Support plate manufacturing method, power supply module, power supply module assembling method and magnetic assembly

Abstract

The invention provides a manufacturing method of a carrier plate, a power supply module, a power supply module assembling method and a magnetic assembly. The manufacturing method of the carrier plate comprises the following steps: step 1, forming a substrate; 2, vertical drilling is conducted, and a connecting piece is formed; thirdly, mechanical drilling is conducted, and holes are formed; fourthly, depth-controlled groove milling is conducted; the power supply module comprises a carrier plate, a magnetic core, a first assembly and a third assembly. The magnetic core comprises a magnetic column, a first magnetic cover plate and a second magnetic cover plate, the magnetic column penetrates through the hole, and the first magnetic cover plate and the second magnetic cover plate are contained in the first deep control groove and the second deep control groove respectively and buckled with the magnetic column to form a second assembly. According to the invention, the reflow soldering frequency of components in the power supply module is reduced, the reliability of the power supply module is improved, the assembly error of the module can be effectively reduced, the space utilization rate of a magnetic component in the power supply module is improved, and the size of the power supply module is reduced.

Description

Technical Field

[0001] The present invention belongs to the technical field of high-frequency power supplies, and in particular relates to a method for manufacturing a carrier board, a power supply module and an assembly method thereof. Background Art

[0002] In recent years, with the advancement of technologies in data centers, artificial intelligence, and supercomputers, an increasing number of powerful ASICs have been deployed, such as CPUs, GPUs, machine learning accelerator chips, and network switch chips. These consume significant current, reaching thousands of amperes, and exhibit rapid current fluctuations. Traditionally, power modules with step-down (Buck) circuits have been used to supply these loads. These power modules are trending from solutions that are coplanar with the ASIC and power the ASIC horizontally to solutions that are off-plane and power the ASIC vertically. Currently, key challenges facing these vertically powered ASICs are how to improve their efficiency, reduce their size, and enhance their integration and reliability. Summary of the Invention

[0003] In view of this, one of the objectives of the present invention is to provide a method for manufacturing a carrier board, comprising the following steps:

[0004] Step 1: Prepare thick copper, a first double-sided copper clad laminate, a second double-sided copper clad laminate, a first PP layer and a second PP layer, wherein the first double-sided copper clad laminate is disposed on the top surface of the thick copper via the first PP layer, and the second double-sided copper clad laminate is disposed on the bottom surface of the thick copper via the second PP layer. The double-sided copper clad laminate, the PP layer and the thick copper are cured at high temperature to form a substrate; the substrate includes a connection area and a winding area;

[0005] Step 2: vertically drilling a hole in the connection area, electroplating the inner wall of the hole and plugging the hole with resin, and then electroplating the top and bottom surfaces of the hole to form a connector; the connector is electrically connected to the thick copper;

[0006] Step 3: Mechanically drilling the winding area to form a hole penetrating the substrate;

[0007] Step 4: Perform controlled-depth milling on the top and bottom surfaces of the winding area to form a first controlled-depth groove and a second controlled-depth groove.

[0008] Preferably, the sum of the thicknesses of the first double-sided copper clad laminate and the first PP layer is equal to the sum of the thicknesses of the second double-sided copper clad laminate and the second PP layer; the height of the first depth controlling groove is equal to the height of the second depth controlling groove.

[0009] Preferably, the connecting member is electrically connected to the internal wiring layer of the substrate, and the connecting member includes a top pad provided on the top surface of the substrate and a bottom pad provided on the bottom surface of the substrate.

[0010] Preferably, part of the PP layer is retained at the bottom of the first depth-controlled groove and the second depth-controlled groove, and the PP layer is removed by a laser etching process.

[0011] Preferably, an insulating layer is formed on the exposed surface of the thick copper by spraying to form a carrier board.

[0012] Another aspect of the present invention provides a power supply module, comprising a first component, a second component, and a third component; the first component, the second component, and the third component are stacked in sequence; the second component comprises a carrier plate and a magnetic core; the carrier plate comprises opposite top and bottom surfaces, a hole, a connector, a first depth-controlled groove, a second depth-controlled groove, a winding area, and a connecting area; the first depth-controlled groove is formed by a concave portion of the top surface of the carrier plate, and the second depth-controlled groove is formed by a concave portion of the bottom surface of the carrier plate; the winding area is the portion of the second carrier plate between the first depth-controlled groove and the second depth-controlled groove; the hole is provided in the winding area, and the hole passes through the top and bottom surfaces of the carrier plate; the connector is provided in the connecting area;

[0013] The power module further includes a winding, which is arranged in the winding area of ​​the carrier plate; the magnetic core includes a magnetic column, a first magnetic cover plate and a second magnetic cover plate, the magnetic column passes through the hole, and the first magnetic cover plate and the second magnetic cover plate are respectively accommodated in the first depth control groove and the second depth control groove, and are buckled with the carrier plate together with the magnetic column;

[0014] The first and third components are respectively arranged on the top and bottom surfaces of the second component, and the first and third components are electrically connected via the connector. Preferably, the thickness of the first magnetic cover plate is less than or equal to the height of the first depth control groove, and the thickness of the second magnetic cover plate is less than or equal to the height of the second depth control groove.

[0015] Preferably, the carrier is a second carrier; the first component includes a first carrier, a switching device and an input capacitor; the first carrier includes opposite top and bottom surfaces, and the bottom surface of the first carrier is arranged adjacent to the top surface of the second carrier; the switching device is arranged on the top surface of the first carrier, and the input capacitor is arranged on the bottom surface of the first carrier.

