Electronic equipment

Abstract

The invention provides an electronic device which comprises a rear cover, a mainboard and a camera module, the rear cover and the mainboard are oppositely arranged, the mainboard comprises an opening, and the camera module comprises an imaging assembly and a signal transmission assembly. Wherein a first part of the imaging assembly faces the rear cover and is arranged on the main board, a second part of the imaging assembly extends towards the opening, the signal transmission assembly faces the rear cover and is arranged on the main board, and the imaging assembly and the signal transmission assembly are connected through a flexible circuit board. According to the electronic equipment provided by the invention, the opening is formed in the main board, and the imaging assembly can partially extend into the opening, so that the assembly structure in the electronic equipment is more reasonable, and the size of the electronic equipment is reduced by reducing the thickness of the electronic equipment.

Description

[0001] This application is a divisional application of the invention patent application with application number 202111412812.3 submitted to the China Patent Office, application date November 25, 2021, and invention name “An electronic device”. Technical Field

[0002] The present application relates to the technical field of periscope camera devices, and in particular to an electronic device. Background Art

[0003] Due to the thickness limitations of electronic devices such as mobile phones and tablets, the focal length of cameras placed along the thickness of the electronic devices is relatively small, and the optical zoom capability is limited. Currently, the maximum optical zoom can reach 3x.

[0004] Therefore, to achieve high-magnification optical zoom, the traditional method of placing the camera along the thickness of the electronic device requires a camera module to be placed perpendicular to the thickness of the electronic device. A special optical prism refracts light onto the photosensitive element to form an image. This type of camera module placed perpendicular to the thickness of the electronic device is called a periscope camera module. It can achieve a higher optical zoom ratio and capture distant objects more clearly.

[0005] However, as electronic devices such as mobile phones and tablet computers are becoming increasingly miniaturized and compact, stricter requirements are placed on the size of electronic devices. Therefore, how to reduce the size of electronic devices has become an urgent problem to be solved. Summary of the Invention

[0006] The present application provides an electronic device, wherein the assembly structure of the periscope camera module inside the electronic device is more reasonable, and the volume of the electronic device is reduced by reducing the thickness of the electronic device.

[0007] The electronic device provided in this application includes a back cover, a main board and a camera module.

[0008] Among them, the back cover is an external component of the electronic device, which can cover the battery and other components of the electronic device, and is used to protect the internal components of the electronic device and prevent external dust from entering the interior of the electronic device. The motherboard is an important internal component of the electronic device. It is installed with the chips and circuit components that make up the electronic device, such as the BIOS chip, I / O control chip, keyboard and panel control switch interface, and power supply plug-in components. The motherboard is used to connect electrical components of different voltages together to form a communication line. It can also be used to centralize data processed by internal devices and transmit it to the outside world to realize communication functions. The camera module is used to capture still images or videos.

[0009] The electronic device provided herein comprises a rear cover and a mainboard disposed relative to each other, the mainboard including an opening, and a camera module including an imaging component and a signal transmission component. The imaging component is configured to collect ambient light, generate optical signals, convert the optical signals into electrical signals, and transmit them to the signal transmission component. The signal transmission component is configured to receive the electrical signals transmitted from the imaging component, amplify them, and transmit them to other components.

[0010] The first portion of the imaging assembly is disposed on the mainboard, facing the rear cover, and the second portion of the imaging assembly extends toward the opening, allowing the rear cover to sink closer to the mainboard. This reduces the distance between the rear cover and the mainboard, thereby reducing the thickness and volume of the electronic device. The signal transmission assembly is disposed on the mainboard, facing the rear cover, and the imaging assembly and the signal transmission assembly are connected via a flexible circuit board.

[0011] Optionally, the first portion of the imaging component and the signal transmission component are arranged on two sides of the opening opposite to each other.

[0012] Optionally, the first part of the imaging component includes a prism, and the second part of the imaging component includes a lens barrel, a photosensitive element and a module substrate, wherein the prism is used to change the optical path of the incident light so that it is transmitted into the lens barrel, and the lens barrel is used to fix the optical elements inside it, such as lenses, filters, etc., and to prevent the light beam from expanding outward and causing light loss. The photosensitive element can be a charge coupled device (CCD) or a complementary metal oxide semiconductor (CMOS) phototransistor. The photosensitive element is used to convert the light signal passing through the lens barrel into an electrical signal, and then transmit the electrical signal to a signal processing element such as an ISP to further complete the signal processing of the telecommunications. The electronic device of the present application may include 1 or N camera modules, where N is a positive integer greater than 1.

[0013] The prism includes a first light-transmitting surface, which is a surface of the prism facing the signal transmission component. One end of the lens barrel is sealed with the first light-transmitting surface of the prism, and the other end of the lens barrel extends toward the opening.

[0014] The photosensitive element is arranged at the other end of the lens barrel and is sealed with the lens barrel. The module substrate is fitted on one side surface of the photosensitive element, and the one side surface of the photosensitive element is the surface away from the lens barrel. The photosensitive element is connected to the signal transmission component through the flexible circuit board.

[0015] Optionally, the lens barrel includes a first structural portion and a second structural portion, the first structural portion and the second structural portion are both hollow structures and have the same inner diameter, one end of the first structural portion is sealed to the first light-transmitting surface, and the other end of the first structural portion is sealed to the second structural portion, the second structural portion is inclined relative to the main board and extends toward the opening away from the back cover, and the angle of the second structural portion relative to the main board is greater than 0° and less than 90°.

[0016] Optionally, the connection between the prism and the first structural part is located at the edge of the opening, the first structural part is inclined relative to the main board, and extends toward the opening away from the back cover, and the angle between the first structural part and the main board is greater than 0° and less than 90°.

[0017] Optionally, there is a gap between the prism and the edge of the opening, the first structural portion is parallel to the main board, and the first structural portion is arranged between the prism and the edge of the opening, and the end of the first structural portion away from the prism is coplanar with the edge of the opening; one end of the second structural portion is sealed with one end of the first structural portion, and the other end extends toward the opening away from the back cover.

