High-precision special-shaped side hole chemical copper plating equipment

Abstract

The invention discloses high-precision special-shaped side hole copper plating equipment, and relates to the technical field of circuit board special-shaped hole copper plating, the high-precision special-shaped side hole copper plating equipment comprises a copper plating pool and a control mechanism, the bottom of the copper plating pool is provided with a circulation mechanism, the bottom of the copper plating pool is provided with an electric cylinder through a stepped hole in a penetrating manner, and the top end of the electric cylinder is fixedly connected with a storage table; a servo motor is fixedly mounted at the top of the storage table, an output shaft of the servo motor is fixedly connected with a rotating cover through a coupler, and the control mechanism is welded to the top of the rotating cover. According to the high-precision special-shaped side hole copper plating equipment, fixing of a plurality of circuit boards to be subjected to copper plating can be completed at a time, batch copper plating machining is achieved, self-adaptive adjustment can be made according to the different sizes of the circuit boards, the better fixing effect is achieved, meanwhile, copper plating liquid circulation is achieved, and the copper plating efficiency is improved. And the conditions of layering, precipitation and the like of effective components of the copper plating solution are further avoided, so that uniform copper plating of the circuit board is further promoted, and high-precision copper plating is realized.

Description

Technical Field

[0001] The invention relates to the technical field of chemical copper plating of special-shaped holes in circuit boards, in particular to a high-precision chemical copper plating device for special-shaped edge holes. Background Art

[0002] In the PCB (circuit board) manufacturing process, copper plating of irregular-shaped holes (non-standard holes) is a critical step, affecting the conductivity and mechanical strength of the board. The irregular-shaped hole electroless copper plating equipment is specifically designed to process these non-standard holes, ensuring they are evenly plated with copper.

[0003] For example, the patent document with publication number CN119300263A discloses a copper plating device for circuit boards with uniform thickness and special-shaped holes. The device rotates the copper plating frame to follow the teeth, so that the teeth will engage with the transmission gear, causing the transmission gear to rotate with the built-in column as the center, so that the entire connecting assembly follows, which is conducive to the flipping of the circuit board frame with the circuit board placed at the end of the connecting plate. The copper plating frame is provided with conventional copper plating liquid and copper plating electrodes for copper plating the circuit board. During the flipping process of the circuit board frame, the copper plating liquid in the copper plating frame can be stirred synchronously, which is conducive to the contact between the copper plating liquid and the circuit boards stacked in the circuit board frame, ensuring that the copper plating liquid is in full and uniform contact with the circuit boards in the circuit board frame, and is conducive to the uniform thickness of the copper plating for special-shaped holes in the circuit board.

[0004] However, in actual operation, the circuit board must be fixed before copper plating to avoid displacement during the copper plating process. The existing technology often uses a screw-threaded fixation method. This method is not only cumbersome and inefficient, but also relies on fixed threaded hole positions, which makes it only applicable to circuit boards of one or several specifications and sizes, and cannot meet the processing needs of the equipment to process multiple models of circuit boards at the same time. Summary of the Invention

[0005] The object of the present invention is to provide a high-precision chemical copper plating equipment for special-shaped side holes to solve the problems raised in the above background technology.

[0006] To achieve the above-mentioned objectives, the present invention provides the following technical solutions: a high-precision special-shaped edge hole chemical copper plating equipment, comprising a copper plating pool and a control mechanism, a circulation mechanism is provided at the bottom of the copper plating pool, and an electric cylinder is installed through the bottom of the copper plating pool through a step hole, the top of the electric cylinder is fixedly connected to a storage table, and a servo motor is fixedly installed on the top of the storage table, and the output shaft of the servo motor is fixedly connected to a rotating cover through a coupling, the control mechanism is welded to the top of the rotating cover, and the end of the control mechanism is fixedly connected to a lifting plate, and a guide slider is fixedly installed on the side of the lifting plate, a storage frame is welded to the outer wall of the rotating cover, and a guide groove is opened on the inner wall of the storage frame, and a fixed card slot is fixedly installed on the inner side of the storage frame, a buffer assembly is provided at the bottom of the lifting plate, and the bottom of the lifting plate is connected to a movable card slot through the buffer assembly.