[0016] Preferably, the input capacitor is accommodated in the first depth-controlled groove, and the sum of the thickness of the input capacitor and the thickness of the first magnetic cover plate is less than or equal to the height of the first depth-controlled groove.

[0017] Preferably, the third component includes a third carrier board, an output capacitor and solder balls; the third carrier board includes opposite top and bottom surfaces, and the top surface of the third carrier board is arranged adjacent to the bottom surface of the second carrier board; the output capacitor is arranged on the top surface of the third carrier board, and the solder balls are arranged on the bottom surface of the third carrier board.

[0018] Preferably, the output capacitor is accommodated in the second depth-controlled groove, and the sum of the thickness of the output capacitor and the thickness of the second magnetic cover plate is less than or equal to the height of the second depth-controlled groove.

[0019] Preferably, the connecting member includes a via hole, a top pad and a bottom pad; the via hole electrically connects the top pad and the bottom pad.

[0020] Preferably, the connecting member includes a via hole, a top pad and a bottom pad; the via hole electrically connects the top pad and the bottom pad.

[0021] Preferably, the connector includes a power electrical connector and a signal electrical connector; the carrier board further includes a thick copper layer and a copper clad layer, and the signal electrical connector is electrically connected to the thick copper layer and the copper clad layer.

[0022] Preferably, the connection region surrounds the winding region.

[0023] Preferably, the winding may be internal wiring of the carrier board or a copper sheet embedded in the carrier board.

[0024] Preferably, it further comprises an insulating layer and an adhesive layer, wherein the insulating layer and / or adhesive layer covers part or all of the winding, and the adhesive layer is arranged between the magnetic core and the insulating layer.

[0025] Another aspect of the present invention provides a method for assembling the power module, comprising the following steps:

[0026] Step 1: Fasten the magnetic core and the second carrier plate to form a second assembly;

[0027] Step 2: Welding the output capacitor and the second component formed in step 1 on the top surface of the third carrier board to form a first assembly;

[0028] Step 3: Planting and soldering balls on the bottom surface of the third carrier board to form a second assembly;

[0029] Step 4: Soldering the switching device on the top surface of the first carrier board;

[0030] Step 5: Welding the input capacitor and the second assembly formed in step 3 on the bottom surface of the first carrier board to form the power module;

[0031] Step 4 can be completed in any step before step 5.

[0032] Another aspect of the present invention provides a method for assembling the power module, comprising the following steps:

[0033] Step 1: Fasten the magnetic core and the second carrier plate to form a second assembly;

[0034] Step 2: Planting and soldering balls on the bottom surface of the third carrier board;

[0035] Step 3: Welding the output capacitor and the second component formed in step 1 on the top surface of the third carrier board to form a first assembly;

[0036] Step 4: Soldering the switching device on the top surface of the first carrier board;

[0037] Step 5: Welding the input capacitor and the first assembly formed in step 3 on the bottom surface of the first carrier board to form the power module;

[0038] The step 2 can be completed in any step before the step 3, and the step 4 can be completed in any step before the step 5.

[0039] Another aspect of the present invention provides a method for assembling the power module, comprising the following steps:

[0040] Step 1: Fasten the magnetic core and the second carrier plate to form a second assembly;

[0041] Step 2: Planting and soldering balls on the bottom surface of the third carrier board;

[0042] Step 3: Welding the input capacitor and the second component formed in step 1 on the bottom surface of the third board to form a first assembly;

[0043] Step 4: Soldering the switching device on the top surface of the first carrier board;

[0044] Step 5: Welding the output capacitor and the first assembly formed in step 3 on the top surface of the third carrier board to form the power module;

[0045] The step 2 can be completed in any step before the step 3, and the step 4 can be completed in any step before the step 5.

[0046] Another aspect of the present invention provides a method for assembling the power module, comprising the following steps:

[0047] Step 1: Fasten the magnetic core and the second carrier plate to form a second assembly;

[0048] Step 2: Welding the output capacitor and the second component formed in step 1 on the top surface of the third carrier board to form a first assembly;

[0049] Step 3: Soldering the switching element and the top input capacitor on the top surface of the first carrier board;

[0050] Step 4: Arranging a bottom input capacitor and the first assembly formed in step 2 on the bottom surface of the first carrier board, and arranging solder balls on the bottom surface of the third carrier board, and performing reflow soldering to form a power module;

[0051] Step 3 can be completed in any step before step 4.

[0052] Another aspect of the present invention provides a magnetic assembly, comprising a carrier, a magnetic core, and a winding; the winding is an internal wiring layer within the carrier or a metal sheet embedded within the carrier; the magnetic core comprises a magnetic column, a first magnetic cover plate, and a second magnetic cover plate, the magnetic column being disposed between the first magnetic cover plate and the second magnetic cover plate; the carrier comprises a hole, and opposing top and bottom surfaces, the hole penetrating the top and bottom surfaces and allowing the magnetic column to pass through the hole, the first magnetic cover plate and the second magnetic cover plate being respectively engaged with the carrier from the top and bottom surfaces of the carrier together with the magnetic column;

[0053] The magnetic assembly further includes an insulating layer and an adhesive layer. The insulating layer and / or the adhesive layer covers at least a portion of the winding, and the adhesive layer is arranged between the magnetic core and the insulating layer.