[0018] Optionally, the prism further includes a second light-transmitting surface, the second light-transmitting surface being a surface of the prism facing away from the mainboard. The back cover further includes a lens aperture, a lens protection sheet disposed in the lens aperture, the lens protection sheet being disposed opposite and parallel to the second light-transmitting surface, and the lens protection sheet being used to prevent external dust from entering the interior of the electronic device.

[0019] Optionally, the electronic device further includes a decorative piece and a connecting platform, wherein the decorative piece is a hollow annular structure, the outer diameter of the decorative piece is the same as the inner diameter of the lens hole, the decorative piece is embedded in the lens hole, and the lens protection sheet is fixed in the decorative piece; the connecting platform is a hollow annular structure and is arranged to fit the inner side of the back cover, and the inner ring of the connecting platform is connected to the outer ring of the decorative piece.

[0020] Optionally, a first groove is provided on an inner wall of the decorative piece, the lens protection sheet is located inside the decorative piece, and an edge of the lens protection sheet is embedded in the first groove.

[0021] Optionally, a storage table is further included, which is a hollow ring structure, and the outer ring of the storage table is connected to the inner ring of the decorative component, and the lens protection sheet is adhered to the surface of the storage table away from the main board.

[0022] The distance between the surface of the storage table away from the main board and the surface of the decorative component away from the main board is greater than or equal to the thickness of the lens protection sheet.

[0023] Optionally, the second structural part further includes a first surface, which is a bottom plane of the second structural part away from the lens protection sheet, and the first surface is parallel to the main board.

[0024] Optionally, the decorative element further includes a second surface, which is a surface of the decorative element facing the second structural portion and has the same curvature as that of the second structural portion.

[0025] Optionally, the second structural portion further includes a second groove, and the second groove is located at the contact point between the second structural portion and the decorative element, so that the decorative element is partially embedded in the second groove.

[0026] Optionally, the imaging assembly further includes a support frame, which is located on the main board and is used to carry the prism.

[0027] Optionally, the electronic device further includes a sealing ring, which surrounds the edge of the second light-transmitting surface and is bonded between the prism and the lens protection sheet. The sealing ring is used to protect the prism and prevent external moisture, dust and other substances from adhering to the surface of the prism.

[0028] Optionally, the storage platform extends toward the center of the decorative component until it reaches a side surface of the sealing ring away from the lens protection sheet, and is bonded to a side surface of the sealing ring away from the lens protection sheet.

[0029] Optionally, the electronic device further includes a fixing frame, which is fixedly connected to the mainboard and covers around the supporting frame to limit the movement of the supporting frame.

[0030] Optionally, the fixing frame includes a first connector and at least one second connector, the first connector and at least one second connector are an integral structure, the first connector is wrapped around the support frame, and at least one second connector is fixed to the mainboard by a positioning bolt.

[0031] Optionally, a support plate is further included for supporting the camera module to balance the gravity of the camera module. The support plate includes a first support portion, a second support portion, and a third support portion. The second support portion and the third support portion are arranged on opposite sides of the first support portion and are fixedly connected to the first support portion.

[0032] An embedding groove is provided on the surface of the mainboard on one side away from the back cover, and two embedding grooves are arranged opposite to each other on both sides of the opening. The second support part and the third support part are partially embedded in the embedding grooves, and there is a gap between the first support part and the mainboard.

[0033] From the above technology, it can be known that the present application provides an electronic device, including a back cover, a main board and a camera module. The back cover and the main board are arranged relative to each other, the main board includes an opening, and the camera module includes an imaging component and a signal transmission component. Among them, the first part of the imaging component is arranged on the main board facing the back cover, the second part of the imaging component extends toward the opening, the signal transmission component is arranged on the main board facing the back cover, and the imaging component and the signal transmission component are connected through a flexible circuit board. The electronic device provided by the present application has an opening on the main board, and the imaging component can partially extend into the opening, so that the internal assembly structure of the electronic device is more reasonable, and the volume of the electronic device is reduced by reducing the thickness of the electronic device. BRIEF DESCRIPTION OF THE DRAWINGS

[0034] In order to more clearly illustrate the technical solution of the present application, the following is a brief introduction to the drawings required for use in the embodiments. Obviously, for ordinary technicians in this field, other drawings can be obtained based on these drawings without any creative work.

[0035] Figure 1 This is a schematic diagram of the structure of a current electronic device;

[0036] Figure 2 A schematic diagram of the assembly structure of a periscope camera module inside an electronic device;

[0037] Figure 3 This is a schematic diagram of a partial structure of a periscope camera module;

[0038] Figure 4 A schematic diagram of the assembly structure of a camera module inside an electronic device provided in some embodiments of the present application;

[0039] Figure 5 A schematic diagram of the structure of the mainboard provided in some embodiments of this application;

[0040] Figure 6 A schematic diagram of the assembly structure of a camera module inside an electronic device provided in some embodiments of the present application;

[0041] Figure 7 A schematic diagram of the assembly structure of a camera module inside an electronic device provided in some embodiments of the present application;

[0042] Figure 8 A schematic structural diagram of the second structural portion provided in some embodiments of the present application;

[0043] Figure 9 A schematic diagram of the assembly structure of a camera module inside an electronic device provided in some embodiments of the present application;

[0044] Figure 10 A schematic diagram of the second surface structure of a decorative element provided in some embodiments of the present application;

[0045] Figure 11 A schematic diagram of the assembly structure of a camera module inside an electronic device provided in some embodiments of the present application;

[0046] Figure 12 A schematic structural diagram of the second structural portion provided in some embodiments of the present application;

[0047] Figure 13 A schematic three-dimensional cross-sectional view of a decorative element provided in some embodiments of the present application;

[0048] Figure 14 A schematic diagram of the internal assembly structure of an electronic device provided in some embodiments of this application;

[0049] Figure 15 A schematic diagram of the internal assembly structure of an electronic device provided in some embodiments of this application;

[0050] Figure 16 A schematic diagram of the internal assembly structure of an electronic device provided in some embodiments of this application;

