Automatic detection device and detection method

Abstract

The invention relates to the technical field of semiconductor packaging detection, in particular to an automatic detection device and method, and the device comprises a light source module, a camera module, a detection module and a Z-axis control module. Wherein the light source module comprises a main light source and a side light source which are independently controlled; the camera module comprises an industrial camera and a lens; the detection module comprises a laser sensor used for detecting the height of a side step of the wafer carrying disc; the double-light-spot photoelectric sensor is used for detecting whether the wafer carrying disc is covered with the cover paper or not and detecting the deviation of the wafer carrying disc and is arranged right above the wafer carrying disc; the positioning stop block is used for fixing the unfilled corner direction of the wafer carrying disc; the Z-axis control module comprises a Z-axis lifting module driven by a lifting motor; the detection method comprises the steps of chip detection, cover paper detection, wafer carrying disc model detection and multi-wafer carrying disc continuous detection. According to the invention, through cooperation of influence comparison and the sensor, the three problems of missing detection by manual naked eye inspection, no detection after paper covering and no detection of the type of the wafer carrying disc are solved, and efficient and continuous detection is realized.

Description

Technical Field

[0001] The present invention relates to the technical field of semiconductor packaging detection, and in particular to an automatic detection device and a detection method. Background Art

[0002] Before the product is shipped, the appearance inspection of the chip loaded on the wafer tray must be carried out. The existing technology has defects:

[0003] 1. Manual naked-eye inspection: high missed detection rate (especially the polarity direction of the chip cannot be detected);

[0004] 2. Missing process inspection: There is no deviation inspection link after the cover paper (Tyvek paper) is covered, resulting in the outflow of defective packaging products;

[0005] 3. The crystal carrier model was not tested: The crystal carrier model was not included in the testing scope.

[0006] Therefore, how to achieve full-process closed-loop detection of accurate identification of chip polarity and direction, automatic detection of cover paper offset, and online inspection of wafer carrier model has become a technical problem that needs to be solved urgently in the semiconductor packaging field. Summary of the Invention

[0007] The problem to be solved by the present invention is to provide an automatic detection device and detection method, which realizes accurate polarity identification by collecting images of the chip circuit area and the crystal bump area through alternating light sources, determines the offset state of the cover paper by the deviation of the reflection intensity of the two light spots, and verifies the ID of the crystal carrier online, so as to solve the technical problems of high missed detection rate due to manual naked vision, no detection of the post-covering paper process, and uninspected crystal carrier model.

[0008] In view of the shortcomings of the prior art, the present invention solves the technical problems thereof by adopting a technical solution: an automatic detection device comprising: a light source module, a camera module, a detection module and a Z-axis control module;

[0009] in:

[0010] The light source module includes an independently controlled main light source and a side light source, wherein the main light source vertically illuminates the chip circuit area of ​​the wafer carrier, and the side light source illuminates the chip bump area of ​​the wafer carrier at an angle of 30° to 45°;

[0011] The camera module includes an industrial camera and a lens, and the industrial camera takes an image of the wafer carrier through the lens;

[0012] The detection module includes:

[0013] Laser sensor for detecting the height of the step on the side of the crystal carrier plate;

[0014] A dual-spot photoelectric sensor located directly above the wafer carrier, used to detect whether the wafer carrier is covered with cover paper and whether it is offset;

[0015] A positioning stopper for fixing the missing corner direction of the crystal carrier;

[0016] The Z-axis control module includes a Z-axis lifting module driven by a lifting motor; the laser sensor is fixedly installed on the Z-axis lifting module.

[0017] A detection method for an automatic detection device, characterized in that it comprises the following steps:

[0018] Step 1: Chip detection;

[0019] Step 2: Cover paper detection;

[0020] Step 3: Check the wafer carrier model;

[0021] Step 4: Continuous testing of multiple wafer trays.

