Solid state source microwave control method and microwave device

Abstract

Embodiments of the present application provide a solid-state source microwave control method and a microwave device. The solid-state source microwave control method comprises: in response to a microwave heating instruction, controlling a plurality of radiation components of the microwave device to radiate microwaves to a target object at a preset initial phase and a preset initial frequency and at a preset initial power; collecting reflected power of the target object to determine a target position corresponding to the target object; determining a target phase corresponding to each radiation component according to the target position and a set position corresponding to each radiation component, and controlling the radiation component to heat the target object at a preset heating power according to the corresponding target phase. The method can quickly locate the target position, thereby achieving accurate microwave irradiation and heating of the target object.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of intelligent control, in particular to a solid-state source microwave control method and a microwave device. BACKGROUND

[0002] Microwave heating refers to emitting microwaves to food, so that the food absorbs the energy of the microwaves and converts it into heat energy, so that the food itself is heated as a whole. Microwave heating has the characteristics of high efficiency, rapidity and uniformity. With the acceleration of people's life pace, microwave heating cooking equipment is increasingly favored by consumers.

[0003] In the existing microwave heating technology, the angle and area of microwave radiation are usually fixed, which means that the microwave field distribution inside the microwave heating cooking equipment is preset and does not change with the position and posture of the food. At this time, if the user places the food at a position deviating from the preset heating area, local overheating or incomplete heating may occur, which limits the efficiency and uniformity of microwave heating and becomes a bottleneck in starting and improving microwave heating technology. SUMMARY

[0004] The embodiments of the present application provide a solid-state source microwave control method and a microwave device to achieve the effect of precise heating according to the actual placement position of food.

[0005] In a first aspect, the embodiments of the present application provide a solid-state source microwave control method, comprising:

[0006] In response to a microwave heating instruction, a plurality of radiation components of a microwave device are controlled to radiate microwaves to a target object at a preset initial phase and a preset initial frequency with a preset initial power;

[0007] The reflected power of the target object is collected to determine the target position corresponding to the target object;

[0008] According to the target position and the setting position corresponding to each radiation component, the target phase corresponding to each radiation component is determined, and the radiation component is controlled to heat the target object with a preset heating power according to the corresponding target phase;

[0009] The preset heating power is greater than the preset initial power.

[0010] In a possible implementation, the step of controlling the plurality of radiation components of the microwave device to radiate microwaves to the target object at the preset initial phase and the preset initial frequency with the preset initial power comprises:

[0011] According to a preset phase difference and the preset initial phase, the radiation phase of each radiation component is determined;

[0012] The microwave radiations on the target object by the radiation assemblies are controlled according to the radiation phases of the radiation assemblies and the preset initial frequency and the preset initial power.

[0013] In a possible implementation, the plurality of radiation assemblies are provided with a radiation sequence in advance.

[0014] The radiation phases of the radiation assemblies are determined according to the preset phase difference and the preset initial phase.

[0015] The preset initial phase is taken as a first radiation phase corresponding to a first radiation assembly according to the radiation sequence.

[0016] A second radiation phase corresponding to a second radiation assembly in the radiation sequence is determined based on the preset phase difference and the preset initial phase, and a third radiation phase corresponding to a third radiation assembly in the radiation sequence is determined according to the radiation phase corresponding to the second radiation assembly and the preset phase difference, and so on, to determine the radiation phases corresponding to the radiation assemblies.

[0017] In a possible implementation, each of the radiation assemblies is divided into a corresponding heating area.

[0018] The reflection power of the target object is collected to determine a target position corresponding to the target object.

[0019] The reflection power of the target object under the radiation phase corresponding to each of the radiation assemblies is collected, and the reflection powers corresponding to the radiation assemblies are arranged in ascending order.

[0020] A target radiation assembly is selected from the radiation assemblies based on the arrangement order of the reflection powers, and a target position corresponding to the target object is determined based on the heating area corresponding to the target radiation assembly.

[0021] In a possible implementation, the target radiation assembly is selected from the radiation assemblies based on the arrangement order of the reflection powers.

[0022] A difference between the smallest reflection power and each of the reflection powers arranged in the front n positions is calculated.

[0023] When there is a reflection power with a difference less than a preset difference threshold, the radiation assembly corresponding to the smallest reflection power and the radiation assembly corresponding to the reflection power with the difference less than the preset difference threshold are both taken as the target radiation assembly.

[0024] When there is no reflection power with a difference less than a preset difference threshold, the radiation assembly corresponding to the smallest reflection power is taken as the target radiation assembly.

[0025] In a possible implementation, the control of the radiation assembly to perform microwave heating on the target object according to the target phase and the preset heating power includes:

[0026] controlling the target radiation assembly to perform microwave heating on the target object according to the corresponding target phase and target frequency and the preset heating power; or

[0027] controlling the target radiation assembly to perform microwave heating on the target object according to the corresponding target phase and target frequency and the preset heating power, and controlling the remaining radiation assemblies to perform microwave heating on the target object according to the preset initial phase and the target frequency and the preset initial power;

[0028] The preset heating power is greater than the preset initial power.

[0029] In a possible implementation, the step of determining the target frequency includes:

[0030] controlling the radiation assembly to perform sweep-frequency radiation on the target object according to a preset initial frequency range;

[0031] collecting the reflection power of the target object at each frequency in the preset initial frequency range to determine the target frequency corresponding to the target object.

[0032] In a possible implementation, the microwave device includes a plurality of radiation assemblies.

[0033] The control of the radiation assembly to perform sweep-frequency radiation on the target object according to a preset initial frequency range includes:

[0034] controlling a first radiation assembly to perform sweep-frequency radiation on the target object according to the preset initial power and a preset initial frequency range according to a preset arrangement order of each radiation assembly; the sweep-frequency radiation covers the entire preset heating frequency range to form a sweep-frequency cycle;

[0035] controlling a next radiation assembly to perform sweep-frequency radiation on the target object according to the preset initial power and the preset initial frequency range according to the arrangement order when a previous radiation assembly completes half of the sweep-frequency cycle.

[0036] In a possible implementation, the collection of the reflection power of the target object at each frequency in the preset initial frequency range to determine the target frequency corresponding to the target object includes:

[0037] According to any one of the radiation assemblies, after the sweep frequency cycle is completed, the reflection power of the target object at each frequency in the preset initial frequency range is collected;

[0038] Based on the reflection power of the target object at each frequency in the preset initial frequency range of each radiation assembly, the frequency corresponding to the minimum reflection power is screened out as the target frequency corresponding to the target object.

[0039] In a possible implementation, the method further includes:

[0040] In the process of microwave heating, according to a preset period, each radiation assembly is controlled to perform sweep frequency radiation on the target object according to the preset initial frequency range and the preset initial phase, and the reflection power of the target object at each frequency in the preset frequency range is collected again;

[0041] According to the re-collected reflection power, the target frequency is updated, so that each radiation assembly performs microwave heating on the target object according to the updated target frequency and the target phase corresponding to the radiation assembly and the preset heating power.

