Circuit board assembly

Abstract

The invention relates to the technical field of circuit board heat dissipation, and particularly provides a circuit board assembly. The upper surface of the PCB is provided with chips, the radiator corresponds to the chips, the upper surface of the PCB is provided with nut groups in one-to-one correspondence with the chips, and a plurality of nuts of each nut group are at least positioned on two opposite sides of the corresponding chip; the radiator comprises a heat conduction bottom plate, a heat conduction rubber mat is arranged between the heat conduction bottom plate and the chip, the upper surface of the bottom plate is provided with a plurality of heat dissipation needles in the vertical direction and installation holes corresponding to the nut sets, and screws penetrate through the installation holes to be fixed to the nuts. The radiator is quickly disassembled and assembled through a nut set-screw fixing structure, the occupied operation space is reduced, and the space utilization rate is increased; the design of the heat dissipation pins enlarges the heat dissipation area, effectively improves the heat dissipation efficiency, and gives consideration to the maintainability and the heat dissipation performance.

Description

Technical Field

[0001] The present invention belongs to the technical field of computing devices, and in particular relates to a circuit board assembly. Background Art

[0002] With the rapid development of artificial intelligence, high-performance computing and other fields, the number of computing chips integrated on PCB boards and the demand for computing power continue to rise. Chip heat dissipation has become a core issue affecting the performance stability and service life of electronic equipment. Currently, the design of heat sinks for chip heat dissipation mainly faces the following technical pain points: First, in terms of fixed structure, the existing solutions have obvious limitations: 1. Although radiators fixed with complex mechanical structures (such as elastic clips) have a certain degree of maintainability, their disassembly and assembly process requires a large operating space, resulting in a compression of the radiator's effective heat dissipation area (operation space must be avoided), low space utilization, and limited heat dissipation efficiency; 2. The heat sink is directly fixed to the chip surface using a welding process. It is easy to damage the chip or PCB board during disassembly, and the maintainability is extremely poor. It cannot meet the needs of high-frequency maintenance scenarios such as servers and data centers.

[0003] Secondly, in terms of heat dissipation performance, traditional radiators mostly rely on sheet-like heat dissipation structures, which have limited effective heat dissipation area and are difficult to match the heat dissipation requirements of high-power chips. Especially on PCB boards with densely arranged multiple chips, the problem of local heat accumulation is prominent, seriously affecting the performance of the chip. Summary of the Invention

[0004] Based on this, and in response to the above technical problems, a circuit board assembly is provided.

[0005] The technical solution adopted in the present invention is as follows: A circuit board assembly comprises a PCB board having a chip on its upper surface and a heat sink for dissipating heat from the chip, characterized in that the upper surface of the PCB board has a plurality of nut groups, the nut groups corresponding one-to-one with the chips, the multiple nuts of each nut group being located on at least two opposite sides of the corresponding chip, the number of the heat sinks being the same as the number of chips and corresponding one-to-one with the chips, the heat sink comprising a heat-conducting base plate, the heat-conducting base plate being arranged on the corresponding chip, a heat-conducting pad being arranged between the two, the heat-conducting base plate having a plurality of heat-dissipating pins in the upper and lower directions and mounting holes corresponding one-to-one with the multiple nuts of the corresponding nut groups on its upper surface, the heat-conducting base plate being fixed to the PCB board by screws passing through the mounting holes thereon and connected to the corresponding nuts.

[0006] The beneficial effects of the present invention are as follows: 1. Efficient fixing method, taking into account both maintenance and space utilization The linear fixing structure of "nut group-screw" is adopted (the PCB board has an independent nut group corresponding to each chip, and the nuts are distributed on opposite sides of the chip). Combined with the mounting hole design of the heat sink's thermal base plate, the heat sink and PCB board can be quickly disassembled and assembled: the screws only need to be screwed in vertically to complete the fixation. The disassembly and assembly operation space requirement is extremely small, avoiding the encroachment of traditional mechanical structures on the heat dissipation area, which can greatly increase the effective area of ​​the heat sink. At the same time, the detachable feature is retained. During maintenance, the heat sink can be removed by simply removing the corresponding screws, which significantly improves maintainability. It is especially suitable for scenarios such as servers and AI computing equipment that require frequent maintenance.