[0022] Preferably, the chip detection in step 1 includes:

[0023] The wafer carrier is placed on the positioning block. The laser sensor descends, detecting the step on the side of the wafer carrier and recording the Z-axis height. The main and side light sources are then turned on, and the industrial camera captures the image through its lens. The light sources are then turned off, and the software performs a comparison test. Detection mechanism: The main and side light sources capture images of the chip circuit area and the wafer bump area, respectively, and compare them with the standard image.

[0024] Preferably, the cover paper detection in step 2 includes:

[0025] Place cover paper on the wafer carrier plate chip, use the dual-spot photoelectric sensor's two-spot function to detect the difference in consistency between the light spot on one side and the light spot on the other side, to distinguish the cover paper from the side of the wafer carrier plate, and detect whether the cover paper is covered and whether it is offset.

[0026] Preferably, the wafer carrier model detection in step 3 includes:

[0027] The wafer carrier is fixed in the direction of the missing corner. The industrial camera takes a picture from the front and extracts the side wafer carrier ID information. If it does not match the system set characters, an error message will be displayed indicating that the wafer carrier ID comparison failed, and manual intervention is required for confirmation.

[0028] Preferably, the continuous detection of multiple wafer trays in step 4 includes:

[0029] When the laser sensor detects the first wafer tray, it records the height Z1 as the initial value. The second wafer tray is placed in sequence, and the laser sensor rises. When the second wafer tray is detected, the height Z2 is recorded. The absolute value of Z2-Z1 is the wafer tray height. This value is written when the work order is created. For subsequent multi-wafer operations, the laser sensor automatically rises to detect the height of a single wafer tray, achieving continuous detection.

[0030] The beneficial effects of the present invention are as follows:

[0031] 1. Full-process closed-loop detection:

[0032] Accurate chip polarity identification: By controlling the main light source (vertically illuminating the chip circuit area) and the side light source (illuminating the chip bump area at a 30° to 45° angle), combined with the comparison of the bump array orientation marks, the problem of naked human vision being unable to detect polarity direction is solved;

[0033] Automatic determination of cover paper deviation: a dual-spot photoelectric sensor is used to calculate the deviation value of the reflection intensity consistency to prevent defective packaging from flowing out;

[0034] Online verification of wafer tray model: Extract wafer tray ID information through industrial cameras to eliminate the risk of model mismatch.

[0035] 2. Detection efficiency is significantly improved:

[0036] Z-axis control module: The laser sensor dynamically records the height of a single disk, enabling automatic lifting and positioning of the sensor during continuous inspection of multiple disks without manual intervention; BRIEF DESCRIPTION OF THE DRAWINGS

[0037] Figure 1 It is a schematic diagram of the overall structure of the detection device of the present invention;

[0038] Figure 2 It is the chip detection diagram of the present invention;

[0039] Figure 3 This is a schematic diagram of the cover paper detection principle of the present invention;

[0040] Figure 4 This is a diagram for detecting the model of the crystal carrier plate of the present invention;

[0041] Figure 5 This is a schematic diagram of the multi-carrier crystal tray height detection principle of the present invention;

[0042] Figure 6 This is the (mode 2) continuous detection timing diagram of the present invention.

[0043] Explanation of the accompanying drawings: 1. Light source module; 2. Camera module; 3. Detection module; 4. Z-axis control module; 5. Laser sensor; 6. Dual-spot photoelectric sensor; 7. Positioning block; 8. Crystal carrier. DETAILED DESCRIPTION

[0044] The present invention will be described in further detail below with reference to the accompanying drawings and specific embodiments. The embodiments of the present invention are provided for purposes of illustration and description and are not intended to be exhaustive or to limit the invention to the disclosed forms. Many modifications and variations will be apparent to those skilled in the art. The embodiments are chosen and described to better illustrate the principles of the invention and its practical application, and to enable those skilled in the art to understand the invention and design various embodiments with various modifications suitable for specific applications.

