causing cooling and hardening, thereby ensuring the stability of the packaging device when dispensing glue on the RF substrate in the later stage.

[0017] Third, the vibration auxiliary component of the present invention knocks on the outer surface of the glue dispensing head when the auger blades transport glue upward. The vibration force destroys the adhesion between the glue and the pipe wall, avoids glue residue on the pipe wall as much as possible, and improves the reflux effect of the glue. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] Figure 1 This is a structural schematic diagram of a waveguide packaging system for a millimeter-wave radio frequency chip according to the present invention; Figure 2 It is a side plan view of the internal structure of the glue injection tank and the glue dispensing head of the present invention; Figure 3 Schematic cross-sectional view of the dispensing head of the present invention; Figure 4 A top plan view of the internal structure of the transmission shaft of the present invention; Figure 5 for Figure 2 Enlarged view of point A in the middle; Figure 6 for Figure 2 Enlarged view of point B in the middle; Figure 7 for Figure 2 Enlarged view of point C in the middle Figure 8 This is a plan view of the internal structure of the shielding plate and the transmission housing of the present invention; Figure 9 Schematic diagram of the connection structure of the synchronous rotating shaft of the present invention.

[0019] In the figure: 1. Base; 2. N-shaped frame; 3. Glue injection tank; 4. Placement table; 5. Connecting pipe; 6. Glue dispensing head; 7. Transmission shaft; 71. Leakage-proof plate; 72. Retraction groove; 73. Mounting shaft; 74. Centrifugal slide; 75. Centrifugal slider; 76. Connecting push rod; 77. Connecting sleeve; 78. Reset lever; 79. First tension spring; 8. Auger blades; 9. Transmission assembly; 91. Top housing; 92. Fan blades; 93. First rotating shaft; 94. First bevel gear; 95. Connecting shaft; 96. Second bevel gear; 97. Spring; 10. Shielding assembly; 101. Bottom plate; 102. Shielding plate; 103. Sleeve shaft; 104. Second rotating shaft; 105. Third bevel gear; 106. Transmission housing; 107. Third rotating shaft; 108. Fourth bevel gear; 109. Fourth rotating shaft; 1010. First gear; 1011. Mounting shaft; 1012. Second gear; 1013. Sector gear; 1014. Transmission rack; 1015. First mounting plate; 1016. Synchronous rotating shaft; 1017. Sleeve chute; 1018. Limiting slider; 1019. Limiting chute; 1020. Fixed cam; 1021. Second mounting plate; 1022. Contact push rod; 1023. Reset push plate; 1024. Second spring; 1025. Push rod; 1026. First rotating plate; 1027. Rotating ring; 1028. Second rotating plate; 11. Vibration auxiliary component; 111. Fixed plate; 112. Control rod; 113. Sleeve plate; 114. First spring; 115. Rotating seat; 116. Knocking plate; 117. Knocking ball; 118. Extrusion block. DETAILED DESCRIPTION

[0020] The present application will be further described in detail below with reference to the accompanying drawings and examples. It should be understood that the specific embodiments described herein are merely for the purpose of explaining the relevant invention and are not intended to limit the invention. It should also be noted that, for ease of description, only portions relevant to the invention are shown in the accompanying drawings.

[0021] It should be noted that, in the absence of conflict, the embodiments and features of the embodiments in this application can be combined with each other. The present application will be described in detail below with reference to the accompanying drawings and in combination with the embodiments.

[0022] See also Figure 1-2 , the present invention provides the following technical solutions: Specifically, it refers to a waveguide packaging system for millimeter-wave RF chips, including a base 1, an n-type frame 2 is provided on the base 1, and an X / Y-axis moving component is provided on the n-type frame 2. The X / Y-axis moving component is a known technology on the existing dispensing equipment and will not be described in detail here. A glue injection tank 3 is provided on the X / Y-axis moving component, and a dispensing glue head 6 is detachably provided at the bottom of the glue injection tank 3. A connecting pipe 5 communicating with the interior of the glue injection tank 3 is provided on the top of the glue injection tank 3, and the other end of the connecting pipe 5 is connected to a pump body for sucking hot glue. A placement table 4 is provided on the base 1 and is located directly below the dispensing glue head 6.