[0007] 2. Optimized heat dissipation structure to greatly improve heat dissipation efficiency The multiple heat dissipation pins arranged on the surface of the heat conducting base plate of the radiator significantly expand the heat dissipation area and improve the heat dissipation efficiency compared with the traditional sheet heat dissipation structure, effectively solving the heat dissipation bottleneck of high-power chips. BRIEF DESCRIPTION OF THE DRAWINGS

[0008] The present invention is described in detail below with reference to the accompanying drawings and specific embodiments: Figure 1 A schematic diagram of the three-dimensional structure of a circuit board assembly provided by an embodiment of the present invention; Figure 2 A schematic top view of a circuit board assembly provided in an embodiment of the present invention; Figure 3 This is a schematic structural diagram of a PCB board according to an embodiment of the present invention; Figure 4 An exploded view of a heat sink according to an embodiment of the present invention; Figure 5 is a schematic diagram of the three-dimensional structure of a radiator according to an embodiment of the present invention; Figure 6 This is a cross-sectional view of the heat sink and PCB board after being fixed according to an embodiment of the present invention. DETAILED DESCRIPTION

[0009] The following will illustrate the implementation of the present invention in conjunction with the drawings in the specification. It should be noted that the implementation methods involved in this specification are not exhaustive and do not represent the only implementation methods of the present invention. The following corresponding embodiments are only for the purpose of clearly illustrating the invention content of the patent of this invention and are not intended to limit its implementation methods. For ordinary technicians in this field, different forms of changes and modifications can be made based on the description of this embodiment. Any obvious changes or modifications that belong to the technical concept and invention content of the present invention are also within the scope of protection of the present invention.

[0010] like Figure 1 and Figure 2As shown, an embodiment of the present application provides a circuit board assembly, including a PCB board 1100 and a plurality of heat sinks 1200 .

[0011] like Figure 3 As shown, the upper surface of the PCB board 1100 has multiple chips 1110, and the multiple chips 1110 are arranged in a matrix array.

[0012] like Figure 3 As shown, the PCB board 1100 has multiple nut groups 1120 and multiple first positioning structures 1130 , and the multiple nut groups 1120 and the multiple first positioning structures 1130 correspond one-to-one to the multiple chips 1110 .

[0013] Each nut group 1120 includes two nuts 1121, which are surface mount nuts and are soldered to the top surface of the PCB board 1100. Each first positioning structure 1130 includes two positioning holes 1131. The two nuts 1121 and the two positioning holes 1131 are symmetrically arranged on the left and right sides of the corresponding chip 1110. The two nuts 1121 are arranged symmetrically along the axis of the corresponding chip 1110, and the two positioning holes 1131 are arranged symmetrically along the center of the corresponding chip 1110. One positioning hole 1131 is located behind the nut 1121 on the same side, and the other positioning hole 1131 is located in front of the nut 1121 on the same side. It is understood that the number of nuts 1121 in each nut group 1120 can be greater than two, and they can be arranged around the corresponding chip 1110.

[0014] The number of the heat sinks 1200 is the same as the number of the chips 1110 , and they correspond one-to-one to the chips 1110 , and are used to dissipate heat for the corresponding chips 1110 .

[0015] like Figure 4 As shown, the heat sink 1200 includes a heat conductive base plate 1210 , two springs 1220 and two screws 1230 .

[0016] The thermal conductive base plate 1210 is disposed on the corresponding chip 1110 , and a thermal conductive pad 1240 is disposed between the two.

[0017] The heat-conducting base plate 1210 is rectangular and has a plurality of heat-dissipating pins 1211, two mounting holes 1212, two positioning pins 1213 and two limiting walls 1214. Figure 4-Figure 6 .

[0018] The plurality of heat dissipation pins 1211 are all oriented vertically and formed on the upper surface of the heat-conducting base plate 1210. The plurality of heat dissipation pins 1211 are arranged in a rectangular array. In the prior art, the heat sink 1200 often uses a heat sink, but the present application is equivalent to replacing a heat sink with a row of heat dissipation pins 1211. The heat dissipation area of ​​a row of heat dissipation pins 1211 is obviously greater than the heat dissipation area of ​​a single heat sink, thereby improving the heat dissipation efficiency. At the same time, the rectangular array arrangement of heat dissipation pins 1211 improves space utilization, reduces wind resistance, and further improves heat dissipation efficiency.

[0019] The two mounting holes 1212 correspond one-to-one with the two nuts 1121 of the corresponding nut group 1120, and the two positioning pins 1213 constitute a second positioning structure that cooperates with the first positioning structure 1130, and are adapted one-to-one with the two positioning holes 1131 of the corresponding first positioning structure 1130. The two mounting holes 1212 are axially symmetrically arranged at the left and right ends of the heat-conducting base plate 1210, and the two positioning pins 1213 are formed on the lower surface of the left and right ends of the heat-conducting base plate 1210 and are diagonally arranged (forming central symmetry), see Figure 5 .