[0054] Preferably, the carrier plate further includes a first depth-controlled groove, a second depth-controlled groove, a winding area and a connection area; the first depth-controlled groove is formed by the inward concave top surface of the carrier plate, and the second depth-controlled groove is formed by the inward concave bottom surface of the carrier plate; the winding area is the part of the carrier plate between the first depth-controlled groove and the second depth-controlled groove; the hole is arranged in the winding area; the first magnetic cover plate is arranged in the first depth-controlled groove, and the second magnetic cover plate is arranged in the second depth-controlled groove.

[0055] Preferably, the connection area surrounds the winding area; the magnetic component further includes a connector, the connector includes a via, a top pad and a bottom pad; the via electrically connects the top pad and the bottom pad; the connector is arranged in the connection area.

[0056] Preferably, the connector includes a power electrical connector and a signal electrical connector; the carrier board further includes a thick copper layer and a copper clad layer, and the signal electrical connector is electrically connected to the thick copper layer and the copper clad layer. The beneficial effects of the present invention are:

[0057] (1) The present invention proposes a power module structure that reduces the number of times components in the power module undergo reflow soldering;

[0058] (2) The present invention proposes a power module structure and a manufacturing process thereof, which can effectively reduce the assembly error of the module, improve the space utilization rate of the magnetic components in the power module, and reduce the size of the power module.

[0059] (3) The present invention provides a magnetic assembly, which can further enhance the bonding strength between the magnetic core and the winding by providing an insulating layer and an adhesive layer on at least part of the surface of the winding. BRIEF DESCRIPTION OF THE DRAWINGS

[0060] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the following briefly introduces the drawings required for use in the embodiments or the description of the prior art. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative work.

[0061] Figure 1 This is a side view of the power module of the first embodiment;

[0062] Figure 2A This is a side view of a power module according to the second embodiment;

[0063] Figure 2B This is a three-dimensional exploded schematic diagram of the power module of Example 2;

[0064] Figure 2C is a side view schematic diagram of the second component 2 of the second embodiment;

[0065] Figure 2D 3D top view of the second component 2 of the second embodiment;

[0066] Figures 3A to 3E for Figure 2D The production process flow of the second component 2 is shown.

[0067] in:

[0068] 1 First component; 10 First carrier; 110 Switching element; 111 Top input capacitor; 112 Bottom input capacitor; 121 First welding layer; 122 Second welding layer; 2 Second component; 20 Second carrier; 210 Magnetic core; 211 First magnetic cover plate; 212 Second magnetic cover plate; 221 Fifth welding layer; 222 Sixth welding layer; 231 / 232 Electrical connector; 235 Power electrical connector; 236 Signal electrical connector; 233 Connection area; 234 Winding area; 237 Hole; 241 First depth-controlled groove; 242 Second depth-controlled groove; 251 Gap; 260 Substrate; 261 Thick copper layer; 262a / 262b Double-sided copper-clad laminate; 263a / 263b PP layer; 3 third component; 30 third carrier board; 310 welding ball; 311 output capacitor; 321 third welding layer; 322 fourth welding layer; H1 / H2 / H4 / H5 height; H3 thickness; DETAILED DESCRIPTION

[0069] One of the core aspects of the present invention is to provide a structure and manufacturing process for a power module.

[0070] The following will clearly and completely describe the technical solutions in the embodiments of the present invention in conjunction with the accompanying drawings. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. All other embodiments obtained by ordinary technicians in this field based on the embodiments of the present invention without making any creative efforts shall fall within the scope of protection of the present invention.

[0071] Example 1

[0072] Figure 1 The figure shows a side view of a power module according to this embodiment. The power module includes a first component 1, a second component 2, and a third component 3. The first component 1 includes a first carrier board 10, active components such as a switch element 110, and passive components such as a top input capacitor 111 and a bottom input capacitor 112. The switch element 110 and the top input capacitor 111 are soldered to the top surface of the first carrier board 10 via a first solder layer 121; the bottom input capacitor 112 is soldered to the bottom surface of the first carrier board 10 via a second solder layer 122. The third component 3 includes a third carrier board 30, passive components such as an output capacitor 311, and solder balls. The output capacitor 311 is soldered to the top surface of the third carrier board 30 via a third solder layer 321; solder balls 310 are implanted on the bottom surface of the third carrier board 30 as functional pins of the power module, and a fourth solder layer 322 is formed. The second component 2 includes a second carrier board 20, a magnetic component, and electrical connectors. The magnetic assembly includes a winding and a magnetic core 210; the winding is disposed within the second carrier 20. When the second carrier 20 is a multi-layer substrate similar to a printed circuit board (PCB), the winding can be formed by wiring within the PCB or by a copper sheet embedded within the PCB. The magnetic column of the magnetic core 210 passes through the second carrier 20, and the first magnetic cover plate 211 and the second magnetic cover plate 212 of the magnetic core 210 are respectively fastened to the winding from the top and bottom surfaces of the second carrier 20 to form the magnetic assembly. The bottom surface of the electrical connector 231 is welded to the top surface of the second carrier 20 via the fifth welding layer 221, and the top surface of the electrical connector 232 is welded to the bottom surface of the second carrier 20 via the sixth welding layer 222. The top surface of the electrical connector 231 is welded and fixed to the first component 1 through the second welding layer 122, thereby achieving fixation and electrical connection between the first component 1 and the second component 2; the bottom surface of the electrical connector 232 is welded and fixed to the third component 3 through the third welding layer 321, thereby achieving fixation and electrical connection between the second component 2 and the third component 3.