[0007] Furthermore, the circulation mechanism includes a liquid collecting bin, a drainage pipe, a reflux pipe and a water pump. The liquid collecting bin is fixedly installed at the bottom of the copper plating pool, and the outer wall of the liquid collecting bin is connected with the drainage pipe, and the top of the drainage pipe is connected with the bottom of the copper plating pool. The bottom of the liquid collecting bin is connected with the reflux pipe, and the reflux pipe is connected in series with a water pump.

[0008] Furthermore, the control mechanism includes a control box, a limit frame, a control motor and a screw rod. The limit frame is fixed on the inner wall of the control box, and the control motor is fixedly installed inside the control box. The output shaft of the control motor is fixedly connected to the screw rod through a coupling, and the top end of the screw rod is movably connected to the inner top wall of the control box through a bearing.

[0009] Furthermore, the number of the control boxes is four, and the four control boxes are arranged in a circular array on the top of the rotating cover, and the outer wall of the control box is welded to the outer wall of the storage frame.

[0010] Furthermore, the control mechanism also includes a movable block, which is arranged inside the control box, and the outer surface of the movable block is in contact with the inner wall of the control box, and the movable block and the screw rod form a through structure.

[0011] Furthermore, the control mechanism also includes a metal connecting rod, a connecting piece and a suspension rod. The bottom end of the metal connecting rod passes through the top of the control box and extends to the interior of the control box, and the bottom end of the metal connecting rod is fixedly connected to the top of the movable block. The top end of the metal connecting rod is fixedly connected to the connecting piece, and the bottom of the connecting piece is welded with a suspension rod. The bottom end of the suspension rod passes through the top of the storage frame and extends to the interior of the storage frame, and the bottom end of the suspension rod is fixedly connected to the top of the lifting plate.

[0012] Furthermore, the guide sliders are symmetrically arranged on the left and right sides of the lifting plate, and the lifting plate forms a sliding structure with the storage frame through the guide sliders and the guide groove. The guide sliders slide along the inner wall of the guide groove, and the shape and size of the guide sliders match the shape and size of the guide groove.

[0013] Furthermore, the buffer assembly includes a guide rod, a limit plate and a spring. The guide rod and the lifting plate form a through structure, and a limit plate is provided at the top end of the guide rod, and the bottom end of the guide rod is fixedly connected to a movable slot, and the spring is provided between the lifting plate and the movable slot.

[0014] Furthermore, one end of the spring is fixedly connected to the bottom of the lifting plate, and one end of the spring is fixedly connected to the bottom of the movable slot, and the movable slot is kept connected to the lifting plate through the spring.

[0015] Furthermore, the fixed card slots are arranged at equal intervals in the storage frame, and the fixed card slots are located directly below the movable card slots, and the movable card slots are arranged in a one-to-one correspondence with the fixed card slots.

[0016] The present invention provides a high-precision chemical copper plating equipment for special-shaped side holes, which has the following beneficial effects:

[0017] 1. The present invention controls the lifting of the storage frame through an electric cylinder, which makes it convenient for the operator to insert the bottom of the circuit board to be copper-plated into the fixed slot in turn, and cooperates with the control mechanism to drive the lifting and lowering of the lifting plate to drive the movable slot to lift and lower, which can limit and fix the top of the circuit board to achieve multiple circuit boards to be copper-plated at one time, and is provided with a buffer component. After the top of the circuit board is pressed into the movable slot, it is compressed by the spring to cope with the continued downward pressure of the lifting plate. Moreover, since the multiple movable slots at the bottom of the lifting plate are independently arranged, they can adapt to circuit boards of different sizes respectively. The improved copper plating equipment can not only complete the fixation of multiple circuit boards to be copper-plated at one time, realize batch copper plating processing, and improve processing efficiency, but also can make adaptive adjustments according to the different sizes of the circuit boards to achieve better fixing effects and achieve the purpose of processing circuit boards of various specifications and sizes at one time.