[0042] In a possible implementation, the determination of the target phase corresponding to each radiation assembly according to the target position and the set position corresponding to the radiation assembly includes:

[0043] According to the target position and the set position corresponding to the radiation assembly, the distance between each radiation assembly and the target object is determined;

[0044] Based on the distance between each radiation assembly and the target object and the preset initial frequency, the target phase difference between any two of the radiation assemblies is determined;

[0045] The preset initial phase is taken as the target phase corresponding to any one of the radiation assemblies, and based on the target phase difference between this radiation assembly and any other radiation assembly and the preset initial phase, the target phase corresponding to each of the other radiation assemblies is determined.

[0046] In a second aspect, the embodiments of the present application provide a microwave device, including a shell, a microwave control device and a solid-state source arranged on the shell, and a radiation assembly arranged in an internal cavity of the shell;

[0047] The microwave control device is connected with the solid-state source and the radiation assembly respectively;

[0048] The solid-state source is connected with the radiation assembly:

[0049] The microwave control device is used to determine the target phase corresponding to the radiation assembly by using the solid-state source microwave control method in the first aspect and various possibilities of the first aspect;

[0050] The solid-state source is used to generate the corresponding microwave based on the target phase;

[0051] The radiation assembly is used to radiate the microwave to the target object to microwave heat the target object placed in the cavity.

[0052] The solid-state source microwave control method and the microwave device provided by the embodiments of the present application can first radiate the microwave to the target object at low power after receiving the microwave heating instruction, so that the target position can be quickly located by using the reflected power in a state of consuming less power, so that accurate microwave irradiation and heating of the target object can be realized, and blind or excessive heating can be avoided. Based on the target position of the target object, the target phase of the radiation assembly is further determined in the microwave heating process, and the target object is heated by microwave based on the target phase, so that the microwave device can control the radiation assembly to radiate the microwave at the best phase, and the microwave heating efficiency is improved. BRIEF DESCRIPTION OF DRAWINGS

[0053] The accompanying drawings, which are incorporated in and constitute a part of the specification, illustrate embodiments consistent with the present application and, together with the description, serve to explain the principles of the application.

[0054] Figure 1 The rear view structure schematic diagram of the microwave device provided by the present application;

[0055] Figure 2 The structure schematic diagram of the internal cavity of the microwave device provided by the present application;

[0056] Figure 3 The flowchart of the solid-state source microwave control method provided by the present application;

[0057] Figure 4 When the microwave device provided by the present application is provided with radiation assemblies A and B, the schematic diagram of the heating area corresponding to the radiation assembly;

[0058] Figure 5 When the microwave device provided by the present application is provided with radiation assemblies A and B, the schematic diagram of the distance between the radiation assembly and the target object;

[0059] Figure 6 The structure schematic diagram of the solid-state source microwave control device provided by the present application;

[0060] Figure 7 The structure schematic diagram of the electronic device provided by the present application.

[0061] The specific embodiments of the application will be described with reference to the accompanying drawings. These drawings and the associated description herein are not meant to impose limitations on the scope of the application, but are intended to explain how to make and use the application by way of example. DETAILED DESCRIPTION

[0062] In order to make the objects, technical solutions and advantages of the embodiments of the present application clearer, the technical solutions in the embodiments of the present application will be described clearly and completely below with reference to the drawings in the embodiments of the present application. Obviously, the described embodiments are only some of the embodiments of the present application, but not all the embodiments. Based on the embodiments in the present application, all other embodiments made by those of ordinary skill in the art according to the idea of the present application belong to the scope of protection of the present application.

[0063] The terms "first", "second", "third", "fourth" and the like in the description and claims of the present application and above drawings (if any) are used to distinguish similar objects, and do not necessarily indicate a specific order or sequence. It should be understood that the data thus used can be interchanged under appropriate circumstances, so that the embodiments of the present application described herein can be implemented in other than the order illustrated or described herein. In addition, the terms "comprise" and "have" and any variations thereof are intended to cover non-exclusive inclusion, for example, a process, method, system, product or device that includes a list of steps or units does not necessarily limit those steps or units to those clearly listed, but can include other steps or units not clearly listed or inherent to such processes, methods, products or devices.

[0064] As shown in Figure 1 , 2 The embodiments of the present application provide a microwave device 100, which comprises a shell 110, a microwave control device 120 and a solid-state source 130 arranged on the shell 110, and a radiation assembly 140 arranged in an internal cavity of the shell 110.

[0065] The microwave control device 120 is connected with the solid-state source 130 and the radiation assembly 140 respectively, and the solid-state source 130 is connected with the radiation assembly 140.

[0066] The microwave control device 120 generates a microwave generation command based on a preset initial phase, preset initial frequency, and preset initial power, and sends it to the solid-state source 130 and the radiation component 140. The solid-state source 130 generates microwaves according to the preset initial phase, preset initial frequency, and preset initial power carried in the microwave generation command upon receiving it; and stops generating microwaves upon receiving a stop generation command from the microwave control device 120. The radiation component 140 modulates the frequency and phase of the microwaves generated by the solid-state source 130 according to the preset initial phase, preset initial frequency, and preset initial power carried in the microwave generation command, and radiates the modulated microwaves into the internal cavity of the housing 110 to microwave-heat a target object placed inside the internal cavity; it also collects the reflected power of the microwaves emitted by the radiation component 140 from the target object and sends the reflected power to the microwave control device 120 so that the microwave control device 120 determines the target position corresponding to the target object based on the reflected power.

[0067] The target object can be food that the user places inside the cavity to be heated.

[0068] It should be noted that microwave device 100 can be a kitchen appliance that uses microwave heating to heat food, such as a microwave oven, a microwave-grill combination appliance, or a microwave-steam-grill combination appliance.

[0069] The housing 110 has an opening on which a door is installed. The housing 110 can be connected to one side of the door via a hinge structure, allowing the door to rotate freely within a certain angle. The housing 110 can also be connected to the other side of the door via a door lock device. When the housing 110 is connected to the other side of the door, the opening on the housing 110 is closed, and the internal cavity of the housing 110 forms a sealed space. When the housing 110 is not connected to the other side of the door, the opening on the housing 110 is open, and the user can place or retrieve food in the internal cavity of the housing 110 through the open opening.

[0070] like Figure 1 As shown, the microwave control device 120 and the solid-state source 130 can be disposed adjacently on the first end face of the housing 110, and the first end face is disposed opposite to the opening on the housing 110. Specifically, the microwave control device 120 and the solid-state source 130 can be disposed on the outer surface of the first end face, and the microwave control device 120 and the solid-state source 130 can be pre-integrated into the same housing.