[0073] The power module in this embodiment includes six solder layers, making it difficult to control the number of reflow soldering cycles for some components within the module to three or fewer during assembly. This results in a complex production process, low production yield, and significantly reduced reliability. Therefore, reducing the number of solder layers in the power module, thereby improving its production yield and reliability, is an urgent issue.

[0074] Example 2

[0075] To solve Figure 1 To solve the problem shown in the embodiment, this embodiment proposes a power supply module. Figure 2A is a side view schematic diagram of the power module of this embodiment; Figure 2B is a three-dimensional exploded schematic diagram of the power module of this embodiment; Figure 2C is a side view schematic diagram of the second component 2 in the power module of this embodiment; Figure 2D This is a three-dimensional top view schematic diagram of the second component 2 in the power module of this embodiment. In this embodiment, the structures of the first component 1 and the third component 3 are the same as those in the first embodiment; the difference is that the second component 2 does not include electrical connectors 231 and 232 similar to copper blocks, but the second carrier 20 in the second component 2 includes a special-shaped structure of a first depth control groove 241 and a second depth control groove 242, so that the second component 2 does not include the fifth welding layer and the sixth welding layer; thereby reducing the six welding layers in the first embodiment to four welding layers, so that the number of reflow soldering times experienced by the device in this embodiment during the power module assembly process can be reduced to three times or less. The specific assembly process flow of the power module of this embodiment is as follows:

[0076] Step 1: Snap and bond the magnetic core 210 onto two opposite sides of the second carrier plate 20 to form the second assembly 2;

[0077] Step 2: Place the output capacitor 311 and the second component 2 formed in step 1 on the top surface of the third carrier board 30 and perform reflow soldering to form a first assembly. At this time, the magnetic component and the output capacitor 311 undergo the first reflow soldering.

[0078] Step 3: Place solder balls 310 on the bottom surface of the third carrier board 30 and perform reflow soldering to form a second assembly. At this time, the solder balls 310 undergo a first reflow soldering, and the magnetic components and output capacitors 311 undergo a second reflow soldering.

[0079] Step 4: Place the switch element 110 and the top surface input capacitor 111 on the top surface of the first carrier 10 and perform reflow soldering. At this time, the switch element 110 and the top surface input capacitor 111 undergo a first reflow soldering.

[0080] Step 5: Place the bottom input capacitor 112 and the second assembly formed in step 3 on the bottom surface of the first carrier 10 and undergo reflow soldering. At this time, the bottom input capacitor 112 undergoes the first reflow soldering, the solder balls 310, the switching element 110 and the top input capacitor 111 undergo the second reflow soldering, and the output capacitor 311 and the magnetic component undergo the third reflow soldering respectively, finally forming the power module. In this assembly process, step 4 can be completed in any step before step 5.

[0081] Therefore, the solder ball 310, the top surface input capacitor 111 and the switch element 110 undergo two reflows, and the output capacitor 311 and the magnetic component undergo three reflows. Figure 2A The module structure shown and the above-mentioned power module assembly process flow can control the number of reflow soldering times of the solder ball 310 to two times; since the solder ball 310 serves as the pin of the module, its soldering reliability is crucial; the fewer the number of reflow soldering times the solder ball 310 undergoes during the assembly process, the less the degree of collapse of the solder ball 310 will be; thus, the good flatness of the bottom surface of the module can be ensured, and the soldering reliability of the solder ball 310 can be improved.

[0082] Assembly process flow 1 can also be adjusted to the following assembly process flow 2 for the power module:

[0083] Step 1: Snap and bond the magnetic core 210 onto two opposite sides of the second carrier plate 20 to form the second assembly 2;

[0084] Step 2: placing solder balls 310 on the bottom surface of the third carrier board 30 and reflowing the solder balls;

[0085] Step 3: Place the output capacitor 311 and the second component 2 formed in step 1 on the top surface of the third carrier board 30, and perform reflow soldering to form a first assembly;

[0086] Step 4: Place the switch element 110 and the top input capacitor 111 on the top surface of the first carrier 10 and perform reflow soldering;

[0087] Step 5: Place the bottom input capacitor 112 and the first assembly formed in step 3 on the bottom surface of the first carrier 10 and perform reflow soldering again.

[0088] In this assembly process, step 2 can be completed in any step before step 3, and step 4 can be completed in any step before step 5. The above assembly process can also achieve the same technical effect.

[0089] Furthermore, step three in the assembly process flow can be merged into step five, that is, the bottom input capacitor 112 and the first assembly formed in step two are placed on the bottom surface of the first carrier 10 at the same time, and the solder balls 310 are placed on the bottom surface of the third carrier 30, and then reflowed simultaneously; thereby, the number of reflows for the solder balls 310 can be reduced from two to one, and the number of reflows for the magnetic components and output capacitors 311 can be reduced from three to two. Specifically:

[0090] Step 1: Snap and bond the magnetic core 210 onto two opposite sides of the second carrier plate 20 to form the second assembly 2;

[0091] Step 2: Place the output capacitor 311 and the second component 2 formed in step 1 on the top surface of the third carrier board 30 to form a first assembly, and perform reflow soldering; at this time, the magnetic component and the output capacitor 311 undergo the first reflow soldering.