[0023] During use, the substrate is placed on the placement table 4, and the X / Y axis moving component controls the glue dispensing head 6 to align with the RF substrate. The pump body starts and sucks the heated glue into the glue injection tank 3, and finally the glue dispensing head 6 drips onto the substrate. The RF chip is then placed on the substrate area with glue for bonding, thereby preparing for the next welding process.

[0024] Furthermore, a heating wire is embedded in the inner wall of the glue injection tank 3, and the surface of the glue injection tank 3 is wrapped with a heat insulation layer. The heating wire can heat the glue input into the glue injection tank 3 by the pump body, thereby avoiding the glue injected into the glue injection tank 3 from solidifying when cold and affecting the bonding effect on the RF lens.

[0025] Furthermore, a detachable structure such as a thread or a screw can be used between the glue dispensing head 6 and the glue injection tank 3, so that the glue dispensing head 6 can be easily removed from the bottom of the glue injection tank 3 at a later time.

[0026] A transmission shaft 7 is provided in the glue injection tank 3, and the lower end of the transmission shaft 7 extends into the glue dispensing head 6. The outer surface of the lower end of the transmission shaft 7 is sleeved with an auger blade 8, and the lower side of the auger blade 8 extends into the glue dispensing head 6, and the outer surface of the auger blade 8 is in contact with the inner wall of the glue dispensing head 6. A transmission component 9 for controlling the rotation of the transmission shaft 7 is provided on the top of the glue injection tank 3.

[0027] During use, when the pump body injects glue into the glue injection tank 3, the transmission component 9 controls the transmission shaft 7 to rotate, so that the auger blades 8 transport the glue in the glue injection tank 3 to the RF substrate through the glue dispensing head 6. After the glue is dripped on the RF substrate, the transmission component 9 controls the transmission shaft 7 to reverse, and the auger blades 8 can transport the glue in the glue dispensing head 6 upward into the glue injection tank 3. At the same time, the auger blades 8 rotate in the opposite direction and the bottom of the auger blades 8 can cut off the remaining glue near the glue outlet of the glue dispensing head 6, thereby avoiding the problem of glue stringing on the substrate caused by the rapid shrinkage of the glue injection tank 3 as much as possible, ensuring the bonding effect of the millimeter wave chip and the production quality of the millimeter wave RF chip.

[0028] Furthermore, the inner wall of the dispensing glue head 6, the surface of the auger blades 8 and the transmission shaft 7 are all coated with a polytetrafluoroethylene (PTFE) coating, which reduces glue adhesion.

[0029] When the auger blades 8 pump the glue into the glue injection tank 3, if the auger blades 8 stop rotating, the glue will also slide down along the auger blades 8 under the action of inertia, and eventually slide out of the glue dispensing head 6. For this purpose, a backflow prevention component is provided on the transmission shaft 7.

[0030] See also Figure 3-4 When the locking cam 73 is unlocked, the locking cam 78 is locked and the locking cam 78 is locked.

[0031] When the first spring 79 is released, the first spring 79 will pull the centrifugal slider 75 closer to the side of the transmission shaft 7 axis, and the reset rod 78 will push the leak-proof plate 71 out of the contraction groove 72 and block the area between the dispensing head 6, the auger blade 8 and the transmission shaft 7.

[0032] When in use, the transmission shaft 7 rotates and the centrifugal slider 75 rotates synchronously. At this time, the centrifugal slider 75 is displaced to the side away from the contraction groove 72 under the action of centrifugal force. At the same time, the first tension spring 79 is stressed and stretched, so the reset rod 78 forms a pulling force on the leak-proof plate 71, causing the leak-proof plate 71 to rotate into the contraction groove 72. At the same time, the connecting sleeve 77 slides on the outer surface of the connecting push rod 76 until the leak-proof plate 71 rotates into the contraction groove 72 and no longer blocks the glue. When the transmission shaft 7 stops rotating, the first tension spring 79 pulls the centrifugal slider 75 to slide to the initial position, so that the reset rod 78 pushes the leak-proof plate 71 to block the glue again.