[0071] like Figure 2 As shown, multiple radiating components 140 can be disposed on the second end face of the housing 110, where the second end face may refer to the upper end face of the housing 110 in the height direction. As an example, the radiating component 140 may be an antenna transmitter.

[0072] As an example, the microwave device 100 is also provided with a coaxial cable 150. As shown, a through hole 111 can be formed on the first end face, one end of the coaxial cable 150 is connected to the radiation assembly 140 arranged on the second end face, and the other end of the coaxial cable 150 passes through the through hole 111 and is connected to the solid-state source 130 arranged on the outer surface of the first end face, so as to realize the connection between the radiation assembly 140 and the solid-state source 130, and the coaxial cable 150 is used to transmit the microwaves generated at the solid-state source 130 to the radiation assembly 140. Figure 1

[0073] In an embodiment, the microwave device 100 can also be provided with a timing device, which can be arranged, for example, on the outer surface of the first end face and connected to the microwave control device 120. The timing device can start timing when receiving a timing instruction sent by the microwave control device 120, and stop timing when the timing reaches a target time length corresponding to the timing instruction, and generate a stop instruction sent to the microwave control device 120. After receiving the stop instruction, the microwave control device 120 can generate a stop generation instruction and send it to the solid-state source 130 to control the solid-state source 130 to stop generating microwaves. The timing of the timing device can be used to indicate the time length of the continuous generation of microwaves by the solid-state source 130, or the time length of the microwave radiation by the radiation assembly 140.

[0074] In an embodiment, the microwave device 100 can also be provided with a weighing device, which can be arranged, for example, on the third end face. The third end face can refer to the lower end face of the housing 110 in the height direction, and the third end face is arranged opposite to the second end face. The weighing device is connected to the microwave control device 120. In this embodiment, the food to be heated can be placed on the weighing device. The weighing device is used to weigh the food to be heated carried thereby to obtain a corresponding weight parameter, and then the weighing device can send the weight parameter to the microwave control device 120, so that the microwave control device 120 generates a target frequency and a target phase according to the weight parameter.

[0075] In an embodiment, a solid-state source microwave control method is provided. In this embodiment, the solid-state source microwave control method is applied to the microwave control device in the microwave device described above, as shown in Figure 3 The solid-state source microwave control method comprises the following steps:

[0076] Step 302, in response to a microwave heating instruction, controlling a plurality of radiation assemblies of a microwave device to radiate microwaves to a target object at a preset initial phase and a preset initial frequency with a preset initial power.

[0077] The microwave heating instruction refers to an instruction to radiate microwaves to food to be heated to heat the food.

[0078] ​The microwave heating instruction can be generated by the user through a control panel pre-integrated on the microwave device. The control panel can be provided with a mechanical knob, a button or a touch screen. The user can rotate the mechanical knob, press the button or click the virtual button on the touch screen to generate the microwave heating instruction.

[0079] In this embodiment, the microwave control device can generate a corresponding microwave generation instruction according to the preset initial frequency, the preset initial phase and the preset initial power, and send it to the solid-state source and the radiation assembly in the microwave device. The solid-state source generates a corresponding microwave according to the preset initial frequency, the preset initial phase and the preset initial power of the microwave generation instruction. The radiation assembly adjusts the frequency and phase of the microwave generated by the solid-state source according to the preset initial frequency, the preset initial phase and the preset initial power of the microwave generation instruction, and radiates it to the target object placed in the internal cavity of the microwave device to radiate the target object with microwave.

[0080] Further, the target object placed in the internal cavity of the microwave device can absorb part of the microwave and reflect the remaining microwave back. After receiving the reflected microwave, the radiation assembly can send it to a power meter arranged on the microwave device to measure the reflected power of the reflected microwave. The power meter is connected to the microwave control device and can send the obtained reflected power to the microwave control device.

[0081] Step 304: Collect the reflected power of the target object to determine the target position corresponding to the target object.

[0082] In the microwave heating scene, the smaller the reflected power is, the more energy is usually transmitted to the target object, i.e. the more microwave the target object absorbs, which can be used as a basis for positioning the target object.

[0083] As an example, when multiple radiation assemblies are arranged on the microwave device, different radiation assemblies can radiate microwaves and collect reflected power. The microwave control device can sort the reflected power collected by each radiation assembly in ascending order and select the radiation area of the radiation assembly corresponding to the smallest reflected power as the target position corresponding to the target object.

[0084] Step 306: determining the target phase corresponding to each radiation component according to the target position and the set position corresponding to each radiation component, and controlling the radiation component to perform microwave heating on the target object according to the corresponding target phase.

[0085] When there are multiple radiation components in the microwave device, in order to improve the distribution state of the microwave field in the internal cavity of the microwave device and improve the heating uniformity of the microwave device, the phases of the microwaves emitted by different radiation components can be adjusted to make the microwaves emitted by different radiation components have phase differences, and finally the microwaves radiated into the internal cavity can be radiated to the surface of the target object at different angles, so that the microwaves form more complex reflection and interference modes in the internal cavity, and the microwave heating efficiency is improved.

[0086] It should be noted that in step 306, the microwave control device can control the radiation component to perform microwave heating on the target object at a preset heating power according to the target phase and the target frequency corresponding to the radiation component. The preset heating power is greater than the preset initial power. It can be understood that the microwave control device can control the radiation component to perform microwave radiation in step 302 at a low power, and control the radiation component to perform microwave heating in step 306 at a high power.

[0087] The solid-state source microwave control method provided by the embodiment can first perform low-power microwave radiation on the target object after receiving the microwave heating instruction, so that the target position can be quickly located by using reflected power in a state of consuming less power, so that accurate microwave irradiation and heating on the target object can be realized, and blind or excessive heating can be avoided. Based on the target position of the target object, the target phase of the radiation component is further determined in the microwave heating process, and the target object is heated based on the target phase, so that the microwave device can control the radiation component to radiate microwaves at the best phase. When there are multiple radiation components, the microwaves radiated into the internal cavity of the microwave device can be radiated to the surface of the target object at different angles, so that the microwaves form more complex reflection and interference modes in the internal cavity, and the microwave heating efficiency is improved.

[0088] In some optional embodiments, step 302 includes:

[0089] determining the radiation phase of each radiation component according to the preset phase difference and the preset initial phase;

[0090] controlling each radiation component to perform microwave radiation on the target object at a preset initial power according to the radiation phase of each radiation component and the preset initial frequency.

[0091] As an example, when the microwave device has two radiation components A and B, the preset phase difference can be 180°, and the preset initial phase can be 0°, which means that when the radiation phase of the radiation component A is 0°, the radiation phase of the radiation component B is 180°.