[0092] Step 3: Place the switch element 110 and the top surface input capacitor 111 on the top surface of the first carrier 10 and perform reflow soldering. At this time, the switch element 110 and the top surface input capacitor 111 undergo a first reflow soldering.

[0093] Step 4: Place the bottom input capacitor 112 and the first assembly formed in Step 2 on the bottom surface of the first carrier 10. Simultaneously, place solder balls 310 on the bottom surface of the third carrier 30 and perform reflow soldering. The switch element 110 and the top input capacitor 111 undergo a second reflow soldering, while the solder balls 310 and the bottom input capacitor 112 undergo a first reflow soldering, ultimately completing the power module.

[0094] in addition, Figure 2A In the power module structure shown, the second carrier plate 20 is a special-shaped structure, that is, a first depth-controlled groove 241 and a second depth-controlled groove 242 are provided on the top and bottom surfaces of the second carrier plate 20; Figure 2B and Figure 2C As shown, the portion of the second carrier plate between the first depth-controlled groove 241 and the second depth-controlled groove 242 is the winding area 234, and the portion of the second carrier plate surrounding the depth-controlled groove is the connection area 233; Figure 2DAs shown, power electrical connectors 235 and signal electrical connectors 236 are disposed within connection region 233 and each include a top solder pad disposed on the top surface of connection region 233 and a bottom solder pad disposed on the bottom surface of connection region 233. Power electrical connectors 235 are soldered and electrically connected to first substrate 10 via the top solder pads, and to third substrate 30 via the bottom solder pads, thereby establishing electrical connections between the windings within second substrate 20 and first and third substrates 10, 30, respectively. Signal electrical connectors 236 are soldered and electrically connected to the first substrate via the top solder pads, and to the third substrate via the bottom solder pads, thereby establishing electrical signal connections between first and third substrates 10, 30. In this embodiment, connection region 233 surrounds winding region 234; in other embodiments, connection region 233 may alternatively be disposed within winding region 234 to reduce parasitic resistance between winding region 234 and connection region 233.

[0095] refer to Figure 2B In this embodiment, the third component 3 includes a third carrier board 30, an output capacitor 311, and a plurality of connector pads 312, wherein the plurality of connector pads 312 are respectively used to be welded and fixed to the bottom surface pads of the power electrical connector 235 and the signal electrical connector 236; the output capacitor 311 is arranged on the third carrier board in an area perpendicular to the winding area 234 of the second carrier board 20; the plurality of connector pads 312 are arranged around the output capacitor 311, that is, in an area perpendicular to the connection area 233 of the second carrier board 20. In some other embodiments, the plurality of connector pads 312 can also be arranged between the output capacitors 311, that is, as long as they are in an area perpendicular to the connection area 233 of the second carrier board 20. Figure 2CThe depths of the first depth-controlled groove 241 and the second depth-controlled groove 242 are H1 and H2, respectively, and the thickness of the winding area 234 of the second carrier 20 is H3. When the magnetic core 210 is fastened to the second carrier from the top and bottom surfaces of the winding area 234, the height of the magnetic core protruding from the top surface of the winding area 234 is H4, that is, the thickness of the first magnetic cover 211 is H4; the height of the magnetic core protruding from the bottom surface of the winding area 234 is H5, that is, the sum of the thickness of the second magnetic cover 212 and the height of the gap 251 is H5; here, the gap 251 is the gap between the second magnetic cover and the bottom surface of the second carrier 20, which is caused by assembly tolerance. During design, the output capacitor 311 can optionally be positioned so that it is directly opposite the second magnetic cover 212, that is, after assembly, the output capacitor 311 is set within the projection of the second magnetic cover 212 on the third carrier 30. At this time, the sum of the thickness of the output capacitor 311 and the height of H5 must be less than or equal to the height H2 of the depth control groove 242 to avoid component interference when the second component 2 is assembled with the third component 3. In other embodiments, the output capacitor 311 can also be arranged to avoid the area of ​​the second magnetic cover plate 212, that is, after assembly, the output capacitor 311 is not arranged in the projection of the second magnetic cover plate 212 on the third carrier plate 30; in this case, the height of H5 must be less than or equal to the height H2 of the depth control groove 242 to avoid component interference when the second component 2 is assembled with the third component 3, where H5

[0096] Step 1: If Figure 3A ​As shown, a thick copper layer 261 formed by laying out a plurality of thick copper sheets, two double-sided copper-clad laminates 262a and 262b, and two polypropylene (PP) layers 263a and 263b are prepared. In this embodiment, the PP layer is a prepreg, or prepreg. The first double-sided copper-clad laminate 262a, the first PP layer 263a, the thick copper layer 261, the second PP layer 263b, and the second double-sided copper-clad laminate 262b are stacked in sequence. The two double-sided copper-clad laminates, the two PP layers, and the thick copper layer are cured at high temperature to form substrate 260. The thickness of the two double-sided copper-clad laminates 262a and 262b can be the same or different. For example, the thickness of 262b can be greater than that of 262a, so that the depth H2 of the second controlled-depth groove in the finished product is greater than the depth H1 of the first controlled-depth groove. In addition, in an extended embodiment, the two double-sided copper clad laminates 262a and 262b can also be replaced by two multi-layer copper clad laminates 262a and 262b, and the two multi-layer copper clad laminates 262a and 262b have pre-installed PCB traces to complete the connection between the top surface pad and the bottom surface pad of the signal electrical connector 236 at the connection area 233 in the substrate 260; here, the top surface pad and the bottom surface pad of the signal electrical connector 236 can be in a vertically opposite position relationship, or they may not be in a vertically opposite position relationship.