[0033] The outer surface of the centrifugal slider 75 is provided with a pulley in contact with the inner wall of the centrifugal chute 74 , thereby reducing the friction of the centrifugal slider 75 sliding in the centrifugal chute 74 and improving the smoothness of the sliding of the centrifugal slider 75 .

[0034] See also Figure 5 The transmission assembly 9 includes a top shell 91, which is arranged on the top wall of the glue injection tank 3. A first rotating shaft 93 is provided in the top shell 91. The first rotating shaft 93 rotates through one end of the connecting tube 5 to pass through the outer surface of the top shell 91. The other end of the first rotating shaft 93 is rotatably connected to the inner wall of the top shell 91, and a clockwork spring 97 is provided between the inner wall of the top shell 91. A fan blade 92 is provided at one end of the first rotating shaft 93 located outside the top shell 91. One side of the fan blade 92 is located directly below the connecting tube 5. A first bevel gear 94 is sleeved on the outer surface of the first rotating shaft 93 located inside the top shell 91. The lower side of the first bevel gear 94 is meshed with a second bevel gear 96. The lower surface of the second bevel gear 96 is provided with a connecting shaft 95. The lower end of the connecting shaft 95 rotates through the lower surface of the top shell 91 and is connected to the upper end of the transmission shaft 7.

[0035] During use, since the glue in the glue injection tank 3 is transported out of the glue dispensing head 6 through the auger blades 8, it does not need to be squeezed out by pressure, so the glue capacity in the glue injection tank 3 does not need to be full. Therefore, when the glue falls into the glue injection tank 3 through the connecting tube 5, the glue can form a continuous thrust on the blades of the fan blades 92, so that the fan blades 92 drive the first rotating shaft 93 to rotate, and at the same time the spring spring 97 is stressed and contracts. At this time, the connecting shaft 95 rotates under the transmission of the first bevel gear 94 and the second bevel gear 96, so that the transmission shaft 7 can rotate with the connecting shaft 95, and the auger blades 8 drip the glue in the glue injection tank 3 onto the RF substrate. When the pump body stops conveying, the fan blades 92 lose the impact force of the glue, so the spring spring 97 drives the first rotating shaft 93 to rotate in the opposite direction. At this time, the transmission shaft 7 drives the auger blades 8 to reverse, so that the glue in the glue dispensing head 6 can be transported upward into the glue injection tank 3.

[0036] Furthermore, the outer surface of the fan blade 92 is also coated with polytetrafluoroethylene (PTFE).

[0037] See also Figure 2 and Figure 6 The bottom of the glue dispensing head 6 is provided with a shielding assembly 10, which includes a bottom plate 101. Both sides of the bottom plate 101 are installed on the inner walls of the opposite sides of the bottom of the glue dispensing head 6. The lower end of the transmission shaft 7 contacts the upper surface of the bottom plate 101 and rotates. The opposite sides of the bottom plate 101 are provided with U-shaped, and a sleeve shaft 103 is provided between the inner walls of the opposite sides of the groove of the bottom plate 101. The opposite sides of the bottom plate 101 are provided with convex shielding plates 102. The protruding part of the shielding plate 102 extends into the groove of the bottom plate 101 and is rotatably sleeved on the outer surface of the sleeve shaft 103. A torsion spring (not shown in the figure) is provided between the shielding plate 102 and the inner wall of the groove of the bottom plate 101. The two shielding plates 102 are kept horizontal under the action of the torsion spring, which can form a block for the bottom of the glue dispensing head 6, so that the glue dispensing head 6 is in a sealed state, which is convenient for the auger blade 8 to transport glue to the glue injection tank 3.

