Production process of novel Metal Mesh product

Abstract

The invention discloses a production process of a novel Metal Mesh product. The production process comprises the following steps: 1) cleaning a glass substrate; 2) plating a layer of Metal on the surface of the glass substrate as a first Metal; 3) exposing, developing and etching the first Metal; 4) manufacturing a first OC layer on the first Metal; 5) plating a layer of Metal on the first OC layer as a second Metal; 6) exposing, developing and etching the second Metal; (7) plating an IM layer; 8) making a second OC layer on the IM layer, directly plating a first Metal on the original glass, replacing the previous need of OC0 and IM1 film layer bottoming to avoid the problem of adhesive force, and saving the cost at the same time; the line width tolerance of the first Metal electrode and the second Metal electrode is reduced, the control is consistent in the production process, and the situation that two film colors appear visually is avoided.

Description

Technical Field

[0001] The present invention belongs to the technical field of display equipment, and in particular relates to a production process of a novel Metal Mesh product. Background Art

[0002] In the process of implementing the present invention, the inventors discovered that the prior art has at least the following problems:

[0003] In the era of Internet+ and big data 5G, Metal Mesh is developing rapidly in the fields of wearable devices, foldable devices, smart homes, education and teaching. The demand for medium and large-sized touch panels or flexible panels is becoming more and more urgent. Traditional ITO films cannot be bent or folded, and their conductivity cannot meet the requirements of medium and large-sized touch panels. Moreover, ITO is a scarce resource and is non-renewable.

[0004] Alternative technologies to ITO include metal mesh, silver nanowires, carbon nanotubes, and graphene. Currently, carbon nanotubes and graphene are not commercially viable for mass production, as their conductivity doesn't meet the required standards. However, a few manufacturers have already achieved mass production of metal mesh and silver nanowires.

[0005] Currently, under conventional stacking conditions, the first metal has poor adhesion to the OC0 photoresist, and an IM1 layer needs to be plated on the OC0 layer to improve the first metal adhesion. This design adds two processes and significantly increases the cost.

[0006] Under the fluorescent light of the finished product, confirm that the first and second metal grid lines are visually obvious. Measure the electrode line widths of the first and second metals. The line width of the first metal is within the standard lower limit, and the line width of the second metal is within the standard upper limit. The range is between 2 and 3μm. The visual grid lines are naturally obvious. The main reason is that the yellow photoetching is not controlled according to the standard center value.

[0007] After the finished product was put into reliability testing at high temperature and high humidity (60℃ / 90%; 85℃ / 85%) for 200 hours, the second metal electrode line width area was visually whitened as a whole. The optical reflectivity of the whitened area was measured and was about 2% higher than that of normal products. The second metal wire was confirmed to have faded under a 2D microscope. Summary of the Invention

[0008] The technical problem to be solved by the present invention is to provide a new production process for Metal Mesh products, in which the first Metal is directly plated on the original glass, replacing the previous need for OC0 and IM1 film layers to avoid adhesion problems and also saving costs; the line width tolerance of the first Metal and second Metal electrodes is reduced, and consistent control is maintained during the production process to avoid the visual appearance of two film colors.

[0009] In order to solve the above technical problems, the technical solution adopted by the present invention is: a production process of a new type of Metal Mesh product, comprising the following steps:

[0010] 1) Cleaning the glass substrate;

[0011] 2) Coating a layer of metal on the surface of the glass substrate as the first metal;

[0012] 3) Exposure, development and etching of the first metal;

[0013] 4) Fabricate the first OC layer on the first Metal;

[0014] 5) Plate a layer of metal on the first OC layer as the second metal;

[0015] 6) Exposure, development and etching of the second metal;

[0016] 7) Plating another IM layer;

[0017] 8) Create a second OC layer on the IM layer.

[0018] In step 1), soda-lime reinforced glass is selected as the substrate.

[0019] In the above step 2), a layer of Metal, namely MOALMO material, is coated on the surface of the glass substrate. The total thickness of the first Metal film is between 250-350nm, of which the film thickness of MOO3 is about 40-50nm, the film thickness of F-MO is about 15-35nm, the film thickness of AL is about 180-250nm, and the film thickness of S-MO is about 40-70nm. The non-film surface reflectivity of the film layer is between 7-15%, and the film surface reflectivity is between 40-50%.