[0097] Step 2: If Figure 3B As shown, a hole is vertically drilled on the connection area 233, and then the inner wall of the hole is electroplated, and then the hole is filled with resin, and finally the top and bottom surfaces of the hole are surface-plated to form a top pad and a bottom pad, and finally a structure as shown in FIG. Figure 2D The power electrical connector 235 and the signal electrical connector 236 are shown; both the power electrical connector 235 and the signal electrical connector 236 include a top pad disposed on the top surface of the substrate 260 and a bottom pad disposed on the bottom surface of the substrate; the power electrical connector 235 realizes electrical connection between the top pad and the bottom pad of the substrate 260 and the thick copper layer 261 through a via hole; the signal electrical connector 236 realizes electrical connection between the top pad and the bottom pad of the substrate 260 and two double-sided copper clad laminates or two multi-layer copper clad laminates through a via hole. The through hole here can also be replaced by the sidewall plating of the printed circuit board, that is, the power electrical connector 235 realizes electrical connection between the top pad and the bottom pad of the substrate 260 and the thick copper layer 261 through sidewall plating; the signal electrical connector 236 realizes electrical connection between the top pad and the bottom pad of the substrate 260 and two double-sided copper clad laminates or two multi-layer copper clad laminates through sidewall plating.

[0098] Step 3: If Figure 3CAs shown, mechanical drilling is performed on the winding area 234 to form a hole 237 that passes through the second carrier board 20 for accommodating the magnetic column of the magnetic core 210; the hole 237 passes through the thick copper layer 261, so that the thick copper in the thick copper layer 261 forms a winding that surrounds the magnetic column, so that the magnetic column of the magnetic core 210 is surrounded by the winding in the thick copper layer 261 to form a magnetic component, such as an inductor.

[0099] Step 4: If Figure 3D As shown, controlled-depth milling is performed on the top and bottom surfaces of the winding area 234, forming a first controlled-depth groove 241 and a second controlled-depth groove 242. The first controlled-depth groove 241 is used to accommodate the first magnetic cover plate 211, and the second controlled-depth groove 242 is used to accommodate the second magnetic cover plate 212. The bottom input capacitor 112 can also be accommodated in the first controlled-depth groove 241; the output capacitor 311 can also be accommodated in the second controlled-depth groove 242. Here, the depth of the controlled-depth milling groove can be controlled to retain a certain thickness of residual PP on the thick copper layer 261.

[0100] Step 5: If Figure 3E As shown, the residual PP retained in step 4 is removed by a laser etching process; because the energy of the laser is not enough to thin the thick copper, the thick copper layer 261 in step 1 will eventually be retained in the vertical direction of the winding area 234.

[0101] Optionally, an insulating layer, such as green oil, is formed on the surface of the thick copper layer 261 exposed in step five by spraying; on the one hand, the thick copper layer 261 can be insulated from external devices such as the magnetic core 210, the bottom input capacitor 112, or the output capacitor 311; on the other hand, it can prevent moisture, thereby further enhancing the reliability of the module.

[0102] Preferably, an adhesive layer is further included between the insulating layer and the magnetic core on the surface of the thick copper layer 261, and the adhesive layer plays the role of fixing the magnetic core and the thick copper layer; the adhesive layer and the insulating layer are both organic materials, which can better protect the adhesive layer and will not reduce the bonding ability; compared with the thick copper layer that does not include the insulating layer, the bonding strength between the magnetic core and the thick copper layer that includes the insulating layer is greater than the bonding strength between the magnetic core and the thick copper layer that does not include the insulating layer. The thick copper layer here can be a pure copper material, or it can be a copper surface plated with nickel gold, a copper surface plated with nickel tin, or a copper surface plated with nickel, etc. The surface treatment method of the thick copper layer is not limited here. The adhesive layer and / or the insulating layer can cover part or all of the thick copper layer, and the application of this type of magnetic component is not limited to the power supply module disclosed in the present invention, and can also be applied to other types of power supply models or electronic devices.

[0103] The second component 2 formed by the above-mentioned processing process makes Figure 3EThe tolerance of the thickness H3 of the remaining winding area 234 is equal to the tolerance of the thick copper layer 261, thereby significantly reducing the tolerance of the thickness H3 of the winding area 234. Furthermore, the depth tolerances of the first depth-controlling groove 241 and the second depth-controlling groove 242 are eliminated. As a result, the thicknesses of the first magnetic cover plate 211 and the second magnetic cover plate 212 can be significantly increased. Furthermore, the winding formed by the thick copper layer 261 allows for 100% space utilization at the winding location. In summary, the features and processing flow of the second carrier plate 20 proposed in this embodiment maximize the space utilization of both the magnetic core and winding locations, thereby significantly improving the performance of the magnetic components within the second assembly 2.

[0104] The switch tube disclosed in the present invention can be SiMOSFET, SiCMOSFET, GaNMOSFET or IGBTMOSFET, etc., all of which can realize the switch function disclosed in the present invention.

[0105] The power module described in the above embodiment may also be a part of an electronic device, and can still meet the technical features and benefits disclosed by the present invention.

