A rotatable flexible hinge and semiconductor positioning apparatus

Abstract

This invention belongs to the field of semiconductor positioning technology, and specifically relates to a rotatable flexible hinge and a semiconductor positioning device. The flexible hinge includes a first fixed part, a second fixed part, multiple deformable parts, and a support part. The second fixed part and the first fixed part are arranged parallel to each other along the X-direction. Under the action of the deformable parts, the flexible hinge can deform around the Z-direction, thereby driving the second fixed part to rotate. The support part supports the first and second fixed parts along the X-direction, ensuring that the distance between the first and second fixed parts remains at a preset value. This improves the stiffness of the flexible hinge in the X-direction, reducing the deformation of the flexible hinge when subjected to forces along the X-direction, and thus ensuring the positioning accuracy of the semiconductor positioning device when positioning the semiconductor.

Description

Technical Field

[0001] This invention relates to the field of semiconductor positioning technology, and more particularly to a rotatable flexible hinge and a semiconductor positioning device. Background Technology

[0002] A flexible hinge is a thin, flexible unit that connects two adjacent rigid links. It uses the elastic deformation of its own material to complete the transmission and conversion of motion and force. Under the action of external force or torque, it can achieve high-precision rotation function and is widely used in precision engineering fields such as micro-nano manipulation and precision positioning.

[0003] Currently, the rotation angle of flexible hinges is usually designed to be around 1m Rad. The small range of rotation angle cannot meet the production needs of some large rotation angles. In order to achieve large-angle rotation of flexible hinges, cross-spring type flexible hinges and wheel type flexible hinges are often used. However, the increase of the rotation angle often leads to a large axial deformation of the flexible hinge, which will cause a large deformation in the axial direction when the flexible hinge is subjected to axial force, thus reducing the rotation accuracy.

[0004] Therefore, the above problems urgently need to be solved. Summary of the Invention

[0005] The purpose of this invention is to provide a rotatable flexible hinge and a semiconductor positioning device to ensure the axial stiffness of the flexible hinge, thereby ensuring the rotational accuracy of the flexible hinge.

[0006] To achieve this objective, the present invention adopts the following technical solution:

[0007] A rotatable flexible hinge, comprising:

[0008] First fixed part;

[0009] The second fixing part is arranged parallel to and spaced apart from the first fixing part along the X direction;

[0010] Multiple deformation parts are inclinedly disposed between the first fixing part and the second fixing part. The multiple deformation parts are configured to generate deformation around the Z direction when the first fixing part moves along the Y direction, so as to drive the second fixing part to rotate around the Z direction.

[0011] The support portion is supported between the first fixing portion and the second fixing portion along the X direction, so that the distance between the first fixing portion and the second fixing portion along the X direction is at a preset value, and can deform around the Z direction together with the deformable portion;

[0012] The X, Y, and Z directions are set perpendicular to each other.

[0013] Preferably, the support portion is located at the middle position of the plurality of deformable portions, the plurality of deformable portions on both sides of the support portion are symmetrically arranged, and the plurality of deformable portions on the same side have the same inclination direction.

[0014] Preferably, the included angle between the two outermost deformed portions is 60° to 120°.

[0015] Preferably, at least two support portions are provided along the Y direction.

[0016] Preferably, the second fixing part is provided with a plurality of unloading grooves extending along the Y direction, and the plurality of unloading grooves are provided in a one-to-one correspondence with the plurality of deformation parts.

[0017] Preferably, the deformable part or the support part includes a deformable body, which is a sheet-like structure and has a cuboid shape, and the deformable body has a deformable region that deforms around the Z direction.

[0018] Preferably, the width-to-thickness ratio of the deformed shape is greater than or equal to 10:1.

[0019] Preferably, the deformable part or the supporting part further includes a base, which is disposed between the deformable part and the first fixing part;

[0020] The base is provided with decoupling grooves on both sides along the Z direction. The length direction of the decoupling grooves is arranged along the Y direction and penetrates the base, so that the two decoupling grooves form a connection structure for causing the first fixing part to swing relative to the deformation along the Z direction.

[0021] Preferably, the first fixing part, the second fixing part, the deformable part, and the supporting part are integrally formed.