[0038] During use, when the auger blades 8 transport glue downward, the glue will form a thrust on the baffle 102, causing the baffle 102 to rotate downward and the torsion spring to deform. At this time, the glue can drip from the bottom of the glue dispensing head 6. When the auger blades 8 rotate in the opposite direction and transport the glue upward, the baffle 102 rotates into a horizontal shape again under the action of the torsion spring and seals the bottom of the glue dispensing head 6. At the same time, the baffle 102 can further cut off the residual glue at the glue outlet during the rotation process, thereby improving the effect of cutting off the residual glue.

[0039] See also Figure 7The outer surface of the glue dispensing head 6 is provided with a vibration auxiliary component 11, and the vibration auxiliary component 11 includes a fixed plate 111, which is arranged on the outer surface of the bottom of the glue dispensing head 6, and a control rod 112 is slidably sleeved on the fixed plate 111, and the outer surface of the control rod 112 is sleeved with a sleeve plate 113, and a first spring 114 movably sleeved on the outer surface of the control rod 112 is provided between the lower surface of the sleeve plate 113 and the fixed plate 111. A plurality of vertically arranged rotating seats 115 are provided on the outer surface of the glue dispensing head 6 near the control rod 112, and a knocking plate 116 is rotatably connected to the rotating seat 115, and a knocking ball 117 is provided on the lower side of the knocking plate 116. The knocking plate 116 remains vertical under the action of gravity of the knocking ball 117, and a right-angled trapezoidal extrusion block 118 is provided on the surface of the control rod 112 near the upper side of the knocking plate 116, and the inclined surface of the extrusion block 118 faces and slides in contact with the upper surface of the knocking plate 116.

[0040] When in use, the control rod 112 is pulled downward, and the extrusion block 118 moves downward synchronously with the control rod 112. The first spring 114 is stressed and contracts. At this time, the inclined surface of the extrusion block 118 squeezes the knocking plate 116, causing the knocking plate 116 to rotate clockwise with the rotating seat 115 as the rotating point, so that the knocking plate 116 drives the knocking ball 117 to knock on the outer surface of the glue dispensing head 6. When the control rod 112 moves upward, the extrusion block 118 does not squeeze the knocking plate 116, and the first spring 114 is reset. At this time, the knocking ball 117 drives the knocking plate 116 to rotate vertically again. The above structure can be used to knock on the outer surface of the glue dispensing head 6. When the auger blade 8 transports the glue in the glue dispensing head 6 upward, the vibration force destroys the adhesion between the glue and the pipe wall, avoids residual glue on the pipe wall as much as possible, and improves the reflux effect of the glue.

[0041] See also Figure 6-9, a transmission assembly for controlling the operation of the vibration auxiliary assembly 11 is provided at the bottom of the shielding plate 102, and the transmission assembly includes a transmission housing 106, and the transmission housing 106 is installed on the lower surface of the shielding plate 102. The lower surface of the bottom plate 101 is rotatably connected to the second rotating shaft 104, and the upper end of the second rotating shaft 104 rotates and penetrates the upper surface of the bottom plate 101. A square block (not shown in the figure) is provided on the upper end of the second rotating shaft 104, and a square groove (not shown in the figure) that matches the square block is opened on the lower surface of the transmission shaft 7. In this way, when the dispensing glue head 6 is installed at the bottom of the glue injection tank 3, the square groove at the bottom of the transmission shaft 7 is inserted into the square block. shaped block, so that when the transmission shaft 7 rotates, the second rotating shaft 104 can be driven to rotate. The lower end of the second rotating shaft 104 is provided with a third bevel gear 105, and a third rotating shaft 107 is provided in the transmission housing 106. The end of the third rotating shaft 107 close to the bottom plate 101 movably passes through the outer surface of the transmission housing 106, and the end of the third rotating shaft 107 located outside the transmission housing 106 is provided with a fourth bevel gear 108 meshing with the third bevel gear 105. Therefore, when the second rotating shaft 104 rotates with the transmission shaft 7, the third rotating shaft 107 rotates under the drive of the third bevel gear 105 and the fourth bevel gear 108.