[0020] In the above step 3), the first metal is exposed to yellow light, developed and etched to leave the required metal lines, namely the electrode line width, which is controlled to be 7±1 μm.

[0021] In the above step 4), a full-surface OC layer, namely the first OC layer, is formed on the first metal, with a film thickness of 1.4 to 1.8 μm.

[0022] In the above step 5), a layer of Metal is plated on the first OC layer, that is, the second Metal. The conditions of the second Metal are consistent with those of the first Metal, that is, the total film thickness is between 250-350nm, of which the film thickness of MOO3 is about 40-50nm, the film thickness of F-MO is about 15-35nm, the film thickness of AL is about 180-250nm, and the film thickness of S-MO is about 40-70nm. The non-film surface reflectivity of the film layer is 7-15%, and the film surface reflectivity is between 40-50%.

[0023] In step 6) above, the second metal is exposed to yellow light, developed, and etched to leave the required metal lines. The electrode line width is controlled at 7±1μm, which is consistent with the first metal.

[0024] In the above step 7), an IM layer is deposited on the metal film layer. The IM layer is SiO2. The thickness of the SiO2 film layer is between 20-60 nm, and the refractive index n value is between 1.46 and 1.49.

[0025] In the above step 8), a full-surface OC layer, namely the second OC layer, is formed on the SiO2 film layer with a film thickness of 1.6 to 2.4 μm.

[0026] One of the above technical solutions has the following advantages or beneficial effects: the first metal is directly plated on the original glass, replacing the previous need for OC0 and IM1 film layers to avoid adhesion problems and also saving costs; the line width tolerance of the first metal and second metal electrodes is reduced, and consistent control is achieved during the production process to avoid the visual appearance of two film colors. BRIEF DESCRIPTION OF THE DRAWINGS

[0027] Figure 1 This is a product overall structure diagram of the production process of the new Metal Mesh product provided in an embodiment of the present invention;

[0028] Figure 2 for Figure 1 A partial enlarged view of the production process of the new Metal Mesh product;

[0029] Figure 3 for Figure 1 The membrane stack composition of the new Metal Mesh product; DETAILED DESCRIPTION

[0030] The following will clearly and completely describe the technical solutions in the embodiments of the present invention in conjunction with the accompanying drawings. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of the present invention.

[0031] Example 1

[0032] See also Figures 1 to 3A production process for a new type of Metal Mesh product includes the following steps: 1) cleaning a glass substrate; 2) coating a layer of Metal on the surface of the glass substrate as the first Metal; 3) exposing, developing, and etching the first Metal; 4) making a first OC layer on the first Metal; 5) coating a layer of Metal on the first OC layer as the second Metal; 6) exposing, developing, and etching the second Metal; 7) coating another IM layer; 8) making a second OC layer on the IM layer, directly coating the first Metal on the original glass, replacing the previous need for OC0 and IM1 film layers to avoid adhesion problems and also saving costs; reducing the line width tolerance of the first and second Metal electrodes, and ensuring consistent control during the production process to avoid the visual appearance of two film colors.

[0033] In step 1), soda-lime reinforced glass is selected as the substrate.

[0034] In the above step 2), a layer of Metal, namely MOALMO material, is coated on the surface of the glass substrate. The total thickness of the first Metal film is between 250-350nm, of which the film thickness of MOO3 is about 40-50nm, the film thickness of F-MO is about 15-35nm, the film thickness of AL is about 180-250nm, and the film thickness of S-MO is about 40-70nm. The non-film surface reflectivity of the film layer is between 7-15%, and the film surface reflectivity is between 40-50%.

[0035] Production steps:

[0036] a. Substrate cleaning: Add 5% KOH solution by volume to the cleaning machine, and press the upper and lower brushes normally.

[0037] Enter, the AP machine is turned on normally, and the organic matter and dirt on the surface of the substrate are cleaned;

[0038] b. Product coating: ① Target washing, the target material will be used and turned on normally according to the required power, in order to remove the organic matter on the target surface to avoid sputtering to the substrate surface during the production process; ② Evaluate the thickness of each layer, prepare 5ST plain glass and use high-temperature tape to laminate them at equal intervals according to the substrate size, and evaluate the thickness of MOO3, F-MO, AL, and S-MO respectively; ③ After the thickness of each layer is confirmed, start evaluating the first piece of the upper and lower finished products. According to the sputtering rate of different target materials, the power of MOO3 is calculated to be 8KW, the power of F-MO is 6KW, the power of AL layer is 48KW, and the power of S-MO is 11KW. After the first piece is completed, measure the optics of the upper and lower layers, confirm the adjustment direction, and adjust a certain section in time until the optical adjustment is confirmed;