[0022] A semiconductor positioning device, comprising:

[0023] Motion platform, used to support and position semiconductors;

[0024] A driving device, connected to the motion platform, is used to drive the motion platform to move along the Y direction;

[0025] The guide rail is arranged along the Y direction;

[0026] A slider that is adapted to slide along the guide rail;

[0027] As described above, the flexible hinge is disposed between the slider and the motion platform to compensate for assembly errors between the guide rail and the motion platform.

[0028] The beneficial effects of this invention are:

[0029] The rotatable flexible hinge and semiconductor positioning device proposed in this invention can ensure that the flexible hinge can deform around the Z direction under the action of the deformation part, thereby driving the second fixed part to rotate. The support part is supported between the first fixed part and the second fixed part along the X direction (i.e., axial direction) to ensure that the distance between the first fixed part and the second fixed part is maintained at a preset value, thereby improving the stiffness of the flexible hinge in the X direction, reducing the amount of deformation generated when the flexible hinge is subjected to a force along the X direction, and thus ensuring the positioning accuracy of the semiconductor positioning device when positioning the semiconductor. Attached Figure Description

[0030] Figure 1 This is a schematic diagram of the semiconductor positioning device in an embodiment of the present invention;

[0031] Figure 2 This is a schematic diagram of the flexible hinge structure in an embodiment of the present invention;

[0032] Figure 3 yes Figure 2 Side view of a medium-flexible hinge.

[0033] In the picture:

[0034] 100. Motion platform; 200. Drive unit; 300. Guide rail; 400. Slider; 500. Flexible hinge;

[0035] 10. First fixing part; 20. Second fixing part; 30. Deformation part; 40. Support part;

[0036] 1. Unloading groove; 2. Deformation shape; 3. Base; 4. Decoupling groove. Detailed Implementation

[0037] The present invention will now be described in further detail with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the invention and not intended to limit it. Furthermore, it should be noted that, for ease of description, the accompanying drawings show only the parts relevant to the present invention, and not all of the structures.

[0038] In the description of this invention, unless otherwise explicitly specified and limited, the terms "connected," "linked," and "fixed" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in this invention based on the specific circumstances.

[0039] In this invention, unless otherwise explicitly specified and limited, "above" or "below" the second feature can include direct contact between the first and second features, or contact between the first and second features through another feature between them. Furthermore, "above," "over," and "on top" of the second feature includes the first feature directly above or diagonally above the second feature, or simply indicates that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the second feature includes the first feature directly below or diagonally below the second feature, or simply indicates that the first feature is at a lower horizontal level than the second feature.

[0040] In the description of this embodiment, the terms "upper," "lower," "left," and "right," etc., refer to the orientation or positional relationship shown in the accompanying drawings. They are used only for ease of description and simplification of operation, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on the present invention. In addition, the terms "first" and "second" are used only for distinction in description and have no special meaning.

[0041] Please see Figure 1 This embodiment proposes a semiconductor positioning device, which includes a motion platform 100, a driving device 200, a guide rail 300, a slider 400, and a flexible hinge 500. The motion platform 100 is used to support and position semiconductors. The driving device 200 is connected to the motion platform 100 and is used to drive the motion platform 100 to move along the Y direction. The guide rail 300 is arranged along the Y direction. The slider 400 is slidably adapted to the guide rail 300. The flexible hinge 500 is disposed between the slider 400 and the motion platform 100 to compensate for assembly errors between the guide rail 300 and the motion platform 100. It is understood that the motion platform 100 can position semiconductors such as wafers. When adjusting the position of the semiconductor, the driving device 200 can drive the motion platform 100 to move along the Y direction. The driving device 200 is preferably a linear motor in the prior art, and two linear motors are arranged along the X direction to ensure the stability of the motion platform 100 during movement. During the movement of the motion platform 100 along the Y direction, the slider 400 can move along the Y direction with the motion platform 100 and slide along the guide rail 300. At this time, during the movement of the motion platform 100, the flexible hinge 500 can deform in time to compensate for the assembly error between the guide rail 300 and the motion platform 100, thereby ensuring the accuracy of the semiconductor in the positioning process.

[0042] Furthermore, an air-bearing assembly is provided between the guide rail 300 and the slider 400 to eliminate friction between them, thereby further improving the accuracy of the semiconductor during the positioning process. The structure of the air-bearing assembly is prior art and will not be described in detail here.

[0043] To further ensure the positioning accuracy of the motion platform 100, this embodiment also proposes a rotatable flexible hinge, which aims to ensure the stiffness of the flexible hinge in the direction perpendicular to the X direction during the movement of the motion platform 100 along the Y direction.