[0106] The "equal", "same" or "equal" disclosed in the present invention must take into account the parameter distribution of the project, and the error distribution is within ±30%; the definition of "parallel" of two line segments or two straight lines is that the angle between the two line segments or two straight lines is less than or equal to 45 degrees; the definition of "perpendicular" of two line segments or two straight lines is that the angle between the two line segments or two straight lines is within the range of [60, 120] degrees; the definition of "phase mismatch" also needs to take into account the parameter distribution of the project, and the error distribution of the degree of phase mismatch is within ±30%.

[0107] The various embodiments in this specification are described in a progressive manner, and each embodiment focuses on the differences from other embodiments. The same or similar parts between the various embodiments can be referenced to each other.

[0108] The above description of the disclosed embodiments is intended to enable one skilled in the art to implement or use the present invention. Various modifications to these embodiments will be readily apparent to one skilled in the art, and the general principles defined herein may be implemented in other embodiments without departing from the spirit or scope of the present invention. Therefore, the present invention is not limited to the embodiments shown herein but is intended to conform to the widest scope consistent with the principles and novel features disclosed herein.

Claims

1. A method for manufacturing a carrier board, characterized in that: The steps include: Step 1: Prepare thick copper, a first double-sided copper clad laminate, a second double-sided copper clad laminate, a first PP layer and a second PP layer, wherein the first double-sided copper clad laminate is disposed on the top surface of the thick copper via the first PP layer, and the second double-sided copper clad laminate is disposed on the bottom surface of the thick copper via the second PP layer. The double-sided copper clad laminate, the PP layer and the thick copper are cured at high temperature to form a substrate; the substrate includes a connection area and a winding area; Step 2: vertically drilling a hole in the connection area, electroplating the inner wall of the hole and plugging the hole with resin, and then electroplating the top and bottom surfaces of the hole to form a connector; the connector is electrically connected to the thick copper; Step 3: Mechanically drilling the winding area to form a hole penetrating the substrate; Step 4: Perform controlled-depth milling on the top and bottom surfaces of the winding area to form a first controlled-depth groove and a second controlled-depth groove.

2. The production method according to claim 1, characterized in that The sum of the thicknesses of the first double-sided copper clad laminate and the first PP layer is equal to the sum of the thicknesses of the second double-sided copper clad laminate and the second PP layer; the height of the first depth-controlled groove is equal to the height of the second depth-controlled groove.

3. The production method according to claim 1, characterized in that The connecting member is electrically connected to the internal wiring layer of the substrate, and the connecting member includes a top surface pad arranged on the top surface of the substrate and a bottom surface pad arranged on the bottom surface of the substrate.

4. The production method according to claim 1, characterized in that Part of the PP layer is retained at the bottom of the first depth-controlled groove and the second depth-controlled groove, and the PP layer is removed by a laser etching process.

5. The production method according to claim 4, characterized in that: An insulating layer is formed on the exposed surface of the thick copper by spraying to form a carrier board.

6. A power supply module, characterized in that: The present invention comprises a first component, a second component and a third component; the first component, the second component and the third component are stacked in sequence; the second component comprises a carrier plate and a magnetic core; the carrier plate comprises opposite top and bottom surfaces, a hole, a connector, a first depth-controlled groove, a second depth-controlled groove, a winding area and a connecting area; the first depth-controlled groove is formed by a concave portion of the top surface of the carrier plate, and the second depth-controlled groove is formed by a concave portion of the bottom surface of the carrier plate; the winding area is the portion of the second carrier plate between the first depth-controlled groove and the second depth-controlled groove; the hole is provided in the winding area and passes through the top and bottom surfaces of the carrier plate; the connector is provided in the connecting area; The power module further includes a winding, which is arranged in the winding area of ​​the carrier plate; the magnetic core includes a magnetic column, a first magnetic cover plate and a second magnetic cover plate, the magnetic column passes through the hole, and the first magnetic cover plate and the second magnetic cover plate are respectively accommodated in the first depth control groove and the second depth control groove, and are buckled with the carrier plate together with the magnetic column; The first component and the third component are respectively arranged on the top surface and the bottom surface of the second component, and the first component and the third component are electrically connected through the connecting member.

7. The power module according to claim 6, characterized in that: The thickness of the first magnetic cover plate is less than or equal to the height of the first depth control groove, and the thickness of the second magnetic cover plate is less than or equal to the height of the second depth control groove.

8. The power module according to claim 6, wherein: The carrier is a second carrier; the first component includes a first carrier, a switching device and an input capacitor; the first carrier includes a top surface and a bottom surface relative to each other, and the bottom surface of the first carrier is arranged adjacent to the top surface of the second carrier; the switching device is arranged on the top surface of the first carrier, and the input capacitor is arranged on the bottom surface of the first carrier.

9. The power module according to claim 8, characterized in that: The input capacitor is accommodated in the first depth-controlled groove, and the sum of the thickness of the input capacitor and the thickness of the first magnetic cover plate is less than or equal to the height of the first depth-controlled groove.

10. The power module according to claim 8, wherein: The third component includes a third carrier board, an output capacitor and solder balls; the third carrier board includes opposite top and bottom surfaces, and the top surface of the third carrier board is arranged adjacent to the bottom surface of the second carrier board; the output capacitor is arranged on the top surface of the third carrier board, and the solder balls are arranged on the bottom surface of the third carrier board.

11. The power module according to claim 10, wherein: The output capacitor is accommodated in the second depth-controlled groove, and the sum of the thickness of the output capacitor and the thickness of the second magnetic cover plate is less than or equal to the height of the second depth-controlled groove.