[0045] like Figure 1 As shown, the present invention provides an automatic detection device and a detection method, and the outer dimensions of the detection device are 420mm×650mm×800mm.

[0046] The detection device includes: a light source module 1, a camera module 2, a detection module 3 and a Z-axis control module 4;

[0047] Wherein: the light source module 1 includes an independently controlled main light source and a side light source, the main light source vertically illuminates the chip circuit area of ​​the crystal carrier plate 8, and the side light source illuminates the chip bump area of ​​the crystal carrier plate 8 at an angle of 30° to 45°;

[0048] The camera module 2 includes an industrial camera and a lens, and the industrial camera takes an image of the wafer carrier 8 through the lens;

[0049] Detection module 3 includes:

[0050] A laser sensor 5 for detecting the height of the step on the side of the crystal carrier plate 8;

[0051] A dual-spot photoelectric sensor 6 is used to detect whether the wafer carrier 8 is covered with a cover paper and whether it is offset and is arranged directly above the wafer carrier 8;

[0052] A positioning stopper 7 for fixing the chip carrier plate 8 in the direction of the missing corner;

[0053] The Z-axis control module 4 includes a Z-axis lifting module driven by a lifting motor; the laser sensor 5 is fixedly installed on the Z-axis lifting module, and the Z-axis lifting module receives the height feedback signal of the laser sensor 5 to dynamically locate the height of the stacked crystal carrier 8.

[0054] 1. How to realize chip detection, such as Figure 2 Shown is the chip detection diagram of the present invention

[0055] The wafer carrier 8 is placed on the positioning block 7. The Z-axis lift module drives the laser sensor 5 downward, detecting the side step of the wafer carrier 8 and recording the Z-axis height. The main and side light sources are then turned on, and the industrial camera captures the image through its lens. The light sources are then turned off, and the software performs a comparison test. Detection mechanism: The main and side light sources capture images of the chip's circuitry and bump areas, respectively, and compare them with a standard image. The circuitry area image is used for defect detection, while the bump area image uses the bump array orientation markings to identify the chip's polarity.

[0056] 2. How to realize the cover paper detection, such as Figure 3 The figure shows the principle diagram of the cover paper detection of the present invention.

[0057] Place cover paper (Tyvek paper) on the chip on the wafer carrier plate 8, and use the dual-spot function of the dual-spot photoelectric sensor 6 to detect the difference in consistency between the light spots on one side and the other side to distinguish the cover paper from the side of the wafer carrier plate 8, and detect whether the cover paper is covered and offset.

[0058] 3. How to realize the detection of crystal plate 8 models, such as Figure 4 Shown is the crystal carrier plate 8 model detection diagram of the present invention

[0059] The wafer carrier 8 has a fixed corner direction, and the industrial camera is used to take a photo from the front to extract the side wafer carrier ID information. If it does not match the system set characters, an error message will be displayed indicating that the wafer carrier ID comparison failed, and manual intervention is required for confirmation.

[0060] 4. How to realize continuous detection of multiple wafers, such as Figure 5 The figure shows the principle diagram of the multi-carrier crystal plate height detection of the present invention.

[0061] When the laser sensor 5 detects the first crystal carrier plate 8, the height Z1 is recorded as the initial value. The second crystal carrier plate 8 is placed in sequence, and the laser sensor 5 rises. When the second crystal carrier plate 8 is detected, the height Z2 is recorded. The absolute value of Z2-Z1 is the height of the crystal carrier plate 8. This value will be written when the work order is created. For subsequent multi-crystal carrier plate operations, the laser sensor will automatically rise to detect according to the height of the single crystal carrier plate to achieve continuous detection.

[0062] 5. How to achieve rapid detection, such as Figure 6 Shown is the (mode 2) continuous detection timing diagram of the present invention

[0063] The current design inspection action is from bottom to top (mode 1), continuously stacking the wafer tray 8, first inspecting the chip and wafer tray ID, and then inspecting the cover paper.