[0044] Specifically, please refer to Figure 2 as well as Figure 3 The flexible hinge 500 includes a first fixing part 10, a second fixing part 20, a plurality of deformable parts 30, and a support part 40. The second fixing part 20 and the first fixing part 10 are arranged parallel to each other along the X direction. The plurality of deformable parts 30 are inclinedly arranged between the first fixing part 10 and the second fixing part 20. The plurality of deformable parts 30 are configured to generate deformation around the Z direction when the first fixing part 10 moves along the Y direction, so as to drive the second fixing part 20 to rotate around the Z direction. The support part 40 is supported between the first fixing part 10 and the second fixing part 20 along the X direction, so as to keep the distance between the first fixing part 10 and the second fixing part 20 along the X direction at a preset value, and can generate deformation along the Z direction together with the deformable parts 30. The X direction, Y direction and Z direction are arranged perpendicular to each other.

[0045] Understandably, the deformation part 30 ensures that the flexible hinge 500 can deform around the Z direction, thereby driving the second fixed part 20 to rotate. The support part 40 supports the first fixed part 10 and the second fixed part 20 along the X direction to ensure that the distance between the first fixed part 10 and the second fixed part 20 is kept at a preset value. This preset value means that the initial distance between the first fixed part 10 and the second fixed part 20 remains unchanged, thereby improving the stiffness of the flexible hinge 500 in the X direction and reducing the deformation of the flexible hinge 500 when subjected to a force along the X direction, thereby ensuring the positioning accuracy of the semiconductor positioning device when positioning the semiconductor. Furthermore, during the deformation process of the deformation part 30, the support part 40 can deform simultaneously with the deformation part 30. This allows the support part 40 to not only ensure the rigidity of the entire flexible hinge 500 in the X direction, but also participate in the deformation of the entire flexible hinge 500. This ensures that the motion platform 100 will not jam during rotation and improves the lifespan of the flexible hinge 500.

[0046] Furthermore, the support portion 40 is positioned at the center of the plurality of deformable portions 30. The plurality of deformable portions 30 on both sides of the support portion 40 are symmetrically arranged, and the multiple deformable portions 30 on the same side have the same inclination direction. It is understood that the support portion 40, positioned in the center, can uniformly constrain the deformation of the deformable portions 30 on both sides along the X-direction, thereby preventing uneven force distribution on the deformable portions 30 on both sides of the support portion 40 along the X-direction during the deformation of the flexible hinge 500. This further improves the stiffness of the flexible hinge 500 in the X-direction. Moreover, the symmetrically arranged deformable portions 30 with respect to the support portion 40 ensure a balance of torque during the left-right rotation of the entire flexible hinge 500 during deformation, reducing sway or jamming during rotation, thereby further ensuring the positioning accuracy of the motion platform 100 during rotation. The multiple deformation parts 30 on the same side have the same tilt direction, which can prevent the deformation parts 30 on the same side from interfering with each other during the deformation process, thereby increasing the rotation angle of the flexible hinge 500. Furthermore, the symmetrically arranged deformation parts 30 can ensure that the rotation angle on both sides of the flexible hinge 500 is the same when the flexible hinge 500 rotates in both directions, thereby improving the applicability of the flexible hinge 500.

[0047] Furthermore, at least two support portions 40 are provided along the Y direction. It is understood that increasing the number of support portions 40 can increase the stiffness of the flexible hinge 500 in the X direction, thereby further ensuring the positioning accuracy of the motion platform 100 during rotation. However, increasing the number of support portions 40 will also increase the stiffness of the flexible hinge 500 along the RZ direction, thereby reducing the rotation angle of the flexible hinge 500. Therefore, the number of support portions 40 cannot be too large. In this embodiment, the number of support portions 40 is preferably one. Furthermore, the number of support portions 40 depends on the number of the first fixing portion 10 and the second fixing portion 20, and is not specifically limited here.

[0048] If the angle between the two outermost deformation parts 30 is too small, the multiple deformation parts 30 will still increase the stiffness of the flexible hinge 500 in the X direction. However, if the angle is too small, it will also increase the stiffness of the flexible hinge 500 in the RZ direction, which is not conducive to deformation. If the angle between the two outermost deformation parts 30 is too large, it will greatly reduce the stiffness of the flexible hinge 500 in the Y direction. This will cause the deformation parts 30 to drift when subjected to a slight external force, thus reducing the positioning accuracy of the motion platform 100 during rotation. Therefore, in this embodiment, the angle is selected in the range of 60° to 120°, preferably 90°.