[0051] Figure 17 A schematic diagram of the three-dimensional assembly structure inside an electronic device provided in some embodiments of this application;

[0052] Figure 18 A schematic diagram of the internal assembly structure of an electronic device provided in some embodiments of this application;

[0053] Figure 19 A schematic diagram of the three-dimensional assembly structure inside an electronic device provided in some embodiments of this application;

[0054] Figure 20 A schematic diagram of the three-dimensional assembly structure inside an electronic device provided in some embodiments of this application;

[0055] Figure 21 A schematic diagram of the three-dimensional assembly structure inside an electronic device provided in some embodiments of this application;

[0056] Figure 22 A schematic diagram of the internal assembly structure of an electronic device provided in some embodiments of this application;

[0057] Figure 23 A schematic diagram of the exploded structure between the support sheet and the main board provided in some embodiments of the present application;

[0058] Figure 24 A schematic diagram of the exploded structure between the support sheet and the main board provided in some embodiments of the present application;

[0059] Figure 25 A schematic structural diagram of a support sheet provided in some embodiments of this application;

[0060] Figure 26 This is a schematic structural diagram of the support sheet provided in some embodiments of this application.

[0061] Illustration:

[0062] Among them, 1-back cover; 2-mainboard; 3-periscope camera module; 4-lens hole; 5-camera module; 6-decorative part; 7-sealing ring; 8-fixing frame; 9-positioning bolt; 11-support plate; 21-opening; 22-embedding slot; 31-lens protection plate; 32-prism; 33-lens barrel; 34-photosensitive element; 35-connector; 36-lens assembly; 37-module substrate; 38-flexible circuit board; 51-imaging component; 52-signal transmission component; 53-support frame; 61-connection platform ;62-storage table;63-second surface;81-first connector;82-second connector;111-first supporting portion;112-second supporting portion;113-third supporting portion;114-window;311-first side surface;312-second side surface;321-first light-transmitting surface;322-second light-transmitting surface;323-reflecting surface;331-first structural portion;332-second structural portion;333-first surface;334-second groove;511-first part;512-second part. DETAILED DESCRIPTION

[0063] The following embodiments are described in detail, with examples illustrated in the accompanying drawings. When the following description refers to the drawings, identical numbers in different figures represent identical or similar elements unless otherwise indicated. The embodiments described in the following embodiments are not intended to represent all possible implementations consistent with the present application. They are merely examples of systems and methods consistent with certain aspects of the present application, as detailed in the claims.

[0064] Figure 1 This is a structural diagram of a current electronic device. Figure 2 The figure is a schematic diagram of the internal assembly structure of the electronic device. Figure 1 and Figure 2 As shown, the electronic device may include a back cover 1, a mainboard 2, and a periscope camera module 3. The periscope camera module 3 is an image input device and a crucial electronic component for image capture. The periscope camera module 3 may include a lens protection sheet 31, a prism 32, a lens barrel 33, a photosensitive element 34, a connector 35, a lens assembly 36, and a module substrate 37.

[0065] The back cover 1 includes at least one lens hole 4, into which a lens protection sheet 31 can be embedded. The lens protection sheet 31 is made of a translucent material to allow ambient light to pass through and prevent dust from entering the interior of the electronic device. The lens protection sheet 31 includes a first side 311 and a second side 312. The first side 311 is the side of the lens protection sheet 31 facing the exterior of the electronic device, and the second side 312 is the side of the lens protection sheet 31 facing the interior of the electronic device. Light L1 enters the lens protection sheet 31 from the first side 311 and exits the lens protection sheet 31 from the second side 312, entering the interior of the electronic device. The lens barrel 33 is arranged parallel to the main board 2 and between the main board 2 and the lens protection sheet 31. More specifically, a broken wall structure is provided on the side of the lens barrel 33 close to the lens hole 4 so that the light L1 can enter the inside of the lens barrel. The prism 32 is fixed at one end of the lens barrel 33 and is located at the bottom of the broken wall structure of the lens barrel 33. The light L1 can enter the prism 32 from the broken wall structure of the lens barrel 33. The photosensitive element 34 is fixed at the other end of the lens barrel 33. The lens assembly 36 is arranged in the lens barrel 33 and is located between the prism 32 and the photosensitive element 34. The photosensitive element 34 is fitted on the module substrate 37. The module substrate 37 is connected to the connector 35 set on the main board 2 through a flexible circuit board.

[0066] Figure 3 This is a partial structural diagram of a periscope camera module, see Figure 2 and Figure 3 The prism 32 in the electronic device may be a triangular prism, including a first light-transmitting surface 321, a second light-transmitting surface 322, and a reflective surface 323. The first light-transmitting surface 321 is the surface of the prism 32 facing the photosensitive element 34, and the second light-transmitting surface 322 is the surface of the prism 32 facing the lens protection sheet 31. The second light-transmitting surface 322 is arranged parallel to the lens protection sheet 31. More specifically, the photosensitive element 34 is provided with a photosensitive pixel block for receiving light signals, and the first light-transmitting surface 321 is arranged opposite the side of the photosensitive element 34 provided with the photosensitive pixel block.

[0067] After the light L1 passes through the second side surface 312, it passes through the opening on the lens barrel 33 to reach the second light-transmitting surface 322, and is emitted from the second light-transmitting surface 322. After reaching the reflective surface 323, it is reflected, and the direction of the light path changes. It passes through the first light-transmitting surface 321, passes through the lens assembly 36 and reaches the photosensitive element 34. The photosensitive element 34 can realize the conversion of optical signals into electrical signals. The photosensitive element 34 can transmit the converted electrical signals to the module substrate 37. The module substrate 37 transmits the electrical signals to the connector 35 through the flexible circuit board 38, and then the connector 35 transmits the electrical signals to the main board. The main board can process the received electrical signals to generate an electronic image.