[0039] advantage:

[0040] The metal base layer, MO, uses a blackened MO film layer, resulting in MOO3. After etching, the metal grid lines appear dull, creating a visually dissimilar effect. Metal mesh touchscreens also offer high-precision touch control, allowing users to easily operate mobile phones and other electronic devices. Durability: Metal mesh touchscreens have a long lifespan, typically withstanding thousands of cycles, meeting the needs of most users. Excellent touch performance: Metal mesh touchscreens offer excellent touch performance, allowing users to easily operate mobile phones and other electronic devices. Low cost: Compared to other touch technologies, metal mesh touchscreens are less expensive, making them a popular choice for many electronic device manufacturers.

[0041] In the above step 3), the first metal is exposed to yellow light, developed and etched to leave the required metal lines, namely the electrode line width, which is controlled to be 7±1 μm.

[0042] step:

[0043] First, clean the substrate, apply positive photoresist on the entire metal surface, and then go through pre-bake, exposure, development, post-bake, etching, and stripping to complete the production of metal lines and gold fingers; Gap: 90~110μm, pressure 0.05~0.07Mpa, exposure Gap: 130~160μm, exposure energy 130~160mJ / cm2, development conductivity 40~70ms / cm, development speed 2.0~4.0m / min, etching temperature 40~50℃, speed 2.0~4.0m / min, and the final line width after etching is controlled at 6-8μm.

[0044] advantage:

[0045] 1. Improve light transmittance: Reducing the line width means that the area occupied by the metal grid is reduced, allowing more light to pass through and improving the overall light transmittance.

[0046] 2. Reduce moiré: Moiré is caused by the interference between periodic patterns (such as metal grids) and the display pixel array. Reducing the line width can alleviate this phenomenon.

[0047] 3. Enhanced flexibility and durability: Thinner metal wires mean better flexibility and resistance to breakage, which is especially important for foldable devices.

[0048] In the above step 4), a full-surface OC layer, namely the first OC layer, is formed on the first metal, with a film thickness of 1.4 to 1.8 μm.

[0049] step:

[0050] The entire surface of the OC photoresist is coated, and then the process is followed by pre-cleaning, pre-baking, exposure, development, and post-baking to form an OC1 film. The OC1 film only covers the ITO bridge points. The OC1 film thickness is 1.4-1.8μm, the coating pressure is 0.05-0.07Mpa, the exposure gap is 180-220μm, the exposure energy is 100-120mJ / cm2, and the development speed is 3.0-4.0m / min.

[0051] advantage:

[0052] The OC is full-surface, which protects Metal1 from oxidation scratches on the one hand, and effectively insulates Metal1 from direct conduction with Metal2 on the other hand.

[0053] In step 5) above, a layer of metal is deposited on the first OC layer, i.e., the second metal. The conditions of the second metal are the same as those of the first metal, i.e., the total film thickness is between 250-350nm, of which the film thickness of MOO3 is about 40-50nm, the film thickness of F-MO is about 15-35nm, the film thickness of AL is about 180-250nm, and the film thickness of S-MO is about 40-70nm. The non-film reflectivity of the film layer is between 7-15%, and the film surface reflectivity is between 40-50%. Steps:

[0054] Production steps:

[0055] c. Substrate cleaning: Add 5% KOH solution by volume to the cleaning machine, press the upper and lower brushes normally, and turn on the AP machine normally to clean the organic matter and dirt on the surface of the substrate;

[0056] d. Product coating: ① Target washing, the target material will be used and turned on normally according to the required power, in order to remove the organic matter on the target surface to avoid sputtering to the substrate surface during the production process; ② Evaluate the thickness of each layer, prepare 5ST plain glass and use high-temperature tape to laminate them at equal intervals according to the substrate size, and evaluate the thickness of MOO3, F-MO, AL, and S-MO respectively; ③ After the thickness of each layer is confirmed, start evaluating the first piece of the upper and lower finished products. According to the sputtering rate of different target materials, the power of MOO3 is calculated to be 8KW, the power of F-MO is 6KW, the power of AL layer is 48KW, and the power of S-MO is 11KW. After the first piece is completed, measure the optics of the upper and lower layers, confirm the adjustment direction, and adjust a certain section in time until the optical adjustment is OK;