[0020] Since the gap between the chips 1110 is small, in order to adapt to the position of the nut 1121, improve the space utilization of the heat sink and for aesthetic considerations, as shown in FIG. Figure 4 As shown, two mounting holes 1212 are located in an array formed by multiple heat sink pins: two mounting holes 1212 are formed at the two end areas of a middle row of the heat sink pin array. At the same time, in the three rows of heat sink pins, three heat sink pins 1211 adjacent to the mounting holes 1212 form vertical sections 1211a facing the mounting holes 1212. The horizontal cross-sectional profile of the vertical section 1211a is arc-shaped, and the three arc-shaped profiles are located on the same circle concentric with the mounting holes 1212, forming a channel for the screws 1230 to pass up and down.

[0021] A limiting groove 1212 a is further formed at the upper opening of each mounting hole 1212 .

[0022] Two limiting walls 1214 are formed on the lower surface of the thermal conductive base plate 1210 and are arranged symmetrically on the left and right. They have two main functions. One is to facilitate the placement and fixation of the thermal conductive adhesive pad 1240. The thermal conductive adhesive pad 1240 has a certain viscosity and is located between the two limiting walls 1214. The area of ​​the thermal conductive adhesive pad 1240 is slightly larger than the area of ​​the chip 1110 and slightly smaller than the area of ​​the area between the two limiting walls 1214; the second is to limit the radiator 1200 in the up and down directions to prevent the entire radiator 1200 from sinking excessively and crushing the chip 1110.

[0023] The two springs 1220 correspond to the two mounting holes 1212 one by one, and the lower ends of the springs 1220 are disposed in the corresponding limiting grooves 1212a.

[0024] like Figure 4 As shown, the screw 1230 includes a smooth rod section 1231, which is a round rod without threads, so that the spring 1220 can freely extend and retract in the upper and lower directions and act as a guide. The upper end of the smooth rod section 1231 forms a top cap 1232 for compressing the spring 1220, and the lower end forms a threaded section 1233 adapted to the nut 1121. The length of the threaded section 1233 is less than the thread depth of the nut 1121, and the diameter of the threaded section 1233 is less than the diameter of the smooth rod section 1231, forming a limiting step for restricting the depth of the screw 1230 locked into the nut 1121.

[0025] The heat-conducting base plate 1210 is fixed to the PCB board 1100 by screws 1230 passing through the mounting holes 1212 and springs 1220 and connected to corresponding nuts 1121 . After being fixed, the spring 1220 is in a compressed state and continuously applies a rebound force to the outside, causing the thermal conductive base plate 1210 to be always subjected to the spring force toward the chip 1110, and also improving the impact resistance and shear force resistance of the radiator 1200. During the installation, use and transportation and moving process, it is not easy for the chip to be irreversibly damaged by external forces or cause the chip to separate from the radiator, resulting in failure of the heat dissipation function. At the same time, after being fixed, the gap between the thermal conductive base plate 1210 and the chip 1110 is smaller than the thickness of the thermal conductive pad 1240, so that the thermal conductive pad 1240 is also compressed between the thermal conductive base plate 1210 and the chip 1110, and is in full contact with the thermal conductive base plate 1210 and the chip 1110, ensuring that the heat generated by the chip 1110 can be transferred to the radiator 1200 through the thermal conductive pad 1240 for dissipation.

[0026] Based on the above structure, the radiator 1200 is easy to disassemble and assemble, does not require a large disassembly and assembly space, and improves space utilization. The specific disassembly and assembly process is as follows: During installation, first stick the thermal pad 1240 between the two limiting walls 1214 of the thermal base plate 1210, and position the thermal base plate 1210 above the corresponding chip 1110 through the positioning hole 1131 and the positioning pin 1213, so that the thermal pad 1240 contacts the upper surface of the chip 1110, and then place the two springs 1220 in the two limiting grooves 1212a respectively. The screw 1230 then passes through the spring 1220 and the mounting hole 1212 in turn, and is rotated and locked into the nut 1121 until the limiting step hits the nut and cannot be locked further down, completing the installation.

[0027] When uninstalling, rotate the screw 1230 by 220 to disengage it from the nut 1121, then remove the screw 1230 and the spring 1220, and finally remove the heat-conducting base plate 1210 to complete the uninstallation.