[0018] 2. The present invention drives the storage frame to rotate in the copper plating pool by a servo motor, so that during the copper plating process, the circuit board can be evenly contacted with the copper plating liquid inside the copper plating pool, and the copper plating liquid can be stirred to promote the uniform distribution of the effective components of the copper plating liquid. In conjunction with the circulation mechanism, a water pump is used to extract the copper plating liquid in the copper plating pool along the drainage pipe into the liquid collecting bin, and then the copper plating liquid is refluxed into the copper plating pool through the reflux pipe to realize the circulation of the copper plating liquid, further avoiding the stratification and precipitation of the effective components of the copper plating liquid, thereby further promoting uniform copper plating of the circuit board and achieving high-precision copper plating. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] Figure 1 This is a schematic diagram of the overall structure of a high-precision chemical copper plating equipment for special-shaped side holes of the present invention;

[0020] Figure 2 This is a schematic diagram of the bottom structure of a copper plating tank for a high-precision chemical copper plating device for special-shaped side holes of the present invention;

[0021] Figure 3 This is a schematic diagram of the disassembled servo motor-rotating cover structure of a high-precision chemical copper plating device for special-shaped side holes of the present invention;

[0022] Figure 4 This is a schematic diagram of the structure of a storage frame of a high-precision chemical copper plating device for special-shaped side holes according to the present invention;

[0023] Figure 5 This is a schematic cross-sectional view of a control box of a high-precision chemical copper plating device for special-shaped side holes according to the present invention;

[0024] Figure 6 The invention provides a high-precision special-shaped side hole electroless copper plating equipment Figure 5 A schematic diagram of the structure at center A;

[0025] Figure 7 This is a schematic diagram of the three-dimensional structure of a storage frame of a high-precision chemical copper plating device for special-shaped side holes of the present invention.

[0026] In the figure: 1. Copper plating pool; 2. Circulation mechanism; 201. Liquid collecting tank; 202. Drainage pipe; 203. Return pipe; 204. Water pump; 3. Electric cylinder; 4. Storage table; 5. Servo motor; 6. Rotating cover; 7. Control mechanism; 701. Control box; 702. Limit frame; 703. Control motor; 704. Screw; 705. Movable block; 706. Metal connecting rod; 707. Connecting piece; 708. Hanging rod; 8. Lifting plate; 9. Guide slider; 10. Storage frame; 11. Guide groove; 12. Fixed slot; 13. Buffer assembly; 1301. Guide rod; 1302. Limit plate; 1303. Spring; 14. Movable slot. DETAILED DESCRIPTION

[0027] The following embodiments of the present invention are described in further detail with reference to the accompanying drawings and examples. The following examples are used to illustrate the present invention but are not intended to limit the scope of the present invention.

[0028] like Figure 1-Figure 7As shown, a high-precision special-shaped edge hole chemical copper plating equipment includes a copper plating pool 1 and a control mechanism 7. A circulation mechanism 2 is provided at the bottom of the copper plating pool 1, and an electric cylinder 3 is installed through the bottom of the copper plating pool 1 through a step hole. The top of the electric cylinder 3 is fixedly connected to a storage table 4, and a servo motor 5 is fixedly installed on the top of the storage table 4, and the output shaft of the servo motor 5 is fixedly connected to a rotating cover 6 through a coupling. The control mechanism 7 is welded to the top of the rotating cover 6, and the end of the control mechanism 7 is fixedly connected to a lifting plate 8, and a guide slider 9 is fixedly installed on the side of the lifting plate 8. The control mechanism 7 includes a control box 701, a limit frame 702, a control motor 703, a screw rod 704, a movable block 705, a metal connecting rod 706, and a connecting piece 70 7 and the suspension rod 708, the inner wall of the control box 701 is fixed with a limited position frame 702, and the interior of the control box 701 is fixedly installed with a control motor 703, the output shaft of the control motor 703 is fixedly connected to the screw rod 704 through a coupling, and the top of the screw rod 704 is movably connected to the inner top wall of the control box 701 through a bearing, the number of the control boxes 701 is four, and the four control boxes 701 are arranged in a circular array on the top of the rotating cover 6, and the outer wall of the control box 701 is welded to the outer wall of the storage frame 10, the movable block 705 is arranged inside the control box 701, and the outer surface of the movable block 705 is in contact with the inner wall of the control box 701, and the movable block 705 and the screw rod 704 constitute a through structure, and the bottom end of the metal connecting rod 706 penetrates the control box 701. The top of the control box 701 extends to the interior of the control box 701, and the bottom end of the metal connecting rod 706 is fixedly connected to the top of the movable block 705. The top of the metal connecting rod 706 is fixedly connected to a connecting piece 707, and the bottom of the connecting piece 707 is welded with a suspension rod 708. The bottom end of the suspension rod 708 passes through the top of the storage frame 10 and extends to the interior of the storage frame 10, and the bottom end of the suspension rod 708 is fixedly connected to the top of the lifting plate 8. The storage frame 10 is welded to the outer wall of the rotating cover 6, and the inner wall of the storage frame 10 is provided with a guide groove 11. The guide sliders 9 are symmetrically arranged on the left and right sides of the lifting plate 8, and the lifting plate 8 forms a sliding structure with the storage frame 10 through the guide sliders 9 and the guide grooves 11. The guide sliders 9 slide along the inner wall of the guide grooves 11, and the guide The shape and size of the slider 9 match the shape and size of the guide groove 11. A fixed card slot 12 is fixedly installed on the inner side of the storage frame 10. The fixed card slots 12 are equidistantly arranged in the storage frame 10, and the fixed card slot 12 is located directly below the movable card slot 14, and the movable card slot 14 is arranged one-to-one with the fixed card slot 12. A buffer assembly 13 is provided at the bottom of the lifting plate 8, and the bottom of the lifting plate 8 is connected to the movable card slot 14 through the buffer assembly 13. The buffer assembly 13 includes a guide rod 1301, a limit plate 1302 and a spring 1303. The guide rod 1301 and the lifting plate 8 constitute a through structure, and a limit plate 1302 is provided at the top of the guide rod 1301, and the bottom end of the guide rod 1301 is fixedly connected to the movable card slot 14.The spring 1303 is provided between the lifting plate 8 and the movable slot 14. One end of the spring 1303 is fixedly connected to the bottom of the lifting plate 8, and one end of the spring 1303 is fixedly connected to the bottom of the movable slot 14. The movable slot 14 is connected to the lifting plate 8 via the spring 1303.