[0057] advantage:

[0058] The metal base layer, MO, uses a blackened MO film layer, resulting in MOO3. After etching, the metal grid lines appear dull, creating a visually dissimilar effect. Metal mesh touchscreens also offer high-precision touch control, allowing users to easily operate mobile phones and other electronic devices. Durability: Metal mesh touchscreens have a long lifespan, typically withstanding thousands of cycles, meeting the needs of most users. Excellent touch performance: Metal mesh touchscreens offer excellent touch performance, allowing users to easily operate mobile phones and other electronic devices. Low cost: Compared to other touch technologies, metal mesh touchscreens are less expensive, making them a popular choice for many electronic device manufacturers.

[0059] In step 6) above, the second metal is exposed to yellow light, developed, and etched to leave the required metal lines. The electrode line width is controlled at 7±1μm, which is consistent with the first metal.

[0060] step:

[0061] First, clean the substrate, apply positive photoresist on the entire metal surface, and then go through pre-bake, exposure, development, post-bake, etching, and stripping to complete the production of metal lines and gold fingers; Gap: 90~110μm, pressure 0.05~0.07Mpa, exposure Gap: 130~160μm, exposure energy 130~160mJ / cm2, development conductivity 40~70ms / cm, development speed 2.0~4.0m / min, etching temperature 40~50℃, speed 2.0~4.0m / min, and the final line width after etching is controlled at 6-8μm.

[0062] advantage:

[0063] 1. Improve light transmittance: Reducing the line width means that the area occupied by the metal grid is reduced, allowing more light to pass through and improving the overall light transmittance.

[0064] 2. Reduce moiré: Moiré is caused by the interference between periodic patterns (such as metal grids) and the display pixel array. Reducing the line width can alleviate this phenomenon.

[0065] 3. Enhanced flexibility and durability: Thinner metal wires mean better flexibility and resistance to breakage, which is especially important for foldable devices.

[0066] In the above step 7), an IM layer is deposited on the metal film layer. The IM layer is SiO2. The thickness of the SiO2 film layer is between 20-60 nm, and the refractive index n value is between 1.46 and 1.49.

[0067] step:

[0068] A layer of SIO2 film is sputtered on the cleaned glass surface with a thickness of 20-60nm at a coating temperature of 200-250°C. When coating SIO2, 100-140sccm of argon and 150-180sccm of oxygen are introduced, the power is 45-50kw, and the coating speed is 1.2m / min.

[0069] advantage:

[0070] On the one hand, a layer of SIO2 coating process further improves the transmittance of the product, and on the other hand, it effectively prevents the Metal2 metal wire from being scratched and oxidized.

[0071] In the above step 8), a full-surface OC layer, namely the second OC layer, is formed on the SiO2 film layer with a film thickness of 1.6 to 2.4 μm.

[0072] step:

[0073] The entire surface of the OC photoresist is coated, and then the process is followed by pre-cleaning, pre-baking, exposure, development, and post-baking to form an OC1 film. The OC1 film only covers the ITO bridge points. The OC1 film thickness is 1.4-1.8μm, the coating pressure is 0.05-0.07Mpa, the exposure gap is 180-220μm, the exposure energy is 100-120mJ / cm2, and the development speed is 3.0-4.0m / min.

[0074] advantage:

[0075] The OC2 is a full-surface material, which not only further improves the optical transmittance of the product, but also protects the Metal2 wire from scratches and oxidation.

[0076] Product electrode line width adjustment (I):

[0077]

[0078] Reliability post-optical data (II):

[0079]

[0080] Metal Mesh technology is more mature and widely recognized in the industry. Metal Mesh can be used in ultra-thin, foldable, and wearable electronic products, supporting the upcoming demands of the new consumer electronics industry with integrated foldable flexible displays and touchscreens, and has a bright future. Metal Mesh is a conductive material that uses various processes to form extremely fine metal mesh lines on substrates such as PET, COP, and PC. The mesh lines are generally less than 10μm wide and are essentially invisible to the naked eye. The metal mesh lines on the surface of the Metal Mesh material replace the ITO on the surface of the ITO material, and the conductive effect is far superior to traditional ITO.