[0042] The outer surface of the dispensing head 6 is rotatably connected to the mounting shaft 1011 located below the fixed plate 111, and the outer surface of the mounting shaft 1011 is sleeved with a second gear 1012, and the end of the mounting shaft 1011 away from the rotation point is provided with a fan gear 1013, and the lower end of the control rod 112 is provided with a transmission rack 1014 meshing with the fan gear 1013, and the other side of the transmission housing 106 is provided with a fourth shaft 109, and the end of the fourth shaft 109 away from the third shaft 107 is movable through the outer surface of the transmission housing 106, and the end of the fourth shaft 109 located outside the transmission housing 106 is provided with a first gear 1010 meshing with the second gear 1012.

[0043] During use, when the fourth shaft 109 rotates, the first gear 1010 rotates synchronously with the fourth shaft 109, and the mounting shaft 1011 rotates under the meshing transmission of the first gear 1010 and the second gear 1012. At this time, the sector gear 1013 rotates synchronously. When the sector gear 1013 is engaged with the transmission rack 1014, the sector gear 1013 drives the transmission rack 1014 to move downward, that is, the control rod 112 is pulled downward, so that the knocking ball 117 can knock on the outer wall of the dispensing glue head 6. When the sector gear 1013 is not engaged with the transmission rack 1014, the control rod 112 is pushed upward again by the first spring 114, thereby achieving the control of the operation of the vibration auxiliary component 11.

[0044] The meshing positions of the sector gears 1013 and the transmission rack 1014 on opposite sides of the glue dispensing head 6 are symmetrically arranged. Since the two fourth bevel gears 108 at the bottom of the third bevel gear 105 will rotate in opposite directions, the fourth rotating shafts 109 on both sides rotate in opposite directions. If the meshing positions of the sector gears 1013 and the transmission rack 1014 on both sides are the same, the extrusion block 118 on one side will squeeze the knocking plate 116.

[0045] The bottom wall of the transmission housing 106 is provided with a first mounting plate 1015, and a synchronous shaft 1016 is rotatably sleeved on the first mounting plate 1015. The third shaft 107 and the fourth shaft 109 are provided with a sleeve groove 1017 slidingly sleeved on the outer surface of the synchronous shaft 1016 on the surface facing the synchronous shaft 1016. The outer surface of both ends of the synchronous shaft 1016 is provided with a limiting slider 1018. The inner wall of the sleeve groove 1017 is provided with a limiting groove 1019 adapted to the limiting slider 1018. The limiting slider 1018 slides in the limiting groove 1019. During use, when the third shaft 107 rotates, it is restricted by the limiting slider 1018, so that the synchronous shaft 1016 rotates with the third shaft 107, so that the fourth shaft 109 can rotate with the synchronous shaft 1016.

[0046] The interior of the shielding plate 102 is hollow, and the outer surface of the sleeve shaft 103 located inside the shielding plate 102 is sleeved with a fixed cam 1020, and the top wall of the shielding plate 102 is provided with a second mounting plate 1021, and a contact push rod 1022 is slidably sleeved on the second mounting plate 1021, and the other end of the contact push rod 1022 is in contact with the outer surface of the fixed cam 1020, and the outer surface of the contact push rod 1022 is sleeved with a reset push plate 1023, and a second spring 1024 that is movably sleeved on the outer surface of the contact push rod 1022 is provided between the reset push plate 1023 and the second mounting plate 1021.

[0047] During use, when the shielding plate 102 rotates horizontally, the contact push rod 1022 contacts the protruding part of the fixed cam 1020, and the second spring 1024 is in a compressed state. When the shielding plate 102 rotates vertically, the contact push rod 1022 contacts the circular surface of the fixed cam 1020. At this time, the fixed cam 1020 cannot squeeze the contact push rod 1022, and the second spring 1024 is in a normal state.

[0048] A push rod 1025 is provided in the transmission housing 106, the upper end of which slides through the baffle plate 102, and a first rotating plate 1026 is hinged between the upper end of the push rod 1025 and the contact push rod 1022. A rotating ring 1027 is rotatably sleeved on the outer surface of the adjacent end of the third rotating shaft 107 and the fourth rotating shaft 109, and a second rotating plate 1028 is hinged between the lower end of the push rod 1025 and the outer surface of the rotating ring 1027.