[0064] Mode 1 is to place the wafer tray 8, and then wait for the chip and wafer tray ID to pass the inspection before covering the paper. After the cover paper passes the inspection, the second tray can be placed. The placement interval time is the default waiting time.

[0065] The inspection action is optimized from top to bottom (mode 2). The crystal trays 8 are stacked and the chips and the crystal tray ID of the first tray are inspected first, and then covered with paper for inspection. If the inspection is qualified, the first crystal tray 8 is removed. At this time, the laser sensor 5 will drop to the position of the second crystal tray 8 for inspection. When the personnel place the first crystal tray 8, the chips and the crystal tray ID of the second crystal tray 8 have been inspected by the machine, and can be directly covered with paper (no waiting time is required). Repeat the above actions until the end.

[0066] 6. The specific implementation method is as follows (Mode 1):

[0067] 1. Each time the software is started, the Z-axis control module 4 performs the homing operation and waits for the homing to be completed.

[0068] 2. Procedure and batch number entry

[0069] ① Scan the barcode gun on the software interface to enter product batches and operating procedures.

[0070] ② Model and quantity of crystal carrier plate 8 of system-related products.

[0071] 3. Inspection work

[0072] ① Place a tray of products to be inspected, and the Z axis drives the laser sensor 5 to descend and find the wafer carrier 8 for inspection. At this time, the main light source and the side light source turn on the camera to take pictures. After about 3-5 seconds, the light source turns off to detect the model and chip of the wafer carrier 8.

[0073] ②Paper covering operation

[0074] A cover paper is placed on the current crystal carrier plate 8, and the dual-spot photoelectric sensor 6 is started to detect. If the current detection target reaches the threshold value set by the benchmark, it is determined that the cover paper detection is qualified.

[0075] ③ At this time, continue to place the second tray 8 (stacked on the first tray), and the laser sensor 5 will detect the height increase of the tray 8 according to the work order record.

[0076] ④ Repeat the above actions (place the crystal tray 8 + cover paper) to achieve continuous detection of multiple crystal trays. After each detection of 5 trays (1 network), the laser sensor 5 will drop and return to the original position.

[0077] ⑤ At this time, the tested crystal tray 8 can be removed, the upper cover can be added, and the crystal tray 8 to be tested can be replaced and tested from the first tray.

[0078] 4. Test results

[0079] ① First detect the integer disk and compare it with the model and number of the system's crystal carrier disk 8.

[0080] ② After the integer disk detection is completed, the tail disk is detected and compared with the model and quantity of the system's crystal carrier disk 8.

[0081] 5. Description of test results

[0082] ① Front light source - detect the model of the wafer carrier 8 and the appearance of the chip.

[0083] ②Side light source - detect the polarity direction of the chip.

[0084] ③The software compares and detects the feedback results, and personnel confirm them.

[0085] The present invention achieves full-process closed-loop testing through the following technical means, significantly improving the accuracy and efficiency of semiconductor packaging testing:

[0086] By controlling the main light source to illuminate the chip circuit area vertically and the side light source to illuminate the chip bump area at a 30-45° angle, combined with the comparison of the chip bump array orientation marks, the problem of missed detection of chip polarity direction that cannot be identified by naked eyes can be solved;

[0087] The double-spot photoelectric sensor calculates the reflection intensity consistency deviation value, realizes the automatic determination of the cover paper offset, and prevents the outflow of defective products in the packaging process;

[0088] Use industrial cameras to extract the ID information on the side of the wafer carrier online to verify model matching and eliminate batch quality accidents caused by wafer carrier mismatch;

[0089] The laser sensor dynamically records the stack height Z1 / Z2 and calculates the height of a single wafer tray, achieving seamless connection of continuous inspection of multiple trays.