[0049] It should be noted that increasing the number of deformation parts 30 will also increase the stiffness of the flexible hinge 500 in the RZ direction, thereby reducing the rotation angle of the flexible hinge 500. Therefore, in this embodiment, the number of deformation parts 30 is preferably two. In addition, the two deformation parts 30 and one support part 40 can form a "W" shape structure, which can ensure that the flexible hinge 500 has a large rotation angle while also ensuring its stiffness in the X direction. Since the first fixing part 10 needs to be connected to the guide structure, the length of the first fixing part 10 needs to ensure the connection with the slider 400. Therefore, the opening of the "W" shape structure is preferably oriented towards the first fixing part 10, which can relatively shorten the length of the second fixing part 20, thereby reducing the weight of the entire flexible hinge 500.

[0050] In this embodiment, the deformation part 30 and the support part 40 have the same specific structure. The following description uses the specific structure of the support part 40 as an example. The support part 40 includes a deformation part 2, which is a sheet-like structure and has a cuboid shape. The deformation part 2 has a deformation region that deforms around the Z direction. It can be understood that the length direction of the deformation part 2 is set along the X direction, the thickness direction is set along the Y direction, and the width direction is set along the Z direction. This setting allows the deformation region in the middle of the deformation part 2 to deform along the RZ direction. Furthermore, since the deformation part 2 is a sheet-like structure, the stiffness of the flexible hinge 500 in the RZ direction can be reduced to ensure that the motion platform 100 has a large angle of rotation.

[0051] It should be noted that the position and orientation of the deformable parts 2 of different deformable parts 30 can be obtained by rotating the deformable parts 2 of the support part 40 around the same center, so as to ensure that the deformable areas on each deformable part 2 are on the same deformation path. Furthermore, the width-to-thickness ratio of the deformable part 2 is greater than or equal to 10:1. This arrangement not only ensures the stiffness of the deformable part 2 in the X direction, but also ensures the deformation capacity of the deformable part 2 in the RZ direction, thereby increasing the rotation angle of the flexible hinge 500. The thickness of the deformable part 2 is 0.5–1.2 mm, preferably 0.8 mm.

[0052] In this embodiment, the support part 40 further includes a base 3, which is disposed between the deformable part 2 and the first fixing part 10. Decoupling grooves 4 are respectively provided on both sides of the base 3 along the Z direction. The length direction of the decoupling grooves 4 is arranged along the Y direction and penetrates the base 3. It can be understood that the decoupling grooves 4 can form a region with relatively weak rigidity on the base 3, thereby decoupling the flexible hinge 500 in the Z direction. This can reduce or eliminate errors caused by structural coupling, thereby improving the motion accuracy of the flexible hinge 500 and further ensuring the positioning accuracy of the motion platform 100 during rotation.

[0053] In setting the decoupling groove 4, a hole needs to be drilled along the Y direction on the base 3, penetrating the base 3 to form a through hole. Then, an opening is made on the side wall of the base 3 along the Z direction, with the length of the opening matching the length of the base 3 along the Y direction, and the opening communicating with the through hole to form the decoupling groove 4. The portion between the two decoupling grooves 4 constitutes a connection structure for connecting the base 3 and the first fixing part 10. This connection structure can compensate for the height difference between the slider 400 and the first fixing part 10 during installation, thereby further ensuring that the preload generated by the first fixing part 10 during installation does not affect the deformation 2, thus ensuring the positioning accuracy of the semiconductor. Furthermore, the thickness of the connection structure along the Z direction is 1 / 3 to 1 / 2 of the diameter of the through hole to ensure the decoupling effect.

[0054] In this embodiment, the second fixing part 20 is provided with a plurality of unloading grooves 1 extending along the Y direction, and the plurality of unloading grooves 1 are provided one-to-one with the plurality of deformable parts 30. It is understood that during the deformation process of the deformable part 2, a large stress will be generated at the connection position between the second fixing part 20 and the deformable part 2. The provision of the unloading grooves 1 can also change the stress distribution state, thereby reducing the risk of fatigue failure of the deformable part 2 and improving the service life of the flexible hinge 500. In addition, the provision of the unloading grooves 1 can also reduce the stiffness of the deformable part 2 along the RZ direction, so that the thickness of the deformable part 2 does not need to be excessively thinned, and the rotation angle of the flexible hinge 500 can be improved.