[0092] Specifically, in an embodiment, the plurality of radiation components are pre-provided with a radiation sequence;

[0093] According to the preset phase difference and the preset initial phase, the step of determining the radiation phase of each radiation component comprises:

[0094] According to the radiation sequence, the preset initial phase is taken as the first radiation phase corresponding to the first radiation component; based on the preset phase difference and the preset initial phase, the second radiation phase corresponding to the second radiation component in the radiation sequence is determined, and the third radiation phase corresponding to the third radiation component in the radiation sequence is determined according to the radiation phase corresponding to the second radiation component and the preset phase difference, and so on, to determine the radiation phase corresponding to each radiation component.

[0095] As an example, when the microwave device has three radiation components A, B and C, the preset phase difference is 120°, the preset initial phase is 0°, and the radiation sequence of the radiation components A, B and C is A, B, C, which means that the first radiation phase of the radiation component A is the preset initial phase 0°, and the second radiation phase of the radiation component B is determined based on the radiation phase 0° of the radiation component A and the preset phase difference 120°, and the third radiation phase of the radiation component C is determined based on the radiation phase 120° of the radiation component B and the preset phase difference 120°.

[0096] Then in the embodiment, the microwave control device can generate corresponding microwave generation instructions according to the radiation phase corresponding to each radiation component and the preset initial frequency and the preset initial power, and send them to the solid-state source and the corresponding radiation component in the microwave device, so that the solid-state source generates corresponding microwaves according to the radiation phase corresponding to each radiation component and the preset initial frequency and the preset initial power, and each radiation component adjusts the frequency and phase of the microwaves generated by the solid-state source according to the corresponding radiation phase and the preset initial frequency and the preset initial power, and then radiates them to the target object placed in the internal cavity of the microwave device, so as to radiate microwaves to the target object. It should be noted that the solid-state source can also generate microwaves corresponding to each radiation component according to the radiation sequence, according to the radiation phase corresponding to each radiation component and the preset initial frequency and the preset initial power, so that each radiation microwave is radiated in turn.

[0097] The solid-state source microwave control method provided by the embodiment of the present application can realize regular changes of the main radiation area in the internal cavity of the microwave device by pre-setting the radiation sequence and accurately controlling the radiation phase of each radiation component, thereby greatly improving the accuracy of positioning the target object, the anti-interference ability and the multi-angle recognition ability, so that the microwave control device can more easily detect the position of the target object.

[0098] In some optional embodiments, each radiation component is pre-divided into a corresponding heating area.

[0099] Step 304 comprises:

[0100] The reflection power of the target object under the corresponding radiation phase of each radiation component is collected, and the reflection power corresponding to each radiation component is arranged in ascending order.

[0101] Based on the arrangement order of the reflection power, a target radiation component is selected from each radiation component, and based on the heating area corresponding to the target radiation component, a target position corresponding to the target object is determined.

[0102] In the solid-state source microwave control method of the embodiment, the heating area corresponding to each radiation component can be pre-divided, so that different radiation components can be used to ensure the radiation heating effect of different heating areas, thereby realizing the accurate presentation of the microwave heating effect.

[0103] The target radiation component is used to indicate the radiation component with the best microwave heating effect, which can be understood as that the target object is placed in the heating area corresponding to the target radiation component.

[0104] As shown in Figure 4 When there are two radiation components, the heating area corresponding to each radiation component is different.

[0105] In one embodiment, based on the arrangement order of the reflection power, a target radiation component is selected from each radiation component:

[0106] The difference between the smallest reflection power and the reflection power arranged in the front n is calculated.

[0107] When there is a reflection power with a difference less than a preset difference threshold, the radiation component corresponding to the smallest reflection power and the radiation component corresponding to the reflection power with a difference less than the preset difference threshold are both used as the target radiation component.

[0108] When there is no reflection power with a difference less than the preset difference threshold, the radiation component corresponding to the smallest reflection power is used as the target radiation component.

[0109] As an example, when there are M radiation assemblies, the microwave control device can collect the reflection powers corresponding to the M radiation assemblies, and sort the reflection powers in ascending order. For the smallest reflection power, the microwave control device calculates the difference between the second smallest reflection power and the smallest reflection power, the difference between the third smallest reflection power and the smallest reflection power, and so on, until the difference between the (n+1)th smallest reflection power and the smallest reflection power, where n can be equal to M-1, i.e., the difference between each of the remaining reflection powers and the smallest reflection power is calculated.

[0110] When the difference between any one of the reflection powers and the smallest reflection power is less than the preset difference threshold, it can be understood that the reflection power is not much different from the smallest reflection power, which means that the target object absorbs about the same amount of microwaves in the heating area of the radiation assembly corresponding to the reflection power and in the heating area of the radiation assembly corresponding to the smallest reflection power, i.e., the target object can be placed between the heating area of the radiation assembly corresponding to the reflection power and the heating area of the radiation assembly corresponding to the smallest reflection power.

[0111] When there is no reflection power whose difference from the smallest reflection power is less than the preset difference threshold, it can be understood that the target object absorbs a significantly different amount of microwaves in the heating area of the radiation assembly corresponding to any one of the reflection powers and in the heating area of the radiation assembly corresponding to the smallest reflection power, i.e., the target object is placed in the heating area of the radiation assembly corresponding to the smallest reflection power, and the remaining radiation assemblies radiate microwaves to the blank area.

[0112] When there is a reflection power whose difference from the smallest reflection power is less than the preset difference threshold, the microwave control device can regard the radiation assembly corresponding to the smallest reflection power and the radiation assembly corresponding to the reflection power whose difference from the smallest reflection power is less than the preset difference threshold as target radiation assemblies.

[0113] The above solid-state source microwave control method can automatically select the radiation assembly that best matches the actual placement position of the target object and has the highest radiation efficiency by comparing the reflection powers, thereby avoiding manual intervention and improving the accuracy and efficiency of selecting the target radiation assembly.

[0114] In some optional embodiments, step 308 includes:

[0115] controlling the target radiation assembly to perform microwave heating on the target object according to the corresponding target phase and target frequency at a preset heating power; or

[0116] controlling the target radiation assembly to perform microwave heating on the target object according to the corresponding target phase and target frequency at a preset heating power, and controlling the remaining radiation assemblies to perform microwave heating on the target object according to the preset initial phase and target frequency at a preset initial power;

[0117] The preset heating power is greater than the preset initial power.

[0118] In this embodiment, after determining the radiation assembly with the best microwave heating effect, the microwave control device can control only the radiation assembly with the best microwave heating effect to heat the target object, or can control only the radiation assembly with the best microwave heating effect to heat at high power while controlling the radiation assembly with poor microwave heating effect to heat at low power.