[0090] Through the parallel execution mechanism of top layer inspection and cover paper operation (mode 2), the first tray of cover paper is covered synchronously during the inspection of the second tray, eliminating the waiting interval of traditional serial operation;

[0091] The present invention constructs a triple detection closed loop of chip polarity identification, cover paper offset determination, and wafer carrier ID verification, and combines Z-axis control module positioning and parallel operation control to fundamentally solve the industry pain points of high missed detection rate due to manual naked vision, no inspection of post-cover paper process, and no inspection of wafer carrier model, thereby greatly improving the accuracy and production efficiency of semiconductor packaging detection.

Claims

1. An automatic detection device, characterized in that: include: Light source module (1), camera module (2), detection module (3) and Z-axis control module (4); in: The light source module (1) comprises an independently controlled main light source and a side light source, wherein the main light source vertically illuminates the chip circuit area of ​​the crystal carrier (8), and the side light source illuminates the chip bump area of ​​the crystal carrier (8) at an inclination angle of 30° to 45°; The camera module (2) includes an industrial camera and a lens, and the industrial camera captures an image of the crystal carrier plate (8) through the lens; The detection module (3) comprises: A laser sensor (5) for detecting the height of the step on the side of the crystal carrier plate (8); A double-spot photoelectric sensor (6) for detecting whether the crystal carrier plate (8) is covered with cover paper and whether it is offset and is arranged directly above the crystal carrier plate (8); A positioning stopper (7) for fixing the missing corner direction of the crystal carrier plate (8); The Z-axis control module (4) comprises a Z-axis lifting module driven by a lifting motor; the laser sensor (5) is fixedly mounted on the Z-axis lifting module.

2. A detection method for an automatic detection device, characterized in that: The following steps are involved: Step 1: Chip detection; Step 2: Cover paper detection; Step 3: testing the model of the crystal carrier plate (8); Step 4: Continuous testing of multiple crystal trays (8).

3. The detection method of the automatic detection device according to claim 2, characterized in that: Chip testing in step 1 includes: The wafer carrier (8) is placed on the positioning block (7). The laser sensor (5) descends, detects the side step of the wafer carrier (8), and records the Z-axis height. At this time, the main light source and the side light source are turned on, and the industrial camera takes pictures through the lens. The light source is turned off, and the software performs a comparison test. Detection mechanism: The main light source and the side light source respectively take images of the chip circuit area and the wafer bump area, and compare them with the standard image.

4. The detection method of the automatic detection device according to claim 2, characterized in that: The cover paper detection in step 2 includes: A cover paper is placed on the chip of the crystal carrier plate (8), and the dual-light-spot function of the dual-light-spot photoelectric sensor (6) is used to detect the difference in consistency between the light spot on one side and the light spot on the other side, so as to distinguish the cover paper from the side of the crystal carrier plate (8) and detect whether the cover paper is covered and whether it is offset.

5. The detection method of the automatic detection device according to claim 2, characterized in that: The model detection of the crystal carrier plate (8) in step 3 includes: The direction of the missing corner of the crystal carrier (8) is fixed, and the industrial camera takes a picture from the front to extract the ID information of the side crystal carrier (8). If it does not match the system setting character, an error message will be given indicating that the crystal carrier ID comparison has failed, and manual intervention is required for confirmation.

6. The detection method of the automatic detection device according to claim 2, characterized in that: The continuous detection of the multi-carrier crystal tray (8) in step 4 includes: The laser sensor (5) detects the first crystal carrier (8), and at this time records the height Z1 as the initial value. The second crystal carrier (8) is placed in sequence, and the laser sensor (5) rises. When the second crystal carrier (8) is detected, the height Z2 is recorded. The absolute value of Z2-Z1 is the height of the crystal carrier (8). This value will be written when the work order is established. In subsequent operations with multiple crystal carriers (8), the laser sensor (5) automatically rises to detect according to the height of a single crystal carrier (8), thereby achieving continuous detection.

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