[0081] The technical solution adopted by the present invention is as follows:

[0082] 1. Cancel the OC0 and IM1 processes and directly plate the first metal on the original glass to ensure that the debugged optical reflectivity is consistent with the optics with OC0 and IM1 as the base. Specifically, the optics are adjusted by the oxygen permeability of the bottom molybdenum oxide;

[0083] 2. The electrode line width after etching the first and second metals differed significantly, making the final product visually noticeable under fluorescent light. The electrode line width was re-controlled from the original 7±2μm to 7±1μm. During metal etching, the first and second metals were kept consistent, adjusted to a center value of around 7μm, so that there were no two extreme differences visually.

[0084] 3. After the finished product was put into the reliability test (high temperature and high humidity for 200 hours), the second metal wire faded and turned white. When measuring the optical reflectivity, it was about 2% higher than the normal product. In order to solve this problem, a SIO2 protective layer was added after the second metal was etched. This does not change the original optical properties, and at the same time ensures that the second metal wire will not fade and turn white after the reliability test.

[0085] It has the following beneficial effects:

[0086] The first metal is directly plated on the original glass, replacing the previous OC0 and IM1 film layers to avoid adhesion problems and save costs;

[0087] Narrow the line width tolerance between the first and second metal electrodes, maintain consistent control during the production process, and avoid visually appearing two different film colors.

[0088] An SIO2 film layer is added between the second Metal and the second OC layer, which effectively avoids the fading and whitening of the second Metal line after reliability without changing the original optics.

[0089] Example 2

[0090] A new production process of Metal Mesh products:

[0091] 1. Cancel the OC0 and IM1 processes and directly plate the first metal on the original glass to ensure that the debugged optical reflectivity is consistent with the optics with OC0 and IM1 as the base. Specifically, the optics are adjusted by the oxygen permeability of the bottom molybdenum oxide;

[0092] 2. The electrode line width after etching the first and second metals differed significantly, making the final product visually noticeable under fluorescent light. The electrode line width was re-controlled from the original 7±2μm to 7±1μm. During metal etching, the first and second metals were kept consistent, adjusted to a center value of around 7μm, so that there were no two extreme differences visually.

[0093] 3. After the finished product was put into the reliability test (high temperature and high humidity for 200 hours), the second metal wire faded and turned white. When measuring the optical reflectivity, it was about 2% higher than the normal product. In order to solve this problem, a SIO2 protective layer was added after the second metal was etched. This does not change the original optical properties, and at the same time ensures that the second metal wire will not fade and turn white after the reliability test.

[0094] To achieve the above object, the present invention provides a technical solution: a new metal mesh production process, characterized in that it includes the following steps:

[0095] S1: Select ordinary soda-lime strengthened glass substrate and clean the surface;

[0096] S2: A layer of metal is coated on the surface of the glass substrate, namely MOALMO material. The total thickness of the first metal film is between 250-350nm, of which the thickness of MOO3 is about 40-50nm, the thickness of F-MO film is about 15-35nm, the thickness of AL film is about 180-250nm, and the thickness of S-MO film is about 40-70nm. The reflectivity of the non-film surface is 7-15%, and the reflectivity of the film surface is between 40-50%;

[0097] S3: The first metal is exposed to yellow light, developed and etched to leave the required metal lines, that is, the electrode line width, which is controlled at 7±1μm.

[0098] S4: Make a full-surface OC layer on the first metal, that is, the first OC layer. The first OC layer mainly protects the first metal film layer and has an insulation effect. The film thickness is about 1.4 to 1.8 μm.

[0099] S5: Another layer of Metal is deposited on the first OC layer, that is, the second Metal. The conditions of the second Metal are consistent with those of the first Metal, that is, the total film thickness is between 250-350nm, of which the film thickness of MOO3 is about 40-50nm, the film thickness of F-MO is about 15-35nm, the film thickness of AL is about 180-250nm, and the film thickness of S-MO is about 40-70nm. The non-film surface reflectivity of the film layer is 7-15%, and the film surface reflectivity is between 40-50%.

[0100] S6: After yellow light exposure, development and etching, the second metal leaves the required metal lines. The electrode line width is controlled at 7±1μm, consistent with the first metal.

[0101] S7: An IM layer is deposited on the metal film layer. The IM layer is mainly SiO2. The SiO2 film layer mainly protects the Metal film layer. At the same time, it must also ensure that the reflectivity is consistent with that of the uncoated SiO2. The layer thickness is between 20-60nm, and the refractive index n value can be between 1.46 and 1.49.