[0049] When the shielding plate 102 is in use, it rotates downward and the contact push rod 1022 slides to the circular surface by the protruding part of the fixed cam 1020. At this time, the second spring 1024 releases the thrust, causing the contact push rod 1022 to move to the side close to the fixed cam 1020. At this time, the first rotating plate 1026 pulls the push rod 1025 upward, causing the push rod 1025 to move upward. When the push rod 1025 moves upward, the two second rotating plates 1028 respectively form a pulling force on the third rotating shaft 107 and the fourth rotating shaft 109, causing the third rotating shaft 107 and the fourth rotating shaft 109 to move into the transmission housing 106. At the same time, the fourth bevel gear 108 is separated from the third bevel gear 105, and the first gear 1010 is separated from the second gear 1012. When the shielding plate 102 is rotated upward, the contact push rod 1022 slides to the protruding part of the fixed cam 1020. At this time, the fixed cam 1020 When the baffle plate 102 is rotated upward, it is automatically connected to the transmission component of the vibration auxiliary component 11, so that the auger blade 8 transports glue upward and the vibration auxiliary component 11 knocks on the surface of the glue dispensing head 6, reducing the glue residue on the pipe wall.

[0050] When the present invention is used, the glue injection tank 3 and the glue dispensing head 6 can be set at an inclination of 30-60 degrees, so as to further improve the lifting effect of the auger blade 8 on the glue without affecting the glue dispensing of the radio frequency substrate.

[0051] The above description is merely a preferred embodiment of the present application and an illustration of the technical principles employed. Those skilled in the art should understand that the scope of the invention herein is not limited to technical solutions formed by a specific combination of the aforementioned technical features, but also encompasses other technical solutions formed by any combination of the aforementioned technical features or their equivalents without departing from the inventive concept. For example, a technical solution formed by replacing the aforementioned features with (but not limited to) technical features with similar functions disclosed in this application.

Claims

1. A waveguide packaging system for a millimeter wave radio frequency chip, comprising: an n-type frame (2) provided on a base (1); an X / Y axis moving component provided on the n-type frame (2); a glue injection tank (3) provided on the X / Y axis moving component; a glue dispensing head (6) detachably provided at the bottom of the glue injection tank (3); and characterized in that: A transmission shaft (7) is provided in the glue injection tank (3), the lower end of the transmission shaft (7) extends into the glue dispensing head (6), the outer surface of the lower end of the transmission shaft (7) is sleeved with an auger blade (8), the lower side of the auger blade (8) extends into the glue dispensing head (6), the outer surface of the auger blade (8) is in contact with the inner wall of the glue dispensing head (6), a transmission component (9) for controlling the rotation of the transmission shaft (7) is provided on the top of the glue injection tank (3), a backflow prevention component is provided on the transmission shaft (7), a shielding component (10) is provided at the bottom of the glue dispensing head (6), and a vibration auxiliary component (11) is provided on the outer surface of the glue dispensing head (6).

2. The waveguide packaging system for a millimeter-wave radio frequency chip according to claim 1, wherein: The top of the glue injection tank (3) is provided with a connecting pipe (5) communicating with the interior thereof, and the base (1) is provided with a placement platform (4) located directly below the glue dispensing head (6). The glue injection tank (3) and the glue dispensing head (6) can be arranged at an inclination of 30-60 degrees.

3. The waveguide packaging system for a millimeter-wave radio frequency chip according to claim 1, wherein: The backflow prevention assembly includes a leak prevention plate (71), which is arranged on one side of the transmission shaft (7) close to the top of the dispensing glue head (6), and a contraction groove (72) is provided on the outer surface of the transmission shaft (7). The outer surface of the leak prevention plate (71) is in contact with the inner wall of the contraction groove (72), and a mounting shaft (73) is provided between the upper and lower inner walls of the contraction groove (72). One side of the leak prevention plate (71) extends into the contraction groove (72) and is rotatably sleeved on the outer surface of the mounting shaft (73). The leak prevention plate (71) rotates outward with the mounting shaft (73) as a rotation point, and the side of the leak prevention plate (71) away from the mounting shaft (73) can contact the inner wall of the dispensing glue head (6), and the upper and lower sides of the leak prevention plate are in contact with the auger blade (8).