[0119] The above solid-state source microwave control method can activate the radiation assembly with the best microwave heating effect at high power, concentrate energy, efficiently heat the target, and improve overall efficiency; or while controlling the radiation assembly with the best microwave heating effect to heat at high power, control the radiation assembly with poor microwave heating effect to heat at low power, thereby avoiding waste of microwave energy in invalid areas, achieving focused heating of the area where the target object is located, weakening or closing the radiation assemblies corresponding to the remaining blank areas, and thereby achieving more uniform and directional heating effect and improving energy utilization of the microwave device.

[0120] In some optional embodiments,

[0121] Step 306 comprises:

[0122] According to the target position and the set position corresponding to the radiation assembly, the distance between each radiation assembly and the target object is determined.

[0123] Based on the distance between each radiation assembly and the target object and the preset initial frequency, the target phase difference between any two radiation assemblies is determined.

[0124] The preset initial phase is taken as the target phase corresponding to any one radiation assembly, and based on the target phase difference between this radiation assembly and any other radiation assembly and the preset initial phase, the target phases corresponding to the other radiation assemblies are determined.

[0125] As an example, when there is a reflected power with a difference less than the preset difference threshold, the microwave control device can take the heating area of the radiation assembly corresponding to the smallest reflected power and the center point position of the heating area of the radiation assembly corresponding to the reflected power with a difference less than the preset difference threshold as the target position of the target object; when there is no reflected power with a difference less than the preset difference threshold, the microwave control device can take the center point position of the heating area of the radiation assembly corresponding to the smallest reflected power as the target position of the target object.

[0126] The set position corresponding to the radiation assembly is pre-set, for example.

[0127] The microwave control device can determine the distance between each radiation component and the target object based on the target position and the set position of each radiation component, and further determine the target phase difference of each radiation component based on the distance between each radiation component and the target object and the preset initial frequency by using the following formula:

[0128] wherein, represents the target phase difference between the i th radiation component and the j th radiation component, represents the phase difference between the i th radiation component and the target object, represents the phase difference between the j th radiation component and the target object.

[0129] The phase difference between the radiation component and the target object can be calculated by using the following formula:

[0130] wherein, represents the phase difference between any one radiation component and the target object, represents the distance between any one radiation component and the target object, represents the wavelength of the microwave of any one radiation component, wherein, c represents the speed of light, represents the preset initial frequency.

[0131] As shown in Figure 5 , when there are two radiation components A and B, the distance between the radiation component A and the target object can be represented as d1, and the distance between the radiation component B and the target object can be represented as d2.

[0132] The above solid source microwave control method can calculate the distance between different radiation components and the target object, further calculate the target phase difference between different radiation components, determine the target phase of each radiation component, and ensure that the microwave radiated by each radiation component can achieve coherent superposition to form a concentrated and enhanced microwave field, so as to compensate for the phase difference caused by different distances, avoid the wave peak and wave trough from being staggered due to the distance difference, and ensure that the microwave waveform radiated by each radiation component can produce the best heating effect when superimposed on the position where the target object is located, thereby improving the microwave heating efficiency.

[0133] In some optional embodiments, the step of determining the target frequency comprises:

[0134] controlling the radiation component to radiate the target object in a sweep frequency according to a preset initial frequency range;

[0135] collecting the reflection power of the target object at each frequency in the preset initial frequency range to determine the target frequency corresponding to the target object.

[0136] It should be noted that the step of determining the target frequency can be arranged after step 304 and before step 306.

[0137] In an embodiment, the microwave device comprises a plurality of radiation assemblies.

[0138] According to the preset initial frequency range, the radiation assemblies are controlled to perform sweep-frequency radiation on the target object, comprising:

[0139] According to the preset arrangement order of the radiation assemblies and the preset initial frequency range, the first radiation assembly is controlled to perform sweep-frequency radiation on the target object at the preset initial power; the sweep-frequency radiation process covers the entire preset heating frequency range to form a sweep-frequency cycle.

[0140] According to the arrangement order, when the previous radiation assembly completes half of the sweep-frequency cycle, the next radiation assembly is controlled to perform sweep-frequency radiation on the target object at the preset initial power according to the preset initial frequency range.

[0141] Half of the sweep-frequency cycle completed by the previous radiation assembly is used to indicate the starting time of the microwave radiation to the surface of the target object by the next radiation assembly. In this embodiment, the plurality of radiation assemblies arranged inside the microwave device can be preset with an arrangement order for indicating the sweep-frequency radiation in sequence. When the first radiation assembly starts to radiate microwaves to the surface of the target object, the radiation assembly in the second position in the arrangement order can start to radiate microwaves when the first radiation assembly completes half of the sweep-frequency cycle; the radiation assembly in the third position in the arrangement order can start to radiate microwaves when the radiation assembly in the second position in the arrangement order completes half of the sweep-frequency cycle; and so on.

[0142] The microwave control device can control the solid-state source to generate microwaves corresponding to each radiation assembly in the sweep-frequency radiation stage according to the preset initial frequency range and the preset initial power according to the time when each radiation assembly starts to radiate microwaves, and control each radiation assembly to radiate microwaves to the surface of the target object.

[0143] Further, in an embodiment, the step of determining the target frequency corresponding to the target object based on the reflection power of the target object at each frequency in the preset initial frequency range comprises:

[0144] For any one radiation assembly, after completing the sweep-frequency cycle, the reflection power of the target object at each frequency in the preset initial frequency range is collected.

[0145] Based on the reflection power of the target object at each frequency in the preset initial frequency range of each radiation assembly, the frequency corresponding to the smallest reflection power is selected as the target frequency corresponding to the target object.

[0146] The target frequency can be understood as the best absorption frequency of the target object at present.

[0147] It should be noted that the microwave control device can also only control the target radiation assembly to perform sweep frequency radiation on the target object, and collect the emission power of the microwave emitted by the target radiation assembly to the target object, so as to determine the target frequency corresponding to the target object.

[0148] In this embodiment, the microwave control device can subsequently increase the radiation power corresponding to the target frequency to the preset heating power, thereby realizing efficient heating.

[0149] In this embodiment, the microwave control device can dynamically regulate and control the radiation power of each frequency in the preset heating frequency range during the microwave heating process based on the reflection power of the target object during the sweep frequency radiation stage, thereby realizing accurate and efficient heating of the target object.

[0150] In some optional embodiments, the solid-state source microwave control method further comprises:

[0151] During the microwave heating process, according to a preset period, the radiation assembly is controlled to perform sweep frequency radiation on the target object again according to a preset initial frequency range and a preset initial phase, and the reflection power of the target object at each frequency in the preset frequency range is collected again.

[0152] According to the re-collected reflection power, the target frequency is updated, so that the radiation assembly performs microwave heating on the target object according to the updated target frequency and the target phase corresponding to the radiation assembly at a preset heating power.

[0153] In this embodiment, the microwave control device can continuously update the target frequency according to a preset period.