[0068] However, the assembly structure of the above-mentioned periscope camera module 3 inside the electronic device will cause the thickness of the electronic device to be larger, thereby making the volume of the electronic device larger. In order to reduce the volume of the electronic device, an embodiment of the present application provides an electronic device, which includes but is not limited to mobile phones, tablet computers, aerial photography aircraft, smart wearable devices, etc. The electronic device reduces the thickness of the electronic device by improving the assembly structure of its internal camera module, thereby reducing the volume of the electronic device and making the electronic device more miniaturized and compact.

[0069] Figure 4 This is a schematic diagram of the assembly structure of a camera module inside an electronic device provided in some embodiments of this application. Figure 4 As shown, the electronic device includes a back cover 1 , a camera module 5 , a lens protection sheet 31 and a mainboard 2 . The camera module 5 includes an imaging component 51 and a signal transmission component 52 .

[0070] The back cover 1 is an external component of the electronic device, used to protect the internal components of the electronic device. The back cover 1 can cover components such as the battery of the electronic device. The back cover 1 can be made of plastic. The good ductility of plastic is conducive to the shaping and production of the back cover 1, and thus facilitates the mass production of the back cover 1. In addition, the specific material of the back cover 1 can also be set according to different situations. For example, in other implementations, the back cover 1 can also be made of metal materials such as aluminum and iron. Metal materials such as aluminum and iron have good hardness and are conducive to protecting the internal components of the electronic device. The specific material of the back cover 1 is not limited here.

[0071] Further Figure 1 and Figure 4 As shown, the back cover 1 includes at least one lens hole 4, which can be located at the upper left, upper right, or any other position of the back cover 1, and is not limited to this embodiment of the present application. A lens protection sheet 31 can be installed in the lens hole 4 to prevent external dust from entering the interior of the electronic device.

[0072] In one implementation, the mainboard 2 and the back cover 1 are arranged relative to each other. Figure 5 This is a schematic diagram of the structure of the motherboard provided in some embodiments of this application, such as Figure 5 As shown, the main board 2 includes an opening 21, which is a hollow structure located in the middle of the main board 2. It should be noted that the size of the opening 21 and the position on the main board can be set according to actual needs, and the specific size of the opening and the specific position on the main board are not limited here.

[0073] Further Figure 4As shown, in one implementation, a decorative piece 6 is provided on the edge of the lens aperture 4. The decorative piece 6 is a hollow annular structure, and the outer diameter of the decorative piece 6 is the same as the inner diameter of the lens aperture 4, so that the decorative piece 6 and the lens aperture 4 can be sealed together to prevent external dust from entering the interior of the electronic device. The outer wall of the decorative piece 6 is provided with a connecting platform 61. The outer ring of the connecting platform 61 is sealedly connected to the inner ring of the decorative piece 6. The connecting platform 61 is provided on the inner side of the back cover 1 to fix the decorative piece 6 in the lens aperture 4. More specifically, the connecting platform 61 can be attached to the inner side of the back cover 1 by bonding, welding, clamping, etc., thereby fixing the decorative piece 6 in the lens aperture 4.

[0074] In one implementation, a first groove is provided on the inner wall of the decorative piece 6 , the lens protection sheet 31 is located inside the decorative piece 6 , and the edge of the lens protection sheet 31 is embedded in the first groove.

[0075] In one implementation, a storage platform 62 is provided on the inner wall of the decorative element 6. This platform 62 is a hollow, ring-shaped structure, with its outer ring sealed to the inner ring of the decorative element 6. The storage platform 62 is used to secure the lens protection sheet 31. The lens protection sheet 31 is bonded to the surface of the storage platform 62 facing away from the mainboard 2. The distance between the surface of the storage platform facing away from the mainboard and the surface of the decorative element facing away from the mainboard is greater than or equal to the thickness of the lens protection sheet.

[0076] Further Figure 4 As shown, the imaging component 51, the signal transmission component 52, and the main board 2 are all located inside the electronic device. Specifically, the first portion 511 of the imaging component 51 is disposed on the main board 2 facing the rear cover 1 and is disposed opposite the lens protection sheet 31, while the second portion 512 extends toward the opening 21. The signal transmission component 52 is disposed on the main board 2 and is located between the rear cover 1 and the main board 2. It is connected to the imaging component 51 via the flexible circuit board 38. In this application, the specific location of the signal transmission component 52 is not particularly limited, as long as it is disposed on the main board 2 and can be connected to the imaging component 51 via the flexible circuit board 38 to meet normal signal transmission functions. For example, the signal transmission component 52 can be disposed on both sides of the opening opposite the first portion 511 of the imaging component 51.

[0077] The first portion 511 of the imaging assembly 51 includes a prism 32 , and the second portion 512 of the imaging assembly 51 includes a lens barrel 33 , a lens assembly 36 , a photosensitive element 34 and a module substrate 37 .

[0078] like Figure 6 As shown, Figure 6Schematic diagram of an assembly structure of a camera module inside an electronic device provided by some embodiments of the present application. The prism 32 and the lens protective sheet 31 are oppositely arranged on the main board 2. The prism 32 includes a first light-transmitting surface 321, a second light-transmitting surface 322 and a reflecting surface 323. The first light-transmitting surface 321 is the surface on one side of the prism 32 connected to the second part of the imaging component 51. One end of the lens barrel is hermetically connected to the first light-transmitting surface of the prism, and the other end of the lens barrel 33 is hermetically connected to one side of the photosensitive element 34 facing the prism 32. Specifically, the first light-transmitting surface 321 can be hermetically connected to one end of the lens barrel 33 by means of bonding, welding, clamping, etc.

[0079] It should be noted that, in one example, the prism 32 is a triangular prism, but in other embodiments, the prism 32 can also be a polygonal prism 32, and the specific type of the prism 32 is not limited herein.

[0080] Furthermore, the prism 32 can be made of quartz glass. Quartz glass has high hardness and high transparency, which is beneficial to improving the wear resistance and optical performance of the prism 32. The prism 32 can also be made of optical glass, alkali metal halide (such as sodium bromide) crystals and other materials. Specifically, the specific material of the prism 32 can be set according to different situations, and the material of the prism 32 is not limited herein.