[0102] S8: Make a whole-surface OC layer on the SiO2 film layer, that is, the second OC layer. The second OC layer further protects the second Metal film layer and has an insulation effect. The film thickness is about 1.6 to 2.4 μm.

[0103] It has the following beneficial effects:

[0104] The first metal is directly plated on the original glass, replacing the previous OC0 and IM1 film layers to avoid adhesion problems and save costs;

[0105] Narrow the line width tolerance between the first and second metal electrodes, maintain consistent control during the production process, and avoid visually appearing two different film colors.

[0106] An SIO2 film layer is added between the second Metal and the second OC layer, which effectively avoids the fading and whitening of the second Metal line after reliability without changing the original optics.

[0107] In the description of the present invention, it should be understood that the terms "coaxial", "bottom", "one end", "top", "middle", "the other end", "upper", "one side", "top", "inside", "front", "center", "both ends", etc., indicating the orientation or position relationship, are based on the orientation or position relationship shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present invention.

[0108] In the present invention, unless otherwise clearly stipulated and limited, the terms "install", "set", "connect", "fix", "screw" and the like should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or an integrated connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium; it can be the internal connection of two elements or the interaction relationship between two elements. Unless otherwise clearly defined, ordinary technicians in this field can understand the specific meanings of the above terms in the present invention according to the specific circumstances.

[0109] While embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions, and variations may be made to these embodiments without departing from the principles and spirit of the invention, and that the scope of the invention is defined by the appended claims and their equivalents.

Claims

1. A new production process for Metal Mesh products, characterized in that: The steps include: 1) Cleaning the glass substrate; 2) Coating a layer of metal on the surface of the glass substrate as the first metal; 3) Exposure, development and etching of the first metal; 4) Fabricate the first OC layer on the first Metal; 5) Plate a layer of metal on the first OC layer as the second metal; 6) Exposure, development and etching of the second metal; 7) Plating another IM layer; 8) Create a second OC layer on the IM layer.

2. The production process of the new Metal Mesh product according to claim 1, characterized in that: In the above step 1), soda-lime reinforced glass is selected as the substrate.

3. The production process of the new Metal Mesh product according to claim 2, characterized in that: In the above step 2), a layer of Metal, namely MOALMO material, is coated on the surface of the glass substrate. The total thickness of the first Metal film is between 250-350nm, of which the film thickness of MOO3 is about 40-50nm, the film thickness of F-MO is about 15-35nm, the film thickness of AL is about 180-250nm, and the film thickness of S-MO is about 40-70nm. The non-film surface reflectivity of the film layer is between 7-15%, and the film surface reflectivity is between 40-50%.

4. The production process of the new Metal Mesh product according to claim 3, characterized in that: In the above step 3), the first metal is exposed to yellow light, developed and etched to leave the required metal lines, namely the electrode line width, which is controlled to be 7±1 μm.

5. The production process of the new Metal Mesh product according to claim 4, characterized in that: In the above step 4), a full-surface OC layer, namely the first OC layer, is formed on the first metal, with a film thickness of 1.4 to 1.8 μm.

6. The production process of the new Metal Mesh product according to claim 5, characterized in that: In the above step 5), a layer of Metal is plated on the first OC layer, that is, the second Metal. The conditions of the second Metal are consistent with those of the first Metal, that is, the total film thickness is between 250-350nm, of which the film thickness of MOO3 is about 40-50nm, the film thickness of F-MO is about 15-35nm, the film thickness of AL is about 180-250nm, and the film thickness of S-MO is about 40-70nm. The non-film surface reflectivity of the film layer is 7-15%, and the film surface reflectivity is between 40-50%.

7. The production process of the novel Metal Mesh product according to claim 6, characterized in that: In step 6) above, the second metal is exposed to yellow light, developed, and etched to leave the required metal lines. The electrode line width is controlled at 7±1μm, which is consistent with the first metal.

8. The production process of the new Metal Mesh product according to claim 7, characterized in that: In the above step 7), an IM layer is deposited on the metal film layer. The IM layer is SiO2. The thickness of the SiO2 film layer is between 20-60 nm, and the refractive index n value is between 1.46 and 1.

49.

9. The production process of the novel Metal Mesh product according to claim 8, characterized in that: In the above step 8), a full-surface OC layer, namely the second OC layer, is formed on the SiO2 film layer with a film thickness of 1.6 to 2.4 μm.

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