[0029] The specific operation is as follows: the electric cylinder 3 drives the storage table 4 to rise, thereby lifting the storage frame 10 out of the copper plating pool 1, and then starts the control motor 703 to drive the screw 704 to rotate. In conjunction with the control box 701 to limit the movement trajectory of the movable block 705, the movable block 705 can gradually move upward under the rotation drive of the screw 704, thereby driving the metal connecting rod 706, the connecting piece 707, the suspension rod 708 and the lifting plate 8 to move upward. Next, the operator only needs to insert the bottom of the circuit board to be copper-plated into the inner side of the fixed card slot 12 in sequence. After insertion, the control motor 703 is started again to control the lifting plate 8 to move downward, driving the movable card slot 14 to move downward. As the movable card slot 14 moves downward, the top of the circuit board gradually fits into the inner side of the movable card slot 14. During this process, when the top of the circuit board is pressed against the movable slot 14, the lifting plate 8 continues to press down, which will cause the spring 1303 between the lifting plate 8 and the movable slot 14 to be compressed to buffer the downward force. Moreover, since the multiple movable slots 14 at the bottom of the lifting plate 8 are independently arranged, they can adapt to circuit boards of different sizes respectively. Through the above design, not only can the fixation of multiple circuit boards to be copper-plated be completed in batches at one time, thereby improving processing efficiency, but also adaptive adjustments can be made according to the different sizes of the circuit boards to achieve better fixing effects.

[0030] like Figure 1 、 Figure 2 and Figure 3As shown, a circulation mechanism 2 is provided at the bottom of the copper plating pool 1. The circulation mechanism 2 includes a liquid collecting bin 201, a drainage pipe 202, a return pipe 203 and a water pump 204. The liquid collecting bin 201 is fixedly installed at the bottom of the copper plating pool 1, and the outer wall of the liquid collecting bin 201 is connected with the drainage pipe 202, and the top of the drainage pipe 202 is connected with the bottom of the copper plating pool 1. The bottom of the liquid collecting bin 201 is connected with the return pipe 203, and the return pipe 203 is connected in series with the water pump 204. The bottom of the copper plating pool 1 is penetrated by a step hole and an electric cylinder 3 is installed. The top of the electric cylinder 3 is fixedly connected to a storage table 4. A servo motor 5 is fixedly installed on the top of the storage table 4, and the output shaft of the servo motor 5 is fixedly connected to the rotating cover 6 through a coupling. The control mechanism 7 is welded to the top of the rotating cover 6, and the end of the control mechanism 7 is fixedly connected to the lifting plate 8, and the side of the lifting plate 8 is fixedly installed with a guide slider 9. The outer wall of the rotating cover 6 is welded with a storage frame 10, and the inner wall of the storage frame 10 is provided with a guide groove 11, and the inner side of the storage frame 10 is fixedly installed with a fixed card slot 12. A buffer component 13 is provided at the bottom of the lifting plate 8, and the bottom of the lifting plate 8 is connected to a movable card slot 14 through the buffer component 13;