[0154] Generally, after the target object is subjected to microwave heating according to the target frequency and the preset heating power for a period of time, the water content and temperature of the target object will change, and at this time, the optimal absorption frequency of the target object will also change. If the radiation power of each frequency in the preset heating frequency range is continued to be regulated and controlled according to the initial target frequency, the microwave heating effect of the microwave device on the target object will be poor, thereby causing uneven heating or heating not in place.

[0155] The above-mentioned solid-state source microwave control method can consider the change of the water content and temperature of the target object after heating for a period of time, and through regular re-detection and adjustment of the target frequency, it can ensure that the target frequency always matches the optimal absorption frequency of the target, thereby continuously optimizing the heating efficiency.

[0156] It should be noted that step 306 can also stop heating when the microwave heating meets the preset requirement.

[0157] The preset requirement refers to a condition for indicating that the microwave device stops performing microwave heating.

[0158] As an example, the preset requirement can be that the radiation time length of the radiation assembly reaches a target time length corresponding to the microwave heating instruction, i.e., the microwave heating time length of the microwave device reaches the target time length, which can be selected by the user on the control panel. For example, a mechanical knob on the control panel can correspond to several heating time lengths, a button can correspond to several heating time lengths, and a touch screen can be pre-integrated with virtual buttons indicating a plurality of heating time lengths. The user issues a microwave heating instruction carrying the information of the target time length to the microwave control device by rotating the mechanical knob to the target time length, pressing the button corresponding to the target time length, or clicking the virtual button representing the target time length on the touch screen.

[0159] After receiving the microwave heating instruction carrying the information of the target time length, the microwave control device can generate a timing instruction carrying the information of the target time length and send it to the timing device of the microwave device, so that the timing device starts timing, and at the same time, controls the solid-state source to generate microwaves and controls the radiation assembly to radiate the target object according to the preset initial frequency, the preset initial phase, and the preset initial power, so as to determine the target position of the target object. Subsequently, the microwave control device controls the radiation assembly to perform microwave heating on the target object according to the corresponding target phase and target frequency and the preset heating power, until the timing reaches the target time length, the timing device stops timing, and generates a stop instruction and sends it to the microwave control device. At this time, the microwave control device can determine that the process of microwave heating meets the preset requirement, and can further generate a stop generation instruction and send it to the solid-state source to control the solid-state source to stop generating microwaves and stop microwave heating on the target object.

[0160] The solid-state source microwave control method of the embodiment can re-determine the optimal absorption frequency of the target object according to the preset period, so as to prevent the target object from changing due to changes in temperature and water content, causing the state of the food to change, so that the microwave device can adjust the emission strategy of the microwaves according to the preset period, improve the accuracy and efficiency of microwave heating, and thus can perform customized microwave heating processing on the target object.

[0161] In an embodiment, the reflected power used in any of the above embodiments can be replaced by microwave reflectivity.

[0162] The microwave reflectivity can be calculated based on the reflected power, and the following formula can be used:

[0163] wherein, represents the microwave reflectivity, represents the power of the microwaves radiated by the radiation assembly, in step 304, is the preset initial power, in step 306, to preset the heating power; indicate the reflection power of the target object collected by the radiation assembly.

[0164] It should be understood that, although each step in the flowchart involved in the above embodiments is shown in sequence according to the arrow, these steps are not necessarily executed in the order indicated by the arrow. Unless otherwise specified herein, the execution of these steps is not strictly limited in sequence, and these steps can be executed in other orders. Moreover, at least part of the steps in the flowchart involved in the above embodiments can include multiple steps or stages, which are not necessarily executed at the same time, but can be executed at different times, and the execution order of these steps or stages is not necessarily sequential, but can be alternately executed with at least part of other steps or steps or stages in other steps.

[0165] The embodiments of the present application also provide a device for implementing the above-mentioned method. The implementation scheme for solving the problem provided by the device is similar to the implementation scheme described in the above method, so the specific limitations in one or more device embodiments provided below can refer to the limitations of the method in the above text, which will not be repeated here.

[0166] In one embodiment, as shown in Figure 6 a solid-state source microwave control device 600 is provided, comprising:

[0167] a radiation module 602, configured to control, in response to a microwave heating instruction, a plurality of radiation assemblies of a microwave device to perform microwave radiation on a target object at a preset initial phase and a preset initial frequency with a preset initial power;

[0168] a determination module 604, configured to collect reflection power of the target object to determine a target position corresponding to the target object;

[0169] a heating module 606, configured to determine a target phase corresponding to each radiation assembly according to the target position and a set position corresponding to each radiation assembly, and control the radiation assembly to perform microwave heating on the target object according to the corresponding target phase.

[0170] In some optional embodiments,

[0171] The radiation module 602 is further configured to:

[0172] determine the radiation phase of each radiation assembly according to the preset phase difference and the preset initial phase;

[0173] control each radiation assembly to perform microwave radiation on the target object at the preset initial power according to the radiation phase of each radiation assembly and the preset initial frequency.

[0174] In some optional embodiments, the plurality of radiation components are provided with a radiation sequence in advance;

[0175] The radiation module 602 is further configured to:

[0176] According to the radiation sequence, a preset initial phase is taken as a first radiation phase corresponding to a first radiation component;

[0177] Based on the preset phase difference and the preset initial phase, a second radiation phase corresponding to a second radiation component in the radiation sequence is determined, and a third radiation phase corresponding to a third radiation component in the radiation sequence is determined according to the radiation phase corresponding to the second radiation component and the preset phase difference, and so on, to determine the radiation phase corresponding to each radiation component.

[0178] In some optional embodiments, each radiation component is pre-divided into a corresponding heating area;

[0179] The determination module 604 is further configured to:

[0180] Collect the reflection power of the target object under the radiation phase corresponding to each radiation component, and arrange the reflection power corresponding to each radiation component in ascending order;

[0181] Based on the arrangement order of each reflection power, a target radiation component is selected from each radiation component, and based on the heating area corresponding to the target radiation component, a target position corresponding to the target object is determined.

[0182] In some optional embodiments, the determination module 604 is further configured to:

[0183] Calculate the difference between the smallest reflection power and the reflection power arranged in the top n;

[0184] When there is a reflection power with a difference less than a preset difference threshold, the radiation component corresponding to the smallest reflection power and the radiation component corresponding to the reflection power with the difference less than the preset difference threshold are both taken as the target radiation component;

[0185] When there is no reflection power with a difference less than a preset difference threshold, the radiation component corresponding to the smallest reflection power is taken as the target radiation component.

[0186] In some optional embodiments, the heating module 606 is further configured to:

[0187] Control the target radiation component to perform microwave heating on the target object according to the corresponding target phase and target frequency at a preset heating power; or

[0188] The control target radiation assembly performs microwave heating on the target object according to the corresponding target phase and target frequency at a preset heating power, and the remaining radiation assemblies perform microwave heating on the target object according to the preset initial phase and target frequency at a preset initial power.