[0081] The lens barrel 33 includes a first structural part 331 and a second structural part 332. Both the first structural part 331 and the second structural part 332 are hollow structures and have the same inner diameter. One end of the first structural part 331 is hermetically connected to the first light-transmitting surface 321, and the other end is hermetically connected to one end of the second structural part 332. The other end of the second structural part 332 extends in the direction close to the signal transmission component 52.

[0082] In one implementation, further as Figure 4 shown, there is a gap between the prism 32 and the edge of the opening 21. The first structural part 331 is parallel to the main board 2, and the first structural part 331 is arranged between the prism 32 and the edge of the opening 21. The end of the first structural part 331 far from the prism 32 is coplanar with the edge of the opening 21. One end of the second structural part 332 is hermetically connected to the first structural part 331, and the other end extends in the direction away from the rear cover 1 of the opening 21.

[0083] In one implementation, the connection between the prism 32 and the first structural part 331 can also be located at the edge of the opening 21. The first structural part 331 is inclined with respect to the main board 2 and extends in the direction away from the rear cover 1 of the opening 21. The first structural part 331 has an included angle A with respect to the main board 2, 0° < A < 90°, so that the other end of the second structural part 332 is located in the opening 21 of the main board 2.

[0084] Further as Figure 6As shown, in one implementation, the end of the second structure portion 332 away from the first structure portion 331 can partially or completely pass through the opening 21 of the main board 2. The distance that the second structure portion 332 extends along the bending direction can be set based on the size of the opening 21 on the main board 2 and actual needs without affecting light propagation. The specific distance that the second structure portion 332 extends along the bending direction is not limited herein.

[0085] The technical solution provided in the embodiments of the present application is conducive to reducing the thickness of electronic devices. Specifically, if the distance between the highest point and the lowest point of the cross-section where the top of the second structural part is located in the direction perpendicular to the horizontal plane is defined as S1, then S1 is the thickness of the electronic device that can be reduced (that is, the distance that the shell can sink).

[0086] It should be noted that the thickness S1 that can be reduced by the electronic device (ie, the distance S1 that the housing can sink) is a limit distance, and in practical applications, it can be achieved by adjusting the angle of A or the like.

[0087] See further Figure 6 In one implementation, the photosensitive element 34 is arranged at one end of the second structural portion 332 away from the first structural portion 331, the lens assembly 36 is vertically arranged in the lens barrel 33 and is located between the prism 32 and the photosensitive element 34, and the module substrate 37 is arranged on the side of the photosensitive element 34 away from the lens assembly 36.

[0088] Furthermore, the lens assembly 36 can be a lens element such as a fixed-focus lens, a telephoto lens, a wide-angle lens, etc. In specific applications, it can also be equipped with optical lenses such as filters. The lens assembly 36 can be designed with reference to the existing technology and will not be described in detail in this application.

[0089] The photosensitive element 34 includes a plurality of photosensitive pixel blocks on the side facing the first light-transmitting surface 321. Each photosensitive pixel block corresponds to three photosensitive units of red, green and blue. After the light signal reaches the photosensitive element through the lens assembly 36, it further enters the corresponding photosensitive unit. The photosensitive unit is essentially a photodiode, which can convert light signals of different intensities into electrical signals of different intensities, and use the module substrate 37 to transmit the converted electrical signals to other components.

[0090] See further Figure 6In one implementation, the imaging component 51 also includes a support frame 53, which is arranged on the main board 2 and in contact with the prism 32, and the size of the support frame 53 matches the size of the prism 32 to ensure that the support frame 53 can stably carry the prism 32. In a specific implementation, the support frame 53 can carry the prism and can also drive the movement of the prism by combining magnets, balls, etc. to achieve changes in the light path reflection position, optical image stabilization and other functions. In specific applications, the support frame can be designed with reference to the existing technology, and this application will not go into details.

[0091] Furthermore, the light L2 enters the lens protection plate 31 from the first side surface 311, passes through the lens protection plate 31 from the second side surface 312, and is incident on the second light-transmitting surface 322 of the prism 32. After reaching the reflecting surface 323, it is reflected, and the propagation direction of the light changes. It passes through the first light-transmitting surface 321, passes through the lens assembly 36 and reaches the photosensitive element 34. The photosensitive element 34 can realize the conversion of optical signals into electrical signals. The photosensitive element 34 can transmit the converted electrical signals to the module substrate 37. The module substrate 37 transmits the electrical signals to the signal transmission component 52 through the flexible circuit board 38, and then the signal transmission component 52 transmits the electrical signals to the main board. The main board can process the received electrical signals to generate electronic images.

[0092] It should be noted that the angle between the reflecting surface 323 and the first light-transmitting surface 321 is C, and the angle between the reflecting surface 323 and the second light-transmitting surface 322 is B. The sizes of the angles B and C need to be set according to the refractive index of the selected prism 32. After the light reaches the reflecting surface 323 and is reflected, the angle at which the light is expected to be deflected relative to the horizontal plane is set. The sizes of the angles B and C are not limited here.

[0093] Figure 7 This is a schematic diagram of the internal assembly structure of an electronic device provided in some embodiments of this application. Figure 8 This is a schematic diagram of the structure of the second structural part provided in some embodiments of the present application. In one implementation, as Figure 7 and Figure 8 As shown, the second structural portion 332 also includes a first surface 333, which is the bottom plane of the second structural portion 332 away from the lens protection sheet 31. The first surface 333 is parallel to the main board 2, so as to further reduce the thickness of the electronic device by reducing the distance S2 from the first surface 333 of the second structural portion 332 to the top section of the second structural portion 332.

[0094] Figure 9 This is a schematic diagram of the internal assembly structure of an electronic device provided in some embodiments of this application. Figure 10 This is a schematic diagram of the structure of the decorative parts provided in some embodiments of this application. In one implementation, Figure 9 and Figure 10 As shown, the decorative member 6 also includes a second surface 63, which is the surface of the decorative member 6 facing the second structural portion 332 and has the same curvature as the second structural portion 332, so as to further reduce the thickness of the electronic device by reducing the distance between the lens protection sheet 31 and the prism 32.