[0031] The specific operation is as follows: after the circuit board is fixed, the electric cylinder 3 is started to drive the storage table 4 to move downward, and the storage frame 10 and the circuit board fixed therein are re-sunk into the copper plating pool 1, and then the servo motor 5 is started to drive the rotating cover 6 to rotate in the copper plating pool 1, so that the circuit board can evenly contact the copper plating liquid inside the copper plating pool 1, and this operation can also have a stirring effect on the copper plating liquid, which helps to promote the uniform distribution of the effective ingredients of the copper plating liquid. In this process, the water pump 204 operates synchronously, and the water pump 204 is used to extract the copper plating liquid in the copper plating pool 1 so that the copper plating liquid can enter the liquid collecting bin 201 along the drainage pipe 202, and then flow back into the copper plating pool 1 through the reflux pipe 203 to realize the circulation of the copper plating liquid, avoid stratification and precipitation of the effective ingredients of the copper plating liquid, thereby further promoting uniform copper plating of the circuit board.

[0032] In summary, combined Figure 1-Figure 7 As shown, the working principle of the high-precision special-shaped edge hole copper plating equipment is as follows: first, the storage table 4 is driven to rise by the electric cylinder 3, and the storage frame 10 is lifted out of the copper plating pool 1, and then the control motor 703 is started to drive the screw rod 704 to rotate and drive it to move upward, thereby driving the lifting plate 8 to move upward, and then the bottom of the circuit board to be copper-plated is inserted into the inner side of the fixed card slot 12 in turn. After insertion, the control motor 703 is started again to control the lifting plate 8 to move downward, drive the movable card slot 14 to move downward, and clamp the top of the circuit board into the inner side of the movable card slot 14.

[0033] During this process, when the top of the circuit board is pressed into the movable slot 14, the lifting plate 8 continues to press down, and the spring 1303 will be compressed to adapt to circuit boards of different sizes. After the circuit board is fixed, the electric cylinder 3 drives the storage table 4 to move down, and the circuit board is sunk into the copper plating pool 1, and then the servo motor 5 is started to drive the rotating cover 6 to rotate in the copper plating pool 1, so that the circuit board can evenly contact the copper plating liquid inside the copper plating pool 1, and at the same time have a stirring effect on the copper plating liquid. During the copper plating process, the water pump 204 operates synchronously, and the water pump 204 draws the copper plating liquid in the copper plating pool 1 along the drainage pipe 202 into the liquid collecting bin 201, and then flows back into the copper plating pool 1 through the reflux pipe 203, realizing the circulation of the copper plating liquid.

[0034] The embodiments of the present invention are presented for purposes of illustration and description and are not intended to be exhaustive or to limit the invention to the disclosed forms. Many modifications and variations will be apparent to those skilled in the art. The embodiments are chosen and described in order to better illustrate the principles of the invention and its practical application and to enable those skilled in the art to understand the invention and design various embodiments with various modifications as suited for specific applications.

Claims

1. A high-precision copper plating equipment for special-shaped side holes, comprising a copper plating pool (1) and a control mechanism (7), characterized in that: The bottom of the copper plating pool (1) is provided with a circulation mechanism (2), and an electric cylinder (3) is installed through a step hole at the bottom of the copper plating pool (1), the top of the electric cylinder (3) is fixedly connected to a storage table (4), and a servo motor (5) is fixedly installed on the top of the storage table (4), and the output shaft of the servo motor (5) is fixedly connected to a rotating cover (6) through a coupling, and the control mechanism (7) is welded to the top of the rotating cover (6), and the end of the control mechanism (7) is fixedly connected to the rotating cover (6). A lifting plate (8) is fixedly connected, and a guide slider (9) is fixedly installed on the side of the lifting plate (8); a storage frame (10) is welded to the outer wall of the rotating cover (6), and a guide groove (11) is opened on the inner wall of the storage frame (10), and a fixed card slot (12) is fixedly installed on the inner side of the storage frame (10); a buffer component (13) is provided at the bottom of the lifting plate (8), and the bottom of the lifting plate (8) is connected to a movable card slot (14) through the buffer component (13).