[0028] As can be seen from the above, the circuit board assembly provided in the embodiment of the present application has the following beneficial effects: 1. Efficient fixing method, taking into account both maintenance and space utilization The linear fixing structure of "nut group-screw" is adopted (the PCB board has an independent nut group corresponding to each chip, and the nuts are distributed on opposite sides of the chip). Combined with the mounting hole design of the heat sink's thermal base plate, the heat sink and PCB board can be quickly disassembled and assembled: the screws only need to be screwed in vertically to complete the fixation. The disassembly and assembly operation space requirement is extremely small, avoiding the encroachment of traditional mechanical structures on the heat dissipation area, which can greatly increase the effective area of ​​the heat sink. At the same time, the detachable feature is retained. During maintenance, the heat sink can be removed by simply removing the corresponding screws, which significantly improves maintainability. It is especially suitable for scenarios such as servers and AI computing equipment that require frequent maintenance.

[0029] 2. Optimized heat dissipation structure to greatly improve heat dissipation efficiency The multiple heat dissipation pins arranged on the surface of the heat conducting base plate of the radiator significantly expand the heat dissipation area and improve the heat dissipation efficiency compared with the traditional sheet heat dissipation structure, effectively solving the heat dissipation bottleneck of high-power chips.

[0030] Obviously, those skilled in the art may make various changes and modifications to the present application without departing from the scope of the present application. Thus, if these modifications and variations of the present application fall within the scope of the claims of the present application and their equivalents, the present application is intended to include these modifications and variations.

Claims

1. A circuit board assembly comprising a PCB board having a chip on its upper surface and a heat sink for dissipating heat from the chip, characterized in that: The upper surface of the PCB board has multiple nut groups, and the nut groups correspond to the chips one by one. The multiple nuts of each nut group are located on at least two opposite sides of the corresponding chip. The number of the heat sinks is the same as the number of chips and corresponds to the chips one by one. The heat sink includes a thermally conductive base plate, which is arranged on the corresponding chip, and a thermally conductive pad is arranged between the two. The thermally conductive base plate has multiple heat dissipation pins in the upper and lower directions located on its upper surface and mounting holes corresponding to the multiple nuts of the corresponding nut groups. The thermally conductive base plate is fixed to the PCB board by screws passing through the mounting holes thereon and connected to the corresponding nuts.

2. The circuit board assembly according to claim 1, wherein: There are multiple chips, which are arranged in a matrix array.

3. The circuit board assembly according to claim 1, wherein: The PCB board has a plurality of first positioning structures corresponding to the chips one by one, and the lower surface of the heat-conducting base plate has a second positioning structure that cooperates with the first positioning structure.

4. The circuit board assembly according to claim 3, wherein: Each nut group includes 2 nuts, and each first positioning structure includes 2 positioning holes. The 2 nuts and 2 positioning holes are symmetrically arranged on the same opposite sides of the corresponding chip. The number of mounting holes is 2, and the second positioning structure includes 2 positioning pins adapted to the positioning holes.

5. The circuit board assembly according to claim 4, wherein: The nut is a patch nut, which is welded and fixed to the upper surface of the PCB board.

6. The circuit board assembly according to claim 4, characterized in that: A plurality of heat dissipation pins are arranged in a rectangular array.

7. The circuit board assembly according to claim 6, wherein: The heat-conducting base plate is rectangular, and the two mounting holes and the two positioning pins are arranged at the left and right ends of the heat-conducting base plate.

8. The circuit board assembly according to claim 7, characterized in that: The two mounting holes are located in an array formed by a plurality of heat dissipation pins. A vertical section facing the mounting hole is formed on the heat dissipation pin adjacent to the mounting hole, forming a channel for the screws to pass through.

9. The circuit board assembly according to claim 1, wherein: The radiator also includes a spring corresponding to the mounting holes one by one, which is used to be compressed by the screw after the screw is connected to the corresponding nut. The upper orifice of each mounting hole forms a limit groove, and the lower end of the spring is arranged in the limit groove. The screw includes a polished rod section, the upper end of the polished rod section forms a top cap for compressing the spring, and the lower end forms a threaded section adapted to the nut. The length of the threaded section is less than the thread depth of the nut, and the diameter of the threaded section is less than the diameter of the polished rod section, forming a limit step for constraining the depth of the screw locking into the nut.

10. The circuit board assembly according to claim 1, wherein: The thermally conductive adhesive pad is compressed between the thermally conductive base plate and the corresponding chip, and the lower surface of the thermally conductive base plate forms limiting walls located on two opposite sides of the thermally conductive adhesive pad.

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