4. The waveguide packaging system for a millimeter-wave radio frequency chip according to claim 3, wherein: A centrifugal chute (74) is provided in the transmission shaft (7), and a centrifugal slider (75) is slidably connected in the centrifugal chute (74). A reset rod (78) is provided on the side of the centrifugal slider (75) facing the leak-proof plate (71). The other end of the reset rod (78) slides through the contraction groove (72). A connecting push rod (76) is provided on the inner side of the leak-proof plate (71). A connecting sleeve (77) is provided on the outer surface of the connecting push rod (76). One end of the reset rod (78) located in the contraction groove (72) is hinged to the connecting sleeve (77). A first tension spring (79) movably sleeved on the outer surface of the reset rod (78) is provided between the centrifugal slider (75) and the inner wall of the centrifugal chute (74).

5. The waveguide packaging system for a millimeter-wave radio frequency chip according to claim 1, wherein: The transmission assembly (9) includes a top shell (91), which is arranged on the top wall of the glue injection tank (3). A first rotating shaft (93) is arranged in the top shell (91). One end of the first rotating shaft (93) close to the connecting pipe (5) rotates through the outer surface of the top shell (91), and the other end of the first rotating shaft (93) is rotatably connected to the inner wall of the top shell (91). A spring (97) is arranged between the first rotating shaft (93) and the inner wall of the top shell (91). The first rotating shaft (93) is located outside the top shell (91). A fan blade (92) is provided at the end, and one side of the fan blade (92) is located directly below the connecting tube (5). A first rotating shaft (93) is located inside the top shell (91) and is sleeved with a first bevel gear (94) on its outer surface. The lower side of the first bevel gear (94) is meshedly connected with a second bevel gear (96). A connecting shaft (95) is provided on the lower surface of the second bevel gear (96). The lower end of the connecting shaft (95) rotates through the lower surface of the top shell (91) and is connected to the upper end of the transmission shaft (7).

6. The waveguide packaging system for millimeter wave radio frequency chips according to claim 1, characterized in that: The shielding assembly (10) includes a base plate (101), two sides of the base plate (101) are mounted on opposite inner walls of the bottom of the dispensing glue head (6), the lower end of the transmission shaft (7) contacts the upper surface of the base plate (101) and rotates, and the opposite sides of the base plate (101) are provided with U-shaped, and a sleeve shaft (103) is provided between the opposite inner walls of the groove of the base plate (101), and the opposite sides of the base plate (101) are provided with convex shielding plates (102), the protruding part of the shielding plate (102) extends into the groove of the base plate (101) and is rotatably sleeved on the outer surface of the sleeve shaft (103), and a torsion spring is provided between the shielding plate (102) and the inner wall of the groove of the base plate (101), and the two shielding plates (102) are kept horizontal under the action of the torsion spring, so as to block the bottom of the dispensing glue head (6).

7. The waveguide packaging system for a millimeter-wave radio frequency chip according to claim 6, wherein: The vibration auxiliary component (11) includes a fixed plate (111), which is arranged on the outer surface of the bottom of the dispensing glue head (6), a control rod (112) is slidably sleeved on the fixed plate (111), and a sleeve plate (113) is sleeved on the outer surface of the control rod (112), and a first spring (114) is movably sleeved on the outer surface of the control rod (112) between the lower surface of the sleeve plate (113) and the fixed plate (111), and the dispensing glue head (6) is close to the outer surface of the control rod (112). A plurality of vertically arranged rotating seats (115) are provided on the surface, a knocking plate (116) is rotatably connected to the rotating seat (115), a knocking ball (117) is provided on the lower side of the knocking plate (116), and the knocking plate (116) is kept vertically under the action of the gravity of the knocking ball (117), and a right-angled trapezoidal extrusion block (118) is provided on the surface of the control rod (112) close to the upper side of the knocking plate (116), and the inclined surface of the extrusion block (118) faces and contacts and slides with the upper surface of the knocking plate (116).