2. A high-precision special-shaped side hole electroless copper plating equipment according to claim 1, characterized in that: The circulation mechanism (2) comprises a liquid collecting bin (201), a drainage pipe (202), a return pipe (203) and a water pump (204); the liquid collecting bin (201) is fixedly mounted on the bottom of the copper plating pool (1); the outer wall of the liquid collecting bin (201) is connected through the drainage pipe (202); the top end of the drainage pipe (202) is connected through the bottom of the copper plating pool (1); the bottom of the liquid collecting bin (201) is connected through the return pipe (203), and the return pipe (203) is connected in series with the water pump (204).

3. The high-precision special-shaped side hole electroless copper plating equipment according to claim 1, characterized in that: The control mechanism (7) comprises a control box (701), a limit frame (702), a control motor (703) and a screw rod (704); the limit frame (702) is fixed to the inner wall of the control box (701); the control motor (703) is fixedly installed inside the control box (701); the output shaft of the control motor (703) is fixedly connected to the screw rod (704) via a coupling, and the top end of the screw rod (704) is movably connected to the inner top wall of the control box (701) via a bearing.

4. The high-precision special-shaped side hole electroless copper plating equipment according to claim 3, characterized in that: The number of the control boxes (701) is four, and the four control boxes (701) are arranged in a circular array on the top of the rotating cover (6), and the outer wall of the control box (701) is welded to the outer wall of the storage frame (10).

5. The high-precision special-shaped side hole electroless copper plating equipment according to claim 3, characterized in that: The control mechanism (7) further includes a movable block (705), which is arranged inside the control box (701), and the outer surface of the movable block (705) is in contact with the inner wall of the control box (701), and the movable block (705) and the screw rod (704) form a through structure.

6. The high-precision chemical copper plating equipment for special-shaped side holes according to claim 5, characterized in that: The control mechanism (7) further comprises a metal connecting rod (706), a connecting piece (707) and a suspension rod (708); the bottom end of the metal connecting rod (706) passes through the top of the control box (701) and extends into the interior of the control box (701); the bottom end of the metal connecting rod (706) is fixedly connected to the top of the movable block (705); the top end of the metal connecting rod (706) is fixedly connected to the connecting piece (707); the bottom end of the connecting piece (707) is welded to the suspension rod (708); the bottom end of the suspension rod (708) passes through the top of the storage frame (10) and extends into the interior of the storage frame (10); and the bottom end of the suspension rod (708) is fixedly connected to the top of the lifting plate (8).

7. The high-precision chemical copper plating equipment for special-shaped side holes according to claim 1, characterized in that: The guide sliders (9) are symmetrically arranged on the left and right sides of the lifting plate (8), and the lifting plate (8) forms a sliding structure with the storage frame (10) through the guide sliders (9) and the guide groove (11). The guide sliders (9) slide along the inner wall of the guide groove (11), and the shape and size of the guide sliders (9) match the shape and size of the guide groove (11).

8. The high-precision chemical copper plating equipment for special-shaped side holes according to claim 1, characterized in that: The buffer assembly (13) comprises a guide rod (1301), a limiting plate (1302) and a spring (1303); the guide rod (1301) and the lifting plate (8) form a through structure, and the limiting plate (1302) is provided at the top end of the guide rod (1301); and the bottom end of the guide rod (1301) is fixedly connected to a movable slot (14); and the spring (1303) is provided between the lifting plate (8) and the movable slot (14).

9. The high-precision chemical copper plating equipment for special-shaped side holes according to claim 8, characterized in that: One end of the spring (1303) is fixedly connected to the bottom of the lifting plate (8), and one end of the spring (1303) is fixedly connected to the bottom of the movable slot (14), and the movable slot (14) is kept connected to the lifting plate (8) through the spring (1303).

10. The high-precision chemical copper plating equipment for special-shaped side holes according to claim 1, characterized in that: The fixed card slots (12) are arranged at equal intervals in the storage frame (10), and the fixed card slots (12) are located directly below the movable card slots (14), and the movable card slots (14) and the fixed card slots (12) are arranged in a one-to-one correspondence.

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