[0055] The unloading groove 1 is arranged along the Y direction and passes through the first fixing part 10 along the Z direction. The length direction of any deformable part 30 is located in the middle of the corresponding unloading groove 1. This arrangement can further improve the large stress generated at the connection position between the second fixing part 20 and the deformable part 2.

[0056] In this embodiment, the first fixing part 10, the second fixing part 20, the deformation part 30, and the support part 40 are integrally formed. It can be understood that the entire flexible hinge 500 is processed from the same raw material, and no additional connecting structures are needed between different parts (the different parts refer to the first fixing part 10, the second fixing part 20, the deformation part 30, and the support part 40). This reduces processing and assembly errors between different parts, thereby ensuring the movement accuracy of the motion platform 100.

[0057] Obviously, the above embodiments of the present invention are merely examples for clearly illustrating the present invention, and are not intended to limit the implementation of the present invention. Those skilled in the art will be able to make various obvious changes, readjustments, and substitutions without departing from the scope of protection of the present invention. It is neither necessary nor possible to exhaustively describe all embodiments here. Any modifications, equivalent substitutions, and improvements made within the spirit and principles of the present invention should be included within the scope of protection of the claims of the present invention.

Claims

1. A rotatable flexible hinge, characterized in that, include: First fixed part (10); The second fixing part (20) is arranged parallel to and spaced apart from the first fixing part (10) in the X direction; Multiple deformation parts (30) are obliquely disposed between the first fixing part (10) and the second fixing part (20). The multiple deformation parts (30) are configured to generate deformation around the Z direction when the first fixing part (10) moves along the Y direction, so as to drive the second fixing part (20) to rotate around the Z direction. The support part (40) is supported between the first fixing part (10) and the second fixing part (20) along the X direction, so that the distance between the first fixing part (10) and the second fixing part (20) along the X direction is at a preset value, and can deform around the Z direction together with the deformation part (30); wherein the X direction, Y direction and Z direction are arranged perpendicular to each other; The support part (40) is located in the middle of the plurality of deformable parts (30), and the plurality of deformable parts (30) on both sides of the support part (40) are symmetrically arranged, and the plurality of deformable parts (30) on the same side have the same inclination direction. The deformable part (30) or the support part (40) includes a deformable part (2), which is a sheet structure and has a cuboid shape. The deformable part (2) has a deformable region that deforms around the Z direction. The deformable part (30) or the support part (40) further includes a base (3), which is disposed between the deformable part (2) and the first fixing part (10); The base (3) is provided with decoupling grooves (4) on both sides along the Z direction. The length direction of the decoupling grooves (4) is arranged along the Y direction and penetrates the base (3) so that the two decoupling grooves (4) form a connection structure for causing the first fixing part (10) to swing relative to the deformable part (2) along the Z direction.

2. The rotatable flexible hinge according to claim 1, characterized in that, The included angle between the two outermost deformable parts (30) is 60° to 120°.

3. The rotatable flexible hinge according to claim 1, characterized in that, At least two support portions (40) are provided along the Y direction.

4. The rotatable flexible hinge according to claim 1, characterized in that, The second fixing part (20) is provided with a plurality of unloading grooves (1) extending along the Y direction, and the plurality of unloading grooves (1) are provided in a one-to-one correspondence with the plurality of deformation parts (30).

5. The rotatable flexible hinge according to claim 1, characterized in that, The width to thickness ratio of the deformed shape (2) is greater than or equal to 10:

1.

6. The rotatable flexible hinge according to claim 1, characterized in that, The first fixing part (10), the second fixing part (20), the deformable part (30) and the supporting part (40) are integrally formed.

7. A semiconductor positioning device, characterized in that, include: A motion platform (100) is used to support and position semiconductors; A drive device (200) is connected to the motion platform (100) and is used to drive the motion platform (100) to move along the Y direction; Guide rail (300) is arranged along the Y direction; A slider (400) is slidably adapted to the guide rail (300); The flexible hinge (500) as described in any one of claims 1-6 is disposed between the slider (400) and the motion platform (100) to compensate for assembly errors between the guide rail (300) and the motion platform (100).

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