8. The waveguide packaging system for the millimeter wave radio frequency chip according to claim 7, characterized in that: The bottom of the shielding plate (102) is provided with a transmission assembly for controlling the operation of the vibration auxiliary assembly (11), and the transmission assembly includes a transmission housing (106). The transmission housing (106) is installed on the lower surface of the shielding plate (102). The lower surface of the bottom plate (101) is rotatably connected to a second rotating shaft (104). The upper end of the second rotating shaft (104) rotates through the upper surface of the bottom plate (101). A square block is provided on the upper end of the second rotating shaft (104). The transmission shaft (7) A square groove that matches the square block is opened on the lower surface, a third bevel gear (105) is provided at the lower end of the second rotating shaft (104), a third rotating shaft (107) is provided in the transmission housing (106), one end of the third rotating shaft (107) close to the bottom plate (101) is movable through the outer surface of the transmission housing (106), and one end of the third rotating shaft (107) located outside the transmission housing (106) is provided with a fourth bevel gear (108) that is meshed with the third bevel gear (105).

9. The waveguide packaging system for the millimeter wave radio frequency chip according to claim 8, characterized in that: The outer surface of the dispensing glue head (6) is rotatably connected to a mounting shaft (1011) located below the fixed plate (111), the outer surface of the mounting shaft (1011) is sleeved with a second gear (1012), and the end of the mounting shaft (1011) away from the rotation point is provided with a sector gear (1013), the lower end of the control rod (112) is provided with a transmission rack (1014) meshing with the sector gear (1013), and the other side of the transmission housing (106) is provided with a fourth rotating shaft (109), the end of the fourth rotating shaft (109) away from the third rotating shaft (107) is movable through the outer surface of the transmission housing (106), and the end of the fourth rotating shaft (109) located outside the transmission housing (106) is provided with a gear engaged with the second gear ( 1012) is meshed with a first gear (1010), a first mounting plate (1015) is provided on the bottom wall of the transmission housing (106), a synchronous shaft (1016) is rotatably sleeved on the first mounting plate (1015), a sleeve groove (1017) is provided on the surface of the third shaft (107) and the fourth shaft (109) facing the synchronous shaft (1016), and a limiting slide block (1018) is provided on the outer surface of the synchronous shaft (1016), and a limiting slide block (1018) is provided on the outer surface of both ends of the synchronous shaft (1016), and a limiting slide block (1019) adapted to the limiting slide block (1018) is provided on the inner wall of the sleeve groove (1017), and the limiting slide block (1018) slides in the limiting slide groove (1019).

10. The waveguide packaging system for millimeter wave radio frequency chips according to claim 9, characterized in that: The shielding plate (102) is hollow inside, and a fixed cam (1020) is sleeved on the outer surface of the sleeve shaft (103) located inside the shielding plate (102). A second mounting plate (1021) is provided on the top wall of the shielding plate (102). A contact push rod (1022) is slidably sleeved on the second mounting plate (1021). The other end of the contact push rod (1022) contacts the outer surface of the fixed cam (1020). A reset push plate (1023) is sleeved on the outer surface of the contact push rod (1022). A space is provided between the reset push plate (1023) and the second mounting plate (1021). A second spring (1024) is movably sleeved on the outer surface of the contact push rod (1022), a push rod (1025) is provided in the transmission housing (106), the upper end of which slides through the shielding plate (102), a first rotating plate (1026) is hinged between the upper end of the push rod (1025) and the contact push rod (1022), a rotating ring (1027) is rotatably sleeved on the outer surface of the adjacent end of the third rotating shaft (107) and the fourth rotating shaft (109), and a second rotating plate (1028) is hinged between the lower end of the push rod (1025) and the outer surface of the rotating ring (1027).

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