[0095] Figure 11 This is a schematic diagram of the internal assembly structure of an electronic device provided in some embodiments of this application. Figure 12 This is a schematic diagram of the structure of the second structural part provided in some embodiments of this application. In one implementation, Figure 11 and Figure 12 As shown, the second structural portion 332 also includes a second groove 334, which is located at the contact point between the second structural portion 332 and the decorative member 6, so that the decorative member 6 is partially embedded in the second groove 334, and the thickness of the electronic device is further reduced by reducing the distance between the lens protection sheet 31 and the prism 32.

[0096] It should be noted that the present application does not impose any specific restrictions on the position, shape and size of the second groove 334. As long as the shape and size of the second groove 334 match the shape and size of the contact point between the decorative part 6 and the second structural part 332, so that the decorative part 6 can be partially embedded in the groove, this application will not elaborate on it.

[0097] Figure 13 is a three-dimensional cross-sectional schematic diagram of a decorative part provided in some embodiments of this application, such as Figure 6 and Figure 13 As shown, in one implementation, the connecting platform 61 surrounds the decorative member 6 for connecting the decorative member 6 and the back cover 1 , and the storage platform 62 can be distributed in a stepped manner on the inner wall of the decorative member for placing the lens protection sheet 31 .

[0098] In one implementation, Figure 14 As shown, a sealing ring 7 is further provided between the prism 32 and the lens protection sheet 31. The sealing ring 7 is a hollow annular structure, and the cross-sectional shape of the sealing ring 7 matches the shape of the second light-transmitting surface 322 of the prism 32. For example, the second light-transmitting surface 322 can be a rectangle, and the sealing ring 7 can be a cube or a cuboid, forming a hollow cavity inside, and the cross-sectional shape of the sealing ring 7 is the same rectangle as the second light-transmitting surface 322. Alternatively, the second light-transmitting surface 322 can be a triangle, and the sealing ring 7 can be a triangular prism, forming a hollow cavity inside, and the cross-sectional shape of the sealing ring 7 is the same triangle as the second light-transmitting surface 322. In specific applications, the sealing ring 7 can be made of a material such as foam, rubber, or silicone, and is used to protect the prism 32 and prevent external moisture or dust from adhering to the surface of the prism 32 and affecting the light transmission and reflection capabilities of the prism 32.

[0099] The sealing ring 7 surrounds the edge of the second light-transmitting surface 322 of the prism 32 and is in close contact with the prism 32 and the lens protection sheet 31 . Specifically, the sealing ring 7 can be bonded between the prism 32 and the lens protection sheet 31 .

[0100] Figure 15 This is a schematic diagram of the internal assembly structure of an electronic device provided in some embodiments of this application, such as Figure 15 As shown, in one implementation, the storage platform 62 can extend toward the center of the decorative component 6 until it reaches one side of the edge of the second light-transmitting surface 322. In order to protect the prism 32 and prevent external moisture or dust and other substances from adhering to the surface of the prism 32, thereby affecting the light transmittance and reflection capabilities of the prism 32, a sealing ring 7 can be provided between the prism 32 and the storage platform 62. The sealing ring 7 is a hollow annular structure, and the shape of the sealing ring 7 matches the shape of the second light-transmitting surface 322. For example, the second light-transmitting surface 322 can be a rectangle, then the sealing ring 7 can be a cube or a cuboid, forming a hollow cavity inside, and the cross-section of the sealing ring 7 is the same rectangle as the second light-transmitting surface 322. Alternatively, the second light-transmitting surface 322 can be a triangle, then the sealing ring 7 can be a triangular prism, forming a hollow cavity inside, and the cross-section of the sealing ring 7 is the same triangle as the second light-transmitting surface 322.

[0101] The sealing ring 7 is distributed at the edge of the second light-transmitting surface 322 and is in close contact with the prism 32 and the placement table 62 . Specifically, the sealing ring 7 can be bonded between the prism 32 and the placement table 62 .

[0102] Figure 16 This is a schematic diagram of the internal assembly structure of an electronic device provided in some embodiments of this application. Figure 17 This is a schematic diagram of the three-dimensional assembly structure inside the electronic device provided in some embodiments of this application, such as Figure 16 and Figure 17 As shown, in one implementation, the electronic device may further include a fixing frame 8, which wraps around the prism 32 and the support frame 53 and is fixedly connected to the mainboard to limit the position of the prism 32 and the support frame 53. Specifically, the fixing frame 8 may be fixedly connected to the mainboard 2 by bonding, welding, snapping, or the like.

[0103] Figure 18 This is a schematic diagram of the internal assembly structure of an electronic device provided in some embodiments of this application. Figure 19 This is a schematic diagram of the three-dimensional assembly structure inside the electronic device provided in some embodiments of this application, such as Figure 18As shown, in one embodiment, to facilitate the disassembly between the fixing frame 8 and the mainboard 2, the fixing frame 8 may further include a first connector 81 and a second connector 82. The first connector 81 and the second connector 82 may be an integral structure. The first connector 81 is located on the mainboard, and the prism 32 and the support frame 53 may be partially or completely embedded in the first connector 81. The second connector 82 may be a cubic structure, the length of each side of which is less than or equal to the length of the bottom side of the outer surface of one side of the first connector 81 in contact with it. The second connector 82 is located at the bottom of the outer surface of one side of the first connector 81 and is fixedly connected to the first connector 81. The second connector 82 contacts the mainboard 2, and a coaxial through-hole is provided on the second connector 82 and the mainboard 2. A positioning bolt 9 is provided in the through-hole, and the outer diameter of the positioning bolt 9 is the same as the inner diameter of the through-hole. The positioning bolt 9 is used to increase the stability of the connection between the second connector 82 and the mainboard 2, prevent relative sliding between the camera module 5 and the mainboard 2, and limit the position of the camera module 5.