12. The power module according to claim 6, wherein: The connecting member includes a via hole, a top pad and a bottom pad; the via hole electrically connects the top pad and the bottom pad.

13. The power module according to claim 6, wherein: The connector includes sidewall plating, a top pad and a bottom pad; the sidewall plating electrically connects the top pad and the bottom pad.

14. The power module according to claim 12 or 13, characterized in that: The connector includes a power electrical connector and a signal electrical connector; the carrier board also includes a thick copper layer and a copper clad layer, and the signal electrical connector is electrically connected to the thick copper layer and the copper clad layer.

15. The power module according to claim 6, wherein: The connection region surrounds the winding region.

16. The power module according to claim 6, wherein: The winding can be internal wiring of the carrier board or a copper sheet embedded in the carrier board.

17. The power module according to claim 6, wherein: It also includes an insulating layer and an adhesive layer, wherein the insulating layer and / or the adhesive layer covers part or all of the winding, and the adhesive layer is arranged between the magnetic core and the insulating layer.

18. A method for assembling a power module according to claim 10, characterized in that: The steps include: Step 1: Fasten the magnetic core and the second carrier plate to form a second assembly; Step 2: welding the output capacitor and the second component formed in step 1 on the top surface of the third carrier board to form a first assembly; Step 3: Planting and soldering balls on the bottom surface of the third carrier board to form a second assembly; Step 4: Soldering the switching device on the top surface of the first carrier board; Step 5: Welding the input capacitor and the second assembly formed in step 3 on the bottom surface of the first carrier board to form the power module; Step 4 can be completed in any step before step 5.

19. A method for assembling a power module according to claim 10, characterized in that: The steps include: Step 1: Fasten the magnetic core and the second carrier plate to form a second assembly; Step 2: Planting and soldering balls on the bottom surface of the third carrier board; Step 3: Welding the output capacitor and the second component formed in step 1 on the top surface of the third carrier board to form a first assembly; Step 4: Soldering the switching device on the top surface of the first carrier board; Step 5: Welding the input capacitor and the first assembly formed in step 3 on the bottom surface of the first carrier board to form the power module; The step 2 can be completed in any step before the step 3, and the step 4 can be completed in any step before the step 5.

20. A method for assembling a power module according to claim 10, characterized in that: The steps include: Step 1: Fasten the magnetic core and the second carrier plate to form a second assembly; Step 2: Planting and soldering balls on the bottom surface of the third carrier board; Step 3: Welding the input capacitor and the second component formed in step 1 on the bottom surface of the third board to form a first assembly; Step 4: Soldering the switching device on the top surface of the first carrier board; Step 5: Welding the output capacitor and the first assembly formed in step 3 on the top surface of the third carrier board to form the power module; The step 2 can be completed in any step before the step 3, and the step 4 can be completed in any step before the step 5.

21. A method for assembling a power module according to claim 10, characterized in that: The steps include: Step 1: Fasten the magnetic core and the second carrier plate to form a second assembly; Step 2: Welding the output capacitor and the second component formed in step 1 on the top surface of the third carrier board to form a first assembly; Step 3: Soldering the switching element and the top input capacitor on the top surface of the first carrier board; Step 4: Arranging a bottom input capacitor and the first assembly formed in step 2 on the bottom surface of the first carrier board, and arranging solder balls on the bottom surface of the third carrier board, and performing reflow soldering to form a power module; Step 3 can be completed in any step before step 4.

22. A magnetic component, characterized in that: The invention comprises a carrier plate, a magnetic core and a winding; the winding is an internal wiring layer in the carrier plate or a metal sheet embedded in the carrier plate; the magnetic core comprises a magnetic column, a first magnetic cover plate and a second magnetic cover plate, the magnetic column being arranged between the first magnetic cover plate and the second magnetic cover plate; the carrier plate comprises a hole, and opposite top and bottom surfaces, the hole passing through the top and bottom surfaces and allowing the magnetic column to pass through the hole, and the first magnetic cover plate and the second magnetic cover plate respectively buckle the carrier plate together with the magnetic column from the top and bottom surfaces of the carrier plate; The magnetic assembly further includes an insulating layer and an adhesive layer. The insulating layer and / or the adhesive layer covers at least a portion of the winding, and the adhesive layer is arranged between the magnetic core and the insulating layer.

23. The magnetic assembly according to claim 22, wherein: The carrier plate also includes a first depth-controlled groove, a second depth-controlled groove, a winding area and a connection area; the first depth-controlled groove is formed by the inward concave top surface of the carrier plate, and the second depth-controlled groove is formed by the inward concave bottom surface of the carrier plate; the winding area is the part of the carrier plate between the first depth-controlled groove and the second depth-controlled groove; the hole is arranged in the winding area; the first magnetic cover plate is arranged in the first depth-controlled groove, and the second magnetic cover plate is arranged in the second depth-controlled groove.

24. The magnetic assembly according to claim 23, wherein: The connection area surrounds the winding area; the magnetic component further includes a connector, which includes a via, a top pad and a bottom pad; the via electrically connects the top pad and the bottom pad; the connector is arranged in the connection area.

25. The magnetic assembly according to claim 24, wherein: The connector includes a power electrical connector and a signal electrical connector; the carrier board also includes a thick copper layer and a copper clad layer, and the signal electrical connector is electrically connected to the thick copper layer and the copper clad layer.

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