Circuit board heat dissipation mechanism

Abstract

The invention discloses a circuit board heat dissipation mechanism, which comprises a main body and a main board, a chip is arranged on the main board, one surface of the main body is in contact with the chip, first fins are arranged on the main body, grooves are formed between the first fins, the circuit board heat dissipation mechanism further comprises a cover plate and a driving mechanism for driving the cover plate to move up and down, and the driving mechanism is arranged on the main board. Second fins are arranged at the bottom of the cover plate and inserted into the grooves, and the thickness of the second fins is the same as the width of the grooves. Before the mainboard is started, the cover plate covers the main body, the second fins on the cover plate are inserted into the grooves, and due to the fact that the width of the second fins is the same as that of the grooves, the second fins can completely fill the areas between the first fins, and dust in air is prevented from entering the grooves.

Description

Technical Field

[0001] The invention relates to a heat dissipation mechanism for a circuit board. Background Art

[0002] The heat dissipation mechanisms on circuit boards are generally divided into three types: liquid cooling, air cooling, and heat sinks. All three types of heat dissipation mechanisms require the use of heat sinks, which are generally made of metals with good heat dissipation properties such as copper or aluminum. The heat sink generally consists of a main body, with one side being a flat surface that closely fits the chip, and the other side being multiple heat dissipation fins. These fins are mainly used to increase the contact area between the heat sink and the air to facilitate heat exchange. Of course, the more fins, the greater the heat dissipation area, and the better the heat dissipation effect. However, the grooves between the fins easily accumulate dust, which can block the heat exchange between the fins and the air, reducing the heat dissipation effect. Therefore, it is necessary to improve this. Summary of the Invention

[0003] The object of the present invention is to provide a circuit board heat dissipation mechanism that can prevent dust from accumulating in the grooves between the fins.

[0004] To achieve the above objectives, the present invention provides the following technical solution: a circuit board heat dissipation mechanism, comprising a main body and a motherboard, the mainboard being provided with a chip, one side of the main body being in contact with the chip, a first fin being provided on the upper surface of the main body, and a groove being defined between the first fins. The main body also comprises a cover plate and a drive mechanism for moving the cover plate up and down, a second fin being provided at the bottom of the cover plate and inserted into the groove, the thickness of the second fin being the same as the width of the groove. Before the mainboard is activated, the cover plate is placed on the main body, and the second fin on the cover plate is inserted into the groove. Because the second fin and the groove have the same width, the second fin can completely fill the area between the first fins, preventing the ingress of dust from the air. When the motherboard is started, the driving mechanism starts, pushes the cover upward, and pulls the second fin out of the groove. At this time, air can enter the area between the first fin and the second fin for heat exchange. When the motherboard is not working, the driving mechanism starts again and pulls the cover downward. In the process of moving downward, the first fin and the second fin will also scrape off the dust stuck to the motherboard during operation. Therefore, this mechanism cannot prevent dust from entering when not in use, and can scrape off the dust in time when in use, which can prevent dust from accumulating in the grooves between the fins and avoid reducing the heat dissipation efficiency of the radiator.

[0005] In a preferred embodiment of the present invention, the drive mechanism includes a motor fixed to the mainboard, which drives a screw to rotate. The cover plate is provided with a screw hole that mates with the screw. This screw hole drive method can achieve unidirectional drive, preventing the cover plate from falling due to gravity after being raised.

[0006] As a preferred embodiment of the present invention, a cavity is provided on the main board, and the motor is snapped into the cavity to be fixed.

[0007] As a preferred embodiment of the present invention, the first fin and the second fin have the same length. With this design, when the cover plate is covered on the main body, there is no gap between the bottoms of the first fin and the second fin, thereby preventing dust from entering the groove through the gap.

[0008] As a preferred embodiment of the present invention, the main body is a square plate, and the first fin is arranged perpendicular to the top surface of the square plate.

[0009] As a preferred embodiment of the present invention, the main body is a square plate, the first fin is arranged on the top surface of the square plate, a fan is arranged in the middle of the square plate, the first fin is arranged around the outer ring of the fan, a through hole is arranged in the middle of the cover plate, the through hole is coaxial with the fan, and the diameter of the through hole is larger than the diameter of the fan.

[0010] Compared with the prior art, the present invention has the following beneficial effects: When the motherboard is started, the driving mechanism starts, pushes the cover upward, and pulls the second fin out of the groove. At this time, air can enter the area between the first fin and the second fin for heat exchange. When the motherboard is not working, the driving mechanism starts again and pulls the cover downward. In the process of moving downward, the first fin and the second fin will also scrape off the dust stuck to the motherboard during operation. Therefore, this mechanism cannot prevent dust from entering when not in use, and can scrape off the dust in time when in use, which can prevent dust from accumulating in the grooves between the fins and avoid reducing the heat dissipation efficiency of the radiator. BRIEF DESCRIPTION OF THE DRAWINGS

[0011] Figure 1 This is a three-dimensional schematic diagram of embodiment 1 of the present invention in an unactivated state.

[0012] Figure 2 This is a three-dimensional schematic diagram of the startup state of Example 1 of the present invention.

[0013] Figure 3 for Figure 2 A partial enlarged schematic diagram.

[0014] Figure 4 This is a three-dimensional schematic diagram of embodiment 2 of the present invention in an unactivated state.

[0015] Figure 5 This is a three-dimensional schematic diagram of the startup state of Example 4 of the present invention.

[0016] Figure 6 for Figure 5A partial enlarged schematic diagram. DETAILED DESCRIPTION

[0017] In order to make the technical means, creative features, objectives and effects achieved by the present invention easier to understand, the present invention is further described below in conjunction with specific implementation methods.