[0104] Figure 20 This is a schematic diagram of the three-dimensional assembly structure inside the electronic device provided in some embodiments of this application. Figure 20 As shown, in one implementation, in order to further limit the position of the camera module 5, the first connector 81 can be fixedly connected to the two second connectors 82 respectively to form an integrated structure, and the second connector 82 is in contact with the main board 2. Specifically, the two second connectors 82 can be respectively located at the bottom of the outer surfaces on both sides opposite to each other of the first connector 81, or respectively located at the bottom of the outer surfaces on both sides adjacent to each other of the first connector 81, and each second connector 82 and the main board 2 are provided with a coaxial through-hole, and a positioning bolt 9 is provided in the through-hole, and the outer diameter of the positioning bolt 9 is the same as the inner diameter of the through-hole to increase the stability of the connection between the second connector 82 and the main board 2. It can be understood that the greater the straight-line distance between the two second connectors 82, the less likely it is that relative sliding will occur between the camera module 5 and the main board 2. In specific implementation, the position of the second connector 82 can be adjusted as needed, and this application does not impose specific restrictions.

[0105] Figure 21 This is a schematic diagram of the three-dimensional assembly structure inside the electronic device provided in some embodiments of this application, such as Figure 21As shown, in one implementation, in order to further limit the position of the camera module 5, the first connector 81 can be fixedly connected to multiple second connectors 82 respectively to form an integrated structure, and multiple second connectors 82 are in contact with the main board 2. Specifically, at least one second connector 82 is provided at the bottom of the outer surface of each side of the first connector 81, and each second connector 82 and the main board 2 are provided with a coaxial through-hole, and a positioning bolt 9 is provided in the through-hole. The outer diameter of the positioning bolt 9 is the same as the inner diameter of the through-hole to increase the stability of the connection between the second connector 82 and the main board 2. In specific implementation, the positions of these second connectors 82 can be adjusted as needed, and this application does not impose specific restrictions.

[0106] In one implementation, the inner wall of the perforation is provided with a first threaded structure, and the outer wall of the positioning bolt 9 is provided with a second threaded structure matching the first threaded structure. The positioning bolt 9 and the perforation are tightly connected through the first threaded structure and the second threaded structure, thereby increasing the stability of the connection between the second connector 82 and the main board 2.

[0107] Figure 22 This is a schematic diagram of the internal assembly structure of an electronic device provided in some embodiments of this application. Figure 23 This is a schematic diagram of the exploded structure between the support plate and the main board provided in some embodiments of this application, such as Figure 22 and Figure 23 As shown, in one implementation, the electronic device further includes a support sheet 11, and the support sheet 11 includes a first support portion 111, a second support portion 112, and a third support portion 113. The second support portion 112 and the third support portion 113 are relatively arranged on both sides of the first support portion 111, and are fixedly connected to the first support portion 111. Embedding grooves 22 are respectively provided at the portions of the main board 2 close to both sides of the opening 21. The second support portion 112 and the third support portion 113 can be partially embedded in the embedding grooves 22 by bonding, welding, snapping, etc., so that the first support portion 111 is located on the side of the main board 2 away from the back cover 1, and is spaced apart from the main board 2. The first support portion 111 can provide support for the second structural portion 332 to balance the gravity exerted on the second structural portion 332, thereby fixing the second structural portion 332.

[0108] Figure 24 The exploded structure diagram between the support plate and the main board provided in some embodiments of this application. There are many ways to set the position of the embedded slot 22, which can be as follows: Figure 25 As shown, the line connecting the center points of the two embedded slots 22 is along the long side direction of the electronic device, and can also be as shown in FIG. Figure 24As shown, the line connecting the center points of the two embedding grooves 22 is along the wide side direction of the electronic device. As long as the second support portion 112 and the third support portion 113 are embedded in the embedding groove 22, the first support portion 111 is located at the bottom of the opening 21, and the projected area of ​​the opening 21 is less than or equal to the area of ​​the surface of the first support portion 111 close to the mainboard 2.

[0109] More specifically, the support sheet 11 can be made of a plastic material. Plastic has good ductility, which facilitates the shaping and production of the support sheet 11, thereby facilitating mass production of the support sheet 11. Furthermore, the specific material of the support sheet 11 can also be set according to different circumstances. For example, in other implementations, the support sheet 11 can also be made of metal materials such as steel, iron, and alloys. Metal materials such as steel, iron, and alloys have good hardness and are conducive to providing support for the second structural portion 332. The specific material of the support sheet 11 is not limited herein.

[0110] Figure 25 This is a schematic diagram of the structure of the support sheet provided in some embodiments of this application. Figure 26 For a structural diagram of the support sheet provided in some embodiments of this application, see Figure 25 and Figure 26 In one implementation, the support sheet 11 is further provided with a window 114 to reduce the weight of the electronic device after the support sheet 11 is added. The window 114 is a multiple hole structure evenly arranged on the support sheet 11. The hole shape can be circular, square, rectangular, or any other shape. Alternatively, the window 114 is a strip-shaped hollow structure provided on the support sheet 11. It should be noted that if the window 114 is a strip-shaped hollow structure provided on the support sheet 11, the strip-shaped hollow structure should not be too large to prevent the second structural portion 332 from being completely exposed from the strip-shaped hollow structure, thereby losing its support capacity for the second structural portion 332.

[0111] From the above technology, it can be known that the present application provides an electronic device, including a back cover, a main board and a camera module. The back cover and the main board are arranged relative to each other, the main board includes an opening, and the camera module includes an imaging component and a signal transmission component. Among them, the first part of the imaging component is arranged on the main board facing the back cover, the second part of the imaging component extends toward the opening, the signal transmission component is arranged on the main board facing the back cover, and the imaging component and the signal transmission component are connected through a flexible circuit board. The electronic device provided by the present application has an opening on the main board, and the imaging component can partially extend into the opening, so that the internal assembly structure of the electronic device is more reasonable, and the volume of the electronic device is reduced by reducing the thickness of the electronic device.

[0112] Those skilled in the art will readily appreciate other embodiments of the present application after considering the specification and practicing the application disclosed herein. This application is intended to cover any variations, uses, or adaptations of the present application that follow the general principles of this application and include common knowledge or customary techniques in the art not disclosed herein. The description and examples are to be considered as exemplary only, and the true scope and spirit of the present application are indicated by the following claims.