[0189] The preset heating power is greater than the preset initial power.

[0190] In some optional embodiments,

[0191] The heating module 606 is further configured to:

[0192] According to the target position and the corresponding setting position of the radiation assembly, the distance between each radiation assembly and the target object is determined;

[0193] Based on the distance between each radiation assembly and the target object and the preset initial frequency, the target phase difference between any two radiation assemblies is determined.

[0194] The preset initial phase is taken as the target phase corresponding to any one radiation assembly, and based on the target phase difference between the radiation assembly and any other radiation assembly and the preset initial phase, the target phase corresponding to each of the remaining radiation assemblies is determined.

[0195] 6060In some optional embodiments, the heating module 606 is further configured to:

[0196] According to the preset initial frequency range, the radiation assembly controls the target object to perform sweep frequency radiation;

[0197] The reflection power of the target object at each frequency in the preset initial frequency range is collected to determine the target frequency corresponding to the target object.

[0198] In some optional embodiments, the microwave device includes a plurality of radiation assemblies;

[0199] The heating module 606 is further configured to:

[0200] According to the preset arrangement order of each radiation assembly and the preset initial frequency range, the first radiation assembly controls the target object to perform sweep frequency radiation at a preset initial power; when the sweep frequency radiation process covers the entire preset heating frequency range, a sweep frequency cycle is formed.

[0201] According to the arrangement order, when the previous radiation assembly completes half of the sweep frequency cycle, the next radiation assembly controls the target object to perform sweep frequency radiation at a preset initial power according to the preset initial frequency range.

[0202] In some optional embodiments, the heating module 606 is further configured to:

[0203] For any one radiation component, after completing the frequency sweeping cycle, the reflection power of the target object at each frequency in the preset initial frequency range is collected;

[0204] Based on the reflection power of the target object at each frequency in the preset initial frequency range of each radiation component, the frequency corresponding to the smallest reflection power is selected as the target frequency corresponding to the target object.

[0205] Each module in the above device can be realized by software, hardware and a combination thereof in whole or in part. The above modules can be embedded in or independent of the processor in the electronic device in hardware form, or can be stored in the memory in the electronic device in software form, so as to call and execute the operations corresponding to the above modules by the processor.

[0206] The solid-state source microwave control device provided in the embodiment can execute the method provided in the method embodiment, and has similar implementation principles and technical effects, which will not be described here.

[0207] Figure 7 The structure of the electronic device provided in the present application is shown in FIG. 7. Figure 7 As shown in FIG. 7, the electronic device 70 provided in the embodiment includes at least one processor 701 and a memory 702. Optionally, the device 70 further includes a communication component 703. The processor 701, the memory 702 and the communication component 703 are connected through a bus 704.

[0208] In the specific implementation process, the at least one processor 701 executes the computer execution instructions stored in the memory 702, so that the at least one processor 701 executes the above method.

[0209] The specific implementation process of the processor 701 can refer to the method embodiment, which has similar implementation principles and technical effects, and will not be described here.

[0210] In the above embodiment, it should be understood that the processor can be a central processing unit (CPU), and can also be other general-purpose processors, digital signal processors (DSP), application specific integrated circuits (ASIC) and the like. The general-purpose processor can be a microprocessor or the processor can also be any conventional processor. The steps of the method disclosed in the application can be directly embodied as the execution of the hardware processor, or executed by the combination of hardware and software modules in the processor.

[0211] The memory can include a Random Access Memory (RAM) and can also include a Non-volatile Memory (NVM), such as at least one disk memory.

[0212] The bus can be an Industry Standard Architecture (ISA) bus, a Peripheral Component (PCI) bus, or an Extended Industry Standard Architecture (EISA) bus, etc. The bus can be divided into an address bus, a data bus, a control bus, etc. For the convenience of representation, the bus in the drawings of the present application does not limit to only one bus or one type of bus.

[0213] The present application also provides a computer program product, comprising a computer program, which, when executed by a processor, implements the above method.

[0214] The present application also provides a computer readable storage medium, which stores computer execution instructions, and when a processor executes the computer execution instructions, the above method is implemented.

[0215] The above readable storage medium can be implemented by any type of volatile or non-volatile storage device or their combination, such as Static Random Access Memory (SRAM), Electrically Erasable Programmable Read-Only Memory (EEPROM), Erasable Programmable Read-Only Memory (EPROM), Programmable Read-Only Memory (PROM), Read-Only Memory (ROM), magnetic storage, flash memory, magnetic disk or optical disk. The readable storage medium can be any available medium that can be accessed by a general or special purpose computer.

[0216] An exemplary readable storage medium is coupled to the processor, so that the processor can read information from the readable storage medium and write information to the readable storage medium. Of course, the readable storage medium can also be an integral part of the processor. The processor and the readable storage medium can be located in an Application Specific Integrated Circuit (ASIC). Of course, the processor and the readable storage medium can also exist as discrete components in the device.

[0217] The division of units is only a logical function division, and actual implementation can have another division manner, for example, multiple units or components can be combined or integrated into another system, or some features can be ignored or not executed. Another point is that the coupling or direct coupling or communication connection between the units shown or discussed can be indirect coupling or communication connection through some interfaces, devices or units, which can be electrical, mechanical or other forms.

[0218] The units described as separate components can or can not be physically separate, and the components shown as units can or can not be physical units, that is, can be located in one place, or can be distributed to multiple network units. Part or all of the units can be selected according to actual needs to achieve the purpose of the embodiment.

[0219] In addition, the functional units in each embodiment of the present application can be integrated in one processing unit, or each unit can be physically present separately, or two or more units can be integrated in one unit.

[0220] If the functions are realized in the form of software function units and sold or used as independent products, they can be stored in a computer readable storage medium. Based on this understanding, the technical solutions of the present application or the part of the present application that essentially contributes to the prior art or the part of the technical solutions can be embodied in the form of a software product. The computer software product is stored in a storage medium and includes a plurality of instructions for causing an electronic device (which can be a personal computer, a server, or a network device, etc.) to execute all or part of the steps of the method of each embodiment of the present application. The aforementioned storage medium includes: a U disk, a mobile hard disk, a read-only memory (ROM), a random access memory (RAM), a magnetic disk or an optical disk, and various program code storage media.

[0221] Those skilled in the art can understand that all or part of the steps of the above-mentioned method embodiments can be completed by program instruction related hardware. The aforementioned program can be stored in a computer readable storage medium. The program executes to perform the steps of the above-mentioned method embodiments; and the aforementioned storage medium includes: ROM, RAM, magnetic disk or optical disk, and various program code storage media.