[0018] In the description of the present invention, it should be understood that the terms "upper", "lower", "front", "back", "left", "right", "top", "bottom", "inside", "outside", etc., indicating directions or positional relationships, are based on the directions or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific direction, be constructed and operated in a specific direction, and therefore should not be understood as limiting the present invention.

[0019] Example 1, please refer to Figure 1-3 The present invention provides a technical solution: a circuit board heat dissipation mechanism, comprising a main body 1 and a mainboard 2. A chip is mounted on the mainboard 2, and one side of the main body 1 contacts the chip. The main body 1 is a square plate, and is provided with first fins 11 disposed perpendicular to the top surface of the square plate. Grooves 1a are formed between the first fins 11.

[0020] It also includes a cover plate 3 and a driving mechanism 4 for driving the cover plate 3 to move up and down. A second fin 31 is provided at the bottom of the cover plate 3. The second fin 31 is inserted into the groove 1a. The thickness of the second fin 31 is the same as the width of the groove 1a.

[0021] See also Figure 1 Before the motherboard is started, the cover is placed on the main body, and the second fin on the cover is inserted into the groove. Since the second fin and the groove have the same width, the second fin can completely fill the area between the first fins to prevent dust in the air from entering.

[0022] See also Figure 2-3 When the motherboard is started, the driving mechanism starts, pushes the cover upward, and pulls the second fin out of the groove. At this time, air can enter the area between the first fin and the second fin for heat exchange. When the motherboard is not working, the driving mechanism starts again and pulls the cover downward. In the process of moving downward, the first fin and the second fin will also scrape off the dust stuck to the motherboard during operation. Therefore, this mechanism cannot prevent dust from entering when not in use, and can also scrape off the dust in time when in use, which can prevent dust from accumulating in the grooves between the fins and avoid reducing the heat dissipation efficiency of the radiator.

[0023] The driving mechanism 4 includes a motor 41 , which is fixed on the main board. A cavity 21 is provided on the main board 2 , and the motor 41 is fixed by being inserted into the cavity 21 .

[0024] The motor 41 drives a screw 42 to rotate, and the cover plate 3 is provided with a screw hole 32 that matches the screw 42. This driving mode of the screw hole can realize one-way drive, preventing the cover plate from falling due to gravity after being lifted up.

[0025] In this embodiment, the lengths of the first fin 11 and the second fin 31 are the same. With this design, when the cover plate is covered on the main body, there is no gap between the bottoms of the first fin and the second fin, preventing dust from entering the groove through the gap.

[0026] Example 2, see Figures 4 to 6 The main body 1 is a square plate. The first fins 11 are provided on the top surface of the square plate. A fan 5 is provided in the middle of the square plate. The first fins 11 are provided around the outer ring of the fan 5. A through hole 33 is provided in the middle of the cover plate 3. The through hole 33 is coaxial with the fan 5 and has a diameter larger than that of the fan 5. The rest is the same as in Example 1.

[0027] Example 2 shows an example of the present invention being used for air cooling and heat dissipation, see Figure 4 Before the motherboard is started, the cover is placed on the main body, and the second fin on the cover is inserted into the groove. Since the second fin and the groove have the same width, the second fin can completely fill the area between the first fins to prevent dust in the air from entering.

[0028] See also Figure 5-6 When the motherboard is started, the driving mechanism starts, pushing the cover upwards, and pulling the second fin out of the groove. At this time, air can enter the area between the first fin and the second fin for heat exchange. At the same time, the fan starts, sucking the external airflow from the channel between the first fin and the second fin, and then discharging it from the through hole, which can speed up the heat dissipation. When the motherboard is not working, the driving mechanism starts again and pulls the cover downwards. In the process of moving downwards, the first fin and the second fin will also scrape off the dust that is stuck to the motherboard during operation. Therefore, this mechanism cannot prevent dust from entering when it is not in use, and can promptly scrape off the dust that is stuck when it is in use, which can prevent dust from accumulating in the grooves between the fins and avoid reducing the heat dissipation efficiency of the radiator.

Claims

1. A circuit board heat dissipation mechanism, comprising a main body and a mainboard, wherein a chip is disposed on the mainboard, one surface of the main body contacts the chip, and the main body is provided with first fins, with grooves formed between the first fins, characterized in that: It also includes a cover plate and a driving mechanism for driving the cover plate to move up and down. A second fin is provided at the bottom of the cover plate. The second fin is inserted into the groove. The thickness of the second fin is the same as the width of the groove.

2. The circuit board heat dissipation mechanism according to claim 1, characterized in that: The driving mechanism includes a motor, which is fixed on the main board. The motor drives a screw to rotate, and a screw hole matching the screw is provided on the cover.

3. The circuit board heat dissipation mechanism according to claim 2, wherein: The main board is provided with a cavity, and the motor is snapped into the cavity to be fixed.

4. The circuit board heat dissipation mechanism according to claim 1, wherein: The first fin and the second fin have the same length.

5. The circuit board heat dissipation mechanism according to claim 4, characterized in that: The main body is a square plate, and the first fin is arranged perpendicular to the top surface of the square plate.

6. The circuit board heat dissipation mechanism according to claim 4, characterized in that: The main body is a square plate, the first fin is arranged on the top surface of the square plate, a fan is arranged in the middle of the square plate, the first fin is arranged around the outer ring of the fan, a through hole is arranged in the middle of the cover plate, the through hole is coaxial with the fan, and the diameter of the through hole is larger than the diameter of the fan.

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