[0113] It should be understood that the present application is not limited to the exact structures described above and shown in the drawings, and that various modifications and changes may be made without departing from the scope thereof. The scope of the present application is limited only by the appended claims.

Claims

1. An electronic device, characterized in that: Including back cover, main board and camera module; The back cover and the main board are arranged opposite to each other; the main board includes an opening; The camera module includes an imaging component and a signal transmission component; The first portion of the imaging assembly is arranged on the main board facing the rear cover, and the second portion of the imaging assembly extends toward the opening; The signal transmission component is arranged on the main board facing the back cover; The imaging component and the signal transmission component are connected via a flexible circuit board.

2. The electronic device according to claim 1, wherein The first portion of the imaging component is arranged on two sides of the opening opposite to the signal transmission component.

3. The electronic device according to claim 2, wherein: The first part of the imaging assembly includes a prism, and the second part of the imaging assembly includes a lens barrel, a photosensitive element and a module substrate; The prism includes a first light-transmitting surface, which is a surface of the prism facing the signal transmission component; One end of the lens barrel is sealed to the first light-transmitting surface of the prism, and the other end of the lens barrel extends toward the opening; The photosensitive element is arranged at the other end of the lens barrel and is sealed with the lens barrel; The module substrate is attached to one side surface of the photosensitive element, and the one side surface of the photosensitive element is the surface away from the lens barrel. The photosensitive element is connected to the signal transmission component through the flexible circuit board.

4. The electronic device according to claim 3, wherein: The lens barrel includes a first structure portion and a second structure portion, wherein the first structure portion and the second structure portion are both hollow structures and have the same inner diameter; One end of the first structural part is sealed to the first light-transmitting surface, and the other end of the first structural part is sealed to the second structural part; The second structure portion is tilted relative to the main board and extends toward the opening in a direction away from the rear cover. The angle between the second structure portion and the main board is greater than 0° and less than 90°.

5. The electronic device according to claim 4, characterized in that The connection between the prism and the first structural part is located at the edge of the opening. The first structural part is tilted relative to the mainboard and extends toward the opening away from the back cover. The angle between the first structural part and the mainboard is greater than 0° and less than 90°.

6. The electronic device according to claim 5, characterized in that The prism is spaced apart from the edge of the opening; The first structure portion is parallel to the main board and is disposed between the prism and the edge of the opening, and an end of the first structure portion away from the prism is coplanar with the edge of the opening; One end of the second structure part is sealedly connected to one end of the first structure part, and the other end extends toward the opening in a direction away from the back cover.

7. The electronic device according to claim 6, wherein: The prism further includes a second light-transmitting surface, which is a surface of the prism away from the main board; The back cover further comprises a lens hole, a lens protection sheet is arranged in the lens hole, and the lens protection sheet is arranged opposite to and parallel to the second light-transmitting surface.

8. The electronic device according to claim 7, wherein: The electronic device further comprises a decorative element and a connection platform; The decorative piece is a hollow annular structure, the outer diameter of the decorative piece is the same as the inner diameter of the lens hole, the decorative piece is embedded in the lens hole, and the lens protection sheet is fixed in the decorative piece; The connecting platform is a hollow annular structure and is arranged to fit the inner side of the rear cover. The inner ring of the connecting platform is connected to the outer ring of the decorative component.

9. The electronic device according to claim 8, wherein: The inner wall of the decorative piece is provided with a first groove, the lens protection sheet is located in the decorative piece, and the edge of the lens protection sheet is embedded in the first groove.

10. The electronic device according to claim 8, wherein Also includes storage table; The storage platform is a hollow ring structure, and the outer ring of the storage platform is connected to the inner ring of the decorative element; The lens protection sheet is adhered to the surface of the storage table away from the main board; The distance between the surface of the storage table away from the main board and the surface of the decorative component away from the main board is greater than or equal to the thickness of the lens protection sheet.

11. The electronic device according to claim 10, characterized in that The second structural part further includes a first surface, which is a bottom plane of the second structural part away from the lens protection sheet. The first surface is parallel to the main board.

12. The electronic device according to claim 10, wherein: The decorative element further includes a second surface, which is a surface of the decorative element facing the second structure portion and has the same curvature as that of the second structure portion.

13. The electronic device according to claim 10, wherein: The second structure portion further includes a second groove, and the second groove is located at a contact position between the second structure portion and the decorative element, so that the decorative element is partially embedded in the second groove.

14. The electronic device according to claim 10, wherein: The imaging assembly further includes a support frame, which is located on the main board and is used for carrying the prism.

15. The electronic device according to claim 10, wherein: The electronic device further includes a sealing ring, which surrounds the edge of the second light-transmitting surface and is bonded between the prism and the lens protection sheet.

16. The electronic device according to claim 10, wherein: The storage platform extends toward the center of the decorative component until it reaches a surface of the sealing ring that is away from the lens protection sheet and is bonded to the surface of the sealing ring that is away from the lens protection sheet.

17. The electronic device according to claim 14, wherein: The electronic device further includes a fixing frame, which is fixedly connected to the mainboard and covers around the supporting frame to limit the movement of the supporting frame.

18. The electronic device according to claim 17, wherein: The fixing frame includes a first connector and at least one second connector, the first connector and the at least one second connector are an integral structure, the first connector is wrapped around the supporting frame, and the at least one second connector is fixed to the mainboard via a positioning bolt.

19. The electronic device according to claim 1, wherein Also included is a support sheet, the support sheet including a first support portion, a second support portion, and a third support portion; The second supporting portion and the third supporting portion are relatively arranged on both sides of the first supporting portion and are fixedly connected to the first supporting portion; An embedding groove is provided on the surface of the mainboard on one side away from the back cover, and two embedding grooves are arranged opposite to each other on both sides of the opening. The second support part and the third support part are partially embedded in the embedding grooves, and there is a gap between the first support part and the mainboard.

Images