[0222] It should be understood that many of the materials and devices exemplified in this disclosure are articles of manufacture (i.e., articles of manufacture) according to this disclosure. The articles of manufacture can be manufactured as such or can be manufactured by combining the materials and devices exemplified in this disclosure. It is also to be understood that the terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting. It should be understood that, in some embodiments, equivalents to the specific electrode structures and / or methods described herein can be employed without departing from the scope of the application. Accordingly, the phraseology and terminology used herein is for the purpose of description and should not be regarded as limiting. The use of "including," "comprising," "having," "containing," "involving," "characterized by," "characterized into," and variations thereof herein, is meant to encompass the items listed thereafter, and equivalents thereof as well as additional items. Although the foregoing application has been described in some detail by way of illustration and example, it is not to be limited thereby, but rather, only by the scope of the appended claims.

Claims

1. A solid-state source microwave control method, characterized in that, The method comprises the steps of: controlling a plurality of radiation assemblies of a microwave device to radiate microwaves to a target object at a preset initial phase and a preset initial frequency according to a preset initial power in response to a microwave heating instruction; collecting reflected power of the target object to determine a target position corresponding to the target object; determining a target phase corresponding to each of the radiation assemblies according to the target position and a set position corresponding to each of the radiation assemblies, and controlling the radiation assemblies to radiate microwaves to the target object at the preset heating power according to the target phase; the preset heating power is greater than the preset initial power; the step of controlling the plurality of radiation assemblies of the microwave device to radiate microwaves to the target object at the preset initial phase and the preset initial frequency according to the preset initial power comprises the steps of: determining a radiation phase of each of the radiation assemblies according to a preset phase difference and the preset initial phase; controlling each of the radiation assemblies to radiate microwaves to the target object at the preset initial power according to the radiation phase of each of the radiation assemblies and the preset initial frequency; each of the radiation assemblies is previously divided into a corresponding heating area; the step of collecting the reflected power of the target object to determine the target position corresponding to the target object comprises the steps of: collecting the reflected power of the target object under the corresponding radiation phase of each of the radiation assemblies, and arranging the reflected power corresponding to each of the radiation assemblies in ascending order; selecting a target radiation assembly from each of the radiation assemblies based on the arrangement order of the reflected power, and determining the target position corresponding to the target object based on the heating area corresponding to the target radiation assembly; the step of controlling the radiation assemblies to radiate microwaves to the target object at the preset heating power according to the target phase comprises the steps of: controlling the target radiation assembly to radiate microwaves to the target object at the preset heating power according to the target phase and a target frequency; or controlling the target radiation assembly to radiate microwaves to the target object at the preset heating power according to the target phase and the target frequency, and controlling the remaining radiation assemblies to radiate microwaves to the target object at the preset initial power according to the preset initial phase and the target frequency.

2. The method of claim 1, wherein, a plurality of the radiation assemblies are previously provided with a radiation order; the step of determining the radiation phase of each of the radiation assemblies according to the preset phase difference and the preset initial phase comprises the steps of: arranging the preset initial phase as a first radiation phase corresponding to a first radiation assembly according to the radiation order; determining a second radiation phase corresponding to a second radiation assembly in the radiation order based on the preset phase difference and the preset initial phase, and determining a third radiation phase corresponding to a third radiation assembly in the radiation order according to the radiation phase corresponding to the second radiation assembly and the preset phase difference, and so on, to determine the radiation phase corresponding to each of the radiation assemblies.

3. The method of claim 1, wherein, the step of selecting a target radiation assembly from each of the radiation assemblies based on the arrangement order of the reflected power comprises the steps of: calculating a difference between the smallest reflected power and each of the reflected power arranged in the first n positions; When the difference of the reflection power is less than the preset difference threshold, the radiation component corresponding to the minimum reflection power and the radiation component corresponding to the reflection power whose difference is less than the preset difference threshold are both the target radiation component; When the difference of the reflection power is not less than the preset difference threshold, the radiation component corresponding to the minimum reflection power is the target radiation component.

4. The method of claim 1, wherein, The step of determining the target frequency comprises: controlling the radiation component to perform sweep-frequency radiation on the target object according to a preset initial frequency range; collecting the reflection power of the target object at each frequency in the preset initial frequency range to determine the target frequency corresponding to the target object.

5. The method of claim 4, wherein, The step of controlling the radiation component to perform sweep-frequency radiation on the target object according to a preset initial frequency range comprises: controlling a first radiation component to perform sweep-frequency radiation on the target object at the preset initial power according to the preset initial frequency range and the arrangement order of each radiation component; the sweep-frequency radiation process covering the entire preset heating frequency range forms a sweep-frequency cycle; controlling a subsequent radiation component to perform sweep-frequency radiation on the target object at the preset initial power according to the preset initial frequency range when a previous radiation component completes half of the sweep-frequency cycle according to the arrangement order.

6. The method of claim 5, wherein, The step of collecting the reflection power of the target object at each frequency in the preset initial frequency range to determine the target frequency corresponding to the target object comprises: for any one radiation component, collecting the reflection power of the target object at each frequency in the preset initial frequency range after completing the sweep-frequency cycle; based on the reflection power of the target object at each frequency in the preset initial frequency range of each radiation component, screening the frequency corresponding to the minimum reflection power as the target frequency corresponding to the target object.

7. The method of claim 4, wherein, The method further comprises: during the process of microwave heating, controlling each radiation component to perform sweep-frequency radiation on the target object according to the preset initial frequency range and the preset initial phase according to a preset period, and re-collecting the reflection power of the target object at each frequency in the preset frequency range; updating the target frequency according to the re-collected reflection power, so that each radiation component performs microwave heating on the target object at the preset heating power according to the updated target frequency and the target phase corresponding to the radiation component.

8. The method of claim 1, wherein, The step of determining the target phase corresponding to the radiation component according to the target position and the setting position corresponding to the radiation component comprises: determining the distance between each radiation component and the target object according to the target position and the setting position corresponding to the radiation component; based on the distance between each radiation component and the target object and the preset initial frequency, determining the target phase difference between any two radiation components. The preset initial phase is taken as a target phase corresponding to any one of the radiation assemblies, and target phases corresponding to the rest of the radiation assemblies are determined based on target phase differences between the radiation assembly and the rest of the radiation assemblies and the preset initial phase.

9. A microwave device, characterized by The microwave control device and the solid-state source are arranged on the shell, and the radiation assembly is arranged in an internal cavity of the shell. The microwave control device is connected with the solid-state source and the radiation assembly respectively. The solid-state source is connected with the radiation assembly. The microwave control device is configured to determine target phases corresponding to the radiation assemblies by using the solid-state source microwave control method in any one of claims 1-8. The solid-state source is configured to generate corresponding microwaves based on the target phases. The radiation assembly is configured to radiate the microwaves to a target object to perform microwave heating on the target object placed in the cavity.

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